JP2003003016A - Resin composition - Google Patents

Resin composition

Info

Publication number
JP2003003016A
JP2003003016A JP2001185258A JP2001185258A JP2003003016A JP 2003003016 A JP2003003016 A JP 2003003016A JP 2001185258 A JP2001185258 A JP 2001185258A JP 2001185258 A JP2001185258 A JP 2001185258A JP 2003003016 A JP2003003016 A JP 2003003016A
Authority
JP
Japan
Prior art keywords
resin composition
inorganic filler
parts
resin
vinyl polymer
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP2001185258A
Other languages
Japanese (ja)
Other versions
JP4752141B2 (en
Inventor
Madoka Furuta
円 古田
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Toagosei Co Ltd
Original Assignee
Toagosei Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Toagosei Co Ltd filed Critical Toagosei Co Ltd
Priority to JP2001185258A priority Critical patent/JP4752141B2/en
Publication of JP2003003016A publication Critical patent/JP2003003016A/en
Application granted granted Critical
Publication of JP4752141B2 publication Critical patent/JP4752141B2/en
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

Links

Abstract

PROBLEM TO BE SOLVED: To obtain a resin composition which contains a polyolefin resin and an inorganic filler and has excellent uniform dispersibility and good productivity. SOLUTION: The resin composition contains a vinyl polymer obtained by polymerizing a vinyl monomer at a temperature of 180-350 deg.C, a polyolefin resin and an inorganic filler.

Description

【発明の詳細な説明】Detailed Description of the Invention

【0001】[0001]

【発明の属する技術分野】本発明は、ポリオレフィン系
樹脂および無機充填剤を含有する樹脂組成物に関するも
のである。
TECHNICAL FIELD The present invention relates to a resin composition containing a polyolefin resin and an inorganic filler.

【0002】[0002]

【従来の技術】ポリオレフィン系樹脂にタルク、水酸化
マグネシウム等の無機充填剤を添加することにより、耐
衝撃性や難燃性を向上させる技術は知られている。無機
充填剤はポリオレフィン系樹脂と混合されにくいので、
脂肪酸やワックスを添加することにより均一分散性を改
善することも知られている(特開平9−302099号
公報、特開平11−1581号公報)。しかし、この方
法は条件によっては均一分散性が不充分な場合があり、
使用が制限される。また、表面処理が施された無機充填
剤とポリオレフィンを混合させる方法も知られている
(特開2000−63580号公報)。しかし、この方
法は、無機充填剤に表面処理を施すための工程が作業性
の悪いものであり、大量生産においては生産性が悪い場
合がある。
2. Description of the Related Art There is known a technique for improving impact resistance and flame retardancy by adding an inorganic filler such as talc and magnesium hydroxide to a polyolefin resin. Since the inorganic filler is difficult to mix with the polyolefin resin,
It is also known to improve the uniform dispersibility by adding a fatty acid or a wax (JP-A-9-302099 and JP-A-11-1581). However, this method may have insufficient uniform dispersion depending on the conditions,
Limited use. A method of mixing a surface-treated inorganic filler with a polyolefin is also known (Japanese Patent Laid-Open No. 2000-63580). However, in this method, the process for applying the surface treatment to the inorganic filler has poor workability, and the productivity may be poor in mass production.

【0003】[0003]

【発明が解決しようとする課題】本発明は、上記のよう
な従来技術の問題点に着目してなされたものである。そ
の目的とするところは、ポリオレフィン系樹脂および無
機充填剤を含有する樹脂組成物であって、均一分散性が
優れ、生産性が良好なものを提供することにある。
SUMMARY OF THE INVENTION The present invention has been made by paying attention to the problems of the prior art as described above. An object of the invention is to provide a resin composition containing a polyolefin resin and an inorganic filler, which has excellent uniform dispersibility and good productivity.

【0004】[0004]

【課題を解決するための手段】上記の目的を達成するた
めに、請求項1に記載の樹脂組成物は、ビニル単量体を
180〜350℃の温度で重合させて得られるビニル重
合体、ポリオレフィン系樹脂および無機充填剤を含有す
ることを特徴とするものである。請求項2に記載の樹脂
組成物は、請求項1に記載の樹脂組成物において、前記
ビニル重合体およびポリオレフィン系樹脂の配合量が、
無機充填剤100質量部を基準として、それぞれ0.1
〜200質量部および30〜2000質量部であること
を特徴とするものである。請求項3に記載の発明は、ビ
ニル単量体を180〜350℃の温度で重合させて得ら
れるビニル重合体、ポリオレフィン系樹脂および無機充
填剤を含有する電線被覆用樹脂組成物に関するものであ
る。
In order to achieve the above object, the resin composition according to claim 1 is a vinyl polymer obtained by polymerizing a vinyl monomer at a temperature of 180 to 350 ° C. It is characterized by containing a polyolefin resin and an inorganic filler. The resin composition according to claim 2 is the resin composition according to claim 1, wherein the blending amounts of the vinyl polymer and the polyolefin resin are:
Based on 100 parts by weight of the inorganic filler, each of 0.1
To 200 parts by mass and 30 to 2000 parts by mass. The invention according to claim 3 relates to a wire coating resin composition containing a vinyl polymer obtained by polymerizing a vinyl monomer at a temperature of 180 to 350 ° C., a polyolefin resin, and an inorganic filler. .

【0005】[0005]

【発明の実施の形態】以下、本発明を具体化した実施形
態について説明する。本明細書において、(メタ)アク
リルとはアクリルまたはメタクリルを意味する。
BEST MODE FOR CARRYING OUT THE INVENTION Embodiments embodying the present invention will be described below. In the present specification, (meth) acrylic means acrylic or methacrylic.

【0006】本発明は、ビニル単量体を180〜350
℃の温度で重合させて得られるビニル重合体、ポリオレ
フィン系樹脂および無機充填剤を含有する樹脂組成物に
関するものである。
In the present invention, the vinyl monomer is added in the range of 180-350.
The present invention relates to a resin composition containing a vinyl polymer obtained by polymerizing at a temperature of ° C, a polyolefin resin, and an inorganic filler.

【0007】ポリオレフィン系樹脂は、主たる構成単位
としてオレフィン単位を有する重合体であり、具体例と
してはポリエチレン、低密度ポリエチレン、高密度ポリ
エチレン、ポリプロピレン、エチレンとプロピレンの共
重合体、エチレンとエチレンおよびプロピレン以外のα
−オレフィンの共重合体、プロピレンとエチレンおよび
プロピレン以外のα−オレフィンの共重合体、エチレン
とアクリル酸エステルの共重合体、プロピレンとアクリ
ル酸エステルの共重合体、エチレンと酢酸ビニルの共重
合体等が挙げられる。上記ポリオレフィン系樹脂は、そ
の性能を損なわない範囲で、必要に応じてスチレンなど
本来の構成単位以外の単量体単位を有するものであって
もよい。
The polyolefin resin is a polymer having an olefin unit as a main constituent unit, and specific examples thereof include polyethylene, low density polyethylene, high density polyethylene, polypropylene, a copolymer of ethylene and propylene, ethylene and ethylene and propylene. Other than α
-Olefin copolymer, propylene / ethylene and α-olefin other than propylene, ethylene / acrylic acid ester copolymer, propylene / acrylic acid ester copolymer, ethylene / vinyl acetate copolymer Etc. The above-mentioned polyolefin resin may have a monomer unit other than the original constitutional unit such as styrene, if necessary, as long as the performance thereof is not impaired.

【0008】無機充填剤は、組成物に耐衝撃性や難燃性
を付与する働きをする成分である。具体例としては、炭
酸カルシウム、タルク、クレー、シリカ、アルミナ、水
酸化マグネシウム、水酸化アルミニウム等が挙げられ
る。
The inorganic filler is a component which functions to impart impact resistance and flame retardancy to the composition. Specific examples include calcium carbonate, talc, clay, silica, alumina, magnesium hydroxide, aluminum hydroxide and the like.

【0009】本発明の樹脂組成物は、ポリオレフィン系
樹脂の割合が、無機充填剤100質量部を基準として3
0〜2000質量部であるものが好ましく、50〜10
00質量部であるものがより好ましい。ポリオレフィン
系樹脂の割合が多すぎると耐衝撃性や難燃性が不充分と
なる場合があり、少なすぎると樹脂組成物の成形性が悪
くなる場合がある。
In the resin composition of the present invention, the proportion of the polyolefin resin is 3 based on 100 parts by mass of the inorganic filler.
It is preferably from 0 to 2000 parts by mass, and from 50 to 10
It is more preferably 100 parts by mass. If the proportion of the polyolefin-based resin is too large, impact resistance and flame retardancy may be insufficient, and if it is too small, the moldability of the resin composition may be deteriorated.

【0010】本発明に使用されるビニル重合体は樹脂組
成物の均一分散性を向上させる成分、すなわち分散剤と
して機能する成分であり、ビニル単量体を180〜35
0℃の温度で重合させて得られるものである(以下、単
にビニル重合体ともいう。)。ビニル単量体としては、
(メタ)アクリル酸メチル、(メタ)アクリル酸エチ
ル、(メタ)アクリル酸プロピル、(メタ)アクリル酸
ブチル、(メタ)アクリル酸シクロヘキシル、(メタ)
アクリル酸2−エチルへキシル、(メタ)アクリル酸ヒ
ドロキシエチル、(メタ)アクリル酸ヒドロキシプロピ
ル、(メタ)アクリル酸グリシジル等の(メタ)アクリ
ル酸エステル、(メタ)アクリル酸、スチレン、α−メ
チルスチレン、アクリロニトリルなどが挙げられる。
(メタ)アクリル酸エステルまたは(メタ)アクリル酸
を主たる構成単量体単位として有する(メタ)アクリル
系重合体は、得られる組成物の耐候性を特に優れたもの
にするために好ましい。
The vinyl polymer used in the present invention is a component that improves the uniform dispersibility of the resin composition, that is, a component that functions as a dispersant, and contains 180 to 35 vinyl monomers.
It is obtained by polymerizing at a temperature of 0 ° C. (hereinafter, also simply referred to as vinyl polymer). As a vinyl monomer,
Methyl (meth) acrylate, ethyl (meth) acrylate, propyl (meth) acrylate, butyl (meth) acrylate, cyclohexyl (meth) acrylate, (meth)
(Meth) acrylic acid ester such as 2-ethylhexyl acrylate, hydroxyethyl (meth) acrylate, hydroxypropyl (meth) acrylate, glycidyl (meth) acrylate, (meth) acrylic acid, styrene, α-methyl Examples thereof include styrene and acrylonitrile.
A (meth) acrylic polymer having (meth) acrylic acid ester or (meth) acrylic acid as a main constituent monomer unit is preferable in order to make the resulting composition particularly excellent in weather resistance.

【0011】ビニル単量体は180〜350℃の温度で
重合される。200〜320が好ましく、220〜30
0℃がより好ましい。重合温度が低すぎると得られるビ
ニル重合体の分子量が大きいものとなり、樹脂組成物が
均一に分散されにくく、樹脂組成物の生産性も悪くなる
場合がある。低い重合温度において分子量の小さいビニ
ル重合体を得るために重合開始剤または連鎖移動剤を多
量に使用すると、ビニル重合体が着色したり、耐候性の
悪いものになったりしやすい。重合温度が高すぎるとビ
ニル重合体が着色しやすくなる。ビニル重合体の重量平
均分子量は、1000〜30000が好ましく、130
0〜20000がより好ましい。分子量が小さすぎると
得られる樹脂組成物が耐熱性の不充分なものとなる場合
があり、分子量が大きすぎると樹脂組成物が均一に分散
されにくく、樹脂組成物の生産性も悪くなる場合があ
る。
The vinyl monomer is polymerized at a temperature of 180 to 350 ° C. 200 to 320 is preferable, 220 to 30
0 ° C is more preferable. If the polymerization temperature is too low, the resulting vinyl polymer will have a large molecular weight, and it will be difficult to uniformly disperse the resin composition, and the productivity of the resin composition may deteriorate. When a large amount of a polymerization initiator or a chain transfer agent is used to obtain a vinyl polymer having a small molecular weight at a low polymerization temperature, the vinyl polymer is likely to be colored or have poor weather resistance. If the polymerization temperature is too high, the vinyl polymer tends to be colored. The weight average molecular weight of the vinyl polymer is preferably 1,000 to 30,000,
0 to 20000 is more preferable. If the molecular weight is too small, the resulting resin composition may have insufficient heat resistance, and if the molecular weight is too large, the resin composition may not be uniformly dispersed, and the productivity of the resin composition may also deteriorate. is there.

【0012】ビニル重合体は、溶液重合、塊状重合等に
より製造することができる。また、連続重合、セミ連続
重合、バッチ重合等の方法で製造することができるが、
連続重合、なかでも撹拌槽型反応器を使用する連続重合
により製造されるビニル重合体は、樹脂組成物を均一分
散させる性能が特に優れるために好ましい。このような
連続重合は、公知の方法で行うことができる(特表昭5
7−502171号公報、特開昭59−6207号公
報、特開昭60−215007号公報)。
The vinyl polymer can be produced by solution polymerization, bulk polymerization or the like. Further, it can be produced by a method such as continuous polymerization, semi-continuous polymerization, batch polymerization,
A vinyl polymer produced by continuous polymerization, especially continuous polymerization using a stirred tank reactor, is particularly preferable because of its excellent performance of uniformly dispersing the resin composition. Such continuous polymerization can be carried out by a known method (Tokusho Sho-5).
7-502171, JP-A-59-6207, JP-A-60-215007).

【0013】本発明の樹脂組成物は、ビニル重合体の割
合が、無機充填剤100質量部を基準として0.1〜2
00質量部であるものが好ましく、5〜100質量部で
あるものがより好ましい。ビニル重合体の割合が少なす
ぎると樹脂組成物の均一分散性が不充分となる場合があ
り、多すぎると樹脂組成物の成形性が悪くなる場合があ
る。
The resin composition of the present invention has a vinyl polymer content of 0.1 to 2 based on 100 parts by mass of the inorganic filler.
It is preferably 100 parts by mass, more preferably 5 to 100 parts by mass. If the proportion of the vinyl polymer is too small, the uniform dispersibility of the resin composition may be insufficient, and if it is too large, the moldability of the resin composition may be deteriorated.

【0014】本発明の樹脂組成物は上記成分を混合する
ことにより得られる。混合方法に特に制限はないが、例
えば、ビニル重合体、ポリオレフィン系樹脂及び無機充
填剤を配合し、必要に応じて上記の添加剤を添加し、一
般的な方法、例えばニーダー、バンバリーミキサー、コ
ンティニアスミキサー又は押し出し機等を用いて混合混
練することにより得られる。
The resin composition of the present invention can be obtained by mixing the above components. The mixing method is not particularly limited, for example, a vinyl polymer, a polyolefin-based resin and an inorganic filler are blended, the above-mentioned additives are added if necessary, and a general method such as a kneader, a Banbury mixer, or a Conti It can be obtained by mixing and kneading using a near mixer or an extruder.

【0015】本発明の樹脂組成物は、種々の成形材料と
して利用できるが、電線被覆材として特に有用である。
電線被覆材用途の場合は、重量平均分子量が1000〜
30000のビニル重合体を使用した樹脂組成物が、上
記の特徴に加えて硬度、伸び、絶縁性、耐候性等のバラ
ンスが優れたものとなるために好ましい。硬度はショア
硬度がA80以上であるものが好ましい。
The resin composition of the present invention can be used as various molding materials, but is particularly useful as an electric wire coating material.
In the case of wire coating material use, the weight average molecular weight is 1000-
A resin composition using 30,000 vinyl polymers is preferable because it has an excellent balance of hardness, elongation, insulating property, weather resistance and the like in addition to the above characteristics. The hardness is preferably a Shore hardness of A80 or more.

【0016】本発明の樹脂組成物は、目的に応じて種々
の添加剤が配合されたものであってもよい。例えばサリ
チラート系、ヒドロキシベンゾアート系、ベンゾトリア
ゾール系、ヒンダードアミン系等の光安定剤、ヒンダー
ドフェノール系、ホスファイト系、サルファイト系等の
酸化防止剤、リン酸エステル等の有機リン系、有機ハロ
ゲン化合物等の難燃剤、陰イオン系界面活性剤、陽イオ
ン系界面活性剤、非イオン系界面活性剤、両性界面活性
剤等の帯電防止剤、顔料、抗菌剤、防黴剤、発泡剤、発
泡助剤、滑剤等が挙げられる。
The resin composition of the present invention may be blended with various additives depending on the purpose. For example, salicylate-based, hydroxybenzoate-based, benzotriazole-based, hindered amine-based light stabilizers, hindered phenol-based, phosphite-based, sulfite-based antioxidants, phosphate-based organic phosphorus, organic halogen Flame retardants such as compounds, anionic surfactants, cationic surfactants, nonionic surfactants, antistatic agents such as amphoteric surfactants, pigments, antibacterial agents, antifungal agents, foaming agents, foaming agents. Examples include auxiliary agents and lubricants.

【0017】[0017]

【実施例】次に、実施例及び比較例を挙げて前記実施形
態をさらに具体的に説明する。なお、以下の各例におけ
る「部」は「質量部」を意味する。
EXAMPLES Next, the above-mentioned embodiment will be described more specifically with reference to Examples and Comparative Examples. In addition, "part" in each of the following examples means "part by mass".

【0018】(ビニル重合体の製造例) (製造例1)伝熱ヒータを備えた容量300mlの加圧
式攪拌槽型反応器を、3−エトキシプロピオン酸エチル
で満たし、温度230℃にして、圧力調節器により圧力
をゲージ圧2.45〜2.65MPa(25〜27kg
/cm2)に保った。次いで、反応器の圧力を一定に保
ちながら、アクリル酸エチル(以下、EAという。)1
00部とメチルエチルケトン20部、重合開始剤として
ジターシャリブチルパーオキサイド0.5部からなる単
量体混合物を、一定の供給速度(23g/分、滞留時
間:13分)で原料タンクから反応器に連続供給を開始
した。そして、単量体混合物の供給量に相当する反応液
を出口から連続的に抜き出した。送液直後に、一旦反応
温度が低下した後、重合熱による温度上昇が認められた
が、ヒータを制御する事により、反応温度を230℃に
維持した。単量体混合物の供給開始後、温度が安定した
時点を、反応液の回収開始点とし、これから154分間
反応を継続した結果、2000gの単量体混合物を供給
し、1950gの反応液を回収した。得られた反応液を
薄膜蒸発機に導入した、235℃、4000Pa(30
mmHg)の減圧下で、未反応単量体及び溶剤等の揮発
性分を除去し、約1500gの液状樹脂である重合体1
を得た。
(Production Example of Vinyl Polymer) (Production Example 1) A pressure type stirred tank reactor having a capacity of 300 ml equipped with a heat transfer heater was filled with ethyl 3-ethoxypropionate and the temperature was set to 230 ° C. The pressure is adjusted by the regulator to a gauge pressure of 2.45 to 2.65 MPa (25 to 27 kg
/ Cm 2 ). Then, while keeping the pressure of the reactor constant, ethyl acrylate (hereinafter referred to as EA) 1
A monomer mixture consisting of 00 parts, 20 parts of methyl ethyl ketone, and 0.5 parts of ditertiarybutyl peroxide as a polymerization initiator was fed from a raw material tank to a reactor at a constant feed rate (23 g / min, residence time: 13 minutes). Continuous supply was started. Then, the reaction liquid corresponding to the supply amount of the monomer mixture was continuously withdrawn from the outlet. Immediately after feeding the liquid, the reaction temperature was once lowered and then increased by the heat of polymerization, but the reaction temperature was maintained at 230 ° C. by controlling the heater. After the start of the supply of the monomer mixture, the time when the temperature became stable was set as the starting point of the reaction solution collection, and the reaction was continued for 154 minutes. As a result, 2000 g of the monomer mixture was supplied and 1950 g of the reaction solution was recovered. . The obtained reaction liquid was introduced into a thin film evaporator, and the temperature was 235 ° C. and 4000 Pa (30
Under reduced pressure of (mmHg), volatile components such as unreacted monomers and solvents are removed, and about 1500 g of a liquid resin, Polymer 1
Got

【0019】ガスクロマトグラフ分析の結果、液状樹脂
中の未反応単量体は0.5%以下であった。溶媒とし
て、テトラヒドロフランを使用し、ゲルパーミエーショ
ンクロマトグラフ(以下、GPCという。)により求め
た分子量をポリスチレン換算した重合体1の重量平均分
子量(以下、Mwという。)は1450であった。
As a result of gas chromatographic analysis, the unreacted monomer in the liquid resin was 0.5% or less. Tetrahydrofuran was used as a solvent, and the weight average molecular weight (hereinafter referred to as Mw) of the polymer 1 obtained by converting the molecular weight obtained by gel permeation chromatography (hereinafter referred to as GPC) into polystyrene was 1450.

【0020】(製造例2〜4)使用する単量体の組成を
表1に示すように変更した以外は上記重合体1の製造方
法と同様に操作して重合体2〜4をそれぞれ得た。得ら
れた重合体のMwを表1に示す。表1においてBAはア
クリル酸ブチル、MEAはアクリル酸メトキシエチルを
表す。
(Production Examples 2 to 4) Polymers 2 to 4 were obtained in the same manner as in the production method of the polymer 1 except that the composition of the monomer used was changed as shown in Table 1. . Table 1 shows Mw of the obtained polymer. In Table 1, BA represents butyl acrylate and MEA represents methoxyethyl acrylate.

【0021】[0021]

【表1】 [Table 1]

【0022】(樹脂組成物の調製と成形性の評価) (実施例1)オレフィン系樹脂として、エチレン−アク
リル酸エチル共重合体(以下、EEAという。日本ポリ
オレフィン株式会社製ジェイレクスEEA A1150
を使用した。)10g、無機充填剤として水酸化マグネ
シウム(共和化学株式会社製 キスマ5を使用した。)
20g及び、無機充填剤の分散剤として0.2gの重合
体1をを東洋精機株式会社製ラボプラストミル30C1
50(混練ロータはR−30を使用した。)に仕込み、
200℃、60rpmの回転数で混練を開始した。そし
て、混練トルクが平衡に達する時間(以下、ゲル化時間
という。)及びその時のトルク(以下、平衡トルクとい
う。)を測定した結果、それぞれ0.7分及び10.7
N・m(1.09kgf・m)であり、オレフィン系樹脂と
無機充填剤が速やかに均一混合され(ゲル化時間が短
い)、混練負荷も小さい(平衡トルクが小さい)ことが
わかった。すなわち樹脂組成物の生産性が良好であり、
得られる樹脂組成物は均一分散性が優れたものとなるこ
とがわかった。
(Preparation of Resin Composition and Evaluation of Moldability) (Example 1) As an olefin resin, an ethylene-ethyl acrylate copolymer (hereinafter referred to as EEA. J-LEX EEA A1150 manufactured by Nippon Polyolefin Co., Ltd.)
It was used. ) 10 g, magnesium hydroxide as an inorganic filler (Kisma 5 manufactured by Kyowa Chemical Co., Ltd. was used.)
20 g and 0.2 g of the polymer 1 as a dispersant for the inorganic filler are Laboplast mill 30C1 manufactured by Toyo Seiki Co., Ltd.
50 (kneading rotor used was R-30),
Kneading was started at 200 ° C. and a rotation speed of 60 rpm. Then, the time at which the kneading torque reaches equilibrium (hereinafter referred to as gelation time) and the torque at that time (hereinafter referred to as equilibrium torque) were measured, and as a result, 0.7 minutes and 10.7, respectively.
It was found to be N · m (1.09 kgf · m), the olefin resin and the inorganic filler were rapidly and uniformly mixed (the gelation time was short), and the kneading load was small (the equilibrium torque was small). That is, the productivity of the resin composition is good,
It was found that the obtained resin composition has excellent uniform dispersibility.

【0023】(実施例2〜4、比較例1〜2)使用する
無機充填剤の分散剤を表2に示すように変更し、それ以
外は、実施例1に示す方法に準じてゲル化時間及び平衡
トルクを測定した。比較例1は分散剤を使用せず、比較
例2は分散剤としてステアリン酸を使用した。実施例に
おいては均一混合されやすく、混練負荷も小さいのに対
して、比較例においては均一混合されにくく、混練負荷
が大きいことがわかった。
(Examples 2 to 4, Comparative Examples 1 and 2) The dispersant of the inorganic filler used was changed as shown in Table 2, and the gelation time was changed according to the method shown in Example 1 except for the above. And the equilibrium torque was measured. Comparative Example 1 used no dispersant and Comparative Example 2 used stearic acid as the dispersant. It was found that in Example, uniform mixing was easy and the kneading load was small, whereas in Comparative Example, uniform mixing was difficult and the kneading load was large.

【0024】[0024]

【表2】 [Table 2]

【0025】(樹脂組成物の調製、成形および評価(引
張試験、硬度測定)) (実施例5) EEA100部、20部の重合体2及び
水酸化マグネシウム200部を混ぜ、株式会社プラスチ
ック工学研究所製2軸押出機(温度設定:C1=170
℃、C2=175℃、C3=180℃、C4=180℃、H=18
0℃、D=180℃)で混練し、ペレット状の組成物を
調製した。
(Preparation, Molding, and Evaluation of Resin Composition (Tensile Test, Hardness Measurement)) (Example 5) 100 parts of EEA, 20 parts of Polymer 2 and 200 parts of magnesium hydroxide were mixed, and Plastic Engineering Laboratory Co., Ltd. Twin screw extruder (temperature setting: C1 = 170
℃, C2 = 175 ℃, C3 = 180 ℃, C4 = 180 ℃, H = 18
The mixture was kneaded at 0 ° C. and D = 180 ° C. to prepare a pelletized composition.

【0026】その組成物を5インチ、2本テストロール
にて、180℃の条件で5分混練した後、190℃の熱
プレスにて、シート状の成形物を得た。引張試験用シー
トは厚さ2mm、ショア硬度用シートは厚さ6mmとし
た。
The composition was kneaded with two 5-inch test rolls at 180 ° C. for 5 minutes, and then hot pressed at 190 ° C. to obtain a sheet-shaped molded product. The tensile test sheet had a thickness of 2 mm and the Shore hardness sheet had a thickness of 6 mm.

【0027】引張試験は、インストロン株式会社製引張
試験機シリーズ5560を使用し、JIS K7161
に準じて、ダンベル2号、引張速度10mm/minで
実施し、破断伸びを測定した。その結果、伸び率は16
5%であった。ショア硬度はJIS K7215に準
じ、タイプAデュロメータを用いて実施された。その結
果、ショア硬度は88であった。
For the tensile test, a tensile tester series 5560 manufactured by Instron Co., Ltd. was used, and JIS K7161 was used.
Dumbbell No. 2, tensile speed 10 mm / min, and elongation at break were measured. As a result, the growth rate is 16
It was 5%. Shore hardness was measured using a type A durometer according to JIS K7215. As a result, the Shore hardness was 88.

【0028】(実施例6及び比較例3)使用する無機充
填剤の分散剤を表3に示すように変更し、それ以外は、
実施例5に示す方法に準じて引張試験及びショア硬度を
測定した。比較例3においては分散剤を使用しなかっ
た。比較例においては伸び率が小さかった。その理由は
樹脂組成物が均一分散性の悪いものであるためと推測し
ている。
(Example 6 and Comparative Example 3) The dispersant of the inorganic filler used was changed as shown in Table 3, and other than that,
The tensile test and the Shore hardness were measured according to the method described in Example 5. In Comparative Example 3, no dispersant was used. In the comparative example, the elongation rate was small. It is speculated that the reason is that the resin composition has poor uniform dispersibility.

【0029】[0029]

【表3】 [Table 3]

【0030】(実施例7)ポリプロピレン樹脂(以下、
PPという。日本ポリケム株式会社製ノバテックPP
FY−4を使用した。)100部、5部の重合体2及び
タルク(富士タルク工業株式会社製 タルクPK−50
を使用した。)30部を混ぜ、実施例5に示す方法で、
引張試験及びショア硬度を測定した。その結果を表4に
示す。
Example 7 Polypropylene resin (hereinafter,
It is called PP. Novatec PP manufactured by Nippon Polychem Co., Ltd.
FY-4 was used. ) 100 parts, 5 parts of polymer 2 and talc (Talc PK-50 manufactured by Fuji Talc Industry Co., Ltd.)
It was used. ) Mixing 30 parts and by the method shown in Example 5,
Tensile tests and Shore hardness were measured. The results are shown in Table 4.

【0031】(比較例4〜5)使用する無機充填剤の分
散剤を表4に示すように変更し、それ以外は、実施例7
に示す方法に準じて引張試験及びショア硬度を測定し
た。比較例4は分散剤としてステアリン酸を使用し、比
較例5は分散剤を使用しなかった。比較例においては伸
び率が小さかった。その理由は樹脂組成物が均一分散性
の悪いものであるためと推測している。
(Comparative Examples 4 to 5) The dispersant of the inorganic filler used was changed as shown in Table 4, and other than that, Example 7
The tensile test and the shore hardness were measured according to the method shown in. Comparative Example 4 used stearic acid as the dispersant and Comparative Example 5 did not use the dispersant. In the comparative example, the elongation rate was small. It is speculated that the reason is that the resin composition has poor uniform dispersibility.

【0032】[0032]

【表4】 [Table 4]

【0033】[0033]

【発明の効果】ポリオレフィン系樹脂および無機充填剤
を含有する樹脂組成物であって、均一分散性が優れ、生
産性が良好なものが得られた。均一分散性が優れること
により伸び率が大きいという効果も得られたと考えられ
る。
EFFECT OF THE INVENTION A resin composition containing a polyolefin resin and an inorganic filler, which has excellent uniform dispersibility and good productivity, was obtained. It is considered that the effect of high elongation was obtained due to the excellent uniform dispersibility.

───────────────────────────────────────────────────── フロントページの続き (51)Int.Cl.7 識別記号 FI テーマコート゛(参考) H01B 3/00 H01B 3/00 A 3/44 3/44 A F Fターム(参考) 4J002 BB03X BB06X BB07X BB12X BB15X BC02W BC092 BG01W BG04W BG05W BG06W BG07W BG10W DE076 DE146 DE236 DJ016 DJ046 FD016 FD136 GT00 4J038 CB021 CB022 CB041 CB042 CB051 CB052 CB081 CB082 CC011 CC012 CG031 CG032 CG141 CG142 CG161 CG162 CH031 CH032 CH071 CH072 CH121 CH122 CH171 CH172 HA186 HA216 HA286 HA446 HA526 HA536 KA08 NA11 NA15 PB09 5G303 AA06 AA10 AB20 BA12 CA01 CA09 CC02 5G305 AA02 AA14 AB36 BA15 CA01 CD01 ─────────────────────────────────────────────────── ─── Continuation of front page (51) Int.Cl. 7 Identification code FI theme code (reference) H01B 3/00 H01B 3/00 A 3/44 3/44 A FF term (reference) 4J002 BB03X BB06X BB07X BB12X BB15X BC02W BC092 BG01W BG04W BG05W BG06W BG07W BG10W DE076 DE146 DE236 DJ016 DJ046 FD016 FD136 GT00 4J038 CB021 CB022 CB041 CB042 CB051 CB052 CB081 CB082 CC011 CC012 CG031 CG032 CG141 CG142 CG161 CG162 CH031 CH032 CH071 CH072 CH121 CH122 CH171 CH172 HA186 HA216 HA286 HA446 HA526 HA536 KA08 NA11 NA15 PB09 5G303 AA06 AA10 AB20 BA12 CA01 CA09 CC02 5G305 AA02 AA14 AB36 BA15 CA01 CD01

Claims (3)

【特許請求の範囲】[Claims] 【請求項1】 ビニル単量体を180〜350℃の温度
で重合させて得られるビニル重合体、ポリオレフィン系
樹脂および無機充填剤を含有する樹脂組成物。
1. A resin composition containing a vinyl polymer obtained by polymerizing a vinyl monomer at a temperature of 180 to 350 ° C., a polyolefin resin, and an inorganic filler.
【請求項2】 前記ビニル重合体およびポリオレフィン
系樹脂の配合量が、無機充填剤100質量部を基準とし
て、それぞれ0.1〜200質量部および30〜200
0質量部である請求項1に記載の樹脂組成物。
2. The blending amounts of the vinyl polymer and the polyolefin resin are 0.1 to 200 parts by mass and 30 to 200 parts by mass, respectively, based on 100 parts by mass of the inorganic filler.
The resin composition according to claim 1, which is 0 part by mass.
【請求項3】 ビニル単量体を180〜350℃の温度
で重合させて得られるビニル重合体、ポリオレフィン系
樹脂および無機充填剤を含有する電線被覆用樹脂組成
物。
3. An electric wire coating resin composition containing a vinyl polymer obtained by polymerizing a vinyl monomer at a temperature of 180 to 350 ° C., a polyolefin resin and an inorganic filler.
JP2001185258A 2001-06-19 2001-06-19 Resin composition Expired - Lifetime JP4752141B2 (en)

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Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2011096596A3 (en) * 2010-04-27 2011-10-20 三菱レイヨン株式会社 Dispersant for additive for polyolefin resin, polyolefin resin composition, and molded article
JP2018002941A (en) * 2016-07-06 2018-01-11 株式会社日本触媒 (meth)acrylic acid ester polymer and manufacturing method therefor

Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS596207A (en) * 1982-06-15 1984-01-13 エス・シ−・ジヨンソン・アンド・サン・インコ−ポレ−テツド Bulk polymerization and polymer
JPS60215007A (en) * 1984-02-29 1985-10-28 エス.シ−.ジヨンソン アンド サン,インコ−ポレ−テツド Bulk polymerization for manufacturing high solid content homogeneous copolymer
JPH0726078A (en) * 1993-05-12 1995-01-27 Achilles Corp Ethylene-acrylic copolymer resin composition and ethylene-acrylic copolymer resin film
JPH0931262A (en) * 1995-07-19 1997-02-04 Nippon Unicar Co Ltd Flame-retardant ethylene-based resin composition
JP2000106041A (en) * 1998-09-29 2000-04-11 Yazaki Corp Flexible non-halogen wire cable

Patent Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS596207A (en) * 1982-06-15 1984-01-13 エス・シ−・ジヨンソン・アンド・サン・インコ−ポレ−テツド Bulk polymerization and polymer
JPS60215007A (en) * 1984-02-29 1985-10-28 エス.シ−.ジヨンソン アンド サン,インコ−ポレ−テツド Bulk polymerization for manufacturing high solid content homogeneous copolymer
JPH0726078A (en) * 1993-05-12 1995-01-27 Achilles Corp Ethylene-acrylic copolymer resin composition and ethylene-acrylic copolymer resin film
JPH0931262A (en) * 1995-07-19 1997-02-04 Nippon Unicar Co Ltd Flame-retardant ethylene-based resin composition
JP2000106041A (en) * 1998-09-29 2000-04-11 Yazaki Corp Flexible non-halogen wire cable

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2011096596A3 (en) * 2010-04-27 2011-10-20 三菱レイヨン株式会社 Dispersant for additive for polyolefin resin, polyolefin resin composition, and molded article
JP2018002941A (en) * 2016-07-06 2018-01-11 株式会社日本触媒 (meth)acrylic acid ester polymer and manufacturing method therefor

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