JP2002339062A - Tool for conductive treatment of non-conductive sample - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide a tool for a conductive treatment of a non-conductive sample capable of easily changing the loading height and efficiently performing an analysis in a low-vacuum ion sputtering apparatus. SOLUTION: An outer edge of a sample loading part 12 is made in a disk-like shape having a male screw 12M, and a hole having a female screw 10F receiving the male screw 12M is provided in a tool body 10.

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a jig for conductive treatment of a non-conductive sample, and more particularly to a jig suitable for use in a low-vacuum type ion sputtering apparatus. The present invention relates to a jig for conductive processing of a non-conductive sample, which can improve the efficiency of work.

[0002]

2. Description of the Related Art In general, when observing a non-conductive sample with an electron microscope, for example, an electron beam microanalyzer, electric charges are accumulated (called charge-up) by primary electrons incident on the non-conductive sample, and secondary electrons are collected. Electrons are not excited,
Observation becomes impossible. Therefore, prior to the observation, a conductive material such as carbon or gold is vapor-deposited on the observation surface of the non-conductive sample in advance to perform a conductive treatment to prevent charge-up.

[0003] An ion sputtering apparatus is often used for the conductive treatment. However, in order to obtain an appropriate deposition state free of contamination, an operation relying on experience and intuition is required.

[0004] In order to easily obtain an appropriate vapor deposition state for such a problem, for example, Japanese Patent Application Laid-Open No. 2000-329662.
The dummy sample is placed on the same surface as the sample mounting part where the non-conductive sample is placed on the jig body, and can be moved up and down by screws rotatably provided on the jig body. It is described that a dummy sample mounting portion is provided.

[0005]

SUMMARY OF THE INVENTION However, Japanese Patent Application Laid-Open
The jig described in 000-329662 was not easy to handle and could not be used for an inexpensive low vacuum ion sputtering apparatus. Because, in the low-vacuum type ion sputtering apparatus, the vapor deposition thickness changes depending on the height of the sample, so that the substantial height (mounting height) of the sample is frequently changed by inserting a spacer under the sample. Need to change, did not stand for practical use. For example, if the vapor deposition thickness is larger than necessary, the microstructure will be buried by the vapor deposition, and the form itself of the observation sample will change,
I can't observe. Conversely, when the vapor deposition thickness is small, observation cannot be performed due to charging.

SUMMARY OF THE INVENTION The present invention has been made to solve the above-mentioned conventional problems. In a low-vacuum ion sputtering apparatus, the mounting height can be easily changed, and the efficiency of analysis work can be improved. An object of the present invention is to provide a conductive processing jig.

[0007]

The present invention provides a jig body,
A conductive processing jig for a non-conductive sample, comprising a sample mounting portion on which the non-conductive sample is mounted, wherein an outer edge of the sample mounting portion has a disk shape with an external thread, The object is solved by providing the jig body with a hole in which a female screw to be screwed with the male screw is formed.

[0008]

Embodiments of the present invention will be described below in detail with reference to the drawings.

A first embodiment of a jig for conducting a non-conductive sample according to the present invention, as shown in FIG.
And a sample mounting portion 12 provided on the jig body 10 for mounting a non-conductive sample. In the figure, 1
4 is a pedestal.

FIG. 2 shows a vacuum chamber of a low-vacuum type ion sputtering apparatus (in a form in which a cylinder is turned sideways).
FIG. 2 is a schematic diagram showing the arrangement of a jig body 10, a non-conductive sample 8, and a carbon electrode 24 for generating spatter. In the drawing, reference numeral 22 denotes a carbon sputtering generating mechanism including the carbon electrode 24, and reference numeral 26 denotes a range in which vapor deposition occurs by sputtering (referred to as a vapor deposition region).

Here, the non-conductive sample 8 may not be disposed anywhere in the deposition region 26. As described above, the height of the mounting portion is changed for each non-conductive sample. Therefore, it is necessary to control the deposition thickness.

Therefore, the sample mounting section 12 of the present embodiment is
As shown in FIG. 1, the jig body 10 has a disk shape with an outer edge portion having an external thread 12M.
It has a hole in which a female screw 10F screwed with M is formed.

With such a configuration, the sample mounting portion 12 can be rotated with respect to the jig main body 10 as a male screw. Therefore, the height of the mounting portion 12 can be easily changed by rotating the screw to control the deposition thickness. More specifically, for example, as shown in FIG.
By pressing 0, an operation of rotating in the direction shown by the arrow can be performed. Alternatively, as in the second embodiment shown in FIG. 4, in order to facilitate the rotation operation, the tip of the driver is applied to the vicinity of the center of the disk of the sample mounting part 12 so that the sample mounting part 12 can be rotated. A groove 12G into which the tip of the driver is inserted may be provided.

The pitch of the screw can be set arbitrarily.
5 to 3.0 mm is appropriate from the viewpoint of height adjustment accuracy and work efficiency. Also, the height of the jig body 10 is not limited, but the height of the jig body 10 is easy to handle.

Also, since the sample 8 has various forms, it is often necessary to move the sample 8 slightly in the horizontal direction.
Therefore, when the jig body 10 is placed on the pedestal 14 having a smooth surface, it is preferable in terms of operation when horizontal movement in the vacuum chamber 20 is required.

[0016]

EXAMPLE A steel sample was embedded in a resin and mirror-polished, and the height of the sample was changed from 7.8 to 14.3 mm in the resin-embedded state to prepare 12 types of samples. Samples having the various heights described above were randomly extracted, each of them was subjected to a sputtering operation, and operation times for adjusting the height of the mounting portion 12 were compared. 27 to 34 samples per day were compared between a conventional example using a spacer and an example using the present invention. The pedestal 14 used was common.

The operation was completed in a short period of 116 seconds in the embodiment, whereas the operation was completed in an average of 172 seconds in the conventional example. Improvement was confirmed.

[0018]

According to the present invention, in a low vacuum ion sputtering apparatus, the mounting height of a sample can be easily changed, and the efficiency of analysis can be improved.

[Brief description of the drawings]

FIG. 1 is an exploded perspective view of a first embodiment of a conductive processing jig for a non-conductive sample according to the present invention.

FIG. 2 is a cross-sectional view showing a state in which a conductive processing jig is arranged in a vacuum chamber of a low vacuum ion sputtering apparatus.

FIG. 3 is a perspective view showing a state in which the height of a sample mounting part is adjusted in the first embodiment.

FIG. 4 is a perspective view showing the shape of a sample mounting portion of a second embodiment of a conductive processing jig for a non-conductive sample.

[Explanation of symbols]

 Reference Signs List 8: non-conductive sample 10: jig body 10F: female screw 12: sample mounting part 12M: male screw 12G: groove 14: pedestal 20: vacuum chamber 24: carbon electrode 26: vapor deposition area

Claims (1)

[Claims] 1. A jig for conductive treatment of a non-conductive sample comprising a jig body and a sample mounting portion on which a non-conductive sample is mounted, wherein the outer edge of the sample mounting portion is A jig for forming a non-conductive sample, wherein the jig main body has a hole formed with a female screw to be screwed with the male screw.