JP2002373779A - Electric connection device and electronic equipment having electric connection device - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide an electric connection device capable of electrically connecting to an organic electroluminescent element without giving thermal damage to it when a second substrate is connected to an electrode inside a first substrate having the electrode connected to the organic electroluminescent element, and provide electronic equipment having the electric connection device. SOLUTION: This electric connection device 600 has the organic electroluminescent element and a connector 700 for electrically connecting the second substrate 50 to the electrode inside the first substrate 121 having the electrode connected to the organic electroluminescent element, and a connector terminal 710 of the connector 700 is electrically connected to the electrode of the first substrate 121 by ultrasonic welding.

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention has a connector for electrically connecting a second substrate to an electrode of a first substrate having an electrode connected to an organic electroluminescent device. The present invention relates to an electrical connection device and an electronic apparatus having the electrical connection device.

[0002]

2. Description of the Related Art In recent years, a display device using an organic electroluminescent device (organic electroluminescence device, hereinafter referred to as an organic EL device) as a light emitting device has been receiving attention. In this type of conventional display device, a transparent electrode serving as an anode is formed in a stripe shape on a transparent glass substrate. An organic layer is formed on the stripe-shaped transparent electrode in a direction perpendicular to the transparent electrode. This organic layer comprises a hole transport layer and a light emitting layer. A cathode is formed on the organic layer. In this way, organic EL elements are formed at positions where the transparent electrode and the cathode intersect, and these organic EL elements are arranged vertically and horizontally to form a light emitting area. The periphery of the glass substrate has an electrode portion for connecting the light emitting area to a drive circuit.

When a positive voltage is applied to the transparent electrode serving as the anode and a negative voltage is applied to the cathode, holes injected from the transparent electrode reach the light emitting layer via the hole transport layer. I do. On the other hand, electrons injected from the cathode reach the light emitting layer. As a result, recombination of electrons and holes occurs in the light emitting layer, so that light having a predetermined wavelength is generated, and the light is emitted from the transparent glass substrate to the outside. In this type of display device, a flexible printed wiring board for connection to the outside or a driver IC (integrated circuit) for driving is applied to an electrode on a glass substrate by applying heat to an ACF (anisotropic conductive film). Are electrically connected via

FIG. 24 shows an organic EL element 1000, a driver IC 1001, and a flexible printed circuit board 10.
02 shows a connection example. FIG. 25 shows an example of electrical connection between the flexible printed wiring board 1002 and the glass substrate 1003 and the driver IC 1001 of the organic EL element 1000. ITO on the glass substrate 1003
A transparent electrode 1004 of a film (Indium tin oxide film) is formed. The driver IC 1001 is electrically connected to the transparent electrode 1004 using an ACF 1005. Similarly, the flexible printed wiring board 1002 is also
They are electrically connected by F1006.

[0005]

However, when the electrodes on the glass substrate are electrically connected to the flexible printed wiring board or the driver IC using the ACF by applying heat as described above, there are the following problems. . The monomer constituting the organic EL device can withstand only about 80 ° C. thermally, and the organic EL device is weak to heat. Therefore, when the electrode portion on the glass substrate is electrically connected to the flexible printed wiring board or the driver IC by applying heat, the electrode portion on the glass substrate is located far away from the organic EL element on the glass substrate. Otherwise, there is a problem that electrical connection cannot be made using such heat. Therefore, the present invention solves the above-mentioned problem, and when connecting another electrode to another electrode of the first substrate having the electrode connected to the organic electroluminescent element, the organic electroluminescence is used. It is an object of the present invention to provide an electric connection device capable of making an electric connection without thermally damaging an element, and an electronic device having the electric connection device.

[0006]

According to a first aspect of the present invention, there is provided an organic electroluminescent device and an electrode connected to the organic electroluminescent device. An electrical connection device having a connector for electrically connecting the connector terminal of the first substrate, the connector terminal of the connector is electrically connected by ultrasonic welding. Electrical connection device.
In the first aspect, a connector is used when another second substrate is electrically connected to an electrode in the first substrate connected to the organic electroluminescent element, and a connector terminal of the connector is a The electrodes of one substrate are electrically connected by ultrasonic welding. Thereby, the connector terminal of the connector can be reliably electrically and mechanically connected to the electrode of the first substrate by ultrasonic welding at room temperature.
Therefore, the organic electroluminescent device is not thermally damaged. When repairing either the first board or the second board or both of them, the connector terminal subjected to ultrasonic welding may be removed from the electrode of the first board, and thus the first board or the second board may be repaired. Can be easily exchanged. Since the connector terminal of the connector may be ultrasonically welded to the electrode of the first substrate, it is possible to electrically connect the first substrate to the second substrate by automatic assembly using the connector terminal of the connector. Will be possible.

According to a second aspect of the present invention, in the electrical connection device according to the first aspect, the first substrate is a hard substrate,
The second substrate is a flexible printed wiring board.

According to a third aspect of the present invention, in the electrical connection device according to the second aspect, the second substrate of the flexible printed wiring board is connected to the insertion end of the second substrate of the flexible printed wiring board. A resin component for positioning the insertion end when electrically connecting to the connector by insertion is provided, and a position changing unit capable of changing the position of the insertion end relative to the connector. According to the third aspect, when the insertion end of the second substrate of the flexible printed wiring board is electrically fixed to the connector by insertion, the insertion end is positioned by a resin component. The position changing unit can change the position of the insertion end with respect to the connector. Therefore, when the second board and the first board are electrically connected to the connector by inserting the insertion end of the second board, the position of the insertion end with respect to the connector can be changed. Becomes possible.

According to a fourth aspect of the present invention, in the electrical connection device according to the first aspect, the connector includes a first connector portion electrically connected to the electrode of the first substrate, and the second substrate. A second connector portion electrically connected to the first side and electrically detachably connectable to the first connector portion. According to claim 4, the first connector portion of the connector includes:
It is electrically connected to the electrode of the first substrate. Connector second
The connector portion is electrically connected to the second substrate side,
The connector portion is electrically detachably connectable to the first connector portion.

According to a fifth aspect of the present invention, a second substrate is electrically connected to an electrode of a first substrate having an organic electroluminescent device and an electrode connected to the organic electroluminescent device. An electrical connection device having a connector for connecting the connector terminal of the connector to the electrode of the first substrate by melting a solder ball with a laser beam. Electrical connection device. According to the fifth aspect, a connector is used when another second substrate is electrically connected to an electrode of the first substrate connected to the organic electroluminescent element, and the connector terminal of the connector is The electrodes are electrically connected to the electrodes of one substrate by melting the solder balls with laser light. Thus, the connector terminals of the connector can be reliably electrically and mechanically connected only by locally applying heat by melting the solder balls with the laser light to the electrodes of the first substrate. Therefore, the organic electroluminescent device is not thermally damaged. When repairing either or both of the first substrate and the second substrate, the connector terminals obtained by melting the solder balls by the laser beam may be removed from the electrodes of the first substrate. Exchange of two substrates can be easily performed. The connector terminals of the connector may be formed by melting the solder balls with respect to the electrodes of the first substrate by laser light.
It becomes possible to electrically connect to the substrate by automatic assembly.

According to a sixth aspect of the present invention, in the electrical connection device according to the fifth aspect, the connector terminal has a positioning hole for positioning the solder ball. In the sixth aspect, the solder ball is positioned in the positioning hole of the connector terminal. Thereby, the electrical connection operation using the solder balls is easy and reliable.

According to a seventh aspect of the present invention, another second substrate is electrically connected to an electrode of a first substrate having an organic electroluminescent element and an electrode connected to the organic electroluminescent element. Electronic equipment having an electrical connection device having a connector for connecting the connector terminal of the connector to the electrode of the first substrate by ultrasonic welding. It is an electronic device having a dynamic connection device. According to the seventh aspect, when another second substrate is electrically connected to an electrode of the first substrate connected to the organic electroluminescent element, a connector is used, and a connector terminal of the connector is a second terminal. The electrodes of one substrate are electrically connected by ultrasonic welding. Thereby, the connector terminal of the connector can be reliably electrically and mechanically connected to the electrode of the first substrate by ultrasonic welding at room temperature. Therefore, the organic electroluminescent device is not thermally damaged. When repairing either the first board or the second board or both of them, the connector terminal subjected to ultrasonic welding may be removed from the electrode of the first board, and thus the first board or the second board may be repaired. Can be easily exchanged. Since the connector terminal of the connector may be ultrasonically welded to the electrode of the first substrate, it is possible to electrically connect the first substrate to the second substrate by automatic assembly using the connector terminal of the connector. Will be possible.

According to the invention of claim 8, another second substrate is electrically connected to the electrode of the first substrate having the organic electroluminescent device and the electrode connected to the organic electroluminescent device. Electronic device having an electrical connection device having a connector for connecting a connector terminal of the connector to the electrode of the first substrate by melting a solder ball with a laser beam. An electronic device having an electrical connection device. According to claim 8, when another second substrate is electrically connected to an electrode in the first substrate connected to the organic electroluminescent element,
A connector is used.
The solder balls are electrically connected to the electrodes of the substrate by melting the solder balls with laser light. Thus, the connector terminals of the connector can be reliably electrically and mechanically connected only by locally applying heat by melting the solder balls with the laser light to the electrodes of the first substrate. Therefore, the organic electroluminescent device is not thermally damaged. In addition, the first substrate or the second substrate
When repairing one or both of the boards,
Since the connector terminal in which the solder ball has been melted by the laser beam may be removed from the electrode on the first substrate, the first substrate or the second substrate can be easily replaced. Since the connector terminals of the connector may be formed by melting the solder balls to the electrodes of the first substrate by laser light, the first substrate is electrically connected to the second substrate by automatic assembly using the connector terminals of the connector. It becomes possible to do.

[0014]

Preferred embodiments of the present invention will be described below in detail with reference to the accompanying drawings. Note that the embodiments described below are preferred specific examples of the present invention,
Although various technically preferable limits are given, the scope of the present invention is not limited to these modes unless otherwise specified in the following description.

FIG. 1 shows an example of an electronic apparatus having the electrical connection device of the present invention. The electronic device 10 is, for example, a television receiver. The housing 12 of the electronic device 10 has a display device 20. The display device 20 includes an organic electroluminescent device (hereinafter referred to as an organic EL device).
For example, the display device has a large display surface, and has a size of 75 inches or more as an example. The display device 20 includes the organic EL unit 2 shown in FIG.
Two.

FIG. 3 is an exploded perspective view showing an enlarged part of the organic EL unit 22 of FIG. The organic EL unit 22 has a plurality of IC (integrated circuit) substrates 30 and one organic EL panel 40. Organic EL panel 40
Has a front surface 40A and a back surface 40B in the example shown in FIG. Each IC board 30 has one or more driver ICs 34. These driver ICs 34
The flexible printed wiring board 50 can be electrically and mechanically connected to the electrical connection portion on the back surface 40B side of the organic EL panel 40, respectively. Each IC substrate 30 can be electrically connected to each other by another flexible substrate 51.

The driver IC 34 of each IC substrate 30 can drive a large-sized organic EL panel 40 by dividing it into, for example, a dividing surface 41 as shown by a broken line. The organic EL panel 40 having such a large area
Is driven by the driver IC 34 of the IC substrate 30 after being divided into a plurality of section surfaces 41 for the following reasons.
That is, by driving the organic EL panel 40 having a large area while dividing it into a plurality of division surfaces 41,
The length of the drive wiring from the substrate 30 to the division surface 41 at the corresponding position is shortened, and even if the display screen is enlarged, the voltage drop due to the wiring resistance is eliminated, and the organic EL panel 4
This is because the display drive of 0 can be stably performed.
Then, compared to the case where the large-sized IC substrate 30 is provided according to the area of the organic EL panel 40 having a large area,
By arranging the IC boards 30 separately on the divided surfaces 41, the driver I of one of the IC boards 30 is temporarily provided.
Even if the operation of C34 becomes defective, it is only necessary to remove and replace the IC board 30 on the corresponding partition surface 41, so that there is an advantage that the cost during maintenance can be reduced.

FIGS. 4 and 5 show examples of the structure of the organic EL panel 40 for color display. The organic EL panel 40 shown enlarged in FIG. 5 has a display area 60 and an electrical connection area 70. The display area 60 has a dimension D,
It is a portion formed by the dimensions D1, D2, D3, and D4. The electrical connection region 70 has a region formed by the dimensions D5 and D6 and a region formed by the dimensions D7 and D8. An alignment mark 64 for positioning is formed at an end of the organic EL panel 40, and the alignment mark 64 has, for example, a square shape. The electrical connection region 70 has a plurality of connection points P having, for example, a round shape.

Here, referring to FIG. 6 and FIG.
A structural example of the organic EL element 80 of the panel 40 will be described. In the organic EL panel 40, a transparent electrode 122 serving as an anode is formed in a stripe shape on a transparent substrate 121. And the cathode 124 is formed on the organic EL film 123, whereby the organic EL elements 80 are formed at positions where the transparent electrode 122 and the cathode 124 intersect. The transparent substrate 121, as shown in FIG.
The display section area 60, which is a light emitting area in which the organic EL elements 80 are arranged vertically and horizontally, and the above-described electrical connection area 70 for connecting the light emitting area to a drive circuit are formed.

In such an organic EL panel 40, usually, an insulating layer is provided between the transparent electrodes 122, whereby a short circuit between the transparent electrodes 122, and furthermore, between the transparent electrode 122 and the cathode 124, occur. Short circuit is prevented.

As an organic EL element formed at a position where the transparent electrode 122 and the cathode 124 intersect, for example, FIG.
There is a single hetero organic EL element 80 shown in FIG. The organic EL element 80 is formed on a transparent substrate 121 such as a glass substrate by using ITO (Indium tin oxide).
e) An anode composed of a transparent electrode 122 is provided, and an organic EL film 123 composed of a hole transport layer 123a and a light emitting layer 123b and a cathode 124 are provided thereon.

When the organic EL element 80 applies a positive voltage to the transparent anode 122 and applies a negative voltage to the cathode 124,
The holes injected from the transparent anode 122 form the hole transport layer 123.
a, the light reaches the light emitting layer 123b, and the electrons injected from the cathode 124 reach the light emitting layer 123b, respectively, and recombination of electrons and holes occurs in the light emitting layer 23b. At this time, light having a predetermined wavelength is generated and exits from the transparent substrate 121 side as shown by the arrow in FIG.

FIG. 8 shows a preferred embodiment of the electrical connection device of the present invention. This electrical connection device 600
Has a transparent substrate 121 having an organic EL element 80, a flexible printed wiring board 50, and a connector 700. Electrical connection device 6 having this connector 700
Reference numeral 00 denotes a connector 700 for the electrodes 200 and 201 connected to the organic EL element 80 which is an organic electroluminescent element.
This is a device for electrically connecting the flexible printed wiring board 50 via the. The transparent substrate 121 is a substrate for supporting the organic EL element 80, and corresponds to a first substrate. The flexible printed wiring board 50 is made of the organic EL
This corresponds to a second substrate for electrically connecting the element 80 via the connector 700.

FIGS. 9 and 10 show an example of a laminated structure of the organic EL element 80, the transparent substrate 121, the connector 700, and the flexible printed wiring board 50 in an enlarged manner. In FIG. 9, the connector terminals 710 and 711 of the connector 700 are not yet electrically connected to the electrodes 200 and 201 of the organic EL element 80. However, in FIG.
The 0 connector terminals 710 and 711 are electrically connected to the electrodes 200 and 201 of the organic EL element 80 at the corresponding positions. Here, an example of a cross-sectional structure of the organic EL element 80 will be described with reference to FIG.

As the transparent substrate 121, for example, a glass substrate or a plus rack substrate can be used. In the case of a glass substrate, for example, soda glass, non-alkali glass, quartz glass and the like are used. In the case of a plastic substrate, for example, PC (polycarbonate), fluorine PI (polyimide), PMMA (acrylic resin), PET (polyethylene terephthalate), PAR (polyarylate), PE
S (polyethersulfone), PEN (polyethernitrile), cycloolefin resin, or the like is used.
A gas barrier film 140 is provided on the front and back surfaces of the transparent substrate 121.
Are formed. The gas barrier film 140 prevents a gas such as moisture or oxygen from entering the device, thereby preventing deterioration of the organic EL device. It is desirable that the gas barrier film 140 be provided with anti-reflection properties, so that the gas barrier film 140 suppresses reflection of the generated light on the transparent substrate 121 to provide an excellent organic EL element having high transmittance. Can be.

An auxiliary electrode 142 is formed on one gas barrier film 140. This auxiliary electrode 142
The auxiliary electrode 142 is made of, for example, chromium and has a comb shape, for example, and is provided to reduce the resistance value. On the auxiliary electrode 142, the transparent electrode 1
22 are formed. The transparent electrode 122 is formed, for example, in a stripe shape, is an anode, is a portion to which a positive voltage is applied, and is, for example, an ITO film (Indi).
um tin oxide film).

The first insulating layer 150 is formed on the transparent electrode 122.
Are formed. On the first insulating layer 150, an organic E
An L film 123 is formed. This organic EL film 123
Has a multilayer structure in which a hole transport layer and a light emitting layer are stacked. On the first insulating layer 150 and the organic EL film 123, a cathode (cathode electrode) 124 is formed. The first insulating layer 150 is made of, for example, SiN or the like, and has not only an electrical insulating property but also a gas barrier function against moisture and oxygen. By providing this gas barrier function, it is possible to prevent moisture and oxygen from entering the inside of the device, and to provide an organic EL device.
Deterioration of the film 123 is prevented.

The cathode 124 serves as a cathode of the organic EL film 123 and is formed to be larger than the organic EL film 123. The cathode 124 is made of, for example, lithium fluoride (LiF). First insulating layer 150 and cathode 124
The second insulating layer 155 is formed thereon. This second insulating layer 155 is formed over the entire device.
For example, it is made of SiN, AlN or the like. The second insulating layer 155 has not only insulating properties but also a gas barrier function against moisture and oxygen, thereby preventing moisture and oxygen from entering the inside of the device and preventing the organic EL film 123 from deteriorating. Can be.

The second insulating layer 155 and the first insulating layer 15 shown in FIG.
0 has openings 180 and 181 formed therein. The openings 180 and 181 are provided with electrode portions 182 and 183 of conductive metal, for example, Ni, respectively. The conductive metal film 170 is formed on the electrode portions 182, 1
83 is a metal formed on the substrate 83, for example, Au or the like can be used. The conductive metal film 170 and the electrode portion 182 constitute the electrode 200. The other conductive metal film 170 and the electrode portion 183 constitute the electrode 201. Each of the electrodes 200 and 201 is located at the connection point P of the electrical connection region 70 shown in FIG.

In such an organic EL element 80 or organic EL panel 40, when a current is applied between the transparent electrode 122 as an anode and the cathode 124 as a cathode electrode, holes injected from the cathode 124 are formed. , Through the hole transport layer of the organic EL film to the light emitting layer, and the transparent electrode 12.
The electrons injected from 2 reach the light emitting layer of the organic EL film 123. Therefore, electron-hole recombination occurs in the light emitting layer. At this time, light having a predetermined wavelength is generated, and this light L is emitted from the transparent substrate 121 to the outside. The material of the conductive metal film 170 is Ni, A
1, Au, Cu, etc. can also be adopted.

The flexible printed wiring board 5 shown in FIG.
For 0, for example, those made of PI (polyimide) or PET (polyethylene terephthalate) can be adopted. The flexible printed wiring board 50 can be detachably electrically connected by inserting the connection terminals 50T into the insertion holes 714 (see FIG. 11) of the connector 700. Next, the connector 700 will be described. As shown in FIGS. 9 and 10, the connector 700 is a flexible printed wiring board 50 that is a second substrate.
And the organic EL element 8 on the transparent substrate 121 side as the first substrate
This is a connector for a flexible printed wiring board for electrically connecting the zero electrodes 200 and 201. 11 and 12 show examples of the structure of the connector 700. FIG.
As shown in FIG. 11A, the connector 700
13 and a plurality of connector terminals 710 and insertion holes 714
have. The main body 713 is made of a material having an electrical insulating property,
For example, it is made of plastic. This body 7
As shown in FIGS. 11 (B) and 11 (C), connector terminals 710 are formed in a lower part of 13, protruding in a zigzag manner, for example, in the left-right direction. FIG.
11B illustrates an example of a cross-sectional structure taken along line AA in FIG. 11B and an example of a cross-sectional structure taken along line BB in FIG. Body 71
3 has an insertion hole 714 and holds a connector terminal 710. Insertion holes 714 are used to removably insert the connection terminals 50T of the flexible printed wiring board 50 shown in FIG.
This is a part for electrically connecting the reference numeral 10. The surface of the connector terminal 710 is, for example, Cu, Al, Ni, Au.
Etc. can be adopted.

FIG. 13 shows an example in which the electrodes 200 and 201 of the organic EL element 80 at positions corresponding to the connector terminals 710 are electrically and mechanically connected by ultrasonic welding. When the connector terminal 710 and the electrodes 200 and 201 are ultrasonically welded in this manner, the electrode 20
The material of the surface of 0,201 and the material of the surface of the connector terminal 710 can be, for example, the following combinations. When the surfaces of the electrodes 200 and 201 are made of Ni, the surface of the connector terminal 710 is made of Cu.
The surface of the connector terminal 710 can be made of Al when the surface of 1 is Ni, or Ni when the surfaces of the electrodes 200 and 201 are made of Ni. When the surfaces of the electrodes 200 and 201 are made of Cu, the surface of the connector terminal 710 can be made of Ni or Cu. Alternatively, the surfaces of the electrodes 200 and 201 are made of Al
, The surface of the connector terminal 710 is Ni or A
l. The surface of the electrodes 200 and 201 is A
In the case of u, the surface of the connector terminal 710 can also be Au. By combining such materials, the connector terminal 710 and the electrode 20 can be ultrasonically welded.
0,201 can be reliably and easily welded at room temperature.

The ultrasonic vibration welding apparatus 410 shown in FIG. 13 electrically connects the above-described electrodes 200 and 201 and the connector terminal 710 by ultrasonic vibration welding. Organic EL element 8
The zero transparent substrate 121 is mounted on the fixed base 400. The ultrasonic vibration welding apparatus 410 includes a fixing table 400, a pressing unit 420, and an ultrasonic generation source 430. The pressing portion 420 presses the connector terminal 710 against the electrodes 200 and 201 at corresponding positions along the PS direction. For this reason, the pressing portion 420 is supplied with a voltage from the ultrasonic wave generation source 430, and the pressing portion 420
The amplitude is generated in the direction, that is, the direction orthogonal to the pressing direction PS. The pressing portion 420 has a protrusion 440 at a position corresponding to the connector terminal 710.

The pressing portion 420 is also called a horn, and the projections 440 are used to weld the electrodes 200 and 201 and the connector terminal 710 by applying relatively low pressure and strong ultrasonic vibration at room temperature. By rubbing the interface, solid-phase bonding can be achieved, and clean and ideal electrical bonding without loss can be stably performed without applying heat. In other words, the welding interface is rubbed, the oxide film and the adhered impurities are mechanically cleaned, and a sudden plastic flow occurs, so that the electrode 20 at a position corresponding to the connector terminal 710 is formed.
0 or 201 will be bound in the solid state.
By ultrasonically welding the connector terminal 710 and the electrodes 200 and 201, such an electrical connection can be made at room temperature, so that no heat is applied to the electrodes 200 and 201 and thus the organic EL element 80 Does no thermal damage.

Each of the electrodes 200 and 201 is located at a position corresponding to the joining point P of the organic EL panel 40 shown in FIG. These joining points P are preferably
Are positioned so as not to overlap with the organic EL film 123. Thus, the connector terminal 71
0 and the electrodes 200 and 201 can be directly electrically and mechanically connected using ultrasonic welding.

In this case, it is not possible to align the connector 700 with the alignment mark on the organic EL element 80 and to align the connector terminal 710 of the connector 700 with the electrodes 200 and 201 of the organic EL element 80. Needless to say. Body 713 of connector 700
Is positioned at a position different from the pressing portion 420 which is a horn at the aligned position. The pressing portion 420 may be provided with a protrusion 440 for the connector terminal 710 as shown in FIG.
It is of course possible to simply press the flat surface of the pressing portion 420 against each connector terminal 710 without providing the connector terminal 710.

FIGS. 14 and 15 show another embodiment of the electrical connection device of the present invention, and FIG.
The cross-sectional structure example in -C is shown. 14 and 15
In FIG. 13, the same portions as those in FIG. Electrode 20 of organic EL element 80
Numerals 0 and 201 are electrically and mechanically connected to the connector terminal 710 at a corresponding position of the connector 700 by ultrasonic bonding. If the height of the connector terminal 710 is likely to change in advance due to thermal deformation or the like, as shown in FIGS.
The leading end 725 may be integrated with the resin part 730.
The connector terminal 710 has a substantially C-shaped bent portion 735 as shown in FIG.
The protrusion 444 of the pressing portion 420 is abutted on the inside of the block 35. Thereby, the bent portion 735 and the electrode 200 or 201 can be ultrasonically welded using the pressing portion 420. As described above, since the connector terminal 710 has the bent portion 735, the main body 7 of the connector 700
13 is deformed in the Z direction, for example, due to the elastic deformation capability of the bent portion 735,
And the electrodes 200 and 201 can be maintained in a state of being securely connected electrically. The resin portion 730 plays a role in suppressing positional variations due to deformation of the connector terminals and the like.

FIGS. 16 to 18 show another embodiment of the electrical connection device of the present invention. The electrical connection device 600 of FIG. 16 differs from the electrical connection device 600 of FIG.
The point is that the device is devised so that it can be securely inserted and fixed electrically. The connector terminal 710 of the connector 700 is connected to the electrode 200 on the organic EL element 80 side,
201 has already been electrically and mechanically connected by, for example, ultrasonic welding as described above. In contrast to the connected connector 700, the flexible printed wiring board 50 has a resin component 800 and a position changing unit 830.

The flexible printed wiring board 50 is shown in FIG.
As shown in FIG. 7 and FIG. 18, the insertion end 50T is reinforced by a reinforcing plate 801. The insertion end 50T is bent substantially perpendicularly to the main part 50S of the flexible printed wiring board 50. As shown in FIG. 17, an electronic component EP such as a driver IC is fixed to the flexible printed wiring board 50.

As shown in FIGS. 17 and 18, the resin component 800 is a block-shaped component for holding the flexible printed wiring board 50 without deformation. As shown in FIG. 17 and FIG.
Has a hole 50H, into which the protrusion 802 of the resin component 800 is inserted. The flexible printed wiring board 50 has a long hole 50J as shown in FIG. 17, and the long hole 50J is oriented in the K direction. The projection 803 of the resin component 800 fits into the elongated hole 50J. Flexible printed wiring board 50 is positioned with respect to resin component 800 using holes 50H, protrusions 802, elongated holes 50J, and protrusions 803. Even if the flexible printed wiring board 50 slightly expands and contracts in the K direction, it can be absorbed by the movement of the protrusion 803 in the K direction in the elongated hole 50J.

The flexible printed wiring board 50 is fixed to the resin component 800 using screws 50B. The screw 50B is a so-called self-tapping screw.
The flexible printed wiring board 50 is connected to the resin component 8 while forming a female screw for the self-tap pilot hole 839 of FIG.
00 can be fixed.

The insertion end 50T of the flexible printed wiring board 50 is mechanically reinforced by a reinforcing plate 801 as shown in FIG. 18, but the insertion end 50T is positioned along the K direction by the position changing section 830. Can be fine-tuned. As shown in FIG. 18, the insertion end 50T is
Are fixed by screws 840 for self-tapping. The screw 840 is a self-tapping screw and has a male screw 841 and a stepped portion 843. This screw 840
Is screwed into the self-tapping pilot hole 841 of the resin component 800, so that the insertion end 50T and the reinforcing plate 801 are integrally formed in the stepped portion of the screw 840 by a predetermined clearance along the direction K in FIG. The position can be finely adjusted by using 843. This clearance is, for example, about 0.01 mm to 0.05 mm.

With such a structure, the degree of freedom of the position of the insertion end 50T in the K direction can be given to some extent, and as shown in FIG.
0T is inserted into the insertion hole 714 of the connector 700 and is electrically and mechanically fixed.
OT and the reinforcing plate 801 can be fitted and fixed in the insertion holes 714. By adopting such a structure that ensures the degree of freedom of the insertion end portion 50T, the flexible printed wiring board 50 can be assembled to the connector 700 while absorbing the displacement of the insertion end portion 50T by automatic assembly. .

FIG. 19 shows still another embodiment of the present invention. The embodiment of FIG. 19 is different from the embodiments of FIGS. 16 to 18 in that the connector 700 is electrically connected in advance to the substrate 550 which is the second substrate. The substrate 550 and the flexible printed wiring board 50 correspond to a second substrate, and the transparent substrate 121 having an organic EL element is a first substrate. The substrate 55 which is the second substrate
Electronic components EP such as driver ICs are already electrically fixed to 0. Connector terminal 710 of connector 700
Is connected to the electrode 551 of the substrate 550 by, for example, ultrasonic welding. Electrode 20 on transparent substrate 121 side
The electrodes 50D of the flexible printed wiring board 50 are connected to the 0, 201 side by, for example, ultrasonic welding. The electrode 50D is made of, for example, Au.

The flexible printed wiring board 50 is held by a resin component 900 called a holder. The resin component 900 holds the main part 50S and the insertion end part 50T of the flexible printed wiring board 50. Insertion end 5
0T is reinforced by a reinforcing plate 801 and the insertion end 5
0T and the reinforcing plate 801 are screws 840 of the position changing unit 830.
To the resin component 900 by self-tapping. The screw 840 has a self-tapping screw 841 and a stepped portion 843 so that the insertion end 5
0T and the reinforcing plate 801 can move to some extent in the K direction. As a result, the insertion end 50T can be securely fitted into the insertion hole 713 of the connector 700 while maintaining the degree of freedom in the position in the K direction. In the example of FIG. 19, the electrodes 200 and 201 and the electrode 50D
u can be used, but other materials can also be used.

FIGS. 20 and 21 show still another embodiment of the electrical connection device of the present invention. FIG. 20 shows this electric connection device 600. The electric connection device 600 is different from the electric connection device shown in FIGS. 9 and 10 in that the laser beam 340 and the solder ball are used instead of the ultrasonic welding. 950, the connector terminal 710 of the connector 700 and the electrode 200 or 201 of the organic EL element 80.
Are electrically and mechanically connected to each other. FIG.
Are the same as those of the embodiment shown in FIGS. 9 and 10 and the like, and the description thereof will be used.

FIG. 21 shows an example of the shape of the connector 700 in FIG. The main body 713 of the connector 700
Although a plurality of connector terminals 710 are provided, each connector terminal 710 has a positioning hole 951 for inserting and positioning the solder ball 950 of FIG. The solder ball 950 is a solder ball with flux, and the connector terminal 710 is inserted into the positioning hole 951 of the connector terminal 710 so that the connector terminal 710 is connected to the electrode 200 or 2.
01. Then, the solder ball 950 is melted by irradiating a laser beam 340 to the connector terminal 7.
10 and the electrode 200 or 201 are electrically and mechanically connected. Thus, the connector terminal and the electrode can be electrically connected only by local heating only by irradiating the laser beam. Therefore, no thermal damage is transmitted to the organic EL element 80. As the laser beam 340, a laser beam such as a semiconductor laser, an excimer laser, or a YAG laser can be used. By using the laser beam 340 and the solder ball 950 in this manner, the connector terminal and the electrode can be electrically and mechanically joined by local heating.

Regardless of the above-described ultrasonic welding or the joining using the solder ball and the laser beam, the connector terminal and the electrode can be removed as necessary. That is, organic E
Even if a defect occurs in the L element 80 or a defect occurs in the flexible printed wiring board 50, one or both can be replaced regardless of the defect.

When the connector terminal 710 and the electrode 200 or 201 are electrically connected using the solder ball 950, the following materials can be adopted. The surfaces of the electrodes 200 and 201 can be made of solder or Au. When the surfaces of the electrodes 200 and 201 are solder, the surface of the connector terminal 710 can employ solder or Au. When the surfaces of the electrodes 200 and 201 are made of Au, the surface of the connector terminal 710 is made of solder or Au.
Can be adopted.

FIG. 22 shows still another embodiment of the electrical connection device of the present invention. In the embodiment of FIG. 22, the connector 1700 includes a first connector portion 1710 and a second connector portion 1720. The first connector portion 1710 includes electrodes 200 on the organic EL element 80 side,
Ultrasonic welding or a laser beam and a solder ball are used to electrically connect the connector 201 with the connector terminal 710. On the other hand, the second connector portion 1720 is electrically connected to the electrode 50D of the flexible printed wiring board 50 using the connector terminal 710. The flexible printed wiring board 50 is reinforced by a reinforcing plate 1050F so as not to be deformed, and an electronic component EP is mounted corresponding to the reinforcing plate 1050F.
First connector portion 1710 is, for example, a male connector, and second connector portion 1720 is a female connector. First connector portion 1710 and second connector portion 17
The connector 1700 can be formed by fitting the connector 20. However, it goes without saying that the first connector portion 1710 is a female type and the second connector portion 1720 is a male type.

In the example of FIG. 23, the connector 700 or the connector 1700 is reinforced with the adhesive 998 on the organic EL element 80 side. Such reinforcement by the adhesive can be used in each embodiment.

By the way, the present invention is not limited to the above-described embodiment. Examples of electronic equipment having an electrical connection device include a television monitor, a mobile phone, a computer monitor device, a mobile information terminal, and the like. The present invention can be applied to a digital still camera, a video camera, a portable game machine, and the like.

[0053]

As described above, according to the present invention,
When the second electrode is electrically connected to another electrode of the first substrate having the electrode connected to the organic electroluminescent element, the organic electroluminescent element is thermally damaged. The electrical connection can be made without the need.

[Brief description of the drawings]

FIG. 1 is a perspective view showing a large-sized television receiver as an example of an electronic apparatus having an electrical connection device of the invention.

FIG. 2 is an exemplary perspective view showing an example of an organic EL unit included in the electronic apparatus shown in FIG. 1;

FIG. 3 is an organic EL showing a part of the organic EL unit of FIG. 2;
FIG. 2 is a perspective view showing a panel, an IC substrate, and a flexible printed wiring board.

FIG. 4 is a diagram showing an example of an electrical connection area of the organic EL panel.

FIG. 5 is a plan view showing an example of an electrical connection area and a display area of the organic EL panel of FIG. 4;

FIG. 6 is a perspective view showing a structural example of an organic EL element of the organic EL panel.

FIG. 7 is a diagram showing a partial structure of an organic EL panel.

FIG. 8 is a diagram showing a preferred structure example of the electrical connection device of the present invention.

9 is a diagram showing a more detailed structure example of the electrical connection device of FIG. 8, showing a state where the connector terminal and the electrode are not yet connected.

FIG. 10 is a diagram showing a state in which the connector terminal and the electrode are electrically connected in FIG. 9;

FIG. 11 is a diagram showing an example of the shape of a connector terminal.

FIG. 12 is a diagram showing an example of a cross-sectional structure along AA and BB in FIG. 11;

FIG. 13 is a diagram showing a state in which electrodes and connector terminals are joined by ultrasonic welding.

FIG. 14 is a diagram showing another embodiment of the electrical connection device of the present invention.

FIG. 15 is a sectional view taken along the line CC in FIG. 14;

FIG. 16 is a diagram showing still another embodiment of the electrical connection device of the present invention.

FIG. 17 is a plan view showing the flexible printed wiring board of FIG. 16 and resin parts and the like.

FIG. 18 is an enlarged sectional view showing a part of a flexible printed wiring board and a resin component.

FIG. 19 is a view showing still another embodiment of the electrical connection device of the present invention.

FIG. 20 is a view showing still another embodiment of the electrical connection device of the present invention.

FIG. 21 is a view showing an example of the shape of a connector terminal of the connector used in FIG. 20;

FIG. 22 is a view showing still another embodiment of the electrical connection device of the present invention.

FIG. 23 is a diagram showing an example of reinforcing a connector.

FIG. 24 is a diagram showing a connection example between a conventional organic EL element and a flexible printed wiring board.

FIG. 25 is an enlarged view showing a part of FIG. 24;

[Explanation of symbols]

DESCRIPTION OF SYMBOLS 10 ... Electronic apparatus, 50 ... Flexible printed wiring board (2nd board), 50T ... Insertion end part of flexible printed wiring board, 80 ... Organic EL element, 121
... Transparent substrate (first substrate), 200, 201 ... Electrode of organic EL element, 340 ... Laser light, 410 ...
-Ultrasonic vibration welding device, 600 ... electrical connection device,
700 connector, 710 connector terminal, 8
00: resin parts, 830: position changing unit, 950
... Solder ball, 951 ... Positioning hole for connector terminal

──────────────────────────────────────────────────続 き Continued on the front page (51) Int.Cl. ⁷ Identification symbol FI Theme coat ゛ (Reference) G09F 9/30 365 G09F 9/30 365Z H05B 33/14 H05B 33/14 A H05K 1/14 H05K 1/14 C // B23K 101: 38 B23K 101: 38 (72) Inventor Junichi Osako 6-35, Kitashinagawa, Shinagawa-ku, Tokyo Inside Sony Corporation (72) Inventor Shunji Amano 6-chome, Kitashinagawa, Shinagawa-ku, Tokyo 7-35 Inside Sony Corporation (72) Ryota Kotake, Inventor Ryota Kotake 6-7-35 Kita-Shinagawa, Shinagawa-ku, Tokyo Sony Corporation (72) Inventor Mitsunori Ueda 6-7, Kita-Shinagawa, Shinagawa-ku, Tokyo No. 35 Inside Sony Corporation (72) Inventor Yasuhiro Kataoka 6-7-35 Kita Shinagawa, Shinagawa-ku, Tokyo Inside Sony Corporation (72) Inventor Megumi Takamori Shimogyo, Kyoto City, Kyoto Prefecture 801 Shiouji-Dori Horikawa Higashi-iri Minami-Fudodou-cho (72) Within OMRON Corporation (72) Inventor Takeshi Takeshi Uchida 801 Shiouji-Dori Horikawa Higashi-iri Minami-Fudodou-cho, Shimogyo-ku, Kyoto, Kyoto Prefecture OMRON Corporation (72) Inventor Hemi Koshin No.801 Shimogyo-ku, Shimogyo-ku, Kyoto-shi AA31 AA43 AA48 AA53 BA27 CA19 CA24 DA09 DA12 DB03 DB05 EB02 FA01 FA02 FB01 FB12 FB15 FB20 GB01 5E344 AA01 BB02 BB04 CD18 EE01 5G435 AA14 AA16 AA17 AA18 BB05 CC09 EE32 EE33 EE40 EE40 EE35 EE40

Claims (8)

[Claims] 1. A connector for electrically connecting another second substrate to an electrode of a first substrate having an organic electroluminescent device and an electrode connected to the organic electroluminescent device. An electrical connection device, wherein a connector terminal of the connector is electrically connected to the electrode of the first substrate by ultrasonic welding. 2. The electrical connection device according to claim 1, wherein the first substrate is a hard substrate, and the second substrate is a flexible printed wiring board. 3. The flexible printed wiring board according to claim 2, wherein
The board is a resin component that positions the insertion end when the insertion end of the second substrate of the flexible printed wiring board is electrically connected to the connector by insertion, and the insertion end. The electrical connection device according to claim 2, further comprising: a position changing unit capable of changing a position of the connector with respect to the connector. 4. The connector according to claim 1, wherein the connector includes a first connector portion electrically connected to the electrode on the first substrate, and the second connector portion electrically connected to the electrode on the first substrate.
The electrical connection device according to claim 1, further comprising a second connector portion that is electrically connected to the substrate side and is electrically detachably connectable to the first connector portion. 5. A connector for electrically connecting another second substrate to an electrode of a first substrate having an organic electroluminescent device and an electrode connected to the organic electroluminescent device. An electrical connection device, wherein a connector terminal of the connector is electrically connected to the electrode of the first substrate by melting a solder ball with a laser beam. . 6. The electrical connection device according to claim 5, wherein the connector terminal has a positioning hole for positioning the solder ball. 7. A connector for electrically connecting a second substrate to an electrode of a first substrate having an organic electroluminescent device and an electrode connected to the organic electroluminescent device. An electronic device having an electrical connection device, wherein the connector terminal of the connector is electrically connected to the electrode of the first substrate by ultrasonic welding. Electronics. 8. A connector for electrically connecting a second substrate to an electrode of the first substrate having an organic electroluminescent element and an electrode connected to the organic electroluminescent element. An electronic device having an electrical connection device, wherein a connector terminal of the connector is electrically connected to the electrode of the first substrate by melting a solder ball with a laser beam. Electronic equipment having an electrical connection device.