JP2002329985A - Mounting structure of circuit package to device casing - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide the mounting structure of circuit packages to a device casing by which the circuit package are attached and detached easily and the reduction of the number of parts and the simplification of sorting work in the case of scrapping or recycling can be realized. SOLUTION: The mounting structure for mounting a plurality of circuit packages 55, 56, 57 and 58 is provided with boards and a number of parts mounted on these boards in the casing 51 of the device in the state of arraying them in the horizontal direction and/or in the vertical direction. A plurality of guiding members are provided at the casing 51; fitting tools 59, 60 and 61 forming first grooves to be fitted to the boards and second grooves to be fitted to the guiding members are fitted to the four corners of the substrates of the packages 55, 56, 57 and 58; and the guiding members and the second grove of the fitting tools are fitted to mount the packages 55, 56, 57 and 58 to the casing 51.

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a circuit package mounting structure in a device such as a communication device or an electronic computer on which a plurality of circuit packages are mounted.

[0002]

2. Description of the Related Art FIGS. 1 and 2 show a conventional mounting structure of a circuit package in such an apparatus, respectively.

[0003] A device 10 shown in FIG.
2. A power supply connector 13 and a switch 14 are provided, and a plurality (four in this case) of circuit packages 15 to 18 are mounted horizontally. Each of the circuit packages 15 to 18 is fixed by a mounting bracket 21 provided on the housing 11 through a fixing screw 20 through a screw hole 19 provided at each of the four corners.

On the other hand, the device 30 shown in FIG. 2 includes a power supply unit 32, a power supply connector 33, and a switch 34 in a housing 31 similarly to the device 10 shown in FIG. 35-38 in both horizontal and vertical directions
They are stacked and mounted one by one. Each circuit package 35-38
Are mounted on the housing 31 by interposing a spacer 39 between the upper circuit packages 35 and 36 and the lower circuit packages 37 and 38, and passing fixing screws 41 through screw holes 40 provided at four corners. It is fixed by metal fittings 42.

In the apparatus shown in the drawings, when mounting a circuit package for assembly, maintenance and inspection, etc., each circuit package must be fixed with screws. Screws and spacers must be removed. In particular, when a plurality of circuit packages are stacked and mounted as shown in FIG. 2, when removing one circuit package, it may be necessary to temporarily remove another package. Such an operation is complicated and time-consuming, and the types and the number of components such as screws required for mounting the circuit package are increased, so that the sorting operation particularly at the time of disposal and reuse is complicated.

[0006]

SUMMARY OF THE INVENTION It is an object of the present invention to solve the above-mentioned problems, to easily attach and detach a circuit package, to reduce the number of parts, and to dispose or reuse the circuit package. The present invention proposes a structure for mounting a circuit package on a device housing, which can also simplify the separation work.

[0007]

According to the present invention, a substrate and a plurality of circuit packages each including a large number of components mounted on the substrate are arranged in a horizontal direction and / or a vertical direction to form a housing of an apparatus. A mounting structure for mounting, wherein a plurality of guide members are provided in the housing, and a first groove that fits with the substrate and a fourth groove that fits with the guide member are provided at four corners of a substrate of the circuit package. The circuit package is mounted on the housing by attaching a fitting having two grooves and fitting the guide member and the second groove of the fitting.

In the mounting structure of the circuit package in the device housing according to the present invention, the fittings are attached to the four corners of the circuit package substrate, and the fittings are fitted to the guide members provided on the housing. The circuit package is to be mounted on the device housing. Therefore, the attachment and detachment of the circuit package can be easily performed, and the work can be performed quickly. Further, it is possible to reduce the types and the number of components required for mounting, and it is possible to simplify the sorting work at the time of disposal or reuse.

In the mounting structure of the circuit package in the device housing according to the present invention, a small hole is formed at each of the four corners of the substrate of the circuit package, and a small projection which fits into the small hole is formed inside the first groove of the mounting member. Each is characterized by being formed. This makes it possible to securely attach and fix the fixture to the substrate.

[0010] In the mounting structure of the circuit package to the device housing according to the present invention, two parallel rails for guiding and supporting the circuit package horizontally are provided on the housing as the guide member. On different sides of the first horizontal groove to fit the four corners of the substrate of the circuit package,
A second horizontal groove to be fitted to the rail is formed. This makes it possible to accurately position and arrange a plurality of circuit packages in the horizontal direction.

[0011] In the mounting structure of the circuit package to the device housing according to the present invention, a small hole is formed in the rail, and a small projection which fits into the small hole is formed inside the second horizontal groove of the fixture. It is characterized by. Thereby, accurate positioning and fixing of the circuit package can be reliably performed with a very simple configuration.

[0012] The mounting structure of the circuit package to the device housing according to the present invention is a side surface of the mounting fixture that is not fitted with any of the circuit package and the rail, and a plurality of circuit packages are mounted on the rail. When arranged in a horizontal direction along, perpendicular to the longitudinal direction of the rail, and formed a third horizontal groove on the side facing each other, attached to two circuit packages adjacent to each other, Between the third horizontal groove of the facing fixture,
A plurality of circuit packages adjacent to each other are connected and arranged in the horizontal direction by interposing a connecting member that fits into these third horizontal grooves. As a result, adjacent circuit packages can be accurately positioned and connected in the horizontal direction, and can be mounted correctly while preventing erroneous insertion of these circuit packages.

[0013] The mounting structure of the circuit package to the device housing according to the present invention is a side surface of the mounting fixture that is not fitted with any of the circuit package and the rail, and a plurality of circuit packages are mounted on the rail. When arranged in a horizontal direction along, perpendicular to the longitudinal direction of the rail, and form either a third horizontal groove or a first horizontal protrusion on the side surface facing each other, adjacent to each other A plurality of circuit packages adjacent to each other are connected and arranged in a horizontal direction by fitting the third horizontal groove and the first horizontal protrusion of the mounting tool facing each other, which are mounted on two circuit packages. It is characterized by making it. By doing so, the adjacent circuit packages are accurately positioned and connected in the horizontal direction and arranged.
In addition, these circuit packages can be correctly mounted while preventing erroneous insertion.

The mounting structure of the circuit package according to the present invention on the device housing is characterized in that a convex lid member for closing the third horizontal groove is provided. As a result, erroneous insertion of the circuit package can be more reliably prevented.

In the mounting structure of a circuit package in a device housing according to the present invention, a plurality of supporting members for guiding and supporting the circuit package in a vertical direction are provided on the housing as the guide member, and A first horizontal groove to be fitted to the four corners of the circuit package substrate and a first vertical groove to be fitted to the rail are formed on different sides of the component. As a result, even when the circuit packages are vertically stacked and mounted,
Attachment and removal of the circuit package can be easily performed, and the work can be performed quickly.

Further, in the mounting structure of the circuit package according to the present invention in a device housing, a second vertical groove or a dent is formed in the fixture, and the second vertical groove or the dent is formed in the second vertical groove or the dent of the fixture. A spacer having projections formed at both ends is fitted to the circuit package, whereby a plurality of the circuit packages are vertically connected and arranged. With such a structure, even when the circuit packages are vertically stacked and mounted, the circuit package can be easily attached and detached, and the work can be quickly performed. ,further,
It is also possible to reduce the number of types of components required for mounting, and it is possible to further simplify the sorting work at the time of disposal or reuse.

[0017]

Preferred embodiments of the present invention will be described below with reference to the accompanying drawings.

FIG. 3 shows an apparatus according to an embodiment of the mounting structure according to the present invention. The device 50 of FIG.
Power supply unit 52, power supply connector 53, switch in housing 51
54, and a plurality of (four in this case) circuit packages 55 to 58 are horizontally arranged and mounted.

In the illustrated device 50, as will be described in detail later, mounting members 59 to 62 are respectively attached to the four corners of the substrate of each of the circuit packages 55 to 58, and two rails 63, Each circuit package is mounted by fitting these fittings to 64.

FIG. 4 shows the appearance of a fixture for a circuit package according to the present invention. The illustrated mounting fixture 59 is approximately 5
It has a rectangular planar shape and has five side surfaces 59a to 59e.
As shown in FIG. 4 (a), first horizontal grooves 59f for engaging the four corners of the circuit package are formed over the side surfaces 59a to 59c. Further, inside the first horizontal groove 59f, protrusions 59g and 59h are formed vertically, and the protrusions 59g and 59h are formed.
Is used to fix the fixture 59 to the board by fitting the holes (for example, screw holes) provided at the four corners of the board of the circuit package, as described later.

A second horizontal groove 59i for engaging with a rail provided on the housing is provided on the side surface 59d, and a third horizontal groove 59j is provided on the side surface 59e for the purpose to be described later. Is formed. As shown in FIG.4 (b), the second horizontal groove
Two protrusions 59k and 59l are formed vertically inside 59i. As will be described later, these projections are for fixing a fixture, that is, a circuit package, to a rail provided on the housing. Also, the first horizontal groove 5 is provided on the side face 59d.
A first vertical groove 59m orthogonal to 9i is also formed, and its purpose and function will be described later. Similarly, a second vertical groove 59n orthogonal to the third horizontal groove 59j is formed on the side surface 59e, and its purpose and function will be described later. Note that the projections 59k and 59l need not necessarily be provided on all fixtures used for mounting all circuit packages in one device.

As shown in FIG. 4D, on the side surface 59e, a first horizontal projection 59o is provided instead of the third horizontal groove 59j.
May be formed instead of the second vertical groove 59n, by forming depressions 59p and 59q, respectively.

FIG. 4 shows only the fixture 59, but it will be apparent that the other fixtures 60 to 62 have the same configuration.

FIGS. 5 to 7 show the mounting state of the circuit package and the mounting procedure in the device 50 of FIG. 3 in detail. As shown, the four corners of the board of the circuit packages 55 to 58 are inserted into the first horizontal grooves of the fixtures 59 to 61, and
By fitting projections (for example, the fittings 59k and 59l of the fitting 59 shown in FIG. 6) provided inside the second horizontal grooves of the fittings 59 to 61 into the holes 69 provided at the four corners of the substrate, respectively. Attach a fixture to each circuit package. Next, each mounting fixture 59
61 through 61 are engaged with rails 63 or 64 provided on a housing (not shown), and each circuit package is
These circuit packages are horizontally arranged and fixed by sliding them sequentially on 3 and 64. As the holes 69 provided at the four corners of the substrate, for example, screw holes may be used as they are.

As shown, holes 65 to 68 are formed near both ends of the rails 63 and 64. These holes
The protrusions formed in the second horizontal grooves of the fittings 59 to 61 (for example, FIG.
4 (b) and the projections 59k, 59l) of the fixture 59 shown in FIG. 6, thereby positioning and fixing the fixture, that is, the circuit package. Note that these holes 65
It is sufficient to provide -68 near both ends of the rails 63 and 64 as shown in the figure, but it goes without saying that it may be provided at a position between both ends of the rail corresponding to the position where the circuit package is positioned and fixed. .

Now, as shown in FIGS. 6 and 7, the third groove of the fixture, in the figure, the side face 61e of the fixture 61 and the fixture 62
A rod-shaped connecting member 70 is inserted into each of the grooves 61n, 62n provided on the side surface 62e of each of them. As shown in FIG. 7, when two adjacent circuit packages (circuit packages 56 and 57 in the figure) are fixed side by side, as shown in FIG. 7, the fittings facing each other, that is, the fitting 61 on the circuit package 56 side in FIG. The fixture 59 on the circuit package 57 side, the fixture 62 on the circuit package 56 side, and the fixture 60 on the circuit package 57 side
Are used to concatenate. In the figure, the connecting member 70 inserted into the third horizontal grooves 61n and 62n of the mounting tools 61 and 62 on the circuit package 56 side is connected to the mounting tools 59 and 62 on the circuit package 57 side.
By inserting them into the third horizontal grooves 59n, 60n of the 60, both circuit packages are correctly positioned and connected in the horizontal direction.

Instead of the connecting member 70, as shown in FIG. 4D, a first horizontal projection (a projection in FIG.
59o) may be formed. When this is applied to the case of FIG. 7, the horizontal projections are formed on the fixtures 61 and 62 on the circuit package 56 side and the fixture 5 on the circuit package 57 side.
A third horizontal groove that fits with the horizontal protrusion may be formed on the 9, 60 sides. On the other hand, on the contrary, the fixtures 61, 62
Needless to say, a third horizontal groove may be formed on the side, and a horizontal protrusion may be formed on the mounting fixture 59, 60 side.

FIG. 8 shows a state in which a convex lid member 71 for closing a third horizontal groove formed on the side surface is mounted on the side surface 59e of the mounting member 59. When the attachment of the circuit package to one device is finished, by attaching this lid member 71 to the third horizontal groove of the attachment of the circuit package to be attached last, another circuit package It is possible to prevent mistakes such as mounting the circuit package or making a mistake in the mounting direction of the circuit package (the side to be fitted with the rail).

FIG. 9 shows another embodiment of the mounting structure according to the present invention, in which a plurality of circuit packages are vertically stacked and mounted. Here, a case where two circuit packages 72 and 73 are stacked vertically is shown.

The housing (not shown) is provided with substantially U-shaped support members 74 and 75 for guiding the circuit package at the time of mounting and supporting the package after mounting. Fixtures 59-62 attached to four corners of circuit packages 74 and 75
The second vertical grooves 59n to 62n are formed on the side surfaces 59e to 62e of the support members 74 and 75, respectively.
By mating with 74a, 74b, 75a, 75b respectively
Each circuit package 72, 73 is mounted on a housing.

A spacer 76 is interposed between the circuit packages 72 and 73. Spacers 76 have protrusions 76a, 76b at both ends
And these projections fit into first vertical grooves 59m to 62m provided on the side surfaces 59d to 62d of the attachments 59 to 62. by this,
Appropriate intervals are maintained between the vertically adjacent circuit packages.

As described above, according to the mounting structure of the circuit package to the device housing according to the present invention, it is possible to perform accurate positioning and fixing when mounting a plurality of circuit packages, Can be easily attached and detached, and the operation can be quickly performed. Further, it is possible to reduce the types and the number of components required for mounting, and it is possible to simplify the sorting work at the time of disposal or reuse.

The present invention is not limited only to the above-described embodiment. For example, as shown in FIGS. 3 and 5 to 7, circuit packages are arranged horizontally,
In addition to arranging multiple levels of rails in the housing in the vertical direction,
By using the spacer shown in FIG. 2, it becomes possible to stack circuit packages not only in the horizontal direction but also in the vertical direction, similarly to the conventional example of FIG.

[Brief description of the drawings]

FIG. 1 is a perspective view showing a device according to an example of a conventional mounting structure.

FIG. 2 is a perspective view showing an apparatus according to another example of a conventional mounting structure.

FIG. 3 is a perspective view showing an apparatus according to an embodiment of the mounting structure according to the present invention.

FIG. 4 is a perspective view showing an appearance of a fixture for a circuit package according to the present invention.

FIG. 5 is a perspective view showing a mounted state of a circuit package in the device of FIG. 3;

6 is an exploded view showing members constituting a mounting structure in the device of FIG.

FIG. 7 is a perspective view schematically showing a connection procedure of a circuit package in the apparatus of FIG. 3;

FIG. 8 is a view showing a state in which a lid member is attached to the fixture of FIG. 4;

FIG. 9 is a perspective view showing another embodiment of the mounting structure according to the present invention.

[Explanation of symbols]

 10, 30, 50 device 11, 31, 51 device housing 12, 32, 52 power supply unit 13, 33, 53 power connector 14, 34, 54 switch 15-18, 35-38, 55-58, 72, 73 Circuit package 19, 40, 69 Screw hole 20, 41 Fixing screw 21, 42 Mounting bracket 39, 76 Spacer 59-62 Mounting bracket 63, 64 Rail 65-68 Hole on rail 70 Connecting member 71 Cover member 74, 75 Support member

 ──────────────────────────────────────────────────続 き Continuing on the front page (72) Inventor Hirofumi Senoo 6-12-1, Nishi-Shinjuku, Shinjuku-ku, Tokyo Inside Fujitsu Eye Network Systems Co., Ltd. (72) Inventor Ichiro Takamura 6-chome, Nishi-Shinjuku, Shinjuku-ku, Tokyo No. 12 No. 1 Fujitsu Eye Network Systems Co., Ltd. F-term (reference) 5E348 AA12 AA14 AA16 AA21 AA25 CC02 EE07 EE11 EE26 EE31 EH03

Claims (10)

[Claims] 1. A circuit board comprising a substrate and a plurality of circuit packages each including a number of components mounted on the substrate.
Or a mounting structure for mounting in a vertical direction and mounting on a housing of an apparatus, wherein a plurality of guide members are provided on the housing, and four first corners of the circuit package board that fit with the board are provided at four corners of the board. The circuit package is attached to the housing by attaching a fitting having a groove formed therein and a second groove fitted with the guide member, and fitting the guide member and the second groove of the fitting. The mounting structure of the circuit package on the device housing, characterized by being mounted on the device housing. 2. The mounting structure according to claim 1, wherein small holes are formed at four corners of the substrate of the circuit package, and small projections that fit with the small holes are formed inside the first groove of the fixture. A structure for mounting a circuit package on a device housing. 3. The mounting structure according to claim 1, wherein two parallel rails for guiding and supporting the circuit package horizontally are provided on the housing as the guide member, and the mounting members are different from each other. On the side surface, a first horizontal groove to be fitted to the four corners of the circuit package substrate and a second horizontal groove to be fitted to the rail are formed, respectively. Mounting structure. 4. The mounting structure according to claim 3, wherein a small hole is formed in the rail, and a small projection that fits into the small hole is formed inside the second horizontal groove of the mounting fixture. , Mounting structure of the circuit package on the device housing. 5. The mounting structure according to claim 1, wherein a plurality of circuit packages are mounted on a side surface of the attachment that is not fitted with any of the circuit package and the rail. When arranged horizontally along the rail, a third horizontal groove is formed on a side surface orthogonal to the longitudinal direction of the rail and facing each other, and attached to two circuit packages adjacent to each other. In addition, by interposing a connecting member that fits with the third horizontal groove between the third horizontal grooves of the mounting fixture facing each other, a plurality of circuit packages adjacent to each other are connected to each other in the horizontal direction. A mounting structure of a circuit package on a device housing, characterized by being arranged. 6. The mounting structure according to claim 1, wherein a plurality of circuit packages are mounted on a side surface of the attachment that is not fitted with any of the circuit package and the rail. When arranged in the horizontal direction along the rail, orthogonal to the longitudinal direction of the rail, and form either a third horizontal groove or a first horizontal protrusion on the side surface facing each other, A plurality of circuit packages adjacent to each other are connected to each other by connecting the third horizontal grooves and the first horizontal protrusions of the mounting tool facing each other, which are mounted on two circuit packages adjacent to each other, to connect the plurality of circuit packages adjacent to each other. A mounting structure of a circuit package on a device housing, which is arranged in a direction. 7. The mounting structure according to claim 5, wherein a convex lid member for closing the third horizontal groove is provided. 8. The mounting structure according to claim 1, wherein a plurality of support members for guiding and supporting the circuit package in a vertical direction are provided on the housing as the guide members, and different side surfaces of the mounting fixture. Wherein a first horizontal groove that fits with the four corners of the circuit package substrate and a first vertical groove that fits with the rail are formed. Construction. 9. The mounting structure according to claim 1, wherein a second vertical groove or dent is formed in the fixture, and the second vertical groove or dent of the fixture is A mounting structure for mounting a circuit package on a device housing, wherein a spacer having protrusions formed on both ends thereof to be fitted thereto is attached, whereby a plurality of the circuit packages are vertically connected and arranged. 10. An apparatus comprising the mounting structure according to claim 1. Description: