JP2002353509A - Light-emitting diode - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide a light-emitting diode which can be mounted surely and easily on the surface of a printed wiring board without having to use solder. SOLUTION: This light-emitting diode is formed into a nearly T shape of bases 23a and 23b with a couple of electrodes 26a and 26b and a body 24 being raised from nearly the center part of the base parts 23a and 23b. The diode is equipped with a light emitting part 25 on the front side of the body part 24, and then provided with hooks 33a and 33b which are elastic along the flank of the body 24 on the top surfaces of bases 23a and 23b; and engagement claws 35a and 35b are engaged elastically with the peripheral edge 38 of a fitting hole 37 of a printed wiring board 22.

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a light emitting diode which is surface-mounted on a mounting board such as a printed wiring board by means of engaging means with hooks.

[0002]

2. Description of the Related Art The present applicant has proposed a backlight light source provided in a liquid crystal display of a small electronic device such as a mobile phone.
A T-shaped side-emission type light emitting diode 1 as shown in FIG. 4 has already been proposed (Japanese Patent Application No. 2000-278).
No. 087). This light-emitting diode 1 is formed in a substantially T-shape by left and right base portions 2a, 2b and a main body portion 3 rising from substantially the center of the base portions 2a, 2b. A first electrode 4a extending on one side of the main body 3 has a main body 3 on the upper surface of the other base 2b.
A second electrode 4b extending on the other side is formed. The first electrode 4a and the second electrode 4b are
And a cathode electrode 5 and an anode electrode 6 are formed, respectively. A light emitting element 7 is mounted on the cathode electrode 5 and the light emitting element 7 and the anode electrode 6 are connected to each other by a bonding wire 8. The light emitting element 7 and the bonding wire 8 are connected to each other, and are protected by a sealing resin material 9 protruding toward the front side of the main body 3.

When the above-mentioned T-shaped light emitting diode 1 is surface-mounted on a printed wiring board (hereinafter referred to as a PCB) 10, as shown in FIGS. 4 and 5, a circular mounting hole 11 formed in the PCB 10 is formed. The main body 3 of the light emitting diode 1 is inserted from the back side, and the first electrodes 2a and 2b of the bases 2a and 2b are connected to the back electrodes 12a and 12b formed on the back of the PCB 10.
By connecting the electrode 4a and the second electrode 4b with the solder 13, conduction to the light emitting diode 1 is achieved.

[0004]

When the above-mentioned light emitting diode 1 is joined to the PCB 10 by the solder 13, the following problems may be considered. That is, the above-mentioned light emitting diode 1 may be turned forward when standing upright because the sealing resin material 9 protrudes from the front surface side of the main body 3.
a and the second electrode 4b are the back electrodes 12a, 1 of the PCB 10.
2b may not be securely joined.

Accordingly, an object of the present invention is to provide a light emitting diode which can be mounted reliably and easily without using solder when the light emitting diode is surface-mounted on a PCB.

[0006]

According to a first aspect of the present invention, there is provided a light emitting diode having a base portion and a main body formed substantially in a T-shape. A hook portion extending along the side surface is provided on the upper surface of the base portion.

According to the present invention, the light emitting diode is connected to the PC
When the light emitting diode is mounted on the surface B, simply inserting the main body of the light emitting diode into the mounting hole formed in the PCB, the hook portion engages with the periphery of the mounting hole, and the mounting of the light emitting diode is completed. Also, depending on the mounting, the electrode on the light emitting diode side and P
The electrode on the CB side makes surface contact, and conduction between the two is achieved.

According to a second aspect of the present invention, in the light emitting diode according to the first aspect, the hook portion is formed at a tip end of the spacer portion, the spacer portion having substantially the same length as the thickness of the mounting substrate and having an elastic action. A locking claw elastically engaged with a peripheral portion of the mounting hole of the mounting board.

According to the present invention, the spacer portion is fitted into the mounting hole of the mounting substrate while being elastically deformed, and the engaging claw is elastically engaged with the peripheral portion of the mounting hole on the upper surface side of the mounting substrate. The light emitting diode is securely fixed. In addition, since the length of the spacer portion is substantially the same as the thickness of the mounting substrate, when the engaging claw is engaged with the peripheral portion of the mounting hole, the electrode on the light emitting diode side and the electrode on the PCB side are in surface contact with each other while being pressed against each other. Thus, conduction between the two is ensured.

[0010]

DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS Hereinafter, embodiments of the light emitting diode according to the present invention will be described in detail with reference to the accompanying drawings. In the light emitting diode of the present invention shown in FIGS.
FIG. 1 is a perspective view showing the overall shape of the light emitting diode, FIG. 2 is an explanatory view showing the elastic deformation of the hook portion when the light emitting diode is mounted on the PCB, and FIG. 3 is a front view when the light emitting diode is mounted on the PCB. is there.

As shown in FIG. 1, a light emitting diode 21 according to this embodiment is made of a glass epoxy substrate, a BT resin (Bismaleimide Triazine Resin) substrate, or the like. The parts 23a and 23b and the rectangular parallelepiped main body part 24 rising from the substantially central part of the base parts 23a and 23b are substantially T-shaped.
A light emitting unit 25 is formed on the front side of the main body 24.
Are formed to protrude.

A first electrode 26a and a second electrode 26b are formed on the upper surfaces of the base portions 23a and 23b, respectively. The first electrode 26a extends to the front side via one side surface 27a of the main body 24, and forms a cathode electrode 29 on which the light emitting element 28 is mounted on the upper part of the main body 24. The second electrode 26 b extends to the front side via the other side surface 27 b of the main body 24, and forms an anode electrode 30 below the cathode electrode 29. The light emitting element 28 mounted on the cathode electrode 29 and the anode electrode 30 are connected by a bonding wire 31, and a current is supplied to the light emitting element 28 via the first electrode 26a and the second electrode 26b. The light emitting element 28 and the bonding wire 31 have a structure protected by a sealing resin material 32 protruding from the front surface of the main body 24. In addition, as a material of the sealing resin material 32, for example, an epoxy resin having a light transmitting property is used.

On the other hand, in the light emitting diode 21 according to this embodiment, hook portions 33a, 33b are formed so as to protrude from the upper surfaces of the base portions 23a, 23b. This hook part 3
3a and 33b are formed integrally with the base portions 23a and 23b when the light emitting diode 21 is formed.
Spacer portion 3 extending in parallel with both side surfaces 27a, 27b of
4a and 34b, and outward locking claws 35a and 35b formed at the distal ends of the spacers 34a and 34b. The spacer portions 34a and 34b have an elastic action, and can be flexibly deformed by gaps 36a and 36b formed between the spacer portions 34a and 34b and the side surfaces 27a and 27b of the main body portion 24. The length of the spacer portions 34a and 34b is
2 and 3, and as shown in FIGS. 2 and 3, mounting holes 37 provided in the PCB 22.
When it is inserted into the mounting hole 37 on the top side of the PCB 22,
Are designed so that the locking claws 35a and 35b can be appropriately engaged with the peripheral portion 38 of the base. Although the hook portions 33a and 33b according to this embodiment form an integral conductive surface with the first electrode 26a and the second electrode 26b formed on the upper surfaces of the base portions 23a and 23b, the hook portions 33a and 33b are not necessarily formed. 3
The conductive surface need not be formed on the surface of 3b.

Next, the light emitting diode 2 having the above configuration
1 will be described with reference to FIGS. 2 and 3. In this case, as shown in FIG. 2, the main body 24 and the hooks 33a, 33b are inserted into the mounting holes 37 formed in the PCB 22 from the back side. At this time, the locking claws 35a, 35b of the hook portions 33a, 33b are pushed inward on the inner peripheral surface of the mounting hole 37, and the spacer portions 34a, 34b are moved to the side surfaces 27a, 27b.
It elastically bends and deforms to the b side. When the locking claws 35a and 35b are further pushed out and jump out of the mounting holes 37, the spacer portions 34a and 34b are elastically restored, and the locking claws 35a and 35b are returned.
35 b is elastically engaged with the peripheral portion 38 of the mounting hole 37.
At the same time when the locking claws 35a and 35b are engaged, the PCB 22
The first electrode 26a and the second electrode 26 of the base portions 23a, 23b of the light emitting diode 21 are provided on the back electrodes 39a, 39b of the light emitting diode 21, respectively.
Since the contacts b come into contact with each other in a press-contact state, conduction between the two can be reliably achieved.

Further, the locking claw 3 of the hook portions 33a, 33b
Since 5a and 35b are engaged with the peripheral portion 38 of the mounting hole 37 with elasticity, mounting play does not occur after the light emitting diode 21 is mounted, and unstable conduction can be avoided. As described above, when the light emitting diode 21 is mounted on the PCB 22, the light emitting diode 21 can be easily mounted simply by inserting the light emitting diode 21 into the mounting hole 37 previously opened in the PCB 22 from the back side. Moreover, since there is no need for soldering, the light emitting element 28, the substrate, and the sealing resin material 32 are not exposed to the high temperature of the reflow furnace, and the stability of quality is further improved. In addition, since no harmful gas is generated when the solder is melted, it is preferable in terms of sanitary work environment.

In the above embodiment, the case where the light emitting portion 25 is provided on the front surface of the main body portion 24 has been described. However, the present invention can be applied to the case where the light emitting portion is provided not only on the front surface but also on both the front surface and the rear surface. Of course. Further, in the above embodiment, the side emission type light emitting diode has been described.
The present invention is also applicable to a top-emitting or back-emitting light emitting diode.

[0017]

As described above, according to the light emitting diode of the present invention, in the light emitting diode formed in a substantially T shape by the base portion and the main body portion, the hook portion extending along the side surface of the main body portion is provided. Since it is provided on the upper surface of the base part, when the light emitting diode is surface mounted on the surface mounting board, simply insert the main body of the light emitting diode into the mounting hole opened in the surface mounting board and the hook part will be the inner peripheral edge of the mounting hole. And secure mounting can be easily obtained without using solder. Further, since the hook portion has an elastic action, the electrode on the light emitting diode side and the electrode on the surface mounting board are in surface contact with each other while being pressed against each other, so that reliable conduction between them can be achieved.

[Brief description of the drawings]

FIG. 1 is a perspective view showing the overall shape of a light emitting diode according to the present invention.

FIG. 2 is an explanatory view showing elastic deformation of a hook portion when the light emitting diode of FIG. 1 is mounted on a printed wiring board.

FIG. 3 is a front view when the light emitting diode of FIG. 1 is mounted on a printed wiring board.

FIG. 4 is a perspective view showing an example of a light emitting diode formed in a substantially T shape.

FIG. 5 is a front view when the light emitting diode of FIG. 4 is mounted on a printed wiring board.

[Explanation of symbols]

 Reference Signs List 21 light emitting diode 22 printed wiring board (mounting board) 23a, 23b base part 24 main body part 25 light emitting part 26a first electrode 26b second electrode 33a, 33b hook part 34a, 34b spacer part 35a, 35b locking claw 37 mounting hole 38 Perimeter

Claims (2)

[Claims] 1. A base having a pair of electrodes, and a main body rising from a substantially central portion of the base, are formed in a substantially T-shape, and a light emitting part is provided on at least one of a front surface and a rear surface of the main body. A light emitting diode, comprising: a hook portion provided on an upper surface of a base portion along a side surface of a main body portion. 2. The hook portion is elastically connected to a spacer portion having substantially the same length as the thickness of the mounting substrate and having an elastic action, and a peripheral portion of a mounting hole formed at the tip of the spacer portion and mounted on the mounting substrate. The light emitting diode according to claim 1, further comprising a locking claw that engages with the light emitting diode.