JP2002273711A - Method for manufacturing timber chip board - Google Patents

Method for manufacturing timber chip board

Info

Publication number
JP2002273711A
JP2002273711A JP2001076966A JP2001076966A JP2002273711A JP 2002273711 A JP2002273711 A JP 2002273711A JP 2001076966 A JP2001076966 A JP 2001076966A JP 2001076966 A JP2001076966 A JP 2001076966A JP 2002273711 A JP2002273711 A JP 2002273711A
Authority
JP
Japan
Prior art keywords
phenol resin
chips
timber
wood chip
temperature
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP2001076966A
Other languages
Japanese (ja)
Inventor
Shigeru Yagi
茂 八木
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
YAITA KAKO SANGYO KK
Original Assignee
YAITA KAKO SANGYO KK
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by YAITA KAKO SANGYO KK filed Critical YAITA KAKO SANGYO KK
Priority to JP2001076966A priority Critical patent/JP2002273711A/en
Publication of JP2002273711A publication Critical patent/JP2002273711A/en
Pending legal-status Critical Current

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  • Laminated Bodies (AREA)
  • Dry Formation Of Fiberboard And The Like (AREA)

Abstract

PROBLEM TO BE SOLVED: To develop a method for manufacturing a timber chip board capable of integrally forming the timber chip board in precise steps by utilizing characteristics of timber chips and a phenol resin. SOLUTION: The method for manufacturing the timber chip board comprises the steps of drying the timber chips to a water content of 4 wt.% or less, dipping the chips in a phenol resin tank, impregnating the chips with the phenol resin to 20 to 40 wt.% or more, and covering both or one of the front and rear surfaces of the filler with a front surface material of a woody material having excellent permeability of the phenol resin. The method further comprises (a) a step of expediting temperature raising under a pressure by a hot press, (b) a step of stopping the temperature raising, holding the temperature at about 100 deg.C, bringing about softening of the phenol resin, expediting impregnation of an outside surface material with the resin and bringing about a composition change by compressing at the timber chips, and (c) a step of restarting temperature raising to expedite a curing reaction by molecular crosslinking of the resin to obtain the integrated timber chip board.

Description

【発明の詳細な説明】DETAILED DESCRIPTION OF THE INVENTION

【0001】[0001]

【発明の属する技術分野】本発明は、木材チップをフェ
ノール樹脂で結合させたボードの製造方法に関し、更に
詳細には、木材チップとフェノール樹脂との特性を活用
して、表裏面の板材と芯材としての木材チップとを簡潔
な工程で一体的に成形できる木材チップボードの製造方
法に関する。
BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a method for manufacturing a board in which wood chips are bonded with a phenol resin, and more particularly, to a board material on the front and back surfaces and a core using the characteristics of the wood chips and the phenol resin. The present invention relates to a method for manufacturing a wood chip board that can be integrally formed with a wood chip as a material in a simple process.

【0002】[0002]

【従来の技術】今日、建築廃材、土木廃材等から多くの
廃材が排出され、それを焼却するだけでは、資源保護の
観点から問題のあるものと指摘されている。そこで、本
発明者らは、廃材をチップ状に砕いて、それをフェノー
ル樹脂で結合させてボードとして再利用しようとする研
究に長年努めているが、しかし、木材チップがそのまま
剥き出しであると、商品として付加価値が低いという欠
点を残していた。そこで、木材チップの表裏面に化粧や
デザインを施したボードを開発しようと試みたが、製造
方法を複雑化すると商品価格が高価となるという矛盾に
逢着した。
2. Description of the Related Art At present, it is pointed out that a large amount of waste materials are discharged from construction waste materials, civil engineering waste materials, and the like. Therefore, the present inventors have been working for many years to research waste materials that are crushed into chips and bonded with phenol resin to reuse them as boards, but when wood chips are exposed as they are, It had the disadvantage of low added value as a product. Therefore, they attempted to develop a board with decorative and designed designs on the front and back of the wood chip, but came across the contradiction that the complication of the manufacturing method would increase the product price.

【0003】[0003]

【発明が解決しようとする課題】そこで本発明は、木材
チップとフェノール樹脂の相互の特性を活用して、簡潔
な工程で木材チップボードを一体的に成形できる木材チ
ップボードの製造方法の開発を狙いとしたものである。
SUMMARY OF THE INVENTION Accordingly, an object of the present invention is to develop a method for manufacturing a wood chip board which can integrally form a wood chip board in a simple process by utilizing the mutual characteristics of wood chips and phenol resin. That is what I aimed for.

【0004】[0004]

【課題を解決するための手段】本発明木材チップボード
の製造方法は、木材チップを含水率4wt%以下に乾燥
し、該木材チップをフェノール樹脂のメタノール溶液槽
内に浸漬してフェノール樹脂が20〜40wt%となる
よう含浸させ、該メタノールを蒸散させて表面をベト付
きのないサラサラ状態として型内に充填し、該充填物の
表裏面の双方又はいずれか一方をフェノール樹脂の浸透
性に優れた木質素材の表面材で覆う。熱プレス機にて、
(a)加圧下で温度上昇を促す工程と、(b)昇温を停
止して100℃付近に温度を保ち、フェノール樹脂の軟
化を惹起し、外側表面材にフェノール樹脂の浸透を促す
と共に、木材チップに圧縮による組織変化をもたらす工
程と、(c)再度昇温を開始して、フェノール樹脂の分
子架橋で硬化反応を促す工程とを経て、一体化された木
材チップボードを得ることを特徴として構成される。
According to the method for producing a wood chip board of the present invention, the wood chip is dried to a water content of 4 wt% or less, and the wood chip is immersed in a phenol resin methanol solution tank to reduce the phenol resin content to 20%.メ タ ノ ー ル 40 wt%, the methanol is evaporated, and the surface is filled into a mold in a smooth state without stickiness, and both or one of the front and back surfaces of the filling is excellent in phenol resin permeability. Cover with wood material. With a heat press machine,
(A) a step of increasing the temperature under pressure, and (b) stopping the temperature increase and maintaining the temperature at around 100 ° C. to cause the phenol resin to soften and to promote the penetration of the phenol resin into the outer surface material. It is characterized in that an integrated wood chip board is obtained through a step of causing a change in the structure of the wood chip by compression and a step (c) of starting the heating again and promoting a curing reaction by molecular crosslinking of the phenol resin. Is configured as

【0005】[0005]

【発明の実施の形態】先ず、建築現場、土木現場等から
排出される建築廃材、土木廃材等を破砕機で直径約6m
m程度のチップ状に粉砕する。該廃材には、建築材等か
ら排出される杉材、ラワン材、バツメラ等の一般的廃材
を広く対象とする。そして、該廃材は粉砕に当たって、
含水率を約4wt%以下に乾燥させるが、これは、4w
t%以下とした場合木材チップ1の有する孔隙がスポン
ジ様の吸収効果を発揮すると共に、外から一定の圧力が
掛かった場合に液を吐き出す弾辱性を保つからである。
BEST MODE FOR CARRYING OUT THE INVENTION First, waste construction materials and civil engineering materials discharged from construction sites, civil engineering sites, etc. are crushed by a crusher to a diameter of about 6 m.
It is pulverized into chips of about m. As the waste material, general waste materials such as cedar wood, lauan wood, and batsumera discharged from building materials and the like are widely applied. And, when the waste material is crushed,
The water content is dried to about 4 wt% or less.
When the content is set to t% or less, the pores of the wood chip 1 exhibit a sponge-like absorption effect and maintain the resilience of discharging the liquid when a certain pressure is applied from the outside.

【0006】次いで、フェノール樹脂をメタノール等の
溶剤で溶かした溶液の槽を設け、該フェノール樹脂に
は、フェノールをホルムアルデヒドを塩基性触媒の下で
加熱反応させて得たレゾール型のものを用いる。フェノ
ール樹脂は、粘度が高いので、メタノール溶剤で希釈し
て含浸の可能な粘度とする為であり、例えば、樹脂:メ
タノールを7:3程度の割合で混合する。
Next, a tank for a solution of a phenol resin dissolved in a solvent such as methanol is provided, and a resol type phenol resin obtained by heating and reacting phenol with formaldehyde under a basic catalyst is used. Since the phenol resin has a high viscosity, the phenol resin is diluted with a methanol solvent so as to have a viscosity that allows impregnation. For example, resin: methanol is mixed at a ratio of about 7: 3.

【0007】上記フェノールの槽に木材チップ1を含浸
させ、これを適当時間含浸状態に保つ。 ここで適当時
間とは、必要量のフェノール樹脂が含浸されるに適当な
時間をいい、その必要量とは後工程でメタノールを蒸散
させたときに、フェノール樹脂分が木材に対して20〜
40wt%残存する量をいう。含浸割合を約20〜40
wt%としたのは、約40wt%を越えると、フェノー
ル樹脂としての強度は増すが、ヒビ割れ等が入りやす
く、且つ、経済的に高価となり、一方、20wt%以下
となると、一応固まっても、ボードとしての物理的強度
が不足するからである。
[0007] The wood chip 1 is impregnated in the phenol tank, and the impregnated state is maintained for an appropriate time. Here, the appropriate time means an appropriate time for impregnating a required amount of phenol resin, and the necessary amount means that when methanol is evaporated in a later step, the phenol resin content is 20 to
It refers to the amount remaining at 40 wt%. Impregnation ratio is about 20-40
When the content is more than about 40% by weight, the strength as a phenol resin increases when the content exceeds about 40% by weight. This is because the physical strength of the board is insufficient.

【0008】次に、含浸した木材チップ1を取り出し、
メタノールを蒸散させる。すると、モノマー又はオリゴ
マー状態にあるフェノール樹脂は、表面が固化し、ベト
ベト感のないサラサラした状態となるので取扱いが容易
となり、これを敷き詰め、型内に充填する。
Next, the impregnated wood chips 1 are taken out,
The methanol evaporates. Then, the phenol resin in a monomer or oligomer state has a solidified surface and is in a smooth state without a sticky feeling, so that it is easy to handle, and the phenol resin is spread and filled in a mold.

【0009】一方、表面材2としてフェノール樹脂の浸
透性に優れた木質素材を用い、これを上記充填後の中芯
材の表裏面の双方又はいずれか一方に重ね合わせて組み
合わる。ここでフェノール樹脂の浸透性に優れた木質素
材とは、組織内に一定の通孔や空隙を備えたフェノール
樹脂を良好に浸透させる木質材をいい、例えば、合板や
カンナ屑等を指す。カンナ屑は、木材を鉋で切削加工す
る過程で生じる屑材で、厚さ0.1〜0.3mm程度の
薄皮状の形態で、表面に木目模様が浮き彫りに表出され
ている。該表面材2と木材チップ1とを組み合わせたも
のを、熱プレス機により、以下の工程により加圧する。 (a)先ず、60分程度の間は、加圧下で熱を徐々に上
昇させる。すると、フェノールとホルマリンとの間で架
橋反応が開始されるが、比較的低温のこの間は、わずか
の反応にとどまる。
On the other hand, a wooden material excellent in permeability of a phenol resin is used as the surface material 2, and the wooden material is overlapped on both or one of the front and rear surfaces of the core material after filling. Here, the woody material having excellent phenolic resin permeability refers to a woody material having a certain amount of holes and voids in a tissue to satisfactorily penetrate the phenolic resin, such as plywood and canned waste. Canna debris is a debris material generated in the process of cutting wood with a plane, and is a thin skin having a thickness of about 0.1 to 0.3 mm, and has a wood grain pattern on the surface. The combination of the surface material 2 and the wood chip 1 is pressed by a hot press machine in the following steps. (A) First, heat is gradually increased under pressure for about 60 minutes. Then, a cross-linking reaction starts between phenol and formalin, but during the relatively low temperature, only a slight reaction occurs.

【0010】(b)次いで、温度が100℃付近に至っ
た時点で、温度上昇を停止させ、約30分の間温度を1
00℃付近に保つ。すると、先ず、反応中間体としての
フェノール樹脂に一種の軟化が惹起され、チップ表面に
浸透していたフェノール樹脂が液状化し、加えられた圧
力に押されて外側、つまり表面材2側へと徐々に浸透し
ていく。即ち、軟化した樹脂に圧力が加えられると、膨
出が起こり、それが空隙性にとんだ表面材2に吸収され
る形態で浸透し、表面材2の表側に達する。
(B) Then, when the temperature reaches about 100 ° C., the temperature rise is stopped, and the temperature is reduced to 1 for about 30 minutes.
Keep around 00 ° C. Then, first, a kind of softening is induced in the phenol resin as a reaction intermediate, and the phenol resin that has permeated the chip surface is liquefied, and is gradually pushed outward by the applied pressure, that is, toward the surface material 2 side. Infiltrate That is, when pressure is applied to the softened resin, swelling occurs, and the swelling penetrates in a form that is absorbed by the voided surface material 2 and reaches the front side of the surface material 2.

【0011】更に、100℃付近に温度を維持すると、
チップ内部に浸透していたフェノール樹脂にも液状化が
及び、圧力で外へと浸みだしが起こり、このとき急激に
チップ嵩容積が減少し、恰もスポンジが縮むかのように
全体が圧縮される現象が起こる。即ち、樹脂の軟化が最
高に達すると、チップ相互を固定させていた固化樹脂の
抗力が失われ、外部圧力によって絡み合いが潰され、チ
ップ組成全体が弾辱体のように縮む現象が惹起される。
その結果、チップ相互の噛み合いが密となり、緻密な組
成構造に変化する。
Further, when the temperature is maintained at around 100 ° C.,
Liquefaction also spreads into the phenolic resin that had penetrated inside the chip, causing leaching to the outside due to pressure, and at this time the chip bulk volume sharply decreases, and the whole is compressed as if the sponge shrinks A phenomenon occurs. That is, when the softening of the resin reaches the maximum, the drag of the solidified resin that fixed the chips is lost, the entanglement is crushed by external pressure, and a phenomenon that the entire chip composition shrinks like an insult body is caused. .
As a result, the engagement between the chips becomes dense, and the composition changes to a dense composition structure.

【0012】このとき、100℃付近に約30分程度保
つことが重要で、もし、この工程を経ることなく、直線
状に温度上昇を続けると、即座に硬化反応が開始され、
ボード側への樹脂の浸透や、圧縮を伴う組織変化は困難
となる。
At this time, it is important to keep the temperature at about 100 ° C. for about 30 minutes. If the temperature is increased linearly without going through this step, the curing reaction starts immediately,
It is difficult to permeate the resin into the board side or change the structure due to compression.

【0013】(c)上記、表面材への浸透及びチップ組
成の変化がなされた後、加圧力を強めつつ再度加熱を始
める。すると、120〜140℃付近でフェノール樹脂
の硬化反応が開始され、分子間に架橋反応が進行し、上
記軟化した樹脂間に硬化反応が進む。同時に加圧による
押圧力で木材チップ1同志が食い込み、固い組織が形成
される。即ち、浸透したフェノール樹脂が硬化して結合
力が生まれると共に、一定強度を備えたチップが互いに
交絡し合って食い込み効果を生み、二重の意味で強い結
合力が得られる。
(C) After the permeation into the surface material and the change in the chip composition are performed, heating is started again while increasing the pressing force. Then, a curing reaction of the phenol resin is started at around 120 to 140 ° C., a crosslinking reaction proceeds between molecules, and a curing reaction proceeds between the softened resins. At the same time, the wood chips 1 bite each other by the pressing force of the pressurization, and a hard tissue is formed. That is, the penetrated phenol resin is hardened to generate a bonding force, and chips having a certain strength are entangled with each other to produce a biting effect, so that a strong bonding force is obtained in a double sense.

【0014】その結果、外側合板に浸透したフェノール
樹脂3と芯材としての木材チップ1に含浸した樹脂とが
一連に連続した形態で硬化反応が進んで一体化が促さ
れ、且つ、該芯材としてのチップ組成が緻密な構造に変
換された形態で固化される。従って、一連の工程で木材
チップ1と外側表面材2とが簡潔な工程で一体成形され
ると共に、全体が緻密で、物理的強度に優れた木材チッ
プボードが得られる。
As a result, the phenolic resin 3 permeated into the outer plywood and the resin impregnated in the wood chip 1 as the core material proceed in a continuous series of curing reactions to promote integration and promote the integration of the core material. Is solidified in a form converted into a dense structure. Therefore, the wood chip 1 and the outer surface material 2 are integrally formed in a simple process in a series of steps, and the wood chip board which is dense as a whole and has excellent physical strength can be obtained.

【0015】[0015]

【実施例1】<合板>木材を約6mm程度のチップ状に
粉砕し、該チップ状の木材を乾燥させて、含浸率を4w
t%とした。この乾燥させた木材チップにフェノール樹
脂を含浸させて、再度乾燥し、フェノール樹脂の含浸割
合を25wt%とした。該フェノール樹脂を含浸させた
木材チップを厚み2.5mmの合板で挟み込むようにし
て、熱プレス機内にセットした。熱プレスの温度を上昇
させながら、加圧し、約60分で100℃付近にまで昇
温させ、その後100℃の温度付近で昇温を停止し、3
0分間その温度を維持し、ボード側への樹脂の浸透と、
圧縮を伴う組織変化が惹起された。その後、加熱を開始
し、30分で135℃程度にまで昇温し、硬化反応を促
した。プレス終了後、取り出して、自然冷却し、木材チ
ップと合板とが一体化されたボードを得た。
Example 1 <Plywood> Wood was crushed into chips of about 6 mm, and the chips were dried to obtain an impregnation rate of 4 watts.
t%. The dried wood chips were impregnated with a phenol resin, and dried again to make the impregnation ratio of the phenol resin 25 wt%. The wood chip impregnated with the phenolic resin was set in a hot press so as to be sandwiched between plywood having a thickness of 2.5 mm. While increasing the temperature of the hot press, pressurization was performed, and the temperature was increased to around 100 ° C. in about 60 minutes.
Maintain the temperature for 0 minutes, penetrate the resin into the board side,
A tissue change with compression was induced. Thereafter, heating was started, and the temperature was raised to about 135 ° C. in 30 minutes to promote a curing reaction. After the pressing was completed, the board was taken out and naturally cooled to obtain a board in which the wood chips and the plywood were integrated.

【0016】[0016]

【実施例2】<カンナ屑>実施例1と同様に、木材を約
6mm程度のチップ状に粉砕し、該チップ状の木材を乾
燥させて、含浸率を4wt%とし、木材チップにフェノ
ール樹脂を含浸させて、再度乾燥し、フェノール樹脂の
含浸割合を25wt%とした。熱プレス機の下面にカン
ナ屑を10〜15層くらいになる厚みで敷き、その上に
フェノールを含浸させ木材チップを7mm程度に載せ、
さらにその上にカンナ屑を上記と同様10〜15層程度
に敷設した。実施例1と同様に熱プレスの温度を上昇さ
せながら、加圧し、約60分で100℃付近にまで昇温
させ、その後100℃の温度付近で昇温を停止し、30
分間その温度を維持し、ボード側への樹脂の浸透と、圧
縮を伴う組織変化が惹起された。その後、加熱を開始
し、30分で135℃程度にまで昇温し、硬化反応を促
した。プレス終了後、取り出して、自然冷却し、木材チ
ップとカンナ屑とが一体化されたボードを得た。カンナ
屑の表面には木目模様が浮き彫りに表出され、且つ、数
十枚がランダムに重ねられるので、独特のデザイン性が
得られた。
[Example 2] <Canna debris> In the same manner as in Example 1, the wood was pulverized into chips of about 6 mm, the chip-shaped wood was dried to an impregnation rate of 4 wt%, and the wood chips were phenol resin. And then dried again to make the phenol resin impregnation ratio 25 wt%. On the lower surface of the heat press machine, lay out 10 to 15 layers of canna chips, impregnate phenol on it and place wood chips on about 7 mm,
Further, canna scraps were laid thereon in about 10 to 15 layers in the same manner as described above. While increasing the temperature of the hot press in the same manner as in Example 1, pressurization was performed, and the temperature was increased to around 100 ° C. in about 60 minutes.
The temperature was maintained for a minute, causing the resin to penetrate the board side and cause a tissue change with compression. Thereafter, heating was started, and the temperature was raised to about 135 ° C. in 30 minutes to promote a curing reaction. After the press was completed, the board was taken out and naturally cooled to obtain a board in which the wood chips and the canned waste were integrated. Wood grain patterns are embossed on the surface of the canna waste and dozens of them are randomly stacked, giving a unique design.

【0017】[0017]

【発明の効果】以上の構成に基づく本発明は、以下の如
き優れた効果を奏する。
The present invention based on the above configuration has the following excellent effects.

【0018】木質素材のフェノール樹脂吸収性とフェノ
ール樹脂の軟化性、浸透性、硬化性等を活用して、簡潔
な工程で、表面材と木材チップとを一体的に成形するこ
とができ、表面の装飾性、デザイン性に富んだ付加価値
の高いボードが、経済的に低廉に得られる。
The surface material and the wood chip can be integrally formed in a simple process by utilizing the phenolic resin absorbency of the woody material and the softening, penetrating, and hardening properties of the phenolic resin. A high value-added board rich in decorativeness and design can be obtained economically at low cost.

【0019】木材チップボードの組成が緻密なものに変
換されるので、製品として、耐屈曲性、耐衝撃性、引張
強度等の物理的強度に優れ、且つ、家具、建築素材等と
して取扱いの便宜性に優れた製品が得られる。
Since the composition of the wood chipboard is converted into a dense one, the product has excellent physical strength such as bending resistance, impact resistance and tensile strength, and is convenient to handle as furniture, building material, etc. A product with excellent properties can be obtained.

【図面の簡単な説明】[Brief description of the drawings]

【図1】本発明により得られた木材チップボードの一部
切欠拡大断面図。
FIG. 1 is a partially cutaway enlarged sectional view of a wood chip board obtained according to the present invention.

【図2】本発明製造過程を模式的に示す模式的断面図
で、(A)が圧縮前、(B)が圧縮後を示す。
2A and 2B are schematic cross-sectional views schematically showing the manufacturing process of the present invention, wherein FIG. 2A shows a state before compression and FIG. 2B shows a state after compression.

【図3】木材チップからオガ屑とした表面材へのフェノ
ール樹脂が浸透する状態を模式的に描いた断面図。
FIG. 3 is a cross-sectional view schematically illustrating a state in which a phenol resin penetrates from a wood chip to a surface material that has been turned into sawdust.

【符号の説明】[Explanation of symbols]

1 木材チップ 2 表面材 3 フェノール樹脂 1 Wood chip 2 Surface material 3 Phenol resin

───────────────────────────────────────────────────── フロントページの続き Fターム(参考) 2B260 BA01 BA05 BA18 CB01 CB04 DA04 DC05 EB01 EB02 EB05 EB06 EB12 EB21 EB42 4F100 AK33A AK33B AK33C AP01A AP01B AP01C BA02 BA03 BA10A BA10B BA10C BA13 DE05B EC052 EH311 EJ082 EJ202 EJ422 EJ82A EJ82C EJ821 GB07 GB81 JK01 JK04 JK10  ────────────────────────────────────────────────── ─── Continued on the front page F-term (reference) 2B260 BA01 BA05 BA18 CB01 CB04 DA04 DC05 EB01 EB02 EB05 EB06 EB12 EB21 EB42 4F100 AK33A AK33B AK33C AP01A AP01B AP01C BA02 BA03 BA10A BA10B BA10C EB12 EJ2 EB02 EJ2 GB81 JK01 JK04 JK10

Claims (1)

【特許請求の範囲】[Claims] 【請求項1】 木材チップを含水率4wt%以下に乾燥
し、 該木材チップをフェノール樹脂のメタノール溶液槽内に
浸漬してフェノール樹脂が20〜40wt%となるよう
含浸させ、 該メタノールを蒸散させて表面をベト付きのないサラサ
ラ状態として型内に充填し、 該充填物の表裏面の双方又はいずれか一方をフェノール
樹脂の浸透性に優れた木質素材の表面材で覆い、 熱プレス機にて、 (a)加圧下で温度上昇を促す工程と、 (b)昇温を停止して100℃付近に温度を保ち、フェ
ノール樹脂の軟化を惹起し、外側表面材にフェノール樹
脂の浸透を促すと共に、木材チップに圧縮による組織変
化をもたらす工程と、 (c)再度昇温を開始して、フェノール樹脂の分子架橋
で硬化反応を促す工程とを経て、 一体化された木材チップボードを得ることを特徴とする
製造方法。
1. A wood chip is dried to a water content of 4 wt% or less, and the wood chip is immersed in a methanol solution tank of phenol resin to impregnate the phenol resin to 20 to 40 wt%, and the methanol is evaporated. The surface is filled in a mold in a smooth state without stickiness, and both or one of the front and back surfaces of the filling is covered with a surface material made of a wooden material having excellent phenol resin permeability, and then heated with a hot press. (A) a step of increasing the temperature under pressure; and (b) stopping the temperature increase and maintaining the temperature at around 100 ° C. to cause the phenol resin to soften and to promote the penetration of the phenol resin into the outer surface material. , A process of causing a change in the structure of the wood chip by compressing the wood chip, and (c) a process of restarting the temperature rise and promoting a curing reaction by molecular crosslinking of the phenol resin to form an integrated wood chip board. Manufacturing method characterized by obtaining.
JP2001076966A 2001-03-16 2001-03-16 Method for manufacturing timber chip board Pending JP2002273711A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP2001076966A JP2002273711A (en) 2001-03-16 2001-03-16 Method for manufacturing timber chip board

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2001076966A JP2002273711A (en) 2001-03-16 2001-03-16 Method for manufacturing timber chip board

Publications (1)

Publication Number Publication Date
JP2002273711A true JP2002273711A (en) 2002-09-25

Family

ID=18933801

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2001076966A Pending JP2002273711A (en) 2001-03-16 2001-03-16 Method for manufacturing timber chip board

Country Status (1)

Country Link
JP (1) JP2002273711A (en)

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR100886838B1 (en) 2008-07-03 2009-03-04 (주)간삼파트너스 종합건축사사무소 Woodchips and structural materials using prepreg of powder and chips of woods
JP2010234716A (en) * 2009-03-31 2010-10-21 Victor Co Of Japan Ltd Wooden molded article and manufacturing method therefor
CN101670604B (en) * 2008-09-08 2011-09-07 富朗投资管理集团(香港)有限公司 Processing technology for manufacturing board by utilizing crop straws
CN101670608B (en) * 2008-09-08 2011-11-16 富朗投资管理集团(香港)有限公司 Hot-pressing technology for manufacturing board by utilizing crop straws

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR100886838B1 (en) 2008-07-03 2009-03-04 (주)간삼파트너스 종합건축사사무소 Woodchips and structural materials using prepreg of powder and chips of woods
CN101670604B (en) * 2008-09-08 2011-09-07 富朗投资管理集团(香港)有限公司 Processing technology for manufacturing board by utilizing crop straws
CN101670608B (en) * 2008-09-08 2011-11-16 富朗投资管理集团(香港)有限公司 Hot-pressing technology for manufacturing board by utilizing crop straws
JP2010234716A (en) * 2009-03-31 2010-10-21 Victor Co Of Japan Ltd Wooden molded article and manufacturing method therefor

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