JP2002324468A - Semiconductor device and its test method - Google Patents

Abstract

PROBLEM TO BE SOLVED: To obtain a semiconductor device which can accurately grasps the test temperature after assembly, and its method. SOLUTION: In a semiconductor device having a lead frame 2 to be connected to an integrated circuit formed on semiconductor chip 1 sealed by molding to the outside, a temperature fuse 4 which fuses at a prescribed temperature is installed in an inner leg 3a sealed by molding of a lead frame 3.

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

The present invention relates to a semiconductor device and a test method therefor, and more particularly to a microcomputer with a thermal fuse and a test method therefor.

[0002]

2. Description of the Related Art In a test after assembly, even if the test temperature fluctuates and a lot of failures occur, it takes a long time before the actual test temperature is known because the test temperature causes the failure.

[0003]

SUMMARY OF THE INVENTION It is an object of the present invention to provide a semiconductor device and a test method thereof that can accurately determine a test temperature.

[0004]

According to a first aspect of the present invention, there is provided a semiconductor device having a connection piece for externally connecting an integrated circuit formed on a semiconductor chip sealed by a mold. A thermal fuse for blowing at a predetermined temperature is provided on the inner leg portion sealed by the mold of the connection piece.

According to a second aspect of the present invention, there is provided a semiconductor device having a plurality of connecting pieces for connecting an integrated circuit formed on a semiconductor chip sealed by molding to the outside. Is provided with a thermal fuse that blows at a predetermined temperature on the inner leg portion sealed by the mold for the connection portion piece in the empty state.

In a semiconductor device according to a third aspect of the present invention, there is provided a semiconductor device having a connection piece for connecting an integrated circuit formed on a semiconductor chip sealed by a mold to the outside, wherein the connection is subjected to a continuity test. A temperature fuse for blowing at a predetermined temperature is provided on the inner leg portion sealed by the mold of the piece.

A semiconductor device according to a fourth aspect of the present invention is the semiconductor device according to the first to third aspects, further comprising a plurality of connecting pieces each provided with a thermal fuse that blows at a predetermined different temperature.

In a method for testing a semiconductor device according to a fifth aspect of the present invention, a test is performed on a semiconductor device having a connection piece for connecting an integrated circuit formed on a semiconductor chip sealed by a mold to the outside. After the temperature test of the semiconductor device, it is confirmed by a continuity test whether or not a temperature fuse provided at an inner leg portion sealed by the mold of the connection piece and blown at a predetermined temperature is blown, and the temperature test is performed. Was able to determine if the test was performed at the correct temperature.

In a semiconductor device test method according to a sixth aspect of the present invention, a test is performed on a semiconductor device having a connection piece for connecting an integrated circuit formed on a semiconductor chip sealed by a mold to the outside. A current application test is performed on a connection piece having a temperature fuse provided on an inner leg portion sealed by a mold and blown at a predetermined temperature in a state where a current flows, and the temperature fuse is blown. Is used to detect an abnormality in the test temperature.

According to a seventh aspect of the present invention, in the semiconductor device test method according to the fifth or sixth aspect, the connecting piece for connecting the integrated circuit formed on the semiconductor chip sealed by the mold to the outside is provided. In conducting a test on a semiconductor device provided with a plurality of connecting pieces having a temperature fuse different from each other, including a temperature fuse provided on an inner leg portion sealed by a mold and fusing at a temperature lower than a test temperature. When the temperature is too low, the test temperature can be ascertained.

In a method of testing a semiconductor device according to an eighth aspect of the present invention, a test is performed on a semiconductor device having a connection piece for connecting an integrated circuit formed on a semiconductor chip sealed by a mold to the outside. The temperature at the time of executing a current application test for performing a characteristic test in a state where a current is flowing, for a plurality of thermal fuses provided on inner legs respectively sealed by the mold of the plurality of connection pieces and having different fusing temperatures. Information on whether the fuse has blown is stored in a storage means, and the test temperature is grasped from the storage contents of the storage means.

[0012]

DESCRIPTION OF THE PREFERRED EMBODIMENTS Embodiment 1 Embodiment 1 of the present invention will be described with reference to FIG. FIG. 1 is a plan view showing a configuration according to the first embodiment. In the figure, 1 is a chip on which a semiconductor integrated circuit is formed, 1a is a bonding pad provided on the chip 1, 2 is a package for molding and sealing the chip 1 with a resin, 3 is a bonding pad 1a provided on the chip 1 And a connection piece formed of a lead frame for connecting the semiconductor integrated circuit formed on the chip 1 to an external circuit, which is connected to the semiconductor device via wires.
Reference numeral 3a denotes a leg provided inside the connection piece 3 formed of a lead frame and molded and sealed by the package 3. Reference numeral 4 denotes a temperature fuse formed of a solder fuse provided on the leg 3a of the connection piece 3 and blown at a predetermined temperature. It is.

In the first embodiment shown in FIG. 1, a thermal fuse 4 is made of a solder which is melted at a temperature slightly higher than a test temperature on a connecting piece 3 composed of a lead frame as an empty pin as shown in FIG. By judging whether or not the fuse 4 is melted by a continuity test through the connection piece 3, it is possible to know after the molding whether or not the test has been performed at an appropriate temperature.

In the first embodiment, at the time of assembly, an empty pin fuse 4 is formed on the leg 3a of the connecting piece 3 made of a lead frame at low temperature (120 ° C. if the test temperature is 115 ° C.), and after molding, When the test temperature becomes higher than the set temperature in the test, a continuity test for whether or not the solder is melted is used as a guide to whether or not the test has been performed at the correct temperature. It is presented.

According to the first embodiment of the present invention, in a semiconductor device having a plurality of connection pieces 3 for connecting an integrated circuit formed on a semiconductor chip 1 sealed by a mold to the outside, Since the thermal fuse 4 that blows at a predetermined temperature is provided on the inner leg 3a of the connection piece 3 that is sealed by the molding of the empty connection piece 3, a semiconductor that can accurately grasp the test temperature by the thermal fuse 4 is provided. A device can be obtained.

Further, according to the first embodiment of the present invention, a test is performed on a semiconductor device having a connection piece 3 for connecting an integrated circuit formed on a semiconductor chip 1 sealed by a mold to the outside. In performing the test, after the temperature test of the semiconductor device, it is confirmed by a continuity test whether or not the thermal fuse 4 that is blown at a predetermined temperature provided on the inner leg 3a sealed by the molding of the connection piece 3 is blown. Since it is possible to grasp whether the temperature test has been performed at the correct temperature or not, it is possible to confirm whether or not the thermal fuse 4 is blown by a continuity test. You can get a test method.

Embodiment 2 FIG. Embodiment 2 of the present invention will be described with reference to FIG. FIG. 2 is a plan view showing a configuration according to the second embodiment. In the second embodiment, the configuration and operation other than the specific configuration described here have the same configuration as the first embodiment described above and exert the same operation. In the drawings, the same reference numerals indicate the same or corresponding parts.

In the figure, 1 is a chip on which a semiconductor integrated circuit is formed, 1a is a bonding pad provided on the chip 1, 2 is a package for molding and sealing the chip 1 with resin, and 3 is formed on the chip 1. A connection piece 3a made of a lead frame for connecting the semiconductor integrated circuit to an external circuit, 3a are provided inside the connection piece 3 made of the lead frame, and are molded and sealed by the package 3. 4 is a connection piece. 3 is a temperature fuse formed of a solder fuse which is provided on the leg 3a of the third and melts at a predetermined temperature.

In the second embodiment shown in FIG. 2, a thermal fuse 4 is formed in a leg 3a of a connecting piece 3 formed of a lead frame as a test pin, and a test after molding at a temperature higher than a set temperature is performed. If done,
When the solder melts, the IF test, that is, a current application test for performing a characteristic test in a state where a current flows, becomes NG,
Use this as an indication that the actual test was performed at a high level.

In the second embodiment, the device described in the first embodiment is formed on the connection piece 3 composed of a lead frame as a pin for IF test, and when the test temperature is high, the solder melts. The thermal fuse 4 is blown and I
A test method of a semiconductor device characterized by making an F test NG.

According to the second embodiment of the present invention, a test is performed on a semiconductor device having a connection piece 3 for connecting an integrated circuit formed on a semiconductor chip 1 sealed by a mold to the outside. A current application test (IF) for performing a characteristic test on a connection piece having a thermal fuse 4 provided at an inner leg 3a sealed by a mold and blowing at a predetermined temperature while a current is flowing.
Test) to detect an abnormality in the test temperature by fusing the thermal fuse 4, so that the current application test is performed on the connection piece 3 having the thermal fuse 4 to accurately grasp the test temperature. A method of testing a semiconductor device that can be obtained can be obtained.

Embodiment 3 FIG. Third Embodiment A third embodiment according to the present invention will be described with reference to FIG. FIG. 3 is a plan view showing a configuration according to the third embodiment. In the third embodiment, configurations and operations other than the specific configuration described here have the same configurations as those of the first and second embodiments described above, and exhibit the same operations. is there. In the drawings, the same reference numerals indicate the same or corresponding parts.

In the figure, 1 is a chip on which a semiconductor integrated circuit is formed, 1a is a bonding pad provided on the chip 1, 2 is a package for molding and sealing the chip 1 with resin, and 3 is formed on the chip 1. A connection piece 3a made of a lead frame for connecting the semiconductor integrated circuit to an external circuit, 3a are provided inside the connection piece 3 made of the lead frame, and are molded and sealed by the package 3. 4 is a connection piece. 3 is a temperature fuse formed of a solder fuse which is provided on the leg 3a of the third and melts at a predetermined temperature.

In the third embodiment shown in FIG. 3, a fuse 4 is formed on a connecting piece 3 composed of a lead frame as a vacant pin with solder having a different melting temperature, and even when a test is performed at a low temperature, a fuse 4 is formed. The actual test temperature is determined based on whether the fuse 4 is melted.

In the third embodiment, several fuses 4 are made of solders having different melting temperatures, so that even if the temperature becomes too low, the test temperature can be determined by how many solders are melted. And a method of testing a semiconductor device.

According to the third embodiment of the present invention, in the configuration of the semiconductor device of the first and second embodiments, a plurality of connecting pieces each provided with a thermal fuse 4 that blows at a different temperature from each other. 3
By the thermal fuses 4 respectively provided on the plurality of connecting pieces 3, a semiconductor device capable of accurately grasping the test temperature can be obtained.

According to the third embodiment of the present invention, in the method of testing a semiconductor device of the first and second embodiments, the integrated circuit formed on the semiconductor chip 1 sealed by the mold is removed. In conducting a test on the semiconductor device provided with the connecting piece 3 for connection to the outside, the connecting piece 3 having the thermal fuse 4 that is blown at a predetermined temperature and provided on the inner leg 3a sealed by the mold is used. A current application test for performing a characteristic test in a state where a current flows, and detecting an abnormality of a test temperature by fusing the thermal fuse 4, wherein an inner leg 3a sealed by a mold is used. A plurality of connections having thermal fuses 4 having different fusing temperatures, including thermal fuses 4 provided at a temperature lower than a test temperature. Since the test temperature can be grasped when the temperature of the piece 3 becomes too low, it is possible to obtain a semiconductor device test method capable of accurately grasping the test temperature by the temperature fuses 4 having different fusing temperatures. it can.

Embodiment 4 A fourth embodiment according to the present invention will be described with reference to a third embodiment. In the fourth embodiment, the configuration and operation other than the specific configuration described here have the same configurations as those of the first, second, and third embodiments described above, and the same It works.

In the fourth embodiment according to the present invention,
A plurality of fuses 4 melting at different temperatures are prepared as in the third embodiment, and the information of NG and PASS of the IF test is stored in a register formed in an integrated circuit formed on the semiconductor chip 1 (see FIG. 3). The test temperature is stored so that the test temperature can be determined by reading the register.

In the fourth embodiment, a fuse 4 that melts at a different temperature is made as in the third embodiment, NG and PASS information is stored in a register in an IF test, and the register is read. A test method for a semiconductor device, characterized in that a test temperature is known.

According to the fourth embodiment of the present invention, a test is performed on a semiconductor device having a connection piece 3 for connecting an integrated circuit formed on a semiconductor chip 1 sealed by a mold to the outside. A characteristic test is performed on a plurality of thermal fuses 4 (see FIG. 3) provided on the inner leg portions 3a sealed by the molding of the plurality of connection pieces 3 and having different fusing temperatures in a state where a current flows. Information on whether or not the thermal fuse 4 has blown during the execution of the current application test is stored in the semiconductor chip 1.
(See FIG. 3) The test temperature is stored in a storage unit composed of a register formed in an integrated circuit formed in the integrated circuit, and the storage temperature of the storage unit composed of the register is read so as to grasp the test temperature. According to the information of the means,
It is possible to obtain a semiconductor device test method capable of accurately grasping a test temperature.

[0032]

According to the first aspect of the present invention, there is provided a semiconductor device having a connecting portion for connecting an integrated circuit formed on a semiconductor chip sealed by a mold to the outside, wherein the molding of the connecting portion is performed. Since the thermal fuse for blowing at a predetermined temperature is provided on the inner leg portion sealed by the thermal fuse, a semiconductor device capable of accurately grasping the test temperature can be obtained by the thermal fuse.

According to the second aspect of the present invention, in a semiconductor device having a plurality of connecting pieces for connecting an integrated circuit formed on a semiconductor chip sealed by a mold to the outside, an empty space in the connecting pieces is provided. For the connection piece in the state,
Since a thermal fuse that blows at a predetermined temperature is provided on the inner leg portion sealed by the mold, a semiconductor device capable of accurately grasping the test temperature can be obtained by the thermal fuse provided on the vacant connection piece. it can.

According to the third aspect of the present invention, in a semiconductor device having a connecting portion for connecting an integrated circuit formed on a semiconductor chip sealed by a mold to the outside, the connecting portion is subjected to a continuity test. Since a temperature fuse that blows at a predetermined temperature is provided on the inner leg portion sealed by the mold, it is possible to obtain a semiconductor device that can accurately grasp the test temperature by using the temperature fuse provided on the connection piece to be subjected to the continuity test. Can be.

According to the fourth aspect of the present invention, in the first to third aspects, a plurality of connecting pieces provided with respective thermal fuses for blowing at different predetermined temperatures are provided. By using the provided thermal fuse, it is possible to obtain a semiconductor device capable of accurately grasping the test temperature.

According to the fifth aspect of the present invention, when a test is performed on a semiconductor device having a connection piece for connecting an integrated circuit formed on a semiconductor chip sealed by a mold to the outside, After the temperature test, it is confirmed by a continuity test whether or not the temperature fuse provided at the predetermined temperature provided on the inner leg portion sealed by the mold of the connection piece is blown, and the temperature test is performed at a correct temperature. Since it is possible to determine whether or not the test has been performed, it is possible to obtain a semiconductor device test method capable of accurately determining the test temperature by checking whether or not the thermal fuse is blown by a continuity test.

According to the sixth aspect of the present invention, when a test is performed on a semiconductor device provided with a connection piece for connecting an integrated circuit formed on a semiconductor chip sealed by a mold to the outside, the semiconductor chip is sealed by the mold. A current application test for performing a characteristic test is performed on a connection piece having a temperature fuse provided at a predetermined temperature provided on an inner leg portion to be blown at a predetermined temperature while a current is flowing. Since the current application test is performed on the connection piece having the thermal fuse, a test method for a semiconductor device capable of accurately grasping the test temperature can be obtained.

According to a seventh aspect, in the fifth or sixth aspect, the semiconductor device includes a connection piece for connecting an integrated circuit formed on the semiconductor chip sealed by the mold to the outside. In performing the test, a plurality of connecting pieces having different thermal fuses having different fusing temperatures, including a thermal fuse provided on the inner leg portion sealed by the mold and fusing at a temperature lower than the test temperature, have a lower temperature. Since the test temperature can be ascertained in the case of too much, it is possible to obtain a test method for a semiconductor device in which the test temperature can be accurately ascertained by using thermal fuses having different fusing temperatures.

According to the eighth aspect, when a test is performed on a semiconductor device having a connection piece for connecting an integrated circuit formed on a semiconductor chip sealed by a mold to the outside, a plurality of connection parts are required. For a plurality of thermal fuses provided on the inner leg portions sealed by the one-piece mold and having different fusing temperatures, whether the thermal fuse has blown during a current application test for performing a characteristic test in a state where a current is flowing. The information of whether the test temperature is stored in the storage means and the test temperature is grasped by the storage contents of the storage means,
It is possible to obtain a semiconductor device test method capable of accurately grasping a test temperature.

[Brief description of the drawings]

FIG. 1 is a plan view showing a configuration of a microcomputer with a thermal fuse according to a first embodiment of the present invention.

FIG. 2 is a plan view showing a configuration of a microcomputer with a thermal fuse according to a second embodiment of the present invention.

FIG. 3 is a plan view showing a configuration of a microcomputer with a thermal fuse according to a third embodiment of the present invention.

[Explanation of symbols]

DESCRIPTION OF SYMBOLS 1 Chip, 2 package, connection piece consisting of 3 lead frames, connection piece 3 consisting of 3a lead frames
Legs, 4 thermal fuse.

Continued on the front page (51) Int.Cl. ⁷ Identification symbol FI Theme coat II (reference) H01L 21/822 G01R 31/28 U 27/04 H01H 85/00 TF term (reference) 2G132 AA03 AK02 AL09 AL11 AL21 5F038 AV15 BE07 DF04 DT04 DT12 DT17 EZ20 5F064 BB10 BB31 BB33 FF12 FF27 FF32 5G502 AA02 BB13 EE04

Claims (8)

[Claims] 1. A semiconductor device provided with a connecting piece for connecting an integrated circuit formed on a semiconductor chip sealed by a mold to the outside, wherein inner leg portions sealed by the molding of the connecting piece are provided. A semiconductor device, further comprising a thermal fuse that blows at a predetermined temperature. 2. A semiconductor device having a plurality of connection pieces for connecting an integrated circuit formed on a semiconductor chip sealed by a mold to the outside, wherein each of the connection pieces in an empty state in the connection pieces is provided. A semiconductor fuse provided at an inner leg portion sealed by the mold at a predetermined temperature. 3. A semiconductor device having a connection piece for connecting an integrated circuit formed on a semiconductor chip sealed by a mold to the outside, wherein the connection piece subjected to a continuity test is sealed by a mold. A semiconductor fuse provided at an inner leg portion of the fuse to blow at a predetermined temperature. 4. The semiconductor device according to claim 1, further comprising a plurality of connecting pieces each provided with a thermal fuse that melts at a predetermined temperature different from each other. 5. A test for a semiconductor device provided with a connection piece for connecting an integrated circuit formed on a semiconductor chip sealed by a mold to the outside, wherein the test is performed after a temperature test of the semiconductor device. A continuity test is used to check whether the thermal fuse that blows at a predetermined temperature provided on the inner leg portion sealed by the one-piece mold is blown, so that it can be grasped whether the temperature test has been performed at the correct temperature. A method for testing a semiconductor device, comprising: 6. A test is performed on a semiconductor device having a connection piece for connecting an integrated circuit formed on a semiconductor chip sealed by a mold to the outside. For the connecting piece having a thermal fuse that blows at a predetermined temperature provided,
A method of testing a semiconductor device, comprising: performing a current application test for performing a characteristic test in a state where a current is flowing; and detecting an abnormality in a test temperature by blowing the thermal fuse. 7. A test is performed on a semiconductor device having a connection piece for connecting an integrated circuit formed on a semiconductor chip sealed by a mold to the outside. It is now possible to determine the test temperature of a plurality of connecting pieces having different temperature fuses, including a temperature fuse that is provided and blows at a temperature lower than the test temperature when the temperature becomes too low. The method for testing a semiconductor device according to claim 5, wherein: 8. A test is performed on a semiconductor device provided with a connection piece for connecting an integrated circuit formed on a semiconductor chip sealed by a mold to the outside, and a plurality of connection pieces are sealed by a mold. For a plurality of thermal fuses having different fusing temperatures provided on the inner legs respectively, information on whether or not the thermal fuse has blown at the time of executing a current application test for performing a characteristic test in a state where a current is flowing is stored. Wherein the test temperature is determined based on the storage contents of the storage means.