JP2002329766A - Structure for fitting sensor head for wafer detection - Google Patents
Structure for fitting sensor head for wafer detectionInfo
- Publication number
- JP2002329766A JP2002329766A JP2001135902A JP2001135902A JP2002329766A JP 2002329766 A JP2002329766 A JP 2002329766A JP 2001135902 A JP2001135902 A JP 2001135902A JP 2001135902 A JP2001135902 A JP 2001135902A JP 2002329766 A JP2002329766 A JP 2002329766A
- Authority
- JP
- Japan
- Prior art keywords
- wafer
- sensor head
- hand
- mounting portion
- screw
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Landscapes
- Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
- Manipulator (AREA)
Abstract
Description
【０００１】[0001]
【発明の属する技術分野】本発明は、ウエハを搬送する
ハンドにウエハの検出を行う静電容量式のセンサヘッド
を取り付けるウエハ検出用センサヘッドの取付構造に関
する。[0001] 1. Field of the Invention [0002] The present invention relates to a mounting structure for a sensor head for detecting a wafer, in which a capacitive sensor head for detecting a wafer is mounted on a hand for transferring the wafer.
【０００２】[0002]
【従来の技術】例えば、上下に隙間を空けて重ねられた
複数のウエハから、所望のウエハを取り出すためには、
ウエハ同士の隙間に差し込まれる平板状のハンドが用い
られる。そして、このようなハンドには、検知電極を内
蔵した静電容量式センサが取り付けられ、ハンド上にウ
エハを載せたか否かを検出する。なお、このようなもの
は、実開平６−２９１４１号公報に掲載されている。2. Description of the Related Art For example, in order to take out a desired wafer from a plurality of wafers stacked one above another with a gap above and below,
A flat hand inserted into the gap between the wafers is used. Then, a capacitance type sensor having a built-in detection electrode is attached to such a hand, and detects whether a wafer is placed on the hand. Such a device is disclosed in Japanese Utility Model Laid-Open No. 6-29141.
【０００３】[0003]
【発明が解決しようとする課題】近年では、装置の小型
化などからウエハ同士の配置間隔がより狭くなる傾向に
あり、ハンドについてもウエハを載せるためのウエハ載
置部をより薄く形成することが要求されている。そのよ
うな薄型のハンドに静電容量式センサを取り付ける場
合、ウエハ載置部付近にねじ止めしようとすると、厚み
が不足してねじ止めできない。また、ねじに代わって、
接着剤で取り付けると、使用環境により接着剤からガス
が発生したり、接着剤との相性から、静電容量式センサ
及びハンドの材質が限定されたり、あるいはセンサの変
更ができなくなるという問題が生じる。In recent years, the spacing between wafers has tended to be narrower due to the miniaturization of the apparatus and the like, and it has been required to make the wafer mounting portion for mounting a wafer thinner even for a hand. Has been requested. When the capacitance type sensor is attached to such a thin hand, if the screw is to be screwed near the wafer mounting portion, the screw is too thin to screw. Also, instead of screws,
When mounting with an adhesive, there is a problem that gas is generated from the adhesive depending on the use environment, the material of the capacitive sensor and the hand is limited due to compatibility with the adhesive, or the sensor cannot be changed. .
【０００４】本発明は、上記事情に鑑みてなされたもの
で、その目的は、薄型のハンドに接着剤を用いることな
くセンサヘッドを取り付けることの可能なウエハ検出用
センサヘッドの取付構造を提供するところにある。The present invention has been made in view of the above circumstances, and an object of the present invention is to provide a mounting structure of a sensor head for detecting a wafer which can mount the sensor head on a thin hand without using an adhesive. There.
【０００５】[0005]
【課題を解決するための手段】上記の課題を解決するた
めの請求項１の発明に係るウエハ検出用センサヘッドの
取付構造は、ウエハを搬送するためのハンドにウエハの
検出を行うセンサヘッドを取り付けるウエハ検出用セン
サヘッドの取付構造であって、前記ハンドは、前記ウエ
ハを載置するウエハ載置部と、このウエハ載置部に連な
る支持部とを備えている一方、前記センサヘッドは、前
記ハンドにおける前記ウエハ載置部の領域から前記支持
部の領域にわたるような形状をなすと共に、前記ウエハ
載置部側には前記ウエハを検出する検知電極部を設け、
前記支持部側にはこの支持部にねじ止めされるねじ止め
部を設けたところに特徴を有する。According to a first aspect of the present invention, there is provided a sensor head mounting structure for detecting a wafer, wherein the sensor head for detecting a wafer is provided to a hand for transporting the wafer. A mounting structure of a sensor head for wafer detection to be mounted, wherein the hand includes a wafer mounting portion on which the wafer is mounted, and a support portion connected to the wafer mounting portion, while the sensor head includes: The hand has a shape ranging from the region of the wafer mounting portion to the region of the support portion, and a detection electrode portion for detecting the wafer is provided on the wafer mounting portion side,
It is characterized in that a screwing portion to be screwed to the supporting portion is provided on the supporting portion side.
【０００６】請求項２の発明は、請求項１に記載のもの
において、前記ウエハ載置部には、前記センサヘッドを
収容する収容部が厚さ方向に凹んで設けられているとこ
ろに特徴を有する。According to a second aspect of the present invention, in the first aspect, an accommodation portion for accommodating the sensor head is provided in the wafer mounting portion so as to be recessed in a thickness direction. Have.
【０００７】[0007]
【発明の作用および効果】請求項１の発明によれば、セ
ンサヘッドをハンドにおけるウエハ載置部の領域から支
持部の領域にわたるような形状とし、ねじ止め部を支持
部側に設けて支持部にねじ止めするようにしたため、ね
じ止めする部位に必要な厚さを確保する一方で、ウエハ
載置部の厚さを小さくすることができる。また、取り付
けには接着剤を用いないので、前記したガスの発生や材
質の相性を心配せずに済む。According to the first aspect of the present invention, the sensor head is formed so as to have a shape extending from the area of the wafer mounting portion to the area of the support portion of the hand, and the screw portion is provided on the support portion side. As a result, the thickness of the wafer mounting portion can be reduced while securing the necessary thickness at the portion to be screwed. Further, since no adhesive is used for the attachment, there is no need to worry about the generation of gas and the compatibility of the materials.
【０００８】請求項２の発明によれば、ウエハ載置部に
厚さ方向に凹んだ収容部を設けてセンサヘッドを収容す
るため、センサヘッドを取り付けた状態のウエハ載置部
の厚さをより小さくできる。According to the second aspect of the present invention, since the sensor head is accommodated in the wafer mounting portion by providing the accommodation portion recessed in the thickness direction, the thickness of the wafer mounting portion with the sensor head attached is reduced. Can be smaller.
【０００９】[0009]
【発明の実施の形態】次に本発明の一実施形態について
図１から図５を参照して説明する。図１において、符号
１０はラックであって、側方に開放した筺体状をなし、
その対向する一対の内側面１１，１１には、水平方向に
延びる複数の凹溝１２が上下方向に所定の間隔を開けて
形成されている。そして、複数の円板状のウエハ９が、
それらの縁部を両内側面１１，１１の凹溝１２に係合さ
せた状態で、両内側面１１，１１間に差し渡され、これ
により、複数のウエハ９が上下方向で所定の隙間を開け
て重ねられた状態となっている。DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS Next, an embodiment of the present invention will be described with reference to FIGS. In FIG. 1, reference numeral 10 denotes a rack, which has a housing shape opened to the side,
A plurality of recessed grooves 12 extending in the horizontal direction are formed on the pair of opposed inner surfaces 11, 11 at predetermined intervals in the vertical direction. Then, a plurality of disc-shaped wafers 9
In a state where their edges are engaged with the concave grooves 12 of both inner side surfaces 11, 11, they are inserted between both inner side surfaces 11, 11, whereby a plurality of wafers 9 are separated from each other by a predetermined gap in the vertical direction. It is open and stacked.
【００１０】このラック１０から所望のウエハ９を取り
出すためのハンド１３は、例えばセラミックから形成さ
れ、図１に示すように、ラック１０への挿入方向で長く
延びた板状をなしている。ハンド１３には、先端側にウ
エハ９を載置するウエハ載置部１４が設けられ、これに
連なって基端側に支持部１５が設けられている。支持部
１５は、全体にウエハ載置部１４よりも厚さが大きくさ
れており、支持部１５のさらに基端側は例えばロボット
のアームに取り付けられる。A hand 13 for taking out a desired wafer 9 from the rack 10 is made of, for example, ceramic, and has a plate shape elongated in the direction of insertion into the rack 10 as shown in FIG. The hand 13 is provided with a wafer mounting portion 14 on which the wafer 9 is mounted on the distal end side, and a supporting portion 15 is provided on the proximal end side in connection with the wafer mounting portion 14. The support portion 15 has a thickness greater than that of the wafer mounting portion 14 as a whole, and the base end of the support portion 15 is attached to, for example, a robot arm.
【００１１】ウエハ載置部１４上面には、図２に示すよ
うに、先端側と基端側とに、２段構造の段差部１６，１
７が備えられ、これら段差部１６，１７の間が板状部分
１８となっている。各段差部１６，１７は、ウエハ９の
外周面に対応して、水平方向で湾曲しており（図１参
照）、ウエハ９は、両段差部１６，１７の上段側の起立
面１６Ａ，１７Ａ（図５参照）の間に収まり、板状部分
１８から若干浮き上がって、ハンド１３との接触面積を
最小限にした状態で、ハンド１３上に載せられる。As shown in FIG. 2, a stepped portion 16, 1 having a two-stage structure is provided on the upper surface of the wafer mounting portion 14, as shown in FIG.
7 is provided, and a plate-like portion 18 is provided between the step portions 16 and 17. Each of the steps 16 and 17 is curved in the horizontal direction corresponding to the outer peripheral surface of the wafer 9 (see FIG. 1), and the wafer 9 is provided with the upright surfaces 16A and 17A on the upper side of the steps 16 and 17. 5 (see FIG. 5), and is slightly lifted from the plate-like portion 18 and placed on the hand 13 in a state where the contact area with the hand 13 is minimized.
【００１２】ハンド１３の上面には、後述するセンサヘ
ッド２９を収容する収容部２１が厚さ方向に凹んで設け
られている。収容部２１は、ハンド１３の幅方向の中央
に、ラック１０への挿入方向に細長く形成され、ウエハ
載置部１４から支持部１５にわたって設けられている。
収容部２１のウエハ載置部１４側の端部には、板状部分
１８を上下に貫通する円形の貫通孔２２が設けられてい
る。貫通孔２２からは、支持部１５側へ底部２３が延び
ており、収容部２１の支持部１５側の端部は、底部２３
よりも肉が厚くされ段差状となった取付部２５が設けら
れている。取付部２５には、一対のねじ孔２６が収容部
２１の長手方向に対して斜めに並んで設けられている。
さらに、取付部２５からハンド１３の基端側へ延びて溝
部２７が形成されている。An accommodation portion 21 for accommodating a sensor head 29 described later is provided on the upper surface of the hand 13 so as to be recessed in the thickness direction. The accommodating portion 21 is formed in the center in the width direction of the hand 13 to be elongated in the direction of insertion into the rack 10, and is provided from the wafer mounting portion 14 to the support portion 15.
A circular through-hole 22 penetrating the plate-like portion 18 vertically is provided at an end of the accommodation portion 21 on the side of the wafer mounting portion 14. A bottom portion 23 extends from the through hole 22 to the support portion 15 side.
A mounting portion 25 is provided, which is thicker and has a stepped shape. The mounting portion 25 is provided with a pair of screw holes 26 arranged obliquely to the longitudinal direction of the housing portion 21.
Further, a groove 27 is formed extending from the mounting portion 25 to the proximal end side of the hand 13.
【００１３】収容部２１に収容されるセンサヘッド２９
は、静電容量式センサの一部であって、ケーブル３１を
介して図示しないセンサコントローラに接続されてい
る。センサヘッド２９は、合成樹脂材よりなるハウジン
グ３２を備えており、詳しくは、例えばポリエーテルイ
ミド（ＰＥＩ）、ポリエーテルサルホン（ＰＥＳ）、ポ
リエーテルエーテルケトン（ＰＥＥＫ）等の誘電率が比
較的低くかつ耐熱性を有する材質からなる。ハウジング
３２は、図３及び図４に示すように、収容部２１に概ね
緊密に嵌合される形状であり、つまりハンド１３におけ
るウエハ載置部１４の領域から支持部１５の領域にわた
るような形状をなしている。The sensor head 29 housed in the housing 21
Is a part of the capacitance type sensor, and is connected to a sensor controller (not shown) via a cable 31. The sensor head 29 includes a housing 32 made of a synthetic resin material. Specifically, for example, the dielectric constant of a polyetherimide (PEI), a polyethersulfone (PES), a polyetheretherketone (PEEK) or the like is relatively high. It is made of a material having low heat resistance. As shown in FIGS. 3 and 4, the housing 32 is shaped so as to be substantially tightly fitted into the accommodation portion 21, that is, a shape extending from the region of the wafer mounting portion 14 of the hand 13 to the region of the support portion 15. Has made.
【００１４】ハウジング３２の先端（ウエハ載置部１４
側）には、中空の円柱形をなす検知電極部３３が設けら
れており、この検知電極部３３は前記の貫通孔２２に収
容され、その厚さ寸法は板状部分１８とほぼ同じくされ
ている。検知電極部３３からは、ハンド１３の基端側へ
平板状の連結部３４が水平に延びており、その端部から
上側へ段差状をなして、連結部３４よりも肉厚になった
ねじ止め部３５が形成されている。このねじ止め部３５
は、前記の取付部２５の上面に重ねられており、ハンド
１３側のねじ孔２６に対応する一対のねじ孔３７がセン
サヘッド２９の延長方向に対して斜めに設けられてい
る。これらのねじ孔２６，３７には、ねじ３８が挿通さ
れ、このねじ３８をナット３９と螺合することでハンド
１３とセンサヘッド２９とが固定される。The tip of the housing 32 (the wafer mounting portion 14)
On the side), there is provided a hollow cylindrical detection electrode portion 33, which is housed in the through hole 22 and whose thickness dimension is substantially the same as that of the plate portion 18. I have. A flat connecting portion 34 extends horizontally from the detection electrode portion 33 to the base end side of the hand 13, and has a stepped shape upward from the end portion, and has a thickness larger than the connecting portion 34. A stop 35 is formed. This screwed part 35
Is overlaid on the upper surface of the mounting portion 25, and a pair of screw holes 37 corresponding to the screw holes 26 on the hand 13 side are provided obliquely with respect to the extension direction of the sensor head 29. A screw 38 is inserted into these screw holes 26 and 37, and the hand 13 and the sensor head 29 are fixed by screwing the screw 38 with a nut 39.
【００１５】検知電極部３３の内部には、図２に示すよ
うに、上側に円盤状の主電極４１が設けられ、下側に薄
皿状のガード電極４２が設けられて、ガード電極４２の
底壁と主電極４１とが対向し、かつ、ガード電極４２の
周壁が主電極４１の側方を取り囲んだ状態に保持されて
いる。これらの各電極４１、４２には、ケーブル３１の
端末が接続されており、このケーブル３１は、ハウジン
グ３２を貫通してねじ止め部３５から前記の溝部２７内
に沿って延び出て、その先が前記のコントローラ部に接
続されている。この検知電極部３３においては、主電極
４１にウエハ９が近づいたときに、主電極４１を介して
検出される静電容量の変化に基づいて、ウエハ９を検出
する。As shown in FIG. 2, a disc-shaped main electrode 41 is provided on the upper side, and a thin dish-shaped guard electrode 42 is provided on the lower side of the detection electrode section 33. The bottom wall and the main electrode 41 face each other, and the peripheral wall of the guard electrode 42 is held so as to surround the side of the main electrode 41. A terminal of a cable 31 is connected to each of the electrodes 41 and 42, and the cable 31 extends through the housing 32 from the screw portion 35 along the inside of the groove 27, and extends therefrom. Are connected to the controller. In the detection electrode section 33, when the wafer 9 approaches the main electrode 41, the wafer 9 is detected based on a change in capacitance detected via the main electrode 41.
【００１６】本実施形態によれば、センサヘッド２９を
ハンド１３におけるウエハ載置部１４の領域から支持部
１５の領域にわたるような形状とし、ねじ止め部３５を
支持部１５側に設けて支持部１５にねじ止めするため、
ねじ止めする部位に必要な厚さを確保する一方で、ウエ
ハ載置部１４の厚さを小さくすることができる。また、
接着剤を用いないので、前記したガスの発生や材質の相
性を心配せずに済む。According to the present embodiment, the sensor head 29 is formed so as to extend from the region of the wafer mounting portion 14 of the hand 13 to the region of the support portion 15, and the screw portion 35 is provided on the support portion 15 side. To screw it to 15,
The required thickness can be secured at the portion to be screwed, while the thickness of the wafer mounting portion 14 can be reduced. Also,
Since no adhesive is used, there is no need to worry about the above-mentioned generation of gas and compatibility of materials.
【００１７】また、ウエハ載置部１４に厚さ方向に凹ん
だ収容部２１を設けてセンサヘッド２９を収容するた
め、センサヘッド２９を取り付けた状態のウエハ載置部
１４の厚さをより小さくできる。Further, since the sensor head 29 is accommodated by providing the accommodation portion 21 which is recessed in the thickness direction in the wafer mounting portion 14, the thickness of the wafer mounting portion 14 with the sensor head 29 attached is made smaller. it can.
【００１８】従来のように、フィルム状のセンサヘッド
は、主電極とガード電極との距離が極めて短くなり、両
電極間の静電容量が大きくなることからセンサの検出感
度が低くなることがある。これに対し、本実施形態で
は、検知電極部３３をウエハ載置部１４に設けた貫通孔
２２に収容するようにしたことで、センサヘッド２９を
取り付けた状態のウエハ載置部１４の厚さを増すことな
く、検知電極部３３の厚さを少なくとも板状部分１８の
肉厚程度まで大きくすることできる。これにより、主電
極４１とガード電極４２との距離を充分に大きくして、
センサの検出感度を向上させることができる。As in the prior art, in a film-shaped sensor head, the distance between the main electrode and the guard electrode is extremely short, and the capacitance between the two electrodes is large, so that the detection sensitivity of the sensor may be low. . On the other hand, in the present embodiment, the detection electrode section 33 is accommodated in the through hole 22 provided in the wafer mounting section 14, so that the thickness of the wafer mounting section 14 with the sensor head 29 attached thereto is reduced. The thickness of the detection electrode portion 33 can be increased to at least the thickness of the plate portion 18 without increasing the thickness. Thereby, the distance between the main electrode 41 and the guard electrode 42 is made sufficiently large,
The detection sensitivity of the sensor can be improved.
【００１９】また、センサヘッド２９は、収容部２１に
概ね緊密に嵌め込まれているため、ハンド１３を移動さ
せる際にセンサヘッド２９が揺れにくくなっている。さ
らに、一対のねじ孔２６，３７がセンサヘッド２９の延
長方向に対して斜めに並んで配置されているため、一対
のねじ孔をセンサヘッド２９の延長方向やそれに直交す
る方向に沿って並べて配置した場合よりもセンサヘッド
２９に揺れが生じにくくなっている。Further, since the sensor head 29 is substantially tightly fitted into the housing 21, the sensor head 29 is less likely to shake when the hand 13 is moved. Further, since the pair of screw holes 26 and 37 are arranged obliquely with respect to the extension direction of the sensor head 29, the pair of screw holes are arranged along the extension direction of the sensor head 29 and the direction perpendicular thereto. The swinging of the sensor head 29 is less likely to occur than in the case where it is performed.
【００２０】また、検知電極部３３においては、各電極
４１、４２の周囲を低誘電率の合成樹脂材からなるハウ
ジング３２によって覆う構成となっているため、ハンド
１３を構成するセラミックのような高誘電率の部材が遠
ざけられ、検出感度を向上することができる。さらに、
検知電極部３３は貫通孔２２に収容され、下方が開放さ
れているため、検出感度を一層向上することができる。In the detection electrode section 33, the periphery of each of the electrodes 41 and 42 is covered by a housing 32 made of a synthetic resin material having a low dielectric constant. The member having the permittivity is moved away, and the detection sensitivity can be improved. further,
Since the detection electrode portion 33 is accommodated in the through hole 22 and the lower portion is open, the detection sensitivity can be further improved.
【００２１】本発明の技術的範囲は、上記した実施形態
によって限定されるものではなく、例えば、次に記載す
るようなものも本発明の技術的範囲に含まれる。 （１）上記実施形態では、ハンド１３の上面に収容部２
１を設けてセンサヘッド２９を上側から取り付けるよう
にしたが、図６に示すように、ハンド１３の下面に収容
部６０を設けて、センサヘッド６１を下方から取り付け
るようにしても良い。この場合、センサヘッド６１の検
知電極部３３を収容部６０に設けた貫通孔６２を通して
ウエハ載置部１４の上面に露出させるようにすると良
い。 （２）上記実施形態では、ねじ３８及びナット３９を用
いてセンサヘッド２９とハンド１３とをねじ止めしてい
るが、例えばハンドに雌ねじ孔を設けてねじと螺合させ
ることで、ナットを用いずに固定するようにしても良
い。The technical scope of the present invention is not limited by the above-described embodiment. For example, the followings are also included in the technical scope of the present invention. (1) In the above embodiment, the housing 2 is provided on the upper surface of the hand 13.
1, the sensor head 29 is attached from the upper side. However, as shown in FIG. 6, a housing portion 60 may be provided on the lower surface of the hand 13 and the sensor head 61 may be attached from below. In this case, the detection electrode section 33 of the sensor head 61 may be exposed on the upper surface of the wafer mounting section 14 through the through hole 62 provided in the housing section 60. (2) In the above-described embodiment, the sensor head 29 and the hand 13 are screwed using the screw 38 and the nut 39. However, for example, a female screw hole is provided in the hand and screwed with the screw, so that the nut is used. Alternatively, it may be fixed.
【図１】本発明の第１実施形態に係るハンド及びセンサ
ヘッドを示す斜視図FIG. 1 is a perspective view showing a hand and a sensor head according to a first embodiment of the present invention.
【図２】ハンド及びセンサヘッドの分解側断面図FIG. 2 is an exploded side sectional view of a hand and a sensor head.
【図３】ハンドにセンサヘッドを取り付けた状態を示す
部分拡大斜視図FIG. 3 is a partially enlarged perspective view showing a state where a sensor head is attached to a hand.
【図４】ハンドにセンサヘッドを取り付けた状態を示す
部分拡大平面図FIG. 4 is a partially enlarged plan view showing a state where the sensor head is attached to the hand.
【図５】ハンドにセンサヘッドを取り付けた状態を示す
側断面図FIG. 5 is a side sectional view showing a state where the sensor head is attached to the hand.
【図６】第２実施形態に係るハンド及びセンサヘッドの
分解側断面図FIG. 6 is an exploded side sectional view of a hand and a sensor head according to a second embodiment.
９…ウエハ １３…ハンド １４…ウエハ載置部 １５…支持部 ２１，６０…収容部 ２９，６１…センサヘッド ３３…検知電極部 ３５…ねじ止め部 9 Wafer 13 Hand 14 Wafer placement part 15 Support part 21, 60 Housing part 29, 61 Sensor head 33 Detection electrode part 35 Screw fixing part
Claims (2)
の検出を行うセンサヘッドを取り付けるウエハ検出用セ
ンサヘッドの取付構造であって、 前記ハンドは、前記ウエハを載置するウエハ載置部と、
このウエハ載置部に連なる支持部とを備えている一方、 前記センサヘッドは、前記ハンドにおける前記ウエハ載
置部の領域から前記支持部の領域にわたるような形状を
なすと共に、前記ウエハ載置部側には前記ウエハを検出
する検知電極部を設け、前記支持部側にはこの支持部に
ねじ止めされるねじ止め部を設けたことを特徴とするウ
エハ検出用センサヘッドの取付構造。1. A mounting structure of a sensor head for wafer detection, wherein a sensor head for detecting a wafer is mounted on a hand for transferring a wafer, wherein the hand has a wafer mounting portion for mounting the wafer,
And a support portion connected to the wafer mounting portion. The sensor head has a shape ranging from an area of the wafer mounting portion to an area of the support portion in the hand, and the sensor mounting portion includes A detection electrode portion for detecting the wafer is provided on the side, and a screwing portion screwed to the support portion is provided on the support portion side.
ドを収容する収容部が厚さ方向に凹んで設けられている
ことを特徴とする請求項１に記載のウエハ検出用センサ
ヘッドの取付構造。2. The mounting of the sensor head for detecting a wafer according to claim 1, wherein a housing portion for housing the sensor head is provided in the wafer mounting portion so as to be recessed in a thickness direction. Construction.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2001135902A JP2002329766A (en) | 2001-05-07 | 2001-05-07 | Structure for fitting sensor head for wafer detection |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2001135902A JP2002329766A (en) | 2001-05-07 | 2001-05-07 | Structure for fitting sensor head for wafer detection |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JP2002329766A true JP2002329766A (en) | 2002-11-15 |
Family
ID=18983287
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2001135902A Pending JP2002329766A (en) | 2001-05-07 | 2001-05-07 | Structure for fitting sensor head for wafer detection |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JP2002329766A (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2011211063A (en) * | 2010-03-30 | 2011-10-20 | Sinfonia Technology Co Ltd | Substrate conveyance device |
| JP2015506594A (en) * | 2012-01-27 | 2015-03-02 | アプライド マテリアルズ インコーポレイテッドＡｐｐｌｉｅｄ Ｍａｔｅｒｉａｌｓ，Ｉｎｃｏｒｐｏｒａｔｅｄ | Method and apparatus for sensing a substrate in a load cup |
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| JPH03129853A (en) * | 1989-10-16 | 1991-06-03 | Nec Kyushu Ltd | Semiconductor manufacturing device |
| JPH04293250A (en) * | 1991-03-22 | 1992-10-16 | Tokyo Electron Ltd | Substrate carrier |
| JPH0758183A (en) * | 1993-07-15 | 1995-03-03 | Applied Materials Inc | Method and equipment for carrying substrate, and substrate carrying member used in the same equipment |
| JPH11111816A (en) * | 1997-09-29 | 1999-04-23 | Omron Corp | Multiple type sensor and wafer sensor |
| JPH11116047A (en) * | 1997-10-20 | 1999-04-27 | Mecs Corp | Robot hand for thin substrate carrying robot |
| JPH11347980A (en) * | 1998-06-11 | 1999-12-21 | Nec Corp | Chuck mechanism |
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2001
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Patent Citations (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH03129853A (en) * | 1989-10-16 | 1991-06-03 | Nec Kyushu Ltd | Semiconductor manufacturing device |
| JPH04293250A (en) * | 1991-03-22 | 1992-10-16 | Tokyo Electron Ltd | Substrate carrier |
| JPH0758183A (en) * | 1993-07-15 | 1995-03-03 | Applied Materials Inc | Method and equipment for carrying substrate, and substrate carrying member used in the same equipment |
| JPH11111816A (en) * | 1997-09-29 | 1999-04-23 | Omron Corp | Multiple type sensor and wafer sensor |
| JPH11116047A (en) * | 1997-10-20 | 1999-04-27 | Mecs Corp | Robot hand for thin substrate carrying robot |
| JPH11347980A (en) * | 1998-06-11 | 1999-12-21 | Nec Corp | Chuck mechanism |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2011211063A (en) * | 2010-03-30 | 2011-10-20 | Sinfonia Technology Co Ltd | Substrate conveyance device |
| JP2015506594A (en) * | 2012-01-27 | 2015-03-02 | アプライド マテリアルズ インコーポレイテッドＡｐｐｌｉｅｄ Ｍａｔｅｒｉａｌｓ，Ｉｎｃｏｒｐｏｒａｔｅｄ | Method and apparatus for sensing a substrate in a load cup |
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