JP2003033322A - Endscope device - Google Patents

Endscope device

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Publication number
JP2003033322A
JP2003033322A JP2001220372A JP2001220372A JP2003033322A JP 2003033322 A JP2003033322 A JP 2003033322A JP 2001220372 A JP2001220372 A JP 2001220372A JP 2001220372 A JP2001220372 A JP 2001220372A JP 2003033322 A JP2003033322 A JP 2003033322A
Authority
JP
Japan
Prior art keywords
circuit board
endoscope
panel
circuit substrate
video processor
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP2001220372A
Other languages
Japanese (ja)
Other versions
JP3939941B2 (en
Inventor
Koji Omori
浩司 大森
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Olympus Corp
Original Assignee
Olympus Optical Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Olympus Optical Co Ltd filed Critical Olympus Optical Co Ltd
Priority to JP2001220372A priority Critical patent/JP3939941B2/en
Publication of JP2003033322A publication Critical patent/JP2003033322A/en
Application granted granted Critical
Publication of JP3939941B2 publication Critical patent/JP3939941B2/en
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

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  • Studio Devices (AREA)
  • Mounting Of Printed Circuit Boards And The Like (AREA)
  • Instruments For Viewing The Inside Of Hollow Bodies (AREA)
  • Endoscopes (AREA)
  • Casings For Electric Apparatus (AREA)

Abstract

PROBLEM TO BE SOLVED: To provide an endscope device capable of easily and surely conducting the addition or the exchange of a subsidiary circuit substrate equipped with input and output terminals having desired functions to a parent circuit substrate. SOLUTION: The endscope device comprises a video processor 6 provided with a device body 10 having the built-in parent circuit substrate 20 equipped with a signal processing circuit, and the like, and the subsidiary circuit substrate 30 equipped with an input-output terminal 32 capable of electrically connecting to the parent circuit substrate 20 and changing the function of the video processor 6. In the endscope device, notch parts 17, 18 are formed for an opening 23a for the arrangement of the subsidiary circuit substrate 30 in a bottom panel 10c and a rear panel 10b to constitute the device body 10. The notch parts 17, 18 are closed, and a panel-constituting part 33 and a bottom closing member 25 which are integrally fixed to the device body 10, are provided. The subsidiary circuit substrate 30, panel-constituting part 33 and the bottom-closing member 25 are fixedly provided with prescribed fastening members 41, 42, 43, different from the fastening members to fix other members constituting the video processor 6, at prescribed positions.

Description

【発明の詳細な説明】 【0001】 【発明の属する技術分野】本発明は、入出力端子を備え
た回路基板の追加又は交換が可能なプロセッサ部を備え
る内視鏡装置に関する。 【0002】 【従来の技術】近年、細長の挿入部を体腔内などに挿入
して対象部位を観察したり、各種検査、治療処置等を行
える内視鏡が広く利用されている。CCD等の撮像素子
を挿入部に設けた電子内視鏡では、モニタ画面上に内視
鏡画像を表示させて観察を行ったり、検査後の診断のた
めの画像を記録するように画像処理を行うビデオプロセ
ッサを設けて内視鏡装置が構成されている。 【0003】また、硬性鏡やファイバースコープなどの
光学式内視鏡を用いる場合にも、モニタ画面上に内視鏡
画像を表示させて観察を行ったり、検査後の診断のため
の画像を記録したいとの要望から、この光学式内視鏡の
接眼部に装着可能なカメラヘッドと、画像処理を行うビ
デオプロセッサとを設けて内視鏡装置を構成したものが
ある。 【0004】近年、ビデオプロセッサは、小型化が進む
反面、多機能化に伴い、回路基板の追加や交換が必要に
なるとともに、新たな回路基板を追加することによっ
て、外部機器を接続するための入出力端子も増加する。
このため、複数の回路基板を積層配置してプロセッサ装
置の小型化を図ったり、入出力端子を回路基板に直接設
けて装置本体の外面へ露出させる構造をとってプロセッ
サ装置の小型化を図るようにしていた。 【0005】 【発明が解決しようとする課題】しかしながら、プロセ
ッサ装置に入出力端子を有する回路基板を追加する場
合、パソコンのように装置本体の側面に開口を設け、横
方向から回路基板を追加する構造をとった場合、追加し
た回路基板を親基板に電気的に接続するために中継基板
が必要になる。このことにより、親基板に接続するため
のコネクタ位置が制限されて基板レイアウトの自由度が
低くなったり、基板グランドを確実に接地させるための
手段を別途設ける必要から、小型化及びコスト低減に問
題が生じるおそれがあった。 【0006】この不具合を解消するために、装置本体上
面に開口を設けて、この上方開口から回路基板を追加し
てビス等で固定する構造が考えられるが、医用電気機器
の場合、上方側からの液体の侵入を防止するためにパッ
キンや案内溝等を設けなければならず、そのためにコス
ト上昇するおそれがある。また、基板追加、交換の際、
上面カバーや背面パネル等を分解するために多数の締結
部材であるビスを外す必要があり、そのために工数が増
加するという不具合もあった。 【0007】これらの問題を解決するため、特願200
0−249652号の出願人は、開口を底面側に設けた
医用電気機器を提案している。しかし、この医用電気機
器では、開口を底面に設ける際、入出力端子を装置に予
め組み込んでいる、つまり、前記入出力端子が予め装置
本体に設けられた構造なので、入出力端子の数や機能が
制限される。また、この開口をプロセッサ装置の1次回
路に触れない位置及び大きさに設定していたので、装置
の小型化を図ることが難しかった。 【0008】本発明は、上記事情を鑑みてなされたもの
であり、外部機器との接続のための入出力端子を備えた
所望の機能を有する子回路基板の親回路基板への追加又
は交換を容易、かつ確実に行なえる内視鏡装置を提供す
ることを目的にしている。 【0009】 【課題を解決するための手段】本発明の内視鏡装置は、
内視鏡と、この内視鏡が接続され、少なくとも装置本体
内に信号処理回路等を備えた親回路基板を設けて構成し
たプロセッサ部を有し、前記親回路基板に入出力端子を
備えた子回路基板を電気的に接続することにより、前記
プロセッサ部の機能の変更が可能な外部装置とを具備す
る内視鏡装置であって、前記外部装置の装置本体を構成
する底面パネル及び背面パネルに、前記子回路基板を配
置するための開口を構成する切り欠き部を形成するとと
もに、これら切り欠き部を塞ぎ、前記装置本体に一体的
に固定される蓋部材を設け、前記子回路基板及び前記蓋
部材を、前記プロセッサ装置を構成する他部材を固定す
る締結部材とは異なる、所定締結部材で所定位置に固設
している。 【0010】この構成によれば、所定締結部材の取り外
し及び取付けを行うことによって、外部機器との接続の
ための入出力端子を備えた所望の機能を有する子回路基
板の追加、交換を行える。 【0011】 【発明の実施の形態】以下、図面を参照して本発明の実
施の形態を説明する。図1ないし図12は本発明の一実
施形態に係り、図1は内視鏡システムの構成を説明する
図、図2はビデオプロセッサを説明する上面図、図3は
ビデオプロセッサを説明する断面図、図4は子回路基板
を説明する図、図5はビデオプロセッサに形成した子回
路基板を配置するための開口を説明する斜視図、図6は
ビデオプロセッサに形成した子回路基板を配置するため
の開口を説明する断面図、図7は子回路基板の取付けを
説明する図、図8は子回路基板の取付け状態を説明する
図、図9は所定締結部材の他の例を説明する図、図10
は底面閉塞部材の他の構成を説明する図、図11は子回
路基板の背面パネル構成部の他の構成を説明する図、図
12は図11の背面パネル構成部の取付け状態を説明す
る図である。 【0012】図1に示す内視鏡システム1は撮像手段を
備えた電子内視鏡2と、この電子内視鏡2に照明光を供
給する光源装置3と、撮像手段に対する信号処理を行
い、映像信号を生成するプロセッサ部を備えたビデオプ
ロセッサ(或いは映像信号処理装置)6と、このビデオ
プロセッサ6と接続され、映像を表示するカラーモニタ
8と、電子内視鏡2及び光源装置3からの信号をビデオ
プロセッサ6に伝送する信号伝送ケーブル7とより構成
されている。 【0013】前記信号伝送ケーブル7は、電子内視鏡2
と接続するための内視鏡接続用コネクタ7aとビデオプ
ロセッサ6と接続するためのビデオプロセッサ接続用コ
ネクタ7bとを両端に備えた構造である。 【0014】前記電子内視鏡2は、生体内に挿入するた
めの細長の挿入部2aと、この挿入部2aの後端に設け
られた操作部2bと、この操作部2bの側部から延出さ
れたユニバーサルコード2cとを有している。このユニ
バーサルコード2cの末端には総合コネクタ2dが設け
られている。 【0015】なお、本実施形態では光源装置3とビデオ
プロセッサ6とが別体な内視鏡システム1を示している
が、ビデオプロセッサ内に光源部とプロセッサ部とを一
体に設けた構成であってもよい。 【0016】図2に示すように前記プロセッサ6の装置
本体10内には電源ユニット等の1次回路11と、この
1次回路11と電気的に絶縁された図示しない信号処理
回路等を設けた単数又は複数の回路基板で構成した親回
路基板20を配置した2次回路12とが設けられてお
り、小型化を図るため前記1次回路11と2次回路12
とを近接させている。 【0017】前記親回路基板20には後述する子回路基
板(図4に示す符号30)が電気的に接続される接続コ
ネクタ21が設けられている。なお、符号13は前記信
号伝送ケーブル7に設けられたビデオプロセッサ接続用
コネクタ7bが接続される、装置本体10を構成するフ
ロントパネル10aに設けた接続コネクタであり、符号
14は装置本体10の一側面である2次回路12側の側
面に内曲げして形成した吸気口であり、符号15は装置
本体10の他側面である1次回路11側の側面に外曲げ
して形成した排気口であり、符号16は装置本体10内
の空気を前記排気口15から排出するとともに、前記吸
気口14から外気を取り込む冷却用ファンである。 【0018】図3に示すようにプロセッサ6の装置本体
10内、所定位置には例えば2枚の回路基板で構成され
た親回路基板20が配置されている。この装置本体10
の背面パネル10b側には親回路基板20と電気的に接
続された各種入出力端子22,…,22が突設してい
る。 【0019】前記背面パネル10bの後述する背面側切
り欠き部には蓋部材を構成する例えば屈曲板部材で構成
された背面パネル構成部材24が六角レンチによって締
結が可能な所定締結部材である第1六角穴付きボルト4
1によって着脱自在に固定されている。また、前記底面
パネル10cの後述する底面側切り欠き部には蓋部材を
構成する薄板状の底面閉塞部材25が六角レンチによっ
て締結が可能な所定締結部材である第2六角穴付きボル
ト42によって着脱自在に固定されている。そして、前
記親回路基板20と底面閉塞部材25との間には子回路
基板30を追加配置するための子基板配置空間部(以
下、空間部と略記する)23が設けられている。 【0020】なお、符号26は基板間距離を所定の間隔
に保持するとともに、回路基板を固定するためのスペー
サである。また、前記所定締結部材とは、六角レンチに
よって締結が可能な六角穴付きボルトであり、前記ビデ
オプロセッサ6を構成する他部材を固定する締結部材に
は、所定締結部材と異なる後述する図7に示す背面パネ
ル10bに配置されているプラスドライバーによって締
結されるプラスネジや図示しないボックスレンチによっ
て締結されるナット等を使用している。 【0021】図4に示すように前記空間部23に配置さ
れる子回路基板30は、所定の機能を有するための回路
を設けた基板部31と、所定の外部装置と接続可能な各
種入出力端子32,…,32を所望の位置に配置させ
た、前記背面パネル構成部材24と同形状の、背面パネ
ル構成部33とで構成されている。 【0022】前記背面パネル構成部33には締結用凸部
34が設けられており、この締結用凸部34及び所定位
置には前記第1六角穴付きボルト41が螺合する雌ネジ
を形成した貫通孔35が形成されている。また、この子
回路基板30の基板部31の四隅にはこの子回路基板3
0を固定する所定締結部材である後述する第3六角穴付
きボルトが挿通する貫通孔36が形成されている。これ
ら貫通孔36の裏面側周囲にはGND接地のための導電
部37がそれぞれ設けられている。 【0023】前記子回路基板30を親基板20に追加し
て、ビデオプロセッサ6の機能変更を行う場合、まず、
図5に示すようにビデオプロセッサ6をひっくり返し
て、底面パネル10cを上側にし、所定位置に配置され
た複数の六角穴付きボルト41,42を六角レンチを使
用して取り外す。 【0024】次に、前記底面パネル10cから底面閉塞
部材25を取り外すとともに、前記背面パネル10bか
ら背面パネル構成部材24を取り外す。すると、図5及
び図6に示すように前記空間部23に通じる背面側切り
欠き部17及び底面側切り欠き部18で構成された開口
23aが表れる。 【0025】なお、図5及び図6において符号19aは
背面パネル構成部材24を背面パネル10bに固定して
いた前記第1六角穴付きボルト41が挿通する貫通孔で
あり、符号19bは底面閉塞部材25を底面パネル10
cに固定する前記第2六角穴付きボルト42が螺合する
雌ネジが形成された貫通孔であり、符号24a及び符合
24bは前記符号34及び符号35同様に形成した締結
用凸部及び前記第1六角穴付きボルト41が螺合する雌
ネジが形成された貫通孔であり、符号25aは底面閉塞
部材25を底面パネル10cに固定する前記第2六角穴
付きボルト42が挿通する貫通孔、符号25bは底面パ
ネル10cに電気的に接触する弾性導電部材であり、符
号27は親回路基板20及び子回路基板30を所定位置
に配置する基板固定部と、空間部23と1次回路11と
の連通部を閉塞してこの空間部23側から1次回路への
接触を防止したり、1次回路11側等に締結部材等が落
ち込むことを防止する仕切り部とを兼ねる板部材であ
る。図6ではこの板部材27を底面パネル10cに配置
する構造を示しているが、板部材27と底面パネル10
cとを別部材で構成する代わりに、底面パネル10cか
ら引き出して一体に設ける構成等にしてもよい。 【0026】次いで、図7及び図8に示すように前記子
回路基板30を用意し、前記開口23aを介してこの子
回路基板30の接続用コネクタ38を前記親回路基板2
0の接続コネクタ21に接続し、その後、この子回路基
板30をスペーサ26に所定締結部材である第3六角穴
付きボルト43で締結固定するとともに、前記第1六角
穴付きボルト41を貫通孔19aを介して貫通孔35に
形成された雌ネジに螺合して、この子回路基板30の背
面パネル構成部33を背面パネル10bに一体的に固定
配置する。このことにより、背面パネル構成部33の一
部と背面パネル10bとの一部とが当接するとともに、
子回路基板30とスペーサ26とが当接してGND接地
状態になる。 【0027】次に、図7及び図8に示すように前記底面
閉塞部材25を用意し、前記第2六角穴付きボルト42
を貫通孔25aを介して貫通孔19bに形成された雌ネ
ジに螺合して、底面閉塞部材25を底面パネル10cに
一体的に固定配置する。このことにより、弾性導電部材
25bが底面パネル10cに面接触する。 【0028】最後に、ビデオプロセッサ6を再びひっく
り返して、前記底面パネル10cが下側に配置される所
定状態にして、子回路基板30を親基板20に追加する
ビデオプロセッサ6の機能変更が完了する。 【0029】このように、背面パネルに設けた背面側切
り欠き部及び底面パネルに設けた底面側切り欠き部でビ
デオプロセッサの子基板配置空間部に通じる開口を形成
し、この開口を介して回路基板を追加する構造にしたこ
とにより、開口を安価な構成で実現して回路基板の追加
及び交換を容易に行うことができるとともに、基板レイ
アウトの自由度を大幅に向上させることができる。 【0030】また、背面側切り欠き部を塞ぐ背面パネル
構成部及び背面パネル構成部材を所定締結部材で背面パ
ネルに固定する構造にし、底面側切り欠き部を塞ぐ底面
閉塞部材を所定締結部材で底面パネルに固定する構造に
するとともに、子回路基板を所定締結部材で固定する構
造にしたことによって、子回路基板を親回路基板に追加
配置してビデオプロセッサの機能を変更する作業を容易
かつ確実に行うことができる。 【0031】さらに、子基板配置空間部の周囲に仕切り
部を兼ねる板部材を配置したことによって、1次回路と
の接触及び1次回路側に締結部材等が落ち込むことを確
実に防止することができる。 【0032】なお、所定締結部材を上述した六角穴付き
ボルト41,42,43等の代わりに図9に示すように
工具を使用することなく締結を可能にするツマミ部45
aを有する締結ネジ45にしてもよい。 【0033】また、図10に示すように前記底面閉塞部
材25の端部に折曲部25cを設けることによって、こ
の底面閉塞部材25を底面パネル10cに所定締結部材
で一体的に締結固定したとき、弾性導電部材25bによ
る浮き上がりが防止される。さらに、図11に示すよう
に子回路基板30を構成する背面パネル構成部33の下
面側所定位置に例えば2つの略U字形状の凹部33aを
設け、この凹部33aを図12に示すように背面パネル
10bの内面の前記凹部33aに対応する位置に設けた
軸部48aとフランジ部48bとで構成された凹部締結
部48を設ける構成にすることにより、締結部材を使用
することなく子回路基板30を背面パネル10bに配置
することができる。このとき、前記背面パネル10bに
設けたL字部材46に前記背面パネル構成部33の先端
部に当接するように弾性導電部材47を配置させておく
ことによって、締結部材を使用することなく前記子回路
基板30を背面パネル10bに配置させたとき、確実に
GND接地状態を得られる。加えて、前記背面パネル構
成部材24に凹部33aを設ける構成にしてもよい。 【0034】ここで、ビデオプロセッサ6内に複数の回
路基板を積層配置する構成例を説明する。例えば、図1
3(a)に示すように回路基板51,51,…の間にそ
れぞれスペーサ52を配置させ、それぞれのスペーサ5
2の雌ネジ部にビス53を螺合させて複数の回路基板5
1,51,…を積層する構成例がある。また、図13
(b)に示すようにスペーサ52の代わりに両端部に凸
部を設けた樹脂製スペーサ54を用意し、この凸部を回
路基板51,51,…に圧入して、複数の回路基板5
1,51,…を積層する構成例がある。さらに、図13
(c)に示すように一端部に雄ネジを形成した凸部を設
ける一方、このスペーサ55の他端部に前記雄ネジが螺
合する雌ネジを形成した凹部を設けたスペーサ55を、
回路基板51と回路基板51との間に配置させて、複数
の回路基板51,51,…を積層する構成例がある。 【0035】しかし、図13(a)及び図13(c)の
構成例では多数の締結を必要とするため、組立て及び分
解に多くの工数がかかるという不具合がある。また、図
13(b)の構成例では樹脂製のスペーサ54を使用す
ることによって、ノイズ対策に不具合が生じるおそれが
ある。さらに、図13(a)及び図13(b)の構成例
では上下2つのスペーサ52,54を異なる位置に配置
させなければならないので、回路基板51の小型化が難
しくなるという問題がある。又、図13(c)の構成例
ではスペーサ55の製造コストがかかるという不具合が
ある。このため、安価な構成で、回路基板の積層配置が
可能で、かつ回路基板の小型化を図れ、確実なGND接
地の図れる回路基板積層構造が望まれていた。 【0036】図14ないし図17は回路基板積層構造を
説明する図であり、図14は回路基板の構成を説明する
図、図15は回路基板積層状態を説明する図、図16は
スペーサの他の構成例を説明する図、図17は2枚の回
路基板を積層配置した構成例を説明する図である。 【0037】図14に示すように本実施形態の厚みtの
回路基板60の四隅には後述する図15に示す支柱71
が挿通する直径寸法がφaの貫通孔61が形成されてい
る。前記回路基板60の表面側及び裏面側の前記貫通孔
61の周囲には、この貫通孔61と同心で径寸法をこの
貫通孔より所定寸法だけ大きく形成した導電部62a,
62bを設けている。そして、これら導電部62a,6
2b同士を電気的に接続して、いわゆるスルーホール6
2を形成している。 【0038】図15に示すように支持部材70には前記
貫通孔61の直径寸法よりやや小径の外径寸法で形成さ
れた支柱71が突設している。この支柱71の端部には
雌ネジを有する凹部72が設けられている。 【0039】複数の回路基板60,60,…を積層する
ときは、まず1枚目の回路基板60の貫通孔61を前記
支柱71に挿通し、続いて、この支柱71が挿通する貫
通孔81を形成したパイプ状スペーサ80をそれぞれの
支柱71に挿通して回路基板60の上に載置させる。そ
の後は、このパイプ状スペーサ80に載せるように支柱
71に2枚目の回路基板60を挿通し、パイプ状スペー
サ80、回路基板60を順次挿通配置させて、4枚目の
回路基板60の貫通孔61を前記支柱71に挿通配置さ
せたなら、固定ネジ83を前記凹部72の雌ネジに螺合
させる。 【0040】このとき、前記支柱71の突出高さHs
と、4枚の基板60を積層配置した状態の1枚目の基板
下端面から4枚目の基板上端面までの距離である基板両
端面間距離Hnと、1枚目の基板下端面から3つ目のパ
イプ状スペーサ80上端面までの距離Hn−tとの間に
は Hn≧Hs>Hn−t の関係が成り立っている。 【0041】このため、全ての基板60をパイプ状スペ
ーサ80を介して積層配置したとき、4枚目の回路基板
60の上端面が少なくとも支柱71の上端面と面一致、
若しくはそれより高くなっている。 【0042】したがって、前記固定ネジ83を支柱71
の凹部72に形成されている雌ネジに螺合させたとき、
4枚の回路基板60,…,60が一体的に固定される。
このとき、各基板60,…,60に設けられている導電
部62a,62bとパイプ状スペーサ80の端面とが面
接触した状態になる。 【0043】つまり、支持部材70に支柱71を設ける
一方、この支柱71に回路基板60、パイプ状スペーサ
80、回路基板60,…の順に配置して、最後の回路基
板60を支柱71に配置した後、固定ネジ83を凹部7
2の雌ネジに螺合することによって、各基板60に設け
られている導電部62a,62bとパイプ状スペーサ8
0の端面とが面接触してGND接地を確実な状態にし
た、回路基板積層構造を得られる。 【0044】このように、支持部材に支柱を設け、この
支柱に対して回路基板及びパイプ状スペーサを順次配置
させて固定することによって、安価な構成で回路基板積
層構造を得ることができるとともに、同一軸上にスペー
サを配置して回路基板の小型化を図ることができる。 【0045】なお、図16に示すように前記パイプ状ス
ペーサ80の代わりに、両端部に凸部86を設けたパイ
プ状スペーサ85にしてもよい。このとき、前記凸部8
6の突出高さhと回路基板60の厚みtとの間にt≧2
hを設定する。 【0046】また、前記凸部86の外径寸法は、前記回
路基板60の貫通孔61の径寸法よりやや大きく設定す
る。 【0047】このことによって、上述と同様の作用及び
効果を得ることができる。 【0048】さらに、図17に示すように支柱の高さH
s′と、基板両端面間距離Hn′との間に、Hn′>H
s′の関係を設定することによって、上述した作用及び
効果に加えて回路基板60を2枚配置する構成や、図示
しないが回路基板60を3枚配置する構成等を容易にと
って所望の機能を得ることができる。 【0049】尚、本発明は、以上述べた実施形態のみに
限定されるものではなく、発明の要旨を逸脱しない範囲
で種々変形実施可能である。 【0050】[付記]以上詳述したような本発明の上記
実施形態によれば、以下の如き構成を得ることができ
る。 【0051】(1)内視鏡と、この内視鏡が接続され、
少なくとも装置本体内に信号処理回路等を備えた親回路
基板を設けて構成したプロセッサ部を有し、前記親回路
基板に入出力端子を備えた子回路基板を電気的に接続す
ることにより、前記プロセッサ部の機能の変更が可能な
外部装置とを具備する内視鏡装置において、前記外部装
置の装置本体を構成する底面パネル及び背面パネルに、
前記子回路基板を配置するための開口を構成する切り欠
き部を形成するとともに、これら切り欠き部を塞ぎ、前
記装置本体に一体的に固定される蓋部材を設け、前記子
回路基板及び前記蓋部材を、前記プロセッサ装置を構成
する他部材を固定する締結部材とは異なる、所定締結部
材で所定位置に固設した内視鏡装置。 【0052】(2)前記子基板を配置する空間部の周囲
に、仕切り部を兼ねる板部材を配置した付記1記載の内
視鏡装置。 【0053】(3)内視鏡と、複数の回路基板を積層配
置したプロセッサ装置とを有する内視鏡装置において、
前記プロセッサ装置内の所定位置に鉛直に、端部に雌ネ
ジを形成した凹部を有する支柱を複数設け、それら支柱
に挿通する貫通孔を所定位置に形成した回路基板及び、
支柱に挿通する貫通孔を形成したスペーサを順次載置
し、締結部材で一体固定した内視鏡装置。 【0054】(4)前記スペーサーの両端部に凸部を設
けた付記3記載の内視鏡装置。 【0055】(5)前記凸部の高さ寸法を、基板の厚み
寸法との間に t≧2h(t:基板の厚み寸法,h:凸部の高さ寸法) の関係を設定した付記4記載の内視鏡装置。 【0056】 【発明の効果】以上説明したように本発明の内視鏡装置
によれば、外部機器との接続のための入出力端子を備え
た所望の機能を有する子回路基板の親回路基板への追加
又は交換を容易、かつ確実に行える内視鏡装置を提供す
ることができる。
Description: BACKGROUND OF THE INVENTION [0001] 1. Field of the Invention [0002] The present invention relates to an endoscope apparatus provided with a processor capable of adding or replacing a circuit board having input / output terminals. 2. Description of the Related Art In recent years, endoscopes capable of observing a target site by inserting an elongated insertion portion into a body cavity or the like, and performing various examinations, treatments, and the like have been widely used. In an electronic endoscope provided with an image pickup device such as a CCD at an insertion portion, image processing is performed such that an endoscopic image is displayed on a monitor screen for observation or an image for diagnosis after inspection is recorded. An endoscope apparatus is provided with a video processor for performing the operation. [0003] Also, when an optical endoscope such as a rigid endoscope or a fiberscope is used, an endoscope image is displayed on a monitor screen for observation, and an image for diagnosis after inspection is recorded. In response to this demand, some endoscope apparatuses are provided with a camera head that can be attached to the eyepiece of the optical endoscope and a video processor that performs image processing. [0004] In recent years, video processors have been reduced in size, but with increasing functionality, it has become necessary to add or replace circuit boards, and by adding new circuit boards, it is necessary to connect external equipment. The number of input / output terminals also increases.
Therefore, the processor device may be miniaturized by stacking and arranging a plurality of circuit boards, or the processor device may be miniaturized by adopting a structure in which input / output terminals are provided directly on the circuit board and exposed to the outer surface of the device main body. I was [0005] However, when a circuit board having input / output terminals is added to a processor device, an opening is provided in a side surface of the device body like a personal computer, and the circuit board is added from the side. In the case of adopting a structure, a relay board is required to electrically connect the added circuit board to the parent board. As a result, the position of the connector for connecting to the parent board is restricted, so that the degree of freedom in the layout of the board is reduced. Further, it is necessary to provide a separate means for reliably grounding the board ground. Was likely to occur. In order to solve this problem, a structure is conceivable in which an opening is provided in the upper surface of the main body of the apparatus, and a circuit board is added from the upper opening and fixed with screws or the like. In order to prevent the intrusion of the liquid, a packing, a guide groove, and the like must be provided, which may increase the cost. Also, when adding or replacing boards,
In order to disassemble the top cover, the back panel, and the like, it is necessary to remove a number of screws, which are fastening members. [0007] In order to solve these problems, Japanese Patent Application No. 200-200
The applicant of Japanese Patent Application No. 0-249652 proposes a medical electrical device in which an opening is provided on the bottom side. However, in this medical electrical device, when the opening is provided on the bottom surface, the input / output terminals are incorporated in the device in advance, that is, since the input / output terminals are provided in advance in the device main body, the number and functions of the input / output terminals Is limited. In addition, since this opening is set at a position and size that does not touch the primary circuit of the processor device, it has been difficult to reduce the size of the device. The present invention has been made in view of the above circumstances, and is intended to add or replace a child circuit board having desired functions provided with input / output terminals for connection to an external device to a parent circuit board. It is an object of the present invention to provide an endoscope apparatus that can be easily and reliably performed. [0009] An endoscope apparatus according to the present invention comprises:
An endoscope and a processor unit to which the endoscope is connected and which is provided with a parent circuit board provided with at least a signal processing circuit and the like in the apparatus main body, and an input / output terminal provided on the parent circuit board An endoscope apparatus comprising: an external device capable of changing a function of the processor unit by electrically connecting a sub-circuit board; and a bottom panel and a rear panel constituting a device main body of the external device. A notch portion forming an opening for arranging the sub-circuit board, a cover member that is closed with the notch portion, and is integrally fixed to the apparatus main body, and the sub-circuit board and The lid member is fixed to a predetermined position with a predetermined fastening member different from a fastening member for fixing other members constituting the processor device. According to this configuration, by removing and attaching the predetermined fastening member, it is possible to add or replace a sub-circuit board having input / output terminals for connection to an external device and having a desired function. Embodiments of the present invention will be described below with reference to the drawings. FIGS. 1 to 12 relate to an embodiment of the present invention. FIG. 1 is a diagram illustrating a configuration of an endoscope system, FIG. 2 is a top view illustrating a video processor, and FIG. 3 is a cross-sectional view illustrating a video processor. FIG. 4 is a view for explaining a child circuit board, FIG. 5 is a perspective view for explaining an opening for arranging a child circuit board formed on a video processor, and FIG. 6 is a view for arranging a child circuit board formed on a video processor. FIG. 7 is a diagram illustrating the mounting of the sub-circuit board, FIG. 8 is a diagram illustrating the mounting state of the sub-circuit board, FIG. 9 is a diagram illustrating another example of the predetermined fastening member, FIG.
FIG. 11 is a diagram illustrating another configuration of the bottom surface closing member, FIG. 11 is a diagram illustrating another configuration of the rear panel component of the sub-circuit board, and FIG. 12 is a diagram illustrating an attached state of the rear panel component of FIG. It is. An endoscope system 1 shown in FIG. 1 performs an electronic endoscope 2 having an image pickup means, a light source device 3 for supplying illumination light to the electronic endoscope 2, and a signal processing for the image pickup means. A video processor (or a video signal processing device) 6 having a processor unit for generating a video signal, a color monitor 8 connected to the video processor 6 for displaying a video, an electronic endoscope 2 and a light source device 3; It comprises a signal transmission cable 7 for transmitting a signal to the video processor 6. The signal transmission cable 7 is connected to the electronic endoscope 2
It has an endoscope connection connector 7a for connecting to the video processor 6 and a video processor connection connector 7b for connecting to the video processor 6 at both ends. The electronic endoscope 2 has an elongated insertion section 2a for insertion into a living body, an operation section 2b provided at the rear end of the insertion section 2a, and a side extending from the operation section 2b. And the issued universal cord 2c. An integrated connector 2d is provided at the end of the universal cord 2c. In this embodiment, the endoscope system 1 in which the light source device 3 and the video processor 6 are separate from each other is shown. However, the light source unit and the processor unit are integrally provided in the video processor. You may. As shown in FIG. 2, a primary circuit 11 such as a power supply unit and a signal processing circuit (not shown) electrically insulated from the primary circuit 11 are provided in an apparatus main body 10 of the processor 6. A secondary circuit 12 having a parent circuit board 20 composed of one or more circuit boards is provided, and the primary circuit 11 and the secondary circuit 12 are provided for miniaturization.
And close proximity. The mother circuit board 20 is provided with a connector 21 to which a child circuit board (reference numeral 30 shown in FIG. 4) described later is electrically connected. Reference numeral 13 denotes a connector provided on the front panel 10a of the apparatus main body 10 to which the video processor connection connector 7b provided on the signal transmission cable 7 is connected. Reference numeral 15 denotes an exhaust port formed by inwardly bending the side surface of the primary circuit 11 which is the other side of the apparatus main body 10. Reference numeral 16 denotes a cooling fan that discharges the air inside the apparatus main body 10 from the exhaust port 15 and takes in the outside air from the intake port 14. As shown in FIG. 3, a parent circuit board 20 composed of, for example, two circuit boards is arranged at a predetermined position in the apparatus main body 10 of the processor 6. This device body 10
On the rear panel 10b side, various input / output terminals 22,..., 22 electrically connected to the parent circuit board 20 are protruded. In a notch portion on the back side of the back panel 10b, which will be described later, a back panel member 24 formed of a bent plate member constituting a cover member is a first fastening member which can be fastened by a hexagon wrench. Hex Socket Head Cap Screw 4
1 detachably fixed. Further, a thin plate-shaped bottom closing member 25 constituting a lid member is attached to and detached from a bottom cutout portion of the bottom panel 10c, which will be described later, by a second hexagon socket head bolt 42 which is a predetermined fastening member which can be fastened by a hexagon wrench. It is fixed freely. Further, between the parent circuit board 20 and the bottom surface closing member 25, a child board arrangement space portion (hereinafter abbreviated as a space portion) 23 for additionally arranging the child circuit board 30 is provided. Reference numeral 26 denotes a spacer for maintaining the distance between the substrates at a predetermined interval and fixing the circuit substrate. Further, the predetermined fastening member is a hexagon socket head cap screw that can be fastened by a hexagon wrench, and a fastening member for fixing another member constituting the video processor 6 is different from the predetermined fastening member in FIG. A Phillips screw tightened by a Phillips screwdriver arranged on the rear panel 10b shown, a nut tightened by a box wrench (not shown), and the like are used. As shown in FIG. 4, a sub-circuit board 30 disposed in the space 23 includes a board section 31 provided with a circuit having a predetermined function, and various input / output ports which can be connected to a predetermined external device. , 32 are arranged at desired positions and have a rear panel component 33 having the same shape as the rear panel component 24. The rear panel constituting portion 33 is provided with a fastening protrusion 34, and a female screw with which the first hexagon socket head bolt 41 is screwed is formed at the fastening protrusion 34 and at a predetermined position. A through hole 35 is formed. In addition, the four corners of the board part 31 of the sub-circuit board 30 are
A through hole 36 through which a third hexagon socket head cap screw, which will be described later, which is a predetermined fastening member for fixing 0 is inserted. Conductive portions 37 for GND grounding are provided around the back surface of these through holes 36, respectively. When the function of the video processor 6 is changed by adding the child circuit board 30 to the master board 20, first,
As shown in FIG. 5, the video processor 6 is turned over, the bottom panel 10c is turned upward, and the plurality of hexagon socket head bolts 41 and 42 arranged at predetermined positions are removed using a hexagon wrench. Next, the bottom surface closing member 25 is removed from the bottom panel 10c, and the back panel constituting member 24 is removed from the back panel 10b. Then, as shown in FIGS. 5 and 6, an opening 23 a constituted by the rear side cutout portion 17 and the bottom side cutout portion 18 communicating with the space portion 23 appears. In FIGS. 5 and 6, reference numeral 19a denotes a through hole through which the first hexagon socket head bolt 41 for fixing the rear panel component 24 to the rear panel 10b passes, and reference numeral 19b denotes a bottom closing member. 25 to the bottom panel 10
c is a through hole formed with a female screw to which the second hexagon socket head cap screw 42 is screwed. Reference numerals 24a and 24b denote a fastening projection formed similarly to the reference numerals 34 and 35, and Reference numeral 25a denotes a through hole through which the second hexagonal bolt 42 for fixing the bottom surface closing member 25 to the bottom panel 10c is inserted. Reference numeral 27 denotes an elastic conductive member that electrically contacts the bottom panel 10c. Reference numeral 27 denotes a board fixing portion for disposing the parent circuit board 20 and the child circuit board 30 at predetermined positions, and a space 23 and the primary circuit 11. It is a plate member that also serves as a partition that closes the communication portion to prevent contact with the primary circuit from the space 23 side and prevents a fastening member or the like from dropping into the primary circuit 11 or the like. FIG. 6 shows a structure in which the plate member 27 is disposed on the bottom panel 10c.
Instead of being formed as a separate member from the bottom panel c, a configuration may be adopted in which it is drawn out from the bottom panel 10c and provided integrally. Next, as shown in FIGS. 7 and 8, the slave circuit board 30 is prepared, and the connector 38 for connecting the slave circuit board 30 is connected to the master circuit board 2 through the opening 23a.
After that, the sub-circuit board 30 is fastened and fixed to the spacer 26 with a third hexagon socket bolt 43 as a predetermined fastening member, and the first hexagon socket bolt 41 is inserted into the through hole 19a. Then, the rear panel component 33 of the sub-circuit board 30 is integrally fixed to the rear panel 10b by being screwed into a female screw formed in the through hole 35. As a result, a part of the rear panel component 33 and a part of the rear panel 10b abut, and
The sub-circuit board 30 and the spacer 26 come into contact with each other, and the ground state is established. Next, as shown in FIGS. 7 and 8, the bottom surface closing member 25 is prepared, and the second hexagon socket head cap screw 42 is provided.
Is screwed into a female screw formed in the through hole 19b through the through hole 25a, and the bottom surface closing member 25 is integrally fixed to the bottom panel 10c. Thus, the elastic conductive member 25b comes into surface contact with the bottom panel 10c. Finally, the video processor 6 is turned over again to bring the bottom panel 10c into a predetermined state in which the lower panel 10c is disposed on the lower side, and the function change of the video processor 6 for adding the child circuit board 30 to the master board 20 is completed. I do. As described above, the back side cutout portion provided on the back panel and the bottom side cutout portion provided on the bottom panel form an opening which communicates with the sub-board arrangement space of the video processor. With the structure in which the board is added, the opening can be realized with an inexpensive configuration, the circuit board can be easily added and replaced, and the degree of freedom of the board layout can be greatly improved. Further, the rear panel constituting portion for closing the rear side cutout portion and the rear panel constituting member are fixed to the rear panel with a predetermined fastening member, and the bottom closing member closing the bottom side notch portion is provided on the bottom surface with a predetermined fastening member. The structure to fix to the panel and the structure to fix the child circuit board with a predetermined fastening member make it easy and reliable to add the child circuit board to the parent circuit board and change the function of the video processor. It can be carried out. Further, by arranging a plate member also serving as a partition around the sub board arrangement space, it is possible to reliably prevent contact with the primary circuit and dropping of a fastening member or the like on the primary circuit side. . As shown in FIG. 9, a predetermined fastening member is replaced with a hexagon socket head bolt 41, 42, 43 or the like, as shown in FIG.
A fastening screw 45 having a may be used. Further, as shown in FIG. 10, a bent portion 25c is provided at an end of the bottom surface closing member 25 so that the bottom surface closing member 25 is integrally fastened and fixed to the bottom panel 10c with a predetermined fastening member. The floating by the elastic conductive member 25b is prevented. Further, as shown in FIG. 11, for example, two substantially U-shaped concave portions 33a are provided at predetermined positions on the lower surface side of the rear panel constituting portion 33 constituting the sub-circuit board 30, and these concave portions 33a are formed on the rear surface as shown in FIG. By providing a recessed fastening portion 48 formed by a shaft portion 48a and a flange portion 48b provided at a position corresponding to the recessed portion 33a on the inner surface of the panel 10b, the child circuit board 30 can be provided without using a fastening member. Can be arranged on the back panel 10b. At this time, by arranging the elastic conductive member 47 so as to abut on the L-shaped member 46 provided on the back panel 10b so as to abut on the front end of the back panel component 33, the child can be used without using a fastening member. When the circuit board 30 is disposed on the back panel 10b, a GND ground state can be reliably obtained. In addition, the back panel component 24 may be provided with a recess 33a. Here, an example of a configuration in which a plurality of circuit boards are stacked in the video processor 6 will be described. For example, FIG.
As shown in FIG. 3A, spacers 52 are arranged between the circuit boards 51, 51,.
The screw 53 is screwed into the female screw portion of the second
There is a configuration example in which 1, 51,. FIG.
As shown in (b), instead of the spacer 52, a resin spacer 54 having protrusions at both ends is prepared, and this protrusion is pressed into the circuit boards 51, 51,.
There is a configuration example in which 1, 51,. Further, FIG.
As shown in (c), a spacer 55 having a convex portion formed with a male screw at one end and a concave portion formed with a female screw with which the male screw is screwed is provided at the other end of the spacer 55.
There is a configuration example in which a plurality of circuit boards 51, 51,... Are arranged between the circuit boards 51 and stacked. However, the configuration examples shown in FIGS. 13A and 13C require a large number of fastenings, so that there is a problem that assembling and disassembling require a lot of man-hours. In addition, in the configuration example of FIG. 13B, the use of the resin spacer 54 may cause a problem in noise suppression. Further, in the configuration examples of FIGS. 13A and 13B, since the upper and lower spacers 52 and 54 must be arranged at different positions, there is a problem that it is difficult to reduce the size of the circuit board 51. Further, in the configuration example of FIG. 13C, there is a problem that the manufacturing cost of the spacer 55 is increased. For this reason, there has been a demand for a circuit board laminated structure that can be stacked and arranged with an inexpensive configuration, can reduce the size of the circuit board, and can reliably ground the GND. 14 to 17 are diagrams for explaining a circuit board laminated structure. FIG. 14 is a diagram for explaining the structure of the circuit board. FIG. 15 is a diagram for explaining the circuit board laminated state. FIG. FIG. 17 is a diagram illustrating a configuration example in which two circuit boards are stacked and arranged. As shown in FIG. 14, four pillars 71 shown in FIG.
Are formed through holes 61 having a diameter of φa. Around the periphery of the through hole 61 on the front surface side and the back surface side of the circuit board 60, conductive portions 62a concentric with the through hole 61 and having a diameter larger by a predetermined size than the through hole are formed.
62b is provided. And these conductive parts 62a, 6
2b are electrically connected to each other to form a so-called through hole 6.
2 are formed. As shown in FIG. 15, the support member 70 is provided with a column 71 having an outer diameter slightly smaller than the diameter of the through hole 61. A concave portion 72 having a female screw is provided at an end of the column 71. When a plurality of circuit boards 60 are stacked, first, the through holes 61 of the first circuit board 60 are inserted into the columns 71, and then the through holes 81 through which the columns 71 are inserted. The pipe-shaped spacers 80 formed with are formed on the circuit boards 60 by passing through the respective columns 71. After that, the second circuit board 60 is inserted into the column 71 so as to be placed on the pipe-shaped spacer 80, and the pipe-shaped spacer 80 and the circuit board 60 are inserted and arranged in sequence to penetrate the fourth circuit board 60. When the hole 61 is inserted through the column 71, the fixing screw 83 is screwed into the female screw of the recess 72. At this time, the projecting height Hs of the column 71
And a distance Hn between both end surfaces of the substrate, which is a distance from the lower end surface of the first substrate to the upper end surface of the fourth substrate in a state where the four substrates 60 are stacked, and 3 from the lower end surface of the first substrate. The relationship of Hn ≧ Hs> Hn−t is established between the distance Hn−t to the upper end surface of the second pipe-shaped spacer 80. For this reason, when all the boards 60 are stacked and arranged via the pipe-shaped spacer 80, the upper end face of the fourth circuit board 60 is at least flush with the upper end face of the column 71,
Or higher. Therefore, the fixing screw 83 is connected to the support 71
When screwed into the female screw formed in the concave portion 72 of
The four circuit boards 60 are integrally fixed.
At this time, the conductive portions 62a and 62b provided on the substrates 60,... That is, while the support 71 is provided with the support 71, the circuit board 60, the pipe-shaped spacer 80, the circuit board 60,... Are arranged on the support 71 in this order, and the last circuit board 60 is provided on the support 71. Then, the fixing screw 83 is
2 by screwing the conductive portions 62 a and 62 b provided on each substrate 60 and the pipe-shaped spacer 8.
Thus, a circuit board laminated structure can be obtained in which the end surface of the circuit board is in surface contact with the ground plane and GND grounding is ensured. As described above, by providing the support on the support member, and sequentially arranging and fixing the circuit board and the pipe-shaped spacer to the support, a circuit board laminated structure can be obtained with an inexpensive structure. By disposing the spacers on the same axis, the size of the circuit board can be reduced. As shown in FIG. 16, instead of the pipe-shaped spacer 80, a pipe-shaped spacer 85 having projections 86 at both ends may be used. At this time, the protrusion 8
6 between the protruding height h and the thickness t of the circuit board 60.
Set h. The outer diameter of the projection 86 is set slightly larger than the diameter of the through hole 61 of the circuit board 60. Thus, the same operation and effect as described above can be obtained. Further, as shown in FIG.
s' and the distance Hn 'between both end faces of the substrate, Hn'> H
By setting the relationship of s', desired functions can be easily obtained in addition to the above-described functions and effects by easily arranging two circuit boards 60 or arranging three circuit boards 60 (not shown). be able to. It should be noted that the present invention is not limited to only the above-described embodiments, and various modifications can be made without departing from the spirit of the invention. [Appendix] According to the above-described embodiment of the present invention, the following configuration can be obtained. (1) The endoscope is connected to the endoscope,
At least a processor unit provided with a parent circuit board having a signal processing circuit and the like is provided in the apparatus main body, and by electrically connecting a child circuit board having input / output terminals to the parent circuit board, In an endoscope apparatus including an external device capable of changing the function of the processor unit, a bottom panel and a rear panel forming a device main body of the external apparatus include:
A notch forming an opening for arranging the sub-circuit board is formed, and a cover member that closes the notch and is integrally fixed to the apparatus main body is provided. An endoscope device in which a member is fixed at a predetermined position with a predetermined fastening member, which is different from a fastening member for fixing another member constituting the processor device. (2) The endoscope apparatus according to appendix 1, wherein a plate member also serving as a partition is disposed around a space where the daughter board is disposed. (3) In an endoscope device having an endoscope and a processor device in which a plurality of circuit boards are stacked and arranged,
Vertically at a predetermined position in the processor device, provided with a plurality of pillars having a concave portion formed with a female screw at an end, a circuit board formed with a through hole inserted in the pillars at a predetermined position,
An endoscope device in which spacers each having a through-hole formed to be inserted into a support are sequentially placed and integrally fixed with a fastening member. (4) The endoscope device according to appendix 3, wherein convex portions are provided at both ends of the spacer. (5) The height of the projections and the thickness of the substrate have a relationship of t ≧ 2h (t: thickness of the substrate, h: height of the projections). The endoscope device according to claim 1. As described above, according to the endoscope apparatus of the present invention, the parent circuit board of the slave circuit board having a desired function and having input / output terminals for connection to external devices. It is possible to provide an endoscope apparatus that can be easily and reliably added to or replaced with the endoscope.

【図面の簡単な説明】 【図1】図1ないし図12は本発明の一実施形態に係
り、図1は内視鏡システムの構成を説明する図 【図2】ビデオプロセッサを説明する上面図 【図3】ビデオプロセッサを説明する断面図 【図4】子回路基板を説明する図 【図5】ビデオプロセッサに形成した子回路基板を配置
するための開口を説明する斜視図 【図6】ビデオプロセッサに形成した子回路基板を配置
するための開口を説明する断面図 【図7】子回路基板の取付けを説明する図 【図8】子回路基板の取付け状態を説明する図 【図9】所定締結部材の他の例を説明する図 【図10】底面閉塞部材の他の構成を説明する図 【図11】子回路基板の背面パネル構成部の他の構成を
説明する図 【図12】図11の背面パネル構成部の取付け状態を説
明する図 【図13】複数の回路基板を積層配置する構成例を説明
する図 【図14】図14ないし図17は回路基板積層構造を説
明する図であり、図14は回路基板の構成を説明する図 【図15】回路基板積層状態を説明する図 【図16】スペーサの他の構成例を説明する図 【図17】2枚の回路基板を積層配置した構成例を説明
する図 【符号の説明】 6…ビデオプロセッサ 10…装置本体 10b…背面パネル 10c…底面パネル 17…背面側切り欠き部 18…底面側切り欠き部 23…子基板配置空間部 23a…開口 41…第1六角穴付きボルト 42…第2六角穴付きボルト 43…第3六角穴付きボルト
BRIEF DESCRIPTION OF THE DRAWINGS FIGS. 1 to 12 relate to an embodiment of the present invention, and FIG. 1 is a diagram illustrating a configuration of an endoscope system. FIG. 2 is a top view illustrating a video processor. FIG. 3 is a cross-sectional view illustrating a video processor. FIG. 4 is a view illustrating a sub-circuit board. FIG. 5 is a perspective view illustrating an opening for disposing a sub-circuit board formed in the video processor. FIG. 7 is a cross-sectional view illustrating an opening for disposing a sub-circuit board formed in a processor. FIG. 7 is a diagram illustrating the mounting of the sub-circuit board. FIG. 8 is a diagram illustrating the mounting state of the sub-circuit board. FIG. 10 is a view for explaining another example of the fastening member. FIG. 10 is a view for explaining another configuration of the bottom surface closing member. FIG. 11 is a view for explaining another configuration of the rear panel component of the slave circuit board. FIG. 11 is a diagram for explaining an attached state of a rear panel component of FIG. 13 is a view for explaining a configuration example in which a plurality of circuit boards are stacked and arranged. FIGS. 14 to 17 are views for explaining a circuit board stacked structure, and FIG. 14 is a view for explaining the configuration of a circuit board. 15 illustrates a circuit board lamination state. FIG. 16 illustrates another configuration example of a spacer. FIG. 17 illustrates a configuration example in which two circuit boards are laminated and arranged. Video processor 10 Device main body 10b Rear panel 10c Bottom panel 17 Rear cutout 18 Bottom cutout 23 Substrate placement space 23a Opening 41 First hexagon socket head bolt 42 Second Hexagon socket head bolt 43 ... 3rd hexagon socket head bolt

───────────────────────────────────────────────────── フロントページの続き (51)Int.Cl.7 識別記号 FI テーマコート゛(参考) H05K 7/14 H05K 7/14 G Fターム(参考) 2H040 GA02 GA11 4C061 CC06 JJ06 4E360 AB09 AB13 BA08 BD03 EA18 ED02 ED17 ED27 FA08 GA04 GA46 GA53 GB99 5C022 AA09 AB00 AC70 AC77 AC78 5E348 AA07 AA16 AA32 CC06 CC08 CC09 EH01 FF03 ──────────────────────────────────────────────────続 き Continued on the front page (51) Int.Cl. 7 Identification symbol FI Theme coat ゛ (Reference) H05K 7/14 H05K 7/14 G F-term (Reference) 2H040 GA02 GA11 4C061 CC06 JJ06 4E360 AB09 AB13 BA08 BD03 EA18 ED02 ED17 ED27 FA08 GA04 GA46 GA53 GB99 5C022 AA09 AB00 AC70 AC77 AC78 5E348 AA07 AA16 AA32 CC06 CC08 CC09 EH01 FF03

Claims (1)

【特許請求の範囲】 【請求項1】 内視鏡と、この内視鏡が接続され、少な
くとも装置本体内に信号処理回路等を備えた親回路基板
を設けて構成したプロセッサ部を有し、前記親回路基板
に入出力端子を備えた子回路基板を電気的に接続するこ
とにより、前記プロセッサ部の機能の変更が可能な外部
装置とを具備する内視鏡装置において、 前記外部装置の装置本体を構成する底面パネル及び背面
パネルに、前記子回路基板を配置するための開口を構成
する切り欠き部を形成するとともに、これら切り欠き部
を塞ぎ、前記装置本体に一体的に固定される蓋部材を設
け、 前記子回路基板及び前記蓋部材を、前記プロセッサ装置
を構成する他部材を固定する締結部材とは異なる、所定
締結部材で所定位置に固設したことを特徴とする内視鏡
装置。
Claims: 1. An endoscope, comprising: a processor unit to which the endoscope is connected and which is provided with a parent circuit board having a signal processing circuit and the like in at least an apparatus body; An endoscope apparatus comprising: an external device capable of changing the function of the processor unit by electrically connecting a child circuit board having input / output terminals to the parent circuit board; A notch that forms an opening for arranging the sub-circuit board is formed in the bottom panel and the back panel that form the main body, and these notches are closed to be integrally fixed to the apparatus main body. An endoscope apparatus, wherein a member is provided, and the sub-circuit board and the lid member are fixed at a predetermined position with a predetermined fastening member different from a fastening member for fixing other members constituting the processor device. .
JP2001220372A 2001-07-19 2001-07-19 Video signal processing system Expired - Lifetime JP3939941B2 (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP2001220372A JP3939941B2 (en) 2001-07-19 2001-07-19 Video signal processing system

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2001220372A JP3939941B2 (en) 2001-07-19 2001-07-19 Video signal processing system

Publications (2)

Publication Number Publication Date
JP2003033322A true JP2003033322A (en) 2003-02-04
JP3939941B2 JP3939941B2 (en) 2007-07-04

Family

ID=19054195

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2001220372A Expired - Lifetime JP3939941B2 (en) 2001-07-19 2001-07-19 Video signal processing system

Country Status (1)

Country Link
JP (1) JP3939941B2 (en)

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2007127594A (en) * 2005-11-07 2007-05-24 Riken Keiki Co Ltd Explosion-proof type gas detector
US7282025B2 (en) 2004-01-27 2007-10-16 Fujinon Corporation Electronic endoscope apparatus for connection to adapter unit
WO2015137158A1 (en) * 2014-03-10 2015-09-17 オリンパス株式会社 Electrical apparatus

Cited By (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US7282025B2 (en) 2004-01-27 2007-10-16 Fujinon Corporation Electronic endoscope apparatus for connection to adapter unit
JP2007127594A (en) * 2005-11-07 2007-05-24 Riken Keiki Co Ltd Explosion-proof type gas detector
JP4579136B2 (en) * 2005-11-07 2010-11-10 理研計器株式会社 Explosion-proof gas detector
WO2015137158A1 (en) * 2014-03-10 2015-09-17 オリンパス株式会社 Electrical apparatus
JP5927357B2 (en) * 2014-03-10 2016-06-01 オリンパス株式会社 Electrical equipment
JPWO2015137158A1 (en) * 2014-03-10 2017-04-06 オリンパス株式会社 Electrical equipment

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