JP2002292727A - Air pressure-forming method for plastic-made emboss carrier tape - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide a method for easily stably manufacturing a pocket for housing an electronic part of a carrier tape by means of air pressure-forming. SOLUTION: A carrier tape is formed by heating and softening a forming area of a thermoplastic resin sheet with a slit having a predetermined width, the forming area being corresponding to a pocket for housing an electronic part, and forming it by use of an upper mold equipped with a blowing-out aperture of compressed air and a lower mold having a concave shape fabricated to form a plurality of pocket.

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a package for storing, transporting, and mounting electronic components, which forms a storage pocket in a package having a function of protecting the electronic components, aligning them for mounting on a printed wiring board, and taking them out. And a method for stably producing a plastic embossed carrier tape of high quality.

[0002]

2. Description of the Related Art Generally, a plastic embossed carrier tape described above is prepared by heating and softening a thermoplastic resin sheet slit to a predetermined width by radiant heat, and then injecting 1 to ³ kgf / cm ² of air from an upper mold. A method in which cooling water at 10 to 40 ° C. is circulated through a lower mold processed into a concave shape to form a pocket (for example, Japanese Patent Application Laid-Open No. 10-31
No. 5311).

[0003]

However, in the conventional molding method, a thermoplastic resin sheet slit to a predetermined width is introduced into a heater having a plurality of openings, where it is heated and softened by radiant heat. Deterioration of the properties of the thermoplastic resin sheet, insufficient cooling of the molded pocket due to an increase in the temperature of the upper mold due to the radiant heat of the heater and the retained heat of the thermoplastic resin sheet, and stable molding was not performed.

[0004]

According to the present invention, there is provided (1) a method of manufacturing a plastic embossed carrier tape by heating and softening a thermoplastic resin sheet slit to a predetermined width in an area for forming an electronic component storage pocket. And then forming using a lower die having a concave shape to form an upper die having a compressed air outlet and a plurality of pockets, (2) a slit having a predetermined width. After the front and back surfaces of the formed area of the electronic component storage pocket of the thermoplastic resin sheet are heated and softened by direct heating with a heating plate at a softening temperature or higher, a compressed air outlet having a frontage wider than the heated portion is provided. insert the pressure mold made up of processed lower mold in a concave shape for molding the mold and a plurality of pockets, blow from the upper mold compressed air 1~5kgf / cm ^2, a thermoplastic resin sheet Applying a pressure from the top, (1) air-pressure forming method according performed by using the lower die provided with the following gap air discharge 0.2mm on the bottom around the concave shape,
(3) The compressed air forming method according to (1) or (2), which is performed using an upper mold and a lower mold in which cooling water at 20 to 40 ° C. circulates.

[0005]

DESCRIPTION OF THE PREFERRED EMBODIMENTS An embodiment of the present invention will be described with reference to FIG. The thermoplastic resin sheet 11 slit to a predetermined width is a polystyrene, polyester, vinyl chloride, polycarbonate or the like having a thickness of 0.2 to 0.4 mm,
A heating plate 13, having a plurality or continuous convex shapes 17, 18;
The front and back surfaces of the formation region of the electronic component storage pocket 12 are heated and softened by direct heating to a temperature higher than the softening temperature. Next, the heat-softened thermoplastic resin sheet is a compressed air molding die composed of an upper die 15 having a compressed air outlet 19 with a frontage wider than the heated part and a lower die 16 processed into a plurality of concave shapes 20. The compressed air of 1 to 5 kgf / cm ² is blown out from the upper mold, and pressure is applied from the upper surface of the thermoplastic resin sheet to form a pocket.

The sheet heating area a of the convex shapes 17, 18 of the heating plates 13, 14 is larger by about 0.4 to 1 mm than the pocket opening area b of the concave shape 20 of the lower die 16, and the compressed air of the upper die 15 is The opening area d of the outlet 19 is the total heating area c of the heating plates 13 and 14.
By setting a larger value, molding defects are prevented. Lower mold
By providing a gap 21 for air discharge of 0.2 mm or less around the bottom surface of the concave shape 20 of 16, the air between the thermoplastic resin sheet at the time of molding and the concave shape 20 of the lower mold is smoothly discharged,
Stable molding is performed. In addition, 2 for upper mold 15 and lower mold 16
By providing the cooling water circulation holes 22 and 23 at 0 to 40 ° C., the cooling of the mold, that is, the deformation of the pocket 12 can be prevented.

[0007]

DESCRIPTION OF THE PREFERRED EMBODIMENTS The equipment shown in FIG.
After directly heating and softening 2 mm of the pocket forming area with a heating plate to a temperature equal to or higher than the softening temperature, compressed air of 4 kgf / cm ² is blown out from the upper mold, the pocket interval is 8 mm, and the pocket opening is 4.5 mm × 4.5 mm. An embossed carrier tape was formed. At this time, the convex shape of the heating plate was 5.7 mm × 5.7.
mm, the compressed air outlet of the upper die of the compressed air molding die is 64 mm.
mm x 7 mm, 5 mm x 5 m for lower concave opening
m, the gap for air discharge is 0.1 mm, and the temperature of cooling water is 2
Performed at 8 ° C.

[0008]

According to the method of molding a plastic embossed carrier tape of the present invention, a high-accuracy and high-quality pocket for storing electronic parts can be molded easily and stably. In addition, since the shapes of the heating plate and the pressure forming die are simple, high-precision processing is easy, and cost reduction and short delivery time can be achieved.

[Brief description of the drawings]

FIG. 1 is a sectional view of an embodiment of the apparatus of the present invention.

FIG. 2 is an enlarged view of a plastic embossed carrier tape formed by the method of the present invention.

[Explanation of Signs] 1, 11 ... thermoplastic resin sheet 2, 12 ... pocket for storing electronic components 13, 14 ... heating plate 15 ... mold for air pressure molding (upper die) 16 ······································································ Air discharge Parts 22, 23: Cooling water circulation holes a: Sheet heating area b: Pocket forming opening area c: Heating plate area d: Compressed air outlet area

Claims (3)

[Claims] When manufacturing a plastic embossed carrier tape, a thermoplastic resin sheet slit to a predetermined width is heated and softened in a region where an electronic component storage pocket is formed, and then provided with a compressed air outlet. A compressed air forming method characterized by forming a mold and a plurality of pockets using a lower mold processed into a concave shape. 2. After the front and back surfaces of the electronic component storage pocket forming area of the thermoplastic resin sheet slit to a predetermined width are directly heated and softened by a heating plate to a softening temperature or higher, a frontage wider than the heated portion. Into a pressurized air molding die composed of an upper die having a compressed air outlet and a lower die formed into a concave shape for forming a plurality of pockets, and
The compressed air of kgf / cm ² is blown out from the upper mold, pressure is applied from the upper surface of the thermoplastic resin sheet, and 0.1 kgf is applied around the concave bottom surface.
The compressed air forming method according to claim 1, wherein the method is performed using a lower mold having a gap for discharging air of 2 mm or less. 3. The method according to claim 1, wherein the upper and lower dies circulate cooling water at 20 to 40 ° C.