JP2002292879A - Method of manufacturing printer head, apparatus therefor and boring apparatus - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide an apparatus for manufacturing a printer head which can accurately form orifice holes to an orifice plate even when an energy of a laser beam changes. SOLUTION: These are provided an array lens illumination system 35 for shaping the laser beam to a predetermined beam shape, a mask 36 which is arranged on an optical path of the laser beam emitted from the array lens illumination system and to which a hole pattern corresponding to orifice holes 21 is formed, a projection lens 37 for focusing the laser beam passing through the mask to a plate to be processed to form orifice holes, a light detector 61 for receiving light emitted from the orifice plate when the orifice holes are formed by the laser beam to the orifice plate 20, and a fine processing controller 48 for controlling the energy of the laser beam which illuminates the orifice plate on the basis of the emitted light from the plate to be processed.

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a method and an apparatus for manufacturing a printer head for forming an orifice hole having a reverse taper shape with respect to a laser irradiation direction, and a hole processing apparatus used therefor.

[0002]

2. Description of the Related Art As shown in FIG.
A metal orifice plate 3 having a plurality of orifice holes 2 is bonded to a plurality of ink chambers 1. Each of the ink chambers 1 is partitioned by a partition wall 4, and ink droplets are ejected from an orifice hole 2 having a reverse taper shape by an ejection mechanism (not shown) for ejecting predetermined ink. As the ejection mechanism, for example, a bubble jet (registered trademark) method, a Kaiser method including a piezoelectric vibrating plate, and the like are known.

The orifice hole 2 of such an ink-jet printer is formed to have a diameter of about 30 μm, and the metal orifice plate 3 has a thickness of about 50 μm.
A plate such as Kovar is used.

The metal orifice plate 3 is usually manufactured by a plating method called an electroforming method. In a subsequent printer head manufacturing process, the metal orifice plate 3 is bonded to a head portion of the printer. In this case, it is difficult to ensure the positioning accuracy between each orifice hole 2 of the metal orifice plate 3 and each ink chamber 1 with high accuracy, and there is a problem that the orifice hole 2 is closed by the adhesive 5.

In order to avoid such a problem, there has been proposed a processing method in which an orifice plate is adhered to a head portion of a printer, and then the orifice hole 2 is opened using a laser beam. In this case, a hole pattern is formed. The used mask is used. Japanese Patent Application Laid-Open No. 2000-218802 discloses such prior art.

[0006]

When the orifice hole is machined by laser light, the intensity and beam shape of the laser light fluctuate due to the aging of the laser oscillator and the transmission optical system. In some cases, the reverse tapered orifice hole is not processed into a predetermined shape.

The shape of the orifice hole on the surface can be measured by an optical microscope or the like. However, since the imaging optical system is used, even if the intensity of the laser beam changes, the hole shape on the surface hardly changes. do not do. However, since the orifice hole has an inverted tapered shape as described above, its internal shape is greatly affected by the intensity change of the laser beam,
For example, the taper angle may fluctuate, or in extreme cases, the orifice hole may not penetrate.

[0008] Such a processing defect cannot be detected during processing by measurement with an optical microscope or the like, but it is almost always found by performing a discharge test for discharging ink from the orifice hole after processing. For this reason, a large number of defective products may be manufactured before processing defects are discovered.

The present invention measures whether or not a reverse tapered hole is reliably formed in the work plate by measuring the light emission from the work plate processed by the laser beam during the work. It is an object of the present invention to provide a method and an apparatus for manufacturing a printer head which can be distinguished, and a hole processing apparatus.

[0010]

According to a first aspect of the present invention, a plate to be processed is provided on a printer head housing in which a plurality of ink grooves are formed, and an orifice hole is formed in the plate for processing by laser light. In the method of manufacturing a printer head, a step of shaping a laser beam into a predetermined beam shape, a step of irradiating the shaped laser beam onto a mask on which a pattern corresponding to the orifice hole is formed, and a step of laser beam passing through the mask Forming an orifice hole by imaging light on the plate to be processed by an imaging optical system, and emitting light generated from the plate to be processed when forming the orifice hole by laser light in the plate to be processed. A step of receiving light and a step of controlling energy of a laser beam for irradiating the plate to be processed based on light emission generated from the plate to be processed. In the manufacturing method of the printer head, characterized by comprising and.

According to a second aspect of the present invention, there is provided the method of manufacturing a printer head according to the first aspect, wherein the energy of the laser beam for irradiating the plate to be processed is controlled by the intensity and the number of pulses of the laser beam. .

According to a third aspect of the present invention, a processing plate is provided on a printer head housing in which a plurality of ink grooves are formed.
In a manufacturing apparatus of a printer head for forming an orifice hole by laser light in a plate to be processed, a shaping optical system for shaping a laser beam into a predetermined beam shape, and a laser beam emitted from the shaping optical system are arranged on an optical path of the laser beam. A mask in which a hole pattern corresponding to the orifice hole is formed, an image forming optical system for forming an orifice hole by forming an image of the laser beam passing through the mask on the plate for processing, and the plate for processing. A light detector that receives light emitted from the plate to be processed when the orifice hole is formed by the laser light, and an energy of the laser light that irradiates the plate to be processed based on the light emitted from the plate to be processed. And a control means for controlling the printer head.

According to a fourth aspect of the present invention, in a hole forming apparatus for forming a hole in a workpiece, a shaping optical system for shaping a laser beam into a predetermined beam shape, and a laser beam on the optical path of the laser beam from the shaping optical system. A mask in which a hole pattern corresponding to the hole is formed, an imaging optical system that forms a hole by imaging a laser beam passing through the mask on the workpiece, and a hole in the workpiece. A photodetector for receiving light emitted from the workpiece when forming; and control means for controlling energy of a laser beam for irradiating the workpiece based on the light emission detected by the photodetector. A hole machining apparatus characterized in that:

According to the present invention, when the orifice hole is machined, the light emitted from the plate to be processed is measured, and the energy of the laser beam is controlled based on the measured light emission. Can be processed.

[0015]

DESCRIPTION OF THE PREFERRED EMBODIMENTS One embodiment of the present invention will be described below with reference to FIGS. FIG. 1 is a configuration diagram of a printer head manufacturing apparatus which is a hole processing apparatus for forming an orifice hole of an ink jet printer.

In the figure, reference numeral 30 denotes an excimer laser oscillator, and this excimer laser oscillator 30 outputs a laser beam having a wavelength of 400 nm or less in a pulse shape. Excimer laser oscillator 30
A variable attenuator 31, an up collimator 32, an image rotator 33, and a mirror 34 are arranged on the optical path of the laser light output from the
On the reflection optical path of No. 4, an array lens illumination system 35, a relay lens 39, a mask 36, and a projection lens (imaging lens)
37 are arranged.

On the other hand, an x stage 38a, a y stage 38b, and a z stage 3
An orifice plate (working plate) 20 as a work is placed on the z stage 38c.

Here, a specific configuration of an optical system from the array lens illumination system 35 to the relay lens 39, the mask 36, and the projection lens 37 will be described with reference to FIG. As shown in the figure, an array lens illumination system 35, a relay lens 39, a mask 36, and a projection lens 37 are arranged on the optical path of the laser light.

The array lens illumination system 35 includes two cylindrical array lenses 35a, as shown in FIGS.
35b in the mutually direction intersecting perpendicularly and is obtained by spaced L _0.

These cylindrical array lenses 35
a, each of 35b condensing surface 40 (shown in FIG. 2) is adapted to match the cylindrical array lens 35b on the same surface where the distance L _1.

Further, these cylindrical array lenses 3
The condensing surfaces 40 of the lenses 5a and 35b are imaged on the surface of the entrance pupil (aperture) 41 of the projection lens 37 by the relay lens 39, whereby the telecentric condition for the projection lens 37 is established. 35, relay lens 39, entrance pupil 41, and projection lens 37, mask 3
6 are arranged.

By such a telecentric optical system, an orifice hole 21 (shown in FIG. 2) having an inverse taper and having an axis perpendicular to the plate surface of the orifice plate 20 is formed. The mask 36 is formed in an elongated rectangular shape as shown in FIG. 4, and a plurality of circular openings 36a for forming orifice holes of the ink jet printer are formed in the longitudinal direction at predetermined pitch intervals in the longitudinal direction. .

In order to irradiate the mask 36 with laser light with a uniform intensity distribution, the up collimator 32
Has a function of converting the beam shape of the laser light output from the excimer laser oscillator 30 so as to match the rectangular apertures of the array lenses 35a and 35b.

The beam size 22 of the laser beam on the mask 36 is determined by the focal length of the array lens illumination system 35 and the relay lens 39 and the width of the array lens illumination system 35 in FIG.
The XY size is determined as shown in FIG.

The relationship between the distance and the focal length of the array lens illumination system 35, the relay lens 39, the mask 36 and the projection lens 37 is specifically shown as follows.

Each cylindrical array lens 35a, 3
_F 0 The respective focal lengths of 5b, _{f 1,} a focal length of _{f 2} of the relay lens 39, the focal distance _{f 3} of the projection lens, width W of each cylindrical array lenses 35a, 35b units array lenses, these cylindrical array The number of columns of the lenses 35a and 35b is N, and the rectangular beam size of the laser light determined by the array lens illumination system 35 is X
Assuming that Y is M and the magnification of the projection lens 37 is M, the interval L ₀ between the cylindrical array lenses 35 a and 35 b is L ₀ = f ₀ −f ₁ (1) as shown in FIG. The distance from to the focal point is L ₁ = f ₁ (2).

The diameter d of the relay lens 39 is as follows: d = W (N + L ₂ / L ₁ -1) (3)

Each cylindrical array lens 35a, 3
The focal lengths f ₀ and f ₁ of 5b are as follows: f ₀ = f ₂ / X · W (4) f ₁ = f ₂ / Y · W (5)

Further, L ₃ = f ₂ (6) f ₂ = W (N−1) / NA _in / 2 (7) L ₂ = f ₂ (f ₂ / L ₄ +1) (8) NA _in = NA _out / M (9)

The pupil diameter EPD of the entrance pupil 41 of the projection lens 37
Is represented by EPD = L ₄ · NA _in · 2 (10)

Further, f ₃ = L (2 + M + 1 / M) (11) L ₆ = (1 + M) · f ₃ (12) L ₅ = f ₃ (13) L ₄ = (1 + 1 / M) · f _{3 -f 3 = f 3 / M} ... has become a relationship of (14).

Here, the mask 36 is disposed so as to have a conjugate positional relationship with the orifice plate 20 and the projection lens 37. Thus, the hole shape of the mask 36 is formed on the orifice plate 20 with high accuracy.

The micromachining controller 48 shown in FIG.
It controls the entire hole drilling apparatus and has the following functions. That is, the micromachining controller 48 has a function of transmitting a laser control signal (trigger signal) to the excimer laser oscillator 30 and controlling the operation of the excimer laser oscillator 30.

The micromachining controller 48 sends a rotation speed control signal to the rotation mechanism 44 of the image rotator 33, and irradiates, for example, a laser beam of about 200 to 500 pulses necessary for boring the orifice plate 20. Has a function of rotating the image rotator 33 continuously.

The micro-machining controller 48 has a function of transmitting a fluence control signal to the variable attenuator 31 and adjusting the output intensity of the laser beam according to the number of pulses of the laser beam output from the excimer laser oscillator 30. Have.

The micromachining controller 48 has a function of transmitting a focus control signal to the autofocus unit 49 to form a mask image on the orifice plate 20.

The auto focus unit 49 includes:
A camera 50 is connected, and has a function of calculating a focus shift based on a mask image on the orifice plate 20 captured by the camera 50 and transmitting a drive signal for eliminating the focus shift to the driver 51. The driver 51 has a function of operating the z stage 38c according to a drive signal from the autofocus unit 48.

The micromachining controller 48 has a function of sending a position control signal to the xy driver 52 and operating the xy tables 38a and 38b so that the mask image is projected on the orifice plate 20. .

A photodetector 61 is disposed diagonally above the orifice plate 20. This photodetector 61
Irradiates the orifice plate 20 with laser light, and when processing the orifice hole 21 in the orifice plate 20, receives light emitted from the surface of the orifice plate 20 during processing, and then measures the intensity and light amount. The measurement signal from the photodetector 61 is transmitted to the fine processing controller 48.
The processing state of the orifice plate 20 is detected here, and the intensity of the laser beam is controlled according to the detection result.

FIGS. 5A to 5C are views for explaining the relationship between the process of forming the orifice hole 21 in the orifice plate 20 and the light emission in the process. Before the orifice hole 21 formed in the orifice plate 20 penetrates as shown in FIG. 5A, the removed matter P from the orifice plate 20 jumps out as a plume (light emission) toward the laser beam irradiation side. The emission intensity is relatively unchanged,
Great strength.

As shown in FIG. 5B, the orifice hole 21
In the early stage when penetrated the orifice plate 20,
Since a part of the removed matter P is discharged to the lower surface side of the orifice plate 20, the emission intensity of the laser beam on the irradiation side detected by the photodetector 61 is lower than that in the case of FIG.

As shown in FIG. 5C, the orifice hole 21
Is processed into a tapered shape, the generation of the removed matter P hardly occurs, so that light emission is hardly observed.

FIG. 6A is a graph showing a change in light emission intensity detected by the photodetector 61 when the orifice hole 21 is processed, and FIG. 6B is a graph showing the intensity of laser light. is there. The laser light is controlled by the variable attenuator 31 so that the intensity is controlled to be constant, and pulse oscillation is performed. The emission intensity detected by the photodetector 61 depends on the progress of the processing of the orifice hole 21 as described above. And it falls.

That is, in FIG. 6A, the area X is the light emission intensity in the state shown in FIG.
FIG. 5 shows the emission intensity in the state of FIG.
It is the light emission intensity in the state of (c).

Next, the operation of the device configured as described above will be described.

The pulsed laser light output from the excimer laser oscillator 30 first enters the variable attenuator 31 and the output intensity is adjusted. Next, the up collimator 32 transmits the laser beam emitted from the variable attenuator 31 to all the circular apertures 36 on the mask 36.
The light beam is converted into a belt-like beam so as to cover a, and is sent to the image rotator 33.

Since the laser light output from the excimer laser oscillator 30 has a non-uniform intensity distribution, the image rotator 33
Are continuously rotated during the irradiation of, for example, about 200 to 500 pulses of laser light required for forming a hole in the orifice plate 20, and the laser light is formed into a rotationally symmetric intensity distribution on the incident surface of the array lens illumination system 35. I do.

The laser light emitted from the image rotator 33 is reflected by a mirror 34 and enters an array lens illumination system 35. This laser light is transmitted to two cylindrical array lenses 35a, 3a of the array lens illumination system 35.
The light is condensed on the light condensing surface 40 by 5b, and is further irradiated on the mask 36 by the relay lens 39.

Then, the condensing surface 40 of the array lens illumination system 35 is imaged on the surface of the entrance pupil 41 of the projection lens 37 by the relay lens 39, so that the laser light is
Is projected on the orifice plate 20 through the orifice plate 20, thereby forming an orifice hole 21 in the orifice plate 20 as shown in FIG.

The orifice plate 2 has an orifice hole 2
When processing 1, light emission from the orifice plate 20 is detected by the photodetector 61, and processing of the orifice hole 21 is controlled based on the detection.

The procedure for machining the orifice hole 21 will be described with reference to the flowchart shown in FIG. First, S
When the start signal is output in step 1, a trigger pulse is output to the excimer laser 30 as shown in S2. As a result, pulse laser light is oscillated and output from the excimer laser 30 to irradiate the orifice plate 20.

In S3, the light emitted from the orifice plate 20 is received by the photodetector 61, and then the intensity of the light emission or the light emission amount L, and in this embodiment, the light emission amount L is measured. In S4, the light emission amount L measured in S3 is compared with the light emission amount in FIG. 5C, that is, Lmin (minimum light emission amount). If YES, the trigger pulse count value N in S5
Is compared to Nmin. Nmin is a predetermined threshold, and Nmin
If <Nmin is YES, a laser non-irradiation warning is issued as shown in S6.

That is, L <Lmin in S4 is the same as FIG.
It is determined that the reason is that the laser light is not irradiated on the orifice plate 20 because the light amount does not decrease because the orifice hole 21 penetrates as shown in FIG.

If N <Nmin is NO in S5,
In S7, the trigger pulse count value N, that is, Nmid> N
> Nmin. If YES, it is determined that the orifice hole 21 has penetrated when the trigger pulse count value N does not reach the predetermined number, so that an excessive laser irradiation warning is issued in S8.

If Nmid>N> Nmin is NO, the condition that the trigger pulse count value N reaches the predetermined number and the condition that the light emission amount in S4 decreases are satisfied.
As shown in FIG. 5C, the orifice hole 21 has penetrated, and it is displayed in S9 that the processing has been completed normally.

If it is determined in S4 that L <Lmin is NO, then in S10, Lmax>L> Lmin is determined. If NO, a laser irradiation intensity excess warning is issued in S11,
If YES, N = Nmax is determined in S12. N
If O, the number of irradiation pulses is small, so S2
Return to If YES, and the state where the orifice hole 21 does not penetrate or the state of insufficient processing occurs, if YES of the processing retry of S13 is selected, the process returns to S2, and NO
Is selected, processing abnormal end is displayed in S14.

As described above, if the processing based on the flowchart shown in FIG. 7 is performed based on the detection signal of the photodetector 61, the intensity of the pulse laser beam irradiating the orifice plate 20 due to the aging of the excimer laser oscillator 30 and the transmission optical system. Even if the beam shape changes, the orifice hole 21 can be formed in the orifice plate 20 in a predetermined shape in accordance with the change. Therefore, it is possible to prevent a large number of defective products from being manufactured in advance.

The photodetector 61 is arranged obliquely above the orifice plate 20 provided on the z-stage 38c. That is, the photodetector 61 can be arranged at a position off the optical axis of the optical system.
1 can be arranged without disturbing the projection lens 37 and the mask 36.

FIGS. 8A to 8D are process diagrams showing a method for manufacturing a printer head according to the present invention.

First, if an adhesive 111 is applied to the head casing 101 of the ink jet printer as shown in FIG. 8A, then a polyimide as a plate to be processed is applied thereto as shown in FIG. 8B. The orifice plate 20 made of a polymer material such as a sheet is bonded. The orifice plate 20 is not limited to a polyimide sheet, but may be polysulfone.

Next, after the head housing 101 is positioned and mounted on the z stage 38c shown in FIG.
As shown in (c), the orifice plate 20 is irradiated with laser light that has passed through the mask 36 and the projection lens 37 (both shown in FIG. 1). As a result, FIG.
As shown in (1), an orifice hole 21 having a desired shape can be formed in the orifice plate 20 with high accuracy.

When the orifice hole 21 is processed, light emission from the orifice plate 20 is detected by the photodetector 61, and control is performed based on the detected light emission based on the flowchart of FIG. It can be formed with an accurate shape.

The present invention is not limited to the above embodiment, but can be variously modified. For example, the photodetector 61 may be arranged at a position conjugate to the processing point via the projection lens 37 instead of obliquely above the orifice plate 20. Then, since the processing point of the orifice plate 20 is imaged on the photodetector 61,
Light emission from this processing point can be detected.

[0064]

As described above, according to the present invention, the light emitted from the plate to be processed when the orifice hole is machined is received, and the energy of the laser beam is controlled based on this light emission.

Therefore, not only can the orifice hole be machined into a preset shape, but also the occurrence of machining defects can be prevented.

[Brief description of the drawings]

FIG. 1 is a configuration diagram showing an embodiment of a hole drilling apparatus according to the present invention.

FIG. 2 is a specific configuration diagram from an array lens illumination system to a mask and a projection lens.

FIG. 3 is a configuration diagram of a part of an array lens illumination system.

FIG. 4 is a plan view showing a state in which a laser beam irradiates a mask.

FIG. 5 is an explanatory view of a state in which an orifice hole is formed in an orifice plate.

FIG. 6 is an explanatory diagram showing light emission intensity and laser intensity when forming an orifice hole in an orifice plate.

FIG. 7 is a flowchart showing a procedure for processing an orifice hole based on a light emission amount detected by a photodetector.

FIG. 8 is a process chart for manufacturing the printer head of the present invention.

FIG. 9 is a view for explaining a method of processing an orifice hole of a conventional ink jet printer.

[Explanation of symbols]

 Reference Signs List 20 orifice plate 21 orifice hole 30 excimer laser oscillator 31 variable attenuator 32 up collimator 33 image illuminator 35 array lens illumination system 36 mask 37 projection lens 61 photodetector 101 printer housing

 ──────────────────────────────────────────────────続 き Continuing on the front page (72) Inventor Isao Suzuki 6-78, Minamicho, Mishima-shi, Shizuoka Toshiba Tec Co., Ltd. Mishima Plant (72) Inventor Masashi Shimozato 6-78, Minami-cho, Mishima-shi, Shizuoka Toshiba Tec F-term (reference) at Mishima Plant, Inc. 2C057 AF93 AP13 AP23 AQ03 4E068 AF02 CA02 CA03 CA17 CD05 CD10 DA00

Claims (4)

[Claims] 1. A method of manufacturing a printer head, comprising: forming a plate to be processed on a printer head housing in which a plurality of ink grooves are formed; and forming an orifice hole in the plate for processing by laser light. Shaping the laser beam into a beam shape; irradiating the shaped laser beam onto a mask on which a pattern corresponding to the orifice hole is formed; and applying the laser beam passing through the mask to an image forming optical system for processing the laser beam. Forming an orifice hole by forming an image on the plate; receiving light emitted from the plate when forming the orifice hole by laser light on the plate; and Controlling the energy of the laser beam for irradiating the plate for processing based on the generated light emission. Method of manufacturing a printer head. 2. The method according to claim 1, wherein the energy of the laser beam for irradiating the plate to be processed is controlled by the intensity of the laser beam and the number of pulses. 3. A printer head manufacturing apparatus in which a plate to be processed is provided in a printer head housing in which a plurality of ink grooves are formed, and an orifice hole is formed in the plate to be processed by laser light. A shaping optical system for shaping into a beam shape of a laser beam, a mask disposed on an optical path of laser light emitted from the shaping optical system and having a hole pattern corresponding to the orifice hole formed thereon, and a laser beam passing through the mask, An imaging optical system that forms an orifice hole by forming an image on a processing plate; and a photodetector that receives light emitted from the processing plate when the orifice hole is formed by laser light in the processing plate. And control means for controlling the energy of the laser beam for irradiating the plate for processing based on the light emission generated from the plate for processing. Apparatus for manufacturing a printer head, characterized by comprising. 4. A drilling apparatus for forming a hole in a workpiece, comprising: a shaping optical system for shaping a laser beam into a predetermined beam shape; and a laser beam arranged on the optical path of the laser beam from the shaping optical system. A mask on which a corresponding hole pattern is formed, an imaging optical system for forming a hole by forming an image of the laser beam passing through the mask on the workpiece, A photodetector for receiving light emitted from the workpiece; and control means for controlling energy of laser light for irradiating the workpiece based on the light detected by the photodetector. Hole processing equipment.