JP2003008289A - Method and apparatus for mounting electronic component on tape-like board - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide a method of mounting electronic components, a mounting apparatus and a tape-like board used therefor, which has small carry-in/ejection loss time in each working part of the mounting apparatus in mounting electronic components on a board, and enables the mounting apparatus to be made as small as possible. SOLUTION: Using a tape-like board having a plurality of circuit patterns continuously formed thereon, the tape-like board is fed intermittently, and a plurality of electronic components are mounted on the board during intermittent feed stop. This eliminates the time loss of the board feeding and the need of board buffers provided between working parts of the conventional mounting apparatus, thus making the mounting apparatus size to be reduced in size.

Description

Detailed Description of the Invention

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a method and a method for mounting electronic components on a tape-shaped substrate for mounting a plurality of electronic components on each circuit pattern of the tape-shaped substrate on which a plurality of circuit patterns are continuously formed. The present invention relates to a device and a tape-shaped substrate used for the device.

[0002]

2. Description of the Related Art Conventionally, for mounting electronic components such as IC chips and chip components on a substrate, a fixed number of individual substrates are grouped and sent to each work process in a mounting apparatus, and then predetermined in each process. By feeding the individual substrates one by one to the work position by a belt conveyor or the like, supplying the bonding material, mounting the electronic parts, and heating / pressurizing the bonding material,
The electrodes of the electronic parts and the electrodes of the substrate are electrically connected.

[0003]

However, in the above-mentioned structure, in order to reduce the time loss of the substrate feeding due to the difference in the working time in each process in the mounting apparatus, the board for each working process in the mounting apparatus is reduced. The buffer part of
Substrates processed in each process are sent to each buffer unit, and after a certain number of substrates are accumulated in each buffer unit, the substrates processed in a certain number of units are sent to the next work process. There was a problem that the size increased. Also, in each work step in the device, all the substrates in a fixed quantity unit are subjected to a predetermined treatment,
There is a problem that the substrate processing waiting state cannot be completely eliminated in the next process until it is discharged and the substrates are sent to the next process in batches in a fixed quantity. It was Therefore, there has been a demand for a method in which substrates are continuously processed, the apparatus is made as small as possible, and the time loss in substrate feeding is reduced.

Therefore, an object of the present invention is to solve the above problems by using a tape-shaped substrate on which a plurality of circuit patterns are continuously formed and intermittently feeding the tape-shaped substrate. By mounting a plurality of electronic components on a tape-shaped substrate, it is possible to eliminate the time loss of substrate feeding and to reduce the mounting device size. To provide a tape-shaped substrate.

[0005]

In order to achieve the above object, the present invention is configured as follows.

According to the first aspect of the present invention, a tape-shaped substrate on which a plurality of circuit patterns capable of mounting a plurality of electronic components are continuously formed at regular intervals is intermittently fed, and the tape-shaped substrate is intermittently fed. Provided is a method for mounting an electronic component on a tape-shaped substrate, characterized in that the electronic component is mounted on each of the circuit patterns on the tape-shaped substrate at the time of stopping the mechanical feeding.

According to the second aspect of the present invention, the plurality of electronic components are the IC chip and the chip component, and the tape in which a plurality of circuit patterns having respective joints of the IC chip and the chip component are continuously formed. The substrate is intermittently fed, and the IC chip mounting pre-operation for mounting the IC chip on the tape-shaped substrate is performed, and the IC chip is mounted on the tape-shaped substrate subjected to the IC chip mounting pre-operation. The tape is mounted, and the tape-shaped substrate on which the IC chip is mounted is subjected to a pre-operation for mounting the chip component for mounting the chip component, and the pre-operation for mounting the chip component is performed to supply the solder. The chip component is mounted on a strip-shaped substrate, the solder of the tape-shaped substrate on which the chip component is mounted is reflowed, and the intermittent feeding of the tape-shaped substrate is stopped. In each of the different work steps from the pre-working step for mounting the C chip on the tape-shaped board to the work step for reflowing the solder of the tape-shaped board on which the chip parts are mounted, the different tape-shaped board is used. A method for mounting an electronic component on a tape-shaped substrate according to the first aspect, in which the respective work steps are simultaneously performed on each circuit pattern is provided.

According to a third aspect of the present invention, the IC is mounted on the tape-shaped substrate which has been pre-worked for mounting the IC chip.
In an operation step of mounting a chip, the IC chip having bumps formed on a plurality of electrodes of the IC chip is bonded to the plurality of electrodes of the IC chip on the circuit patterns of the tape-shaped substrate. The tape shape according to the second aspect, wherein the bumps of the IC chip are aligned as possible, the bumps of the IC chip are bonded to the electrodes on the circuit patterns of the tape-shaped substrate, and the IC chip is mounted on the tape-shaped substrate. Provided is a method of mounting an electronic component on a board.

According to a fourth aspect of the present invention, bumps are formed on a plurality of electrodes of the IC chip in a work process of performing the IC chip mounting preparatory work for mounting the IC chip on the tape substrate. The above-mentioned IC chip
A non-conductive resin sheet or resin paste is supplied onto each circuit pattern of the tape-shaped substrate as a bonding material capable of bonding the bumps of the IC chip and the electrodes on the circuit patterns of the tape-shaped substrate. Then, in the work step of mounting the IC chip on the tape-shaped substrate that has been subjected to the IC chip pre-mounting work, the non-conductive material that is the bonding material supplied onto each of the circuit patterns of the tape-shaped substrate. The IC chip is mounted via the resin sheet or the resin paste, and the resin sheet or the resin paste is pressed while being heated, and the bumps of the IC chip are connected to the circuit patterns of the tape-shaped substrate. A second mode in which the above-mentioned respective electrodes are directly joined and the joining is maintained by thermosetting the resin sheet or the resin paste. Provides a mounting method of the electronic component to the tape-shaped substrate according.

According to a fifth aspect of the present invention, bumps are formed on a plurality of electrodes of the IC chip in a work process for performing the IC chip mounting preparatory work for mounting the IC chip on the tape-shaped substrate. The above-mentioned IC chip
A resin sheet or resin paste in which conductive particles are distributed, or a conductive resin sheet or resin as a bonding material capable of bonding the bumps of the IC chip and the electrodes on the circuit patterns of the tape-shaped substrate The paste is supplied onto each circuit pattern of the tape-shaped substrate, and the above-mentioned I
In the work step of mounting the IC chip on the tape-shaped substrate on which the C-chip mounting operation has been performed, the conductive particles, which are the bonding material supplied, are distributed on the respective circuit patterns of the tape-shaped substrate. The IC chip is mounted via the resin sheet or the resin paste, or the conductive resin sheet or the resin paste,
The resin sheet or the resin paste is pressed while being heated, and the bumps of the IC chip are connected to the electrodes on the circuit patterns of the tape-shaped substrate by the conductive particles or the conductive resin sheet. Alternatively, there is provided a method for mounting an electronic component on a tape-shaped substrate according to a second aspect, which is indirectly bonded via a resin paste, and the bonding is maintained by thermosetting the resin sheet or the resin paste.

According to the sixth aspect of the present invention, bumps are formed on a plurality of electrodes of the IC chip in a work step of performing the IC chip mounting preparatory work for mounting the IC chip on the tape-shaped substrate. The above-mentioned IC chip
As a bonding material capable of bonding the bumps of the IC chip to the electrodes on the circuit patterns of the tape-shaped substrate, a metal, which is a conductive material, is supplied onto the circuit patterns of the tape-shaped substrate to form the IC. In the operation step of mounting the IC chip on the tape-shaped substrate on which the chip mounting operation has been performed, the IC is transferred via the metal, which is the bonding material supplied onto the circuit patterns of the tape-shaped substrate.
A chip is mounted, the metal is heated and melted, the bumps of the IC chip are indirectly bonded to the electrodes on the circuit patterns of the tape-shaped substrate through the metal, and the metal is heated. A method for mounting an electronic component on a tape-shaped substrate according to the second aspect, wherein the bonding is maintained by curing.

According to the seventh aspect of the present invention, the plurality of electronic components are the IC chip and the chip component, and the tape in which a plurality of circuit patterns having the respective joining portions of the IC chip and the chip component are continuously formed. The substrate is intermittently fed, the plurality of electrodes of the IC chip are aligned so that they can be joined to the plurality of electrodes on the circuit patterns of the tape substrate, and the electrodes of the IC chip are attached to the tape. Each electrode on each circuit pattern of the strip-shaped substrate is subjected to ultrasonic metal diffusion bonding, the IC chip is mounted on the tape-shaped substrate, and the chip component is mounted on the tape-shaped substrate on which the IC chip is mounted. The chip component is mounted on the tape-shaped substrate to which the solder is supplied by performing the chip component mounting pre-work. The tape-shaped board on which the chip components are mounted is reflowed from the mounted tape-shaped board, and the IC chip is mounted on the tape-shaped board during the intermittent feeding stop of the tape-shaped board. The tape-shaped substrate according to the first aspect, wherein in each of the different work steps up to the work step of reflowing the solder of the board, the work of each work step is performed simultaneously on the different circuit patterns of the tape-like board. Provide a method for mounting electronic components on the.

According to the eighth aspect of the present invention, the plurality of electronic components are the IC chip and the chip component, and the tape in which a plurality of circuit patterns having the respective joints of the IC chip and the chip component are continuously formed. The substrate is intermittently fed, and the IC chip mounting pre-operation for mounting the IC chip on the tape-shaped substrate is performed, and the IC chip is mounted on the tape-shaped substrate subjected to the IC chip mounting pre-operation. The chip component mounting pre-operation for mounting the chip component on the tape-shaped substrate on which the IC chip is mounted is performed, and the chip component mounting pre-operation is performed to supply the bonding material. The plurality of electrodes of the chip component are aligned on the tape-shaped substrate so that the electrodes can be bonded to the plurality of electrodes on the circuit patterns of the tape-shaped substrate, and the electrodes of the chip component are aligned. The tape-shaped substrate is bonded to each electrode on each circuit pattern via the bonding material, the chip component is mounted on the tape-shaped substrate on which the IC chip is mounted, and the tape-shaped substrate is intermittently mounted. In each of the different work steps from the pre-working step for mounting the IC chip on the tape-shaped substrate to the work step for mounting the chip component on the tape-shaped board on which the IC chip is mounted when the feeding is stopped There is provided a method for mounting electronic components on a tape-shaped substrate according to the first aspect, in which the respective work steps are simultaneously performed on the different circuit patterns of the tape-shaped substrate.

According to a ninth aspect of the present invention, the bonding material is a conductive resin, and the electrodes of the chip component can be bonded to a plurality of electrodes on the circuit patterns of the tape-shaped substrate. And press the electrodes of the chip component to the electrodes on the circuit patterns of the tape-shaped substrate while heating the electrodes of the chip component to the circuit patterns of the tape-shaped substrate. A method for mounting an electronic component on a tape-shaped substrate according to an eighth aspect, wherein the upper electrode is indirectly bonded via the conductive resin, and the bonding is maintained by thermosetting the conductive resin. To do.

According to a tenth aspect of the present invention, the bonding material is a metal, and the electrodes of the chip component are positioned so as to be bonded to a plurality of electrodes on the circuit patterns of the tape-shaped substrate. The electrodes of the chip component are mounted on the electrodes on the circuit patterns of the tape-shaped substrate via the metal, the metal is heated and melted, and the electrodes of the chip component are attached to the tape. The electronic device to the tape-shaped substrate according to the eighth aspect, wherein the plurality of electrodes on each of the circuit patterns of the strip-shaped substrate are indirectly bonded via the metal, and the bonding is maintained by thermosetting the metal. Provide a mounting method of parts.

According to the eleventh aspect of the present invention, a tape-shaped substrate on which a plurality of circuit patterns capable of mounting a plurality of electronic components are continuously formed at regular intervals can be intermittently fed. Supplying work unit and electronic component mounting work unit capable of mounting each electronic component on each circuit pattern of the tape-shaped substrate when the intermittent feeding of the tape-shaped substrate by the tape-shaped substrate supply working unit is stopped. And a tape-shaped substrate winding operation unit capable of intermittently winding the tape-shaped substrate on which the electronic components are mounted, and
The tape-shaped substrate supply working unit and the tape-shaped substrate winding work unit are capable of simultaneously supplying and winding the tape-shaped substrate, and an electronic component to the tape-shaped substrate. Provide a mounting device.

According to the twelfth aspect of the present invention, the plurality of electronic components are an IC chip and a chip component, and a tape in which a plurality of circuit patterns having joint portions of the IC chip and the chip component are continuously formed. Tape-like substrate supply working section capable of intermittently feeding the board-like substrate, electronic component mounting working section capable of mounting the IC chip and the chip component on the circuit patterns of the tape-shaped board, and the IC A tape-shaped substrate winding operation unit capable of intermittently winding the chip and the tape-shaped substrate on which the chip component is mounted is provided, and the electronic component mounting operation unit transfers the IC chip to the tape-shaped substrate. An IC chip pre-mounting work section capable of performing an IC chip mounting pre-work for mounting, and the IC chip on the tape-shaped substrate on which the IC chip mounting pre-work has been performed. And the IC chip mounting work unit capable of instrumentation,
A chip component pre-mounting work unit capable of performing a chip component mount pre-work for mounting the chip component on the tape-shaped substrate on which the IC chip is mounted, and a chip component mount pre-work are performed. A chip component mounting working unit capable of mounting the chip component on the tape-shaped substrate supplied with solder, and a chip component reflow working unit for reflowing the solder of the tape-shaped substrate on which the chip component is mounted, When the tape-shaped substrate supply working unit stops the intermittent feeding of the tape-shaped substrate, the different working units from the pre-IC chip mounting working unit to the chip component reflow working unit are different from the tape-shaped substrate. It is possible to simultaneously perform the work of each of the working units on the circuit pattern, and the tape-shaped substrate supply working unit and the tape-shaped substrate winding work. The may be simultaneously performing the supplying operation and the winding operation of the tape-like substrate 1
An electronic component mounting apparatus for a tape-shaped substrate according to one aspect is provided.

According to a thirteenth aspect of the present invention, the tape-shaped substrate can be wound around a reel, and the tape-shaped substrate supply unit winds the tape-shaped substrate wound around the reel around the reel. The tape-shaped substrate winding operation unit includes a reel supply unit that can be intermittently fed by returning the tape-shaped substrate on which the electronic components are mounted on the reel. An electronic component mounting device for a tape-shaped substrate according to the eleventh aspect or the twelfth aspect, which comprises a tape accommodating portion that can be wound up.

According to the fourteenth aspect of the present invention, the distance between the working parts from the IC chip pre-mounting working part to the chip component reflow working part is determined by the circuit patterns on the tape-shaped substrate. Firstly, a variable data control unit is provided in a multiple of the formed pitch.
An electronic component mounting apparatus for a tape-shaped substrate according to the second aspect is provided.

According to a fifteenth aspect of the present invention, the tape-shaped substrate winding operation unit is a sheet-shaped embossed spacer having an uneven portion capable of protecting the electronic components mounted on the tape-shaped substrate. An electronic component mounting apparatus for a tape-shaped substrate according to a thirteenth aspect is provided, which comprises a tape housing portion capable of intermittently winding the protected tape-shaped substrate by winding the reel on the reel.

According to the sixteenth aspect of the present invention, the tape-shaped substrate heated in the chip-component reflow working unit can be cooled between the chip-component reflow working unit and the tape-shaped substrate winding working unit. An apparatus for mounting an electronic component on a tape-shaped substrate according to the twelfth aspect, further comprising a cooling unit is provided.

[0022]

BEST MODE FOR CARRYING OUT THE INVENTION Embodiments of the present invention will be described below in detail with reference to the drawings.

FIG. 1 is an overall plan view of an electronic component mounting apparatus 101 using the method for mounting electronic components on a tape-shaped substrate according to the first embodiment of the present invention. In FIG. 1, an electronic component mounting apparatus 101 that is elongated in the lateral direction feeds a tape-shaped substrate while adjoining a plurality of working units for mounting electronic components such as IC chips and chip components on the top surface of the tape-shaped substrate. It has along the X direction which is a direction. These working units are roughly divided into seven working units. The tape-shaped substrate supply working unit 1 and the IC
It is composed of a pre-chip mounting work unit 2, an IC chip mounting work unit 3, a chip component pre-working unit 4, a chip component mounting work unit 5, a chip component reflow working unit 6, and a tape-shaped substrate winding work unit 7. .

In the tape-shaped substrate supply operation unit 1, a tape-shaped substrate formed by a plurality of independent circuit patterns continuous at regular intervals is wound on one tape formed of an insulating substrate. The tape-shaped substrate is rewound from the reel and the tape-shaped substrate is supplied to the IC chip pre-mounting work unit 2.

Next, in the IC chip pre-mounting work section 2, a bonding material for bonding the IC chip to the tape-shaped substrate is supplied to the IC chip bonding part on each circuit pattern of the tape-shaped substrate, and then the IC is bonded. In the chip mounting operation unit 3, the IC chip is bonded to the tape-shaped substrate through a bonding material by thermocompression bonding.

Next, in the pre-chip component mounting working unit 4, solder for bonding the chip component to the tape-shaped substrate is supplied to the chip component bonding portion on the tape-shaped substrate, and in the chip-component mounting working unit 5, The chip component is attached to the tape-shaped substrate via solder, and the chip component reflow operation unit 6
In step 1, heating is performed to melt the solder supplied onto the tape-shaped substrate, bond the chip component to the tape-shaped substrate, and then cool the heated tape-shaped substrate by air blow or the like.

Finally, in the tape-shaped substrate winding operation section 7, the tape-shaped substrate having the IC chip and the chip component mounted on each circuit pattern is wound on a reel.

The tape-shaped substrate is sucked and fixed on each stage in each working unit from the IC chip pre-mounting working unit 2 to the chip component reflow working unit 6 and then subjected to each predetermined work. After the tape-shaped substrate is released from the suction-fixed state on each stage in the working section, the tape-shaped substrate is sent from each working section to which each predetermined work has been performed to each next working section.

Further, in the side view of the tape-shaped substrate supply working unit 1 shown in FIG. 2B, the tape-shaped substrate 11 is a tape between the tape-shaped substrate supply working unit 1 and the tape-shaped substrate winding work unit 7. A constant tension is always applied by the tension roller 18 provided between the pair of guide rollers 17a and 17b provided along the X direction, which is the tape substrate feeding direction, and the tape substrate feeding working unit 1 is provided. To the tape-shaped substrate take-out working unit 7 without slack.

A method of mounting electronic components on a tape-like substrate using the electronic component mounting apparatus 101 constituted by each working unit in each of the above steps will be described in detail below.

As shown in FIG. 4, the tape-shaped substrate 11 is formed so that the same circuit patterns 12 on which IC chips and chip components can be mounted are continuous with a pitch P at a constant interval.
Formed on. Here, the pitch P means a certain circuit pattern 12 and the next same circuit pattern 12 that is continuous.
And the distance in the length direction of the tape-shaped substrate 11 at the same position in each circuit pattern 12 between and. The reel 15 around which the tape-shaped substrate 11 is wound is attached to the reel supply unit 1a in the tape-shaped substrate supply operation unit 1, and the reel 15 is intermittently rotated by using the tape-shaped substrate rewinding motor 16 to obtain the tape. While rewinding the substrate 11 from the reel 15, the tape substrate 11 is intermittently supplied to the IC chip pre-mounting work unit 2 which is the next working unit.
It should be noted that each working unit performs a predetermined work on each circuit pattern 12.

Next, each circuit pattern 12 of the tape-shaped substrate 11 is sent from the tape-shaped substrate supply working unit to the pre-IC chip mounting working unit 2 of FIG. The tape-shaped substrate 11 having the circuit patterns 12 is sucked and held on the stage 20 by being sucked by the suction holes of the stage 20.

Next, as shown in FIG. 5A, bumps formed of a conductive material such as Au on a plurality of electrodes of the IC chip and I of each circuit pattern 12 on the tape-shaped substrate 11 are formed.
The bonding material 21, which is a non-conductive resin material for bonding the plurality of electrodes 13a of the C chip bonding portion 13, is formed in a sheet shape whose both surfaces are protected by the protective film 22. As shown in FIG. 2A, the sheet material supply unit 23
In the above, the bonding material 21 is supplied in a state of being wound on the reel 23a, and by intermittently rotating the reel 23a using the sheet material rewinding motor 23b, the bonding material 21 is rewound from the reel 23a, One side of the protective sheet 22 is peeled off, and further, as shown in FIG. 5B, the tape-shaped substrate 11 is cut by the cutting portion 23c so that it can be supplied to the IC chip bonding portion 13 in each circuit pattern 12 of the tape-shaped substrate 11. The tape 21 is supplied above the circuit patterns 12 of the tape-shaped substrate 11 in a state of being cut into pieces at the surface 21a. Thereafter, as shown in FIGS. 5C and 5D, the bonding material 21 is heated and pressed by the heating / pressing tool 24 to the IC chip bonding portion 13 of each circuit pattern 12 on the tape-shaped substrate 11. As a result, the protective sheet 22 that has been pasted and supplied and that has protected the other surface of the bonding material 21 is sucked by the sheet suction unit 27. After that, the suction of the tape-shaped substrate 11 on the stage 20 is released.

Here, as shown in FIG. 5 (e), when the bonding material 21 is a paste-shaped bonding material 25, the tape-shaped substrate 11 is replaced with the above-mentioned bonding material 21 being stuck.
Is applied and supplied to the IC chip joint portion 13 of each circuit pattern 12 in FIG.

Next, each circuit pattern 12 of the tape-shaped substrate 11 is transferred from the IC chip pre-mounting work portion 2 to the IC of FIG.
After being sent to the IC chip mount working unit 3a which is the first working unit in the chip mounting working unit 3, the tape-shaped substrate having each circuit pattern 12 to which the bonding material 21 is attached in the IC chip mounting working unit 3a. 11 is
It is sucked and held by the stage 30a by being sucked by the suction holes of the stage 30a.

Next, as shown in FIG. 6A, Au, which is a conductive material, is applied to the plurality of electrodes 31a on the upper surface of the IC chip 31.
Thereby forming the bump 31b. In FIG. 2A, the IC chips 31 are aligned in the component tray 32, and the Y direction moving motor 3 built in the reversing unit 33.
The reversing unit 33 is moved above the component tray 32 by 3a, and the IC chip 31 is taken out from the component tray 32 while being sucked and held by the suction nozzle of the reversing unit 33.
3 returns to the original position while holding the IC chip 31 by suction.

Next, after the IC chip 31 is inverted by the reversing motor 33b of the reversing unit 33 so that the surface of the IC chip 31 on which the bumps 31b are formed faces downward, the IC chip 31 has a built-in X direction. The reversing section 33 is held by the moving motor 33c while the IC chip 31 is adsorbed and held by the tool 34.
6B, the IC chip 31 is sucked and held by the pressurizing / heating unit on the lower surface of the tool 34 and transferred to it, as shown in FIG. 6B.

After that, the reversing unit 33 returns to the original position from below the tool 34, and the IC chip 31 moves to the tool 34.
While being sucked and held on the tape-shaped substrate 11 by the Y-direction moving motor 34a of the tool 34,
Each bump 31b of the chip 31 and each electrode 13a of the IC joint portion 13 of each circuit pattern 12 on the tape-shaped substrate 11
So that the IC chip 31 can be bonded to the tape-shaped substrate 1
After aligning with each circuit pattern 12 in FIG. 1, as shown in FIGS. 6C and 6D, the tool 34
While being heated, the IC chip 31 is temporarily pressure-bonded to the bonding material 21 stuck to the IC chip bonding portion 13 of each circuit pattern 12 on the tape-shaped substrate 11. After that, the tool 34 is returned to the original position, and the suction of the tape-shaped substrate 11 to the stage 30a is released.

Next, each circuit pattern 12 of the tape-shaped substrate 11 is the second working unit I from the IC chip mounting working unit 3a to the IC chip mounting working unit 3 in FIG. 2A.
After being sent to the C-chip main pressure-bonding working section 3b, the tape-shaped substrate 11 having the circuit patterns 12 on which the IC chips are temporarily pressure-bonded is sucked in the suction holes of the stage 30b in the IC chip main-pressure bonding working section 3b. Stage 3
It is adsorbed and held at 0b.

Next, as shown in FIG. 7A, I which has been temporarily pressure-bonded to the bonding material 21 supplied on the tape-shaped substrate 11 is formed.
Heating / pressurizing tool 35 for main pressure bonding of C-tip 31
Is the heating / pressurizing surface, the lower surface is heated by the protective sheet 36.
It is protected from dirt during pressurization and always kept clean.

The heating / pressurizing tool 35 is moved onto the tape-shaped substrate 11 by the XY-direction moving motors 35a and 35b, and the tape-shaped substrate 11 is moved as shown in FIG. 7 (b). The upper surface of the IC chip 31 that has been temporarily pressure-bonded to the bonding material 21 supplied above is pressed while being heated by the heating / pressing tool 35, so that each bump 31b of the IC chip 31 and the tape-shaped substrate 11 are The bonding material 21 between the electrodes 13a of the IC chip bonding portion 13 of each circuit pattern 12 is pushed away, and the bumps 31b of the IC chip 31 are separated from the IC chip bonding portion 13 of each circuit pattern 12 on the tape-shaped substrate 11. It is directly bonded to each electrode 13a. After that, the bonding material 21 is thermoset,
The bonding between the IC chip 31 and the tape-shaped substrate 11 will be maintained. After that, the heating / pressurizing tool 35 is returned to the original position, and the suction of the tape-shaped substrate 11 to the stage 30b is released.

Here, as the bonding material 21, instead of the non-conductive resin material, a resin material containing conductive particles, a conductive resin material, or a metal which is a conductive material may be used. For example, as shown in FIG.
When 1 is an anisotropic conductive film containing conductive particles 21a, the upper surface of the IC chip 31 temporarily press-bonded to the bonding material 21 supplied on the tape-shaped substrate 11 is pressed, so that the IC chip The bonding material 21 between each of the bumps 31b of 31 and each electrode 13a of the IC chip bonding portion 13 of each circuit pattern 12 is pressed, and the conductive particles 21a in this portion of the bonding material 21 cause the bonding of the IC chip 31. Each bump 31b and each circuit pattern 12 on the tape-shaped substrate 11
The electrodes 13a of the IC chip joint portion 13 are indirectly joined.

The electrodes 31a of the IC chip 31 and the electrodes 13a of the IC chip bonding portion 13 of the circuit patterns 12 on the tape-shaped substrate 11 are made of the bonding material 21 instead of the bonding method described above. Each electrode 31a of the IC chip 31 formed of a metal material without using each other
And metal diffusion bonding by ultrasonic waves to each electrode 13a of each circuit pattern 12, and the IC chip 31 is attached to the tape-shaped substrate 11
You may use the metal diffusion bonding method mounted in.

Next, after each circuit pattern 12 of the tape-shaped substrate 11 is sent from the IC chip mounting working unit 3 to the chip component pre-mounting work unit 4 of FIG. 3, the solder supply unit of the chip component pre-mounting work unit 4 is carried out. 41, as shown in FIG.
The tape-shaped substrate 11 having the circuit patterns 12 on which the chips 31 are mounted is sucked and held by the stage 42 by being sucked by the suction holes 42a of the stage 42.

Next, the metal mask 43 is attached to the tape-shaped substrate 1
Each electrode 14a of the plurality of chip component joints 14 of each circuit pattern 12 on the tape-shaped substrate 11
A plurality of solder supply openings 43a of the plate-shaped metal mask 43 are provided on the upper surface, and cream solder 44 is provided on each electrode 14a of each chip component joint 14 from each solder supply opening 43a.
The metal mask 43 so that the metal mask 43 can be supplied.
Is placed on the tape-shaped substrate 11.

Next, the tip of the squeegee 45 is applied to the upper surface of the metal mask 43 by the XY-direction moving motors 45a and 45b, and the squeegee 45 is slid and moved to fill the solder supply openings 43a. The cream solder 44 is printed and supplied onto the electrode 14a of the chip component joint portion 14 of each circuit pattern 12 on the tape-shaped substrate 11. After that, the metal mask 43 on the tape-shaped substrate 11 is moved upward, and the adsorption of the stage 42 is released.

Here, although the supply of the cream solder 44 to the electrodes 14a of the plurality of chip component joints 14 of the circuit patterns 12 on the tape-shaped substrate 11 is not shown,
Instead of the metal mask 43 and the squeegee 45, a dispenser may be used for coating and supply.

The cream solder 44 is made of the bonding material 44.
In this example, the bonding material 44 is replaced with the cream solder 44, and lead-free solder, a metal such as an alloy of Au and Sn,
Alternatively, it may be a conductive resin.

Next, after each circuit pattern 12 of the tape-shaped substrate 11 is sent from the pre-chip component mounting work unit 4 to the chip component mounting work unit 5 of FIG. 3, the chip component mounting work unit 5 is carried out.
In FIG. 9, as shown in FIG. 9, the tape-shaped substrate 11 having each circuit pattern 12 on which the cream solder 44 is printed
Are sucked and held by the stage 55 by being sucked by the suction holes 55 a of the stage 55.

Next, in FIG. 3, a motor 5 for moving the head 53 in the XY directions is placed in a parts cassette 52 containing a plurality of chip parts 51 having a plurality of electrodes 51a.
The head 53 is moved in the XY directions by 3a and 53b,
By sucking and holding the chip component 51 with the suction nozzle 54 of the head 53, the chip component 51 is held.
2 and take out the chip component 51 on the tape-shaped substrate 11.
Is moved by the head 53. Further, as shown in FIG. 9, each electrode 51a of the chip component 51 is connected to the tape-shaped substrate 11
Each chip component joint 14 of each circuit pattern 12 in
It is mounted via the cream solder 44 printed on each electrode 14a. After that, the head 53 is returned to the original position,
The tape-shaped substrate 11 is released from the suction on the stage 55.

Next, after each circuit pattern 12 of the tape-shaped substrate 11 is sent from the chip component mounting working unit 5 to the chip component reflow working unit 6 of FIG. 3, the chip component reflow working unit 6 shows it in FIG. So that each chip component 5
The tape-shaped substrate 11 on which No. 1 is mounted is sucked and held by the stage 63 by being sucked by the suction holes 63 a of the stage 63.

Next, the cream solder 4 printed on each electrode 14a of each chip component joint portion 14 of each circuit pattern 12 on the tape-shaped substrate 11 on which each chip component 51 is mounted.
4 is melted by using a heat source 61 such as a light beam or a heater, and is cooled and solidified, so that each electrode 51a of the chip component 51 and each chip component bonding portion 14 of each circuit pattern 12 on the tape-shaped substrate 11 are bonded. Each electrode 14a is joined. Then, the adsorption of the tape-shaped substrate 11 on the stage 63 is released.

At this time, the IC chip 31 already mounted on each circuit pattern 12 on the tape-shaped substrate 11
In order to prevent the heat from the heat source 61 from being applied to the IC chip 31 and to deteriorate the bonding quality between the IC chip 31 and the tape-shaped substrate 11, it is possible to cover the entire upper surface of the IC chip 31 bonded on the circuit pattern 12. IC with the shield plate 62
The entire upper surface of the chip 31 is covered, and the IC chip 31 is heated by the heat source 6
It can also be shielded from the heat of 1.

Further, in order to prevent the tape-shaped substrate 11 heated by the heat source 61 from radiating heat, a space 63b is provided as an insulating layer between the tape-shaped substrate 11 and the upper surface of the stage 63.

Further, by cooling the heated tape-shaped substrate 11 and the mounted chip component 51 in the chip-component reflow working section by air blow or the like, distortion of the tape-shaped substrate 11 or the like due to heat can be reduced.

Finally, after each circuit pattern 12 of the tape-shaped substrate 11 is sent from the chip component reflow working unit 6 to the tape-shaped substrate winding working unit 7 of FIG. 3, in the tape-shaped substrate winding working unit 7, The tape-shaped substrate 11 cooled by air blow or the like is used as an IC chip 31 and a chip component 51.
With the tape mounted, the tape-shaped substrate winding motor 72
Reel 71 attached to the tape storage portion 7a using
Is intermittently wound around the reel 71 by intermittent rotation.

Here, when the tape-shaped substrate 11 on which the IC chip 31 and the chip component 51 are mounted is wound by the reel 71, the IC chip 31 and the chip component 51 may come into direct contact with the tape-shaped substrate 11. As shown in FIG. 11, a sheet-like embossed spacer 73 having an uneven portion capable of protecting the IC chip 31 and the chip component 51 is sandwiched between the tape-shaped substrate 11 and the tape-shaped substrate 11 before being wound up. After protection, the tape-shaped substrate 11 is wound on the reel 71.

When mounting the chip component 51, instead of the solder reflow soldering method described above, a conductive resin or a metal is used as a bonding material, and heating and pressurization are performed, as in the IC chip 31 mounting method. You may implement by applying.

Further, in the tape-shaped substrate winding operation section 7, with the IC chip 31 and the chip component 51 mounted, instead of winding the tape-shaped substrate 11 on the reel 71, the IC chip 31 and the chip component are replaced. Each circuit pattern 1 on the tape-shaped substrate 11 with 51 mounted
2 may be punched from the tape-shaped substrate 11 and the individually punched circuit patterns 12 may be taken out as trays to a tray or the like.

Next, a control system of the mounting apparatus 101 for performing a series of each work in each work section will be described. FIG. 12 is a control system diagram of the mounting apparatus 101. The operation of the tape-shaped substrate rewinding motor 16 and the winding motor 72 is controlled by the mounting apparatus main control unit.
Further, each working unit from the IC chip pre-mounting working unit 2 to the chip component reflow working unit 6 has a sub-control unit for each working unit, and each sub-control unit causes each motor in each working unit to operate. The operation of the non-control unit such as is controlled. Further, all of these sub-control units are associated with each other so that they can be centrally monitored and controlled by the main control unit.

The main controller of the mounting apparatus controls the feeding of the tape-shaped substrate 11, and the tape-shaped substrate 11 is used in each of the working units from the IC chip pre-mounting working unit 2 to the chip component reflow working unit 6. When each of the circuit patterns 12 is subjected to each predetermined work in the working section and the suction-fixing of the tape-shaped substrate 11 onto each stage is released in each of the working sections, each sub-control section causes the main control section to The release signal of each working unit is sent to the main control unit, and the main control unit receives each release signal of all the working units from each sub control unit. After that, a rotation operation signal is sent from the main control unit to the tape-shaped substrate rewinding motor 16 and the winding motor 72, and the tape-shaped substrate rewinding motor 16 and the winding motor 72 rotate, thereby The circuit patterns 12 on the substrate 11 are sent at the pitch P. Therefore, in each working unit, the tape-shaped substrate 11 is sucked and fixed, one circuit pattern 12 on the tape-shaped substrate 11 is subjected to a predetermined work in the working unit, and the tape-shaped substrate 11 is applied in all working units. After the suction and fixation of No. 1 are released, the circuit pattern 12 that has been subjected to the work in the working section is sent to the next working section at the pitch P, and the work in the working section is performed in each working section. The circuit pattern 12 which is not provided is supplied.

In addition, the tape-shaped substrate 1 is provided in each of the working sections.
When a trouble occurs in which the suction fixation on each stage of No. 1 cannot be released, the suction control release signal is not sent from the sub-control unit of the working unit to the main control unit. It is also possible to put the tape-shaped substrate 11 in a standby state and issue a trouble alarm or the like to the main control unit if necessary.

Further, since it is necessary to accurately recognize the component mounting positions of the circuit patterns 12 continuously formed on the tape-shaped circuit board 11 in each working unit, the component mounting of each circuit pattern 12 is performed. Each working unit has a mounting position recognition unit that recognizes the mounting position of each component by directly recognizing the position or by utilizing the partial shape of each circuit pattern 12 and recognizing the shape. .

Further, when the defective circuit pattern is included in the circuit pattern 12 on the tape-shaped substrate 11, the defective circuit pattern is used by each working unit based on the mapping data of each circuit pattern 12 on the tape-shaped substrate 11. It is possible to skip.

Further, the interval between the working parts from the IC chip pre-mounting working part 2 to the chip component reflow working part 6 is varied by data control to a multiple of the pitch P of each circuit pattern 12 of the tape-shaped substrate 11. By doing so, it becomes possible to deal with various circuit pattern shapes.

Next, the tape substrate 11 is mounted on the mounting apparatus 101.
The intermittent feeding stop time t of the tape-shaped substrate 11 in the case of the processing will be described. The time required for each work in each work unit from the IC chip pre-mounting work unit 2 to the chip component reflow work unit 6 is t _{2 for} the IC chip pre-mounting work unit ₂ , the IC chip mounting work unit in the IC chip mounting work unit 3 3a is t _3a , the IC chip main pressure bonding working unit 3b is t _3b , the chip component pre-mounting working unit 4 is t ₄ , the chip component mounting working unit 5 is t ₅ , and the chip component reflow working unit 6 is t ₆ . Then, the intermittent feeding stop time t of the tape-shaped substrate 11 needs to be equal to or greater than the maximum value t _max of the times t _{2 to} t ₆ required for each work in each working unit, and is determined by the maximum value t _max. The Rukoto.

Further, in the IC chip main pressure bonding work section 3b and the chip part reflow work section 6, heating time is required to mount the IC chip 31 and the chip part 51 on each circuit pattern 12, so that the IC chip book Crimping work part 3
b or the time t _3b or t ₆ required for each work in the chip component reflow working unit 6 becomes the maximum value t _max of the times t _{2 to} t ₆ required for each work in each working unit in many cases. When there are many chip components 51 to be mounted in the component mounting work unit 5, the time t ₅ required for the work in the chip component mounting work unit ₅ is I
C chips to the crimping portion 3b and a chip component reflow work unit 6 delivers greater than the time t _3b and t ₆ required for each task, the time t ₂ ~ required for each operation in each working unit
There are cases where the maximum value t _{max of} t ₆ is reached. In such a case, the time t ₂ required for each work in each work unit
By dividing the work process into two or the like in the work unit corresponding to the maximum value t _max of t _6, the time required for the work in the work unit is similarly divided and becomes small, and the work process is divided. The maximum value t _max1 of the time t _{2 to} t ₆ required for each work in each subsequent work unit is required for each work in each work unit including the time required for the work in the work unit after the work process is divided. It is the maximum working time of the time. Therefore, the maximum value t
_max1 can be smaller than the maximum value t _max ,
It is possible to shorten the intermittent feeding stop time t of the tape-shaped substrate 11.

In addition, the electronic component mounting apparatus 101 is configured in the order of each working unit from the IC chip pre-mounting working unit 2 to the chip component reflow working unit 6, and mounts the chip component 51 after the IC chip 31 is mounted. However, each working unit may be configured such that the IC chip 31 is mounted after the chip component 51 is mounted.

In this embodiment, the method of mounting electronic components on the tape-shaped substrate 11 in which the same circuit patterns 12 are continuously formed with a constant pitch P has been described. Circuit pattern 1
If 2 are continuously formed with a constant pitch P, the circuit patterns 12 may not be the same but may be slightly different.

According to the first embodiment described above, the following effects can be obtained.

Conventionally, a buffer unit for the substrate is provided for each working unit in the mounting apparatus, the substrates processed in each working unit are sent to each buffer unit, and after a certain number of substrates are accumulated in each buffer unit. The substrates processed in a certain quantity unit were sent to the next working unit. However, using the tape-shaped substrate 11 in which the same circuit patterns 12 are formed so as to be continuous at a pitch P of a constant interval, the tape-shaped substrate 11 is supplied to each working unit of the mounting apparatus 101,
Performing a predetermined work on the tape-shaped substrate 11 in each work unit, winding the tape-shaped substrate 11 on which the work has been performed, and synchronizing the supply work and the winding work of the tape-shaped substrate 11 and performing them intermittently. As a result, one tape-shaped substrate 11 is passed through and the tape-shaped substrate 11 is intermittently fed between the working units adjacent to each other from the supply to the winding of the tape-shaped substrate 11.

Further, by intermittently sending one tape-shaped substrate 11 to the adjacent working units, one circuit pattern 12 on the tape-shaped substrate 11 is subjected to a predetermined work in each working unit. Circuit pattern 1 for each work
2 is sent to the next working unit with the pitch P. At the same time, the circuit pattern 12 not supplied with the work is supplied to each work unit. Therefore, in each work unit, each predetermined work is intermittently repeated, so that the buffer unit of the substrate is not required, and the size of the mounting apparatus can be reduced.

In addition, in the conventional mounting apparatus for electronic parts in the case of starting the substrate feeding to the mounting apparatus,
In each working unit in the mounting equipment, after all the boards of a certain quantity unit have been mounted with electronic components, they are ejected from each working section and the boards are sent to the next working section in a certain quantity unit together. In the next working section, there was a substrate processing waiting state, and there was a time loss in substrate feeding. However, the tape-shaped substrate 11 in which the same circuit pattern 12 is formed so as to be continuous is used, and the tape-shaped substrate 11 is supplied to the mounting apparatus 101 so that one circuit pattern 12 is subjected to a predetermined work in each working unit. Each time the work is performed, the worked circuit pattern 12 is sent to the next work unit at the pitch P. At the same time, the circuit pattern 12 not supplied with the work is supplied to each work unit. Therefore, in each working unit, it is possible to intermittently and repeatedly perform the respective predetermined works on the board, the time loss of the board feeding can be shortened, and the mounting cost can be reduced. Furthermore, it is possible to increase the operating rate in each working unit and increase productivity.

Further, in the conventional mounting method of electronic parts using the individual substrate, the individual substrate is sent to each working unit,
It was difficult to make the feeding position of each piece of the substrate constant in each working unit because a predetermined work in the working unit was performed, the substrate was discharged from the working unit, and these works were repeated. . However, since the circuit patterns 12 are formed on the tape-shaped substrate 11 so as to be continuous at the constant pitch P, each circuit pattern 12 is preliminarily positioned on the tape-shaped substrate 11. By feeding the tape-shaped substrate 11 of the book at the pitch P, the feeding position of each circuit pattern 12 in each working unit can be made more constant, so that the working efficiency can be improved.

The mounting apparatus 101 includes a mounting apparatus main control section for controlling the operation of the tape-shaped substrate rewinding motor 16 and the winding motor 72, and the IC chip pre-mounting section 2 to the chip component reflow working section 6. Each work unit has a sub-control unit that controls the operation of the non-control unit such as each motor in each work unit, and all of these sub-control units can be centrally monitored and controlled by the main control unit. Associated with. As a result, the pre-IC chip mounting work unit 2
After the tape-shaped substrate is sucked and fixed in each working unit from the chip component reflow working unit 6, the tape-shaped substrate 1
When each of the circuit patterns 12 of No. 1 is subjected to each predetermined work in the working unit, and the suction-fixing of the tape-shaped substrate 11 onto each stage is released in each working unit, main control is performed from each sub-control unit. The release signal of each working unit is sent to the unit, and the main control unit receives the release signals of all the working units from each sub control unit. After that, a rotation operation signal is sent from the main control unit to the tape-shaped substrate rewinding motor 16 and the winding motor 72, and the tape-shaped substrate rewinding motor 16 and the winding motor 72 rotate, thereby Each circuit pattern 12 on the substrate 11
Will be sent with pitch P. Therefore, in each working unit, the tape-shaped substrate 11 is adsorbed and fixed, and one circuit pattern 12 on the tape-shaped substrate 11 is subjected to a predetermined work in the working unit, and the tape-shaped substrate 11 in all working units. After the suction and fixation of No. 1 are released, the circuit pattern 12 that has been subjected to the work in the working section is sent to the next working section at the pitch P, and the work in the working section is performed in each working section. Since the circuit pattern 12 which is not provided is supplied, the intermittent feeding operation control of the tape-shaped substrate 11 becomes possible.

Further, when a trouble occurs in which the suction-fixing of the tape-shaped substrate 11 on each stage cannot be released in each working unit, the suction-fixing is released from the sub-control unit of the working unit. Since the signal is not sent to the main control unit, the main control unit can put the tape-shaped substrate 11 in a standby state and issue a trouble alarm or the like to the main control unit as needed, so The operation of feeding the tape-shaped substrate 11 can be managed, and the management efficiency of the mounting work can be improved.

Further, conventionally, in a mounting apparatus, in order to cope with boards of various shapes, it is necessary to enlarge the buffer section of the board between the working sections or replace the buffer section according to the shape of the board. was there. However, depending on the pitch P of each circuit pattern 12 on the tape-shaped substrate 11,
By varying the interval between the respective working units from the IC chip pre-mounting working unit 2 to the chip component reflow working unit 6 to a multiple of the pitch P by data control, various circuits can be adjusted only by adjusting data control settings. It becomes possible to correspond to the shape of the pattern 12.

In the chip component reflow working unit 6, the chip component 51 is mounted on each circuit pattern 12 by heating with the heat source 61 on each circuit pattern 12 of the tape-shaped substrate 11 on which the IC chip 31 is already mounted. In such a case, by covering the entire upper surface of the IC chip 31 mounted on each circuit pattern 12 with the shield plate 62, the IC chip 31 is shielded from the heat from the heat source 61 and the IC chip 31 The chip component 51 can be mounted without deteriorating the joining quality.

In the chip component reflow working unit 6, after the chip component 51 is mounted on the tape substrate 11 by melting the cream solder 44, the tape substrate 11 which retains heat is cooled by air blow or the like. By winding the tape-shaped substrate 11 in the tape-shaped substrate winding operation unit 7 while reducing the distortion of the tape-shaped substrate 11 due to heat, the tape-shaped substrate 11 is distorted in the tape-shaped substrate winding operation unit 7. The roll is wound in a state in which the amount is reduced, and the roll can be smoothly wound.

Further, in the tape-shaped substrate winding operation section 7, before the tape-shaped substrate 11 on which the IC chip 31 and the chip component 51 are mounted is wound up, the IC chip 31 and the chip component 51 can be protected so that they are uneven. After the IC chip 31 and the chip component 51 are covered and protected by a sheet-shaped embossed spacer 73 having a portion, the tape-shaped substrate 11 is wound on the reel 71 together with the spacer 73, so that the tape-shaped substrate 11 is wound on the reel 71. Since the IC chip 31 and the chip component 51 do not come into direct contact with the tape-shaped substrate 11 when the IC chip 31 and the chip component 51 are mounted, it is possible to prevent displacement of the mounting position of the IC chip 31 and the chip component 51. It is possible to prevent deterioration of the joining quality of the component 51.

The tape-shaped substrate 11 includes a pair of guide rollers 17a and 17b provided along the feeding direction of the tape-shaped substrate 11 between the tape-shaped substrate supply working unit 1 and the tape-shaped substrate winding working unit 7. Tension roller 18 between
By providing, the tape-shaped substrate 11 is always in a state in which a constant tension is applied. Therefore, the tape-shaped substrate 11 can be sent from the tape-shaped substrate supply work unit 1 to the tape-shaped substrate winding work unit 7 without slack, and it is possible to prevent solder collapse, displacement of electronic component mounting position, and the like.

Further, the intermittent feeding stop time t of the tape-shaped substrate 11 is the time t _{2 to} t ₆ required for each work in each working unit from the IC chip pre-mounting working unit 2 to the chip component reflow working unit _{6. Is} greater than or equal to the maximum value t _max, and is determined by the maximum value t _max . Therefore, the maximum value t of the times t _{2 to} t ₆ required for each work in each working unit
By dividing the work process into a plurality of work units corresponding to _max , the time required for the work in the work unit is also divided and reduced, and each work in each work unit after the work process division is divided. Time t
The maximum value t _max1 of _{2 to} t _{6 is} the maximum work time of the time required for each work in each work unit, including the time required for the work in the work unit after the work process is divided. Therefore, the maximum value t _max1 is the maximum value t
It is possible to make it smaller than _max , and it is possible to shorten the intermittent feeding stop time t of the tape-shaped substrate 11 and reduce the mounting cost.

The present invention is not limited to the above embodiment, but can be implemented in various other modes. An electronic component mounting apparatus using a method for mounting electronic components on a tape-shaped substrate according to a second embodiment of the present invention is a tape-shaped substrate 1
In the case where a large number or various types of electronic components such as the IC chip 31 and the chip component 51 are mounted on each circuit pattern 12 of No. 1, each of the IC chip pre-working unit 2 to the chip component reflow working unit 6 It is an electronic component mounting apparatus in which the number of units of the working unit is increased. Here, the unit means a single working unit in each working unit for mounting each electronic component on the tape-shaped substrate 11.

For example, when a large number of IC chips 31 need to be mounted on the tape-shaped substrate 11, I
Among the respective working units from the C chip pre-mounting work unit 2 to the chip component reflow working unit 6, the IC chip pre-mounting work unit 2 and I
The number of working unit units of the C-chip mounting working unit 3 is made plural, and the bonding material 21 is applied and supplied step by step in each working unit unit of the plural-unit pre-IC chip mounting working unit 2, By mounting the IC chips 31 in stages in each of the working unit units of the IC chip mounting working unit that is made into a plurality of units, it is possible to mount the large number of IC chips 31 on the tape-shaped substrate 11.

According to the second embodiment, since the number of units of each working unit from the IC chip pre-mounting working unit 2 to the chip component reflow working unit 6 is increased, one working unit in each working unit is increased. For a large number or many types of electronic components that cannot be mounted by a unit, each electronic component is divided into multiple units according to the number and type of electronic components to be mounted. Since it is possible to perform the mounting work of, for example, in the case of mounting a large number or various kinds of electronic components such as the IC chip 31 and the chip component 51 on each circuit pattern 12 of the tape-shaped substrate 11, a plurality of electronic components can be mounted. One work can be simultaneously performed on the circuit pattern 12 by one working unit that is made into a plurality of units, and each circuit pattern 1
When there are a plurality of parts in which the same work is performed, the same work of each circuit pattern 12 is performed in the work part of each unit in a plurality of unitized work parts. It is possible to sequentially perform the work on the part to be mounted, and it is possible to cope with the tape-shaped substrate 11 on which a large number or many kinds of electronic components are mounted by this electronic component mounting apparatus. .

By properly combining the arbitrary embodiments of the aforementioned various embodiments, the effects possessed by them can be produced.

[0087]

According to the first aspect of the present invention, it is possible to reduce the time loss of substrate feeding and reduce the mounting cost, and further increase the operating rate of the mounting apparatus and improve the productivity. It is possible to raise it.

In the conventional electronic component mounting method, individual boards are grouped into a fixed quantity unit at a place where a plurality of electronic components are mounted, and one of the fixed quantity units is used. The above-mentioned boards are sent one by one, the above-mentioned electronic parts are mounted on the above-mentioned boards, and the above-mentioned boards on which the above-mentioned mounting operations have been carried out are collectively sent out in a fixed quantity unit and the above-mentioned mounting work is carried out. These operations were repeated, in which the above-mentioned other substrates, which were not provided, were collected in a certain quantity unit and supplied again. Therefore, there was a time loss in substrate feeding in the work of supplying the individual substrates together and the work of taking them out together.

However, in the electronic component mounting method according to the first aspect of the present invention, the tape-shaped substrate formed so that the circuit patterns are continuous at a constant pitch is used, and the one tape-shaped substrate is used. The circuit board is intermittently fed, and when the intermittent feeding of the tape-shaped substrate is stopped, the electronic components are mounted on the circuit patterns of the tape-shaped substrate, whereby one circuit on the tape-shaped substrate is mounted. Every time the mounting work of each electronic component is performed on the pattern, at the place where the mounting work of each electronic component is performed, the one circuit pattern subjected to the mounting work is sent out at a constant pitch. However, another circuit pattern that has not been subjected to the mounting work is supplied at a constant pitch, and these works are repeated. It made.

Therefore, it is possible to eliminate the work of assembling the boards into a fixed number of units, reduce the time loss of board feeding, and reduce the mounting cost. Furthermore, the operating rate of the mounting apparatus can be increased, and the productivity can be increased.

Further, in the conventional electronic component mounting method, since the individual boards are sent to the place where the mounting work of each electronic component is performed, the mounting work of each electronic component is performed. There is also a problem in that it is difficult to make the feeding position of each of the above-mentioned individual substrates constant in place. However, since the circuit patterns are formed on the tape-shaped substrate so as to be continuous with a constant pitch, the circuit patterns are preliminarily positioned on the tape-shaped substrate. By feeding the tape-shaped substrate at a constant pitch, it is possible to make the feeding position of each of the circuit patterns more constant at the place where the mounting work of each of the electronic components is performed, thereby improving work efficiency. It is possible to raise it.

According to the second aspect of the present invention, it is possible to reduce the time loss of substrate feeding and reduce the mounting cost, and further increase the operating rate of the mounting apparatus and increase the productivity. Is possible.

In the conventional mounting method of electronic parts when starting the board feeding, in each work step, after the mounting work of each electronic part is performed on all the boards of a certain quantity unit, the above-mentioned respective work is performed. In the next work step, the board is in the work waiting state until it is ejected from the process and sent to the next work step in a fixed quantity unit and the boards are sent. was there.

However, in the method of mounting an electronic component according to the second aspect of the present invention, the tape-like substrate formed so that the circuit patterns are continuous at a constant pitch is used. The tape-shaped substrate is intermittently fed, and when the intermittent feeding of the tape-shaped substrate is stopped, the electronic components are mounted on the circuit patterns of the tape-shaped substrate, so that 1 Every time a predetermined work is performed on each of the one circuit pattern in each of the work steps, the circuit pattern on which the work is performed is sent to the next work step with a constant pitch, The other one circuit pattern which has not been subjected to the work in the work step is supplied, and these works are repeated.

Therefore, in each of the above work steps, it is possible to eliminate the work of assembling the boards into a certain number of units, reduce the time loss in feeding the boards, and reduce the mounting cost. . Further, it is possible to increase the operation rate in each work process and increase the productivity.

Further, in the conventional mounting method of electronic parts, since the individual boards are sent to the individual mounting work steps of the respective electronic parts, the individual board parts of the individual boards are sent in the respective working steps. There is also a problem that it is difficult to make the feed position constant. However, since the circuit patterns are formed on the tape-shaped substrate so as to be continuous with a constant pitch, the circuit patterns are preliminarily positioned on the tape-shaped substrate. By feeding the tape-shaped substrate of the book at a constant interval pitch, the feeding position of each of the circuit patterns can be made more constant in each of the working steps, so that the working efficiency can be improved.

According to the third to tenth aspects of the present invention,
Since various mounting methods of the conventionally used IC chip or chip component on the substrate can be applied to each of the above-mentioned work steps even in the mounting method of the electronic component on the tape-shaped substrate according to the present invention, It is possible to provide a mounting method of electronic parts having high versatility.

According to the eleventh aspect of the present invention, the buffer portion of the substrate can be eliminated, the size of the mounting apparatus can be reduced, and the time loss of substrate feeding can be shortened. It is possible to reduce the mounting cost, and further, it is possible to increase the operating rate of the mounting apparatus and improve the productivity.

In the conventional mounting apparatus for electronic parts, a buffer section for the board is provided in the mounting apparatus, and in the mounting working section for mounting a plurality of electronic parts, individual boards are used in the buffer section in a fixed quantity unit. Collected, the substrates are supplied to the mounting operation unit one by one from the fixed quantity unit of the buffer unit, the mounting work of each electronic component is performed on each substrate, and the mounting work is performed. It is said that each of the above-mentioned substrates is collectively sent out in a fixed quantity unit in the buffer unit, and another substrate not subjected to the mounting work is collected in a constant quantity unit and supplied again to the buffer unit. These operations were repeated. Therefore, the above-mentioned buffer portion is required for collecting the individual substrates, and further, there is a time loss in feeding the substrates in the operation of collectively supplying the individual substrates and the operation of extracting the individual substrates.

However, in the electronic component mounting apparatus according to the eleventh aspect of the present invention, a tape-shaped substrate formed so that the circuit patterns are continuous with a constant pitch is used. Is intermittently sent to the electronic component mounting work unit, and when the intermittent feeding of the tape-shaped substrate is stopped, the electronic component mounting work unit mounts the electronic components on the circuit patterns of the tape-shaped substrate. By doing so, every time the mounting work of each electronic component is performed on one circuit pattern on the tape-shaped substrate, the one mounting circuit pattern is subjected to the mounting work in the electronic component mounting work section. Is sent out at a fixed pitch, but the other mounting work is not performed.
One circuit pattern is supplied with a pitch of a constant interval, and these operations are repeated.

Therefore, it is possible to eliminate the work of assembling the substrates into a fixed quantity unit, and to eliminate the need for the buffer portion of the substrate for assembling the boards into a fixed quantity unit. Therefore, it is possible to reduce the size of the mounting apparatus, reduce the time loss of substrate feeding, and reduce the mounting cost. Furthermore, the operating rate of the mounting apparatus can be increased, and the productivity can be increased.

Further, in the conventional electronic component mounting apparatus, since the individual substrate is sent to the electronic component mounting working unit, the electronic component mounting working unit
There is also a problem that it is difficult to make the feeding position of the substrate of each of the above pieces constant. However, since the circuit patterns are formed on the tape-shaped substrate so as to be continuous with a constant pitch, the circuit patterns are preliminarily positioned on the tape-shaped substrate. By feeding the tape-shaped substrate at a constant pitch, the feeding position of each of the circuit patterns can be made more constant in the electronic component mounting work section, so that the work efficiency can be improved. .

According to the twelfth aspect of the present invention, the buffer portion of the substrate can be eliminated, the size of the mounting apparatus can be reduced, and the time loss of substrate feeding can be shortened. It is possible to reduce the mounting cost, and further, it is possible to increase the operating rate of the mounting apparatus and improve the productivity.

In the conventional electronic component mounting apparatus, a buffer section for the board is provided for each working section, and the board processed in each working section is sent to each of the above-mentioned buffer sections, and a fixed quantity unit is used for each buffer section. After the substrates were accumulated, the substrates processed in a fixed quantity unit were sent to the next working unit. Therefore, it is necessary to have a buffer part for collecting the individual boards, and further, after the electronic parts are mounted on the individual boards, the electronic parts are discharged from the respective working parts, and the next work described above is performed. Until the substrates are sent in a fixed quantity unit to a unit and sent to the next working unit, the substrates are in a work waiting state, and there is a time loss in feeding the substrates.

However, in the electronic component mounting apparatus according to the twelfth aspect of the present invention, the tape-shaped substrate formed so that the circuit patterns are continuous with a pitch of a constant interval is used. The tape-shaped substrate is intermittently sent to each working unit, and when the intermittent feeding of the tape-shaped substrate is stopped, the electronic components are mounted on the circuit patterns of the tape-shaped substrate in each working unit. Thus, each time one circuit pattern on the tape-shaped substrate is subjected to a predetermined work in each working unit, the circuit pattern subjected to the work is transferred to the next working unit with a constant interval pitch. While being sent, each of the working sections is supplied with another one of the circuit patterns which has not been worked by the working section, and these steps are repeated. It made.

Therefore, it is possible to eliminate the work of assembling the substrates in a fixed quantity unit, and it is possible to eliminate the above-mentioned buffer section of the substrate for assembling the boards in a fixed quantity unit in each of the working sections. Therefore, it is possible to reduce the size of the mounting apparatus, reduce the time loss of substrate feeding, and reduce the mounting cost. Furthermore, the operating rate of the mounting apparatus can be increased, and the productivity can be increased.

Further, in the conventional electronic component mounting apparatus, since the individual boards are sent to the respective mounting work parts of the respective electronic parts, the individual work boards of the individual parts are transferred in the respective work parts. There is also a problem that it is difficult to make the feed position constant. However, since the circuit patterns are formed on the tape-shaped substrate so as to be continuous with a constant pitch, the circuit patterns are preliminarily positioned on the tape-shaped substrate. By sending the tape-shaped substrate of the book at a constant pitch, it is possible to make the feeding position of each of the circuit patterns more constant in each of the working sections, so that the working efficiency can be improved.

According to the thirteenth aspect of the present invention, supply and winding of the tape-shaped substrate can be performed by rewinding and winding of the reel, and the tape-shaped substrate supply section and the tape-shaped substrate winding. It is possible to start the supply work and the winding work of the tape-shaped substrate by simply attaching and detaching the reel to and from the unit, which makes it possible to reduce the size of the mounting device and facilitate the supply and winding work of the tape-shaped substrate. It becomes possible to do it.

According to the fourteenth aspect of the present invention, conventionally, in the mounting apparatus, in order to cope with substrates having various shapes, the buffer portion of the substrate between the working units is made large, or It was necessary to replace the buffer part according to the shape. However, according to the pitch of the circuit patterns on the tape-shaped substrate, the interval between the working parts from the IC chip pre-mounting working part to the chip component reflow working part is changed to a multiple of the pitch by data control. Therefore, it is possible to deal with various shapes of the circuit patterns only by adjusting the settings of the data control.

According to the fifteenth aspect of the present invention, in the tape-shaped substrate winding operation section, each electronic component can be protected before the tape-shaped substrate on which each electronic component is mounted is wound. After covering and protecting each of the electronic components with a sheet-like embossed spacer having an uneven portion, by winding the tape-shaped substrate together with the spacer on a reel, when the tape-shaped substrate is wound on the reel, Since the electronic components do not come into direct contact with the tape-shaped substrate, it is possible to prevent mounting position deviations of the electronic components, etc., and prevent deterioration of the joining quality of the electronic components. Becomes

According to the sixteenth aspect of the present invention, in the chip component reflow working unit, after the chip component is indirectly mounted on the tape-shaped substrate by melting of the cream solder, the tape is kept heat-retained. When the tape-shaped substrate is cooled by air blow or the like to reduce the distortion of the tape-shaped substrate due to heat, the tape-shaped substrate winding operation unit winds the tape-shaped substrate winding operation unit to remove the tape-shaped substrate winding operation unit. In the above, the tape-shaped substrate is wound in a state with less distortion, and it is possible to wind it smoothly.

[Brief description of drawings]

FIG. 1 is an overall plan view of an apparatus for mounting electronic components on a tape-shaped substrate according to a first embodiment of the present invention.

2A is a partially enlarged plan view of a mounting apparatus for mounting electronic components on a tape-shaped substrate in FIG. 1, and FIG. 2B is a side view of a tape-shaped substrate supply working unit.

FIG. 3 is a partially enlarged plan view of a device for mounting electronic components on the tape-shaped substrate in FIG.

FIG. 4 is a partial plan view of the tape-shaped substrate used in the method of mounting electronic components on the tape-shaped substrate according to the first embodiment of the present invention.

FIG. 5 is a diagram showing a working method in a pre-IC chip mounting working unit of the mounting method of the electronic component on the tape-shaped substrate according to the first embodiment of the present invention, and (a) and (b) are bonding materials. Is a cross-sectional view of the heating / pressurizing tool and the bonding material and the tape-shaped substrate, (d) is a cross-sectional view of the bonding material adhered to the tape-shaped substrate, and (e) is a paste-shaped substrate. FIG. 3 is a perspective view showing a state in which the bonding material of FIG.

FIG. 6 is a diagram showing a working method in the IC chip mounting working part of the method for mounting electronic components on the tape-shaped substrate according to the first embodiment of the present invention, in which (a) is a sectional view of the IC chip; b) and (c) are I with a heating / pressurizing tool
Sectional drawing of a state where the C-chip is temporarily pressure-bonded to the tape-shaped substrate,
(D) is a sectional view showing a state in which the IC chip is temporarily pressure-bonded to the tape-shaped substrate.

FIG. 7 is a diagram showing a working method in the IC chip main pressure bonding working part of the mounting method of the electronic component on the tape-shaped substrate according to the first embodiment of the present invention, and FIG. A cross-sectional view, (b) is a cross-sectional view of a state in which an IC chip is permanently pressure-bonded to a tape-shaped substrate by a heating / pressurizing tool,
(C) is a cross-sectional view showing a state where the IC chip is main-press-bonded to the tape-shaped substrate, and (d) is a state where the IC chip is main-press-bonded to the tape-shaped substrate when an anisotropic conductive film is used as a bonding material. FIG.

FIG. 8 is a diagram showing a working method in a pre-chip component mounting working part of a mounting method of electronic components on a tape-shaped substrate according to the first embodiment of the present invention, in which cream solder is supplied onto the tape-shaped substrate. FIG.

FIG. 9 is a diagram showing a working method in the chip component mounting work part of the mounting method of the electronic component on the tape-shaped substrate according to the first embodiment of the present invention, in which the chip component is mounted on the tape-shaped substrate. It is sectional drawing of a state.

FIG. 10 is a diagram showing a working method in the chip component reflow working unit of the method for mounting electronic components on the tape-shaped substrate according to the first embodiment of the present invention, in which the solder is reflowed to the tape-shaped substrate to form the chip. It is sectional drawing of the state which has joined the components.

FIG. 11 is a cross-sectional view showing a state where the tape-shaped substrate on which the electronic component is mounted in the method for mounting the electronic component on the tape-shaped substrate according to the first embodiment of the present invention is protected by the embossed spacer.

FIG. 12 is a control system diagram in the electronic component mounting apparatus for a tape-shaped substrate according to the first embodiment of the present invention.

[Explanation of symbols]

DESCRIPTION OF SYMBOLS 1 ... Tape-shaped substrate supply working unit, 1a ... Reel supply unit, 2
IC chip mounting work unit, 3 ... IC chip mounting work unit, 3a ... IC chip mounting work unit, 3b ... IC chip main pressure bonding work unit, 4 ... Chip component mounting work unit, 5 ... Chip component mounting work unit, 6 ... Chip part reflow work section,
7 ... Tape-shaped substrate winding work section, 7a ... Tape storage section, 1
DESCRIPTION OF SYMBOLS 1 ... Tape-shaped substrate, 12 ... Circuit pattern, 13 ... IC chip joint part, 13a ... IC chip joint part electrode, 14 ...
Chip component joint portion, 14a ... Electrode of chip component joint portion,
15 ... Reel, 16 ... Tape-like substrate rewinding motor, 1
7a ... Guide roller, 17b ... Guide roller, 18 ... Tension roller, 20 ... Stage, 21 ... Joining material,
21a ... Conductive particles, 22 ... Protective sheet, 23 ... Sheet material supply section, 23a ... Reel, 23b ... Sheet material rewinding motor, 23c ... Cutting section, 24 ... Heating / pressurizing tool,
25 ... Paste-like bonding material, 26 ... Dispenser, 2
7 ... Suction part, 30a ... Stage, 30b ... Stage, 3
1 ... IC chip, 31a ... IC chip electrode, 31b ...
Bumps, 32 ... parts tray, 33 ... reversing unit, 33a ... Y direction moving motor of reversing unit, 33b ... reversing motor of reversing unit, 33c ... X direction moving motor of reversing unit, 3
4 ... tool, 34a ... tool Y-direction movement motor,
35 ... Heating / pressurizing tool, 35a ... Motor for moving heating / pressurizing tool in X direction, 35b ... Y of heating / pressurizing tool
Directional movement motor, 36 ... Protective sheet, 41 ... Solder supply section, 42 ... Stage, 42a ... Adsorption hole, 43 ... Metal mask, 43a ... Solder supply opening, 44 ... Cream solder, 45 ... Squeegee, 45a ... Squeegee Motor for moving in X direction, 45b ... motor for moving in squeegee in Y direction,
51 ... Chip component, 51a ... Chip component electrode, 52 ...
Parts cassette, 53 ... Head, 54 ... Suction nozzle, 5
5 ... Stage, 55a ... Adsorption hole, 61 ... Heat source, 62 ... Shielding plate, 63 ... Stage, 63a ... Adsorption hole, 63b ... Void portion, 71 ... Reel, 72 ... Tape-shaped substrate winding motor, 73 ... Embossed shape spacer 101 ... electronic component mounting apparatus, P ... pitch, t ... intermittent feeding of downtime of the tape substrate, the time required for the work of t 2 _... IC chip mounting front working unit, t _{3a ...} IC chip mounting operations unit time required for the work, the time required for the work of t _{3b ...} IC chip main bonding working portion, t 4 _... time required for working of the chip component mounting front working unit, t 5 _... time required for working of the chip component mounting work unit, t ₆ ... time required for work of the chip part reflow working unit, t _max ... maximum value of time required for each work of each working unit, t _max1 ... time required for each work of each working unit after work process division Maximum value of.

   ─────────────────────────────────────────────────── ─── Continued front page    F-term (reference) 5E313 AA03 AA12 AA15 AA23 CC03                       CC05 CD02 EE24 EE35 EE50                       FG01 FG05 FG06

Claims (16)

[Claims] 1. A tape-shaped substrate (11), on which a plurality of circuit patterns (12) capable of mounting a plurality of electronic components (31, 51) are continuously formed at regular intervals (P), The electronic components (31, 51) are mounted on the circuit patterns (12) of the tape substrate (11) when the tape substrate (11) is intermittently stopped. A method for mounting electronic components on a tape substrate. 2. The plurality of electronic parts (31, 51) are an IC chip (31) and a chip part (51), and each joint (1) of the IC chip (31) and the chip part (51).
3. A tape-shaped substrate (11) on which a plurality of circuit patterns (12) having a plurality of (3, 14) are continuously formed is intermittently fed to mount the IC chip (31) on the tape-shaped substrate (11). The IC chip (31) is mounted on the tape-shaped substrate (11) on which the IC chip mounting pre-processing is performed, and the tape on which the IC chip (31) is mounted The tape-like substrate () on which the chip component mounting pre-work for mounting the chip component (51) on the strip-shaped substrate (11) is performed, and the solder (44) is supplied by the chip-component mounting pre-work. 11) is mounted with the chip component (51), the solder (44) of the tape-shaped substrate (11) on which the chip component (51) is mounted is reflowed, and the tape-shaped substrate (11) is intermittently Na When stopping, the solder (44) of the tape-shaped substrate (11) on which the chip component (51) is mounted is removed from the pre-working step for mounting the IC chip (31) on the tape-shaped substrate (11). The tape according to claim 1, wherein in each of the different work steps up to the work step of reflowing, the work of each of the work steps is simultaneously performed on the different circuit patterns (12) of the tape-shaped substrate (11). Method for mounting electronic components on a printed circuit board. 3. A plurality of electrodes (31a) of the IC chip (31) in a work step of mounting the IC chip (31) on the tape-shaped substrate (11) on which the IC chip mounting work has been performed. The IC chip (31) having the bump (31b) formed on the
The bumps (31b) of the IC chip (31) correspond to the circuit patterns (12) of the tape-shaped substrate (11).
The bumps (31b) of the IC chip (31) are aligned so that they can be bonded to the plurality of electrodes (13a) above, and the electrodes (on the circuit patterns (12) of the tape-like substrate (11) ( The method for mounting electronic components on a tape-shaped substrate according to claim 2, wherein the IC chip (31) is bonded to the tape-shaped substrate (11a) and the IC chip (31) is mounted on the tape-shaped substrate (11). 4. A plurality of electrodes (31a) of the IC chip (31) in a work step of performing a pre-work for mounting the IC chip for mounting the IC chip (31) on the tape-shaped substrate (11). The IC chip (31) having the bump (31b) formed on the
The bumps (31b) of the IC chip (31) and the circuit patterns (12) of the tape-shaped substrate (11).
A bonding material (21, 2) capable of bonding the upper electrodes (13a)
As 5), a non-conductive resin sheet (21) or a resin paste (25) is supplied onto each circuit pattern (12) of the tape-shaped substrate (11), and the above-mentioned work before mounting the IC chip is performed. In the process of mounting the IC chip (31) on the tape-shaped substrate (11), the circuit patterns (1) on the tape-shaped substrate (11) are
2) The IC chip (31) is mounted via the non-conductive resin sheet (21) or the resin paste (25) which is the bonding material (21, 25) supplied onto the resin, Sheet (21) or the above resin paste (2
5) While heating, pressurizing the bumps (31b) of the IC chip (31) to the circuit patterns (12) of the tape-shaped substrate (11).
The resin sheet (21) or the resin paste (2) is directly bonded to each of the electrodes (13a) above.
The method for mounting an electronic component on a tape-shaped substrate according to claim 2, wherein the bonding is maintained by thermosetting 5). 5. A plurality of electrodes (31a) of the IC chip (31) in a work step of performing a pre-work for mounting the IC chip for mounting the IC chip (31) on the tape-shaped substrate (11). The IC chip (31) having the bump (31b) formed on the
The bumps (31b) of the IC chip (31) and the circuit patterns (12) of the tape-shaped substrate (11).
A bonding material (21, 2) capable of bonding the upper electrodes (13a)
As 5), a resin sheet or resin paste in which conductive particles (21a) are distributed, or a conductive resin sheet or resin paste is supplied onto each circuit pattern (12) of the tape-shaped substrate (11), and the above IC In the work step of mounting the IC chip (31) on the tape-shaped substrate (11) on which the chip mounting work has been performed, the circuit patterns (1) on the tape-shaped substrate (11) are
2) The IC chip through the resin sheet or the resin paste in which the conductive particles (21a) as the bonding material (21) supplied above are distributed, or the conductive resin sheet or resin paste. (31) is mounted, the resin sheet or the resin paste is heated and pressed, and the bumps (31b) of the IC chip (31) are connected to the circuit patterns (12) of the tape-shaped substrate (11). )
The conductive particles (21
The tape-like substrate according to claim 2, wherein the tape-shaped substrate is bonded indirectly via a) or the conductive resin sheet or resin paste, and the resin sheet or the resin paste is thermoset to maintain the bonding. Electronic component mounting method. 6. A plurality of electrodes (31a) of the IC chip (31) in a work step of performing a pre-work for mounting the IC chip for mounting the IC chip (31) on the tape-shaped substrate (11). The IC chip (31) having the bump (31b) formed on the
The bumps (31b) of the IC chip (31) and the circuit patterns (12) of the tape-shaped substrate (11).
A bonding material (21, 2) capable of bonding the upper electrodes (13a)
5) As a tape-shaped substrate (1), a metal which is a conductive material is used.
In the work step of mounting the IC chip (31) on the tape-shaped substrate (11) which has been supplied onto each circuit pattern (12) of (1) and has been subjected to the IC-chip mounting work, the tape-shaped substrate ( 11) Each circuit pattern (1
2) The IC chip (31) is mounted via the metal, which is the bonding material (21) supplied above, and the metal is heated and melted, and the bumps (31b) of the IC chip (31) are mounted. The circuit patterns (12) of the tape-shaped substrate (11)
The method for mounting an electronic component on a tape-shaped substrate according to claim 2, wherein the above-mentioned electrodes (13a) are indirectly bonded to each other via the metal, and the bonding is maintained by thermosetting the metal. 7. The plurality of electronic parts (31, 51) are an IC chip (31) and a chip part (51), and each joint (1) of the IC chip (31) and the chip part (51).
3. A tape-shaped substrate (11) on which a plurality of circuit patterns (12) each having a plurality of (3, 14) are continuously formed is intermittently sent, and a plurality of electrodes (31a) of the IC chip (31) are connected to the tape-shaped substrate. Each circuit pattern of (11) (12)
The electrodes (31a) of the IC chip (31) are aligned so that they can be bonded to the plurality of electrodes (13a) above, and the circuit patterns (12) of the tape-shaped substrate (11) are arranged.
Ultrasonic metal diffusion bonding is applied to the upper electrodes (13a), and the IC chip (3) is attached to the tape-shaped substrate (11).
1) is mounted on the tape-shaped substrate (11) on which the IC chip (31) is mounted, and a chip component mounting pre-operation for mounting the chip component (51) is performed. The chip component (51) is mounted on the tape-shaped substrate (11) to which the solder (44) has been supplied, and the solder of the tape-shaped substrate (11) on which the chip component (51) is mounted. (44) is reflowed, and at the time of intermittent feeding stop of the tape-shaped substrate (11), the chip component (51) is removed from the work process of mounting the IC chip (51) on the tape-shaped substrate (11). In each of the different work steps up to the work step of reflowing the solder (44) of the mounted tape-like board (11), on each of the circuit patterns (12) different in the tape-like board (11). The method of mounting an electronic component on a tape-shaped substrate according to claim 1, wherein the work of each of the work steps is performed simultaneously. 8. The plurality of electronic parts (31, 51) are an IC chip (31) and a chip part (51), and each joint (1) of the IC chip (31) and the chip part (51).
3. A tape-shaped substrate (11) on which a plurality of circuit patterns (12) having a plurality of (3, 14) are continuously formed is intermittently fed to mount the IC chip (31) on the tape-shaped substrate (11). The IC chip (31) is mounted on the tape-shaped substrate (11) on which the IC chip mounting pre-processing is performed, and the tape on which the IC chip (31) is mounted The chip component mounting pre-operation for mounting the chip component (51) on the strip substrate (11) is performed, and the chip component mounting pre-operation is performed to perform the bonding material (4
4) the tape-shaped substrate (11) is supplied with the plurality of electrodes (51a) of the chip component (51) and the plurality of electrodes (14a) on the circuit patterns (12) of the tape-shaped substrate (11). ) So that the electrodes (51a) of the chip part (51) can be bonded to the electrodes (14a) of the circuit patterns (12) of the tape-shaped substrate (11). The chip component (51) is mounted on the tape-shaped substrate (11) on which the IC chip (31) is mounted by bonding with the material (44), and the tape-shaped substrate (11) is intermittently mounted. When the feeding is stopped, the chip component (51) is attached to the tape-shaped substrate (11) on which the IC chip (31) is mounted from a pre-working step for mounting the IC chip (31) on the tape-shaped substrate (11). A) The tape according to claim 1, wherein in each of the different work steps up to the work step of mounting, the work of each of the work steps is performed simultaneously on each of the circuit patterns (12) on the different tape-shaped substrate (11). Method for mounting electronic components on a printed circuit board. 9. The bonding material (44) is a conductive resin, and the electrodes (51a) of the chip part (51) are connected to the circuit patterns (1) of the tape-like substrate (11).
2) The electrodes (51a) of the chip part (51) are aligned on the plurality of electrodes (14a) so as to be bonded to each other, and the electrodes (51a) of the chip part (51) are placed on the circuit patterns (12) of the tape-like substrate (11). While applying pressure to each electrode (14a) of the above, each electrode (51a) of the above chip component (51) is applied to each electrode (14a) on each circuit pattern (12) of the above tape-shaped substrate (11). The method of mounting an electronic component on a tape-shaped substrate according to claim 8, wherein the conductive resin is indirectly bonded via the conductive resin, and the bonding is maintained by thermosetting the conductive resin. 10. The bonding material (44) is a metal,
The electrodes (51a) of the chip part (51) are aligned so that they can be bonded to the plurality of electrodes (14a) on the circuit patterns (12) of the tape-shaped substrate (11), The electrodes (51a) of (51) are mounted on the electrodes (14a) of the circuit patterns (12) of the tape-shaped substrate (11) via the metal, and the metal is heated and melted to The electrodes (51a) of the chip part (51) are indirectly bonded to the plurality of electrodes (14a) on the circuit patterns (12) of the tape-shaped substrate (11) through the metal, The method for mounting an electronic component on a tape-shaped substrate according to claim 8, wherein the mounting is performed by maintaining the bonding by thermosetting. 11. A tape-shaped substrate (11), on which a plurality of circuit patterns (12) capable of mounting a plurality of electronic components (31, 51) are continuously formed at regular intervals (P). And a tape-shaped substrate supply working unit (1) capable of performing the above, and each of the tape-shaped substrate (11) when the intermittent feeding of the tape-shaped substrate (11) by the tape-shaped substrate supply working unit (1) is stopped. The electronic component mounting work unit (2, 3, 4, 5, 6) capable of mounting the electronic components (31, 51) on the circuit pattern (12) and the electronic components (31, 51) are mounted. A tape-shaped substrate winding operation unit (7) capable of intermittently winding the tape-shaped substrate (11) thus formed, and the tape-shaped substrate supply operation unit (1) and the tape-shaped substrate winding unit. The picking work section (7) simultaneously removes the tape-shaped substrate (11). A device for mounting electronic components on a tape-shaped substrate, which is capable of supplying and winding. 12. A plurality of electronic parts (31, 51) are integrated into an IC.
The chip (31) and the chip component (51), which are the above ICs
It is possible to intermittently feed a tape-shaped substrate (11) on which a plurality of circuit patterns (12) each having a bonding portion (13, 14) of a chip (31) and each of the chip components (51) are continuously formed. The tape-shaped substrate supply working unit (1), the IC chip (31) and the chip component (51) on each circuit pattern (12) of the tape-shaped substrate (11).
Electronic component mounting work unit (2, 3, 4, 5,
6) and a tape-shaped substrate winding operation section (7) capable of intermittently winding the tape-shaped substrate (11) on which the IC chip (31) and the chip component (51) are mounted. The electronic component mounting work section (2, 3, 4, 5, 6) can perform an IC chip mounting pre-work for mounting the IC chip (31) on the tape-shaped substrate (11). IC chip pre-mounting work section (2), and IC capable of mounting the IC chip (31) on the tape-shaped substrate (11) on which the IC chip mounting pre-work has been performed
It is possible to perform a chip component mounting pre-work for mounting the chip component (51) on the chip mounting operation unit (3) and the tape-shaped substrate (11) on which the IC chip (31) is mounted. Chip component pre-mounting work section (4) and chip component capable of mounting the chip component (51) on the tape-shaped substrate (11) to which the chip component pre-mounting work has been performed and the solder (44) has been supplied. The tape-shaped substrate supply operation includes a mounting operation unit (5) and a chip-component reflow operation unit (6) for reflowing the solder (44) of the tape-shaped substrate (11) on which the chip component (51) is mounted. When the intermittent feeding of the tape-shaped substrate (11) by the unit (1) is stopped, the different working units (2, 3, 4, 5,
6) are the working units (2, 3, ...) Simultaneously on the different circuit patterns (12) of the tape-shaped substrate (11).
4, 5, 6) can be performed, and the tape-shaped substrate supply operation unit (1) and the tape-shaped substrate winding operation unit (7) simultaneously perform the tape-shaped substrate ( 11)
The electronic component mounting apparatus for a tape-shaped substrate according to claim 11, which is capable of performing a supplying operation and a winding operation. 13. The tape-shaped substrate (11) can be wound around a reel (15, 71), and the tape-shaped substrate supply unit (1) is the reel (15).
The tape-shaped substrate winding working unit (7) includes a reel supply unit (1a) capable of intermittently feeding the tape-shaped substrate (11) wound around the reel by rewinding the reel (15). Is the tape-shaped substrate (11) on which the electronic components (31, 51) are mounted.
13. The electronic component mounting device for a tape-shaped substrate according to claim 11, further comprising a tape storage portion (7a) capable of being intermittently wound by winding the tape onto the reel (71). 14. The tape between the working parts (2, 3, 4, 5, 6) between the pre-IC chip mounting working part (2) and the chip component reflow working part (6) is set to the tape. The electronic component mounting on the tape-shaped substrate according to claim 12, wherein a variable data control unit is provided in a multiple of a pitch (P) in which the circuit patterns (12) are formed on the substrate (11). apparatus. 15. The tape-shaped substrate winding work section (7)
Is the tape-shaped substrate (11) protected by a sheet-shaped embossed spacer (73) having an uneven portion capable of protecting the electronic components (31, 51) mounted on the tape-shaped substrate (11). 14. The electronic component mounting apparatus for a tape-shaped substrate according to claim 13, further comprising a tape storage portion (7a) capable of being intermittently wound by winding the tape onto the reel (71). 16. The chip part reflow working unit (6)
The cooling unit capable of cooling the tape-shaped substrate (11) heated in the chip component reflow working unit (6) is further provided between the tape-shaped substrate winding working unit (7) and the tape-shaped substrate winding working unit (7). Electronic component mounting device for tape-shaped substrates.