JP2003030804A - Thin-film magnetic head and its manufacturing method - Google Patents

Abstract

PROBLEM TO BE SOLVED: To increase a magnetic field in a direction vertical to the surface of a recording medium, which is generated from a magnetic pole part. SOLUTION: A thin-film magnetic head is provided with first and second magnetic layers 8 and 14, a connection 12 for magnetically connecting the magnetic layers 8 and 14 at a position apart from a medium opposite surface ABS, a gap layer 9 placed between the magnetic layers 8 and 14, and a thin-film coil 10 partially placed between the magnetic layers 8 and 14. The surface of the second magnetic layer 14 opposite to the gap layer 9 is flat, and the surface thereof of the gap layer 9 side approaches the first magnetic layer 8 gradually as it is separated more from the medium opposite surface ABS. The second magnetic layer 14 has a first layer 14A exposed to the medium opposite surface ABS and a second layer 14B formed on the first layer 14A without being exposed to the medium opposite surface ABS. The saturated magnetic flux density of the first layer 14A is set larger than that of the second layer 14B.

Description

Detailed Description of the Invention

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a thin film magnetic head having at least an inductive type electromagnetic conversion element for writing and a manufacturing method thereof.

[0002]

2. Description of the Related Art In a recording system of a magnetic recording / reproducing apparatus, the direction of signal magnetization is set to the in-plane direction (longitudinal direction) of a recording medium.
And a perpendicular magnetic recording method in which the direction of signal magnetization is perpendicular to the surface of the recording medium. Perpendicular magnetic recording method is longer than longitudinal magnetic recording method.
It is said that it is possible to realize a high linear recording density without being easily affected by the thermal fluctuation of the recording medium.

A thin film magnetic head for a longitudinal magnetic recording system is
Generally, first and second magnetic fields including magnetic pole portions that are magnetically coupled to each other and a magnetic pole portion that faces the recording medium and that face each other via a gap portion on the medium facing surface side. The structure includes a layer and a thin film coil provided at least partially between the first and second magnetic layers and insulated from the first and second magnetic layers.

On the other hand, the thin film magnetic head for the perpendicular magnetic recording system has a ring head having the same structure as that of the thin film magnetic head for the longitudinal magnetic recording system, and one main magnetic pole is arranged in a direction perpendicular to the surface of the recording medium. There is a single pole head that applies a magnetic field. When a single pole head is used, a two-layer medium having a soft magnetic layer and a magnetic recording layer laminated on a substrate is generally used as the recording medium.

In the single pole head for the perpendicular magnetic recording system,
It is important to increase the magnetic field generated from the main pole in the direction perpendicular to the surface of the recording medium. Therefore, the main magnetic pole is required to satisfy the following conditions. The first condition is that at least a part of the surface of the main pole on the front side in the traveling direction of the recording medium (the air outflow end side of the slider including the single pole head) on the medium facing surface side is the surface of the recording medium. To be vertical. The second condition is that at least a part of the main pole on the medium facing surface side has a small thickness. The third condition is that at least a part of the main pole on the medium facing surface side is made of a high saturation magnetic flux density material. An example of a single pole head that satisfies such conditions is
Nikkei Electronics September 25, 2000 Issue (No.
779), P206 ”(hereinafter simply referred to as“ Nikkei Electronics ”).

[0006]

In the single pole head shown in "Nikkei Electronics", the main pole is composed of a thin and flat single magnetic layer. Therefore, in this single-pole head, there is a problem that the magnetic flux is likely to be saturated in the middle of the magnetic layer forming the main pole, and the magnetic field generated by the main pole on the medium facing surface becomes small.

Further, in the single-pole head shown in "Nikkei Electronics", since the main pole is composed of a flat magnetic layer, the magnetic path length becomes long and the high frequency characteristics deteriorate. .

Further, in the single-pole head, the component of the magnetic field generated from the main pole on the medium facing surface in the direction perpendicular to the surface of the recording medium is the component in the direction horizontal to the surface of the recording medium. In order to make the gap relatively larger than, it is necessary to increase the length of the gap, that is, the distance between the main pole and the auxiliary pole. "Nikkei Electronics"
In the single-pole head shown in Fig. 1, the main pole is composed of a flat magnetic layer. Therefore, if the gap length is increased to increase the magnetic field in the direction perpendicular to the surface of the recording medium, the coil The distance between the magnetic pole and the main pole becomes large. Then, the main magnetic pole cannot efficiently absorb the magnetic field generated from the coil, and as a result, the magnetic field in the direction perpendicular to the surface of the recording medium cannot be increased.

In general, a high saturation magnetic flux density material often has a small specific electric resistance, and a magnetic layer formed of the high saturation magnetic flux density material often has large magnetostriction and internal stress. Therefore, when the main magnetic pole is composed of a single magnetic layer made of a high saturation magnetic flux density material, there are problems that the number of eddy current generation locations in the main magnetic pole increases and the efficiency of magnetic field generation decreases. In addition, the main pole,
In the case of a single magnetic layer made of a high saturation magnetic flux density material, if the volume of the main pole is increased, the magnetostriction and internal stress in the main pole also increase, so the volume of the main pole cannot be increased so much. . Therefore, there is a problem that the magnetic field generated from the coil cannot be efficiently absorbed and the efficiency of magnetic field generation is reduced.

The present invention has been made in view of the above problems, and an object thereof is to increase a magnetic field generated from a magnetic pole portion in a direction perpendicular to a surface of a recording medium. And to provide a manufacturing method thereof.

[0011]

A thin-film magnetic head according to the present invention comprises a medium-opposing surface facing a recording medium, and magnetic poles arranged so as to face each other with a predetermined space before and after in the traveling direction of the recording medium. First and second magnetic layers including portions,
A connecting portion that magnetically connects the first magnetic layer and the second magnetic layer, and a first magnetic layer and a second magnetic layer, which are made of a non-magnetic material, at a position apart from the medium facing surface. A gap layer provided between the first and second magnetic layers and a thin film coil provided at least partially between the first and second magnetic layers and insulated from the first and second magnetic layers; The second magnetic layer includes an end surface exposed on the medium facing surface, a surface on the side of the gap layer, and a surface on the side opposite to the gap layer, and the surface on the side of the gap layer of the second magnetic layer faces the medium. At least a part of the surface of the second magnetic layer on the side opposite to the gap layer is flat on the medium facing surface side, including the portion gradually approaching the first magnetic layer as the distance from the surface increases. The magnetic layer has a first layer and a second layer made of magnetic materials different from each other.
The layer includes an end portion of the end surface exposed to the medium facing surface of the second magnetic layer, which is opposite to the gap layer, and the saturation magnetic flux density of the first layer is larger than that of the second layer. is there.

In the thin film magnetic head of the present invention, the surface of the second magnetic layer on the side of the gap layer includes a portion which gradually approaches the first magnetic layer as the distance from the medium facing surface increases. At least a part of the surface opposite to the gap layer on the medium facing surface side is flat. Therefore, in the present invention,
Since the magnetic pole portion of the second magnetic layer is separated from the first magnetic layer by an appropriate distance, the magnetic field generated by the magnetic pole portion on the medium facing surface has a component perpendicular to the surface of the recording medium. , The component can be made relatively larger than the component in the direction horizontal to the surface of the recording medium. Also,
According to the present invention, the distance between the second magnetic layer and the thin film coil is reduced, which makes it possible to efficiently absorb the magnetic field generated from the thin film coil. Further, in the present invention, the second magnetic layer has a first layer and a second layer made of mutually different magnetic materials, and the first layer is on an end face exposed to the medium facing surface of the second magnetic layer. The saturation magnetic flux density of the first layer is higher than the saturation magnetic flux density of the second layer including the end portion on the side opposite to the gap layer. Therefore, in the present invention, as compared with the case where the second magnetic layer is composed of one layer, the ratio of the component of the magnetic field generated from the magnetic pole portion in the medium facing surface in the direction perpendicular to the surface of the recording medium. Can be increased, and the volume of the second magnetic layer can be increased without increasing the magnetostriction and internal stress of the second magnetic layer.

In the thin film magnetic head of the present invention, the specific electric resistance of the second layer may be larger than the specific electric resistance of the first layer.

In the thin film magnetic head of the present invention,
The surface of the second magnetic layer on the side of the gap layer includes a first surface, a second surface and a third surface arranged in order from the medium facing surface side, and the first surface is a flat surface, and the third surface Is arranged closer to the first magnetic layer than the first surface, a step is formed between the first surface and the third surface, and the second surface is different from the first surface. It may be an inclined surface that is connected to any of the three surfaces at an obtuse angle.

In the thin film magnetic head of the present invention,
The first layer and the second layer may overlap each other in the region away from the medium facing surface. In this case, the first layer and the second layer may overlap so that the first layer is arranged on the gap layer side, or the second layer may overlap so that the second layer is arranged on the gap layer side. .

The thin film magnetic head of the present invention further comprises:
A magnetoresistive effect element as a reproducing element may be provided.

The thin film magnetic head of the present invention may be used in a perpendicular magnetic recording system.

A method of manufacturing a thin film magnetic head of the present invention is a method of manufacturing the thin film magnetic head of the present invention having the above-mentioned structure, which comprises a step of forming a first magnetic layer and a step of forming a first magnetic layer on the first magnetic layer. And a step of forming a second magnetic layer on the connecting portion and the gap layer, and a step of forming the second magnetic layer is the second step. Determining the shape of the underlayer of the second magnetic layer so that the upper surface of the underlayer of the magnetic layer includes a portion that gradually approaches the first magnetic layer as it moves away from the medium facing surface; And a step of forming a second magnetic layer having a first layer and a second layer.

In the method of manufacturing the thin film magnetic head of the present invention,
The surface of the second magnetic layer on the side of the gap layer includes a portion that gradually approaches the first magnetic layer as the distance from the medium facing surface increases,
Of the surface of the second magnetic layer on the side opposite to the gap layer, at least a part on the medium facing surface side is made flat.
Magnetic layer is formed. Therefore, in the present invention, since the magnetic pole portion of the second magnetic layer is separated from the first magnetic layer by an appropriate distance, the magnetic field generated by the magnetic pole portion on the medium facing surface is not affected by the magnetic field of the recording medium. The component in the vertical direction can be made relatively larger than the component in the horizontal direction with respect to the surface of the recording medium. Further, in the present invention, the distance between the second magnetic layer and the thin film coil is reduced, which makes it possible to efficiently absorb the magnetic field generated from the thin film coil. Further, in the present invention, the second magnetic layer has a first layer and a second layer made of mutually different magnetic materials, and the first layer is on an end face exposed to the medium facing surface of the second magnetic layer. The saturation magnetic flux density of the first layer is higher than the saturation magnetic flux density of the second layer including the end portion on the side opposite to the gap layer. Therefore, in the present invention, as compared with the case where the second magnetic layer is composed of one layer, the ratio of the component of the magnetic field generated from the magnetic pole portion in the medium facing surface in the direction perpendicular to the surface of the recording medium. Can be increased,
Further, it becomes possible to suppress the generation of eddy currents in the second magnetic layer, and further increase the volume of the second magnetic layer without increasing the magnetostriction and internal stress of the second magnetic layer. Will be possible.

In the method of manufacturing the thin-film magnetic head of the present invention, the step of determining the shape of the underlayer of the second magnetic layer is performed on the second magnetic layer side in at least a part of the gap layer on the medium facing surface side. The step of flattening the surface, the step of forming a mask on the surface of the gap layer facing the second magnetic layer in a part of the gap layer facing the medium, and the shape of the underlayer of the second magnetic layer are determined. As described above, a step of etching a part of the gap layer and a part of the connection part by dry etching using a mask may be included.

In the method of manufacturing a thin film magnetic head of the present invention, the step of forming the second magnetic layer further includes the step of forming the second magnetic layer.
The step of flattening the surface of the magnetic layer opposite to the gap layer may be included.

In the method of manufacturing a thin film magnetic head of the present invention, the second layer may be formed after forming the first layer. In this case, both the first layer and the second layer may be formed by frame plating. Further, the step of forming the second magnetic layer includes the step of forming a layer to be etched made of the material forming the first layer, the step of forming a second layer on the layer to be etched, and the step of forming the second layer. As a mask, part of the layer to be etched is dry-etched,
And a step of forming the first layer by the remaining layer to be etched.

In the method of manufacturing the thin film magnetic head of the invention, the first layer may be formed after the second layer is formed. In this case, both the first layer and the second layer may be formed by frame plating. Further, the step of forming the second magnetic layer includes the step of forming a layer to be etched made of a material forming the second layer, the step of forming a first layer on the layer to be etched, and the step of forming the first layer. As a mask, part of the layer to be etched is dry-etched,
And a step of forming a second layer by the remaining layer to be etched.

[0024]

BEST MODE FOR CARRYING OUT THE INVENTION Hereinafter, embodiments of the present invention will be described in detail with reference to the drawings. [First Embodiment] FIG. 1 is a sectional view showing the structure of a thin-film magnetic head according to the first embodiment of the present invention. Note that FIG. 1 shows a cross section perpendicular to the medium facing surface and the surface of the substrate. Further, the arrow indicated by the symbol T in FIG. 1 indicates the traveling direction of the recording medium. FIG. 2 is a sectional view showing a section taken along the line AA of FIG. FIG. 3 is a front view showing the medium facing surface of the thin film magnetic head shown in FIG. 4 is shown in FIG.
4 is a plan view showing the shape of a second magnetic layer in the thin film magnetic head shown in FIG.

As shown in FIGS. 1 to 3, the thin film magnetic head according to the present embodiment has an AlTiC (Al ₂ O ₃
A substrate 1 made of a ceramic material such as TiC), an insulating layer 2 made of an insulating material such as alumina (Al ₂ O ₃ ) formed on the substrate 1, and an insulating layer 2 formed on the insulating layer 2. A lower shield layer 3 made of a magnetic material, an MR (magnetoresistive effect) element 5 as a reproducing element formed on the lower shield layer 3 via an insulating layer 4, and an insulation on the MR element 5. And an upper shield layer 6 made of a magnetic material formed through the layer 4. The thicknesses of the lower shield layer 3 and the upper shield layer 6 are, for example, 1 to 2 respectively.
μm.

One end of the MR element 5 is arranged on the ABS (air bearing surface) facing the medium. As the MR element 5, an element using a magneto-sensitive film exhibiting a magnetoresistive effect such as an AMR (anisotropic magnetoresistive effect) element, a GMR (giant magnetoresistive effect) element or a TMR (tunnel magnetoresistive effect) element is used. be able to.

The thin film magnetic head further includes a non-magnetic layer 7 formed on the upper shield layer 6, a first magnetic layer 8 made of a magnetic material and formed on the non-magnetic layer 7, Between the insulating layer 9A formed at the position where the thin film coil 10 should be formed on the first magnetic layer 8, the thin film coil 10 formed on this insulating layer 9A, and at least between the windings of the thin film coil 10. And a filled insulating layer 9B.
A contact hole 9a is formed in the insulating layer 9A at a position away from the medium facing surface ABS.

The thickness of the first magnetic layer 8 is, for example, 1 to 2 μm.
Is. The magnetic material forming the first magnetic layer 8 may be, for example, an iron-nickel alloy, that is, permalloy, or a high saturation magnetic flux density material described later. Also, the first
The magnetic layer 8 may be composed of two or more layers.

The insulating layer 9A is made of a non-conductive and non-magnetic material such as alumina and has a thickness of 0.1 to 1 μm, for example.
m.

The thin-film coil 10 is made of a conductive material such as copper and has a winding thickness of, for example, 0.3 to 2 μm. The number of turns of the thin film coil 10 is arbitrary, and the pitch of the windings is also arbitrary.

The insulating layer 9B is made of a non-conductive and non-magnetic material having fluidity when formed. Specifically, the insulating layer 9B may be formed of, for example, an organic non-conductive non-magnetic material such as a photoresist (photosensitive resin), or a spin-on-glass (SOG) film made of coated glass. You may form.

The thin film magnetic head further includes a connecting portion 12 made of a magnetic material formed on the first magnetic layer 8 at the position where the contact hole 9a is formed, the thin film coil 10, the insulating layer 9A and the insulating layer. And an insulating layer 9C formed so as to cover 9B. The thin-film coil 10 is wound around the connecting portion 12.

The shape of the connecting portion 12 is, for example, 2 to 2 in thickness.
The depth is 4 μm, the depth (length in the direction perpendicular to the medium facing surface ABS) is 2 to 10 μm, and the width is 4 to 20 μm. The magnetic material forming the connecting portion 12 may be, for example, an iron-nickel alloy or a high saturation magnetic flux density material as described later.

The insulating layer 9C is more corrosion resistant than the insulating layer 9B,
It is made of a non-conductive and non-magnetic material having excellent rigidity and insulating properties. As such a material, an inorganic non-conductive non-magnetic material such as alumina or silicon oxide (SiO ₂ ) can be used. The total thickness of the insulating layer 9A and the insulating layer 9C on the medium facing surface ABS is, for example, 2 to 4 μm.
m. The insulating layers 9A, 9B and 9C are the first magnetic layer 8
And a gap layer 9 provided between the second magnetic layer 14 and the second magnetic layer 14 described later.

In the present embodiment, the second coil of the thin film coil 10 is
The surface on the magnetic layer 14 side is disposed closer to the first magnetic layer 8 than the position of the end of the gap layer 9 on the second magnetic layer 14 side in the medium facing surface ABS.

The thin film magnetic head further includes a second magnetic layer 14 made of a magnetic material and formed on the insulating layer 9C and the connecting portion 12. The second magnetic layer 14 is magnetically coupled to the first magnetic layer 8 via the coupling portion 12 at a position apart from the medium facing surface ABS.

The second magnetic layer 14 has a first layer 14A and a second layer 14B made of different magnetic materials. The first layer 14A is exposed at the medium facing surface ABS.
The second layer 14B is not exposed at the medium facing surface ABS, and is not exposed to the first layer.
Magnetically connected to layer 14A. Second magnetic layer 14
The surface on the side opposite to the gap layer 9 is flat. Moreover, in the second magnetic layer 14, a part of the thickness on the ABS side facing the medium is smaller than the thickness of the other part.
Further, in the region away from the medium facing surface ABS, the first
The layer 14A and the second layer 14B are overlapped with each other such that the first layer 14A is arranged on the gap layer 9 side.

The saturation magnetic flux density of the first layer 14A is larger than that of the second layer 14B. As the magnetic material forming the first layer 14A, it is preferable to use a high saturation magnetic flux density material having a saturation magnetic flux density of 1.4 T or more. As the high saturation magnetic flux density material, a material containing iron and nitrogen atoms, a material containing iron, zirconia and oxygen atoms, a material containing iron and nickel elements, and the like can be used. Specifically, as the high saturation magnetic flux density material, for example, NiFe (Ni: 45% by weight, Fe: 55% by weight), FeN or its compound, Co-based amorphous alloy,
At least one of Fe-Co, Fe-M (including O (oxygen atom) as necessary), and Fe-Co-M (including O (oxygen atom) as necessary) Can be used. Here, M is Ni, N, C, B, S
i, Al, Ti, Zr, Hf, Mo, Ta, Nb, Cu
At least 1 selected from (all chemical symbols)
It is a kind.

As a material forming the second layer 14B, for example, an iron-nickel alloy, that is, permalloy is used.

The specific electric resistance of the second layer 14B is the first
It is larger than the specific electric resistance of the layer 14A. For example, the specific electric resistance of the first layer 14A is 20 to 50 μΩ · c.
m, the specific electric resistance of the second layer 14B is 50 to 200 μΩ · c
m.

The upper surface of the underlayer of the second magnetic layer 14, that is, the upper surfaces of the insulating layer 9C and the coupling portion 12 are the medium facing surface AB.
The first magnetic layer 8 is gradually approached as the distance from S increases. More specifically, as shown in FIG.
The upper surface of the underlayer of the second magnetic layer 14 has a first surface e, a second surface f, and a third surface arranged in order from the medium facing surface ABS side.
Surface g is included. The first surface e is a plane parallel to the upper surface of the first magnetic layer 8. The third surface g is a surface that is substantially parallel to the upper surface of the first magnetic layer 8 and is more
Is disposed on the magnetic layer 8 side. Therefore, a step is formed between the first surface e and the third surface g. The second surface f is an inclined surface that is connected to the first surface e and the third surface g at an obtuse angle.

The distance between the first surface e and the first magnetic layer 8 is
It is preferably 2 μm or more, for example, 2 to 4 μm. On the other hand, the length of the first surface e in the direction perpendicular to the medium facing surface ABS is preferably 1 μm or less. The angle θ formed by the second surface f and the third surface g is larger than 90 ° and is 120 to 150 °.
Is preferred. The angle formed by the second surface f and the first surface e is substantially equal to θ. Therefore, this angle is also 90 °
It is larger than the above and is preferably 120 to 150 °. The length of the second surface f is preferably 1 to 3 μm. First
The position of the third surface g in the direction perpendicular to the upper surface of the magnetic layer 8 substantially coincides with the position of the upper surface of the coupling portion 12, and the position of the first surface e and the position of the upper surface of the thin-film coil 10 are the same. It is the position between.

The surface on the side of the gap layer 9 of the second magnetic layer 14 formed on the underlayer as described above has the first stepwise shape with increasing distance from the medium facing surface ABS, similarly to the shape of the upper surface of the underlayer. Approaching the magnetic layer 8. Further, the surface of the second magnetic layer 14 on the side of the gap layer 9 is the first surface on the upper surface of the underlayer.
Surface e, second surface f, and third surface g having the same shape as the first surface, the second surface, and the third surface. The second surface gradually becomes the first surface as it moves away from the medium facing surface ABS.
Approaching the magnetic layer 8.

The first layer 14A of the second magnetic layer 14 is disposed on the above-mentioned underlayer from the medium facing surface ABS to the portion above the coupling portion 12. Second of the second magnetic layer 14
The layer 14B is the medium facing surface A of the upper surface of the first layer 14A.
It is arranged on the part except the part on the BS side. Therefore, in the region apart from the medium facing surface ABS, the first layer 14A and the second layer 14B are the same as the gap layer 9 in the first layer 14A.
Overlap each other so that they are located on the side. Of the flat upper surface of the second magnetic layer 14, a part on the ABS side facing the medium is the upper surface of the first layer 14A, and the other part is the second layer 14B.
Is the upper surface of. In the ABS facing the medium, the first layer 1
Of the 4A and the second layer 14B, only the first layer 14A is exposed. Therefore, the first layer 14A is the gap layer 9 on the end face exposed to the medium facing surface ABS of the second magnetic layer 14.
It includes the opposite end.

First layer 14A exposed on the medium facing surface ABS
The shape of the surface is a trapezoid in which the lower side arranged on the rear side (the air inflow end side of the slider) of the recording medium in the traveling direction T is smaller than the upper side, or the inverted shape having the apex on the rear side of the recording medium in the traveling direction T. It is preferably triangular.

The medium facing surface A of the first layer 14A
A part of the BS side preferably has a constant width equal to the track width. Further, it is preferable that the portion of the first layer 14A that is away from the medium facing surface ABS has a large width so that the magnetic flux can be transmitted to the medium facing surface ABS side without being saturated in the middle. Therefore, the first layer 14A and the second layer 14
The planar shape of the entire second magnetic layer 14 including B is preferably, for example, the shape shown in FIG. In the example shown in FIG. 4, the second magnetic layer 14 includes a first portion 14a, a second portion 14b, and a third portion 14c, which are arranged in order from the medium facing surface ABS side. The first portion 14a is
It has a constant width equal to the track width. The width of the first portion 14a is preferably 0.3 μm or less. Third part 1
4c has a constant width larger than the width of the first portion 14a. The width of the third portion 14c is, for example, 6 μm or more. The width of the second portion 14b is equal to the width of the third portion 14c at the boundary position with the third portion 14c, and equal to the width of the first portion 14a at the boundary position with the first portion 14a. In the area of, the area gradually decreases as it approaches the medium facing surface ABS. The end of the second layer 14B on the medium facing surface ABS side is arranged in the second portion 14b.

The thickness PY1 of the portion of the second magnetic layer 14 located on the third surface g of the upper surface of the underlayer is
It is preferably 1 to 3 μm. Of the first layer 14A, the thickness PT1 of the portion of the upper surface of the underlayer disposed on the first surface e is preferably 0.1 to 0.8 μm. The thickness PT2 of the portion of the first layer 14A disposed on the third surface g is larger than PT1, and PY1
Smaller than. The thickness of the second layer 14B is 0.2 to.
It is preferably 2.5 μm.

The thin-film magnetic head further includes a protective layer 17A made of a non-conductive and non-magnetic material such as alumina and disposed around the second magnetic layer 14. The upper surface of the second magnetic layer 14 is flattened together with the upper surface of the protective layer 17A.

The thin film magnetic head further includes a protective layer 17B made of a non-conductive and non-magnetic material such as alumina and formed on the second magnetic layer 14 and the protective layer 17A.

As described above, the thin film magnetic head according to this embodiment has the medium facing surface AB facing the recording medium.
It is provided with S, a reproducing head and a recording head (induction type electromagnetic conversion element). The reproducing head is arranged such that the MR element 5 as a reproducing element and a lower shield layer 3 for shielding the MR element 5 and an upper portion are arranged so that a part of the medium facing surface ABS side is opposed to the MR element 5. The shield layer 6 is provided.

The recording head includes a first magnetic layer 8 and a second magnetic layer 8 including magnetic pole portions arranged so as to oppose each other at a predetermined distance before and after in the traveling direction T of the recording medium on the medium facing surface ABS side. The magnetic layer 14, the connecting portion 12 that magnetically connects the first magnetic layer 8 and the second magnetic layer 14 at a position away from the medium facing surface ABS, and the connecting portion 12 made of a non-magnetic material The gap layer 9 provided between the layer 8 and the second magnetic layer 14, and at least a part of the gap layer 9 between the first magnetic layer 8 and the second magnetic layer 14, And a thin film coil 10 provided in an insulated state.

The second magnetic layer 14 has an end face exposed to the medium facing surface ABS, a face on the gap layer 9 side, and the gap layer 9
And the opposite surface. The surface of the second magnetic layer 14 on the side of the gap layer 9 includes a portion (a portion corresponding to the second surface f of the underlayer) that gradually approaches the first magnetic layer 8 as the distance from the medium facing surface ABS increases. . Further, at least a part of the surface of the second magnetic layer 14 on the side opposite to the gap layer 9 on the ABS side is flat.

Therefore, according to the present embodiment, the distance between the first magnetic layer 8 and the second magnetic layer 14 in the medium facing surface ABS is increased while the distance from the medium facing surface ABS is increased. The distance between the second magnetic layer 14 and the thin film coil 10 can be reduced. As a result, according to the present embodiment, the magnetic pole portion of the second magnetic layer 14 has the first magnetic pole portion.
Of the magnetic field generated from the magnetic pole portion on the medium facing surface ABS, the component in the direction perpendicular to the surface of the recording medium is horizontal to the surface of the recording medium. The magnetic field generated from the thin-film coil 10 can be efficiently absorbed by the second magnetic layer 14 as compared with the component in the different directions. As a result, according to the present embodiment, it is possible to increase the magnetic field generated from the magnetic pole portion in the direction perpendicular to the surface of the recording medium, and it is possible to improve the overwrite characteristic, for example.

Further, according to the present embodiment, compared to the case where the second magnetic layer 14 is composed of a flat single magnetic layer, a shorter magnetic path is formed from the coupling portion 12 to the medium facing surface ABS. Can be formed. Therefore, according to the present embodiment, the high frequency characteristics can be improved.

Further, in the present embodiment, the second magnetic layer 1
In Fig. 4, the thickness of a part on the ABS side of the medium facing surface is smaller than the thickness of the other part. As a result, according to the present embodiment, in the portion of the second magnetic layer 14 that is away from the medium facing surface ABS, the magnetic field generated from the thin film coil 10 is efficiently absorbed, and as it approaches the medium facing surface ABS. The magnetic flux density can be increased. Also from this point, according to the present embodiment, it is possible to increase the magnetic field generated from the magnetic pole portion in the direction perpendicular to the surface of the recording medium.

Further, in this embodiment, the second magnetic layer 1
The surface on the side opposite to the gap layer 9 in 4 is flattened. Therefore, according to the present embodiment, the second magnetic layer 1
The surface on the side opposite to the gap layer 9 in 4, that is, the surface on the front side (the air outflow end side in the slider) in the traveling direction T of the recording medium can be made perpendicular to the surface of the recording medium. As a result, according to the present embodiment, the component of the magnetic field generated from the magnetic pole portion on the medium facing surface ABS in the direction perpendicular to the surface of the recording medium is detected in the direction horizontal to the surface of the recording medium. It becomes possible to make it relatively larger than the component of. Also from this point, according to the present embodiment, it is possible to increase the magnetic field generated from the magnetic pole portion in the direction perpendicular to the surface of the recording medium.

Further, according to the present embodiment, the end of the second magnetic layer 14 on the side opposite to the gap layer 9 can be made flat in the medium facing surface ABS. This allows
According to the present embodiment, the second surface of the medium facing surface ABS is
The magnetic field generated by the magnetic layer 14 can be made uniform in the direction crossing the tracks. As a result, it is possible to suppress the distortion of the bit pattern shape in the recording medium and improve the linear recording density.

Further, in the present embodiment, the second magnetic layer 1
Reference numeral 4 has a first layer 14A and a second layer 14B made of different magnetic materials. The first layer 14A includes an end portion of the end surface exposed to the medium facing surface ABS of the second magnetic layer 14 opposite to the gap layer 9. Also, the first
The saturation magnetic flux density of the layer 14A is larger than that of the second layer 14B. Therefore, according to the present embodiment, the second
The magnetic flux passing through the second layer 14B can be efficiently focused by the first layer 14A near the medium facing surface ABS, as compared with the case where the magnetic layer 14 of FIG. It is possible to increase the ratio of the component of the generated magnetic field in the direction perpendicular to the surface of the recording medium. As a result, according to the present embodiment, it is possible to further increase the magnetic field generated from the magnetic pole portion in the direction perpendicular to the surface of the recording medium, and it is possible to further improve the overwrite characteristic, for example.

Further, according to the present embodiment, the second layer 14
As the magnetic material forming B, a material having a smaller saturation magnetic flux density than that of the magnetic material forming the first layer 14A is used, so that the specific electric resistance of the second layer 14B can be increased. Therefore, according to the present embodiment, the second magnetic layer 1
Compared to the case where the whole 4 is made of high saturation magnetic flux density material,
Generation of an eddy current in the second magnetic layer 14 when a high-frequency magnetic field is applied to the second magnetic layer 14 can be suppressed. As a result, according to the present embodiment, it is possible to efficiently generate a magnetic field even when the recording signal has a high frequency. Also from this point, according to the present embodiment, it is possible to increase the magnetic field generated from the magnetic pole portion in the direction perpendicular to the surface of the recording medium.

Further, according to the present embodiment, the second layer 14
The magnetostriction and internal stress of B can be reduced. Therefore, according to the present embodiment, as compared with the case where the entire second magnetic layer 14 is made of the high saturation magnetic flux density material, the second magnetic layer 14 can be formed without increasing the magnetostriction and the internal stress. The volume of the magnetic layer 14 can be increased. As a result, according to the present embodiment, the magnetic field generated from the thin film coil 10 can be efficiently absorbed by the second magnetic layer 14. Also from this point, according to the present embodiment, it is possible to increase the magnetic field generated from the magnetic pole portion in the direction perpendicular to the surface of the recording medium.

Further, in the present embodiment, the medium facing surface AB
In a region away from S, the first layer 14A and the second layer 14
B overlap each other. As a result, the first layer 14A and the second layer 14B can be magnetically connected well.

Further, in the present embodiment, the second magnetic layer 1
The surface of the No. 4 on the side of the gap layer 9 includes a first surface, a second surface and a third surface arranged in order from the medium facing surface ABS side, and the first surface is a flat surface and the third surface. Is arranged closer to the first magnetic layer 8 side than the first surface, a step is formed between the first surface and the third surface, and the second surface is separated from the first surface and the third surface. Is a slope that is connected to any of the surfaces at an obtuse angle. If the surface of the second magnetic layer 14 on the side of the gap layer 9 is
If there is an edge having an angle of 90 ° or less, leakage of magnetic flux occurs or eddy current occurs near this edge, and the efficiency of magnetic field generation decreases. On the other hand, according to the present embodiment, the gap layer 9 of the second magnetic layer 14 is
There are no edges on the side face with angles less than 90 °. Therefore, according to the present embodiment, it is possible to prevent the leakage of magnetic flux and the generation of eddy currents and efficiently generate a magnetic field. From this point as well, the surface of the recording medium generated from the magnetic pole portion The magnetic field in the vertical direction can be increased.

Further, in this embodiment, the shape of the surface of the first layer 14A exposed on the medium facing surface ABS is the rear side of the traveling direction T of the recording medium (the air inflow end side of the slider).
It is preferable that the lower side of the recording medium is a trapezoid whose lower side is smaller than the upper side, or an inverted triangle having a vertex on the rear side in the traveling direction T of the recording medium. As a result, when the thin film magnetic head is used in the perpendicular magnetic recording system, it is possible to suppress the change in the recording track width when the skew angle occurs.

The thin film magnetic head according to this embodiment is suitable for use in the perpendicular magnetic recording system. When this thin film magnetic head is used in the perpendicular magnetic recording system, the first portion 14a of the first layer 14A of the second magnetic layer 14 serves as the main magnetic pole, and the magnetic pole portion of the first magnetic layer 8 serves as the auxiliary magnetic pole.
When the thin film magnetic head according to the present embodiment is used in the perpendicular magnetic recording system, either a two-layer medium or a single-layer medium can be used as the recording medium.

Further, in the thin film magnetic head according to the present embodiment, the magnetic field in the direction perpendicular to the surface of the recording medium is larger than the magnetic field in the longitudinal direction, and the magnetic energy generated by the head is efficiently transmitted to the recording medium. be able to. Therefore, according to this thin film magnetic head, the influence of thermal fluctuation of the recording medium is less likely to occur and the linear recording density can be increased.

As shown in FIG. 1, in the thin film magnetic head according to the present embodiment, the first magnetic layer 8 is formed on the rear side in the traveling direction T of the recording medium (on the air inflow end side in the slider including the thin film magnetic head). 2) and the second magnetic layer 14 is preferably arranged on the front side in the traveling direction T of the recording medium (on the air outflow end side in the slider including the thin film magnetic head). But,
When the thin film magnetic head according to the present embodiment is used in the perpendicular magnetic recording system, the first magnetic layer 8 and the second magnetic layer 14 are used.
The arrangement of may be the reverse of the arrangement described above.

Further, as shown in FIG. 1, in the thin film magnetic head according to the present embodiment, the gap layer 9 is made of a material having fluidity when formed, and at least the thin film coil 1 is formed.
A first portion (insulating layer 9B) filled between 0 windings,
A second portion made of a material having higher corrosion resistance, rigidity and insulation than the first portion, covering the thin film coil 10 and the first portion, and in contact with the first magnetic layer 8 and the second magnetic layer 14. (Insulating layers 9A and 9C). The second portion of the gap layer 9 is exposed on the medium facing surface ABS. It is difficult to fill the non-magnetic material with no gap between the windings of the thin film coil 10 by the sputtering method, but it is easy to use a non-magnetic material having fluidity such as an organic material. . However, organic materials have poor reliability in terms of resistance to dry etching, corrosion resistance, heat resistance, rigidity, and the like. In the present embodiment, as described above,
The first portion (insulating layer 9B) filled between the windings of the thin film coil 10 is formed of a material having fluidity at the time of formation, and is made of a material having corrosion resistance, rigidity and insulation superior to that of the first portion. Since the second portion (insulating layers 9A, 9C) that covers the thin-film coil 10 and the first portion and is in contact with the first magnetic layer 8 and the second magnetic layer 14 is formed, The non-magnetic material can be filled without gaps between the windings, and the reliability of the gap layer 9 can be improved.

Further, the thin film magnetic head according to the present embodiment has the MR element 5 as a reproducing element. As a result, the reproduction performance can be improved as compared with the case where reproduction is performed using the induction type electromagnetic conversion element. Also, MR
Since the element 5 is shielded by the shield layers 3 and 6, the resolution during reproduction can be improved.

Next, a method of manufacturing the thin film magnetic head according to the present embodiment will be described with reference to FIGS. 5 through 7, 8 through 10, 11 through 13, 14 through 16, 17 through 19,
20 to 22, 23 to 25, 26 to 29, 30 to 32, 33 to 35,
Each set of FIGS. 36 to 38 and 39 to 41 corresponds to the same process. In addition, FIG.
11, FIG. 14, FIG. 17, FIG. 20, FIG. 23, FIG. 26, FIG. 30, FIG. 33, FIG. 33, FIG. 36 and FIG. 39 show cross sections perpendicular to the medium facing surface and the surface of the substrate. 6, FIG. 9, FIG. 12, FIG. 15, FIG. 18, FIG. 21, FIG. 24, FIG. 27, FIG.
1, FIG. 34, FIG. 37 and FIG. 40 show A- in FIG.
The cross section corresponding to the A line cross section is shown. 7, FIG.
13, FIG. 16, FIG. 19, FIG. 22, FIG. 25, FIG. 28, FIG. 32, FIG. 35, FIG. 38, and FIG. 41 show cross sections corresponding to the medium facing surface. FIG. 29 is a plan view showing a frame for forming the second magnetic layer.

In the method of manufacturing the thin film magnetic head according to this embodiment, first, the insulating layer 2 is formed on the substrate 1. Next, the lower shield layer 3 is formed on the insulating layer 2. Next, an insulating film which will be a part of the insulating layer 4 is formed on the lower shield layer 3, and the MR element 5 and the M film are formed on the insulating film.
A lead (not shown) connected to the R element 5 is formed.
Next, the MR element 5 and the leads are covered with a new insulating film which is another part of the insulating layer 4, and the MR element 5 and the leads are embedded in the insulating layer 4.

Next, the upper shield layer 6 is formed on the insulating layer 4, and the nonmagnetic layer 7 is formed thereon. Next, the first magnetic layer 8 is formed in a predetermined shape on the non-magnetic layer 7. Next, although not shown, the nonmagnetic layer 7 and the first magnetic layer 8 are covered with a nonmagnetic material such as alumina to form the first magnetic layer 8
The non-magnetic material until the first magnetic layer 8 is exposed.
Flatten the upper surface of. 5 to 41, the substrate 1 to the non-magnetic layer 7 are omitted.

Next, as shown in FIGS. 5 to 7, a nonconductive and nonmagnetic material such as alumina is sputtered on the first magnetic layer 8 to form an insulating layer 9A. next,
A contact hole 9a is formed in the insulating layer 9A at a position where the connecting portion 12 is to be formed by using a well-known photolithography technique and dry etching technique. Next, using the well-known photolithography technique and film forming technique (for example, electroplating method), the thin film coil 1 is formed on the insulating layer 9A.
Form 0. Next, a well-known photolithography technique is used to form the insulating layer 9B to be filled at least between the windings of the thin film coil 10.

Next, the first magnetic layer 8 is formed at the position where the contact hole 9a is formed by using the well-known photolithography technique and film forming technique (eg, electroplating method).
The connecting portion 12 is formed on the top of the. The thickness of the connecting portion 12 is, eg, 2-4 μm. Next, the thin film coil 10, the insulating layer 9A, the insulating layer 9B, and the connecting portion 1 are formed by using a sputtering method.
An insulating layer 9C is formed so as to cover 2. The thickness of the insulating layer 9C at this point may be a thickness that can sufficiently cover the connecting portion 12, and is, for example, 6 μm.

Next, as shown in FIGS.
The upper surfaces of the insulating layer 9C and the connecting portion 12 are flattened by using, for example, chemical mechanical polishing. At this point, the first magnetic layer 8
The distance from the upper surface to the upper surfaces of the insulating layer 9C and the connecting portion 12 is, for example, 2 to 4 μm. Also, the medium facing surface AB
The total thickness of the insulating layers 9A and 9C in S is the gap length of the recording head (induction type electromagnetic conversion element).

Next, as shown in FIGS. 11 to 13, the auxiliary layer 4 used to determine the shape of the underlayer of the second magnetic layer 14 is formed on the insulating layer 9C and the coupling portion 12.
1 is formed. The material of the auxiliary layer 41 is preferably copper or an iron-based alloy that can be easily removed, and is particularly preferably the same material as the mask 42 described later. Auxiliary layer 4
The thickness of 1 is preferably 0.1 to 3 μm.

Next, as shown in FIGS. 14 to 16, a mask 42 for dry etching is formed on part of the auxiliary layer 41 on the ABS side. The material of the mask 42 is preferably a material that can be easily removed and has excellent resistance to dry etching performed later. Examples of such materials include copper and iron-based alloys. If a nickel-iron alloy is used as the material of the mask 42, the mask 42 can be easily formed by a frame plating method or the like. Mask 42
The side surface 42a opposite to the medium facing surface ABS is preferably perpendicular to the upper surface of the auxiliary layer 41. Also,
The distance between the side surface 42a and the medium facing surface ABS is 1
It is preferably μm or less.

Next, as shown in FIGS. 17 to 19, a part of the auxiliary layer 41, a part of the insulating layer 9C and a part of the connecting portion 12 are dry-etched by using a mask 42 such as ion milling. The portion is etched to determine the shape of the base of the second magnetic layer 14. That is, by this etching, the upper surface of the underlayer of the second magnetic layer 14 including the first surface e, the second surface f, and the third surface g is formed. The first surface e is formed by the portion of the upper surface of the insulating layer 9C covered with the mask 42.

The upper surface of the underlayer of the second magnetic layer 14 having the above-described shape has, for example, an ion incident angle of 1 with respect to the substrate.
It can be formed by performing ion milling while rotating the substrate at 0 to 80 °. In this case, since a shadow is formed on the periphery of the mask 42 with respect to the ions, the second surface f, which is a slope, is formed around the mask 42, and a substantially flat surface is formed in the portion away from the mask 42. A third surface g of is formed.

In dry etching of the insulating layer 9C and the connecting portion 12, the upper end of the slope serving as the second surface f is the first surface.
The process may be terminated when the edge of the surface e of the above is coincident with the edge of the surface e. Thereby, all the edges formed on the upper surface of the underlayer of the second magnetic layer 14 can be made obtuse edges.

If a mask 42 is formed directly on the insulating layer 9C without the aid of the auxiliary layer 41 and dry etching is performed using this mask 42, the second surface f is formed as described above. It is difficult to match the upper end of the inclined surface with the end of the first surface e, and an edge having an angle of 90 ° or more between the upper surface of the insulating layer 9C and the first surface e around the mask 42. It is easy to

On the other hand, in the present embodiment, the gap layer 9 (insulating layer 9C) and the second magnetic layer 1 of the connecting portion 12 are formed.
The auxiliary layer 41 is formed on the surface on the fourth side, and the second magnetic layer 1 of the gap layer 9 (insulating layer 9C) is interposed via the auxiliary layer 41.
A mask 42 is formed on the surface on the fourth side. Then, using the mask 42, a part of the auxiliary layer 41, a part of the gap layer 9 and a part of the connecting portion 12 are etched to determine the shape of the underlayer of the second magnetic layer 14. Thereby, according to the present embodiment, all the edges formed on the upper surface of the base of the second magnetic layer 14 are easily obtuse edges,
The shape of the base of the second magnetic layer 14 can be determined.

Next, as shown in FIGS. 20 to 22, the connecting portion 1 is formed by using a well-known photolithography technique.
A cover 43 made of resist is formed so as to cover 2.

Next, as shown in FIGS. 23 to 25, the mask 42 and the auxiliary layer 41 are removed by using a known etching technique. For example, when the mask 42 and the auxiliary layer 41 are made of a nickel-iron alloy, the second chloride
These can be easily removed by using an iron aqueous solution. At this time, the insulating layer 9C made of alumina, for example, is not etched, and the connecting portion 12 covered with the resist cover 43 is also not etched.
Next, the cover 43 is removed.

Next, as shown in FIGS. 26 to 29, a well-known photolithography technique is used to form a void portion corresponding to the shape of the second magnetic layer 14 on the insulating layer 9C with a resist. A frame 44 having is formed. As shown in FIG. 29, it is preferable that the void portion of the frame 44 has a shape in which the width of a part on the ABS side is smaller than the width of the other part.

Next, as shown in FIGS. 30 to 32, the second magnetic layer 14 is formed on the insulating layer 9C and the connecting portion 12 by electroplating (frame plating) using the frame 44. The first layer 14A is formed. The thickness of the first layer 14A at this time becomes the thickness PT2 of the first layer 14A in the portion arranged on the third surface g. next,
The second layer 14B is formed on the first layer 14A. This second
The layer 14B is also preferably formed by electroplating using the frame 44 (frame plating).

Next, as shown in FIGS. 33 to 35, the second magnetic layer 14 (first layer 14A and second layer 14).
A protective layer 17A is formed so as to cover B). Protective layer 17
The thickness of A is 1. of the maximum height difference of the unevenness on the laminated surface.
It may be about 1 time.

Next, as shown in FIGS. 36 to 38, by using, for example, chemical mechanical polishing, the protective layer 17A and the first layer 14A and the first layer 14A are exposed until the upper surface of the first layer 14A is exposed at a part on the ABS side of the medium facing surface. The upper surface of the second magnetic layer 14 is polished,
These are flattened. By this polishing, the medium facing surface A
The thickness PT1 of the second magnetic layer 14 (first layer 14A) in BS is determined.

Next, as shown in FIGS. 39 to 41, a protective layer 17B is formed so as to cover the entire laminated surface. Next, wiring, terminals, etc. are formed on the protective layer 17B,
The substrate is cut in units of sliders, the medium facing surface ABS is polished, and the flying rails are manufactured to complete a thin film magnetic head.

According to the method of manufacturing the thin film magnetic head of this embodiment, the following actions and effects can be obtained in addition to the same actions and effects as those of the thin film magnetic head of this embodiment.

According to the method of manufacturing the thin film magnetic head according to the present embodiment, the distance between the first magnetic layer 8 and the second magnetic layer 14 in the medium facing surface ABS is large, and the medium facing surface ABS is large. It is possible to easily manufacture a thin film magnetic head having a structure in which the distance between the second magnetic layer 14 and the thin film coil 10 is small apart from.

Further, in this embodiment, after the upper surfaces of the insulating layer 9C and the connecting portion 12 are flattened, the mask 42 is formed on the insulating layer 9C and the connecting portion 12 with the auxiliary layer 41 interposed therebetween.
To form. Then, using this mask 42, part of the auxiliary layer 41, part of the insulating layer 9C, and part of the connecting portion 12 are etched to determine the shape of the underlayer of the second magnetic layer 14. Thus, the shape of the underlayer of the second magnetic layer 14 is easily changed so that the upper surface of the underlayer of the second magnetic layer 14 gradually approaches the first magnetic layer 8 as the distance from the medium facing surface ABS increases. You can decide. Further, according to the present embodiment, by providing the auxiliary layer 41, the second magnetic layer 14 can be easily formed so that the edges formed on the upper surface of the underlayer of the second magnetic layer 14 are all obtuse angles. The shape of the underlying layer 14 can be determined.

Further, in the present embodiment, after the second magnetic layer 14 is formed on the underlayer of the second magnetic layer 14, the upper surface of the second magnetic layer 14 is flattened. This makes it possible to easily determine the shape of the second magnetic layer 14 in which the thickness of a part of the second magnetic layer 14 on the medium facing surface ABS side is smaller than the thickness of the other part. Further, in the present embodiment, the end of the second magnetic layer 14 on the side opposite to the gap layer 9 is flattened in the medium facing surface ABS. Therefore, according to the present embodiment, the magnetic field generated by the second magnetic layer 14 on the medium facing surface ABS can be made uniform in the direction intersecting the tracks, and as a result, the bit pattern shape in the recording medium can be obtained. Distortion can be suppressed and the linear recording density can be improved.

Further, in this embodiment, after the upper surface of the insulating layer 9C is flattened, the mask 42 is used to form the auxiliary layer 41.
, A part of the gap layer 9 and a part of the coupling portion 12 are etched to determine the shape of the underlayer of the second magnetic layer 14. Therefore, according to the present embodiment, the second magnetic layer 1
It is possible to reduce the length of a part of the portion 4 on the ABS side which has a constant width and a constant thickness in the direction perpendicular to the ABS, while suppressing variations.

Further, according to the present embodiment, the boundary between the first surface and the second surface of the surface of the second magnetic layer 14 on the side of the gap layer 9 is defined by the position of the mask 42. It is possible to reduce the variation in the position of this boundary. From this, according to the present embodiment, the position of the boundary between the first surface and the second surface can be arranged at a position at a distance of 1 μm or less from the medium facing surface, for example. The magnetic field generated from the magnetic pole portion can be increased.

In the above description of the method of manufacturing the thin film magnetic head, both the first layer 14A and the second layer 14B of the second magnetic layer 14 are formed by the frame plating method.
The first layer 14A and the second layer 14B may be formed by other methods. Hereinafter, referring to FIGS. 42 to 50, the first layer 14
An example of another method of forming A and the second layer 14B will be described. 42 to 44, 45 to 47, 48.
50 to 50, each set corresponds to the same process. 42, 45, and 48 show cross sections perpendicular to the medium facing surface and the surface of the substrate. Figure 43,
46 and 49 show a cross section corresponding to the cross section along the line AA in FIG. 1. 44, 47 and 50
Indicates a cross section corresponding to the medium facing surface. 42 to 50, the substrate 1 to the nonmagnetic layer 7 are omitted.

In this method, as shown in FIGS. 42 to 44, a sputtering method is used so as to cover the entire laminated surface shown in FIGS. 23 to 25. The layer to be etched 14Ae is formed.

Next, although not shown, the etching target layer 14 is formed.
A frame having a void corresponding to the shape of the second magnetic layer 14 is formed on Ae.

Next, as shown in FIGS. 45 to 47, the second layer 14B is formed on the layer to be etched 14Ae by electroplating (frame plating) using the frame.

Next, as shown in FIGS. 48 to 50, a part of the etching target layer 14Ae is etched by dry etching such as ion milling using the second layer 14B as a mask, and the remaining etching target layer 14Ae is etched. 14Ae
To form the first layer 14A. The dry etching at this time is performed until the outer shape of the first layer 14A is completely formed. By this dry etching, the shape of the surface of the first layer 14A exposed on the medium facing surface ABS is determined such that the lower side arranged on the rear side (the air inflow end side of the slider) in the traveling direction T of the recording medium is higher than the upper side. Small trapezoids are preferred.

The steps after forming the second magnetic layer 14 as described above are the same as the steps shown in FIGS. 33 to 41.

[Second Embodiment] Next, the second embodiment of the present invention will be described.
A thin film magnetic head and a method for manufacturing the same according to the embodiment will be described. FIG. 51 is a sectional view showing the structure of the thin-film magnetic head according to the second embodiment of the invention. Note that FIG. 51 shows a cross section perpendicular to the medium facing surface and the surface of the substrate. Further, the arrow indicated by the symbol T in FIG. 51 indicates the traveling direction of the recording medium. FIG. 52 is FIG.
It is sectional drawing which shows the BB line | wire cross section. 53 is a front view showing the medium facing surface of the thin film magnetic head shown in FIG. FIG. 54 is a plan view showing the shape of the second magnetic layer in the thin film magnetic head shown in FIG.

In the thin film magnetic head according to this embodiment,
Of the entire second magnetic layer 14, only a part of the second magnetic layer 1 on the ABS side is the first layer 14A.
The remaining part of 4 is the second layer 14B.

As shown in FIG. 54, in the portion where the first layer 14A and the second layer 14B are magnetically connected, the second layer 1
It is preferable that the width of 4B is larger than that of the first layer 14A, and that the second layer 14B sandwiches the first layer 14A from both sides in the width direction. In this case, the second layer 14B is the first layer 14
The end face of A on the side opposite to the medium facing surface ABS, the upper face, and both side faces in the width direction are magnetically connected to the first layer 14A.

In the present embodiment, the first layer 14A and the second layer 14B have, for example, the shapes shown in FIG. That is, in the example shown in FIG. 54, the first layer 14A
Is a first portion 14Aa, a second portion 14Ab, and a third portion 14A that are arranged in order from the medium facing surface ABS side.
c is included. The first portion 14Aa has a constant width equal to the track width. The third portion 14Ac is
It has a constant width larger than the width of the first portion 14Aa. The width of the second portion 14Ab is equal to the width of the third portion 14Ac.
At the boundary position with and, it is equal to the width of the third portion 14Ac, and at the boundary position with the first portion 14Aa, the first portion 14Aa.
The width is equal to the width of the medium, and becomes gradually smaller in the middle portion as it approaches the medium facing surface ABS.

In the example shown in FIG. 54, the second layer 14
B is a first portion 14Ba, a second portion 14Bb, and a third portion 14 which are sequentially arranged from the ABS side.
It contains Bc. The first portion 14Ba is the first layer 14
It has a constant width larger than the width of the third portion 14Ac of A. The third portion 14Bc is the first portion 14Ba.
Has a constant width that is greater than the width. Second part 1
The width of 4Bb is equal to the width of the third portion 14Bc at the boundary position with the third portion 14Bc, equal to the width of the first portion 14Ba at the boundary position with the first portion 14Ba, and in the middle portion, It becomes smaller gradually as it approaches the medium facing surface ABS.

Next, with reference to FIGS. 55 to 76, a method of manufacturing the thin film magnetic head according to the present embodiment will be described. 55 to 58, 59 to 61, 62 to 64, 65 to 67, 68 to 70, 71 to 73, and 74 to 76, the same steps are performed. It corresponds to. Also, FIG.
5, FIG. 59, FIG. 62, FIG. 65, FIG. 68, FIG. 71 and FIG. 74 show cross sections perpendicular to the medium facing surface and the surface of the substrate. 56, FIG. 60, FIG. 63, FIG. 66, FIG. 69, FIG. 72 and FIG. 75 show cross sections corresponding to the cross section along the line BB in FIG. 57, 61, 64, 67, 70, 73, and 76 show cross sections corresponding to the medium facing surface. FIG. 58 is a plan view showing a frame for forming the first layer of the second magnetic layer. 55 to 76, the substrate 1 to the non-magnetic layer 7
Is omitted.

In the method of manufacturing the thin film magnetic head according to this embodiment, as shown in FIGS. 23 to 25, the first embodiment is performed up to the step of determining the shape of the underlayer of the second magnetic layer 14. Is the same as.

In the present embodiment, next, as shown in FIGS. 55 to 58, a well-known photolithography technique is used to form a second magnetic layer 14 on the insulating layer 9C by a resist. A frame 44 having a void corresponding to the shape of the first layer 14A is formed. As shown in FIG. 58,
It is preferable that the void portion of the frame 44 has a shape in which the width of a part on the ABS side of the medium facing surface is smaller than the width of the other part.

Next, as shown in FIGS. 59 to 61, the second magnetic layer 14 is formed on the insulating layer 9C by electroplating (frame plating) using the frame 44.
To form the first layer 14A. The thickness of the first layer 14A at this time is the thickness PY1 of the portion of the second magnetic layer 14 that is disposed on the third surface g of the upper surface of the underlayer (see FIG. 51).
It is preferable that it is smaller than the reference value). As a result, a part of the second layer 14B formed later on the ABS side of the medium facing surface is
It is possible to dispose the first layer 14A so as to overlap a part of the first layer 14A on the side opposite to the medium facing surface ABS.

Next, as shown in FIGS. 62 to 64, a well-known photolithography technique is used to form a second layer on the first layer 14A and the insulating layer 9C by a resist.
A frame 45 having a void corresponding to the shape of the second layer 14B of the magnetic layer 14 is formed.

Next, as shown in FIGS. 65 to 67, a second frame is formed on the first layer 14A, the insulating layer 9C and the connecting portion 12 by electroplating (frame plating) using the frame 45. Form layer 14B. The thickness of the second layer 14B at this time is set to be larger than the thickness PY1 of the portion of the second magnetic layer 14 that is disposed on the third surface g of the upper surface of the underlayer.

Next, as shown in FIGS. 68 to 70, the second magnetic layer 14 (first layer 14A and second layer 14) is formed.
A protective layer 17A is formed so as to cover B). Protective layer 17
The thickness of A is 1. of the maximum height difference of the unevenness on the laminated surface.
It may be about 1 time.

Next, as shown in FIGS. 71 to 73, by using, for example, chemical mechanical polishing, the protective layer 17A and the first layer 14A and the first layer 14A are exposed until the upper surface of the first layer 14A is exposed at a part on the ABS side of the medium facing surface. The upper surface of the second magnetic layer 14 is polished,
These are flattened. By this polishing, the medium facing surface A
The thickness PT1 of the second magnetic layer 14 (first layer 14A) in BS is determined.

Next, as shown in FIGS. 74 to 76, a protective layer 17B is formed so as to cover the entire laminated surface. Next, wiring, terminals, etc. are formed on the protective layer 17B,
The substrate is cut in units of sliders, the medium facing surface ABS is polished, and the flying rails are manufactured to complete a thin film magnetic head.

According to this embodiment, as compared with the first embodiment, the volume of the first layer 14A having a small specific electric resistance is reduced and the volume of the second layer 14B having a large specific electric resistance is increased. Generation of an eddy current in the second magnetic layer 14 when a high frequency magnetic field is applied to the second magnetic layer 14 can be further suppressed. In addition, according to the present embodiment, as compared with the first embodiment, the second magnetoresistive element having a smaller magnetostriction and internal stress is used.
Since the volume of the layer 14B increases, the magnetostriction and internal stress of the second magnetic layer 14 can be further reduced. Further, according to the present embodiment, the magnetic flux passing through the second layer 14B can be efficiently guided to the first layer 14A.

Other configurations, operations and effects in this embodiment are the same as those in the first embodiment.

[Third Embodiment] Next, the third embodiment of the present invention will be described.
A thin film magnetic head and a method for manufacturing the same according to the embodiment will be described. FIG. 77 is a sectional view showing the structure of the thin-film magnetic head according to the third embodiment of the present invention. Note that FIG. 77 shows a cross section perpendicular to the medium facing surface and the surface of the substrate. Also, the arrow indicated by the symbol T in FIG. 77 indicates the traveling direction of the recording medium. FIG. 78 shows FIG.
It is sectional drawing which shows the CC sectional view taken on the line. 79 is a front view showing the medium facing surface of the thin film magnetic head shown in FIG. FIG. 80 is a plan view showing the shape of the second magnetic layer in the thin film magnetic head shown in FIG.

In the thin film magnetic head according to the present embodiment,
The second magnetic layer 14 has a first layer 14D and a second layer 14E made of different magnetic materials. First layer 14
The saturation magnetic flux density of D is larger than that of the second layer 14E. Further, the specific electric resistance of the second layer 14E is larger than the specific electric resistance of the first layer 14D. The magnetic material forming the first layer 14D is similar to the first layer 14A in the first embodiment, and the magnetic material forming the second layer 14E is the second layer 1 in the first embodiment.
The same as 4B.

The overall shape of the second magnetic layer 14 in this embodiment is the same as that in the first embodiment. The first layer 14D and the second layer 14E are overlapped with each other over the entire second magnetic layer 14 so that the second layer 14E is disposed on the gap layer 9 side. The second layer 14E has a substantially constant thickness. The thickness of the second layer 14E is 0.2 to
It is preferably 3 μm.

The thickness of the first layer 14D changes as follows. That is, in the first layer 14D, the thickness of the portion of the upper surface of the underlayer disposed on the first surface e is smaller than the thickness of the portion disposed on the third surface g. The second layer on the upper surface of the base of the first layer 14D
The thickness of the portion arranged on the surface f of the
It gradually becomes smaller as it approaches S. 1st layer 1
The thickness of the portion of the 4D arranged on the first surface e is
It is preferably 0.1 to 0.8 μm. First layer 14
The thickness of the portion of D disposed on the third surface g is
It is preferably 0.2 to 3 μm.

The first layer 14D includes an end portion of the end surface of the second magnetic layer 14 exposed on the medium facing surface ABS opposite to the gap layer 9 (on the air outflow end side of the slider).

In the present embodiment, the vertical relationship between the first layer 14D and the second layer 14E of the second magnetic layer 14 is the same as that of the first layer 14A of the second magnetic layer 14 in the first embodiment. The vertical relationship of the two layers 14B is reversed. However, also in the present embodiment, as in the first embodiment, the first layer 14D having a saturation magnetic flux density larger than that of the second layer 14E.
Includes an end portion of the end surface of the second magnetic layer 14 exposed on the medium facing surface ABS opposite to the gap layer 9. Therefore, according to this embodiment, the same effect as that of the first embodiment is obtained.

A method of manufacturing the thin film magnetic head according to the present embodiment will be described with reference to FIGS. 81 to 92. 81 to 83, 84 to 86, 87 to 89, and 90 to 92 correspond to the same process, respectively. 81 and 8
4, FIG. 87, and FIG. 90 show cross sections perpendicular to the medium facing surface and the surface of the substrate. 82, 85, 88 and 91 show sections corresponding to the section taken along the line CC in FIG. 77. 83, 86, 89 and 9
2 represents a cross section corresponding to the medium facing surface. In addition,
81 to 92, the substrate 1 to the nonmagnetic layer 7 are omitted.

In the method of manufacturing the thin film magnetic head according to the present embodiment, as shown in FIGS. 26 to 29, the second magnetic layer is formed on the base (insulating layer 9C) of the second magnetic layer 14. The process up to the step of forming the frame 44 having the void corresponding to the shape of 14 is the same as that of the first embodiment.

In the present embodiment, next, as shown in FIGS. 81 to 83, the frame 44 is used to form a first layer on the insulating layer 9C and the connecting portion 12 by electroplating (frame plating). The second layer 14E of the second magnetic layer 14 is formed. Next, the first layer 14D is formed on the second layer 14E. This first layer 14D is also preferably formed by an electroplating method (frame plating method) using the frame 44.

Next, as shown in FIGS. 84 to 86, the second magnetic layer 14 (first layer 14D and second layer 14) is formed.
The protective layer 17A is formed so as to cover E). Protective layer 17
The thickness of A is 1. of the maximum height difference of the unevenness on the laminated surface.
It may be about 1 time.

Next, as shown in FIGS. 87 to 89, the upper surfaces of the first layer 14D and the protective layer 17A of the second magnetic layer 14 are polished by, for example, chemical mechanical polishing to flatten them. Turn into. By this polishing, the medium facing surface AB
The thickness of the first layer 14D in S is determined.

Next, as shown in FIGS. 90 to 92, a protective layer 17B is formed so as to cover the entire laminated surface. Next, wiring, terminals, etc. are formed on the protective layer 17B,
The substrate is cut in units of sliders, the medium facing surface ABS is polished, and the flying rails are manufactured to complete a thin film magnetic head.

In the above description of the method of manufacturing the thin film magnetic head, both the second layer 14E and the first layer 14D of the second magnetic layer 14 are formed by the frame plating method.
The second layer 14E and the first layer 14D may be formed by other methods. Hereinafter, referring to FIGS. 93 to 95, the second layer 14
An example of another method of forming E and the first layer 14D will be described. 93 to 95 show the second layer 14E and the first layer 14
11 shows one step in another method of forming D. FIG. 93
Represents a cross section perpendicular to the medium facing surface and the surface of the substrate. FIG. 94 shows a cross section corresponding to the cross section along line CC in FIG. 77. FIG. 95 shows a cross section corresponding to the medium facing surface. The substrate 1 and the nonmagnetic layer 7 are omitted in FIGS. 93 to 95.

In this method, as shown in FIGS. 93 to 95, a sputtering method is used so as to cover the entire laminated surface shown in FIGS. 23 to 25. The layer to be etched 14Ee is formed.
Next, although not shown, on the etching target layer 14Ee,
A frame having a void corresponding to the shape of the second magnetic layer 14 is formed. Next, using this frame, the first layer 14D is formed on the layer to be etched 14Ee by electroplating (frame plating).

Next, using the first layer 14D as a mask, a part of the etching target layer 14Ee is etched by dry etching such as ion milling, and the remaining etching target layer 14Ee forms the second layer 14E. The dry etching at this time is performed until the outer shape of the second layer 14E is completely formed. In this way, the second layer 14E and the first layer 14D having the shapes shown in FIGS. 81 to 83 are formed. The steps after forming the second magnetic layer 14 in this manner are the same as the steps shown in FIGS. 84 to 92.

Other configurations, operations and effects in this embodiment are the same as those in the first embodiment.

The present invention is not limited to the above embodiments, and various modifications can be made. For example, in the present invention,
The second magnetic layer 1 is formed on the flat upper surface of the second magnetic layer 14.
The third layer, which has a smaller saturation magnetic flux density and a larger specific electric resistance than the first layer of No. 4 and is not exposed to the medium facing surface ABS, may be arranged.

Further, in the thin film magnetic head of the present invention, the second magnetic layer is formed first, the gap layer and the coupling portion are formed on the second magnetic layer, and the first magnetic layer is formed on these. You may form and manufacture a layer.

Further, according to the present invention, an inductive type electromagnetic conversion element for writing is formed on the substrate side, and an M type for reading is formed thereon.
It can also be applied to a thin film magnetic head having a structure in which an R element is formed.

The present invention can also be applied to a thin-film magnetic head dedicated to recording provided with only an induction type electromagnetic conversion element, and a thin film magnetic head for recording and reproducing by the induction type electromagnetic conversion element.

[0137]

As described above, the first to eighth aspects are provided.
In the thin-film magnetic head described in any one of 1, the surface of the second magnetic layer on the side of the gap layer includes a portion that gradually approaches the first magnetic layer as the distance from the medium facing surface increases. At least a part of the surface opposite to the gap layer on the medium facing surface side is flat. Therefore, according to the present invention, in the magnetic field generated from the magnetic pole portion on the medium facing surface, the component in the direction perpendicular to the surface of the recording medium is compared with the component in the direction horizontal to the surface of the recording medium. It becomes possible to make relatively large. Further, according to the present invention, the distance between the second magnetic layer and the thin film coil is reduced, which makes it possible to efficiently absorb the magnetic field generated from the thin film coil. Further, in the present invention, the second magnetic layer has a first layer and a second layer made of mutually different magnetic materials, and the first layer is on an end face exposed to the medium facing surface of the second magnetic layer. Including the end opposite to the gap layer,
The saturation magnetic flux density of the first layer is higher than the saturation magnetic flux density of the second layer. Therefore, according to the present invention, as compared with the case where the second magnetic layer is composed of one layer, the component in the direction perpendicular to the surface of the recording medium in the magnetic field generated from the magnetic pole portion in the medium facing surface. The ratio of can be increased and
The volume of the second magnetic layer can be increased without increasing the magnetostriction and internal stress of the second magnetic layer. From the above, according to the present invention, it is possible to increase the magnetic field generated from the magnetic pole portion in the direction perpendicular to the surface of the recording medium. Further, according to the present invention, in the medium facing surface, the end of the second magnetic layer opposite to the gap layer is kept flat, and the magnetic field generated by the second magnetic layer in the medium facing surface is tracked. Can be made uniform in the direction intersecting with. As a result, according to the present invention,
By suppressing the distortion of the bit pattern shape in the recording medium,
The linear recording density can be improved.

Further, according to the thin-film magnetic head of the second aspect, since the specific electric resistance of the second layer is larger than the specific electric resistance of the first layer, the generation of eddy current in the second magnetic layer is suppressed. There is an effect that can be done.

Further, in the thin-film magnetic head according to claim 3, the surface of the second magnetic layer on the side of the gap layer is the first surface, the second surface and the third surface which are sequentially arranged from the medium facing surface side. Including the surface, the first surface is a flat surface, the third surface is located closer to the first magnetic layer than the first surface, and a step is formed between the first surface and the third surface. The second surface is formed with the first surface and the third surface
Is a slope that is connected to any of the surfaces at an obtuse angle. That is, in the thin film magnetic head of the present invention, there is no edge having an angle of 90 ° or less on the surface of the second magnetic layer on the side of the gap layer. Therefore, according to the present invention, the leakage of magnetic flux and the generation of eddy current can be prevented, the magnetic field can be efficiently generated, and the magnetic field generated from the magnetic pole portion in the direction perpendicular to the surface of the recording medium can be further improved. This has the effect of increasing the size.

According to the thin-film magnetic head of any one of claims 4 to 6, the first layer and the second layer of the second magnetic layer overlap each other in the region away from the medium facing surface. Therefore, there is an effect that the first layer and the second layer can be magnetically connected well.

Further, according to the thin film magnetic head of the seventh aspect, since the magnetoresistive effect element as the reproducing element is provided, the reproducing performance is improved as compared with the case of reproducing by using the induction type electromagnetic conversion element. There is an effect that can be made.

According to the thin-film magnetic head of the eighth aspect, since the thin-film magnetic head is used in the perpendicular magnetic recording system, it is less susceptible to the thermal fluctuation of the recording medium and the linear recording density is reduced. The effect of being able to raise.

In the method of manufacturing a thin-film magnetic head according to any one of claims 9 to 17, the surface of the second magnetic layer on the side of the gap layer gradually becomes the first surface as the distance from the medium facing surface increases.
The second magnetic layer is formed such that at least a part of the surface of the second magnetic layer on the side opposite to the gap layer, including the portion close to the magnetic layer, is flat. It
Therefore, according to the present invention, in the magnetic field generated from the magnetic pole portion on the medium facing surface, the component in the direction perpendicular to the surface of the recording medium is compared with the component in the direction horizontal to the surface of the recording medium. It becomes possible to make relatively large. Further, according to the present invention, the distance between the second magnetic layer and the thin film coil is reduced, which makes it possible to efficiently absorb the magnetic field generated from the thin film coil. Further, in the present invention, the second magnetic layer has a first layer and a second layer made of mutually different magnetic materials, and the first layer is on an end face exposed to the medium facing surface of the second magnetic layer. The saturation magnetic flux density of the first layer includes the end opposite to the gap layer,
Greater than the saturation magnetic flux density of the layer. Therefore, according to the present invention, as compared with the case where the second magnetic layer is composed of one layer, the component in the direction perpendicular to the surface of the recording medium in the magnetic field generated from the magnetic pole portion in the medium facing surface. Can be increased, and the volume of the second magnetic layer can be increased without increasing the magnetostriction and internal stress of the second magnetic layer. From the above, according to the present invention, it is possible to increase the magnetic field generated from the magnetic pole portion in the direction perpendicular to the surface of the recording medium. Further, according to the present invention, in the medium facing surface, the end of the second magnetic layer opposite to the gap layer is kept flat, and the magnetic field generated by the second magnetic layer in the medium facing surface is tracked. Can be made uniform in the direction intersecting with.
As a result, according to the present invention, it is possible to suppress the distortion of the bit pattern shape in the recording medium and improve the linear recording density.

[Brief description of drawings]

FIG. 1 is a sectional view showing a configuration of a thin film magnetic head according to a first embodiment of the invention.

FIG. 2 is a cross-sectional view showing a cross section taken along the line AA of FIG.

FIG. 3 is a front view showing the medium facing surface of the thin film magnetic head shown in FIG.

4 is a plan view showing the shape of a second magnetic layer in the thin film magnetic head shown in FIG.

FIG. 5 is a cross-sectional view showing a step in the method of manufacturing the thin-film magnetic head according to the first embodiment of the invention.

6 is a sectional view showing a section corresponding to the section taken along the line AA of FIG. 1 in the state shown in FIG.

7 is a sectional view showing a section corresponding to the medium facing surface in the state shown in FIG.

FIG. 8 is a cross-sectional view showing a step that follows FIG.

9 is a cross-sectional view showing a cross section corresponding to the cross section along the line AA of FIG. 1 in the state shown in FIG.

10 is a sectional view showing a section corresponding to the medium facing surface in the state shown in FIG.

FIG. 11 is a cross-sectional view showing a step that follows FIG.

12 is a cross-sectional view showing a cross section corresponding to the cross section along the line AA of FIG. 1 in the state shown in FIG.

13 is a cross-sectional view showing a cross section corresponding to the medium facing surface in the state shown in FIG.

FIG. 14 is a cross-sectional view showing a step that follows FIG. 11.

15 is a cross-sectional view illustrating a cross section corresponding to the cross section along the line AA of FIG. 1 in the state illustrated in FIG.

16 is a sectional view showing a section corresponding to the medium facing surface in the state shown in FIG.

FIG. 17 is a cross-sectional view showing a step that follows FIG.

18 is a cross-sectional view showing a cross section corresponding to the cross section along line AA of FIG. 1 in the state shown in FIG. 17.

19 is a sectional view showing a section corresponding to the medium facing surface in the state shown in FIG.

20 is a cross-sectional view showing a step that follows FIG.

21 is a cross-sectional view illustrating a cross section corresponding to the cross section along the line AA of FIG. 1 in the state illustrated in FIG. 20.

22 is a sectional view showing a section corresponding to the medium facing surface in the state shown in FIG. 20.

23 is a cross-sectional view showing a step that follows FIG. 20. FIG.

24 is a cross-sectional view illustrating a cross section corresponding to the cross section along the line AA of FIG. 1 in the state illustrated in FIG. 23.

FIG. 25 is a sectional view showing a section corresponding to the medium facing surface in the state shown in FIG. 23.

FIG. 26 is a cross-sectional view showing a step that follows FIG.

27 is a sectional view showing a section corresponding to the section taken along the line AA of FIG. 1 in the state shown in FIG. 26.

28 is a sectional view showing a section corresponding to the medium facing surface in the state shown in FIG. 26.

29 is a plan view showing the frame in the state shown in FIG. 26. FIG.

FIG. 30 is a cross-sectional view showing a step that follows FIG.

31 is a sectional view showing a section corresponding to the section taken along the line AA of FIG. 1 in the state shown in FIG. 30.

32 is a cross-sectional view illustrating a cross section corresponding to the medium facing surface in the state illustrated in FIG. 30.

33 is a cross-sectional view showing a step that follows FIG. 30. FIG.

34 is a cross-sectional view illustrating a cross section corresponding to the cross section along the line AA of FIG. 1 in the state illustrated in FIG. 33.

FIG. 35 is a sectional view showing a section corresponding to the medium facing surface in the state shown in FIG. 33.

36 is a cross-sectional view showing a step that follows FIG. 33. FIG.

37 is a cross-sectional view illustrating a cross section corresponding to the cross section along the line AA of FIG. 1 in the state illustrated in FIG. 36.

38 is a sectional view showing a section corresponding to the medium facing surface in the state shown in FIG. 36.

FIG. 39 is a cross-sectional view showing a step that follows FIG. 36.

40 is a cross-sectional view illustrating a cross section corresponding to the cross section along the line AA of FIG. 1 in the state illustrated in FIG. 39.

41 is a sectional view showing a section corresponding to the medium facing surface in the state shown in FIG. 39. FIG.

FIG. 42 is a cross-sectional view for illustrating another method for forming the second magnetic layer in the first embodiment of the invention.

43 is a cross-sectional view illustrating a cross section corresponding to the cross section along the line AA of FIG. 1 in the state illustrated in FIG. 42.

44 is a sectional view showing a section corresponding to the medium facing surface in the state shown in FIG. 42.

45 is a cross-sectional view showing a step that follows FIG. 42. FIG.

46 is a cross-sectional view illustrating a cross section corresponding to the cross section along the line AA of FIG. 1 in the state illustrated in FIG. 45.

47 is a sectional view showing a section corresponding to the medium facing surface in the state shown in FIG. 45.

48 is a cross-sectional view showing a step that follows FIG. 45. FIG.

49 is a sectional view showing a section corresponding to the section taken along the line AA of FIG. 1 in the state shown in FIG. 48.

50 is a sectional view showing a section corresponding to the medium facing surface in the state shown in FIG. 48.

FIG. 51 is a cross-sectional view showing the structure of the thin film magnetic head according to the second embodiment of the invention.

52 is a cross-sectional view showing a cross section taken along the line BB of FIG. 51.

53 is a front view showing the medium facing surface of the thin film magnetic head shown in FIG. 51. FIG.

54 is a second view of the thin-film magnetic head shown in FIG.
FIG. 3 is a plan view showing the shape of the magnetic layer of FIG.

FIG. 55 is a cross-sectional view showing a step in the method of manufacturing the thin-film magnetic head according to the second embodiment of the invention.

56 is a cross section taken along the line BB of FIG. 51 in the state shown in FIG. 55.
It is sectional drawing showing the cross section corresponding to a line cross section.

57 is a sectional view showing a section corresponding to the medium facing surface in the state shown in FIG. 55. FIG.

58 is a plan view showing the frame in the state shown in FIG. 55. FIG.

FIG. 59 is a cross-sectional view showing a step that follows FIG. 55.

60 is a cross section taken along the line BB of FIG. 51 in the state shown in FIG. 59.
It is sectional drawing showing the cross section corresponding to a line cross section.

61 is a sectional view showing a section corresponding to the medium facing surface in the state shown in FIG. 59. FIG.

62 is a cross-sectional view showing a step that follows FIG. 59. FIG.

63 is a cross section taken along the line BB of FIG. 51 in the state shown in FIG. 62;
It is sectional drawing showing the cross section corresponding to a line cross section.

64 is a cross-sectional view illustrating a cross section corresponding to the medium facing surface in the state illustrated in FIG. 62.

FIG. 65 is a cross-sectional view showing a step that follows FIG. 62.

66 is a BB of FIG. 51 in the state shown in FIG. 65.
It is sectional drawing showing the cross section corresponding to a line cross section.

67 is a sectional view showing a section corresponding to the medium facing surface in the state shown in FIG. 65.

68 is a cross-sectional view showing a step that follows FIG. 65. FIG.

69 is a cross section taken along the line BB of FIG. 51 in the state shown in FIG. 68.
It is sectional drawing showing the cross section corresponding to a line cross section.

70 is a sectional view showing a section corresponding to the medium facing surface in the state shown in FIG. 68. FIG.

71 is a cross-sectional view showing a step that follows FIG. 68. FIG.

72 is a BB of FIG. 51 in the state shown in FIG. 71.
It is sectional drawing showing the cross section corresponding to a line cross section.

73 is a sectional view showing a section corresponding to the medium facing surface in the state shown in FIG. 71. FIG.

74 is a cross-sectional view showing a step that follows FIG. 71. FIG.

75 is a BB of FIG. 51 in the state shown in FIG. 74.
It is sectional drawing showing the cross section corresponding to a line cross section.

76 is a sectional view showing a section corresponding to the medium facing surface in the state shown in FIG. 74. FIG.

FIG. 77 is a cross-sectional view showing the structure of the thin-film magnetic head according to the third embodiment of the invention.

78 is a sectional view showing a section taken along line CC of FIG. 77.

79 is a front view showing the medium facing surface of the thin film magnetic head shown in FIG. 77. FIG.

80 is a second view of the thin-film magnetic head shown in FIG. 77.
FIG. 3 is a plan view showing the shape of the magnetic layer of FIG.

FIG. 81 is a cross-sectional view showing a step in the method of manufacturing the thin-film magnetic head according to the third embodiment of the invention.

82 is a view of CC in FIG. 77 in the state shown in FIG. 81;
It is sectional drawing showing the cross section corresponding to a line cross section.

83 is a sectional view showing a section corresponding to the medium facing surface in the state shown in FIG. 81. FIG.

84 is a cross-sectional view showing a step that follows FIG. 81. FIG.

85 is a view of CC in FIG. 77 in the state shown in FIG. 84;
It is sectional drawing showing the cross section corresponding to a line cross section.

86 is a sectional view showing a section corresponding to the medium facing surface in the state shown in FIG. 84. FIG.

87 is a cross-sectional view showing a step that follows FIG. 84. FIG.

88 is a view of CC in FIG. 77 in the state shown in FIG. 87;
It is sectional drawing showing the cross section corresponding to a line cross section.

89 is a sectional view showing a section corresponding to the medium facing surface in the state shown in FIG. 87. FIG.

90 is a cross-sectional view showing a step that follows FIG. 87. FIG.

91 is a sectional view taken along line CC of FIG. 77 in the state shown in FIG. 90.
It is sectional drawing showing the cross section corresponding to a line cross section.

92 is a sectional view showing a section corresponding to the medium facing surface in the state shown in FIG. 90. FIG.

FIG. 93 is a cross sectional view for illustrating another method for forming the second magnetic layer in the third embodiment of the invention.

94 is a view of CC of FIG. 77 in the state shown in FIG. 93;
It is sectional drawing showing the cross section corresponding to a line cross section.

95 is a sectional view showing a section corresponding to the medium facing surface in the state shown in FIG. 93. FIG.

[Explanation of symbols]

3 ... Lower shield layer, 4 ... Insulating layer, 5 ... MR element, 6 ...
Upper shield layer, 7 ... Non-magnetic layer, 8 ... First magnetic layer, 9
... Gap layer, 9A, 9B, 9C ... Insulating layer, 10 ... Thin film coil, 12 ... Coupling part, 14 ... Second magnetic layer, 14A ...
First layer, 14B ... Second layer, 17A, 17B ... Protective layer, 4
1 ... Auxiliary layer.

Claims (17)

[Claims] 1. A medium facing surface facing a recording medium, and first and second magnetic layers including magnetic pole portions arranged so as to face each other with a predetermined gap before and after in the traveling direction of the recording medium. A connecting portion that magnetically connects the first magnetic layer and the second magnetic layer at a position apart from the medium facing surface; and a connecting portion made of a non-magnetic material. A gap layer provided between the magnetic layer and at least a part of the gap between the first and second magnetic layers,
A thin-film magnetic head comprising: a thin-film coil provided in a state of being insulated from the first and second magnetic layers, wherein the second magnetic layer has an end face exposed to the medium facing surface; A surface on the side of the gap layer and a surface on the side opposite to the gap layer are included, and the surface on the side of the gap layer of the second magnetic layer gradually approaches the first magnetic layer as the distance from the medium facing surface increases. Of the surface of the second magnetic layer opposite to the gap layer, at least a part of the surface facing the medium is flat, and the second magnetic layer is made of a different magnetic material. A first layer and a second layer, wherein the first layer includes an end portion of the end surface exposed to the medium facing surface of the second magnetic layer, the end portion being opposite to the gap layer. The saturation magnetic flux density of is larger than the saturation magnetic flux density of the second layer. Thin-film magnetic head that. 2. The thin-film magnetic head according to claim 1, wherein the specific electric resistance of the second layer is larger than the specific electric resistance of the first layer. 3. A surface of the second magnetic layer on the side of the gap layer is a first surface and a second surface arranged in order from the medium facing surface side.
And a third surface, the first surface is a flat surface, the third surface is arranged closer to the first magnetic layer than the first surface, and the first surface and the third surface are 3. A step is formed between the first and second surfaces, and the second surface is an inclined surface connected to the first surface and the third surface at an obtuse angle. The thin-film magnetic head described. 4. The thin-film magnetic head according to claim 1, wherein the first layer and the second layer overlap each other in a region away from the medium facing surface. 5. The thin film magnetic head according to claim 4, wherein the first layer and the second layer are overlapped with each other so that the first layer is disposed on the gap layer side. 6. The thin-film magnetic head according to claim 4, wherein the first layer and the second layer are overlapped with each other such that the second layer is arranged on the side of the gap layer. 7. The thin-film magnetic head according to claim 1, further comprising a magnetoresistive effect element as a reproducing element. 8. The thin film magnetic head according to claim 1, which is used in a perpendicular magnetic recording system. 9. A medium facing surface facing a recording medium, and first and second magnetic layers including magnetic pole portions arranged so as to face each other with a predetermined gap before and after in the traveling direction of the recording medium. A coupling portion magnetically coupling the first magnetic layer and the second magnetic layer at a position apart from the medium facing surface, and a non-magnetic material, and the first magnetic layer and the second magnetic layer.
And a gap layer provided between the first magnetic layer and the second magnetic layer, and at least a part of the gap layer is insulated from the first magnetic layer and the second magnetic layer. The second magnetic layer includes an end face exposed to the medium facing surface, a gap layer side face, and a face opposite to the gap layer. The surface on the side of the gap layer includes a portion gradually approaching the first magnetic layer as the surface is away from the medium facing surface, and at least the medium of the surface of the second magnetic layer on the side opposite to the gap layer. A part of the facing surface side is flat, the second magnetic layer has a first layer and a second layer made of mutually different magnetic materials, and the first layer is a medium of the second magnetic layer. The end surface of the first layer, which includes the end portion on the opposite side of the gap layer of the end surface exposed on the opposite surface, A method of manufacturing a thin-film magnetic head, wherein a magnetic flux density is higher than a saturation magnetic flux density of the second layer, the method comprising: forming the first magnetic layer; and forming a connecting portion on the first magnetic layer. A step of forming a gap layer and a thin film coil, and a step of forming the second magnetic layer on the connecting portion and the gap layer, wherein the step of forming the second magnetic layer includes the step of forming the second magnetic layer. Of the second magnetic layer such that the upper surface of the underlayer of the magnetic layer includes a portion that gradually approaches the first magnetic layer as the distance from the medium facing surface increases.
Thin film magnetic layer, the method further comprising: determining the shape of the underlayer of the magnetic layer, and forming the second magnetic layer having the first layer and the second layer on the underlayer. Head manufacturing method. 10. The step of determining the shape of the underlayer of the second magnetic layer includes a step of flattening at least a part of the gap layer on the medium facing surface side on the second magnetic layer side. A step of forming a mask on a surface of the gap layer facing the second magnetic layer in a part of the gap layer facing the medium, and a shape of an underlayer of the second magnetic layer are determined. By dry etching using the mask,
10. The method of manufacturing a thin-film magnetic head according to claim 9, further comprising the step of etching a part of the gap layer and a part of the connecting portion. 11. The step of forming the second magnetic layer comprises:
11. The method of manufacturing a thin film magnetic head according to claim 9, further comprising the step of flattening a surface of the second magnetic layer opposite to the gap layer. 12. The method of manufacturing a thin-film magnetic head according to claim 9, wherein the second layer is formed after the first layer is formed. 13. The first layer and the second layer are both formed by a frame plating method.
A method for manufacturing the thin film magnetic head described. 14. The step of forming the second magnetic layer comprises:
A step of forming an etching target layer made of a material forming the first layer, a step of forming the second layer on the etching target layer, and the etching target layer by dry etching using the second layer as a mask 13. A method of manufacturing a thin-film magnetic head according to claim 12, further comprising the step of etching a part of the layer to form a first layer by the remaining layer to be etched. 15. The method of manufacturing a thin-film magnetic head according to claim 9, wherein the first layer is formed after forming the second layer. 16. The first layer and the second layer are both formed by a frame plating method.
A method for manufacturing the thin film magnetic head described. 17. The step of forming the second magnetic layer comprises:
Forming a layer to be etched made of a material forming the second layer; forming the first layer on the layer to be etched; and the layer to be etched by dry etching using the first layer as a mask. 16. A method of manufacturing a thin-film magnetic head according to claim 15, further comprising the step of etching a part of the layer to form a second layer with the remaining layer to be etched.