JP2003031456A - Method and system for producing semiconductor - Google Patents

Abstract

PROBLEM TO BE SOLVED: To realize a method for producing a semiconductor in which accurate evaluation of process performance can be attained. SOLUTION: A relation Y=δ+αXA+βXB+γXC exists between the uniformity (Y) of etching rate of a semiconductor production system and the use time (XA, XB, XC) of consumable components A, B and C. δ, α, β and γ are coefficients determined by the use time of the consumable components A, B and C, and the measurement of uniformity of etching rate. Predicted value of etching rate uniformity (Y) is determined by substituting the use time of the components A, B and C at time point [I] into the expression, and substituting the slice of use time of the components A, B and C into the expression after the time point [I] to immediately before the time point [II]. Since component A is replaced at the time point [II], use time of the component A is set to 0 and the slice of the use time of the components B and C are substituted thus determining the predicted value of etching rate uniformity at time point [II]. Similarly, predicted value of etching rate uniformity at the time point [III] is determined. Since error between the measurement and the predicted value is mall, uniformity of etching rate can be predicted accurately.

Description

Detailed Description of the Invention

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a method for predicting a process performance in a semiconductor manufacturing apparatus, a method for selecting an optimum replacement part for a consumable part, a method for determining a deviation of a device characteristic over time, and a semiconductor incorporating these methods. Manufacturing equipment

[0002]

2. Description of the Related Art In a semiconductor manufacturing apparatus, when the components of the semiconductor manufacturing apparatus are consumed, the characteristics of the product to be manufactured may be deteriorated, so that the replacement of consumable parts is unavoidable.

Further, after the consumable part is replaced with a new part, it is necessary that the process performance of the semiconductor manufacturing apparatus does not become worse than a predetermined evaluation value during the period until the next part replacement time in order to improve the product yield. Connected to.

Therefore, it is important to appropriately predict the deterioration of the process performance, identify the consumable part that causes the deterioration, and replace the consumable part before the process performance becomes worse than a predetermined evaluation value. .

[0005]

However, in the prior art, the process performance prediction of the semiconductor manufacturing apparatus is performed empirically, and the parts are replaced based on the empirical performance prediction. For this reason, appropriate component replacement is not always performed, and the process performance may deteriorate below the evaluation value, which adversely affects the yield of products manufactured by the semiconductor manufacturing apparatus.

In order to avoid adversely affecting the yield of products, it is conceivable to replace parts earlier than based on empirically predicted process performance.
This would increase the cost of the replacement parts and is not desirable.

The object of the present invention is to predict the process performance based on the measured data of the usage time of consumable parts.
It is an object of the present invention to realize a semiconductor manufacturing method capable of accurately evaluating process performance and a semiconductor device implementing the method.

Another object of the present invention is to provide a semiconductor manufacturing method and a method therefor capable of reducing the product cost by selecting an optimum replacement part at the time of replacement of a consumable part based on an appropriate predicted value of process performance. To realize a semiconductor device.

[0009]

In order to achieve the above object, the present invention is configured as follows. (1) An evaluation program for a semiconductor manufacturing apparatus, which is a procedure for substituting the usage time of consumable parts in the semiconductor manufacturing apparatus into a predetermined arithmetic expression, a procedure for executing the above arithmetic expression, and a process performance prediction of the semiconductor manufacturing apparatus. Causing the computer to perform the procedure for calculating the value.

(2) A semiconductor manufacturing apparatus evaluation program, which is a procedure for substituting the usage time of consumable parts in the semiconductor manufacturing apparatus into a predetermined arithmetic expression, a procedure for executing the above arithmetic expression, and a process of the semiconductor manufacturing apparatus. A computer is made to execute the procedure of calculating the predicted value of the performance and the procedure of calculating the change with time of the process performance characteristic of the semiconductor manufacturing apparatus from the calculated process performance.

(3) An evaluation program for a semiconductor manufacturing apparatus, which is a procedure for substituting the usage time of consumable parts in the semiconductor manufacturing apparatus into a predetermined arithmetic expression, a procedure for executing the above arithmetic expression, and a process of the semiconductor manufacturing apparatus. A procedure for calculating the predicted value of performance, a procedure for calculating consumable parts to be replaced from the calculated process performance, and a procedure for calculating a combination of parts to be replaced when there are multiple consumable parts to be replaced, Among the combinations of replacement parts, the computer is made to execute a procedure for selecting an optimum combination of replacement consumable parts based on the price of the parts.

(4) In the semiconductor manufacturing method, the operating time of a consumable part of a manufacturing apparatus component for manufacturing a semiconductor is substituted into a predetermined arithmetic expression, and this arithmetic expression is executed to predict the process performance of the semiconductor manufacturing apparatus. A value is calculated, and a semiconductor is manufactured based on the calculated predicted value.

(5) Preferably, in the above (4),
The change over time in the process performance characteristics of the semiconductor manufacturing apparatus is calculated from the calculated process performance, and a semiconductor is manufactured based on the calculated predicted value and the change over time in the process performance characteristics.

(6) Preferably, in the above (5), the consumable parts to be replaced are calculated from the calculated process performance, and when there are a plurality of consumable parts to be replaced, a combination of the parts to be replaced is calculated. Among the calculated combinations of replacement parts, the optimum combination of replacement consumable parts is selected based on the part price.

(7) In a semiconductor manufacturing apparatus having a plurality of consumable parts for processing an object to manufacture a semiconductor, the operating time of the consumable parts is substituted into a predetermined arithmetic expression, and this arithmetic expression is executed. In addition, a predictive value calculating means for calculating a predictive value of the process performance of the semiconductor manufacturing apparatus is provided.

(8) Preferably, in the above (7),
The predicted value calculation means calculates a change over time in process performance characteristics from the calculated process performance.

(9) Preferably, in the above (8), the predicted value calculating means calculates a replacement plow consumable part from the calculated process performance, and when there are a plurality of consumable parts to be replaced, they should be replaced. A combination of parts is calculated, and an optimum combination of replacement consumable parts is selected from the calculated combinations of replacement parts based on the price of the parts.

(10) Preferably, the above (7),
In (8) and (9), there is provided display means for displaying the predicted value of the process performance calculated by the predicted value calculating means.

By predicting the process performance of the semiconductor manufacturing apparatus based on the actual measurement data of the usage time of consumable parts,
It is possible to accurately evaluate the process performance.

[0020]

BEST MODE FOR CARRYING OUT THE INVENTION Embodiments of the present invention will be described below with reference to the accompanying drawings. FIG. 1 shows the first of the present invention.
FIG. 6 is an explanatory view of the semiconductor manufacturing method according to the embodiment of FIG. FIG. 1 is a graph showing the relationship between the etching time uniformity and the usage time of consumable parts, taking into consideration the uniformity of the etching rate among the process performances in the semiconductor manufacturing apparatus.

As a semiconductor manufacturing apparatus to which the present invention is applied, there are a plasma CVD apparatus, a plasma etching apparatus and the like. Taking a plasma etching apparatus as an example, this apparatus has a processing chamber for etching a wafer, which is an object to be processed, a means for loading / unloading the wafer into / out of the processing chamber, and a wafer arranged in the processing chamber. The apparatus is provided with a support, a gas introduction unit (including a valve) for introducing a processing gas into the processing chamber, a control unit for controlling the operation of the loading / unloading unit, and a computer for performing other processing.

The expendable parts are expendable parts in the semiconductor manufacturing apparatus described above.

In FIG. 1, for example, assuming that the number of consumable parts in the semiconductor manufacturing apparatus is three (consumable parts are A, B, and C, respectively), the etching rate uniformity (Y) and the consumable parts A, B, and The relationship with the usage time of C (XA, XB, XC) is as shown in the following equation (1).

Y = δ + αXA + βXB + γXC (1) However, in the above formula (1), δ, α, β, and γ are coefficients, and the use time (XA, XB, XC) of the consumable parts A, B, and C and the etching rate. It is determined from the relationship between the uniformity (Y) and the measured value.

That is, the coefficient in the equation (1) is obtained as follows. Now, in the plural data of the combination of the measured value of the etching rate uniformity (Y) and the usage time (XA, XB, XC) of the consumable parts A, B, and C at the time of the measurement, the etching rate uniformity ( Y) and consumable parts A, B,
By using the multiple regression equation in relation to the usage time of C,
The coefficients δ, α, β and γ in the equation (1) are obtained.

Next, the case of predicting the etching rate uniformity using the equation (1) is as follows.

First, consumable parts at the time of [I] in FIG.
By substituting the usage time of A, B, and C into equation (1),
The predicted value (Y) of etching rate uniformity at the time of [I] is obtained.

Next, in the range from the time point [I] to immediately before [II], the step value of the use time of the consumable parts A, B, C is expressed by the formula (1).
By substituting into, the predicted value of etching rate uniformity can be obtained. At the time of [II], since the consumable part A will be replaced, the use time of the consumable part A is set to 0, and the remaining consumable parts B and C are substituted with the increment value of the use time to A predicted value of etching rate uniformity at the time point is obtained.

Then, in the range from the time point [II] to immediately before [III], the etching rate uniformity is predicted by substituting the increments of the use time of the consumable parts A, B, and C into the equation (1). Value is required.

At the time of [III], consumable parts B and C
Therefore, the use time of the consumable parts B and C is set to 0, and the remaining consumable part A is substituted with the increment value of the use time. Thereby, the predicted value of the etching rate uniformity at the time of [III] can be obtained.

In this way, by substituting the usage time of the consumable component into the equation (1) at any time, as shown in FIG. (Indicated by diamonds) is obtained.

Here, comparing the actually measured value and the predicted value in FIG. 1, the error between the actually measured value and the predicted value is small, and the predicted value is appropriate, and the first embodiment of the present invention is effective. It turns out that By using the first embodiment, it becomes possible to accurately predict the etching rate uniformity that changes between the times when the etching rate uniformity is actually measured.

Therefore, in the conventional technique, in order to obtain the etching rate uniformity, it is necessary to measure the etching rate uniformity after taking the wafer out of the semiconductor manufacturing apparatus, and for that purpose, it takes a lot of time. Although it is necessary and cannot be obtained at any time, according to the first embodiment of the present invention, if the usage time of consumable parts is known, the etching rate uniformity can be obtained at any time. it can.

Further, by comparing the evaluation value and the predicted value of the etching rate uniformity as shown in FIG. 1, it is possible to clearly grasp the replacement time of the consumable part. As a result, it is possible to manufacture only products within the evaluation value of the etching rate uniformity, and it is possible to improve the product yield.

Therefore, in the control unit of the semiconductor manufacturing apparatus,
A display for displaying a predicted value is provided, which is provided with a memory for storing the above-mentioned formula (1), a measuring unit for measuring the usage time of the consumable component, an input unit, and a calculating unit for executing the above-mentioned formula (1). Means or a warning means, and if the control unit (computer) is configured to perform calculations and the like according to a computer program (semiconductor manufacturing apparatus evaluation program) that executes an algorithm for grasping the replacement time, By performing the prediction based on the actual measurement data of the usage time of the consumable component, it is possible to realize the semiconductor manufacturing method capable of accurately evaluating the process performance and the semiconductor device implementing the method.

Further, if a semiconductor is manufactured based on the calculated predicted value of the performance, the yield rate of the manufactured semiconductor can be predicted in advance, and the input quantity of raw materials, the product quantity, etc. can be easily calculated. Becomes

FIG. 2 is an explanatory view of a semiconductor manufacturing method according to the second embodiment of the present invention. Then, FIG. 2 is a graph showing the relationship between the usage time of consumable parts and the etching rate, taking up the etching rate in the process performance of the semiconductor manufacturing apparatus.

For example, assuming that the number of consumable parts is three (consumable parts are A, B, and C, respectively), the etching rate (Z) and the use time of the consumable parts A, B, and C (XA, XB, XC). ) Is expressed by the following equation (2).

Z = d−a XA −bXB−c XC (2) However, the coefficients d, a, b, and c in the equation (2) are consumable parts A,
It can be obtained from the relationship between the usage time (XA, XB, XC) of B and C and the actual measurement value of the etching rate (Z).

That is, the coefficient in the above equation (2) is obtained as follows.

Now, the measured value of the etching rate (Z),
Use time of consumable parts A, B, C at the time of actual measurement (XA, X
B, XC) in a plurality of data, the coefficient d in the equation (2) is calculated by using the multiple regression equation in the relation between the etching rate (Z) and the usage time of the consumable parts A, B, C. a, b, c are required.

Next, the case of predicting the etching rate using the equation (2) is as follows.

First, consumable parts at the time of [I] in FIG.
By substituting the usage time of A, B, and C into equation (2),
The predicted value (Z) of the etching rate at the time of [I] is obtained.

Next, in the range from the time point [I] to immediately before [II], the time value of the consumable parts A, B and C is calculated by the formula (2).
The predicted value of the etching rate can be obtained by substituting into At the time of [II], since the consumable part A will be replaced, the use time of the consumable part A is set to 0, and the remaining consumable parts B and C are substituted with the increment value of the use time.
The predicted value of the etching rate at the time of [II] is obtained.

Subsequently, in the range from time [II] to immediately before [III], the predicted value of the etching rate is obtained by substituting the increments of the use time of the consumable parts A, B, and C into the equation (2). Desired. And, as of [III], it is a consumable part
Since B and C are to be replaced, the usage time of consumable parts B and C is set to 0, and the remaining consumable parts A are substituted with the increment value of the usage time in equation (2), and The predicted value of the etching rate is calculated.

In this way, by substituting the use time of the expendable component into the equation (2) at any time, as shown in FIG.
A comparison result between the measured value (shown by a black square) and the predicted value (shown by a diamond) of the etching rate is obtained.

Here, comparing the actually measured value and the predicted value in FIG. 2, the error between the actually measured value and the predicted value is small, and the predicted value is appropriate, and the second embodiment of the present invention is effective. It turns out that By using the second embodiment, it is possible to accurately predict the etching rate that changes between the times when the etching rate is actually measured.

Therefore, in the prior art, in order to obtain the etching rate, it is necessary to measure the etching rate after taking out the wafer from the semiconductor manufacturing apparatus, which requires a lot of time and is arbitrary. However, according to the second embodiment of the present invention, the etching rate can be obtained at any time if the usage time of the consumable component is known.

Therefore, in the control unit of the semiconductor manufacturing apparatus,
A memory for storing the above equation (2), a measuring means or an input means for measuring the usage time of consumable parts, an arithmetic means for executing the above equation (2), and a display means for displaying a predicted value or If the control unit (computer) is configured to perform calculations and the like in accordance with a computer program (semiconductor manufacturing apparatus evaluation program) that executes an algorithm for grasping the replacement time etc., the performance prediction can be performed. By performing the measurement based on the actual measurement data of the usage time of the consumable component, it is possible to realize the semiconductor manufacturing method capable of accurately evaluating the process performance and the semiconductor device implementing the method.

Next, a third embodiment of the present invention will be described. The third embodiment of the present invention deals with the etching rate uniformity among the process performance of the semiconductor manufacturing apparatus, and the etching rate uniformity is within the evaluation value, and the replacement part cost is the lowest consumable part. This is a method of selecting replacement parts.

FIG. 3 is a flowchart showing an algorithm for an optimum replacement part selection calculation operation program in the semiconductor manufacturing method according to the third embodiment of the present invention.

In FIG. 3, it is assumed that there are three consumable parts A, B, and C. First, the input value used for calculation is 5
One value ((1-1) to (1-5)).

(1-1) Plural data of combinations of measured values of etching rate uniformity (Y) and usage times (XA, XB, XC) of consumable parts A, B, C at the time of actual measurement.

(1-2) Time of use of consumable parts (XA, XB, XC) when component replacement is attempted.

(1-3) Cost of consumable parts.

(1-4) Evaluation value of process performance (uniformity of etching rate in the third embodiment).

(1-5) Cleaning cycle or parts replacement cycle of semiconductor manufacturing equipment.

Next, the contents of the calculation will be described. First, the construction (2-1) of the process performance prediction formula will be described.

Etching rate uniformity (Y) and consumable parts
The relational expression with the use times (XA, XB, XC) of A, B, and C is the above-mentioned expression (1).

The coefficients δ, α, β, γ in the equation (1) are the relation between the usage time (XA, XB, XC) of the consumable parts A, B, C and the measured value of the etching rate uniformity (Y). Required from. The method of obtaining the coefficient in the equation (1) is as follows.

Now, in a plurality of data of the combination of the measured value of the etching rate uniformity (Y) and the use time (XA, XB, XC) of the consumable parts A, B, C at the time of the measurement, the etching rate Uniformity (Y) and consumable parts A, B, C
The coefficient δ, α, β, γ in the equation (1) can be obtained by using the multiple regression equation in relation to the usage time of. This allows
The construction of the process performance prediction formula is completed.

Next, the calculation (2-2) of the predicted value of the process performance of all the combinations of replacement parts will be described. The complete set of replacement parts is as follows. First, in the case of three replacement parts (A, B, C), the first replacement combination is (a) part A, (b) part B, (c) part C, (d) parts A and B, (e) ) Parts A and C, (f) Parts B and C,
Eight combinations of (g) parts A, B and C, and (h) no parts replacement are possible.

The total combination of the replacement parts for the second time can be the same as the first eight combinations for each of the first eight combinations, and a total of 8 × 8 = 64 combinations.

The total combination of replacement parts for the third time is 8 for each of the 64 combinations up to the second time.
There are 8 possible combinations and a total of 8 × 8 × 8 = 512 possible combinations.

Below, there are 512 × 8 = 4096 combinations for the fourth replacement parts, and 4096 × 8 = 32768 combinations for the fifth replacement parts.

The combination of the replacement parts obtained as described above and the cleaning cycle or the parts replacement cycle of the semiconductor manufacturing apparatus (that is, the usage time of the consumable parts).
Therefore, by using the above-described process performance prediction equation (1), it is possible to calculate the predicted values of the process performance before and after component replacement for all combinations of replacement components.

Next, selection (2-3) of combinations within the evaluation value of process performance will be described. Above (2-
By comparing the predicted value of the process performance and the evaluation value of the process performance with respect to all the combinations of the replacement parts obtained in 2), it is possible to select the combination of the replacement parts within the evaluation value of the process performance.

Next, the cost calculation (2-4) of the replacement part combination within the evaluation value of the process performance will be described. The cost of the replacement part combination within the evaluation value of the process performance can be calculated from the combination of the replacement parts within the evaluation value of the process performance and the consumable part cost obtained in the selection (2-3) of the combination.

Finally, selection (2-5) of the combination of replacement parts having the lowest cost will be described. Among the costs of the replacement part combinations within the process performance evaluation value calculated in the cost calculation (2-4), the lowest cost replacement part combination is selected. The replacement part combination of consumable parts selected here is an optimum replacement part combination within the evaluation value of the process performance and having the lowest part cost related to replacement of consumable parts.

Next, the calculation (2-6) of the deviation of the change over time of the device characteristics, which is different from the optimization of replacement parts, will be described. When calculating the process performance prediction formula obtained in the above-mentioned prediction formula construction (2-1), in the plurality of data arranged in the order of elapsed time in the process performance and consumable part usage time, which is the basis of the prediction formula calculation, It is possible to obtain the latest process performance prediction formula calculated using the initial process performance prediction formula calculated using the data and the latest data.

Therefore, using these prediction formulas, it is possible to obtain the predicted value of the process performance of the initial device and the predicted value of the process performance of the device in the latest state in the same semiconductor manufacturing device. By comparing the predicted values with each other, it is possible to obtain the deviation of the change over time in the device characteristics.

Next, the display of the calculation result will be described.
Regarding the display of the calculation result, the following display obtained by the above calculation is possible. That is, (3-1) clarification of replacement parts at the time of replacement, (3-2) clarification of process performance before and after replacement, that is, clarification of temporal change in process performance, and (3-3).
The deviation of the change over time in the device characteristics can be displayed together.

According to the third embodiment of the present invention, the process performance in the semiconductor manufacturing apparatus can be managed within the evaluation value, and the optimum replacement part among the consumable parts can be selected.

Therefore, the product yield can be improved and the cost can be reduced, and the change in the characteristics of the semiconductor manufacturing apparatus can be easily grasped and monitored by obtaining the deviation of the change in the process performance over time.

FIG. 4 shows an example of calculation results in the third embodiment of the present invention. However, in the example shown in FIG. 4, the etching rate uniformity is taken as the process performance, and the number of consumable parts is three, A, B, and C (a, b, c). The result of calculating the case where the replacement part is selected and replaced (consumable parts are shown as A, B, and C) and the actual measurement result when the parts are replaced by experience (consumable parts are shown as a, b, and c) It is a graph which shows a comparison with.

In the example shown in FIG. 4, the initial value of the calculation result is the same as the initial value of the actual measurement value, and the consumable parts A, B,
This is an example of the case where the use time of C is 0 hour each as an initial value.

As can be understood from FIG. 4, when parts are replaced by experience (shown by diamonds), the evaluation value of etching rate uniformity (1.0) is exceeded, but it is predicted by calculation. If the parts are replaced according to the value (shown by the black triangle), the evaluation value will not be exceeded.

Also, regarding the number of replacement parts, for example, in case of h3, two parts b and c are replaced based on the calculation result, and three parts A, B and C are replaced based on experience. ing.

Therefore, the number of replacement parts is smaller and the cost can be expected to be lower than the case based on the experience, which shows the effectiveness of the third embodiment of the present invention. Is.

Next, FIG. 5 shows a display example of the input / output screen of the calculation program (semiconductor manufacturing apparatus evaluation program) used in the third embodiment of the present invention.

In FIG. 5, the input value [I] displayed on the screen is << 1 >> the usage time of the consumable part when seeking the etching rate uniformity, and << 2 >> the measured value of the process performance and the consumable part. And the usage time measurement data of.

[II] condition setting displayed on the screen is
<< 1 >> Price of consumable parts, << 2 >> Evaluation value of process performance, and << 3 >> Name of semiconductor manufacturing apparatus.

Furthermore, the [III] result displayed on the screen is
<< 1 >> Coefficient of process performance prediction formula, << 2 >> Deviation of change over time in device characteristics, << 3 >> Change in process performance over time after parts replacement, and << 4 >> Predicted value of process performance before and after parts replacement The replacement part name.

In the third embodiment of the present invention, a computer attached to or built in the semiconductor manufacturing apparatus or a host computer installed in a factory outside the semiconductor manufacturing apparatus is used to perform etching rate uniformity according to the present invention. Alternatively, it is possible to perform a calculation for selecting the optimum replacement part and display the calculation result on the screen of the display device.

Instead of the calculation result or together with the calculation result as described above, the process performance evaluation value and the calculation result are compared, and if the difference is less than a predetermined value, an alarm can be displayed. .

In this case, the contents displayed on the display screen etc. are
It is possible to display some or all of the items shown in FIG.

As described above, according to the third embodiment of the present invention, it is possible to reduce the product cost by selecting the optimum replacement part when exchanging the consumable part based on the appropriate predicted value of the process performance. It is possible to realize a different semiconductor manufacturing method and a semiconductor device implementing the method.

Further, as in the third embodiment of the present invention,
If the deviation of the characteristics of the semiconductor manufacturing device over time is displayed on the screen, the deviation of the characteristics of the semiconductor manufacturing device over time can be easily grasped and monitored.

[0089]

According to the present invention, it is not necessary to take out a wafer and measure the process performance of a semiconductor manufacturing apparatus, and the process performance can be grasped at an arbitrary time.

Furthermore, it is possible to select an optimal combination of consumable parts and replacement parts in terms of price.

Therefore, by predicting the process performance based on the actual measurement data of the usage time of the consumable parts, it is possible to realize the semiconductor manufacturing method and the semiconductor device which implements the method, in which the accurate evaluation value of the process performance can be obtained. .

Further, based on an appropriate predicted value of the process performance, an optimum replacement part at the time of exchanging consumable parts is selected, and a semiconductor manufacturing method capable of reducing the product cost and a semiconductor device implementing the method are realized. be able to.

As a result, it is possible to strictly adhere to the evaluation value of the process performance and grasp the time of replacement of parts, and it is possible to improve the product yield and reduce the cost.

[Brief description of drawings]

FIG. 1 is an explanatory diagram of a semiconductor manufacturing method according to a first embodiment of the present invention.

FIG. 2 is an explanatory diagram of a semiconductor manufacturing method which is a second embodiment of the present invention.

FIG. 3 is a flowchart showing an algorithm for an optimum replacement part selection calculation operation program in a semiconductor manufacturing method according to a third embodiment of the present invention.

FIG. 4 is a graph showing an example of calculation results in the third embodiment of the present invention.

FIG. 5 is a diagram showing a display example of an input / output screen of a calculation program used in the third embodiment of the present invention.

[Explanation of symbols]

Consumable parts subject to replacement based on A, B, and C calculation results a, b, c Consumable parts to be replaced based on experience results

   ─────────────────────────────────────────────────── ─── Continued front page    (72) Inventor Yutaka Ito             5-20-1 Kamimizuhonmachi, Kodaira-shi, Tokyo Stock             Ceremony Company within Hitachi Semiconductor Group F-term (reference) 5F004 AA01 AA16

Claims (10)

[Claims] 1. A computer comprising a procedure for substituting a usage time of a consumable part in a semiconductor manufacturing apparatus into a predetermined arithmetic expression, a step for executing the arithmetic expression, and a procedure for calculating a predicted value of a process performance of the semiconductor manufacturing apparatus. An evaluation program for semiconductor manufacturing equipment, characterized in that 2. A procedure of substituting a usage time of a consumable part in a semiconductor manufacturing apparatus into a predetermined arithmetic expression, a step of executing the arithmetic expression, a step of calculating a predicted value of a process performance of the semiconductor manufacturing apparatus, and a calculation. An evaluation program for a semiconductor manufacturing apparatus, which causes a computer to execute a procedure of calculating a temporal change in process performance characteristics of the semiconductor manufacturing apparatus from the process performance. 3. A procedure for substituting a usage time of a consumable part in a semiconductor manufacturing apparatus into a predetermined arithmetic expression, a step for executing the above arithmetic expression, a step for calculating a predicted value of process performance of the semiconductor manufacturing apparatus, and a calculation. Based on the part price of the procedure of calculating the consumable parts to be replaced from the process performance, the procedure of calculating the combination of the parts to be replaced when there are multiple consumable parts to be replaced, and the combination of the calculated replacement parts. An evaluation program for a semiconductor manufacturing apparatus, which causes a computer to execute a procedure for selecting an optimum combination of replacement consumable parts. 4. In a semiconductor manufacturing method, a usage time of a consumable part of a manufacturing apparatus component for manufacturing a semiconductor is substituted into a predetermined arithmetic expression, the arithmetic expression is executed, and a predicted value of process performance of the semiconductor manufacturing apparatus is calculated. And manufacturing a semiconductor based on the calculated predicted value. 5. The semiconductor manufacturing method according to claim 4,
A method of manufacturing a semiconductor, comprising: calculating a change with time of a process performance characteristic of a semiconductor manufacturing apparatus from the calculated process performance, and manufacturing a semiconductor based on the calculated predicted value and the change with time of the process performance characteristic. 6. The semiconductor manufacturing method according to claim 5,
Calculate the consumable parts to be replaced from the calculated process performance, and if there are multiple consumable parts to be replaced, calculate the combination of the parts to be replaced, and perform the optimum replacement based on the part price among the calculated replacement part combinations. A semiconductor manufacturing method characterized by selecting a combination of consumable parts. 7. A semiconductor manufacturing apparatus having a plurality of consumable parts for processing an object to manufacture a semiconductor, substituting the operating time of the consumable parts into a predetermined arithmetic expression, and executing the arithmetic expression. A semiconductor manufacturing apparatus, comprising: a predicted value calculating means for calculating a predicted value of the process performance of the semiconductor manufacturing apparatus. 8. The semiconductor manufacturing apparatus according to claim 7,
A semiconductor manufacturing apparatus, wherein the predicted value calculation means calculates a change in process performance characteristics over time from the calculated process performance. 9. The semiconductor manufacturing apparatus according to claim 8,
The predicted value calculating means calculates a replacement plow consumable part from the calculated process performance, calculates a combination of parts to be replaced when there are a plurality of consumable parts to be replaced, and calculates a combination of the calculated replacement parts. A semiconductor manufacturing apparatus characterized by selecting an optimum combination of replacement consumable parts based on a price. 10. The semiconductor manufacturing apparatus according to claim 7, further comprising display means for displaying the predicted value of the process performance calculated by the predicted value calculating means. Semiconductor manufacturing equipment.