JP2002288256A - Display method and device for circuit board loading state - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide a display method for circuit board loading state, where confirmation and consideration of loaded data can be virtually but carried out surely by displaying an operating condition of a used loaded device in three dimensional graphics at the same time, having displayed the loading state of the circuit board as three-dimensional body. SOLUTION: In the device, data which are desired to be displayed in three dimensions is fetched from circuit board data stored to a circuit board data storing part 3 via a circuit board data input part 1 by a data selecting part 5. Furthermore, the data of a used part for the selected circuit board data are fetched from facility operating data stored in a facility operation data storing part 4 via a facility operation data input part 2. In a three dimensional figure data forming part 6, the state of the circuit board after being loaded is acquired, based on each fetched data and the three-dimensional figure data to display the exterior shape of the circuit board and the exterior shape of each part in actual mounted positions are formed. The three-dimensional figure data formed are displayed by a data display part 7.

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a method and apparatus for displaying a mounting state of a circuit board, and more particularly, to a method for mounting electronic components or the like on a circuit board using a mounting apparatus.
Before the examination of the component mounting state of the circuit board using an inspection apparatus, an apparatus using the method and the method for virtually displaying the component mounting state of the circuit board designed in three dimensions.

[0002]

2. Description of the Related Art Conventionally, in the production of a circuit board, there is no problem in mounting data for operating an electronic component mounting apparatus, that is, there is no wrong mounting, or a part inefficient for mounting operation. In order to confirm that there is no such problem and that the mounting quality is ensured, it has been the mainstream that a designed circuit board is actually produced on a trial basis and the existence of these problems is confirmed on a real board. On the other hand, various methods have been devised so far in which the mounting state of a circuit board is virtually displayed on a screen of a computer or the like, and the presence or absence of a problem is confirmed without trial production of a real board. However, these methods represent a mounting state of a circuit board on a two-dimensional plane. FIGS. 23B and 23D show an example of a two-dimensionally expressed circuit board. In the case of this expression, since the component can be displayed only in a plane figure, even if the upper shape of the part is different as shown in FIG. 23A, it is displayed as the same plane figure as shown in FIG. . Further, even if the heights of the components are different as shown in FIG. 23 (c), they are displayed in the same plane figure as shown in FIG. 23 (d). Therefore, it is impossible to check the mounting constraint conditions in detail regarding the shape division and the height direction of the component, and there is a problem that a sufficient study cannot be performed.

[0003]

In the first place, in recent mounting devices, the necessity of high-precision image recognition of electronic components, etc.,
The mounting data for operating the mounting apparatus often includes items necessary for displaying the mounted circuit board as a three-dimensional body. However, in the case of displaying as a three-dimensional solid, various parts such as rotation and enlargement / reduction of a display figure are required because parts hidden by other parts appear. However, this processing requires large-scale software and hardware such as a mechanical CAD system, and is not practical. However, in recent years, due to the development of computer technology, hardware of personal computers that have become popular,
It has become easier to perform a three-dimensional display processing of the above-described mounted circuit board.

[0004] Therefore, an object of the present invention is to display the mounting state of a circuit board as a three-dimensional three-dimensional object, and then set the operating conditions of a mounting apparatus and an inspection apparatus to be used as a limited range and an operating order of each condition. Simultaneous display in two-dimensional figures enables virtual and reliable confirmation and examination of mounting data and inspection data without using a prototyped real board, thereby realizing circuit board design in a shorter time and at lower cost. It is an object of the present invention to provide a method and an apparatus for displaying a mounting state of a circuit board.

[0005]

According to a first aspect of the present invention, a state in which an electronic component or the like is mounted on a circuit board using one or a plurality of mounting apparatuses is used in the mounting apparatus. A method for displaying a mounting state of a circuit board, which is virtually displayed based on data, wherein mounting position information and shape information of each component mounted on the circuit board and data of a shape of the circuit board are used as data used in the mounting apparatus. Reading the circuit board data consisting of the information and the equipment operation data consisting of the operating condition information relating to the mounting apparatus, such as the type and lowering position of the suction nozzle to be used, the component allowable range, and the operation restriction range, for each mounting apparatus. Reading a circuit board, storing the read circuit board data and equipment operation data, and selecting a circuit board to display a three-dimensional figure from the stored circuit board data. A step that, for the selected circuit board data, obtain the status of the circuit board after component mounting obtains necessary data from the stored equipment operation data,
Creating three-dimensional graphic data for displaying the external shape of the circuit board and the external shape of each component at the mounting position;
Displaying the created three-dimensional graphic data.

As described above, according to the first aspect, the mounting state of the circuit board on which components are mounted based on the input mounting data (circuit board data and equipment operation data) is determined.
A three-dimensional figure is displayed together with the operating conditions of the mounting device to be used. As a result, the confirmation of the mounting data can be virtually and more reliably examined without using the actual board by the trial production. In addition, by reducing the time and effort for trial production, electronic component mounting can be performed in a shorter time and at lower cost. Further, even when components are mounted by a plurality of mounting apparatuses, the method of the present invention can be applied.

A second invention is an invention according to the first invention, wherein the steps of creating are: a component position after component mounting, a component distribution state to each mounting apparatus, a component mounting order,
In addition, three-dimensional graphic data for displaying a component mounting state or the like at a suction nozzle in a three-dimensional graphic is created.

[0008] A third invention is an invention according to the first and second inventions, wherein the step of displaying continuously displays a mounting operation state by a moving image in accordance with a mounting order of components.

[0009] As described above, the second and third invention, shows a typical information and presentation. By displaying the mounting state of the circuit board using such information and display method, it is possible to check the mounting data more quickly and accurately.

A fourth invention is an invention according to the first to third inventions, wherein a change of a component, a change of a mounting position, a type of a suction nozzle or the like is performed on stored circuit board data or equipment operation data. The method further includes a step of changing the descending position and the like and storing the changed information again.

A fifth invention is an invention according to the fourth invention, wherein, when the changed circuit board data or the facility operation data is stored again, a time when the data is stored is stored as a history. , 3 created from the changed data
When displaying the three-dimensional graphic data, the three-dimensional graphic data before the change is searched from the stored history, and the three-dimensional graphic data after the change and the three-dimensional graphic data before the change are compared with the mounting state by the data change. The method further includes a step of displaying the three-dimensional graphic data after the conversion in parallel or redundantly so as to show the difference, and a step of storing the relationship with the time at the time of storage as a history.

As described above, according to the fourth and fifth aspects of the present invention, the change contents of the mounting data can be displayed and confirmed again in a three-dimensional figure, so that the correction of the mounting data can be confirmed more quickly and accurately. It can be performed.

A sixth invention is an invention according to the first to fifth inventions, wherein the step of creating, when the component is not mounted at the position designated by the circuit board data, can indicate the cause or location of the component. Create error state 3D graphic data,
The displaying is characterized by displaying the error state three-dimensional graphic data simultaneously with the three-dimensional graphic data.

As described above, according to the sixth aspect of the present invention, the location of a defect in the mounting data can be checked in advance and displayed at the same time, so that the location to be corrected can be easily determined before actually performing the mounting. Corrections can be made.

A seventh invention is the invention according to the first invention, wherein the step of reading operating condition information of one or a plurality of inspection devices for inspecting a mounting state of an electronic component includes a step of mounting circuit board data. Using the position information as inspection position information,
Generating three-dimensional graphic data for displaying a state of parts distribution to each inspection device, a part inspection order, an equipment operation interference range, and the like as a three-dimensional graphic.

As described above, according to the seventh aspect of the present invention, by applying the method of the present invention to the inspection apparatus, the operating conditions of the inspection apparatus using the inspection state of the circuit board on which the components are mounted can be changed. It can be displayed as a three-dimensional figure. As a result, it is possible to virtually and more reliably check for inspection defects without using a prototype real substrate.

An eighth invention is a circuit for virtually displaying a state in which an electronic component or the like is mounted on a circuit board using one or a plurality of mounting apparatuses, based on data used in the mounting apparatus. A mounting state display device for a board, which reads circuit board data including mounting position information and shape information of each component mounted on the circuit board, and shape information of the circuit board, which are data used by the mounting device. a circuit board data input unit, the type and the lowered position, adjacent the allowable range of parts of the suction nozzle to be used, and equipment operation data and equipment operation data consisting of operating condition information about the mounting apparatus, such as operating constraints range, reads each mounting device An input unit, a circuit board data storage unit that stores the read circuit board data, and a facility operation data storage unit that stores the read facility operation data.
A data selection unit for selecting a circuit board to be displayed in a three-dimensional form from the stored circuit board data; and a circuit board after component mounting by acquiring necessary data from the stored equipment operation data for the selected circuit board data. Find the state of
It has a data creation unit for creating three-dimensional graphic data for displaying the external shape of each component at the external shape and the mounting position of the circuit board, and a data display unit for displaying the generated three-dimensional graphic data.

As described above, according to the eighth aspect, the mounting state of the circuit board on which components are mounted based on the input mounting data (circuit board data and equipment operation data)
A three-dimensional figure is displayed together with the operating conditions of the mounting device to be used. As a result, the confirmation of the mounting data can be virtually and more reliably examined without using the actual board by the trial production. In addition, by reducing the time and effort for trial production, electronic component mounting can be performed in a shorter time and at lower cost. Further, even when components are mounted by a plurality of mounting apparatuses, the method of the present invention can be applied.

A ninth invention is an invention according to the eighth invention, wherein the data creation unit includes a component position after component mounting, a component distribution state to each mounting apparatus, a component mounting order, and a suction nozzle. It is characterized in that three-dimensional graphic data for displaying a component mounting state or the like of the above as a three-dimensional graphic is created.

A tenth invention is an invention according to the eighth and ninth inventions, wherein the data display unit continuously displays a mounting operation state by a moving image in accordance with a mounting order of the components.

As described above, the ninth and tenth aspects of the present invention
It shows typical information and display methods. By displaying the mounting state of the circuit board using such information and display method, it is possible to check the mounting data more quickly and accurately.

An eleventh invention is an invention according to the eighth to tenth inventions, wherein a change of a component, a change of a mounting position,
The data editing unit further includes a data editing unit that changes the type of the suction nozzle, the lowering position, and the like and stores the changed data.

According to a twelfth aspect, according to the eleventh aspect, when the changed circuit board data or facility operation data is stored again, the time at which the data was stored is stored as a history. A data history management unit that stores the three-dimensional graphic data created from the changed data in association with the history, and the data display unit displays the three-dimensional graphic data created from the changed data. If
The stored three-dimensional graphic data before the change is searched from the stored history, and the three-dimensional graphic data after the change and the three-dimensional graphic data before the change are searched in parallel or so as to indicate a difference in the mounting state due to the data change. It is characterized by being displayed redundantly.

As described above, according to the eleventh and twelfth aspects, the change contents of the mounting data can be displayed and confirmed again in a three-dimensional figure, so that the correction of the mounting data can be confirmed more quickly and accurately. It can be performed.

A thirteenth invention is an invention according to the eighth to twelfth inventions, wherein the data creating section can indicate the cause or location of the component when the component is not mounted at the position specified by the circuit board data. Create error state 3D graphic data,
The data display unit displays the error state three-dimensional graphic data simultaneously with the three-dimensional graphic data.

As described above, according to the thirteenth aspect, a defective portion of the mounting data can be checked in advance and displayed at the same time, so that a portion to be corrected can be easily determined before actually performing the mounting. Corrections can be made.

A fourteenth invention is the invention according to the eighth invention, wherein the equipment operation data input section further reads operation condition information of one or a plurality of inspection devices for inspecting a mounting state of electronic components. The data creating unit uses the mounting position information of the circuit board data as the inspection position information, and displays a three-dimensional graphic for displaying a component distribution state to each inspection device, a component inspection order, an equipment operation interference range, and the like as a three-dimensional graphic. It characterized by further create the data.

As described above, according to the fourteenth aspect, by applying the method of the present invention to an inspection apparatus, the operating conditions of the inspection apparatus using the inspection state of the circuit board on which components are mounted can be three-dimensionally determined. It can be displayed as a three-dimensional figure. As a result, it is possible to virtually and more reliably check for inspection defects without using a prototype real substrate.

According to a fifteenth aspect, a state in which electronic components and the like are mounted on a circuit board using one or a plurality of mounting apparatuses is described.
A method of displaying a mounting state of a circuit board that virtually displays based on data used in the mounting device is a medium recorded as a program executable on a computer device, and is used as data used in the mounting device. Reading the circuit board data including the mounting position information and shape information of each component mounted on the circuit board, and the shape information of the circuit board; and the type and descending position of the suction nozzle to be used, the adjacent allowable range of the component, Reading the equipment operation data including the operation condition information on the mounting apparatus such as the operation restriction range and the like, for each mounting apparatus, storing the read circuit board data and the equipment operation data, and reading the stored circuit board data. A step of selecting a circuit board to display a three-dimensional figure;
A step of obtaining necessary data from the stored equipment operation data to determine the state of the circuit board after component mounting, and creating three-dimensional graphic data for displaying the external shape of the circuit board and the external shape of each component at the mounting position And a step of displaying the created three-dimensional graphic data at least.

A sixteenth invention is an invention according to the fifteenth invention, wherein the steps of creating are a component position after component mounting, a component distribution state to each mounting apparatus, a component mounting order, and a suction nozzle. It is characterized in that three-dimensional graphic data for displaying a component mounting state or the like of the above as a three-dimensional graphic is created.

A seventeenth invention is an invention according to the fifteenth and sixteenth inventions, wherein the displaying step is to continuously display the mounting operation state by a moving image in accordance with the order of mounting the components.

An eighteenth aspect of the present invention is an invention according to the fifteenth to seventeenth aspects, wherein, based on the stored circuit board data or equipment operation data, a change of a component, a change of a mounting position, a type of a suction nozzle, further comprising the step of re-storing making any changes to the lowered position, and the like.

A nineteenth aspect is the invention according to the eighteenth aspect, wherein, when the changed circuit board data or the equipment operation data is stored again, a time when the data is stored is stored as a history. When displaying the three-dimensional graphic data created from the data after the change, the three-dimensional graphic data before the change is searched from the saved history, and the three-dimensional graphic data after the change and the three-dimensional graphic before the change are displayed. Displaying the data in parallel or redundantly so as to show the difference in the mounting state due to the data change; storing the converted three-dimensional graphic data; and storing the relationship with the time at the time of storage as a history. And a step.

According to a twentieth aspect, in the invention according to the fifteenth to nineteenth aspects, when the component is not mounted at the position specified by the circuit board data, the cause and location can be indicated. The step of creating and displaying the error state three-dimensional graphic data is characterized by displaying the error state three-dimensional graphic data simultaneously with the three-dimensional graphic data.

A twenty-first invention is the invention according to the fifteenth invention, wherein a step of reading operating condition information of one or a plurality of inspection devices for inspecting a mounting state of the electronic component,
Using the mounting position information of the circuit board data as the inspection position information, the component distribution state to each inspection device, the component inspection order,
Generating three-dimensional graphic data for displaying the equipment operation interference range and the like as a three-dimensional graphic.

According to a twenty-second aspect, a state in which electronic components and the like are mounted on a circuit board using one or a plurality of mounting devices is described as follows.
A program for causing a computer device to execute a mounting state display method of a circuit board that virtually displays based on data used by the mounting apparatus, and is mounted on the circuit board as data used by the mounting apparatus. Reading the circuit board data consisting of the mounting position information and shape information of each component and the shape information of the circuit board; the type and descending position of the suction nozzle to be used;
Reading the equipment operation data including the operation condition information on the mounting apparatus such as the operation restriction range and the like, for each mounting apparatus, storing the read circuit board data and the equipment operation data, and reading the stored circuit board data. Selecting a circuit board to display a three-dimensional figure;
For the selected circuit board data, obtain necessary data from the stored equipment operation data to determine the state of the circuit board after component mounting, and to display the external shape of the circuit board and the external shape of each component at the mounting position. The method includes the steps of creating three-dimensional graphic data and displaying the created three-dimensional graphic data.

The twenty-third invention is an invention according to the twenty-second invention, wherein the steps of creating are: a component position after component mounting, a component distribution state to each mounting apparatus, a component mounting order, and a suction nozzle. It is characterized in that three-dimensional graphic data for displaying a component mounting state or the like of the above as a three-dimensional graphic is created.

A twenty-fourth invention is an invention according to the twenty-second and twenty-third inventions, wherein the step of displaying continuously displays a mounting operation state as a moving image in accordance with a mounting order of components.

A twenty-fifth invention is an invention according to the twenty-fourth to twenty-fourth inventions, wherein a change of a component, a change of a mounting position, a type of a suction nozzle, The method further includes a step of changing the descending position and the like and storing the changed information again.

A twenty-sixth invention is the invention according to the twenty-fifth invention, wherein, when the changed circuit board data or facility operation data is stored again, a time at which the data was stored is stored as a history. When displaying the three-dimensional graphic data created from the data after the change, the three-dimensional graphic data before the change is searched from the saved history, and the three-dimensional graphic data after the change and the three-dimensional graphic before the change are displayed. Displaying the data in parallel or redundantly so as to show the difference in the mounting state due to the data change; storing the converted three-dimensional graphic data; and storing the relationship with the time at the time of storage as a history. And a step.

According to a twenty-seventh aspect, in the invention according to the twenty-second to twenty-sixth aspects, when the component is not mounted at the position specified by the circuit board data, the cause and location can be indicated. The step of creating and displaying the error state three-dimensional graphic data is characterized by displaying the error state three-dimensional graphic data simultaneously with the three-dimensional graphic data.

A twenty-eighth invention is the invention according to the twenty-second invention, wherein a step of reading operating condition information of one or a plurality of inspection devices for inspecting a mounting state of the electronic component,
Using the mounting position information of the circuit board data as the inspection position information, the component distribution state to each inspection device, the component inspection order,
Generating three-dimensional graphic data for displaying the equipment operation interference range and the like as a three-dimensional graphic.

[0043]

DESCRIPTION OF THE PREFERRED EMBODIMENTS (First Embodiment) FIG. 1 is a block diagram showing the configuration of an apparatus using a circuit board mounting state display method according to a first embodiment of the present invention. In FIG. 1, a circuit board mounting state display device according to a first embodiment includes a circuit board data input unit 1, a facility operation data input unit 2, a circuit board data storage unit 3, and a facility operation data storage unit 4. , A data selection unit 5, a three-dimensional graphic data creation unit 6, and a data display unit 7. First, with reference to FIG. 1, an outline of each configuration of the circuit board mounted state display device according to the first embodiment will be described.

The circuit board data input unit 1 receives data relating to a circuit board created by another device (not shown), such as mounting position and shape information of each component, and shape information of the circuit board. . On the other hand, the equipment operation data input unit 2 receives data relating to the equipment operation created by another apparatus, such as operation condition information of the mounting apparatus, such as the type of suction nozzle to be used, the descending position, and the component mountable range. Is done. These data may be obtained from the mounting device,
The NC data of the mounting device may be obtained from a CAM system that generates the data, or may be data that is manually input. In any case, by using the input data and displaying the result of mounting the component in the mounting apparatus to be used in a three-dimensional figure, it is verified whether the component is mounted correctly. . The circuit board data thus input is stored in the circuit board data storage unit 3 for each circuit board. The equipment operation data is stored in the equipment operation data storage unit 4 for each equipment and each part. Data selector 5
According to an instruction given separately, the circuit board data to be displayed three-dimensionally is selected and acquired from the circuit board data storage unit 3 in which a plurality of circuit board data are stored. Further, the data selection unit 5 searches and acquires the equipment operation data of the component used in the acquired circuit board data from the equipment operation data stored in the equipment operation data storage unit 4. The three-dimensional graphic data creating unit 6 calculates the state of the circuit board after mounting based on each data acquired by the data selecting unit 5 and displays the outer shape of the circuit board and the outer shape of each component at the mounting position. Is created. In addition, the three-dimensional graphic data creating unit 6 displays three-dimensional graphic data that can divide the component distribution state and the component mounting order by colors and auxiliary lines, and displays the component mounting state by the suction nozzles so as to show the operation of the mounting apparatus. Also creates three-dimensional graphic data that can be created. The data display unit 7 displays the three-dimensional graphic data created by the three-dimensional graphic data creation unit 6. The data display unit 7 can perform processing such as rotation and enlargement / reduction of the figure so that the contents of the figure three-dimensionally represented can be checked without omission.

Next, with reference to FIGS. 2 to 7, a method of displaying the mounting state of the circuit board performed by the mounting state display device having the above-described configuration will be described with reference to specific examples. FIG. 2 is a flowchart illustrating a procedure of a method of displaying a mounted state of a circuit board according to the first embodiment of the present invention. First, the circuit board data input unit 1 receives circuit board data created by another device (step S201). FIG. 3 shows an example of the circuit board data. As shown in FIG. 3, the circuit board data includes a circuit number, a component name, and a mounting position (XY
Mounting position information list 31 indicating the coordinates and the like, a circuit board shape information list 32 indicating the names and dimensions (vertical and horizontal dimensions) of the boards to be used, a correspondence list 33 indicating the relationship between the component names and the component shape codes, and components It is composed of a part shape information list 34 indicating actual dimension values of each part of the part for each shape code. In addition, since many mounted components have the same external shape and different internal function values such as resistance values, the component shape is managed in a component shape information list 34 to which a component shape code is added, and A part shape code for each name is defined. Further, in this example, the substrate is approximated to a rectangular parallelepiped shape, but it may be separately defined by variable-length data in order to more closely approximate the actual shape. The variable length data may be represented by any expression method, but is generally represented by using, for example, a Gerber format. The input circuit board data is temporarily stored in the circuit board data storage unit 3 in the apparatus (step S202). At this time, the input circuit board data is usually stored in the circuit board data storage unit 3 in the same format. However, when the input circuit board data is divided into a plurality of formats, the subsequent processing is performed. In order to simplify the above, the format of the circuit board data may be converted into a predetermined unified format and stored.

Next, with respect to the stored circuit board data,
It is checked whether a new part exists (step S203). This is because if the part has been used before, the equipment operation data of the part is already stored, so that it is not necessary to read it again. If there is a new part, equipment operation data created by another device is input to the equipment operation data input unit 2 (step S).
204). FIG. 4 shows an example of this equipment operation data. As shown in FIG. 4, the equipment operation data includes a correspondence list 41 indicating the relation between the part name and the part operation code, the operation condition for each part operation code such as the type and moving speed of the suction nozzle to be used, and the lowering position of the suction nozzle. The information list 42 includes an information list 42 and a common operation condition information list 43 such as a non-mountable area on a substrate and a size for each nozzle type that is unique to each component and common to each component.
As in the case of the component shape, there are many which can be defined under the same conditions. Therefore, component operation codes are assigned and managed in the component operation code operation condition information list 42, and the component operation code for each component name in the correspondence list 41. Is defined. In addition, once the common operation condition information list 43 common to the components is read, it is not usually necessary to change the list. Therefore, when reading the equipment operation data for the second time or later, the reading may be omitted.

The circuit board data has different data names for each circuit board name, whereas the equipment operation data is information common to the circuit boards, so that there is only one set of data, and especially the data name is added. Not done. Actually, when the facility operation data is managed in a file, when the facility operation data is additionally input, it is additionally registered in the file in the facility operation data storage unit 4. The input equipment operation data is temporarily stored in the equipment operation data storage unit 4 in the apparatus (step S205). At this time,
The input equipment operation data is stored in the equipment operation data storage unit 4 as it is, but when the input equipment operation data is divided into a plurality of formats, the subsequent processing is simplified. Alternatively, the format of the equipment operation data may be converted into a predetermined unified format and stored.

Next, a circuit board for which a three-dimensional display is desired is selected from the circuit board data stored in the circuit board data storage unit 3 (step S206). This selection is performed by selecting one of the circuit boards from the circuit board data name at the time of input, using the circuit board data list 51 shown in FIG. 5, for example. Here, it is assumed that the circuit board data “BRD0011” has been selected. Then, the contents of the selected circuit board data are read, and for the components used in the data, the operation condition information is obtained from the equipment operation data stored in the equipment operation data storage unit 4 using the part names as keys. Is performed (step S207). For example, the component name “ERJ” used in the circuit board data “BRD0011” from FIGS.
3EYG10 ”, the component shape, that is, the vertical dimension“ 1.6 mm ”and the horizontal dimension“ 0.8 ”
mm ”etc. is the suction nozzle“ S ”as the equipment operation data.
And the nozzle descending position “0.5 mm” are acquired. Then, an image of the circuit board on which the components are mounted is obtained based on the selected data, and three-dimensional graphic data for displaying the image in a three-dimensional screen is created (step S208). FIG. 6 shows this step S208.
4 is a flowchart showing details of a process performed by the three-dimensional graphic data creating unit 6.

Referring to FIG. 6, the three-dimensional graphic data creating section 6 performs the following processing in the order in which the components are actually mounted on the circuit board, using a counter indicating the mounting order of the components (step S1). S601, S608, S609). The three-dimensional graphic data creating unit 6 generates circuit board data such as a mounting position and a shape and equipment operation data such as a used nozzle and a nozzle descending position for a component to be processed by the counter (hereinafter, referred to as a target component). (Step S60)
2). Next, the three-dimensional graphic data creating unit 6 determines whether or not the target component can be mounted at the position coordinates specified by the circuit board data (step S603). The determination criteria include checking for a nozzle selection error, checking for a gap between the nozzle lowering position and the upper surface of the substrate, and the presence or absence of interference around the designated position. If it is determined in step S603 that the target component can be mounted, the three-dimensional graphic data creating unit 6 generates a three-dimensional graphic for arranging the external shape of the target component in a three-dimensional expression at the position specified by the circuit board data. Data is created (step S604). For example, FIG.
In the circuit board data “BRD0011” shown in FIG. 7, the first component “R101” can be mounted without any problem, and is mounted as it is at the designated position (FIG. 7).
(A)).

On the other hand, if it is determined in step S603 that the target component cannot be mounted, the three-dimensional graphic data creating unit 6 specifies the target component with the circuit board data due to the influence (interference or the like) of the component already mounted. It is determined whether or not it will be mounted at a position other than the position where it was set (step S605).
For example, the circuit board data “BRD0011” shown in FIG.
Since the mounting position of the second component “R102” is the same as the mounting position of the component “R101” (incorrect data), even if the XY coordinates are the specified position, the position on the board plane Cannot be implemented. In such a case, 3
The three-dimensional graphic data creating unit 6 predicts a mounting position that will change due to the effect of the already mounted components, and converts the three-dimensional graphic data for arranging the external shape of the target component in the three-dimensional expression at the predicted position. Create (Step S60)
6). Therefore, for the component “R102”, the component “R
101 "(FIG. 7)
(B)). In the case where not only the target component but also the position of the already mounted component changes due to interference, 3
The three-dimensional graphic data creating unit 6 re-creates the three-dimensional graphic data of the part (step S606).

If it is determined in step S605 that the target component is not mounted at a position other than the position specified in the circuit board data, the three-dimensional graphic data creating unit 6 determines that the three-dimensional graphic data of the image on which the target component is mounted is It is not created (step S607). For example, the circuit board data "BRD0011" shown in FIG. 3, mounting positions calculated for the third component "C101" is the amount corresponding nozzle descent distance of the distance 72 from the circuit board surface is insufficient (Figure 7 (c)). In this case, the component "C101"
Will not be able to implement the other position, it is not created 3-dimensional graphic data. Thus, the image is the same as FIG. 7 (b).

The three-dimensional graphic data created in this way is displayed on the data display section 7 (step S20).
9). FIG. 7D shows an image in which the circuit board data “BRD0011” is three-dimensionally displayed. Note that the format of the three-dimensional graphic data may be determined according to the data display unit 7, but the standard data formats include VRML and SML.
There are TL and the like, and by applying these formats, the processing of the data display unit 7 can be diverted by a commercially available tool. In addition, in the data display unit 7, in order to virtually examine the mounting result, functions such as display of a three-dimensional graphic image from a different viewpoint and enlargement / reduction become more effective.
In this example, since there is information related to the lead in the component shape information list 34, the lead shape is also displayed. However, in an environment where there is no lead information, each component is cuboidally formed based on only the component height information. May be approximated.

Next, a line in which components on one circuit board are shared and mounted by a plurality of mounting devices (hereinafter referred to as a line).
Circuit board manufactured in multi-device line)
Consider a case of displaying with three-dimensional graphic data. in this case,
The circuit board data input to the circuit board data input unit 1 and the equipment operation data input to the equipment operation data input unit 2 are slightly different from the data described with reference to FIGS.
This will be described below with reference to FIGS.

FIG. 8 is a diagram showing another example of the circuit board data input to the circuit board data input section 1. As shown in FIG. 8, the mounting position information list 81 of the circuit board data used for the multi-device line includes the mounting position information list 31 of the circuit board data of FIG. Is further added.
Therefore, the mounting order of the components is determined for each device. Other information is the circuit board data of FIG.
Is the same as in the case of a table). On the other hand, FIG. 9 is a diagram illustrating another example of the facility operation data input to the facility operation data input unit 2. As shown in FIG. 9, in the equipment operation data used for the multi-device line, the component operation code is determined as a correspondence list 91 by a combination of the component name and the mounting device name. The type and moving speed of the suction nozzle used,
The operation condition information list 92 for each component operation code such as the lowering position of the suction nozzle is also different for each mounting device. Further, a common operation condition information list 93 such as a non-mountable area on the board and a size for each nozzle type common to each component is also configured for each mounting apparatus. Further, a line configuration information list 94 defining the order of each mounting device on the mounting line is newly added.

In the example of FIGS. 8 and 9, for example, the component “ERJ3EYG1
It can be seen that “0” is mounted on the mounting device “MH1”.
Therefore, the data selection unit 5 acquires the component operation code “M1608R”, which is this combination, from the correspondence list 91 from the equipment operation data. Next, the data selection unit 5
Acquires detailed equipment operation conditions based on this part operation code. The conditions common to the components are as follows:
The key can be acquired from the common operation condition information list 93 using “1” as a key. Next, the three-dimensional graphic data creating unit 6 calculates the state of the circuit board after mounting based on each data acquired by the data selecting unit 5, and calculates the outer shape of the circuit board and the outer shape of each component at the mounting position. Create three-dimensional graphic data for display. At this time, the order of creation is the order of mounting devices in the line configuration information list 94, and further the order of component mounting in each mounting device. 8 and 9, “ERJ3
EYG10 "," ERJ3EYG20 "," ECJ4E
YD10 "and it will be implemented in the order of" TRD3GEY ". Finally, the data display unit 7 displays the three-dimensional graphic data created by the three-dimensional graphic data creating unit 6.
Thereby, even in the case of a multi-device line including a plurality of mounting devices, the same result as in the case of one device can be obtained.

Finally, a three-dimensional graphic display realized by using the mounting state display method of the present invention will be described with a specific example. First, according to the method of the present invention, it is possible to display the order of mounting components. For example, as shown in FIG. 10A, the order of mounting is displayed by connecting with an arrow line. By performing such display, it is understood that components are mounted on the board in the order of the components 101 to 102. Regarding the mounting order, even if the mounting position information list 31 is viewed, it is easy to make a mistake. In addition, since the mounting order is not displayed on the actual board after the trial production, it is necessary to monitor the operation of the equipment during the trial shot in order to confirm the order. Therefore, by performing such display, the order is clarified. Furthermore, unlike the conventional two-dimensional display, by using a three-dimensional display,
Even when a component has the same surface area when viewed from above, the difference in the shape of the component can be reliably classified. On the other hand, in the method of the present invention, the order of mounting components can also be displayed by continuously displaying the screens shown in FIGS. By performing such display, it is possible to more easily understand which component has a problem in the mounting order. For example, in the case of FIG. 7, since the component “R102” is mounted on the component “R101” in FIG. 7B, it can be seen that a problem occurs at the time of this mounting. . Actually, the mounting instruction is issued at the same mounting coordinates on the mounting position information list 81, and it can be seen that the mounting position is incorrect. However, the component “C101” is not mounted in FIG. 7D, but the display at this time alone indicates that there was a problem when mounting the component “C101”, or the mounting operation of other components thereafter. I don't know if they were bounced off. Accordingly, by performing such a display, as shown in FIG. 7C, when the component “C101” is mounted, the mounting of the component “C101” itself is unsuccessful due to an insufficient nozzle descent amount. It is easy to see that When the mounting order is displayed on a multi-device line, the mounting devices may be displayed continuously in order from the first mounting device at the head of the line.

Further, according to the method of the present invention, it is possible to display the mounted state of the component by the suction nozzle. For example, as shown in FIG.
It is possible to display which position of the component 105 is sucked by the component 07, the position of the component 07 with respect to the substrate, and whether the component 07 does not interfere with other components 106. In the case of an asymmetrical component such as a connector component, the nozzle may not adsorb the center of the component due to the gravity balance of the entire component or a lack of a flat shape suitable for adsorption at the center of the upper surface. However, in such a case, it is necessary to set an appropriate offset amount between the suction position and the component mounting position, that is, the component center position, but the setting of this value is likely to be erroneous. Therefore, by performing such display, it is possible to visually understand whether the suction location is appropriate and whether the offset amount is accurate.

Further, according to the method of the present invention, it is possible to display the state of distribution of components to the mounting device for multi-device lines. That is, when there are a plurality of mounting devices as described above, the mounting position information list 81 indicates which mounting device mounts the component. The order of mounting between the same mounting apparatuses is also given in the mounting position information list 81. Therefore, using these pieces of information, the allocation result of the mounting device is displayed by, for example, sorting the components on the mounting state display by color as shown in FIG. By performing such display, the components 101 and 102 and the component 103 or the component 10
4 is distributed to another mounting device.

Further, according to the method of the present invention, when it is determined that the component is not correctly mounted on the board, it is possible to simultaneously display the content of the error. That is, as described above, it is determined whether or not the component is mounted at the designated position on the basis of the circuit board data and the equipment operation data in the three-dimensional graphic data generation unit 6. Therefore, when it is determined that the object is not mounted at the designated position, three-dimensional graphic data representing the values and constraints that are the basis of the determination is created.
It may be displayed together. For example, step S6 in FIG.
In 03, when it is determined whether or not the target component can be mounted at the position coordinates specified by the circuit board data, first, the nozzle selection check, the nozzle lowering position and the board Judgment is made based on the gap with the upper surface, the interference around the designated position, and the operable range of the equipment. At this time, if the result is different from the result that it can be mounted at the expected designated position, a predetermined error graphic that can three-dimensionally express the check item in which a problem has occurred is created. In the example of FIG. 3 and FIG. 4, since the mounting position of the component “R102” is the same as the component “R101” in the circuit board data “BRD0011”, even if the XY coordinates are the specified position, It cannot be mounted at a position on the board plane. In this case, as shown in FIG. 11A, the part “R101” which is the interfering object causing the interference is represented by a graphic 111 having a different color.
Also, regarding the component “C101”, if the mounting position is determined and it is determined that the component cannot be mounted due to the shortage of the nozzle descending distance,
The auxiliary line figure 112 expressing the gap is shown in FIG.
Create as shown in (b). In addition, when the mounting position is out of the mountable range, as shown in FIG. 11C, a graphic 113 indicating the restriction condition is expressed, or another component 114 and the nozzle 115 interfere with each other. FIG. 11
As shown in (d), the nozzle 115 and the component 114 may be displayed at the interference position. This is the conventional 2
In the three-dimensional three-dimensional graphic representation, it is difficult to distinguish between the nozzle and the component, but it is difficult to understand the three-dimensional three-dimensional graphic representation. By doing so, the cause of the improper implementation can be quickly grasped, so that corrective measures can be taken more accurately, and the time for confirming the correction can be shortened.

As described above, according to the method and apparatus for displaying the mounted state of the circuit board according to the first embodiment of the present invention, the mounted state of the circuit board is displayed as a three-dimensional solid on a screen of a computer or the like. As a result, even when the component shape cannot be distinguished by a plane figure, sufficient distinction becomes possible. In addition, it becomes possible to check the mounting constraint condition in the height direction. Therefore, it is possible to virtually and surely confirm and examine the mounting data without using the prototyped actual board, and the design of the circuit board can be realized in a shorter time and at lower cost.

(Second Embodiment) In the first embodiment, the method and the device for displaying the mounting state of the circuit board have been described. Next, in a second embodiment, a method of appropriately changing circuit board data and equipment operation data based on a display result will be described.

FIG. 12 is a block diagram showing the configuration of an apparatus using the circuit board mounting state display method according to the second embodiment of the present invention. 12, the circuit board mounting state display device according to the second embodiment includes a circuit board data input unit 1, a facility operation data input unit 2, a circuit board data storage unit 3, and a facility operation data storage unit 4. A data selector 5, a three-dimensional graphic data generator 6, a data display 7,
And a circuit board data editing unit 8 and a facility operation data editing unit 9. As shown in FIG. 12, the mounting state display device according to the second embodiment further includes a circuit board data editing unit 8 and a facility operation data editing unit 9 in addition to the mounting state display device according to the first embodiment. Configuration. Hereinafter, the mounting state display device according to the second embodiment will be described focusing on the different components.

The circuit board data editing unit 8 reads the circuit board data stored in the circuit board data storage unit 3, edits the contents, and writes and saves the edited result again. Similarly, the equipment operation data editing unit 9 reads the equipment operation data stored in the equipment operation data storage unit 4, edits the contents, and writes and saves the edited result again.

FIG. 13 and FIG. 14 are flowcharts showing the procedure of the method for displaying the mounted state of the circuit board according to the second embodiment of the present invention. 13 and 14, steps for performing the same processing as in FIG. 2 are denoted by the same step numbers, and description thereof is omitted. When the circuit board data is stored in the circuit board data storage unit 3 and the equipment operation data is stored in the equipment operation data storage unit 4 (Step S
In this state, whether to change the data or create three-dimensional graphic data is selected (step S1301).

If the data change is selected, it is selected which of the circuit board data and the equipment operation data is the data to be changed (step S1302). When the circuit board data is selected as a change target, the circuit board data editing unit 8 reads the corresponding circuit board data from the circuit board data storage unit 3 (Step S1303). And
The circuit board data editing unit 8 edits data according to a user's instruction, and after the editing is completed, the circuit board data storage unit 3
The data is stored in the storage device (step S1304). On the other hand, if equipment operation data is selected as a change target,
Since the equipment operation data does not depend on the type of the circuit board, the equipment operation data editing unit 9 reads the entire equipment operation data stored in the equipment operation data storage unit 4 (Step S1305). Then, the equipment operation data editing unit 9 edits the data according to the user's instruction, and saves the data in the equipment operation data storage unit 4 after the editing is completed (step S1306). Step S1304 or S1306
Upon completion of the editing process, the flow returns to step S1301 to select again whether to change the data or create three-dimensional graphic data.

When creation of three-dimensional graphic data is selected, as described above, three-dimensional graphic data is created for a circuit board on which three-dimensional display is to be performed, and displayed on the data display unit 7 (steps S206 to S206). S209). And
The displayed image is checked to determine whether or not there is a defective portion to be corrected. If there is no defective portion, the process is terminated. If there is a defective portion, the process returns to step S1301. The data change is selected again (step S1307).

As described above, according to the circuit board mounting state display method and apparatus according to the second embodiment of the present invention, data can be internally edited so that the mounting state can be displayed and confirmed for each edit. I have to. Thus, even when a data defect is found on the three-dimensional display screen, there is no need to re-input data that has been changed externally, and the time for correction confirmation can be reduced.

(Third Embodiment) In the second embodiment, the method and the apparatus for appropriately changing the circuit board data and the equipment operation data based on the display result have been described. Next, in the third embodiment, a method of displaying a difference of a changed portion in order to more easily confirm the influence of the data change, such as a portion where the data is changed, will be described.

FIG. 15 is a block diagram showing the configuration of an apparatus using the circuit board mounting state display method according to the third embodiment of the present invention. In FIG. 15, the circuit board mounting state display device according to the third embodiment includes a circuit board data input unit 1, a facility operation data input unit 2, a circuit board data storage unit 3, and a facility operation data storage unit 4. , A data selector 5, a three-dimensional graphic data generator 6, a data display 17
, A circuit board data editing unit 8, a facility operation data editing unit 9, a data history management unit 10, and a data storage unit 11. As shown in FIG. 15, the mounting state display device according to the third embodiment replaces the data display unit 7 of the mounting state display device according to the second embodiment with a data display unit 17.
This is a configuration in which a data history management unit 10 and a data storage unit 11 are further added. Hereinafter, the mounting state display device according to the third embodiment will be described focusing on the different components.

The data history management section 10 saves the circuit board data name and the storage time of the circuit board data stored in the circuit board data storage section 3. Similarly, the data history management unit 10 stores the storage time of the facility operation data stored in the facility operation data storage unit 4.
Since the equipment operation data is common to the circuit boards, only one type of data is stored. Data display part 1
When displaying the three-dimensional graphic data created by the three-dimensional graphic data creating part 6, the data history management part 10 is queried with the circuit board data name that is the basis of the three-dimensional graphic data. If the data display unit 17 determines that three-dimensional graphic data has been previously created with the circuit board data as a result of the inquiry and that the circuit board data or the equipment operation data has been edited thereafter, Is read from the data storage unit 11, and
The data is displayed at the same time as the currently displayed data. The data storage unit 11 stores the three-dimensional graphic data that has been displayed on the data display unit 17 in association with the circuit board data name.

FIGS. 16 and 17 are flowcharts showing a procedure of a method for displaying a mounted state of a circuit board according to the third embodiment of the present invention. In FIGS. 16 and 17, steps for performing the same processing as in FIGS. 2, 13 and 14 are denoted by the same step numbers, and description thereof is omitted. When the input circuit board data is stored in the circuit board data storage unit 3, the name and storage time of the circuit board data are stored in the data history management unit 10 (step S1601). When the input equipment operation data is stored in the equipment operation data storage unit 4, the storage time of the equipment operation data is stored in the data history management unit 10 (step S1602).

[0072] Figure 18 is a diagram showing an example of a data record management information managed by the data history management unit 10. FIG.
In the data history management information, the circuit board data storage time management table 181, the equipment operation data storage time management table 18
2 and 3D graphic data management table 183. The storage time of the circuit board data is registered in the circuit board data storage time management table 181, and the storage time of the equipment operation data is registered in the equipment operation data storage time management table 182. At the initial stage, as shown in FIG. 18A, no three-dimensional graphic data is created, and no information related to the circuit board data is registered in the three-dimensional graphic data management table 183. .

When the saving to the data history management unit 10 is completed, it is selected whether to change the data or to create three-dimensional graphic data (step S1301). here,
The case where the creation of three-dimensional graphic data is selected will be described first. In this case, as described above, three-dimensional graphic data is created for a circuit board on which three-dimensional display is to be performed, and is provided to the data display unit 17 (steps S206 to S20).
8). Here, the data display unit 17 searches whether or not the previous three-dimensional graphic data exists for the substrate circuit to be displayed, and if there is another applicable three-dimensional graphic data, obtains it from the three-dimensional graphic data management table 183. (Step S16
05). In the example shown in FIG. 18A, since there is no previous data, the data display unit 17 displays only the created three-dimensional graphic data on the screen (step S1606,
S209). When the display of the three-dimensional image is completed, the data display unit 17 determines whether there is three-dimensional graphic data using the circuit board data and / or equipment operation data at the same time as the three-dimensional graphic data created this time. how the searches in three-dimensional graphic data management table 183 again (step S1608). This time, it will be the first creation,
The three-dimensional graphic data is registered in the three-dimensional graphic data management table 183 together with the storage time of the circuit board data and the equipment operation data from which the three-dimensional graphic data is based. Here, the three-dimensional graphic data name is based on the circuit board data name,
It is automatically given so as to be uniquely determined by a combination of the storage time of the circuit board data and the storage time of the equipment operation data. Then, the data storage unit 11 stores the three-dimensional graphic data with the given name.

Next, the case where the data change is selected in step S1301 will be described. When the circuit board data is selected as a change target and the data is edited and stored in the circuit board data storage unit 3, step S160
The storage time stored in the circuit board data storage time management table 181 at 1 is updated (step S1603). on the other hand,
When the equipment operation data is selected as a change target and the data is edited and stored in the equipment operation data storage unit 4, the equipment operation data storage time management table 182 is obtained in step S1602.
Is updated (step S160).
4). For example, in the data shown in FIG. 3, as shown in FIG. 7D, the mounting positions of the components are overlapped, and the mounting position information of the circuit board data is changed as shown in FIG. 19. Therefore, the storage time of the circuit board data storage time management table 181 is updated according to the time when this change result is stored, as shown in FIG. In the example of FIG. 3, since the equipment operation data is not changed, there is no change in the equipment operation data storage time management table 182.

Then, based on the result of the change, 3
When the three-dimensional graphic data is created and displayed on the screen, the three-dimensional graphic data management table 1
The three-dimensional graphic data “BRD0011-
1 "(FIG. 18B). Therefore, the data display unit 17 simultaneously displays the stored three-dimensional graphic data “BRD0011-1” on the screen together with the changed three-dimensional graphic data (steps S1606 and S160).
7). FIG. 21 is a specific example of displaying the difference between the graphic images before and after the change. It can be displayed simultaneously and in parallel as shown in FIG. 21 (a), can be superimposed and displayed with different colors as shown in FIG. 21 (b), or can compare two 3D graphic data as shown in FIG. 21 (c). Then, a method of displaying only different graphic portions (an example in which the viewpoint is changed by rotation) is considered. By displaying the data in this manner, when data is changed, it is possible to more easily confirm the content of the change and the effect.

When the display of the three-dimensional image is completed, the data display unit 17 displays the three-dimensional graphic data using the circuit board data and / or the equipment operation data at the same time as the three-dimensional graphic data changed this time. It is searched again in the three-dimensional graphic data management table 93 for existence (step S1608). At this time, since the storage time of the circuit board data is different from that of the previous creation, the current three-dimensional figure data is also stored in the three-dimensional figure data management table 183 together with the storage times of the original circuit board data and the equipment operation data. Register (FIG. 20). By doing so, the three-dimensional graphic data can be stored in the data storage unit 11 as difference data only when there is a change in the circuit board data or the equipment operation data. Although the deletion of the three-dimensional graphic data stored in the data storage unit 11 is not specified, the deletion may be performed at the same time when the original circuit board data is deleted, or an update generation that can be stored is determined in advance. Then, when the generation reaches the generation, the oldest generation is deleted in order, and the storage area may be secured.

As described above, according to the circuit board mounting state display method and apparatus according to the third embodiment of the present invention, the past data history is held, and the current data and the previous data are compared. Display the difference. Thereby, it is possible to more easily confirm the influence of the data change, such as the location where the data is changed.

The circuit board mounting state display method described in the first to third embodiments can be applied to the inspection state display when inspecting a circuit board on which components are mounted. is there. An example of the procedure will be described below.
When the method of the present invention is used to display the inspection status, the inspection data of each component and the like are input to the circuit board data input unit 1 in addition to the data described above. On the other hand, the inspection operation condition information such as an inspectable range related to the inspection equipment is input to the equipment operation data input unit 2 in addition to the above-described data. These data are stored in the circuit board data storage unit 3 and the facility operation data storage unit 4, respectively. The data selection unit 5 acquires data on a circuit board and an inspection item to be displayed three-dimensionally from the circuit board data storage unit 3 and the equipment operation data storage unit 4. The three-dimensional graphic data creation unit 6
Based on the data obtained by the data selection unit 5, the state of the circuit board after component mounting is calculated, and three-dimensional graphic data for displaying the external shape of the circuit board and the external shape of each component at the mounting position is created. . In addition, the three-dimensional graphic data creation unit 6 performs an operation content expression according to the inspection item (for example, an expression that divides a component distribution state and a component inspection order by a color and an auxiliary line, and an expression of a component inspection state such as a laser optical axis. ) Is created. The data display section 7 or 17
The three-dimensional graphic data relating to component mounting and the three-dimensional graphic data relating to component inspection generated by the three-dimensional graphic data generating unit 6 are simultaneously displayed.

FIG. 22 shows an example of the inspection state of the component displayed on the data display section 7 or 17. FIG. 22 (a)
FIG. 5 is a diagram showing an inspection state of an inspection item in which an image of an external appearance of a circuit board is checked by an upward camera. As shown in FIG. 22A, in a circuit board in which the component 222 is placed in the same mounting position as the component 221 due to an error in the circuit board data, the component 221 is determined as an uninspection component due to a change in color or the like. Display. FIG.
FIG. 2B is a diagram showing an inspection state of an inspection item for checking a mounting position of a component using a laser beam. As shown in FIG. 22B, the irradiation plane 225 of the laser beam
Is displayed, the component 223 is
24 makes it easy to determine that the part is not inspectable. As described above, by displaying the inspection state in addition to the display of the mounting state of the circuit board, it is possible to virtually and surely check and examine the inspection data without using the prototyped actual board, and to perform the circuit operation. Substrate design can be realized in a shorter time and at lower cost.

The mounting state display method of the present invention can be applied to a printed circuit board circuit, a bendable flexible resin board circuit, and a circuit formed by printing or etching on a housing or the like. Also, typically, the mounting state display method according to the above-described embodiment is realized by causing a predetermined program to be executed on a computer device, and an apparatus using the method includes a storage device storing the predetermined program. (ROM, RAM, hard disk unit, etc.)
This is realized by a CPU (Central Processing Unit) that executes this program. in this case,
The predetermined program may be introduced via a computer-readable recording medium such as a CD-ROM or a floppy (registered trademark) disk.

[Brief description of the drawings]

FIG. 1 is a block diagram showing a configuration of an apparatus using a circuit board mounting state display method according to a first embodiment of the present invention.

FIG. 2 is a flowchart illustrating a procedure of a method of displaying a mounted state of a circuit board according to the first embodiment of the present invention.

FIG. 3 is a diagram illustrating an example of circuit board data input to a circuit board data input unit 1;

FIG. 4 is a diagram showing an example of equipment operation data input to the equipment operation data input unit 2;

FIG. 5 is a diagram illustrating an example of a list of circuit board data.

FIG. 6 is a flowchart showing in detail a process performed by a three-dimensional graphic data creating unit 6;

FIG. 7 is a diagram illustrating an example of a three-dimensional image displayed based on three-dimensional graphic data created by a three-dimensional graphic data creating unit 6.

FIG. 8 is a diagram illustrating another example of the circuit board data input to the circuit board data input unit 1;

FIG. 9 is a diagram showing another example of the equipment operation data input to the equipment operation data input unit 2.

FIG. 10 is a diagram showing an example of a three-dimensional image displayed on the data display unit 7;

FIG. 11 is a diagram showing an example of a three-dimensional image displayed on the data display unit 7;

FIG. 12 is a block diagram illustrating a configuration of an apparatus using a circuit board mounting state display method according to a second embodiment of the present invention.

FIG. 13 is a flowchart illustrating a procedure of a method for displaying a mounted state of a circuit board according to the second embodiment of the present invention.

FIG. 14 is a flowchart illustrating a procedure of a method for displaying a mounted state of a circuit board according to the second embodiment of the present invention.

FIG. 15 is a block diagram showing a configuration of an apparatus using a circuit board mounting state display method according to a third embodiment of the present invention.

FIG. 16 is a flowchart illustrating a procedure of a circuit board mounting state display method according to a third embodiment of the present invention.

FIG. 17 is a flowchart showing a procedure of a circuit board mounting state display method according to a third embodiment of the present invention.

FIG. 18 is a diagram illustrating an example of history management information managed by the data history management unit 10.

FIG. 19 is a diagram illustrating an example of circuit board data changed by the circuit board data editing unit 8;

FIG. 20 is a diagram showing another example of history management information managed by the data history management unit 10.

FIG. 21 is a diagram illustrating an example of a three-dimensional image displayed on the data display unit 17.

FIG. 22 is a diagram showing an example of a three-dimensional image displayed on the data display unit 17 when the present invention is applied to the inspection state display of a circuit board.

FIG. 23 is a diagram illustrating an example of a conventional method for displaying a mounting state of a circuit board.

[Explanation of symbols]

DESCRIPTION OF SYMBOLS 1 ... Circuit board data input part 2 ... Equipment operation data input part 3 ... Circuit board data storage part 4 ... Equipment operation data storage part 5 ... Data selection part 6 ... Three-dimensional figure data creation part 7,17 ... Data display part 8 ... Circuit board data editing part 9 ... Equipment operation data editing part 10 ... Data history management part 11 ... Data storage part 31-34,81-84,197 ... Circuit board data 41-43,91-94 ... Equipment operation data 51 ... Circuit Board data list 72: gaps 101 to 106, 111, 114, 221-224 ... parts 107, 115 ... nozzles 181-183, 208 ... history management data 112, 113, 225 ... error-related condition graphics

Continuation of the front page (72) Inventor Keiji Hanada 1006 Kazuma Kadoma, Kazuma-shi, Osaka Matsushita Electric Industrial Co., Ltd. F-term (reference) 5B046 AA08 BA04 DA10 FA17 GA01 GA09 JA01 5E313 AA01 AA11 EE05 EE24 FG10

Claims (28)

[Claims] 1. A mounting state of a circuit board for virtually displaying a state in which electronic components and the like are mounted on the circuit board using one or a plurality of mounting apparatuses based on data used in the mounting apparatus. A display method, wherein, as data used in the mounting apparatus, reading circuit board data including mounting position information and shape information of each component mounted on the circuit board, and shape information of the circuit board; Reading equipment operation data including operation condition information relating to the mounting apparatus, such as the type and lowering position of the suction nozzle to be performed, the allowable range of component adjacency, and the operation restriction range, for each mounting apparatus; Storing data and the equipment operation data; selecting a circuit board for which a three-dimensional graphic is to be displayed from the stored circuit board data; For the selected circuit board data, to obtain necessary data from the stored facility operation data to determine the state of the circuit board after component mounting, and to display the external shape of the circuit board and the external shape of each component at the mounting position. And a step of displaying the created three-dimensional graphic data. 2. The method according to claim 1, wherein the step of creating includes displaying the component position after component mounting, a component distribution state to each mounting apparatus, a component mounting order, a component mounting state with a suction nozzle, and the like in a three-dimensional figure. 2. The mounting state display method according to claim 1, wherein graphic data is created. 3. The mounting state display method according to claim 1, wherein, in the displaying step, the mounting operation state is continuously displayed as a moving image in accordance with a mounting order of the components. 4. The method according to claim 1, further comprising a step of changing the stored circuit board data or the equipment operation data, changing a component, changing a mounting position, changing a suction nozzle type, a lowering position, and the like, and storing the data again. Item 4. The mounting state display method according to any one of Items 1 to 3. 5. A step of storing the time of data storage as a history when storing the changed circuit board data or the equipment operation data again, and the three-dimensional graphic data created from the changed data. Is displayed, the three-dimensional graphic data before the change is searched from the stored history, and the three-dimensional graphic data after the change and the three-dimensional graphic data before the change are compared in the mounting state due to the data change. 5. The method according to claim 4, further comprising a step of displaying the converted three-dimensional graphic data in parallel or redundantly so as to show the three-dimensional graphic data after conversion, and a step of storing the relation with the time at the time of storage as a history. Mounting status display method described in. 6. The step of creating, when a component is not mounted at a position designated by the circuit board data, creating error state three-dimensional graphic data indicating a cause or location of the component. 6. The mounting state display method according to claim 1, wherein the error state three-dimensional figure data is displayed simultaneously with the three-dimensional figure data. 7. A step of reading operating condition information of one or a plurality of inspection devices for inspecting a mounting state of an electronic component, and using mounting position information of the circuit board data as inspection position information, 2. The mounting state display method according to claim 1, further comprising the step of creating three-dimensional graphic data for displaying a part distribution state, a part inspection order, a facility operation interference range, and the like as a three-dimensional figure. 8. A mounting state of a circuit board that virtually displays a state in which electronic components and the like are mounted on the circuit board using one or a plurality of mounting apparatuses based on data used in the mounting apparatus. A display device, which is data used by the mounting device, circuit board data for reading circuit board data including mounting position information and shape information of each component mounted on the circuit board and shape information of the circuit board. An input unit and equipment operation data input for reading, for each of the mounting apparatuses, equipment operation data including operation condition information relating to the mounting apparatus such as a type and a descending position of a suction nozzle to be used, an adjacent allowable range of parts, and an operation restriction range. A circuit board data storage unit for storing the read circuit board data; a facility operation data storage unit for storing the read facility operation data; A data selecting unit for selecting a circuit board for which a three-dimensional graphic display is desired from the circuit board data, and for the selected circuit board data, acquiring necessary data from the stored facility operation data to obtain a circuit after component mounting. A data creation unit for obtaining the state of the board and creating three-dimensional graphic data for displaying the outer shape of each component at the outer shape and the mounting position of the circuit board; and a data display unit for displaying the created three-dimensional graphic data. A mounting state display device comprising: 9. The three-dimensional data display unit displays the component position after component mounting, component distribution status to each mounting apparatus, component mounting order, component mounting status with a suction nozzle, and the like in a three-dimensional figure. The mounting state display device according to claim 8, wherein figure data is created. 10. The mounting state display device according to claim 8, wherein the data display unit continuously displays a mounting operation state by a moving image in accordance with a mounting order of the components. About 11. memorized the circuit board data or the plant operation data, further comprising component changes, changes in the mounting position, the data editing section stored again making changes, such as the type and the lowered position of the suction nozzle The mounting state display device according to any one of claims 8 to 10. 12. When storing the changed circuit board data or the facility operation data again, the time at which the data was stored is stored as a history, and the three-dimensional graphic data created from the changed data is stored. The data display unit further includes a data history management unit configured to store the three-dimensional graphic data created from the changed data. Searching for the three-dimensional graphic data, and displaying the three-dimensional graphic data after the change and the three-dimensional graphic data before the change in parallel or redundantly so as to show a difference in a mounting state due to the data change; The mounting state display device according to claim 11, characterized in that: 13. The method according to claim 1, wherein when the component is not mounted at the position specified by the circuit board data, the data creating unit creates error state three-dimensional graphic data indicating a cause and a location thereof. The mounting state display device according to claim 8, wherein the error state three-dimensional graphic data is displayed simultaneously with the three-dimensional graphic data. 14. The equipment operation data input unit further reads operation condition information of one or a plurality of inspection devices for inspecting a mounting state of an electronic component, and the data creation unit reads mounting position information of the circuit board data. Is used as inspection position information, and the component distribution state to each inspection device, the component inspection order, the equipment operation interference range, etc.
9. The mounting state display device according to claim 8, further comprising creating three-dimensional graphic data to be displayed as a three-dimensional graphic. 15. A mounting state of a circuit board that virtually displays a state in which electronic components and the like are mounted on the circuit board using one or a plurality of mounting apparatuses based on data used in the mounting apparatus. A display method is a medium recorded as a program executable on a computer device, wherein data used by the mounting device includes mounting position information and shape information of each component mounted on a circuit board, and a circuit board. Reading the circuit board data consisting of the shape information of, and the equipment operation data consisting of the operating condition information on the mounting device, such as the type and descent position of the suction nozzle to be used, the component allowable range, and the operation restriction range, Reading for each of the mounting devices; storing the read circuit board data and the facility operation data; and storing the stored circuit. Selecting a circuit board to be displayed in a three-dimensional pattern from the board data; obtaining necessary data from the stored equipment operation data for the selected circuit board data to obtain a state of the circuit board after component mounting; Generating a three-dimensional graphic data for displaying the external shape of each component at the external shape and the mounting position of the circuit board; and displaying the generated three-dimensional graphic data. A recording medium for recording. 16. The three-dimensionally displaying the three-dimensional figure includes displaying a component position after component mounting, a component distribution state to each mounting apparatus, a component mounting order, a component mounting state with a suction nozzle, and the like. 16. The recording medium according to claim 15, wherein graphic data is created. 17. The recording medium according to claim 15, wherein, in the displaying step, the mounting operation state is continuously displayed as a moving image according to a mounting order of the components. 18. The method according to claim 18, further comprising the step of changing the stored circuit board data or the equipment operation data, changing a component, changing a mounting position, changing a type of a suction nozzle, a lowering position, and the like, and storing the data again. Item 18. The recording medium according to any one of Items 15 to 17. 19. A step of storing the time of data storage as a history when storing the changed circuit board data or the equipment operation data again, and the three-dimensional graphic data created from the changed data. Is displayed, the three-dimensional graphic data before the change is searched from the stored history, and the three-dimensional graphic data after the change and the three-dimensional graphic data before the change are compared in the mounting state due to the data change. 19. The method according to claim 18, further comprising a step of displaying the converted three-dimensional graphic data in parallel or redundantly so as to show the three-dimensional graphic data after conversion, and a step of storing a relationship with the time at the time of storage as a history. A recording medium according to claim 1. 20. The method according to claim 19, wherein: if no component is mounted at a position specified by the circuit board data,
20. An error state three-dimensional graphic data indicating the cause and location of the error state three-dimensional graphic data is displayed, and the displaying includes displaying the error state three-dimensional graphic data simultaneously with the three-dimensional graphic data. The recording medium according to any one of the above. 21. A step of reading operating condition information of one or a plurality of inspection apparatuses for inspecting a mounting state of an electronic component; and using mounting position information of the circuit board data as inspection position information, 16. The recording medium according to claim 15, further comprising: creating three-dimensional graphic data for displaying a distribution state, a part inspection order, a facility operation interference range, and the like as a three-dimensional graphic. 22. A mounting state of a circuit board for virtually displaying a state in which electronic components and the like are mounted on the circuit board using one or a plurality of mounting apparatuses based on data used in the mounting apparatus. A program for causing a computer device to execute a display method, comprising, as data used in the mounting device, mounting position information and shape information of each component mounted on a circuit board, and shape information of the circuit board. And the equipment operation data including the operating condition information on the mounting apparatus, such as the type of suction nozzle to be used, the descending position, the allowable range of components, and the operation restriction range, for each of the mounting apparatuses. A step of reading; a step of storing the read circuit board data and the equipment operation data; and a step of reading 3 from the stored circuit board data. Selecting a circuit board to display the original figure, for the selected circuit board data, obtain necessary data from the stored equipment operation data to determine the state of the circuit board after component mounting, A program comprising: a step of creating three-dimensional graphic data for displaying the external shape of each component at an external shape and a mounting position; and a step of displaying the generated three-dimensional graphic data. 23. The step of creating includes displaying the component position after component mounting, a component distribution state to each mounting apparatus, a component mounting order, a component mounting state with a suction nozzle, and the like in a three-dimensional figure. 23. The program according to claim 22, wherein the program creates graphic data. 24. The program according to claim 22, wherein, in the displaying, the mounting operation state is continuously displayed as a moving image according to a mounting order of the components. 25. The method according to claim 25, further comprising the step of changing the stored circuit board data or the equipment operation data, changing a component, changing a mounting position, changing a type of suction nozzle, a lowering position, and the like, and storing the data again. Item 25. The program according to any one of Items 22 to 24. 26. A step of storing the time of data storage as a history when storing the changed circuit board data or the facility operation data again, and the three-dimensional graphic data created from the changed data. Is displayed, the three-dimensional graphic data before the change is searched from the stored history, and the three-dimensional graphic data after the change and the three-dimensional graphic data before the change are compared in the mounting state due to the data change. 26. The method according to claim 25, further comprising the steps of: displaying the converted three-dimensional graphic data in a parallel or redundant manner so as to show the three-dimensional graphic data; and storing, as a history, an association with the time at the time of the storage. The program described in. 27. The method according to claim 27, wherein: if no component is mounted at a position specified by the circuit board data,
27. An error state three-dimensional graphic data indicating the cause and location thereof is created, and the displaying step displays the error state three-dimensional graphic data simultaneously with the three-dimensional graphic data. The program according to any of the above. 28. A step of reading operating condition information of one or a plurality of inspection apparatuses for inspecting a mounting state of an electronic component, and using mounting position information of the circuit board data as inspection position information, 23. The program according to claim 22, further comprising: creating three-dimensional graphic data for displaying a distribution state, a part inspection order, an equipment operation interference range, and the like as a three-dimensional graphic.