JP2002351931A - Management method of mask drawing data making its data processing system and manufacturing method of photo- mask - Google Patents

Abstract

PROBLEM TO BE SOLVED: To enable drawing of integrated circuits mask patterns efficiently at manufacturing processes of masks used at manufacturing of semiconductor integrated circuits devices. SOLUTION: The system of this invention is comprised of circuits design users U, a mask drawing data making manufacturer MD and a mask manufacturer MM; the circuits design users U and the mask drawing data making manufacturer MD are connected by Internet, etc., in a state in which good communication is possible, and the mask drawing data making manufacturer MD and the mask manufacturer MM are connected by dedicated lines in a state in which good communication is possible.

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a mask drawing data creation management method, a data processing system, and a technique for manufacturing a photomask, and more particularly to a method for creating and manufacturing data for a photomask used in manufacturing a semiconductor device. Technology.

[0002]

2. Description of the Related Art In semiconductor devices, finer circuit patterns and higher integration are progressing year by year. A circuit pattern is formed on a semiconductor wafer by forming a circuit pattern on a photomask (hereinafter abbreviated as a mask) and transferring the circuit pattern to the semiconductor wafer using ultraviolet light.

[0003] With this system, with the ultra-high integration of integrated circuit patterns, there are problems such as efficiently forming circuit patterns on a mask substrate and accurately forming circuit patterns on a semiconductor wafer. I have.

In order to prevent a decrease in the transfer accuracy of an integrated circuit pattern onto a semiconductor wafer, for example, 1996
August 20, 2008, published by the Industrial Research Institute, Inc., “Photomask Technology Story”, p. 236 to p. 240, considering the deformation of the integrated circuit pattern transferred to the semiconductor wafer, Optical proximity correction (Opti Proximity Correction) to improve the accuracy of transferring integrated circuit patterns to semiconductor wafers by designing masks by correcting dimensions or shapes
cal Proximity Correction (OPC) technology is described.

[0005] For example, in the above-mentioned "Photomask technology", p229 to p236 are provided with a phase difference in light transmitted through the mask, and an integrated circuit pattern transferred to a semiconductor wafer using the interference of the transmitted light. There is a description of a phase shift technique for improving the resolution of the image.

As a technique for forming a circuit pattern corresponding to an integrated circuit on a mask, for example, the above-mentioned "Photomask Technology", p. .
The electron beam scanning method used in the electron beam exposure method includes, for example, a raster method and a vector method. The raster method scans the entire surface of a mask and irradiates only a portion where a circuit pattern is formed with an electron beam. The vector system is a system in which only a portion of the mask where a circuit pattern is formed is scanned. A plurality of masks are required at the time of exposure processing for manufacturing one semiconductor integrated circuit device. Drawing of a circuit pattern on these masks is performed using either a raster method or a vector method.

[0007]

However, to use a circuit pattern drawing apparatus such as an electron beam drawing apparatus,
The present inventors have found for the first time that there are the following problems with miniaturization and high integration of a circuit pattern drawn on a mask.

That is, the progress of miniaturization and high integration of circuit patterns is rapid, and a mask is manufactured by using mask writing data that does not conform to mask manufacturing conditions including a mask writing apparatus and wafer manufacturing conditions including a projection exposure apparatus. As a result, it has become technically difficult to transfer a circuit pattern onto a semiconductor wafer.

Further, even when mask drawing data that conforms to mask manufacturing conditions including a mask drawing apparatus and wafer manufacturing conditions including a projection exposure apparatus are used, the mask drawing data creation field has a small market scale, so that development costs and The running cost becomes huge. Therefore, there is a problem that the price of the mask becomes high in order to recover the development cost and the running cost.

An object of the present invention is to provide a technique capable of efficiently drawing an integrated circuit mask pattern in a step of manufacturing a mask used for manufacturing a semiconductor integrated circuit device.

Another object of the present invention is to provide a technique capable of reducing the cost for creating mask drawing data and managing the mask drawing data.

Another object of the present invention is to provide a technique capable of transferring a circuit pattern drawn on a mask onto a semiconductor wafer with high accuracy.

The above and other objects and novel features of the present invention will become apparent from the description of the present specification and the accompanying drawings.

[0014]

SUMMARY OF THE INVENTION Among the inventions disclosed in the present application, the outline of a representative one will be briefly described.
It is as follows.

That is, according to the present invention, a mask data creation section (or maker) is interposed between a semiconductor device design section (or a designer) and a mask manufacturing section (or a manufacturer). In such a state that communication between them is performed well, a connection is established between them through a communication line, and a process is performed from the mask data creation process to the manufacturing process using these configurations.

Another outline of the invention disclosed in the present application will be briefly described as follows.

That is, the present invention provides an integrated circuit pattern data formed on a semiconductor wafer by a circuit design user,
Or receive the corresponding integrated circuit data and convert it by a computer according to the wafer exposure device, developing device, etching device, drawing device, developing device, etching device, film forming material, etc. of the semiconductor wafer manufacturing line. Producing the appropriate mask drawing data by processing includes the following steps; the mask drawing data used for the fabrication of an integrated circuit mask for a plurality of customers includes (a)
After the customer authentication, receiving the mask drawing data processing request signal from the customer, receiving the circuit pattern data (formed on the customer's semiconductor wafer), storing it in an encrypted form, and (b) creating menu-based drawing data Creating mask drawing data and encrypting and storing the drawing data according to the customer's selection for the conditions; (c) after customer authentication,
A step of extracting drawing data by searching for mask drawing data for each customer or the entire group to which the customer belongs, sending the drawing data to a network address designated by the customer, and performing a decryption process; (E) presenting the drawing data file number, data volume total amount, and storage period data of the group to which the customer belongs to the customer side, thereby creating and managing mask drawing data with high efficiency and reliability. It is.

The present invention is also directed to a mask used for producing an integrated circuit mask when manufacturing an integrated circuit mask used for semiconductor wafer exposure and sending mask data by connecting online with a mask maker via the Internet or the like. The data is the first type data (including at least one of order slip, mask production specification and chip arrangement data).
And second type data (including integrated circuit pattern data), and linking information of the first type data and the second type data is added to enable time-discrete online transmission to a mask maker, An integrated circuit mask is manufactured using the linking information.

Also, the present invention provides the first type data and the second type data.
The seed data differs in the storage device of the mask data on the data sending side, is created separately and independently, and is sent online to a mask maker.

Further, according to the present invention, when the second type data is sent online to a mask manufacturer, security is ensured by encryption and data sending time is shortened by data compression.

Further, according to the present invention, when a mask used for semiconductor wafer exposure is manufactured, drawing data of a circuit pattern to be formed on a mask is created from circuit pattern data to be formed on a semiconductor wafer, and duplication of drawing data names is performed. Is stored in one computer storage device, and the drawing data selected from the overlapping drawing data is transferred from the computer storage device to a mask maker to produce an integrated circuit mask.

Further, according to the present invention, when a mask used for semiconductor wafer exposure is manufactured, mask drawing data is created by dividing a circuit pattern into a plurality of pieces and performing distributed processing, and overlapping of drawing data names of the divided data is performed. It is allowed to be stored in one computer storage device, and the information defining the arrangement of the divided drawing data on the mask substrate (including the mask data including the alignment mark data of the exposure apparatus) and the mask manufacturing specification After adding link information, the user side discretely sends the information to a mask maker and sends it on-line, and manufactures an integrated circuit mask using the linking information. Here, one computer storage device performs one data search using a computer.
This indicates a storage device on which a search process is executed, and 1
It includes a case where a plurality of storage devices are connected to one computer. In the system of the present embodiment, a raid disk and two optical disks are connected to the EWS.

The drawing data of the mask is 60M at present.
From about B to about 60 GB, mask specification data,
Sequence data and the like are about 6 MB. If there is link information with the drawing data, even if the difference in data amount is extremely large, the mask manufacturer first obtains the mask specification data, array data, and the like (sends a small data amount first), Preparations for mask production can be started quickly.

In the present invention, the mask writing data is obtained by performing a rule-based optical proximity correction (OPC) process so as to reduce a projection exposure distortion of a semiconductor wafer exposure apparatus.

Further, in the present invention, the mask drawing data includes drawing data for a phase shift mask for improving the resolution of a transfer pattern by causing a phase difference in transmitted light of a photomask.

Further, according to the present invention, the mask writing data is subjected to a rule-based optical proximity correction (OPC) process so as to generate mask data for a semiconductor integrated circuit so as to reduce projection exposure distortion of a semiconductor wafer exposure apparatus. Things.

Further, according to the present invention, the mask writing data is a process for generating mask data for a semiconductor integrated circuit including drawing data for a phase shift mask for improving the resolution of a transfer pattern by causing a phase difference in light transmitted through the mask. Is what you do.

[0028]

Embodiments of the present invention will be described below in detail with reference to the drawings. In all the drawings for describing the embodiments, members having the same functions are denoted by the same reference numerals, and the repeated description thereof will be omitted.

In the embodiments of the present invention, a semiconductor wafer (hereinafter simply referred to as a wafer) refers to a silicon or other semiconductor single crystal substrate (generally a substantially circular shape) used for manufacturing a semiconductor integrated circuit device, a sapphire substrate, or a glass substrate. Other insulating, anti-insulating or semiconductor substrates, or a composite substrate thereof, and a substrate on which an integrated circuit is formed by forming an insulating layer, an epitaxial semiconductor layer, other semiconductor layers, wiring layers, and the like. Note that part or all of the substrate surface may be made of another semiconductor, for example, SiGe. The mask includes an exposure original such as a photomask and a reticle, and is a mask substrate on which a pattern for shielding light or a pattern for changing the phase of light is formed.

(Embodiment 1) The inventor of the present invention has been working on the miniaturization and high integration of a circuit pattern drawn on a mask.
In order to efficiently manufacture a plurality of masks (mask sets) used for manufacturing a semiconductor integrated circuit device, a solution was studied from the following viewpoints.

Circuit design user (customer) design pattern data (SF data) of an integrated circuit formed on a wafer
And efficiently creates mask drawing data for the semiconductor integrated circuit. Here, the mask drawing data (mask data) is written in accordance with the projection exposure apparatus, developing apparatus, etching apparatus, drawing apparatus, developing apparatus, etching apparatus, film forming apparatus, etc. of the wafer manufacturing fabrication. Data creation conditions are set, and data conversion processing is performed by a computer. At this time, a guide including the contents of the mask drawing data creation processing and the processing cost is presented to the circuit design user via a communication line such as the Internet. After the authentication of the circuit design user, from the circuit design user side via a computer network,
It receives the integrated circuit pattern data formed on the wafer, the data indicating the conditions of use of the mask, and the data indicating the method of paying the processing cost, and creates and stores encryption data for the mask writing apparatus. In accordance with an instruction from the circuit design user side, data is sent to a mask writing apparatus or a mask writing data storage apparatus which is connected to the mask writing apparatus via a cable, thereby efficiently manufacturing a projection exposure mask for a semiconductor integrated circuit. This is for creating mask drawing data.

By utilizing the resources of the computer network when creating the mask drawing data, mask data processing is efficiently performed in accordance with the circuit pattern formed on the wafer, and the mask drawing is performed by a mask drawing apparatus. Enables data transmission.

The pattern transfer to the wafer is optimized by optimizing the conditions for creating the mask drawing data in accordance with the circuit pattern formed on the wafer. Mask drawing data for realizing this can be easily created and provided to a circuit design user. Further, since the manufacturing efficiency of the mask can be improved, the manufacturing cost of the mask can be reduced.

Further, with the increase in the degree of integration of circuit patterns, the amount of data of masks and the number of types of masks are increasing, and there is a problem that it is difficult to create and manage mask drawing data.
The second solution studied by the present inventors is a method of constructing a database for creating and managing mask drawing data. This database organizes and stores management information on mask drawing data. However, when registering drawing data in the database, multiple file data creation conditions are set by allowing duplication of file names used for mask drawing. It is possible to create drawing data having the same file name, verify the drawing data after creation, and select the optimum drawing data. Note that, in the database, drawing data having the same file name is distinguished by a registered date, time, minute, and second time difference. The drawing data selected as the optimum drawing data is distinguished by adding a flag on the database. At this time, in the method of changing a part of the file name used for mask drawing, for example, the branch number, along with this, the chip arrangement data specified when forming this file on the mask substrate also has to be changed, The chip array data is created after the writing data is created and the writing data is verified. Conversely, by allowing file names used for mask drawing to overlap, chip array data can be created independently of the progress of drawing data creation.

Further, by dividing the drawing data of the circuit pattern formed on one mask substrate into a plurality of pieces and creating the same, it is possible to reduce the work of creating the drawing data and the processing time.

The mask data created by the distributed processing is automatically sent to the mask maker (mask drawing line) with link information added thereto, so that the mask maker can obtain mask drawing data, array data, order slips, etc. Since the time required for confirmation can be greatly reduced, the manufacturing efficiency of the mask can be improved. Further, since the manufacturing efficiency of the mask can be improved, it is possible to suppress an increase in the manufacturing cost of the mask. The reason that the file name used for mask drawing is allowed to overlap is
If the mask drawing data is made to have a different file name and one mask drawing data is created from the beginning each time, the pattern data of the semiconductor device is constructed in multiple layers and each layer is linked. Because of the special reason that the mask drawing data is created, enormous time and labor are required to create the mask drawing data, and this is from the viewpoint that it is not suitable for manufacturing a semiconductor device with higher integration.

Embodiments of the present invention studied by the present inventors from the above viewpoints will be described in detail below.

FIG. 1 shows an overall system S including a mask processing system according to the present embodiment. This system S includes a circuit design user (customer) U,
Mask drawing data creator MD and mask maker M
M and wafer manufacturing fabrication WF
And The circuit design user U and the mask drawing data creator MD are connected via a communication line such as the Internet. This allows the circuit design user U and the mask drawing data creator MD to freely and quickly exchange information with each other.

The mask drawing data creator MD includes an authentication server (firewall), a user I / O server,
It has a mask data processing server, a library server, and a line device LM1. The library server has a management database and a data storage unit DM for encrypting and storing mask drawing data. Line device LM1
Is capable of encrypting the created mask drawing data. This mask drawing data creator MD
Is connected to the line device LM2 of the mask manufacturer MM through the line device LM1 and a dedicated line (communication line). In the line device LM2, it is possible to decrypt the encrypted mask drawing data. This allows the mask drawing data creator MD and the mask manufacturer MM to freely and quickly exchange information with each other with high security. Also,
In this way, the circuit design user U and the mask manufacturer MM are connected to the network. Respectively,
By interposing the above authentication server (firewall), encryption line device (line device LM1, LM2), etc.,
Security of mask drawing data is secured.

The mask manufacturer MM has a line device LM2
In addition, it has a mask drawing apparatus, a mask inspection apparatus, a mask database, and the like necessary for mask production. Then, the mask manufactured here is transported to the wafer manufacturing fabrication WF. In the wafer manufacturing fabrication WF, a predetermined integrated circuit pattern is transferred (exposed) to a photoresist film on a main surface (device forming surface) of the wafer using the mask, and the semiconductor device is subjected to an etching process, an ion implantation process, and the like. To manufacture.

FIG. 2 shows a processing flow from specification design of a semiconductor product to output of mask design pattern data. This processing step is performed by the circuit design user U.

In the flowchart of FIG. 2 for creating mask design data, according to the specifications of a product to be finally manufactured,
System design, logic design, circuit design, and layout design are performed.

The system design is a process of determining basic specifications required for design, manufacture, and inspection. In this step, functional specifications of the semiconductor device are created based on the system specifications, and the operation is designed in detail. In the function description language and state transition diagram,
For example, the operation of the semiconductor device including the architecture such as the number of function registers and the number of bits of the logic block is determined (step 101).

Subsequently, the logic design is a process of performing a logic simulation and expressing it by logic gates or the like. Here, the logic design is embodied in logic gate units based on system design data. The logic error is corrected by the simulation check (step 102).

The subsequent circuit design is a process of expressing circuit components by performing circuit simulation. Here, the electrical characteristics of elements such as transistors and the like are determined based on the manufacturing conditions of the semiconductor device. Designed.
Based on this, a basic circuit, a circuit cell, and an entire circuit are designed (step 103).

Subsequently, the layout design includes a wiring check,
This is a step of arranging as a circuit pattern by performing a layout rule check. Here, arrangement and wiring of logic gates are performed, and design mask pattern data is created (step 104).

Through these steps, design (SF) data is created and output (step 105). The created mask design data is, for example, CAD (Computer Aided D)
A design processing check such as wiring check and layout check is performed using a computer processing system such as esign). Thereafter, the created mask design pattern data is stored in a karma stream format (S
The data is output in a standard data format of an integrated circuit pattern such as F (Stream Format) data.

FIG. 3 shows a processing flow from mask design pattern data output as SF data or the like to mask drawing data, a mask, and exposure (reduction projection exposure, etc.) to a wafer (substrate). An example is shown. This processing step is usually performed by a circuit design user, but here, processing by a mask drawing data creator MD is assumed.

The mask design data output as SF data is subjected to various processes such as removal of overlap of graphic data, removal of basic graphics, field division, and correction of mask pattern dimensions. In these processes, the setting conditions for converting to mask drawing data differ depending on the apparatus that performs pattern drawing on the mask substrate.

At present, the mask drawing data is in a format dedicated to the mask drawing apparatus of each mask apparatus maker, and is converted according to the applied mask drawing apparatus. For example, as a mask drawing apparatus, MEBE manufactured by ETEC, USA
This apparatus uses a drawing method called a raster method. In drawing a circuit pattern on a mask substrate, electron beam irradiation of a size close to the address size of the mask design data is repeatedly turned on and off (a predetermined energy beam size). On-off irradiation). For example, in HL800 of Hitachi, Ltd., drawing of a circuit pattern on a mask substrate is performed by irradiating a variable size electron beam corresponding to a mask pattern design address unit by a drawing method called a vector method.

The mask drawing data is obtained by matching the mask design pattern data with the data format of the mask drawing pattern and the drawing device, converting the drawing data such as basic figure decomposition for mask drawing and field division, and forming the mask pattern. , And a conversion such as an optical proximity effect correction conversion for correcting distortion at the time of projection exposure.

A circuit pattern can be drawn on a mask based on the mask drawing data thus created. By arranging a plurality of mask writing data converted in this way on a mask, a circuit pattern, an integrated circuit test pattern, a mask test pattern, an exposure alignment mark pattern, and the like can be formed on the mask.

In the process of manufacturing an integrated circuit, a mask having a relatively rough pattern size, such as a circuit pattern used when implanting impurities for forming a diffusion layer (semiconductor region) of a semiconductor integrated circuit, and processing of a gate electrode, circuit wiring, and the like. It is necessary to provide a mask having a fine pattern dimension and a high dimensional accuracy, such as a circuit pattern used for the semiconductor device.

In particular, with the miniaturization of semiconductor integrated circuits,
Optical proximity correction (OPC) for masks used for processing gate electrodes, circuit wiring, etc., reduces projection exposure distortion by distorting the mask pattern.
Proximity Correction), it is necessary to create data such as phase shift mask drawing data by a computer to improve the resolution of the transfer pattern by providing a phase difference to the transmitted light of the mask.

Next, with respect to the mask drawing data processing system shown in FIG. 1, a flow for efficiently creating mask drawing data from an integrated circuit pattern of a circuit design user U via the Internet will be described with reference to FIGS. This will be described with reference to FIGS.

FIG. 4 shows a processing system between the user I / O server and the circuit design user U of the mask drawing data processing system. The user I / O server is connected to the Internet.

When the circuit design user U accesses the user I / O server through the Internet (arrow A),
The home page displays processing contents related to creation and management of mask drawing data, costs required for the processing, and the like (arrow B). Here, the circuit design user U
When performing processing related to creation and management of mask drawing data, the mask drawing data creator MD provides the circuit design user U with a secure card (IC (Integrated circuit) card) for user and group user authentication. Issue (arrow B). This is the circuit design user U
This is a process for ensuring security for the integrated circuit pattern on the side.

The mask drawing data creator MD sends the secure card to the circuit design user U. The circuit design user U uses the secure card to
Set the network address of the personal computer PC or engineering workstation (EWS) on the side. Also, the routing setting of the authentication server (firewall) of the mask data processing system is performed. Between the circuit design user U and the Internet,
If there is an authentication server, it supports routing settings. The mask drawing data creator MD sends to the circuit design user U a processing program that allows the circuit design user U to easily send and accept mask-related data. With this program, user design data can be subjected to data processing such as encryption for security assurance, data compression transmission, and decompression after reception.

FIG. 5 shows a method of creating mask drawing data.

When the circuit design user U accesses the user I / O server using the above-mentioned secure card (arrow C in FIG. 5), the user is authenticated and the mask data processing server can be started (FIG. 5). Arrow D). After this,
User circuit pattern data and cost processing data are received from the circuit design user U. The mask design condition and mask use condition data are received from the circuit design user U as needed, and mask drawing data is created (arrow E).

After the mask drawing data is created, the result of the drawing data creation processing and the processing cost data are sent to the circuit design user U (arrow F). Further, the mask drawing data creator MD stores the mask drawing data in the library server (arrow G). The creation condition data and processing cost data of the mask drawing data are stored in a database (the management database). Also, mask drawing data is usually
The data is encrypted and stored in the data storage unit DM. This allows
Security can be ensured.

FIG. 6 shows a method of creating mask array data. The mask array data is data assuming how the drawing data of the circuit pattern is arranged on the mask. In the data, file names of various patterns on the mask such as an alignment mark described later and position coordinate data on the mask substrate are described.

As described above, the circuit design user U
When the user accesses the user I / O server using the secure card (arrow C in FIG. 6), the user is authenticated and the mask data processing server can be started (arrow D in FIG. 6). Thereafter, the mask design condition and the data for the mask use condition specified by the circuit design user U are received, and the mask arrangement data is created and verified (arrow H).

After the mask array data is created and verified, the result of the array data creation processing and the processing cost data are sent to the user (arrow I). The mask drawing data creator MD stores the created mask array data in the library server (arrow J). The preparation condition data and the processing cost data of the sequence data are stored in a database (the management database). The mask array data is encrypted and stored in the data storage unit DM. Thereby, security can be ensured.

FIG. 7 shows a verification processing method for mask drawing data. When the circuit design user U accesses the user I / O server using the secure card (arrow C in FIG. 7), the user is authenticated and can start the mask data processing server (arrow K in FIG. 7). The mask drawing data of the circuit design user U is searched (arrow L in FIG. 7), and the mask data processing server performs the drawing data verification processing (arrow M in FIG. 7). Then, the drawing data verification processing result and the processing cost data are sent to the circuit design user U (arrow N in FIG. 7).

The circuit design user U confirms the result of the verification processing of the drawing data, and adds a flag indicating whether or not the mask drawing data can be used to the mask drawing data of the library server so that the mask drawing data can be distinguished. Thus, for example, when selecting drawing data subjected to different OPC processing for one circuit pattern, or when using drawing data shared in the same group,
It is possible to efficiently check and draw a mask.

FIG. 8 shows a method of transmitting mask drawing data and array data.

When the circuit design user U accesses the user I / O server using the secure card (arrow C in FIG. 8), the user is authenticated and can start the library server (arrow P in FIG. 8). On the library server,
The desired mask drawing data is searched (arrow Q). The mask drawing data creator MD sends the retrieved mask drawing data and array data of the circuit design user U to the specified mask manufacturing line or the specified EWS server.
The drawing result, the sending result of the array data, and the data indicating the processing cost are sent to the circuit design user U (arrows R1, R
2).

When sending the mask drawing data and array data of the circuit design user U to a mask manufacturing line for designating the mask manufacturing request from which user, data indicating the manufacturing cost processing method are sent as a set.

If a plurality of drawing data to be formed on the mask substrate and arrangement data indicating the arrangement thereof are prepared, together with the arrangement data, a mask manufacturing line designated collectively or a designated EWS server in accordance with the arrangement data. Send processing.

Although the creation of the array data and the creation of the drawing data are not performed at the same time, they can be sent to a mask manufacturing line or a designated EWS server as soon as the confirmation of the drawing data is completed in accordance with the array data.

FIG. 9 shows an example of management information (mask drawing data database) for managing mask drawing data. Although not shown in FIG. 9, the management information also includes the above-described setting conditions for conversion to mask drawing data and the date, month, day, and time of conversion to mask drawing data. Also, the mask drawing data described above is stored on a magnetic disk or the like with the product name, process name, branch number, data conversion date, and the like of the semiconductor integrated circuit device as key items.

The database for the mask drawing data includes various conditions for using mask design data as mask drawing data, that is, a mask drawing data ID (Identifi.
cation), data creation, data flag, drawing device support (data format, address size and mask dimension correction, etc.), exposure support (optical proximity effect correction condition; OP)
C) and data handling (data amount, number of graphics, data sum check value, etc.) are constituent elements. The data sum check value is used when comparing values obtained by performing a sum check calculation process on one mask drawing data as a whole or on circuit graphic data constituting the mask drawing data. Using this data sum check value, when the created mask drawing data is stored on a magnetic disk or the like, or when the mask drawing data is transferred to a mask drawing device, the calculation is performed again to determine whether or not the mask drawing data is abnormal. It is possible to confirm.

Each piece of mask drawing data is managed by a computer using the product name, process name, branch number, data conversion date, etc. of the semiconductor integrated circuit device as key items. Further, the management information shown in FIG. 9 is also a database using the product name, process name, branch number, data conversion date, and the like of the semiconductor integrated circuit device as key items, and thus corresponds to each mask drawing data. Information such as a data format and correction at the time of projection exposure (OPC) can be retrieved from a mask drawing data database. Conversely, by specifying a part of a key item such as a product name, a process name, a branch number, and a data conversion date of a semiconductor integrated circuit device in a mask drawing data database, for example, It is also possible to search (list up) the mask drawing data to be performed. In other words, a mask designer who creates mask design data can search all mask drawing data including a part of the mask drawing data ID in a short time if only a part of the mask drawing data ID is known.

In the mask drawing data database, drawing data having the same file name in the drawing apparatus is distinguished by adding a version in the registration order. From the versioned drawing data, it is possible to determine the drawing data to be used with a flag in the above-mentioned drawing data verification. As a result, the above-mentioned array data is normally completed beforehand in time, and it is not necessary to change the drawing data file name.

The circuit design user U can search for mask drawing data online and write it to the mask drawing data database via a communication line such as the Internet. As a result, the mask designer can specify whether or not the corresponding mask drawing data can be used (flag processing). The information on whether the mask drawing data can be used is stored in the mask drawing data database shown in FIG. Will be recorded.

The retrieved mask drawing data can be verified by graphic display on a monitor screen of a computer. Similarly, the arrangement data when arranging the mask drawing data on the mask substrate can be verified by graphic display on the monitor screen. Therefore, verification of a circuit pattern corresponding to the mask drawing data can be facilitated.

Also, regarding information on mask drawing data created in the past by other users in the same group,
It is recorded in the mask drawing data database shown in FIG. Therefore, as a result of searching the mask drawing data,
When mask drawing data created in the past by a plurality of users can be used, the mask drawing data can be shared without creating mask drawing data again. That is, when the mask drawing data can be shared, the step of creating new mask design data and mask drawing data can be omitted, so that the time required for manufacturing the semiconductor integrated circuit device can be reduced. Becomes possible.

Next, FIG. 10 shows an example of the entire structure of a mask used in the exposure step of manufacturing the semiconductor integrated circuit device according to the present embodiment.

The mask 1 shown in FIG.
It is used when exposing an integrated circuit pattern of M (Dynamic Random Access Memory) onto a wafer (a photoresist film on the wafer; the same applies in the following description), and is enlarged to about 5 times the actual integrated circuit pattern. This is a reticle on which an original circuit pattern is formed. This mask 1 includes chip transfer areas CA and CB and alignment marks A
M or the like. The integrated circuit pattern formed on the mask 1 is transferred to a wafer by a reduction projection exposure apparatus.

The mask substrate 1S constituting the mask 1 is formed of, for example, a transparent quartz glass substrate having a rectangular shape in a plane, and two chip transfer regions CA, CB having, for example, a rectangular shape are formed at the center of the substrate. Are arranged side by side in parallel. Each of the chip transfer areas CA and CB is 1
It corresponds to the transfer amount of one DRAM chip. By arranging two chip transfer areas CA and CB, the throughput of mask manufacturing can be improved and the inspection of the mask can be performed die-to-die.
It is possible to do with a die.

The chip transfer areas CA and CB are formed by being partitioned by a frame-shaped light-shielding band SL made of a light-shielding material such as chrome (Cr). Chip transfer area C
A indicates one integrated circuit pattern. Similarly, the same integrated circuit pattern is formed in the chip transfer area CB. The alignment mark AM is arranged around the light shielding band SL.

The mask 1 has chip transfer areas CA and CB composed of memory circuit areas formed by a plurality of types of mask drawing data. Reference sign CA0 indicates the center coordinates of the chip transfer area CA, and reference sign CB0 indicates the center coordinates of the chip transfer area CB. Mask substrate 1S
By adding an offset to the center of
The mask 1 can be formed. Symbol C0 indicates the center coordinates of the area surrounded by the light-shielding band SL.

The above-mentioned chip transfer areas CA, CB, light shielding band S
L and the alignment mark AM are given file names as independent drawing data. The mask array data includes a file name corresponding to the drawing data and a mask substrate 1.
Position coordinates on S are defined as a set.

The circuit design user U creates mask array data by combining the drawing data name and the position on the mask 1 with the mask arrangement program via the Internet. The mask array data includes all drawing data names mounted on the mask substrate 1S. Based on this mask arrangement data, the drawing data can be automatically retrieved from the database shown in FIG. 9 and an automatic transmission instruction can be given to the mask drawing line.

FIG. 11 shows, as an example of mask design pattern data, a phase for alternately changing the phase from the end of the pattern with respect to the input pattern IP1 (FIG. 11A) of the line-and-space pattern of the exposure wavelength or less. An output pattern OP1 obtained by extracting the shifter pattern and enlarging the pattern by exposure processing in a mask manufacturing process (FIG. 1)
1 (b)). Here, the input pattern IP1 has a plurality of strip-shaped opening patterns 2a that are adjacent to each other in parallel with each other, and a light-shielding pattern 3a that is arranged so as to surround them. In the output pattern OP1, a phase shifter pattern PS1 is disposed at every other strip-shaped opening pattern 2a adjacent to the input pattern IP1 so as to cover the entire plane of the strip-shaped opening pattern 2a. The phase shifter pattern PS1 is created by graphic operation using a computer in accordance with the circuit pattern of the circuit design user U. Phase shifter pattern P
The data in S1 is separate file data. If the shifter cannot be arranged due to the circuit pattern, the data at that location is sent to the circuit design user U side.

FIG. 12 shows an example of a mask design pattern data in which a fine gate pattern having an exposure wavelength or less is formed.
2 (FIG. 12A), an example of generating an output pattern OP2 having three types of pattern data of an opening pattern 2b of a first mask, a phase shifter pattern PS2, and a light-shielding pattern 3b1 of a second mask. It is. In accordance with the circuit pattern of the circuit design user U, the phase shifter pattern PS2 is created by graphic operation using a computer.

In this method, a photoresist film on a wafer is exposed with a first mask, and subsequently exposed with a second mask. In the first mask, the phase of the transmitted light of the mask is inverted across the opening pattern, whereby a fine latent image of only the gate pattern portion is formed. After the exposure of the second mask, a development process is performed to form a desired resist pattern.

FIG. 13 shows an example of a pattern for reducing the transfer distortion by previously distorting the pattern on the mask with respect to the transfer distortion caused by the projection exposure of the circuit pattern. FIG. 13A shows a flat L-shaped input pattern IP3. FIG. 13 (b)
Indicates an output pattern OP3 after the OPC process. This is effective when the pattern width of the L-shaped input pattern IP3 in FIG. 13 is equal to or less than the wavelength of exposure light used for projection exposure. At the time of projection exposure, a minute light-shielding pattern 4a is added to a mask pattern corresponding to a portion where the exposure light intensity becomes excessive, and a minute opening is formed to a mask pattern corresponding to a portion where the exposure light intensity becomes insufficient. The pattern 5a is added. The L-shaped input pattern IP3 in FIG. 13 can be applied to both the opening pattern and the island pattern on the mask.

The user circuit pattern is subjected to graphic operation processing by EWS to create a circuit pattern in which transfer distortion during projection exposure has been corrected.

According to this embodiment, the computer network resources are used to receive the integrated circuit pattern data from the circuit design user U, and to transmit the integrated circuit pattern data to the designated net address as mask drawing data until the reliability of the drawing data is reached. In addition, it is possible to efficiently manufacture a mask for wafer exposure suitable for mask manufacturing conditions including a mask drawing apparatus and wafer manufacturing conditions including a projection exposure apparatus while ensuring security. That is, the mask writing data for forming a highly integrated and fine circuit pattern can be adapted to the mask manufacturing conditions including the mask writing apparatus and the wafer manufacturing conditions including the projection exposure apparatus.

Further, the mask drawing data can be efficiently created, the data creation cost can be reduced, and the mask price can be reduced.

In the step of forming a circuit pattern on a wafer by projection exposure using a mask, a circuit pattern drawn on the mask is highly accurately applied to the wafer by using a mask suitable for the performance of the projection exposure apparatus. It becomes possible to transfer.

Further, since a data sum check value for data handling of mask drawing data can be recorded in a database for mask drawing data, the created mask drawing data can be stored on a magnetic disk or the like, or when mask drawing is performed. When the data is transferred to the electron beam lithography apparatus or the like, it is possible to confirm the presence / absence of abnormality in the mask drawing data by performing the calculation again using the data sum check value.

Also, the integrated circuit pattern data formed on the mask and its array data are distributed to the mask maker with link information added thereto, so that the wafer exposure mask can be manufactured efficiently.

Further, the names of the integrated circuit pattern data formed on the mask substrate are once stored in duplicate, selected from the stored data and distributed to the mask maker, whereby
A mask for semiconductor wafer exposure can be efficiently manufactured by using link data and sum check data.

Further, the mask drawing data can be managed by a computer having a database constructed using the product name, process name, branch number, data conversion date, etc. of the semiconductor integrated circuit device as key items. If the circuit design user U knows only a part of key items such as a product name, a process name, a branch number, and a data conversion date of the semiconductor integrated circuit device in the database, all circuit parts including the part are known. It is possible to search for mask drawing data in a short time.

Further, since the circuit design user can search the mask drawing data and write it in the database online through a predetermined communication line such as the Internet, the user can input the mask drawing data corresponding to the step of drawing the circuit pattern. Usability can be recorded in a database.

Further, since information on mask drawing data created in the past by the same group user can be recorded in the database, if the mask drawing data can be used, the mask drawing data is newly created. It is possible to share the mask drawing data without the need.

The mask drawing data is classified into mask drawing data that can be commonly used by all circuit design users, mask drawing data that can be commonly used within the same group, and mask drawing data that can be used by individual circuit design users. Confidentially managed and provided to the circuit design user. Thereby, mask drawing data for a semiconductor integrated circuit can be efficiently created.

Further, since information on mask drawing data created in the past by the same group user or a plurality of circuit design users U can be recorded in the mask drawing data database, the mask drawing data can be used. In such a case, the mask drawing data can be shared without creating the mask drawing data again. That is, it is possible to omit the step of creating new mask design data and mask drawing data.

Further, the circuit design user U graphically displays on the monitor screen of the computer the mask drawing data retrieved online and the arrangement data for arranging the mask drawing data on the mask substrate, and corresponds to the mask drawing data. Verification of the circuit pattern can be facilitated.

When sending the mask drawing data to the mask manufacturer, the mask drawing data used for the manufacture of the integrated circuit mask should be first-class data including at least one of an order slip, a mask manufacturing specification, and chip arrangement data. And second type data including integrated circuit pattern data, and linking information of the first type data and the second type data is added to enable time-discrete online transmission. Fabrication of integrated circuit mask using information. As a result, the mask manufacturer can quickly start manufacturing the mask, and can efficiently manufacture the mask. This is because if the mask drawing data and the first type data (mask manufacturing specification data, array data, etc.) are sent to the mask manufacturer without being divided, the amount of data will increase, and until the data is sent. There is a problem that the mask maker cannot start manufacturing the mask. On the other hand, if the first type of data having a relatively small data amount is sent to the mask maker first, the mask maker can start preparation for manufacturing the mask desired by the circuit design user U from that point onward. It is possible to smoothly start a full-scale manufacturing of a mask using the second type data (integrated circuit pattern data) having a large amount of data sent from the company. That is, it is possible to reduce the time required for manufacturing the mask because the time originally required for the waiting time can be eliminated.
In the manufacture of semiconductor devices, there may be a special reason that a prototype or a product must be manufactured in a short period of time.
It is a very important task to manufacture a mask for manufacturing a semiconductor device quickly while matching the requirements of the manufacturing equipment of the mask manufacturer MM. Therefore, the technology in the present embodiment is an extremely simple but important technology for advancing the development of the industry related to semiconductor devices in the future.

Also, by using mask data that has been subjected to optical proximity correction (OPC) processing to reduce the projection exposure distortion of the wafer exposure apparatus by distorting the mask pattern, a mask suitable for the performance of the projection exposure apparatus can be used. It is possible to transfer the circuit pattern drawn on the wafer with high accuracy.

Further, the circuit pattern drawn on the mask can be transferred to the semiconductor wafer with high accuracy by the phase shift mask drawing data for generating a phase difference in the transmitted light of the mask to improve the resolution of the transfer pattern. It becomes possible.

(Embodiment 2) FIG. 14 shows an example of a system in which mask drawing data creation processing and a mask creation line are integrated.

The user circuit data is received from the circuit design user U via the Internet, and contracts are made from mask drawing data creation to mask production. In this case, the mask can be manufactured in accordance with both requirements while exchanging communication between the circuit design user U, the mask drawing data processing unit, and the mask manufacturing unit. Cost processing is performed collectively from mask drawing data creation to mask fabrication.
Note that even in the case of separating from the mask production shown in FIG. 1, the cost processing can be collectively received from the mask drawing data creation to the mask production, and can be ordered to the mask manufacturer MM via the Internet.

In the second embodiment, in addition to the effect obtained in the first embodiment, an effect that a mask can be manufactured consistently from the creation of mask drawing data can be obtained. .

(Embodiment 3) FIG. 15 shows an example in which only transfer management of mask drawing data is performed via the Internet. The circuit design user U performs mask drawing data creation processing, receives the drawing data, and manages it collectively. When the user needs it, the mask manufacturer M
Transfer management to M.

In the management of the mask drawing data, the management information for managing the mask drawing data is managed by constructing a mask drawing data database by the method shown in FIG. This is particularly effective when a large number of drawing data are managed in a user group and a part of the drawing data is commonly used.

If the circuit designer owns the mask drawing data, it may not be possible to manage the mask drawing data when the designer changes.
In the third embodiment, since mask drawing data can be managed, such a problem can be eliminated. Therefore, the mask can be manufactured efficiently.

Although the invention made by the inventor has been specifically described based on the embodiment, the invention is not limited to the embodiment and can be variously modified without departing from the gist of the invention. Needless to say,

For example, in the above-described embodiment, the case where a circuit pattern is drawn on a mask using an electron beam drawing apparatus has been described. However, a circuit pattern may be drawn on a mask using a laser beam drawing apparatus.

In the above description, the invention made mainly by the present inventor has been described in terms of the DRA which is the application field in which the invention is based.
Although the description has been given of the case where the present invention is applied to the manufacture of the M, the present invention is not limited thereto.
m Access Memory) or flash memory (EEPR)
OM; Electric Erasable Programmable Read Only Mem
or a semiconductor device having a logic circuit such as a microprocessor, or a semiconductor device having a logic circuit such as a microprocessor, or a hybrid semiconductor device having the memory circuit and the logic circuit provided on the same substrate. The method can also be applied. In addition, although mask production used in a photolithography process in the production process of various semiconductor devices has been described as an example, the present invention can be applied to production of a mask used in production of a liquid crystal substrate, a printed circuit board, a micromachine, or the like.

[0115]

Advantageous effects obtained by typical ones of the inventions disclosed by the present application will be briefly described as follows.
It is as follows. (1). A mask data creation department (or maker) is interposed between a semiconductor device design department (or a designer) and a mask manufacturing department (or a manufacturer), and communication between them is performed. In such a state that satisfactorily is performed, there is a step of connecting between them through a communication line and proceeding from the mask data creation processing to the manufacturing processing by using these configurations, so that the design part of the semiconductor device and the mask are formed. The matching with the manufacturing unit can be performed by the mask data working unit, and the integrated circuit mask pattern can be efficiently drawn on the mask, so that the mask can be manufactured efficiently. (2) According to the above (1), it is possible to reduce the cost of creating mask drawing data and managing the mask drawing data. (3) According to the above (2), in the step of forming a circuit pattern on the semiconductor wafer by projection exposure using a mask,
Since a mask suitable for the performance of the projection exposure apparatus can be used, a circuit pattern drawn on the mask can be transferred onto a semiconductor wafer with high accuracy.

[Brief description of the drawings]

FIG. 1 is an overall explanatory diagram showing a correlation among a mask drawing data creator, a photomask manufacturer, and a circuit design user according to an embodiment of the present invention.

FIG. 2 is an explanatory diagram showing an example of a flowchart from a product specification design to creation of mask pattern data in a manufacturing process of a semiconductor integrated circuit device.

FIG. 3 is an explanatory diagram showing a flow of converting a design pattern data into mask drawing data and transferring a circuit pattern to a semiconductor wafer in a manufacturing process of the semiconductor integrated circuit device.

FIG. 4 is an explanatory diagram showing an example of the start of processing between a circuit design user and a mask drawing data processing system according to an embodiment of the present invention.

FIG. 5 is an explanatory diagram showing an example of a process in which a circuit design user creates mask drawing data using a mask drawing data processing system according to an embodiment of the present invention; It is.

FIG. 6 is an explanatory diagram illustrating an example of a process in which a circuit design user creates mask array data using a mask drawing data processing system according to an embodiment of the present invention;

FIG. 7 is an explanatory diagram illustrating an example of a process in which a circuit design user verifies mask drawing data using a mask drawing data processing system according to an embodiment of the present invention;

FIG. 8 is an explanatory diagram showing an example of a process in which a circuit design user sends mask drawing data using a mask drawing data processing system according to an embodiment of the present invention.

FIG. 9 is an explanatory diagram showing an example of management information (mask drawing data database) for managing mask drawing data in a manufacturing process of a mask for a semiconductor integrated circuit in one embodiment of the present invention.

FIG. 10 is an explanatory diagram showing an overall configuration of a photomask used for manufacturing a semiconductor integrated circuit device according to an embodiment of the present invention.

FIG. 11 is an explanatory diagram of creating phase shift mask data used in an embodiment of the present invention.

FIG. 12 is an explanatory diagram of creating phase shift mask data used in another embodiment of the present invention.

FIG. 13 is an explanatory diagram of creating optical proximity effect correction data used in another embodiment of the present invention.

FIG. 14 is an explanatory diagram showing a correlation with a user when mask data processing and mask production used in another embodiment of the present invention are integrated.

FIG. 15 is an explanatory diagram showing a correlation between a mask data management system used in another embodiment of the present invention and a user.

[Explanation of symbols]

 DESCRIPTION OF SYMBOLS 1 Photomask 1S Mask substrate 2a, 2b Opening pattern 3a, 3b, 3b1 Light-shielding pattern 4a Light-shielding pattern 5a Opening pattern S System U Circuit design user MD Mask drawing data maker MM Mask maker WF Semiconductor wafer manufacturing Fabrication LM1 Line device LM2 Line device DM Data storage unit CA, CB Chip transfer area AM Alignment mark SL Shading band IP1, IP2, IP3 Input pattern OP1, OP2, OP3 Output pattern PS1, PS2 Phase shifter pattern

 ────────────────────────────────────────────────── ─── Continuing on the front page (72) Inventor Masamichi Kobayashi 5-20-1, Kamizuhoncho, Kodaira-shi, Tokyo F-term in the Semiconductor Group, Hitachi, Ltd. (Reference) 2H095 BA01 BB02 5B046 AA08 BA10 DA05 GA01 KA04 KA05

Claims (5)

[Claims] 1. A method for creating and managing mask drawing data used for manufacturing an integrated circuit mask for a plurality of customers, comprising:
Receiving the circuit pattern data formed on the semiconductor wafer of the customer in response to receiving the mask drawing data processing request signal from the customer after the customer authentication, and encrypting and storing the received circuit pattern data;
(B) a step of creating mask drawing data and encrypting and storing the drawing data according to the customer's selection with respect to a menu of drawing data creation conditions; and (c) masking the customer unit or the entire group to which the customer belongs after customer authentication. Drawing data by drawing data search, sending the drawing data to a customer-specified network address and performing a decryption process, (d) deleting the drawing data registered by the instruction after the customer authentication, and (e) belonging to the customer Presenting the data of the number of drawing data files, the total data volume, and the storage period of the group to the customer side. 2. A data processing system for creating and managing mask drawing data used for producing a projection exposure mask of a customer, comprising: (a) means for receiving, via the Internet, circuit pattern data to be formed on a user's semiconductor wafer;
(B) means for displaying a menu of mask drawing data creation contents corresponding to a standard process of semiconductor manufacturing, (c) means for creating mask drawing data by menu selection by a customer,
(D) means for encrypting and storing customer mask drawing data;
(E) means for retrieving drawing data by retrieving customer data, (f) means for sending to a network address designated by the customer to perform decoding processing on the drawing data, (g) number of drawing data files and total data volume of the customer And a means for counting a storage period. 3. A method for manufacturing a photomask used for semiconductor wafer exposure, comprising: connecting a mask maker online via a communication line to send mask data;
The mask data used for manufacturing the integrated circuit mask is divided into first type data including at least one of an order slip, a mask manufacturing specification, and chip arrangement data, and second type data including integrated circuit pattern data. Linking information between the seed data and the second type data is added to enable time-dispersed online transmission to a mask maker, and an integrated circuit mask is manufactured using the linking information. Production method. 4. When manufacturing a photomask used for semiconductor wafer exposure, drawing data of a circuit pattern formed on a photomask is created from circuit pattern data formed on a semiconductor wafer, and duplication of drawing data names is allowed. And storing the image data in one computer storage device, and transferring the drawing data selected from the duplicated drawing data to the mask maker from the computer storage device to a mask maker to perform mask drawing. 5. When manufacturing a photomask used for semiconductor wafer exposure, one computer storage device is formed by dividing mask data into a plurality of pieces and creating the mask data by distributed processing, and allowing overlapping of drawing data names of the divided data. The mask data, including the alignment mark data of the exposure apparatus, the information defining the arrangement of the divided drawing data on the mask substrate, the link information with the mask manufacturing specification, and the computer A method of manufacturing a photomask, comprising: discretely sending the information from a storage device to a mask maker and sending it on-line; and using the linking information to manufacture an integrated circuit mask.