JP2003025373A - Semiconductor functional part, method for manufacturing the same, and ink jet recording head - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide a semiconductor functional part comprising a semiconductor material and a resin and capable of being manufactured at a low cost by a simple process reduced in the number of parts, not generating a liquid leak or the like even in a case constituting a part or the whole of a liquid flow channel or a liquid storage part and having high quality safety, and to provide a method for manufacturing the same. SOLUTION: The semiconductor functional part has a structure having a plurality of openings, a film material having electric wiring formed to one surface thereof, and a semiconductor member arranged on the surface of the film material and electrically connected to the electric wiring, and at least one kind of a resin body covering the peripheral surface of the structure excepting a part thereof and integrated with the surface having the electric wiring formed thereto of the film material in a fluid-tight state. The method for manufacturing the semiconductor functional part is also disclosed.

Description

Detailed Description of the Invention

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a semiconductor functional component which is a composite of a semiconductor member and a resin body, a method for manufacturing the same, and an ink jet recording head.

[0002]

2. Description of the Related Art For example, an ink jet recording head is used as a semiconductor functional component by incorporating a structure containing a semiconductor member into a resin. A conventional inkjet recording head has a plurality of nozzles (openings) for ejecting ink.
And a structure having an ink supply port and the like are attached to a member for holding the structure by using an adhesive or the like, and various members are added each time to obtain its function. There is. Therefore, the number of parts and the number of manufacturing steps are large, and the work is complicated because it is necessary to avoid openings such as nozzles and ink supply ports, resulting in an increase in manufacturing cost and quality troubles. Various proposals have been made to solve these problems. For example, in the ink jet recording head described in Japanese Patent Laid-Open No. 6-8446, nozzles are formed on a tape having electric wiring, and a chip (semiconductor member) attached to the nozzle is attached to a head housing. However, an adhesive is used to attach the chip, and the tape portion is also attached to the bent housing in a separate process. Furthermore, strict alignment is required for the attachment, and the number of parts and the manufacturing process are not sufficiently reduced, causing quality problems.

[0003]

The present invention has been made in view of the above problems, and is a semiconductor functional component made of a semiconductor material and a resin, which can be manufactured at low cost by a simple process with a small number of components, An object is to provide an inkjet recording head. Further, the present invention provides a semiconductor functional component made of a semiconductor material and a resin, which has high quality and safety such that liquid leakage does not occur even when configuring a part or all of a liquid flow path or a liquid storage unit, and an inkjet. An object is to provide a recording head. Further, it is an object of the present invention to provide a method of manufacturing a semiconductor functional component which can be manufactured at a low cost by a simple process with a small number of components, which is made of a semiconductor material and a resin.

[0004]

In order to solve the above-mentioned problems, a semiconductor functional component according to a first aspect of the present invention has a plurality of openings, a film body having electric wiring formed on at least one surface thereof, and a film body of the film body. A structure provided with a semiconductor member disposed on the surface and electrically connected to the electric wiring, and covering a part of the peripheral surface of the structure except the electric wiring of the film body was formed. At least one kind of resin body fluid-tightly integrated with the surface.

A semiconductor functional component according to a first aspect includes a structure including a semiconductor member made of a semiconductor functional material and a resin body made of a resin. The structure and the resin body are fluid-tightly integrated by insert molding or the like. Therefore, it is sufficient to prepare the structural body and the resin forming the resin body at the time of manufacturing, and it is possible to prevent an increase in manufacturing cost and a complicated process due to an increase in the number of parts. Also, because it is fluid-tightly integrated, for example,
Even when a structure for storing and / or supplying a liquid such as an ink jet recording head is formed inside, troubles such as liquid leakage and generation of bubbles can be reduced, and high quality stability can be maintained. Here, “fluid” includes liquid and gas, and “fluid-tight” means that fluid including gas and liquid does not pass through. The same applies hereinafter in this specification.

In order to solve the above-mentioned problems, a semiconductor functional component according to a second aspect of the present invention is provided with a plurality of openings, a film body having electric wiring formed on at least one surface thereof, and a film body disposed on the surface of the film body. A structure provided with a semiconductor member that is electrically connected to the electric wiring, and a structure that covers a part of the peripheral surface of the structure except for a part thereof, and is in contact with a surface of the film body on which the electric wiring is formed. It is characterized in that it has a kind of resin body, and the structure body and the resin body are integrated without including an adhesive at the interface where the structure body and the resin body come into contact with each other.

A semiconductor functional component according to a second aspect includes a structure body including a semiconductor member made of a semiconductor functional material and a resin body made of a resin. The structure and the resin body are integrated by, for example, insert molding without using an adhesive. Therefore, at the time of manufacturing, it suffices to prepare the structural body and the resin constituting the resin body,
It is possible to prevent an increase in manufacturing cost and a complicated process due to an increase in the number of parts. Further, since there is no adhesive at the interface where the structure body and the resin body are in contact with each other, for example, even when the structure has a structure for storing or supplying a liquid inside, such as an ink jet recording head, liquid leakage or the like may occur. It is possible to reduce troubles and maintain high quality stability.

A semiconductor functional component according to a third aspect is the semiconductor functional component according to the first or second aspect, wherein the plurality of openings are formed in the film body. Claim 3
According to the semiconductor functional component described in (1), since the film body having the plurality of openings formed in advance is used, it is not necessary to form the openings later, and the manufacturing process can be simplified. For example, when applied to an inkjet recording head, it can be easily manufactured by using a film body having a plurality of nozzle portions (openings) formed in advance.

A semiconductor functional component according to a fourth aspect is the semiconductor functional component according to the first or second aspect, which has a plate member between the film body and the semiconductor member, and has a single member on the film body. One opening is provided, and the plurality of openings are formed in the plate member. According to the semiconductor functional component of claim 4, by using the plate member having a plurality of openings formed in advance, it is not necessary to form the openings later,
The manufacturing process can be simplified. For example, when applied to an inkjet recording head, by using a plate member in which a plurality of nozzles (openings) are formed in advance and a film body having a single opening of a size exposing the plurality of nozzles to the outside, It can be easily manufactured.

A semiconductor functional component according to a fifth aspect is the semiconductor functional component according to any one of the first to fourth aspects, wherein the film body is arranged along the surface of the resin body. And According to the semiconductor functional component of the fifth aspect, since the flexible film body is arranged along the surface of the resin body, the mechanical strength is increased.

A semiconductor functional component according to a sixth aspect is the semiconductor functional component according to any one of the first to fifth aspects, wherein the resin body is not in direct contact with the semiconductor member. According to the semiconductor functional component of the sixth aspect, no stress is applied to the semiconductor member, so that the semiconductor member can be prevented from being deformed or destroyed.

A semiconductor functional component according to a seventh aspect is the semiconductor functional component according to any one of the first to fifth aspects, in which the resin body does not directly contact the semiconductor member in the structure. And a second resin that comes into contact with the first resin, and the first resin and the second resin that surround the peripheral surface of the semiconductor member are fluid-tightly integrated with each other. It is characterized by According to the semiconductor functional component of claim 7, even when a structure for storing and / or supplying a liquid is formed inside, such as an ink jet recording head, troubles such as liquid leakage and bubble generation are reduced. It is possible to maintain high quality stability.

The semiconductor functional component according to claim 8 is the semiconductor functional component according to claim 7, wherein the second resin has a lower elastic modulus than the first resin. In the semiconductor functional component according to claim 8, the second resin has a lower elastic modulus than the first resin. For example, a second resin having a low elastic modulus is used for the resin contacting the peripheral surface of the structure to reduce the load on the structure when integrally molded, and the resin forming the surface has an elastic modulus. It is possible to increase the strength as a semiconductor functional component by using the first resin having a high value. Therefore, the range of resin material selection can be expanded, and the resin selection can be optimized according to the application of the semiconductor functional component.

A semiconductor functional component according to a ninth aspect is the semiconductor functional component according to any one of the first to eighth aspects, wherein the film body has at least one through hole, and the through hole and the resin. The feature is that the body is fitted and fixed. According to the semiconductor functional component of claim 9,
By fitting the resin body and the through hole, the adhesive strength between the film body and the resin body can be increased without using other parts or materials.

A semiconductor functional component according to a tenth aspect is the semiconductor functional component according to any one of the seventh to ninth aspects, in which the second resin is an electric wiring formed on the film and the semiconductor. It is characterized in that it covers an electric connection portion for electrically connecting to a member. According to the semiconductor functional component of the tenth aspect, since the second resin covers the electric device connecting portion, the electric connecting portion can be protected without using a sealant.

The semiconductor functional component according to claim 11 is the semiconductor functional component according to any one of claims 1 to 10, wherein the space formed by the film body and the resin body is the resin body. It is characterized in that it is fluid-tightly divided. According to the semiconductor functional component of claim 11,
For example, when applied to the manufacture of an inkjet recording head, the ink supply port can be divided into a plurality of parts, and the inkjet recording head can be used for multicolor printing.

According to a twelfth aspect of the present invention, there is provided the semiconductor functional component according to any one of the first to eleventh aspects, wherein the semiconductor member comprises a plurality of semiconductor members. For example, when applied to the manufacture of an inkjet recording head, by changing the semiconductor member for each color,
The inkjet recording head can be used for multicolor printing, and the printing speed can be increased even in the case of a single color.

A semiconductor functional component according to a thirteenth aspect is the semiconductor functional component according to any one of the first to twelfth aspects, wherein the semiconductor functional component is an ink jet recording head. According to the semiconductor functional component of claim 13, an ink discharge port and an ink supply port are originally formed in the structure, and the structure and the resin body are integrated by, for example, insert molding. Therefore, it is possible to provide an ink jet recording head with stable quality without causing troubles such as liquid leakage and bubble generation.

A semiconductor functional component according to a fourteenth aspect is the semiconductor functional component according to the thirteenth aspect, wherein the structure is a manifold of an ink jet recording head.

A semiconductor functional component according to a fifteenth aspect is the semiconductor functional component according to any one of the first to twelfth aspects, wherein the semiconductor functional component is a light emitting component. If a light emitting element such as an LED or a laser diode is used as the semiconductor member, the number of parts and man-hours can be reduced, and a high quality light emitting part can be obtained.

A semiconductor functional component according to a sixteenth aspect is the semiconductor functional component according to any one of the first to twelfth aspects, wherein the semiconductor functional component is a sensor component. If a photodiode, a piezo element, or the like is used as the semiconductor member, a sensor (detection) component such as light or pressure can be made into a high-quality component with a small number of components and man-hours.

According to a seventeenth aspect of the present invention, there is provided a method of manufacturing a semiconductor functional component, wherein a film body having a plurality of openings, electric wiring formed on at least one surface, a film body disposed on the surface of the film body, and the electric wiring and the electric wiring A step of molding a first resin using a first mold that does not contact at least one peripheral surface of the semiconductor member with a structure provided with a connected semiconductor member; and molding the first resin. And a step of molding a second resin with the second structure using the second structure. In the method of manufacturing a semiconductor functional component according to claim 17, the structure and the resin body are integrated by insert molding. Therefore, it is possible to omit a complicated process such as a process of attaching components by using an adhesive and reduce the number of components. Further, by using the first mold that does not contact at least one peripheral surface,
A semiconductor functional component can be formed without damaging a fragile material such as a semiconductor.

The method of manufacturing a semiconductor functional component according to claim 18 is the method of manufacturing a semiconductor functional component according to claim 17, wherein the first mold is not in contact with the semiconductor member and the second mold is Presses at least a part of the portion that does not come into contact with the second resin by the pressing means. According to the method of manufacturing a semiconductor functional component according to claim 18, the semiconductor member is not damaged and the second resin does not exist by pressing the semiconductor member with an appropriate pressure while relaxing the pressing. Regions can be formed.

According to a nineteenth aspect of the present invention, there is provided a method of manufacturing a semiconductor functional component according to the seventeenth or eighteenth aspect, wherein the structure disposes the semiconductor member on the surface of the film body. In this case, there is provided a positioning means for positioning, and the positioning means is used for positioning the structure with respect to the first mold. According to the method of manufacturing a semiconductor functional component according to claim 19, the positioning of the semiconductor member with respect to the film body and the positioning of the structure with respect to the mold are performed by the same positioning means, whereby the positional accuracy of the semiconductor functional component to be manufactured is improved. It is possible to easily perform the alignment work while ensuring the above, and it is possible to improve the dimensional accuracy of the product and reduce the man-hours of the positioning work.

A semiconductor functional component according to a twentieth aspect is the method of manufacturing a semiconductor functional component according to the nineteenth aspect,
It is characterized in that the positioning means is any one of a perforation, a convex portion, and a concave portion formed in the film body.

An ink jet recording head according to a twenty-first aspect is arranged on a surface of a film body having a plurality of openings, at least one surface of which electric wiring is formed, and is electrically connected to the electric wiring. A structure provided with a piezoelectric conversion element made of a dielectric material, and a part of the peripheral surface of the structure is covered, and the structure is fluid-tightly integrated with the surface of the film body on which the electric wiring is formed. And at least one resin body.

An ink jet recording head according to a twenty-first aspect of the invention includes a structure body including a piezoelectric conversion element made of a dielectric material, and a resin body. The structure and the resin body are fluid-tightly integrated by insert molding or the like. Therefore, it is sufficient to prepare the structural body and the resin forming the resin body at the time of manufacturing, and it is possible to prevent an increase in manufacturing cost and a complicated process due to an increase in the number of parts. Further, since it is fluid-tightly integrated, troubles such as liquid leakage and bubble generation can be reduced even in the structure for storing and / or supplying liquid inside the inkjet recording head, and the quality stability is improved. Can be maintained.

According to a twenty-second aspect of the invention, an ink jet recording head is arranged on a surface of a film body having a plurality of openings, at least one surface of which electric wiring is formed, and electrically connected to the electric wiring. A structure provided with a piezoelectric conversion element made of a dielectric material; and at least one kind of structure that covers the structure except for a part of its peripheral surface and contacts the surface of the film body on which the electric wiring is formed. A resin body is provided, and the structure body and the resin body are integrated without including an adhesive at an interface where the structure body and the resin body come into contact with each other.

An ink jet recording head according to a twenty-second aspect of the invention includes a structure body including a piezoelectric conversion element made of a dielectric material, and a resin body. The structure and the resin body are integrated by, for example, insert molding without using an adhesive. Therefore, it is sufficient to prepare the structural body and the resin constituting the resin body at the time of manufacturing, and it is possible to prevent an increase in manufacturing cost and a complicated process due to an increase in the number of parts. Further, since there is no adhesive at the interface where the structure body and the resin body are in contact with each other, it is possible to reduce troubles such as liquid leakage even in the structure for storing or supplying the liquid inside the inkjet recording head. Therefore, it is possible to maintain high quality stability. Further, although a plurality of openings are provided on the peripheral surface of the structure, the resin body is in contact with at least a part of the peripheral surface other than the plurality of openings. Therefore, it is not necessary to form an opening later, and the manufacturing process can be simplified.

[0030]

BEST MODE FOR CARRYING OUT THE INVENTION A first embodiment in which the present invention is applied to an ink jet recording head will be described below with reference to FIGS. It should be noted that these figures are schematically drawn for simplification of description and do not correspond to actual dimensions.

The structure 10 shown in FIG. 1 is a semiconductor (S
A chip (semiconductor member) 12 composed of i) is formed on a film body (tape) 14 in which a plurality of openings are provided in advance and electrical wiring is formed, by a known method (for example, JP-A-6-8).
The method described in Japanese Patent No. 446). Here, the electric connection pad provided in the chip 12 and the electric wiring formed in the film body 14 are connected to each other, and an electric signal is externally supplied to the chip 12 through a terminal provided in another place in the film. Can be input. In the structure 10, ink is supplied from a gap (formed on the chip 12 by polyimide or the like: not shown) provided between the chip 12 and the film 14, and a plurality of openings 22 provided in the film body 14 are nozzles. And has a structure for ejecting ink. In addition to this, the structure 10 has a structure in which an opening previously provided on the back surface of the chip is used as an ink supply port, or a plate member having a plurality of openings is provided between the film body having a single opening and the chip, And the like. Further, the film body 14 is provided with a positioning pin hole (positioning means) 16 for setting the structure 10 in a mold, a through hole 18 for fixing the film body 14 to a resin to be formed later, and the like. The electric wiring is formed avoiding the positioning pin holes 16 and the through holes 18.

In the structure 10, the side surface of the chip 12 has an ink supply port, the upper surface has a plurality of nozzles 22 serving as ink ejection ports, and a heater for heating and ejecting the ink formed inside the chip 12. An electrical connection portion 20 for connecting electrical wiring (not shown) to the electrical wiring of the film body 14.
Are formed. The elements formed in these structures 10 may have different positions, structures, shapes, numbers, etc., depending on the characteristics of the functional components used and the necessity, and other elements may be added.

The structure 10 as described above is set in a mold (first mold) 50 in the injection molding machine shown in FIG. Mold 5
0 consists of a fixed die 50a and a movable die 50b. At this time, the tip 12 that is easily cracked or chipped is the mold 50.
It has a structure in which it does not directly touch the (fixed die 50a), and setting and positioning of the structure 10 in the die 50 is performed by passing a plurality of holding pins 24 through the positioning pin holes 16. Here, the number of pin holes 16 may be two or more, and the number and shape are arbitrary, but by using the same hole as the positioning hole used when fixing the chip 12 to the film body 14, precise positioning accuracy can be obtained. Can be secured. In the present embodiment, the film body 14 is provided with holes (perforations), and the mold 50
Although the pins are provided for positioning, the film body 14 may be provided with a convex portion, a concave portion, a notch, or the die 50 may be provided with a protrusion or the like.

After the structure 10 is set in the mold 50, the mold is automatically clamped, but at this time, the film body 14 is automatically bent along the shape of the movable mold 50b.
After the mold is clamped, the first resin 26 is injected to fill the space created in the mold 50 under a predetermined setting condition, and the primary molding is performed (FIG. 3). Here, as the injection molding machine, PN40 manufactured by Nissei Plastic Industry Co., Ltd. and Noryl SE100 manufactured by Japan GE Plastics Co., Ltd. can be used as the first resin.

FIG. 4 shows the primary molded product 40 taken out from the mold 50 after a predetermined cooling time. Chip 1 here
The first resin 26 is not formed around the area 2. The film 14 of the structure 10 is held by the first resin 26 through the through hole 18.

Next, the primary molded product 40 is set in the injection molding machine again (FIG. 5), and after the mold is clamped (FIG. 6), it is molded with the second resin 28 (FIG. 7). The mold (second mold) 60 used here is different from that used in the first resin molding. The mold 60 includes a fixed mold 60a and a movable mold 60b, and the movable mold 60b has a slide piece 60c. Figure 6
In the above, the back surface of the chip 12 is supported by the fixed die 60a and contacts the pushing piece 60d of the movable die 60b through the film body 14. The pressing piece (pressing means) 60c is a slide piece 60.
The tip 1 is provided by a spring (not shown) provided in c.
It has a structure that relieves the pressure on 2. As the injection molding machine, ES400 ELJECT manufactured by Nissei Plastic Industry Co., Ltd., and as the second resin 28, Rheostomer BJ1050N, a thermoplastic elastomer manufactured by Riken Vinyl Industry Co., Ltd. can be used.

A secondary molded product 41 molded as described above is shown in FIG. In FIG. 8B, the ink supply port 13 has the chip 12
8C shows two different cases when it is on the chip 12 side. Figure 8
In the case of (B), the chip 12 and the second resin 28 are in contact with each other on the peripheral surface excluding the ink supply port 30. In the case of FIG. 8C, the second resin 28 is the film body 14 and the first resin 2.
It is only in contact with 6, but not in direct contact with the chip 12. In what kind of structure the resin is formed in this way can be appropriately selected depending on the structure and application of the chip to be used. Further, the positioning pin hole 16 has the second resin 28.
It is covered with.

Secondary molded product 4 formed as described above
After removing 1 from the mold, a filter 32 for preventing dust from being mixed into the ink is attached to the first resin 26 by heat fusion (FIG. 9). FIG. 10 shows the completed inkjet recording head 42. The space formed in the inkjet recording head 42 is an ink reservoir 34 for supplying ink to the chip 12 through the ink supply port 30.

In the present embodiment, the electrical connection portion was protected in advance by using a sealant before the primary molding, but the sealant becomes unnecessary by appropriately selecting the conditions such as pressure during molding and the electrical connecting means. It is also possible to protect the ink from the ink by covering the electrical connection portion with the second resin 28, for example.

In the present embodiment, two types of resin, Noryl as the first resin 26 and Rheostomer which is a styrene (SBC) elastomer as the second resin, are formed by the injection molding method, but the type of resin is limited. The first resin is ABS, polyacetal (POM), polycarbonate (PC), polyethylene (PE), polyethylene terephthalate (PET), polypropylene (PP), polysulfone (PSF), polystyrene, depending on the purpose and application. (PS), etc. As the second resin, for example, in addition to styrene (SBC), olefin (TPO), vinyl chloride (TPV)
C), urethane type (TPU), ester type (TPEE), amide type (TPAE), so-called elastomer resin or the like, liquid crystal polymer and the like may be appropriately used depending on the characteristics and application of the resin. Further, one kind or two or more kinds of these resins may be used, and the molding method is not limited to injection molding, and compression molding, transfer molding, casting, hot melt method and the like may be appropriately used depending on the characteristics and application of the resin. A combination of methods is also possible. For example, after the first resin is formed by injection molding, the second resin is formed of a thermoplastic polyamide by the hot melt method, or the second resin is also formed of a thermosetting epoxy resin by transfer molding, There are various variations. Further, it is preferable that the second resin has a lower elastic modulus than the first resin. There is no particular limitation on the resin used in this way and the molding method. For example, a so-called two-color molding machine can be used for several types in one device. It is also possible to continuously form the resin molding of.

Comparing this embodiment with the conventional manufacturing method, the step of aligning the structure with the resin casing, the step of adhering and solidifying the chip to the resin casing, the step of bending the film body, and the resin body with the film body are carried out. The process of adhering to the body is not necessary as a series of operations, which simplifies the process and improves the yield, resulting in a significant improvement in quality and cost.

Next, a second embodiment to which the present invention is applied will be described. FIG. 11 shows an inkjet recording head of a second embodiment to which the present invention is applied. The basic manufacturing method is the same as that of the first embodiment. In the case of FIG. 11, the chip 12 is provided with three ink supply ports (the back side of the chip 12 in the figure), and three inks are provided by the color spacing walls 36. Separated into the reservoirs 34a, 34b, 34c, different types of ink can be used. The color spacing wall 36 can be easily formed by changing the mold shown in the first embodiment. Although the print heads for three colors are used in this embodiment, they can be divided into any number in the same manner.

Next, a third embodiment to which the present invention is applied will be described. In the second embodiment, one chip is mounted on one inkjet recording head, but in the third embodiment shown in FIG. 12, a plurality of chips (chips 12a, 12b,
12c) shows an arrayed multiple array head. The number of chips, the arrangement method, the number of partition walls, etc. can be freely selected by using the same method.

Although all of the above embodiments relate to the ink jet recording head, the chip to be used is appropriately selected, for example, if a light emitting element such as an LED or a laser diode is used, a light emitting component is used, and if a photodiode or a piezo element is used, light is emitted. It can be applied to various functional parts such as sensor (sensing) parts such as pressure and pressure.

In each of the above embodiments, a semiconductor member is used, but an inkjet recording head in which the semiconductor member is replaced by a piezoelectric conversion element made of a dielectric material is the same as in the above embodiment. Produce an effect.

[0046]

According to the present invention, it is possible to provide a semiconductor functional component made of a semiconductor material and a resin and an ink jet recording head which can be manufactured at low cost by a simple process with a small number of components. Further, a semiconductor functional component made of a semiconductor material and a resin and an inkjet recording head, which does not cause liquid leakage or the like and has high quality safety even when configuring a part or all of a liquid flow path or a liquid storage unit, are provided. can do. Further, the present invention can provide a method for manufacturing a semiconductor functional component that can be manufactured at low cost by a simple process with a small number of components, which is a semiconductor functional component made of a semiconductor material and a resin.

[Brief description of drawings]

FIG. 1 shows a film body to which a chip is attached, (A)
Schematic view from the back side of the chip, (B) schematic side view, (C)
It is a schematic diagram from the nozzle surface side.

FIG. 2 is a schematic view showing an aspect in which the film body shown in FIG. 1 is loaded into a mold.

FIG. 3 is a schematic cross-sectional view showing a state in which the mold shown in FIG. 2 is clamped and a first resin is injected.

4A is a schematic sectional view showing a primary molded product after molding a first resin, and FIG. 4B is a schematic view from the nozzle surface side.

FIG. 5 is a schematic cross-sectional view showing a state in which a primary molded product is loaded in a mold.

FIG. 6 is a schematic cross-sectional view showing a state in which a mold in which a primary molded product is loaded is clamped.

FIG. 7 is a schematic cross-sectional view showing a state in which the mold shown in FIG. 6 is clamped and a second resin is injected.

8A is a schematic cross-sectional view showing a secondary molded product after molding a second resin, FIG. 8B is a schematic view when the ink supply port is on the back surface of the chip, and FIG. 8C is a side surface of the chip. It is a schematic diagram in a certain case.

9 is a schematic cross-sectional view showing an aspect in which a filter is mounted on the secondary molded product shown in FIG.

10A and 10B are a schematic view of the inkjet recording head of the first embodiment to which the present invention is applied, viewed from the back side of the head, a schematic cross-sectional view of FIG. 10B, and a schematic view of the nozzle surface side of FIG. .

FIG. 11 is a schematic cross-sectional view (A) showing an inkjet recording head according to a second embodiment of the present invention.
It is a schematic diagram from the back side of the head (before mounting the filter).

FIG. 12 is a schematic sectional view (A) showing an inkjet recording head of a third embodiment to which the present invention is applied;
It is a schematic diagram from the back side of the head (before mounting the filter).

[Explanation of symbols]

10 structure 12 chips (semiconductor members) 14 Film body 16 Positioning pin hole 18 through holes 20 Electric connection 22 nozzles 24 Holding pin 26 First Resin 28 Second resin 30 ink supply port 32 filters 34 Ink reservoir 40 Primary molded product 41 Secondary molded product 50 mold (first mold) 60 mold (second mold)

─────────────────────────────────────────────────── ─── Continuation of the front page (51) Int.Cl. ⁷ Identification code FI theme code (reference) B41J 2/16 B41J 3/04 103H // B29L 31:00 (72) Inventor Sotaro Aoki Hongo, Ebina, Kanagawa Prefecture Address 2274 Fuji Xerox Co., Ltd. Ebina F-term (reference) 2C057 AF93 AG44 AP13 AP27 AP46 BA14 4F202 AD08 AD18 AD27 AD35 AH81 CA11 CB01 CB12 CQ03 CQ05 4F206 AD08 AD18 AD27 AD35 AH81 JA07 JB12 JB20 JF05 JP30

Claims (22)

[Claims] 1. A structure comprising a plurality of openings, a film body having electric wiring formed on at least one surface thereof, and a semiconductor member arranged on the surface of the film body and electrically connected to the electric wiring. And a part of the peripheral surface of the structure is covered, and at least one resin body that is fluid-tightly integrated with the surface of the film body on which the electrical wiring is formed, Functional semiconductor components. 2. A structure having a plurality of openings, a film body having electric wiring formed on at least one surface thereof, and a semiconductor member arranged on the surface of the film body and electrically connected to the electric wiring. While covering a part of the peripheral surface of the structure body, at least one resin body that abuts the surface of the film body on which the electric wiring is formed,
A semiconductor functional component, wherein the structure body and the resin body are integrated without including an adhesive at an interface where the structure body and the resin body contact each other. 3. The semiconductor functional component according to claim 1, wherein the plurality of openings are formed in the film body. 4. A plate member is provided between the film body and the semiconductor member, a single opening is provided in the film body, and the plurality of openings are formed in the plate member. The semiconductor functional component according to claim 1 or 2, characterized in that. 5. The semiconductor functional component according to claim 1, wherein the film body is arranged along the surface of the resin body. 6. The resin body is not in direct contact with the semiconductor member, according to any one of claims 1 to 5.
The semiconductor functional component described in the item. 7. The resin body is composed of a first resin that does not directly contact the semiconductor member in the structure and a second resin that contacts the first resin. The semiconductor functional component according to any one of claims 1 to 5, wherein the first resin, the second resin, and the film body that surround each other are fluid-tightly integrated. 8. The semiconductor functional component according to claim 7, wherein the second resin has a lower elastic modulus than the first resin. 9. The film body according to claim 1, wherein the film body has at least one through hole, and the through hole and the resin body are fitted and fixed to each other. Semiconductor functional parts. 10. The second resin covers an electric connection portion for electrically connecting the electric wiring formed on the film body and the semiconductor member. The semiconductor functional component according to any one of 1. 11. The semiconductor function according to claim 1, wherein a space formed by the film body and the resin body is fluid-tightly divided by the resin body. parts. 12. The semiconductor functional component according to claim 1, wherein the semiconductor member is composed of a plurality of members. 13. The semiconductor functional component is an ink jet recording head, according to claim 1.
The semiconductor functional component according to any one of 1. 14. The structure according to claim 13, wherein the structure is a manifold of an ink jet recording head.
The semiconductor functional component described in. 15. The semiconductor functional component according to claim 1, wherein the semiconductor functional component is a light emitting component. 16. The semiconductor functional component according to claim 1, wherein the semiconductor functional component is a sensor component. 17. A structure provided with a plurality of openings, a film body having electric wiring formed on at least one surface thereof, and a semiconductor member arranged on the surface of the film body and electrically connected to the electric wiring. A step of molding a first resin using a first mold that does not contact at least one peripheral surface of the semiconductor member, and a structure in which the first resin is molded using a second mold And a step of molding a second resin, the method for producing a semiconductor functional component, comprising: 18. The pressing means presses at least a part of a portion where the first die does not contact the semiconductor member and the second die does not contact the second resin. Item 17. A method for manufacturing a semiconductor functional component according to Item 17. 19. The structure has a positioning means for positioning the semiconductor member on the surface of the film body, and the positioning means positions the structure with respect to the first mold. 19. The method for manufacturing a semiconductor functional component according to claim 17 or 18, which is used for. 20. The method of manufacturing a semiconductor functional component according to claim 19, wherein the positioning means is any one of a perforation, a convex portion, and a concave portion formed in the film body. 21. A film body having a plurality of openings, electric wiring formed on at least one surface thereof, and a piezoelectric conversion element made of a dielectric material disposed on the surface of the film body and electrically connected to the electric wiring. A structure provided with, and covering at least a part of the peripheral surface of the structure, at least one resin body fluid-tightly integrated with the surface of the film body on which the electrical wiring is formed, An inkjet recording head comprising: 22. A film body having a plurality of openings, at least one surface of which electric wiring is formed, and a piezoelectric conversion element made of a dielectric material which is disposed on the surface of the film body and electrically connected to the electric wiring. And a structure having at least one kind of resin body which covers the peripheral surface of the structure except for a part thereof and is in contact with a surface of the film body on which the electric wiring is formed. An ink jet recording head, characterized in that the structure and the resin body are integrated without including an adhesive at the interface where the body and the resin body contact each other.