JP2002301770A - Device for laminating individual film fragments for tab tape - Google Patents

Abstract

PROBLEM TO BE SOLVED: To prevent voids from being generated in an adhesive interface and thereby obtain a high product quality and high reliability in a device for laminating individual fragments of a functional film such as a film with an adhesive to a TAB tape. SOLUTION: A pay-off chamber A, a working chamber B and a take-up chamber C are sequentially arranged in a direction where the TAB tape is conveyed and, in the working chamber B, a functional film supply device 11 and a laminating device body 3 are arranged. In addition, in order to prevent moisture absorption over time during working of the TAB tape as a principal material, a dehumidifier 4 and a destaticizer 5 are installed as means to fill at least the interior of the working chamber B with a dehumidified and destaticized clean air. At the same time, a near infrared and mid infrared heater 6 is provided which realizes an optimal low moisture absorption state by heating the TAB tape for a short time just before the lamination of the individual film fragments.

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention uses a TAB tape supplied in the form of a hoop as a main material, and singulates and attaches a functional material such as a film with an adhesive to the TAB tape. It concerns the device.

[0002]

2. Description of the Related Art FIG. 3 shows a conventional individual film bonding apparatus for TAB tape.

This individual piece film bonding apparatus for a TAB tape sends a hoop-shaped TAB tape 2 supplied from a TAB unwinding apparatus 7 to a bonding apparatus main body 3 as a bonding section, where a functional film supply apparatus is provided. A functional film piece such as a film with an adhesive supplied from 11 is stuck together and wound by a TAB winding device 8.

[0004] From the viewpoint of antistatic, this TAB
The atmosphere in the processing chamber in which the tape individual film bonding apparatus is placed is humid, and the relative humidity is generally maintained at 55% or more. That is, the processing room in which the apparatus is placed and the environment inside the apparatus are not particularly distinguished, and the bonding apparatus body 3 of the apparatus is exposed to an atmosphere having a relative humidity of 55% or more. .

On the other hand, since the TAB tape absorbs moisture easily, a TAB tape which has been vacuum-dried in advance is conventionally used.

[0006]

However, even in a TAB tape after vacuum drying, it is 15 to 30 in a high humidity environment.
Since moisture absorption and saturation occur in about one minute, the moisture contained therein expands, particularly during the heat bonding process of the functional individual films, and voids are generated at the bonding interface, resulting in a failure. In addition, since the atmosphere around the apparatus is kept at 55% or more relative humidity as a measure against static electricity, the atmosphere inside and outside the apparatus is in the same high humidity state in the conventional apparatus, and it is difficult to maintain a state in which voids are not generated. . This is a serious problem particularly in a process that requires a long processing time for a TAB tape supplied in a long length.

Accordingly, an object of the present invention is to solve the above-mentioned problems, and to provide an apparatus for laminating a functional film piece such as a film with an adhesive on a hoop-shaped TAB tape which has been vacuum-dried in advance, in a low moisture absorbing state over the entire length. While maintaining
Nevertheless, the TAB tape that has absorbed moisture is removed immediately before the laminating process to prevent the occurrence of voids at the bonding interface and to obtain high product quality and reliability.
An object of the present invention is to provide an individual film bonding apparatus for tape.

[0008]

Means for Solving the Problems In order to achieve the above object, the present invention is configured as follows.

(1) The individual piece film bonding apparatus for a TAB tape according to the first aspect of the present invention includes a hoop-shaped TAB tape supplied from a TAB unwinding apparatus with an adhesive supplied from a functional film supplying apparatus. In the individual film bonding device for TAB tape, which bonds functional film pieces such as films and winds them with a TAB winding device, the unwinding chamber, processing chamber,
A winding chamber is arranged, and a functional film supply device and a laminating device main body for laminating a functional film piece to be supplied from the unwinding chamber to a TAB tape supplied from the unwinding chamber are arranged in the processing chamber. In order to prevent time-dependent moisture absorption during processing of a certain TAB tape, at least the processing chamber is filled with clean air that has been dehumidified and destaticized. Near to realize moisture absorption state
A mid-infrared heater is provided to suppress generation of voids due to thermal expansion of residual moisture at the bonding interface between the TAB tape and the functional film.

[0010] The present invention relates to a device for bonding a piece of functional film to a hoop-shaped TAB tape, in which the inside of the device is subjected to dehumidification and static elimination treatment in order to prevent temporal absorption of moisture during processing of the main material TAB tape. The TAB tape is heated by a near / middle infrared heater for a short time just before laminating the individual pieces of film to achieve the optimum low moisture absorption state. The TAB tape remains at the adhesive interface between the TAB tape and the functional film. This effectively suppresses the generation of voids due to thermal expansion of water.

Here, the realization of the optimum low moisture absorption state in which the generation of voids is effectively suppressed can be realized by introducing clean air that has passed through a thread film type dehumidifier into the apparatus, for example, in a TAB tape laminating machine. , The relative humidity R in the aircraft
This is achieved by suppressing H to 30% or less. RH 30%
If kept below, the state immediately after vacuum drying can be maintained for about 3 hours.

Further, since the atmosphere in the processing room B is an environment for leaking static electricity by the ionization device, static electricity in a dehumidifying environment is prevented.

Further, by keeping the processing chamber in which the bonding apparatus main body is placed at a low humidity, it is possible to prevent the generation of rust on a tool such as a die for punching a functional film.

(2) According to the invention of claim 2, in the device for bonding individual films for TAB tape according to claim 1, means for filling at least the processing chamber with clean air subjected to dehumidification and destaticization processing is provided from outside. It is characterized by comprising a dehumidifier and a static eliminator acting on the introduced air.

(3) The invention according to claim 3 is the TAB tape individual film bonding apparatus according to claim 2, wherein the dehumidifier and the static eliminator are connected to the room air of the unwinding chamber and the winding chamber. It is characterized in that it is provided so as to act on it.

(4) The invention according to claim 4, wherein in the individual film bonding apparatus for a TAB tape according to claim 2, the processing chamber is formed after passing air introduced from outside through the dehumidifier and the neutralizer. The processing chamber is always pressurized to prevent the inflow of dust from the surroundings.

According to this feature, the processing chamber in which the bonding apparatus main body is placed is always kept at a pressurized state by the air introduced into the machine from the outside, and the inflow of dust from the surroundings is prevented.

(5) The invention of claim 5 is the TAB tape individual film bonding apparatus according to claim 2, 3 or 4, wherein the air supplied from the dehumidifier at a relatively high humidity is introduced. A dehumidifier, wherein the static eliminator is an ionizer into which air immediately after passing through the dehumidifier is introduced.The dehumidifier and the ionizer purify the processing chamber with low humidity and static elimination air, regardless of the external environment. It is characterized in that the atmosphere in the processing room of each device can be reconditioned.

According to this feature, air supplied at relatively high humidity, for example, clean air supplied from a factory, is introduced into the ionizer immediately after passing through the dehumidifier,
Air purging with low humidity and static elimination in the processing room where the body of the bonding machine is located allows the atmosphere in individual devices to be conditioned regardless of the processing room environment, and furthermore, the pressurizing effect prevents dust from flowing into the machine. Can be planned.

(6) The invention according to claim 6 is an apparatus for bonding individual films for TAB tape according to claim 5, wherein
The dehumidifier and the ionization device are characterized in that the processing chamber has an electrostatic leakage environment.

According to this feature, since the processing chamber has an environment for leaking static electricity, it is possible to prevent static electricity damage particularly in a dehumidifying environment. Since high humidity air originally set to high humidity is dehumidified, it is further ionized and introduced into the device (the processing chamber where the bonding device main body is placed), so processing is performed in an electrostatic leakage environment. This can prevent electrostatic damage in a dehumidifying environment.

(7) The invention of claim 7 is the TAB tape individual film bonding apparatus according to any one of claims 1 to 6, wherein the near / middle infrared heater has a size of 2.5 μm.
It is characterized by comprising an infrared heater radiating a wavelength range from m to 3 μm.

According to this feature, since the infrared ray radiating in the wavelength range of 2.5 μm to 3 μm is used as the tape drying means, the heat absorption characteristic of water and the radiation specialized for heating the plastic thermosetting resin can be obtained. Become. For this reason, since the processing speed of the apparatus can be increased, it is an effective method when the effective drying furnace length cannot be long due to the limitation of the outer shape of the apparatus.

<The gist of the invention> The present invention relates to a TAB tape laminating apparatus, in which the entire inside of the apparatus is kept in a dehumidifying / electrostatic leakage environment, and a hoop-shaped TAB which has been vacuum-dried in advance.
The moisture absorption of the tape is suppressed to a constant dry state over the entire length, and the slight moisture newly absorbed immediately before the laminating process is optimized by near- and mid-infrared non-contact heating for a short time.

The realization of such an optimum low moisture absorption state is specifically performed, for example, in a TAB tape laminating machine.
This is achieved by introducing the clean air that has passed through the thread film type dehumidifier into the apparatus, thereby suppressing the relative humidity in the apparatus to 30% or less. By keeping the RH at 30% or less, the state immediately after vacuum drying can be maintained for about 3 hours.

The realization of the static elimination process can be achieved, for example, by providing an ionizer as a static eliminator on the secondary side of a dehumidifier as a dehumidifier, and adjusting low-humidity air, which is easily charged, to a TAB tape charging line. Therefore, it is possible to provide an apparatus that is provided with both prevention of static electricity and a low humidity environment.

Short-time heating immediately before bonding is performed by a near / middle infrared heater having a fast response. That is, while the whole is dehumidified, heating by infrared rays is performed immediately before bonding to remove a small amount of moisture absorbed in the transportation process.

[0028]

DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS The present invention will be described below based on the illustrated embodiment.

FIG. 1 shows an outline of an individual film laminating apparatus for a TAB tape, and FIG. 2 shows an air flow diagram of an apparatus for performing dehumidification and static elimination of clean air which is a main part of the present invention.

In FIG. 1, an upper and lower unwinding chamber A, an upper processing chamber B, and an upper and lower two-stage winding chamber C are sequentially arranged in the TAB tape transport direction. A TAB unwinder 7 is disposed in the upper unwinding chamber A, a functional film supply device 11 and a bonding apparatus main body 3 are disposed in the processing chamber B, and a TAB unwinding apparatus C is disposed in the upper winding chamber C. A TAB winding device 8 is provided.

The TAB unwinding device 7 in the unwinding chamber A is provided with a TAB tape 2 wound around a TAB tape 2 together with a spacer tape. Then, the separated TAB tape 2 is supplied. The spacer tape peeled off from the TAB unwinding device 7 is wound up by the winding device 17. The hoop-shaped TAB tape 2 supplied from the TAB unwinding device 7 is transported to the processing chamber B, where functional film pieces such as a film with an adhesive supplied from the functional film supply device 11 are bonded. . Next, in the winding chamber C, TA together with the spacer tape supplied from the unwinding device 18 is used.
It is wound by the B winding device 8.

The functional film supply device 11 disposed in the processing chamber B separates a functional material such as a film with an adhesive into individual pieces using a functional film punching die, and supplies the functional film pieces onto the TAB tape 2. It has a function to do.
Further, the bonding apparatus main body 3 also disposed in the processing chamber B transfers the functional film supply apparatus 11 to the TAB tape 2 supplied from the TAB unwinding apparatus 7 in the unwinding chamber A.
And heat bonding the functional film pieces (here, a film with an adhesive) supplied from the company.

The unwinding chamber A, the processing chamber B and the winding chamber C
Are connected to each other as a whole, and are individually provided with opening / closing doors a, b, and c so that they can be opened and closed from the front side (a direction perpendicular to the TAB tape transport direction). I have. Of the three chambers, the unwinding chamber A and the winding chamber C are filled with at least the inside of the processing chamber B with clean air subjected to dehumidification and static elimination in order to prevent temporal absorption of moisture during processing of the main material TAB tape. A dehumidifier 4 and a static eliminator 5 are provided as means for performing the operation, and act on clean air introduced from outside as room air in the unwinding chamber A and the winding chamber C.

FIG. 2 is a diagram showing an apparatus for performing the dehumidification and destaticization processing of the clean air in accordance with the flow of air. Clean air supplied from a factory at high humidity is as follows.
Mist separator 9 and micro mist separator 10
After that, it passes through the dehumidifier 4 and the static eliminator 5 and is sent into the device.

That is, the dehumidifier 4 is composed of a dehumidifier (filtration type dryer) into which clean air, which is originally supplied from a factory at a high humidity, is introduced from the viewpoint of preventing static electricity. And the lower part of the winding chamber C in the upper stage. The static eliminator 5 is composed of an ionizer into which air immediately after passing through the dehumidifier is introduced, and is provided above the upper unwinding chamber A and the upper winding chamber C. By using the dehumidifier and the ionizer, the inside of the processing chamber B is purged with low humidity and static elimination air, so that the atmosphere of the individual processing chamber can be conditioned regardless of the external environment.

Further, in the processing chamber B, the TAB tape 2 is heated for a short time just before the individual film bonding, and finally a 2.5 μm Is provided with a near-infrared heater 6 which emits a wavelength range of 3 μm.

Here, the optimum low moisture absorption state means that the processing chamber B
The inside is controlled by the dehumidifier 4 and the near infrared heater 6 to T
This refers to a state in which the atmosphere in the apparatus is such that generation of voids due to thermal expansion of residual moisture at the adhesive interface between the AB tape 2 and the functional film is suppressed. Specifically, this is achieved by suppressing the relative humidity RH in the processing chamber B to 30% or less. If the relative humidity RH is kept at 30% or less, the state immediately after vacuum drying can be maintained for about 3 hours.

However, in spite of this low moisture absorption state, the atmosphere in the processing room B is in an electrostatic leakage environment by the ionization device, and the electrostatic damage in the dehumidifying environment is prevented. In addition, since the air introduced from the outside is passed through the dehumidifier and the static eliminator and then introduced into the processing chamber B, the inside of the processing chamber B is always kept under pressure, and the inflow of dust from the surroundings is prevented. ing.

Next, the operation will be described.

In FIG. 1, the TAB tape 2 supplied from the TAB unwinding device 7 in the unwinding chamber A and supplied to the processing chamber B by the transfer device 1 is applied to the bonding device main body 3 as a TAB processing portion. Is bonded to a film with an adhesive (functional film piece) supplied from the functional film supply device 11, and then sent to the winding chamber C by the transport device 1,
It is wound by the TAB winding device 8.

In general, the environment of the processing room where there is no section of the unwinding chamber A, the processing chamber B and the winding chamber C, that is, the environment around the outside of the present apparatus (the individual film bonding apparatus for TAB tape) is static electricity. RH5 due to concerns about disability
5% or more. On the other hand, the TAB tape 2 is subjected to a vacuum drying process before being processed by the present apparatus, and dehumidified to a moisture absorption of about 0.12%.

Under such preconditions, in the present apparatus, clean air supplied from the factory is dewatered by a dehumidifier (fiber-film dryer) 4 to reduce the relative humidity RH to 3
Temper to 0% or less. Dry air is TAB tape 2
Is easily charged, so that the static eliminator 5 (ionization device)
Through. The dehumidification / destaticization air is purged into the apparatus, and the amount of charge of the TAB tape 2 is adjusted to be ± 100 V or less.

The clean air conditioning process is as shown in the flowchart of FIG. The factory clean air is filtered by a mist separator 9 having a filtration degree of 5 μm and a micro mist separator 10 having a filtration degree of 0.5 μm, and is introduced into a dehumidifier 4 comprising an aerial fiber membrane type dehumidifier. Where about RH
The air dehumidified and dried to 30% is further passed through a static eliminator 5 composed of a static eliminator (ionization device), and then purged into the apparatus.

The TAB tape 2 whose moisture absorption has been suppressed as described above in the internal environment of the apparatus is heated by the infrared heater 6 for a short time immediately before bonding by the bonding apparatus body 3 in the processing chamber B, and the internal environment of the apparatus is reduced. In the transporting process, moisture absorbed slightly is removed, and immediately before bonding, the weight ratio is adjusted to about 0.05% or less. Therefore, at the time of heating and bonding the functional piece films, the generation of voids due to the thermal expansion of the residual moisture at the adhesive interface between the TAB tape and the functional film is effectively suppressed.

Further, since the atmosphere in the processing room B is an environment for leaking static electricity by the ionization device, static electricity in a dehumidifying environment is prevented. Furthermore, since the air introduced from the outside is introduced into the processing chamber B through the dehumidifier and the static eliminator, the inside of the processing chamber B is always kept under a pressurized state, and the inflow of dust from the surroundings is prevented.

As described above, the individual film bonding apparatus for a TAB tape according to the present embodiment is provided with an ionization apparatus on the secondary side of the dehumidifier to supply low-humidity air that is easily charged to the TAB tape.
The device is adapted to prevent electrostatic damage and provide a low-humidity environment by adjusting according to the tape charging sequence.
And this device is mainly used for continuous processing.
It is suitable for a processing device for heating and bonding a functional material (such as an adhesive tape) to the B tape. This device has the secondary effect of preventing oxidation of the mold even when the humidity in the processing chamber rises extremely due to a failure of the air conditioning equipment, such as when a mold is used as a processing jig. is there. That is, by keeping the processing chamber in which the bonding apparatus main body is placed at a low humidity, it is possible to prevent the generation of rust on a tool such as a functional film punching die.

In the above embodiment, the near-infrared heater is used for drying immediately before bonding, but a mid-infrared heater may be used. If the processing machine has a longer processing time (tact time), the immediately preceding drying can be performed by long-time heating with far infrared rays.

[0048]

As described above, according to the present invention, T
In the device for bonding functional film pieces to AB tape, the inside of the device is filled with dehumidified and destaticized clean air to prevent time-dependent moisture absorption during processing of the main material TAB tape, and the individual film films are bonded. Immediately before the TAB tape is heated for a short time by a near / middle infrared heater to achieve an optimal low moisture absorption state, so voids are generated due to thermal expansion of residual moisture at the adhesive interface between the TAB tape and the functional film. Can be effectively suppressed.

In addition, despite the low moisture absorption state, the atmosphere in the processing chamber B is made to have an electrostatic leakage environment by an ionization device as a static eliminator, thereby preventing static electricity damage in the dehumidifying environment.

Further, since the air introduced from the outside is introduced into the processing chamber through the dehumidifier and the static eliminator, the processing chamber is always kept under pressure and the inflow of dust from the surroundings is prevented. Can be.

As described above, according to the present invention, the reel-shaped TA
Regarding continuous bonding of individual film to B tape,
It is possible to minimize the amount of moisture absorption over the entire length irrespective of the processing room environment which is the external environment of the present apparatus, and it is possible to suppress the generation of voids at the bonded interface and improve the product quality.

[Brief description of the drawings]

FIG. 1 is a schematic view showing an individual film bonding apparatus for a TAB tape according to the present invention.

FIG. 2 is a diagram showing a device for performing dehumidification and static elimination of clean air, which is a main part of the present invention.

FIG. 3 is a schematic view showing a conventional individual piece film bonding apparatus for TAB tape.

[Explanation of symbols]

 2 TAB tape 3 Laminating device main body 4 Dehumidifying device 5 Static elimination device 6 Near infrared heater 7 TAB unwinding device 8 TAB winding device 11 Functional film supply device A Unwinding room B Processing room C Winding room

Continued on the front page (51) Int.Cl. ⁷ Identification FI FI Theme Court II (Reference) B29L 9:00 B29L 9:00 (72) Inventor Yoshihiko Saito 5-1-1 Hidakacho Hitachi, Hitachi City, Ibaraki Hitachi F-term (reference) 4c100 AK01B AT00A BA02 CB00 EJ43 EJ97 EK04 GB90 4F211 AC03 AD05 AD08 AD29 AD32 AG01 AG03 AK04 AM25 AM32 TA05 TC05 TD11 TH01 TH02 TH06 TH11 TH24 TH30 TJ13 TN08 TN26 TN56 TTN PB05 PB13 PB17 PB19 5F044 MM11 MM43 MM48 MM49

Claims (7)

[Claims] 1. A hoop-shaped TAB tape fed from a TAB unwinding device is bonded to a functional film piece such as a film with an adhesive fed from a functional film feeding device, and is wound by a TAB winding device. In an individual film bonding apparatus for TAB tape, an unwinding chamber, a processing chamber, and a winding chamber are sequentially arranged in the transport direction of the TAB tape, and a functional film supply device and a functional film piece supplied from the functional film supplying apparatus are arranged in the processing chamber. Clean air with dehumidification and static elimination at least in the processing chamber, in which a bonding apparatus main body for bonding to the TAB tape supplied from the unwinding chamber is arranged, and at least the processing chamber is dehumidified and dehydrated in order to prevent temporal absorption of moisture during processing of the TAB tape as a main material. Means to fill with TAB tape and heat the TAB tape for a short time just before laminating individual film ; And a near-in infrared heaters to achieve, TAB tape and function TAB tape piece film bonding apparatus is characterized in that suppresses occurrence of voids due to thermal expansion of the residual moisture in the bonding interface of the film. 2. The apparatus according to claim 1, wherein said means for filling at least the processing chamber with clean air having been dehumidified and destaticized comprises a dehumidifier and a static eliminator acting on air introduced from the outside. An individual film bonding apparatus for a TAB tape. 3. The TAB according to claim 2, wherein the dehumidifier and the neutralizer are provided so as to act on room air in the unwinding chamber and the winding chamber. Individual film laminating device for tape. 4. The apparatus according to claim 2, wherein air introduced from the outside is passed through the dehumidifier and the static eliminator and then introduced into the processing chamber to keep the processing chamber constantly pressurized.
TA characterized by preventing inflow of dust from the surroundings
Individual film bonding device for B tape. 5. The apparatus according to claim 2, 3 or 4,
The dehumidifier is a dehumidifier in which air supplied at a relatively high humidity is introduced, and the ionization device in which air immediately after the destaticizer has passed through the dehumidifier is introduced.
A single piece film bonding apparatus for TAB tape, characterized in that low humidity and static elimination air purging is performed in the processing chamber by the dehumidifier and the ionization apparatus, so that the atmosphere in the processing chamber can be reconditioned independently of the external environment. 6. An apparatus according to claim 5, wherein the dehumidifier and the ionizer provide an electrostatic leakage environment in the processing chamber. 7. The apparatus according to claim 1, wherein the near / middle infrared heater has a thickness of 2.5 μm to 3 μm.
An individual film bonding apparatus for a TAB tape, comprising an infrared heater that emits a wavelength range of m.