JP2002270973A5 - - Google Patents

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Publication number
JP2002270973A5
JP2002270973A5 JP2001067005A JP2001067005A JP2002270973A5 JP 2002270973 A5 JP2002270973 A5 JP 2002270973A5 JP 2001067005 A JP2001067005 A JP 2001067005A JP 2001067005 A JP2001067005 A JP 2001067005A JP 2002270973 A5 JP2002270973 A5 JP 2002270973A5
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JP
Japan
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP2001067005A
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Japanese (ja)
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JP2002270973A (en
JP4403661B2 (en
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Publication date
Application filed filed Critical
Priority to JP2001067005A priority Critical patent/JP4403661B2/en
Priority claimed from JP2001067005A external-priority patent/JP4403661B2/en
Publication of JP2002270973A publication Critical patent/JP2002270973A/en
Publication of JP2002270973A5 publication Critical patent/JP2002270973A5/ja
Application granted granted Critical
Publication of JP4403661B2 publication Critical patent/JP4403661B2/en
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

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JP2001067005A 2001-03-09 2001-03-09 Mounting structure of component using heat sink and manufacturing method thereof Expired - Fee Related JP4403661B2 (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP2001067005A JP4403661B2 (en) 2001-03-09 2001-03-09 Mounting structure of component using heat sink and manufacturing method thereof

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2001067005A JP4403661B2 (en) 2001-03-09 2001-03-09 Mounting structure of component using heat sink and manufacturing method thereof

Publications (3)

Publication Number Publication Date
JP2002270973A JP2002270973A (en) 2002-09-20
JP2002270973A5 true JP2002270973A5 (en) 2009-04-09
JP4403661B2 JP4403661B2 (en) 2010-01-27

Family

ID=18925421

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2001067005A Expired - Fee Related JP4403661B2 (en) 2001-03-09 2001-03-09 Mounting structure of component using heat sink and manufacturing method thereof

Country Status (1)

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JP (1) JP4403661B2 (en)

Families Citing this family (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2003046034A (en) * 2001-07-31 2003-02-14 Nec Kagobutsu Device Kk Resin-sealed semiconductor device
JP4858428B2 (en) * 2007-12-25 2012-01-18 富士電機株式会社 Cooling method for mounted parts
JP4934166B2 (en) 2009-05-25 2012-05-16 住友電気工業株式会社 Electrode adhesive connection structure, electronic device and assembly method thereof

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