JP2003019755A5 - - Google Patents
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- Publication number
- JP2003019755A5 JP2003019755A5 JP2001207815A JP2001207815A JP2003019755A5 JP 2003019755 A5 JP2003019755 A5 JP 2003019755A5 JP 2001207815 A JP2001207815 A JP 2001207815A JP 2001207815 A JP2001207815 A JP 2001207815A JP 2003019755 A5 JP2003019755 A5 JP 2003019755A5
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- JP
- Japan
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2001207815A JP4699644B2 (en) | 2001-07-09 | 2001-07-09 | Bonding device and bonding method |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2001207815A JP4699644B2 (en) | 2001-07-09 | 2001-07-09 | Bonding device and bonding method |
Related Child Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2011024559A Division JP5123406B2 (en) | 2011-02-08 | 2011-02-08 | Bonding device and bonding method |
Publications (3)
| Publication Number | Publication Date |
|---|---|
| JP2003019755A JP2003019755A (en) | 2003-01-21 |
| JP2003019755A5 true JP2003019755A5 (en) | 2008-06-19 |
| JP4699644B2 JP4699644B2 (en) | 2011-06-15 |
Family
ID=19043732
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2001207815A Expired - Fee Related JP4699644B2 (en) | 2001-07-09 | 2001-07-09 | Bonding device and bonding method |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JP4699644B2 (en) |
Families Citing this family (9)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP4494826B2 (en) * | 2004-02-26 | 2010-06-30 | リンテック株式会社 | Bonding roller and label bonding device |
| JP4546820B2 (en) * | 2004-12-24 | 2010-09-22 | 立山マシン株式会社 | Film sticking device |
| JP5112682B2 (en) * | 2006-12-18 | 2013-01-09 | リンテック株式会社 | Sheet sticking device and sticking method |
| JP5081471B2 (en) * | 2007-02-27 | 2012-11-28 | 長野オートメーション株式会社 | Device for bonding workpieces |
| JP5151326B2 (en) | 2007-09-04 | 2013-02-27 | Ｎｌｔテクノロジー株式会社 | Vacuum adsorption control mechanism device, film sticking device, display device |
| WO2011071231A2 (en) * | 2009-12-08 | 2011-06-16 | Han Dong Hee | Film adhering device and adhering method |
| JP5123406B2 (en) * | 2011-02-08 | 2013-01-23 | リンテック株式会社 | Bonding device and bonding method |
| KR101398102B1 (en) * | 2014-01-27 | 2014-05-28 | 한동희 | Panel bonding apparatus |
| JP6403456B2 (en) * | 2014-06-27 | 2018-10-10 | 住友化学株式会社 | Bonding apparatus, bonding method, optical display device production system, and optical display device production method |
Family Cites Families (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS63202933A (en) * | 1987-02-19 | 1988-08-22 | Toshiba Corp | Sticker for adhesive sheet |
| JPH04182949A (en) * | 1990-11-16 | 1992-06-30 | Seiko Epson Corp | Adhesive applying device for sticking optical disk |
| JP3328381B2 (en) * | 1993-06-24 | 2002-09-24 | 日東電工株式会社 | Automatic protection tape sticking device for semiconductor wafers |
| JPH08300484A (en) * | 1995-05-09 | 1996-11-19 | Sekisui Chem Co Ltd | Fusion-bonding device |
| JP2001146357A (en) * | 1999-11-19 | 2001-05-29 | Sony Corp | Method and apparatus for attaching tape to semiconductor substrate |
| JP2004047036A (en) * | 2002-07-16 | 2004-02-12 | Fuji Photo Film Co Ltd | Method for sticking sheet material to base substrate and method for manufacturing optical disk |
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2001
- 2001-07-09 JP JP2001207815A patent/JP4699644B2/en not_active Expired - Fee Related