JP2002270973A5 - - Google Patents
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- Publication number
- JP2002270973A5 JP2002270973A5 JP2001067005A JP2001067005A JP2002270973A5 JP 2002270973 A5 JP2002270973 A5 JP 2002270973A5 JP 2001067005 A JP2001067005 A JP 2001067005A JP 2001067005 A JP2001067005 A JP 2001067005A JP 2002270973 A5 JP2002270973 A5 JP 2002270973A5
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- JP
- Japan
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Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2001067005A JP4403661B2 (en) | 2001-03-09 | 2001-03-09 | Mounting structure of component using heat sink and manufacturing method thereof |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2001067005A JP4403661B2 (en) | 2001-03-09 | 2001-03-09 | Mounting structure of component using heat sink and manufacturing method thereof |
Publications (3)
Publication Number | Publication Date |
---|---|
JP2002270973A JP2002270973A (en) | 2002-09-20 |
JP2002270973A5 true JP2002270973A5 (en) | 2009-04-09 |
JP4403661B2 JP4403661B2 (en) | 2010-01-27 |
Family
ID=18925421
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2001067005A Expired - Fee Related JP4403661B2 (en) | 2001-03-09 | 2001-03-09 | Mounting structure of component using heat sink and manufacturing method thereof |
Country Status (1)
Country | Link |
---|---|
JP (1) | JP4403661B2 (en) |
Families Citing this family (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2003046034A (en) * | 2001-07-31 | 2003-02-14 | Nec Kagobutsu Device Kk | Resin-sealed semiconductor device |
JP4858428B2 (en) * | 2007-12-25 | 2012-01-18 | 富士電機株式会社 | Cooling method for mounted parts |
JP4934166B2 (en) | 2009-05-25 | 2012-05-16 | 住友電気工業株式会社 | Electrode adhesive connection structure, electronic device and assembly method thereof |
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2001
- 2001-03-09 JP JP2001067005A patent/JP4403661B2/en not_active Expired - Fee Related