JP2002346741A - Jig and method for brazing - Google Patents

Jig and method for brazing

Info

Publication number
JP2002346741A
JP2002346741A JP2001155946A JP2001155946A JP2002346741A JP 2002346741 A JP2002346741 A JP 2002346741A JP 2001155946 A JP2001155946 A JP 2001155946A JP 2001155946 A JP2001155946 A JP 2001155946A JP 2002346741 A JP2002346741 A JP 2002346741A
Authority
JP
Japan
Prior art keywords
brazing
jig
carbon
graphite
spring
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP2001155946A
Other languages
Japanese (ja)
Inventor
Yoshihisa Suda
吉久 須田
Osamu Shimizu
修 清水
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Mitsubishi Pencil Co Ltd
Original Assignee
Mitsubishi Pencil Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Mitsubishi Pencil Co Ltd filed Critical Mitsubishi Pencil Co Ltd
Priority to JP2001155946A priority Critical patent/JP2002346741A/en
Publication of JP2002346741A publication Critical patent/JP2002346741A/en
Pending legal-status Critical Current

Links

Classifications

    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001Technical content checked by a classifier
    • H01L2924/0002Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00

Landscapes

  • Lead Frames For Integrated Circuits (AREA)

Abstract

PROBLEM TO BE SOLVED: To provide a jig for brazing which is suitable for use at a high temperature. SOLUTION: A carbon based spring member 18 containing amorphous carbon and graphite is used, as a jig for fixing a ceramic substrate 14 to a jig body 10.

Description

【発明の詳細な説明】DETAILED DESCRIPTION OF THE INVENTION

【0001】[0001]

【発明の属する技術分野】半導体のセラミックパッケー
ジをはじめとする電子部品の製造工程において、リード
ピン、リードフレームのろう付に際し、位置決めや荷重
負荷を目的に、炭素系ばね部材を用いるろう付用治具及
びろう付方法に関する。
The present invention relates to a brazing jig using a carbon spring member for the purpose of positioning and applying a load when brazing lead pins and lead frames in a process of manufacturing electronic components such as a semiconductor ceramic package. And a brazing method.

【0002】[0002]

【従来の技術】電子工業部品の多様化と短小軽薄化に伴
い、電子工業部品の製作に使用される耐熱性治具の形状
は複雑多岐となっている。具体的には、主に多層セラミ
ックであるパッケージ基板における入出力電気信号線の
配線密度を高め、信号線導体の抵抗値を下げること、信
号線導体に低コスト材料を使用すること、絶縁材料の誘
電率を下げること等が要求されている。この多層セラミ
ック基板に接続ピンを取り付ける技術として、従来は多
層セラミック基板では、銀ろう、金−すずろう材を用
い、コバール又は4・2アロイ等の材質の接続ピンを主
にカーボン製の治具により取り付けていた。この種の半
導体のセラミックパッケージ等の電子部品を製造する目
的の治具はその性質上、セラミック基板、リードピン、
リードフレーム、素子等の多くの構成要素を本体の表面
に精度よく位置決めする必要があるものである。また小
さなリードピン、リードフレーム等をろう付するにも、
接着時の補助的な荷重が必要であり、その荷重にも高精
度が要求されるものである。
2. Description of the Related Art With the diversification of electronic industrial parts and their reduction in size and weight, the shape of heat-resistant jigs used for manufacturing electronic industrial parts has become complicated and diverse. Specifically, the wiring density of the input / output electric signal lines on the package substrate, which is mainly a multilayer ceramic, is increased, the resistance value of the signal line conductor is reduced, a low-cost material is used for the signal line conductor, the insulating material is used. It is required to lower the dielectric constant. As a technique for attaching connection pins to this multilayer ceramic substrate, conventionally, a multilayer ceramic substrate is made of silver brazing or gold-tin brazing material, and the connecting pins made of a material such as Kovar or 4.2 alloy are mainly made of carbon jigs. It was attached by. Jigs for the purpose of manufacturing electronic components such as this type of semiconductor ceramic package are, by their nature, ceramic substrates, lead pins,
It is necessary to accurately position many components such as a lead frame and an element on the surface of the main body. Also for brazing small lead pins, lead frames, etc.
An auxiliary load is required at the time of bonding, and the load also requires high precision.

【0003】[0003]

【発明が解決しようとする課題】従来、セラミックパッ
ケージ等の電子部品の製造用治具において、位置決めに
ついては、治具本体と同材質の黒鉛製のネジでとめる方
法やステンレス等の金属製のばねを用いて押さえること
によって固定する方法などが主体であった。しかし、セ
ラミックパッケージ等の製造に際し、リードピン、リー
ドフレームのろう付時の様な高温度下では、ねじでとめ
る方法の場合には黒鉛製等の治具と製品との熱膨張係数
の相違により、しばしば治具の割れや製品形状の変形な
ど双方への悪影響が問題であった。また、金属製のばね
を用いて押さえても、高温下でばねが「へたり」、ばね
特性を維持する事が出来なくなり押さえとしての意味を
なさなくなり、製品の精度低下が問題となっていた。
Conventionally, in a jig for manufacturing an electronic component such as a ceramic package, positioning is performed by a method of fixing with a graphite screw of the same material as that of the jig body, or a metal spring such as stainless steel. The method of fixing by pressing with a key was mainly used. However, when manufacturing ceramic packages, etc., at high temperatures such as when brazing lead pins and lead frames, in the case of the method of fastening with screws, due to the difference in the coefficient of thermal expansion between the jig made of graphite etc. and the product, Often, adverse effects on both, such as cracking of the jig and deformation of the product shape, were a problem. In addition, even if the spring is pressed using a metal spring, the spring "sets" under high temperatures, the spring characteristics cannot be maintained, and the spring does not have any meaning. .

【0004】接着時に補助的な荷重をかける場合は、ス
テンレスなどの金属製のばねで押す方法や荷重に相当す
るいわゆる「重し」をのせる等の方法が取られてきた。
通常の金属製の重しを治具として使用する場合、実荷重
分の重しを必要とするため取り扱いが困難であり均一か
つ微弱な荷重調整を行いにくいうえ、熱容量の大きな金
属製重しの加熱冷却を繰り返し行うためにエネルギー消
費効率が悪い等の問題が生じている。そのため、重しに
代わり省スペース化の可能な金属やセラミックス製のコ
イル状ばねが治具として検討され、金属ばね材としては
ステンレスやインコネル等が使用されているが、耐熱性
金属であるインコネル材であっても600℃を越えると
ばねとしての性能を保つことは困難であり、耐久性も劣
る。また、セラミックスばね材としてはアルミナや窒化
珪素等は使用されているが、セラミックスと言えども素
材の融点を超えて使用することは不可能であり、アルミ
ナで1300℃程度、窒化珪素でも1100℃程度を越
えるとばねとしての性能を保つことが困難であり、更に
微弱な荷重調整の可能なコイルばねを作製することも難
しい。
When an auxiliary load is applied at the time of bonding, a method of pressing with a metal spring such as stainless steel or a method of applying a so-called "weight" corresponding to the load has been adopted.
When using a normal metal weight as a jig, it is difficult to handle it because it requires a weight for the actual load, making it difficult to adjust the load evenly and weakly. Problems such as poor energy consumption efficiency occur due to repeated heating and cooling. For this reason, metal or ceramic coil springs, which can save space instead of weights, have been studied as jigs. Stainless steel, Inconel, etc. are used as metal spring materials. However, if the temperature exceeds 600 ° C., it is difficult to maintain the performance as a spring, and the durability is poor. Alumina, silicon nitride or the like is used as a ceramic spring material. However, it is impossible to use ceramics beyond the melting point of the material. When the value exceeds, it is difficult to maintain the performance as a spring, and it is also difficult to produce a coil spring capable of finely adjusting the load.

【0005】本発明の目的は、前述のような従来の欠点
を解消し、高精度で、高効率なろう付用治具及びろう付
方法を提供することにある。
SUMMARY OF THE INVENTION An object of the present invention is to provide a brazing jig and a brazing method with high precision and high efficiency which solve the above-mentioned conventional drawbacks.

【0006】[0006]

【課題を解決するための手段】本発明者は鋭意研究を行
った結果、半導体のセラミックパッケージ等の電子部品
の製造方法で、リードピン、リードフレーム等のろう付
に際し、アモルファス炭素と黒鉛とを含み、高温焼成し
て得られた炭素系ばね部材を使用するろう付用治具及び
ろう付方法は、熱容量が小さく加熱に際しての消費エネ
ルギー量の小さな炭素材である為、エネルギーコストの
低減が図れることに加えて、治具の割れや製品形状の変
形など双方への悪影響がなく、繰り返して高温下で使用
しても、ばねの「へたり」がないことから、製品の精度
が飛躍的に向上することを知見し、本発明を完成するに
至ったのである。
Means for Solving the Problems As a result of diligent research, the present inventor has found that a method of manufacturing an electronic component such as a semiconductor ceramic package includes amorphous carbon and graphite when brazing lead pins and lead frames. Since the brazing jig and the brazing method using the carbon-based spring member obtained by firing at a high temperature have a small heat capacity and a small amount of energy consumed for heating, the energy cost can be reduced. In addition, there is no adverse effect on both, such as cracking of the jig and deformation of the product shape, and there is no "slack" of the spring even when repeatedly used at high temperatures, so the accuracy of the product is dramatically improved Thus, the present inventors have completed the present invention.

【0007】本発明によれば、アモルファス炭素と黒鉛
とを含み、電子部品の製造に用いるろう付用治具として
必要な形状を有するろう付用治具が提供される。本発明
によれば、アモルファス炭素と黒鉛を含む部材を電子部
品製造におけるろう付用治具として用いるろう付方法も
また提供される。前記部材は、ろう付時の位置決めをす
る際の押さえとして使用することができる。前記部材
は、ろう付時のろう材による接着を補助する為に、荷重
をかける事を目的として使用することもできる。
According to the present invention, there is provided a brazing jig containing amorphous carbon and graphite and having a required shape as a brazing jig used for manufacturing electronic components. According to the present invention, there is also provided a brazing method in which a member including amorphous carbon and graphite is used as a brazing jig in electronic component production. The member can be used as a holder for positioning during brazing. The member may be used for the purpose of applying a load in order to assist the bonding with the brazing material during brazing.

【0008】[0008]

【発明の実施の形態】図1を参照して、本発明の、ろう
付時の位置決めをする際のろう付治具及びろう付方法を
説明する。図1において、カーボン製の治具本体10
に、セラミック基板14を固定する目的で基板14を受
ける座12を設け、炭素製ばね材18を座20で固定
し、炭素製ばね材18のばね圧力により基板押さえ治具
16を介してセラミック基板14を治具本体10の上に
固定する。
DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS A brazing jig and a brazing method for positioning during brazing according to the present invention will be described with reference to FIG. In FIG. 1, a jig body 10 made of carbon is used.
In order to fix the ceramic substrate 14, a seat 12 for receiving the substrate 14 is provided. 14 is fixed on the jig body 10.

【0009】セラミック基板14としては、アルミナグ
リーンシートに、導体としてのタングステン又はモリブ
テン等を、1500℃以上で焼結したアルミナ多層セラ
ミック基板や、ガラスアルミナグリーンシートに、導体
としての、金、白金、銀、銀−パラジウム、銅を、10
00℃以下で焼結したガラスアルミナ低温焼結多層セラ
ミック基板がある。図2を参照して、本発明の、セラミ
ック基板に接続ピンをろう付する際のろう付治具及びろ
う付方法の他の例を説明する。図2において、ガラスア
ルミナグリーンシートのセラミック基板22に形成した
スルーホール部分24に、スパッタリングでクロム層2
6、パラジウム層28を形成し、カーボン製の接続ボル
ト30及びナット32で組み立てられた同カーボン製の
治具本体34に装着し、次に金−すずのろう材36を付
け、炭素製ばね38で荷重負荷用のピン39を介して所
望の荷重を、接続ピン40及びセラミック基板22に負
荷する。次に、ろう材を溶融させるために300℃〜9
00℃の真空下あるいは不活性雰囲気下で熱処理を行
う。処理温度は用いるろう材の融点により適宜設定す
る。
As the ceramic substrate 14, an alumina multi-layer ceramic substrate obtained by sintering tungsten or molybdenum as a conductor at 1500 ° C. or higher on an alumina green sheet, or a gold, platinum, Silver, silver-palladium, copper
There is a glass-alumina low-temperature sintering multilayer ceramic substrate sintered below 00 ° C. With reference to FIG. 2, another example of a brazing jig and a brazing method for brazing a connection pin to a ceramic substrate according to the present invention will be described. In FIG. 2, a chromium layer 2 is formed by sputtering on a through-hole portion 24 formed in a ceramic substrate 22 of a glass alumina green sheet.
6. A palladium layer 28 is formed, attached to a carbon jig body 34 assembled with carbon connection bolts 30 and nuts 32, and then a gold-tin brazing material 36 is attached, and a carbon spring 38 is used. A desired load is applied to the connection pins 40 and the ceramic substrate 22 via the load pins 39. Next, in order to melt the brazing material, 300 ° C.-9
The heat treatment is performed in a vacuum of 00 ° C. or in an inert atmosphere. The processing temperature is appropriately set according to the melting point of the brazing material used.

【0010】ここでカーボン製の治具10,12,1
6,20,30,32,34は、製品の性質上、高純度
黒鉛製であることと、炭素系ばね部材18,38は、真
空下での高温処理などの高純度処理を施すことが肝要で
ある。また本発明に用いる炭素系ばね部材は、実質的に
難黒鉛化性炭素のみからなるアモルファス炭素と黒鉛と
を含む炭素系ばね部材である。この炭素系ばね部材は、
焼成後に難黒鉛化性炭素となる一種または二種以上の樹
脂を含む樹脂組成物に黒鉛を混合し、該混合物を所望の
形状に賦形し、該賦形物を焼成することによって製造さ
れる。前記黒鉛は、賦形性及び構造制御を容易とするた
めに、平均粒径100μm以下の高配向性熱分解黒鉛
(HOPG)、キッシュ黒鉛、天然黒鉛、人造黒鉛、直
径100nm以下の気相成長炭素繊維より選ばれることが
望ましい。また製造段階で、通常の樹脂成形に用いられ
る成形方法を用いて高分子樹脂中に黒鉛粉末を均一に分
散複合させた混合物を所望するコイルばね状、板形状に
成形するのに際し、該黒鉛を通常の樹脂成形方法を用い
て一方向に高度に配向制御させた後、不活性雰囲気中、
非酸化性雰囲気中、または真空中で焼成し、高分子樹脂
を炭素化することにより、外部からの特別の圧力を印加
しなくとも樹脂焼成時接合力、パッキング、収縮力を利
用できるため、高度に黒鉛とアモルファス炭素が損失無
く一体化し、治具としての使用時に炭素粉末が剥離する
ことのないコイルばね状治具が簡易かつ安価に製造され
る。
Here, carbon jigs 10, 12, 1
6, 20, 30, 32, and 34 are made of high-purity graphite due to the nature of the product, and the carbon-based spring members 18 and 38 must be subjected to high-purity treatment such as high-temperature treatment under vacuum. It is. The carbon-based spring member used in the present invention is a carbon-based spring member containing amorphous carbon and graphite, which are substantially composed of only non-graphitizable carbon. This carbon-based spring member
It is manufactured by mixing graphite with a resin composition containing one or more resins that become non-graphitizable carbon after firing, shaping the mixture into a desired shape, and firing the shaped object. . The graphite is highly oriented pyrolytic graphite (HOPG) having an average particle diameter of 100 μm or less, quiche graphite, natural graphite, artificial graphite, and vapor-grown carbon having a diameter of 100 nm or less in order to facilitate shapeability and structure control. Desirably selected from fibers. Also, at the manufacturing stage, when molding a mixture obtained by uniformly dispersing and compounding graphite powder in a polymer resin using a molding method used for ordinary resin molding into a desired coil spring shape, a plate shape, the graphite is used. After highly oriented control in one direction using ordinary resin molding method, in an inert atmosphere,
By baking in a non-oxidizing atmosphere or in a vacuum to carbonize the polymer resin, it is possible to use the bonding force, packing, and shrinkage force during resin baking without applying special pressure from the outside. Thus, a coil spring-shaped jig in which graphite and amorphous carbon are integrated without loss and the carbon powder does not peel off when used as a jig can be easily and inexpensively manufactured.

【0011】焼成によりアモルファス状炭素、好ましく
は、高温下での使用時に黒鉛化が進行しない難黒鉛化性
炭素となり得る高分子樹脂とは、炭素化前段階の加熱時
に分子間架橋を生じさせ三次元化させることで、高い炭
素残渣収率を示すものであり、かつ、焼成炭素化時に黒
鉛粉末をパッキング、収縮する能力を有するものであ
り、熱硬化性樹脂や熱可塑性樹脂の一種または二種以上
の複合体である。ここで熱硬化性樹脂としては、フェノ
ール樹脂、フラン樹脂、エポキシ樹脂、キシレン樹脂、
ベンゾオキサジン樹脂、不飽和ポリエステル樹脂、メラ
ミン樹脂、アルキッド樹脂、コプナ樹脂等が用いられ、
経時熱構造変化の少ないことなどから、好ましくはフラ
ン樹脂及びフェノール樹脂が用いられる。また、熱可塑
性樹脂としては、ポリ塩素化塩化ビニル樹脂、ポリアク
リロニトリル、ポリアミド、ポリイミド等が用いられ、
成形性の容易さ及びフラン樹脂やフェノール樹脂と複合
化した際の取り扱いの容易さから好ましくはポリ塩素化
塩化ビニル樹脂が用いられる。
A polymer resin which can be converted into amorphous carbon by firing, preferably non-graphitizable carbon which does not progress graphitization when used at a high temperature, is formed by intermolecular cross-linking during heating prior to carbonization to form tertiary carbon. It has a high carbon residue yield, and has the ability to pack and shrink graphite powder during firing carbonization, and can be one or two types of thermosetting resins and thermoplastic resins. This is the above complex. Here, as the thermosetting resin, phenol resin, furan resin, epoxy resin, xylene resin,
Benzoxazine resin, unsaturated polyester resin, melamine resin, alkyd resin, copna resin, etc. are used,
Preferably, furan resin and phenol resin are used because of little change in thermal structure with time. Further, as the thermoplastic resin, polychlorinated vinyl chloride resin, polyacrylonitrile, polyamide, polyimide and the like are used,
Polychlorinated vinyl chloride resin is preferably used from the viewpoint of easy moldability and easy handling when combined with a furan resin or a phenol resin.

【0012】次に本発明において用いられる黒鉛粉末に
ついて説明する。黒鉛粉末とは、高配向性熱分解黒鉛
(HOPG)、キッシュ黒鉛、天然黒鉛、人造黒鉛等で
ある。使用する黒鉛粉末の種類と量は、目的とするばね
の寸法、強さ等により適宜選択され、単独でも二種以上
の混合体でも使用することができるが、特にばねの強さ
の制御が容易なことから、結晶が良く発達した鱗状黒鉛
粉末を使用することが好ましい。黒鉛粉末の粒径は、成
形性及び黒鉛の一方向への配向制御の容易なことから平
均粒径が100μm以下であることが好ましい。以下に
本発明による、高温不活性雰囲気中もしくは高温真空中
において、加熱加圧しながら素材を接合する工程で用い
る、アモルファス炭素と黒鉛粉末との複合炭素材料から
なり高温耐熱性と高温下ばね特性を有するコイルばね状
治具の製造方法を説明する。
Next, the graphite powder used in the present invention will be described. The graphite powder is highly oriented pyrolytic graphite (HOPG), quiche graphite, natural graphite, artificial graphite, or the like. The type and amount of the graphite powder to be used is appropriately selected depending on the size, strength, etc. of the target spring, and can be used alone or in a mixture of two or more kinds. Particularly, control of the strength of the spring is easy. Therefore, it is preferable to use a scale-like graphite powder in which crystals are well developed. The average particle size of the graphite powder is preferably 100 μm or less in view of moldability and easy control of the orientation of graphite in one direction. In the following, according to the present invention, in a high-temperature inert atmosphere or a high-temperature vacuum, used in the step of bonding the material while heating and pressing, comprising a composite carbon material of amorphous carbon and graphite powder, high-temperature heat resistance and high-temperature lower spring characteristics. A method for manufacturing a coil spring-shaped jig having the same will be described.

【0013】まず、コイルばね状治具として必要な特性
を具備せしめることを目的として、焼成後にアモルファ
ス炭素となる高分子樹脂と黒鉛粉末とを適宜選択した
後、混合機を用いて充分に分散させる。次にこの混合体
を、製膜機や押し出し成型機のような通常のプラスチッ
ク成形を行う際に使用されている成形機を用い、黒鉛微
粉末を一方向に配向制御させつつコイルばね形状に成形
する。得られたコイルばね形状体に、エアオーブン中で
炭素前駆体化処理及び固化処理を施した後、窒素、アル
ゴン等の不活性ガス雰囲気中で昇温速度を制御しつつ焼
成することで炭化を終了させ、アモルファス炭素中に黒
鉛粉末が一方向に配向した炭素複合体からなるコイルば
ね状治具が得られる。ここで、炭素化は不活性ガス雰囲
気もしくは真空下で700〜2800℃程度まで加熱昇
温し行われるが、炭素化時の昇温速度が大きいと賦形体
の形状が変形したり微細なクラックが生じるなどの欠陥
が生じる。したがって、500℃までは毎時50℃以
下、それ以降も毎時100℃以下で行うことが適切であ
る。
First, for the purpose of providing the necessary properties as a coil spring-like jig, a polymer resin and graphite powder which become amorphous carbon after firing are appropriately selected and then sufficiently dispersed using a mixer. . Next, this mixture is formed into a coil spring shape while controlling the orientation of the graphite fine powder in one direction using a molding machine used when performing ordinary plastic molding such as a film forming machine or an extrusion molding machine. I do. The obtained coil spring-shaped body is subjected to carbon precursor treatment and solidification treatment in an air oven, and then carbonized by firing in an inert gas atmosphere such as nitrogen or argon while controlling the temperature rising rate. After the termination, a coil spring-like jig made of a carbon composite in which graphite powder is oriented in one direction in amorphous carbon is obtained. Here, the carbonization is performed by heating and raising the temperature to about 700 to 2800 ° C. in an inert gas atmosphere or under vacuum. However, if the heating rate during the carbonization is high, the shape of the shaped body may be deformed or fine cracks may occur. Defects. Therefore, it is appropriate to perform the process at 50 ° C. or less per hour up to 500 ° C. and at 100 ° C. or less thereafter.

【0014】また本発明で、通常の樹脂成形に用いられ
る成形方法を用いてアモルファス炭素と黒鉛粉末との複
合材料からなるコイルばねを作製するのに際して、目的
とするばねの寸法、強さを得るために黒鉛粉末を一方向
に高温に配向制御させて成形し、高温耐熱性を得るため
に不活性雰囲気中または、真空中で治具として使用する
温度よりも260℃以上500℃以下の温度だけ高い温
度、好ましくは約300℃高い温度まで焼成炭素化処理
を施すことで、治具としての必要スペックを満たしたコ
イルばねを簡易に製造することができるうえ、微弱な荷
重調整可能なものを作製することが可能となり、製造上
も使用時剥離炭素粉が発生することのないコイルばね状
治具を効率よく安価に製造することができる。
Further, in the present invention, when manufacturing a coil spring made of a composite material of amorphous carbon and graphite powder by using a molding method used for ordinary resin molding, the desired size and strength of the spring are obtained. In order to obtain high-temperature heat resistance, the graphite powder is shaped in one direction by controlling the orientation at a high temperature, and in an inert atmosphere, or at a temperature of 260 ° C or more and 500 ° C or less than the temperature used as a jig in a vacuum. By performing the carbonization treatment at a high temperature, preferably about 300 ° C. higher, a coil spring that meets the required specifications as a jig can be easily manufactured, and a material that can adjust a weak load can be manufactured. This makes it possible to efficiently and inexpensively manufacture a coil spring-like jig that does not generate exfoliated carbon powder during use.

【0015】[0015]

【実施例】次に本発明を実施例により、さらに具体的に
説明するが、本発明はこの実施例によって何ら限定され
るものではない。実施例1 図1に示す如く、カーボン製の治具本体10に、セラミ
ック基板14を固定する目的で基板を受ける座12を設
け、炭素製ばね材18を座20で固定し、炭素製ばね材
18のばね圧力により基板押さえ治具16を介してセラ
ミック基板14を治具本体10の上に固定し、セラミッ
ク基板14上にリードピン及びリードフレームのろう付
を行ったところ、従来の、ねじでとめる方法の場合に比
較して、黒鉛製等の治具と製品との熱膨張係数の相違に
よる治具の割れや製品形状の変形などがなく、また炭素
系ばね部材18がへたらない為、精度向上に伴う歩留ま
りが向上した。
EXAMPLES Next, the present invention will be described more specifically with reference to examples, but the present invention is not limited to these examples. Embodiment 1 As shown in FIG. 1, a seat 12 for receiving a substrate for fixing a ceramic substrate 14 is provided on a jig main body 10 made of carbon, and a spring member 18 made of carbon is fixed by a seat 20. When the ceramic substrate 14 is fixed on the jig main body 10 via the substrate holding jig 16 by the spring pressure of 18, and the lead pins and the lead frame are brazed on the ceramic substrate 14, the conventional screws are used to stop them. Compared with the method, there is no cracking of the jig or deformation of the product shape due to a difference in the coefficient of thermal expansion between the jig made of graphite or the like and the product. The yield with the improvement has improved.

【0016】実施例2 図2に示す如く、ガラスアルミナグリーンシートのセラ
ミック基板22に形成したスルーホール部分24に、ス
パッタリングでクロム層26、パラジウム層28を形成
し、カーボン製の接続ボルト30及びナット32で組み
立てられた同カーボン製の治具本体34に装着した後、
金−すずのろう材36を付け、炭素製ばね38で荷重負
荷用のピン39を介して所望の荷重を、リードピン40
及びセラミック基板22に負荷する。次に、ろう材を溶
融させるために600℃の不活性雰囲気下で20分の熱
処理を行った。従来の「重し」を用いての方法に比べて
十分な荷重が負荷出来るため、十分な接着強度が得られ
たと同時に、エネルギーコストが3分の1程度に押さえ
る事が出来た。また、製品一つ一つに荷重が負荷出来る
為、製品の精度向上に伴う歩留まりが向上した。
Embodiment 2 As shown in FIG. 2, a chromium layer 26 and a palladium layer 28 are formed in a through-hole portion 24 formed in a ceramic substrate 22 of a glass alumina green sheet by sputtering, and a connection bolt 30 and a nut made of carbon are formed. After attaching to the carbon jig body 34 assembled in 32,
A gold-tin brazing material 36 is attached, and a carbon spring 38 applies a desired load via a load-loading pin 39 to a lead pin 40.
And load on the ceramic substrate 22. Next, a heat treatment was performed for 20 minutes in an inert atmosphere at 600 ° C. to melt the brazing material. Since a sufficient load can be applied as compared with the method using the conventional "weight", sufficient adhesive strength was obtained, and at the same time, the energy cost was reduced to about one third. In addition, since a load can be applied to each product, the yield associated with the improvement in product accuracy has been improved.

【0017】[0017]

【発明の効果】以上説明したように、本発明の炭素系ば
ね部材を使用するろう付用治具及びろう付方法は、エネ
ルギーコストの低減が図れることに加えて、治具の割れ
や製品形状の変形など双方への悪影響がなく、繰り返し
て高温下で使用しても、ばねの「へたり」がないことか
ら、製品の精度が高い極めて優れたものである。
As described above, the brazing jig and the brazing method using the carbon-based spring member of the present invention not only reduce the energy cost, but also reduce the jig cracking and product shape. It has no adverse effect on both sides such as deformation of the spring, and even when used repeatedly at high temperature, there is no "sag" of the spring.

【図面の簡単な説明】[Brief description of the drawings]

【図1】本発明のろう付時の位置決めをする際のろう付
治具及びろう付方法の一例を示す図である。
FIG. 1 is a diagram showing an example of a brazing jig and a brazing method for positioning during brazing according to the present invention.

【図2】セラミック基板に接続ピンやリードフレームを
ろう付する際のろう付治具及びろう付方法の一例を示す
図である。
FIG. 2 is a diagram showing an example of a brazing jig and a brazing method when brazing a connection pin or a lead frame to a ceramic substrate.

【符号の説明】[Explanation of symbols]

10,34…治具本体 12…基材を受ける座 14…セラミック基板 16…基材押さえ治具 18…炭素系ばね部材 20…炭素系ばね部材を受ける座 30…治具接続ボルト 32…治具接続ナット 22…セラミック基板 40…リードピン 36…ろう材 28…パラジウム層 26…クロム層 24…金属導体 39…荷重負荷用ピン 38…炭素系ばね部材 10, 34: jig body 12: seat for receiving base material 14: ceramic substrate 16: jig for holding base material 18: carbon-based spring member 20: seat for receiving carbon-based spring member 30: jig connection bolt 32 ... jig Connection nut 22 Ceramic substrate 40 Lead pin 36 Brazing material 28 Palladium layer 26 Chromium layer 24 Metal conductor 39 Load pin 38 Carbon spring member

Claims (4)

【特許請求の範囲】[Claims] 【請求項1】 アモルファス炭素と黒鉛とを含み、電子
部品の製造に用いるろう付用治具として必要な形状を有
するろう付用治具。
1. A brazing jig comprising amorphous carbon and graphite and having a required shape as a brazing jig used for manufacturing electronic components.
【請求項2】 アモルファス炭素と黒鉛を含む部材を電
子部品製造におけるろう付用治具として用いるろう付方
法。
2. A brazing method using a member containing amorphous carbon and graphite as a brazing jig in the production of electronic components.
【請求項3】 前記部材をろう付時の位置決めをする際
の押さえとして使用する請求項2記載のろう付方法。
3. The brazing method according to claim 2, wherein the member is used as a holder for positioning during brazing.
【請求項4】 前記部材をろう付時のろう材による接着
を補助する為に、荷重をかける事を目的として使用する
請求項2記載のろう付方法。
4. The brazing method according to claim 2, wherein the member is used for applying a load in order to assist bonding of the brazing material during brazing.
JP2001155946A 2001-05-24 2001-05-24 Jig and method for brazing Pending JP2002346741A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP2001155946A JP2002346741A (en) 2001-05-24 2001-05-24 Jig and method for brazing

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2001155946A JP2002346741A (en) 2001-05-24 2001-05-24 Jig and method for brazing

Publications (1)

Publication Number Publication Date
JP2002346741A true JP2002346741A (en) 2002-12-04

Family

ID=19000042

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2001155946A Pending JP2002346741A (en) 2001-05-24 2001-05-24 Jig and method for brazing

Country Status (1)

Country Link
JP (1) JP2002346741A (en)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR100524191B1 (en) * 2003-04-23 2005-10-26 박봉경 Vise helping for brazing

Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5945077A (en) * 1982-09-07 1984-03-13 Nec Corp Soldering of electronic part
JPH0368969U (en) * 1989-10-30 1991-07-08
JPH10130058A (en) * 1996-10-23 1998-05-19 Showa Denko Kk Jig for production of semiconductor and electronic parts and its production
JP2001106574A (en) * 1999-10-08 2001-04-17 Mitsubishi Pencil Co Ltd Carbon-based spring member and its manufacturing process

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5945077A (en) * 1982-09-07 1984-03-13 Nec Corp Soldering of electronic part
JPH0368969U (en) * 1989-10-30 1991-07-08
JPH10130058A (en) * 1996-10-23 1998-05-19 Showa Denko Kk Jig for production of semiconductor and electronic parts and its production
JP2001106574A (en) * 1999-10-08 2001-04-17 Mitsubishi Pencil Co Ltd Carbon-based spring member and its manufacturing process

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR100524191B1 (en) * 2003-04-23 2005-10-26 박봉경 Vise helping for brazing

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