JP2003032138A - Wireless circuit - Google Patents

Abstract

PROBLEM TO BE SOLVED: To solve problems of a conventional wireless circuit that has required increased man-hours when resin coating is applied to a signal processing circuit and a high frequency circuit and has had part not subjected to the resin coating between the signal processing circuit and the high frequency circuit when separate resin coating is applied to the signal processing circuit and the high frequency circuit. SOLUTION: A shield partition 17 is connected between the signal processing circuit 19 and the high frequency circuit 18 and used for part of an outer frame 20 of the resin coating and the resin coating is executed. Thus, the part not subjected to the resin coating between the signal processing circuit 19 and the high frequency circuit 18 can be eliminated and the resin coating man-hours can be reduced.

Description

Detailed Description of the Invention

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a radio circuit of a radio used for remote control of an automatic gas meter reading system or equipment.

[0002]

2. Description of the Related Art Conventionally, for small radios, a monopole antenna, a loop antenna or a plate-shaped inverted F antenna (hereinafter referred to as inverted F antenna) is used.
The inverted F antenna is often used as a built-in antenna for mobile phones, cordless phones, etc. because it is small, thin, and has a relatively high gain.

FIG. 9 shows a mounting structure of a conventional portable wireless device. In FIG. 9, (a) is a front view and (b) is a side view, 40 is an inverted F antenna (unit), 41
Is a radiating conductor plate which is a radiating element of the inverted F antenna, 42 is a short-circuiting conductor plate for grounding the radiating conductor plate, 43 is a strip line for feeding a high frequency signal, and 44 is a feeding line of the inverted F antenna connected to the strip line. A conductor plate, 45 is a high-frequency circuit board on which a high-frequency circuit for transmitting and receiving radio signals is mounted, 46 is a printed circuit board on which a control circuit of a radio device is mounted, 47 is a shield case for shielding the high-frequency circuit or the printed circuit, Reference numeral 48 is a ground conductor plate provided so as to face the radiation conductor plate, and 49 is a dielectric material mounted between the ground conductor plate 48 and the radiation conductor plate 41.

In the inverted-F antenna 40, a radiation conductor plate 41 and a ground conductor plate 48 are opposed to each other, and a dielectric material 49 is sandwiched between the conductor plates, and a short-circuit conductor plate 42 is interposed at an end of the radiation conductor plate 41. It is connected to the ground conductor plate 48, and the ground conductor plate 48 is connected to the high frequency substrate 45 by soldering. The feeding strip line 43 extending from the high-frequency circuit board 45 is connected to the feeding conductor plate 44 connected to the radiation conductor plate 41 by soldering to feed the inverted F antenna.

[0005]

However, in the above-mentioned conventional structure, when the resin coating is applied to the high frequency circuit and the printed circuit board, both the high frequency circuit and the signal processing circuit are framed, and each frame is separately framed. The resin coating must be performed and the shield case of the high frequency circuit must be covered, and a sufficient space for framing the resin coating must be secured, and it is between the high frequency circuit and the signal processing circuit. Since the shield case is installed between the high-frequency circuit coating frame and the signal processing circuit coating frame, it is necessary to have a resin-free portion, and the wiring between the high-frequency circuit and signal processing circuit cannot be coated with resin. The problem occurs.

If the high-frequency circuit is shielded independently and both the high-frequency circuit and the signal processing circuit are to be shielded, two shield cases, a high-frequency circuit shielding case and a signal processing circuit shielding case, are required. However, there is also a problem that the cost becomes high considering the man-hours for soldering and the material cost.

Further, when the shield case is divided into two parts, an outer frame part and a lid part, strength cannot be obtained when the lid part is attached to the outer frame part by contact, and the outer frame part and the lid part are connected by soldering or the like. You will need it.

Further, in the above-mentioned conventional example, when a shield case is covered on the high-frequency circuit section and a short-circuit conductor is to be connected to the shield case, a separate conductor case is required, resulting in high cost.

Further, when both the high frequency circuit and the signal processing circuit are shielded and the short-circuit conductor of the inverted F antenna is to be connected, a high frequency circuit shield case and a signal processing circuit shield case are provided. The short-circuit conductor must be provided so as to cover the shield case, which causes a problem of high cost.

The present invention is to solve the above-mentioned problems, and in a large component such as a battery or an RF unit, in which the mounting space and the dimension in the thickness direction are restricted, the high frequency circuit and the signal processing circuit are shielded while shielding the high frequency circuit. Both are resin-coated without gaps, and both the high-frequency circuit and the signal processing circuit can be shielded at low cost. Even when the shield case is divided into two parts, the outer frame part and the lid part, the outer frame part and the lid part are separated. The purpose is to connect by contact, shield both the high frequency circuit and the signal processing circuit, and achieve this effect at low cost even when trying to connect the short-circuit conductor of the inverted F antenna. Is.

[0011]

According to the present invention, in order to solve the above-mentioned problems, a printed circuit board is provided with a shield crimp formed of a conductor between a signal processing circuit and a high frequency circuit, and the shield crimp is coated with a resin. It is connected as a part of the outer frame between the signal processing circuit of the printed circuit board and the high frequency circuit.

Further, the shield case is formed by bending three sides of the plate-shaped conductor plate, and the remaining one side of the plate-shaped conductor plate which is not bent is adjusted to the width of the shield crimp. When connected to a printed circuit board, both the signal processing circuit and the high frequency circuit can be shielded.

The shield case is composed of two parts, an outer frame part and a lid part, and the outer frame part has its surface facing the radiation conductor plate connected by a conductor such as a lattice.

Further, the printed circuit board is provided with a shield crimp formed of a conductor between the signal processing circuit and the high frequency circuit, and further, between the shield crimp and the shield case.
The plate-shaped conductor plate is attached to the shield blade.

[0015]

A first aspect of the present invention is a printed circuit board having a wiring pattern for a signal processing circuit and a high-frequency circuit on one side, and a grounding conductor pattern for the entire surface on the opposite side, and the grounding conductor pattern. A radiation conductor plate facing the surface, a short-circuit conductor having one end connected to the radiation conductor plate, a power supply conductor portion for supplying a high frequency signal to the radiation conductor plate, and a shield case for shielding a high frequency circuit, The printed circuit board has a shield crimp formed of a conductor between the signal processing circuit and the high-frequency circuit, and the shield crimp is used as a part of an outer frame of a resin coating and the signal processing circuit of the printed circuit board and the high-frequency circuit. The wireless circuit is formed by coating the circuit with resin.

Therefore, when resin coating is to be applied to the high frequency circuit and the printed circuit board, both the high frequency circuit and the signal processing circuit are framed, and the resin coating is carried out in separate frames. Since the resin coating is performed on the outer frame, it is possible to reduce the number of components, further reduce the number of parts and the number of assembly steps and adjustment steps, and do not apply the resin coating section between the high frequency circuit and the signal processing circuit. The parts can be eliminated.

According to a second aspect of the present invention, a shield shim is attached between the signal processing circuit and the high frequency circuit, and when the shield case is connected to the printed circuit board, the signal processing circuit and the high frequency circuit are connected. By shielding both the circuit and the circuit, it is possible to shield both the signal processing circuit and the high frequency circuit.

According to a third aspect of the present invention, the shield wire has a protrusion, the short-circuit conductor plate has a hole, and the short-circuit conductor plate is inserted into the hole to connect the shield wire and the high-frequency conductor plate is connected. The shield effect of the circuit can be improved.

According to a fourth aspect of the invention, the shield blade has a contact portion having a spring property, and the short-circuit conductor plate and the shield blade are electrically connected at the contact portion having a spring characteristic of the shield blade. This makes it possible to improve the shielding property of the high frequency circuit without soldering.

According to a fifth aspect of the invention, the shield case is composed of an outer frame portion and a lid portion, and the outer frame portion is connected to a surface facing the radiation conductor plate. The outer frame can be used also as the outer frame of resin coating, and sufficient lid mounting strength can be provided only by contacting the outer frame portion and the lid portion without soldering.

According to a sixth aspect of the present invention, a shield crimp made of a conductor is attached between the signal processing circuit and the high frequency circuit of the printed circuit board, and a plate-shaped conductor plate is shielded between the shield crimp and the shield case. By attaching it to the crimp, both the high-frequency circuit and the signal processing circuit are shielded, and even when trying to connect the short-circuit conductor of the inverted F antenna, this effect can be realized at low cost.

[0022]

EXAMPLE 1 Example 1 of the present invention will be described below. FIG. 1 is a system configuration diagram of a wireless gas automatic meter reading system. An outline of a wireless gas automatic meter reading system will be described with reference to FIG. 1, and then a board-mounted plate antenna used in the system will be described.

In FIG. 1, reference numeral 1 is a gas meter for integrating and measuring the gas consumption of a customer, 2 is a wireless adapter slave unit connected to the gas meter for wireless communication, and 3 is wireless communication with the wireless adapter slave unit. Wireless adapter base unit,
4 is a T-NCU (Terminal-Network Control Uni
t) 5 is a wall surface of the house to which the T-NCU 4 and the wireless adapter master unit 3 are attached, 6 is a public line network connected to the T-NCU, and 7 is connected to the public line network 6 and uses gas from a customer It is the meter-reading center of the gas supplier who measures the amount.

Next, the operation will be described. The gas meter reading center 7 of the gas supplier sends a gas meter reading request to the gas meter 1 of the customer's house through the public line network 6 and the T-NCU of the customer's house.
4 is transmitted to the wireless adapter master unit 3 from the T-NCU 4 and wirelessly transmitted to the wireless adapter slave unit 2 and transmitted to the gas meter 1. The gas meter 1 is configured to return the meter reading value to the meter reading center 7 while tracing the same route in reverse. The wireless adapter slave unit 2 and the wireless adapter master unit 3 use the frequency band for specific low power wireless telemeter / telecontrol in the 429 MHz band.

Next, the mounting board in the wireless adapter used in the wireless gas meter reading system will be described. FIG. 2 is an external configuration diagram of a mounting board having a board mounting type plate antenna incorporated in the wireless adapter. FIG. 3 is an external configuration diagram when the wireless adapter slave unit 2 incorporating the plate antenna is attached to the gas meter 1.

In FIG. 2, 8 is a radiating conductor plate forming a radiating element of a plate antenna, 10 is a printed circuit board on which a control circuit of a wireless adapter is mounted, and 11 is one end of which is connected to the radiating conductor plate 8. A short-circuit conductor connected to the entire ground opposite to the radiation conductor plate of the printed circuit board 10, 12 is a whole ground pattern (entire ground conductor pattern) on the side of the radiation conductor plate of the printed circuit board 10, 14
Is connected to an antenna input / output terminal of a high frequency circuit via a wiring pattern and transmits a radio signal (high frequency signal) to the radiation conductor plate 8
A reference numeral 15 is a power supply conductor portion for supplying electric power to the device, 15 is a shield case for shielding a high frequency circuit, and 16 is a lithium battery which is mounted on the surface of the printed circuit board 10 and is a power source of the wireless adapter. In addition, the whole-surface ground pattern has a great influence on the characteristics of the radiation conductor plate. For example, the larger the area of the entire ground pattern, the higher the possibility that the radiation gain characteristic of the radio wave radiated from the radiation conductor plate will be improved.

Further, as shown in FIG. 3, a wireless device board mounted on the printed circuit board 10 is built in a resin casing to form a wireless adapter slave unit 2, which is attached and connected to the front surface of the gas meter 1. .

Next, the structure, operation and action will be described. In the plate antenna shown in FIG. 2, the radiation conductor plate 8 has a short-circuit conductor 11 and a feeding conductor portion 14 formed at one end by a conductor plate. The short-circuit conductor 11 and the feeding conductor portion 14 are bent vertically with respect to the plate 8.

Further, the radiating conductor plate 8 in which the short-circuit conductor 11 and the feeding conductor portion 14 are integrally molded and the radiating conductor plate 8 side of the printed circuit board 10 on the one-sided entire surface ground 12 form a plate antenna. Printed circuit board 1
The lithium battery 16 which is the power source of the wireless device is also mounted on the zero. And the printed circuit board 10
The radio device formed above is built in a resin casing and attached to the gas meter 1 or the house wall surface 5 as the radio adapter slave device 2 or the radio adapter master device 3, respectively.

The radiation conductor plate 8 is made of copper, which is a high conductivity material, in order to improve the gain.

Further, the printed circuit board 10 is provided with a shield crimp 17 made of a conductor between the signal processing circuit 19 and the high frequency circuit 18, and the shield crimp is used as a part of the resin coating outer frame 20 to perform signal processing of the printed circuit board. The circuit 19 and the high-frequency circuit 18 are resin-coated, and the shield case 15 covers the circuit 19 and the high-frequency circuit 18 from above.
Are connected.

According to this structure, it is possible to form a plate-shaped inverted F antenna with the radiation conductor plate 8 and the one-sided whole ground 12 facing the radiation conductor plate 8 of the printed circuit board 10, and it is possible to achieve a high frequency. When resin coating is applied to the circuit and printed circuit board, both the high-frequency circuit and the signal processing circuit are framed, and the resin coating is performed in a separate frame, but the resin coating is performed in one outer frame. Therefore, for the above two reasons, it is possible to reduce the number of constituent parts, further reduce the number of parts and the number of assembly steps and adjustment steps.
In addition, it is possible to realize three things, that is, to eliminate the uncoated portion of the resin coating portion between the high frequency circuit and the signal processing circuit.

Although the present embodiment has been described by using the wireless adapter of the wireless automatic meter reading system of the gas meter, a wireless device used in a wireless system such as other equipment may be used.

The configuration of this embodiment can be applied to any of the following embodiments and has the same effect.

(Embodiment 2) FIG. 4 is a block diagram of Embodiment 2 of the present invention.

In FIG. 4, the same components as those in the above-mentioned embodiment are designated by the same reference numerals, and the description thereof will be omitted.
In FIG. 4, reference numeral 21 denotes a shield case which is enlarged to the signal processing circuit.

With such a configuration, even when both the high frequency circuit and the signal processing circuit are shielded, both parts can be shielded by one shield case. The shield case may be formed by bending three sides of the plate-shaped conductor plate, and the remaining one side of the shield case that is not bent may be matched with the width of the shield hole.

(Third Embodiment) FIG. 5 is a block diagram of a third embodiment of the present invention.

In FIG. 5, the same components as those in the above-mentioned embodiment are designated by the same reference numerals, and the description thereof will be omitted.
In FIG. 5, 22 is a shield shield having a protrusion, and 23 is a shield case having a hole.

Next, the structure and operation will be described. By inserting the projection of the shield sinker 22 having the projection into the hole of the shield case 23 having the hole and soldering it, the shield effect of the high frequency circuit can be obtained. Can be improved.

(Fourth Embodiment) FIG. 6 is a block diagram of a fourth embodiment of the present invention.

In FIG. 6, the same components as those in the above-mentioned embodiment are designated by the same reference numerals, and the description thereof will be omitted.
In FIG. 6, reference numeral 24 is a shield bar having a protrusion having a spring property.

Next, the structure and operation will be described. By bringing the protrusion of the shield sink 24 having the protrusion having the spring property into contact with the inside of the shield case 21, the shield sink 24 and the shield case 21 are electrically conducted. By doing so, the shielding effect of the high frequency circuit can be improved without soldering.

In the embodiment, the protrusion is described, but the present invention is not limited to this. Any contact may be used as long as it makes contact between the shield blade 24 and the shield case.

(Fifth Embodiment) FIG. 7 is a block diagram of a fifth embodiment of the present invention.

In FIG. 7, the same components as those in the above-mentioned embodiment are designated by the same reference numerals and the description thereof will be omitted.
In FIG. 7, 25 is an outer frame portion of the shield case, and 26 is a lid portion of the shield case.

Next, the structure and operation will be described. The shield case outer frame portion 25 is connected to the printed circuit board 10, and then the shield case outer frame portion 25 is coated with resin as an outer frame of resin coating, and then the shield is provided. By covering the case lid from above, the shield case outer frame 25 and the shield case lid 26 can be held only by the contact strength. For this reason, there is no need to separately provide an outer frame of resin coating, and since the four surfaces of the shield case outer frame portion 25 are connected by the lattice-shaped portion on the upper side, the shield case outer frame portion 25 and the shield case lid portion 26 are soldered. It can be held only by the contact strength without doing.

(Sixth Embodiment) FIG. 8 is a block diagram of a sixth embodiment of the present invention.

In FIG. 8, the same components as those in the above-mentioned embodiment are designated by the same reference numerals and the description thereof will be omitted.
In FIG. 8, 27 is a plate-shaped conductor plate.

The structure and operation will be described below. Since the plate-shaped conductor plate 27 is attached to the shield gap between the shield gap 17 and the shield case 21,
The double shield effect can be realized at low cost without actually providing double shield cases.

The plate-shaped conductor plate 27 is basically mounted in parallel with the substrate, but the mounting need not be parallel with the substrate. Further, the size of the plate-shaped conductor plate 27 may be such that it covers either the high frequency circuit or the signal processing section, or it covers both the high frequency circuit and the signal processing section. Further, the size of the plate-shaped conductor plate 27 is not limited. ,

[0052]

As described above, in the radio circuit of the present invention, the shield crimp is provided between the high frequency circuit and the signal processing circuit, so that the high frequency circuit and the signal processing circuit are provided with separate coating frames. The resin coating can be carried out with one outer frame, and the uncoated portion between the high frequency circuit and the signal processing circuit can be eliminated.

[Brief description of drawings]

[Fig. 1] System configuration diagram of wireless gas automatic meter reading system

FIG. 2 is a configuration diagram of a wireless circuit according to the first embodiment of the present invention.

FIG. 3 is a configuration diagram of a gas meter mounting structure of the wireless adapter with a plate antenna according to the first embodiment of the present invention.

FIG. 4 is a configuration diagram of a wireless circuit according to a second embodiment of the present invention.

FIG. 5 is a configuration diagram of a wireless circuit according to a third embodiment of the present invention.

FIG. 6 is a configuration diagram of a wireless circuit according to a fourth embodiment of the present invention.

FIG. 7 is a configuration diagram of a wireless circuit according to a fifth embodiment of the present invention.

FIG. 8 is a configuration diagram of a wireless circuit according to a sixth embodiment of the present invention.

FIG. 9 is a mounting configuration diagram of a wireless circuit in a conventional portable wireless device.

[Explanation of symbols]

8 Radiation conductor plate 10 printed circuit board 11 Short-circuit conductor 12 whole ground pattern 14 Feeding conductor 15 Shield case 16 lithium battery 17 Shield Shikiri 18 Resin coated high frequency circuit 19 Resin coated signal processing circuit 20 Resin coating outer frame 21 Shield case expanded to signal processing circuit 22 Shield with projection 23 Shield case with hole 24 Shield crimp with protrusion having springiness 25 Shield case outer frame 26 Shield case lid 27 Plate conductor plate

   ─────────────────────────────────────────────────── ─── Continued front page    F-term (reference) 5J045 AB09 DA08 KA07 LA04 MA04                       MA07 NA05                 5J046 AA15 AB13 CA10                 5K011 AA03 AA04 AA14

Claims (6)

[Claims] 1. A printed circuit board having a wiring pattern for a signal processing circuit and a high-frequency circuit on one surface, and an entire ground conductor pattern formed on the opposite surface; a radiation conductor plate facing the surface of the ground conductor pattern; The printed circuit board is provided with a short-circuit conductor having one end connected to a radiation conductor plate, a feeding conductor portion for supplying a high-frequency signal to the radiation conductor plate, and a shield case for shielding a high-frequency circuit. A shield crimp made of a conductor is attached between the high frequency circuit and the signal crimping circuit of the printed circuit board and the high frequency circuit are resin-coated with the shield crimp as a part of an outer frame of resin coating. Wireless circuit to do. 2. A printed circuit board having a wiring pattern for a signal processing circuit and a high-frequency circuit on one surface, and a ground conductor pattern for the entire surface on the opposite surface; a radiation conductor plate facing the surface of the ground conductor pattern; The printed circuit board is provided with a short-circuit conductor having one end connected to a radiation conductor plate, a feeding conductor portion for supplying a high-frequency signal to the radiation conductor plate, and a shield case for shielding a high-frequency circuit. A radio circuit, wherein a shield crimp made of a conductor is attached between the radio frequency circuit and the signal processing circuit and the radio frequency circuit when the shield case is connected to a printed circuit board. 3. A printed circuit board having a wiring pattern of a signal processing circuit and a high-frequency circuit on one surface thereof, and a ground conductor pattern formed on the opposite surface thereof, a radiation conductor plate facing the surface of the ground conductor pattern, The printed circuit board is provided with a short-circuit conductor having one end connected to a radiation conductor plate, a feeding conductor portion for supplying a high-frequency signal to the radiation conductor plate, and a shield case for shielding a high-frequency circuit. A shield crimp made of a conductor is attached to the high frequency circuit, the shield crimp has a protrusion, the shield case has a hole, and the shield case is inserted by connecting the protrusion of the shield crimp to the hole. A wireless circuit characterized by the above. 4. A printed circuit board having a wiring pattern for a signal processing circuit and a high-frequency circuit on one surface, and a full-face ground conductor pattern on the opposite surface; a radiation conductor plate facing the surface of the ground conductor pattern; The printed circuit board is provided with a short-circuit conductor having one end connected to a radiation conductor plate, a feeding conductor portion for supplying a high-frequency signal to the radiation conductor plate, and a shield case for shielding a high-frequency circuit. A shield crimp made of a conductor is attached to the high-frequency circuit, the shield crimp has a contact portion having a spring property, and the shield case and the shield crimp electrically contact at the spring contact portion of the shield crimp. A wireless circuit characterized by being. 5. A printed circuit board having a wiring pattern for a signal processing circuit and a high-frequency circuit on one surface, and an entire ground conductor pattern formed on the opposite surface, a radiation conductor plate facing the surface of the ground conductor pattern, and The radiating conductor plate is provided with a short-circuit conductor having one end connected to the radiating conductor plate, a feeding conductor part for supplying a high-frequency signal to the radiating conductor plate, and a shield case for shielding a high-frequency circuit. The shield case includes an outer frame portion and a lid portion. And the outer frame portion is connected to a surface facing the radiation conductor plate. 6. A printed circuit board having a wiring pattern for a signal processing circuit and a high-frequency circuit on one side, and a full-face ground conductor pattern formed on the opposite side, a radiating conductor plate facing the side of the ground conductor pattern, The printed circuit board is provided with a short-circuit conductor having one end connected to a radiation conductor plate, a feeding conductor portion for supplying a high-frequency signal to the radiation conductor plate, and a shield case for shielding a high-frequency circuit. A radio circuit, wherein a shield crimp made of a conductor is mounted between the radio frequency circuit and a plate-shaped conductor plate is mounted on the shield crimp between the shield crimp and the shield case.