JP2002270485A - Processing apparatus and temperature control system - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide a processing apparatus that is simplified in a structure and improved in operability and management by reducing the number of pipes and the number of wirings. SOLUTION: A resist applying and developing system 100 of the processing apparatus has developing units (DEV) 24a to 24c, a cooling unit (COL) for cooling a substrate G subjected to a developing process after a heat treatment, and temperature control heads 53a to 53c for circulating temperature control water between the developing units (DEV) 24a to 24c and the cooling unit (COL) and between them and a chiller 52. The independent control of the temperature control heads 53a to 53c and the chiller 52 can reduce the number of wiring for controlling and the number of pipes for flowing the temperature control water and thus improve assembling ability and controllability.

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

The present invention relates to a liquid crystal display (LCD) glass substrate or the like which is subjected to a predetermined liquid treatment such as a cleaning treatment, a resist coating treatment or a development treatment, and the liquid treatment is performed. The present invention relates to a processing apparatus for performing a predetermined thermal processing on a substrate after the processing and a temperature control system used for the processing apparatus.

[Prior art]

For example, in the manufacture of a liquid crystal display (LCD), a photoresist liquid is applied to a glass rectangular substrate to form a resist film, the resist film is exposed in a predetermined circuit pattern, and this is developed. That is, a predetermined circuit pattern is formed by a so-called photolithography technique.

The formation of such a circuit pattern is performed using a resist coating / developing processing system in which a plurality of processing units are integrated. In such a system, first, the surface of the substrate is modified by irradiating ultraviolet rays as necessary, and then the cleaning unit performs a cleaning process such as brush cleaning and ultrasonic water cleaning. Thereafter, the substrate is subjected to a hydrophobic treatment (HMDS treatment) in an adhesion treatment unit in order to enhance the stability of the resist. Since this hydrophobizing treatment is a heating treatment, before the resist is applied to the substrate by the resist applying unit,
The substrate is once cooled to a predetermined temperature in the cooling unit. A resist film is applied to the cooled substrate, prebaked in a heating unit, cooled to a predetermined temperature, and transferred to an exposure apparatus. The substrate on which the predetermined circuit pattern is exposed in the exposure apparatus is subjected to a post-baking process in a heating unit after being developed in a developing unit, and then cooled to a predetermined temperature. Thus, a predetermined circuit pattern is formed on the substrate.

As described above, after a predetermined liquid treatment such as a cleaning process, a resist coating process, and a development process, the substrate is subjected to a predetermined heating process and a cooling process after the heating process, and then transported to a unit for performing the next process. And processed. here,
For example, as a cooling unit that cools the substrate after the heat treatment to a predetermined temperature, a water cooling jacket structure that circulates cooling water adjusted to a predetermined temperature inside the cooling plate on which the substrate is mounted, so that the cooling plate A structure having a structure for maintaining the temperature at a predetermined temperature is used. Further, it is preferable that various processing liquids used for the resist coating processing or the like are supplied to the substrate while being maintained at a predetermined temperature. For this reason, for example, a discharge head or the like that discharges the processing liquid has a jacket structure. Water that is adjusted to a predetermined temperature (hereinafter referred to as “temperature-regulated water”) is supplied to the discharge head and circulated to maintain the temperature of the processing liquid at the predetermined temperature.

FIG. 4 shows an example of the configuration of a temperature control system for adjusting the temperature control water supplied to such a cooling unit or a discharge head. This temperature control system 80 includes a chiller (primary temperature control unit) 81 for adjusting the temperature of the circulating water to a predetermined low temperature and a plurality of water chillers for adjusting the water supplied to the cooling plate 83 and the discharge head 84 to a predetermined temperature. And a temperature control head (temperature control circulating device; secondary temperature control unit) 82.

In the chiller 81, predetermined low-temperature water (primary temperature water) is prepared, and in the temperature control head 82, temperature-control water (second temperature water) having a higher temperature than the primary temperature water is prepared. Adjusted. More specifically, the chiller 81 sends a predetermined amount of the primary temperature control water to the temperature control head 82, and circulates the temperature control water so that the same amount of the secondary temperature control water is collected from the temperature control head 82. In practice, the primary temperature control water is prepared by cooling the secondary temperature control water returned from the temperature control head 82. The temperature control head 82 circulates a predetermined amount of secondary temperature control water with the cooling plate 83 and the like, and the secondary temperature control water is supplied from the chiller 81 and has a low temperature. It is prepared by mixing water and the warmed secondary temperature adjusted water returned from the cooling plate 83 and the like, and heating the mixed water using a built-in heater or the like. Here, the temperature control and the flow rate control of the primary temperature control water and the secondary temperature control water in the chiller 81 and the temperature control head 82 have been performed by the control device 85 provided in the chiller 81. Further, a power supply 86 provided in the chiller 81 was used as an operation power supply for the temperature control head 82.

[0007]

However, when a plurality of temperature control heads 82 are connected to an integrated chiller 81 as in a temperature control system 80, the number of pipes for circulating the primary temperature control water and the temperature are controlled. Number of wires for controlling the tuning head 82,
There is a problem in that the number of wirings of the power cable increases, the structure of the device becomes complicated, and a large amount of piping space is required. In this case, workability during assembly and maintenance of the device is deteriorated, and there is a possibility that an accident such as incorrect connection of wiring may occur. Further, the temperature control head 82
May have different structures and specifications, and when such a plurality of temperature control heads 82 are controlled by the control device 85 provided in the chiller 81, the number of management steps of the control device 85 increases, and There was a problem that could lead to management mistakes.

[0008] The present invention has been made in view of such problems of the prior art, and has as its object to provide a processing apparatus having a simplified structure by reducing the number of pipes and wirings. . Another object of the present invention is to provide a processing apparatus in which operability and manageability are improved by reviewing a control system. Further, another object of the present invention is to provide a temperature control system applied to these processing apparatuses.

[0009]

That is, the present invention provides the first aspect.
According to the present invention, there is provided a processing apparatus including a plurality of processing units, comprising a temperature control system for supplying a temperature control medium to the plurality of processing units and performing a predetermined temperature control on each processing unit. A first temperature adjustment circulating device that adjusts a temperature adjustment medium to be sent to the plurality of processing units to a predetermined temperature, and circulates a predetermined amount of the temperature adjustment medium between the plurality of processing units; A second temperature control circulating device that adjusts a temperature control medium to be sent to the first temperature control circulating device to a constant temperature and circulates a predetermined amount of the temperature control medium with the first temperature control circulating device; A first control device for controlling the temperature and flow rate of the temperature control medium in the first temperature control circulating device; and a temperature control and flow rate control for the temperature control medium in the second temperature control circulating device. The second control device is provided separately from the first control device.
And a control device.

According to a second aspect of the present invention, there is provided a processing apparatus for performing a liquid treatment on a workpiece and a thermal treatment after the liquid processing, and a liquid processing unit for performing a predetermined liquid processing on the workpiece. A thermal processing unit for performing a predetermined thermal process on the processing object by performing heat exchange between the processing object and the thermal processing medium, and a predetermined amount of temperature between the thermal processing unit and the thermal processing unit. A temperature control medium circulating device for circulating the temperature control medium, wherein the temperature control medium circulating device adjusts the temperature control medium to be sent to the thermal processing unit to a predetermined temperature, and A first temperature control circulating device that circulates a predetermined amount of temperature control medium between the first temperature control circulating device and a first temperature control circulating device that controls a temperature control medium to be sent to the first temperature control circulating device to a constant temperature; A second temperature control circulating device for circulating a predetermined amount of temperature control medium between
A first control device for controlling the temperature and flow rate of the temperature control medium in the temperature control circulating device, and a first control device for controlling the temperature control and flow rate of the temperature control medium in the second temperature control circulating device And a second control device provided separately from the second control device.

According to a third aspect of the present invention, there is provided a processing apparatus for performing a predetermined liquid processing on an object, a liquid processing unit for performing a predetermined liquid processing on the object, and the liquid processing unit. A predetermined amount of temperature control between the processing liquid temperature control device and the processing liquid temperature control device that maintains the processing liquid at a predetermined temperature by performing heat exchange with the processing liquid used in the process using a temperature control medium. A temperature control medium circulating device for circulating a medium, wherein the temperature control medium circulating device adjusts the temperature control medium to be sent to the processing liquid temperature control device to a predetermined temperature, and the processing liquid temperature control device and A first temperature control circulating device that circulates a predetermined amount of temperature control medium between the first temperature control circulating device and the first temperature control circulating device that controls the temperature control medium to be sent to the first temperature control circulating device to a constant temperature; A second temperature control circulating device for circulating a predetermined amount of temperature control medium between the first temperature control circulating device and the first temperature control circulating device; The first control device for performing temperature control and flow rate control of the temperature control medium in the above and the first control device for performing temperature control and flow rate control of the temperature control medium in the second temperature control circulating device are separate bodies. And a second control device provided.

According to a fourth aspect of the present invention, there is provided a processing apparatus for performing a liquid treatment and a thermal treatment after the liquid treatment on an object to be processed, wherein a predetermined temperature is obtained by performing heat exchange with a temperature control medium. A liquid processing unit for performing a predetermined liquid processing on the object to be processed using the processing liquid adjusted to a predetermined temperature, a heating unit for performing a predetermined heating process on the object to be processed after the liquid processing, and a processing unit after the heat processing. A cooling unit that cools the object to be processed by performing heat exchange with the body by using a temperature control medium, and a temperature control medium that is sent to the liquid processing unit is adjusted to a predetermined temperature, and the liquid processing unit A first temperature control circulating device that circulates a predetermined amount of temperature control medium between the first temperature control medium and a temperature control medium to be sent to the cooling unit to a predetermined temperature; Temperature circulating device for circulating water and the first temperature circulating device And adjusting the temperature control medium to be sent to the second temperature control circulating device to a constant temperature, and circulating a predetermined amount of the temperature control medium between the first temperature control circulating device and the second temperature control circulating device. A third temperature control circulating device, a first control device performing temperature control and flow rate control of each temperature control medium in the first temperature control circulating device and the second temperature control circulating device, and the third temperature controlling circulating device; A second control device provided separately from the first control device for performing temperature control and flow rate control of the temperature control medium in the temperature control circulating device. provide.

According to a fifth aspect of the present invention, there is provided a processing apparatus for performing a liquid treatment and a thermal treatment after the liquid treatment on a processing target, and a liquid processing unit for performing a predetermined liquid processing on the processing target. And a plurality of thermal processing units for performing predetermined thermal processing on the object by performing heat exchange with the object to be processed on which the predetermined liquid processing has been performed in the liquid processing unit by using a temperature control medium. A temperature control medium provided for each of the plurality of thermal processing units and sent to the corresponding thermal processing unit to a predetermined temperature to control a predetermined amount of temperature control with the thermal processing unit. A plurality of first temperature control circulating devices for circulating a medium, and adjusting the temperature control medium to be sent to the plurality of first temperature control circulating devices to a constant temperature; A second temperature control circulating device that circulates a predetermined amount of the temperature control medium between A first control device for controlling the temperature and flow rate of the temperature control medium in the temperature control circulating device, and a first control device for controlling the temperature control and flow rate of the temperature control medium in the second temperature control circulating device And a second control device provided separately from the second control device.

According to a sixth aspect of the present invention, there is provided a processing apparatus for performing a liquid treatment and a thermal treatment after the liquid treatment on an object to be processed, wherein a predetermined temperature is obtained by performing heat exchange with a temperature control medium. The heat exchange between the liquid processing unit that performs the predetermined liquid processing on the object to be processed using the processing liquid adjusted to the above and the object that has been subjected to the predetermined liquid processing in the liquid processing unit is performed. A plurality of thermal processing units for performing predetermined thermal processing on the object to be processed by performing with a temperature control medium; and a corresponding liquid processing unit provided for each of the liquid processing unit and the plurality of thermal processing units. A plurality of first temperature control circulating devices for controlling a temperature control medium to be sent to the unit or the thermal processing unit to a predetermined temperature and circulating a predetermined amount of the temperature control medium between the liquid processing unit and the thermal processing unit; And the plurality of first temperature control circulating devices A first control device for controlling the temperature and flow rate of the temperature control medium in the temperature control block, and a temperature control medium for sending liquid to the first temperature control circulation device in the plurality of temperature control blocks A second temperature adjustment circulating device that adjusts the temperature to a constant temperature and circulates a predetermined amount of a temperature adjustment medium between the plurality of first temperature adjustment circulating devices, and a temperature in the second temperature adjustment circulating device. A processing device, comprising: a second control device provided separately from the first control device for performing temperature control and flow rate control of a conditioning medium.

According to a seventh aspect of the present invention, there is provided a processing apparatus for performing a series of processing including cleaning, resist coating, and development after exposure to an object to be processed, comprising: A resist coating unit for applying a predetermined resist solution to the object to be processed, a developing unit for performing a predetermined developing process on the object to be processed after exposure, and the cleaning unit or the resist coating unit or the developing unit. A plurality of heating units for performing predetermined heat treatment on the object to be processed, and heat exchange between the object to be processed and the object to be processed in the plurality of heating units is performed by a temperature control medium. A plurality of cooling units for cooling the object to be processed to a predetermined temperature, and corresponding to each of the plurality of cooling units by adjusting a temperature control medium to be supplied to a predetermined temperature. A plurality of first temperature control circulating devices that circulate a predetermined amount of a temperature control medium between the cooling unit and a plurality of processing liquids used in the cleaning unit or the resist coating unit or the developing unit. A plurality of second temperature control circulating devices that maintain the processing solution at a predetermined temperature by performing heat exchange with the processing solution by using a temperature control medium; A first control device for controlling the temperature and flow rate of a temperature control medium used for a cleaning process of an object to be processed among the two temperature control circulators, and the plurality of first temperature control circulators And a second controller for controlling the temperature and flow rate of a temperature control medium used in the resist coating process for the object to be processed in the second temperature control circulating device, and the plurality of first temperatures. Of the temperature control circulation device and the second temperature control circulation device To a third control device for controlling the temperature and flow rate of the temperature control medium used for the process related to the development processing of the object, and to the plurality of first temperature control circulating devices and the second temperature control circulating devices. A third temperature control circulation for adjusting a temperature control medium to be fed to a constant temperature and circulating a predetermined amount of temperature control medium between the plurality of first temperature control circulating devices and the second temperature control circulating device. And a fourth control device provided separately from the first control device for controlling the temperature and flow rate of the temperature control medium in the third temperature control circulating device. And a processing device.

The present invention provides a temperature control system applied to the above processing apparatus. That is, the present invention provides, as an eighth invention, a temperature control system for performing a predetermined temperature control by supplying a temperature control medium to each processing unit in a processing apparatus including a plurality of processing units. A first temperature control circulating device that adjusts the temperature control medium to be fed to a predetermined temperature and circulates a predetermined amount of the temperature control medium between the plurality of processing units and a first temperature control circulating device. A second temperature control circulating device that adjusts the temperature of the liquid temperature control medium to a constant temperature and circulates a predetermined amount of the temperature control medium between the first temperature control circulating device and the first temperature control circulating device The first control device for performing temperature control and flow rate control of the temperature control medium in the above and the first control device for performing temperature control and flow rate control of the temperature control medium in the second temperature control circulating device are separate bodies. And a second control device provided. Temu, to provide.

In the processing apparatus and the temperature control system of the present invention, the number of piping for the temperature control water and the length of the control cable of the temperature control circulator can be reduced to simplify the apparatus structure. This facilitates assembling and maintenance of the processing apparatus, and prevents erroneous wiring. Furthermore, operability and controllability are improved by separately providing the control device of the temperature control circulation device.

[0018]

DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS Hereinafter, embodiments of a processing apparatus and a temperature control system according to the present invention will be described with reference to the accompanying drawings. Here, the present invention relates to a liquid crystal display (LC).
A case where the present invention is applied to a resist coating / developing system that performs a series of processes of cleaning, resist coating, and developing on a glass substrate for D) will be described.

FIG. 1 shows a resist coating and developing system 1.
00 is a plan view of the resist coating / developing processing system 100 for mounting a cassette C containing a plurality of substrates G thereon and a series of processes including resist coating and developing on the substrates G. A processing unit 2 having a plurality of processing units, and an interface unit 3 for transferring a substrate G to and from an exposure apparatus (not shown). 1 and an interface unit 3 are arranged.

The cassette station 1 has a transport mechanism 1 for transporting the substrate G between the cassette C and the processing section 2.
0 is provided. Then, the cassette C is loaded and unloaded at the cassette station 1. Also, the transport mechanism 1
0 is a transport path 10 provided along the cassette arrangement direction.
A transfer arm 11 is provided which is movable on the substrate a. The transfer arm 11 transfers the substrate G between the cassette C and the processing unit 2.

The processing section 2 is divided into a front section 2a, a middle section 2b, and a rear section 2c.
13 and 14. Each processing unit is arranged on both sides of these transport paths. And, between the transport paths 12 and 13 and between the transport paths 13 and 14, the relay sections 15.1
6 are provided.

The front section 2a is provided with a main transfer device 17 movable along the transfer path 12, and two cleaning units (SCR) 21a and 21b are arranged on one side of the transfer path 12. On the other side of the transport path 12, a temperature control block 25 in which an ultraviolet irradiation unit (UV) and a cooling unit (COL) are stacked in two stages, and a temperature control block 26 in which a heating unit (HP) is stacked in two stages. And a temperature control block 27 in which cooling units (COL) are stacked in two stages.

The middle section 2b is provided with a main transfer device 18 movable along the transfer path 13. A resist coating unit (CT) 22 is provided on one side of the transfer path 13. Next to the resist coating unit (CT) 22, there is provided a peripheral resist removing unit (ER) 23 for removing the resist on the peripheral portion of the substrate G after the resist film is formed in the resist coating unit (CT) 22. .

On the other side of the transport path 13, a heating unit (H
P), a temperature control block 28 in which a heating unit (HP) and a cooling unit (COL) are vertically stacked, and an adhesion processing unit (AD) and a cooling unit (COL). )
And a temperature control block 30 in which the temperature control block 30 is vertically overlapped.

Further, the rear section 2c is provided with a main transport device 19 movable along the transport path 14,
On one side are three developing units (DEV) 24a and 2
4b and 24c are arranged, and on the other side of the transport path 14, a temperature control block 31 in which a heating unit (HP) is stacked in two stages, and both a heating unit (HP) and a cooling unit (COL) are vertically Temperature control blocks 32 and 33 which are overlapped with each other.

The processing unit 2 includes a cleaning unit (SCR) 21a, a resist coating unit (CT) 22, and a developing unit (DEV) 24a on one side of the transport path.
, Only the spinner-based unit is arranged, and only the thermal processing unit such as the heating unit or the cooling unit is arranged on the other side. Also, the relay unit 15
A chemical solution supply unit 34 is disposed at a portion 16 on the side where the spinner system unit is disposed, and a space 35 for performing maintenance of the main transport device is further provided.

Each of the main transporting devices 17, 18, and 19 has an X-axis driving mechanism, a Y-axis driving mechanism, and a vertical Z-axis driving mechanism in two directions in a horizontal plane, and further rotates about the Z axis. , And each has an arm for supporting the substrate G.

The main transfer device 17 has a transfer arm 17a, transfers the substrate G to and from the transfer arm 11 of the transfer mechanism 10, and loads and unloads the substrate G to and from each processing unit in the former stage 2a. Has a function of transferring the substrate G to and from the relay unit 15. Further, the main transfer device 18 has a transfer arm 18a, transfers the substrate G to and from the relay unit 15, and loads and unloads the substrate G to and from each processing unit in the middle unit 2b. And a function of transferring the substrate G during the transfer. Further, the main transfer device 19 has a transfer arm 19a, transfers the substrate G to and from the relay unit 16, loads and unloads the substrate G to and from the respective processing units in the rear-stage unit 2c, and further connects to the interface unit 3. And a function of transferring the substrate G during the transfer. The relay unit 1
5 and 16 also function as cooling plates.

The interface unit 3 includes an extension 36 for temporarily holding the substrate when transferring the substrate to and from the processing unit 2, and two buffer stages 37 provided on both sides thereof for disposing a buffer cassette.
And a transport mechanism 38 for loading and unloading the substrate G between these and an exposure apparatus (not shown). Transport mechanism 38
Is provided with a transfer arm 39 movable along a transfer path 38a provided along the direction in which the extension 36 and the buffer stage 37 are arranged. The transfer arm 39 allows the transfer of the substrate G between the processing unit 2 and the exposure apparatus. Done.

By thus integrating and integrating the processing units, it is possible to save space and increase the efficiency of processing.

In the resist coating / developing processing system configured as described above, the substrate G in the cassette C is transported to the processing section 2, where the ultraviolet irradiation unit of the temperature control block 25 of the former section 2a is first used. (UV) for surface modification and cleaning processing, and after cooling in the cooling unit (COL), scrubber cleaning is performed in the cleaning units (SCR) 21a and 21b, and any of the heating units in the temperature control block 26 After being dried by heating at (HP), one of the cooling units (COL) of the temperature control block 27
Cooled by.

Thereafter, the substrate G is transported to the middle section 2b,
Temperature control block 3 to improve the fixability of the resist
0 is subjected to a hydrophobic treatment (HMDS treatment) in the upper adhesion processing unit (AD), and then cooled in the lower cooling unit (COL). Next, in the resist coating unit (CT) 22, a resist is coated on the substrate G.

In this resist coating step, for example, before supplying the resist liquid to the substrate G, a processing liquid such as a thinner is supplied while rotating the substrate G to improve the wettability of the surface of the substrate G with respect to the resist liquid. Thereafter, the substrate G is once stopped, the resist solution is supplied to the substrate G, and then the substrate G is rotated again to spread the resist solution over the entire surface of the substrate G, thereby forming a resist film.

Such a resist coating unit (CT)
After the processing at 22, the substrate G is transported to the peripheral resist removal unit (ER) 23, and the resist on the peripheral edge of the substrate G is removed (hereinafter, such processing is referred to as "edge removal"). Edge removal refers to a process of removing the resist on the peripheral edge of the surface of the substrate G on which the resist film is formed, and removing the resist attached to the side surface of the substrate G and the back surface of the substrate G.

Thereafter, the substrate G is pre-baked in one of the heating units (HP) in the middle section 2b, and the lower cooling unit (CO) in the temperature control block 29 or 30 is used.
L). Next, the substrate G is transported from the relay section 16 to the exposure apparatus via the interface section 3 by the main transport apparatus 19, where a predetermined pattern is exposed. Then, the substrate G is again carried in via the interface unit 3 and, if necessary, the temperature control block 31 of the subsequent stage 2c.
After the post-exposure bake process is performed by any one of the heating units (HP) 32 and 33, the development process is performed by any of the development units (DEV) 24a, 24b, and 24c to form a predetermined circuit pattern.

The developed substrate G is subjected to post-baking in one of the heating units (HP) in the rear stage 2c, and then cooled in one of the cooling units (COL). 19.18.17 and transport mechanism 1
0 is stored in a predetermined cassette on the cassette station 1.

Next, the resist coating / developing processing system 1
An embodiment of the temperature control system at 00 will be described. FIG. 2 is an explanatory diagram of the temperature control system 50. The temperature control system 50 includes three temperature control blocks 51a and 51b.
-51c, chiller (cooling circulation device; primary temperature control unit) 52
And Here, the temperature control block 51a is for the rear stage 2c, the temperature control block 51b is for the middle stage 2b,
The temperature control block 51c is responsible for the temperature control required in the front section 2a.

The temperature control block 51a includes, for example, three temperature control heads (temperature control circulating devices; secondary temperature control units) 53a-5
3c and a power source 56 for operating the temperature control heads 53a to 53c.
a, a control device 54a for the temperature control heads 53a to 53c,
A relay panel 55a for sending a signal to the chiller 52 when an abnormality or the like occurs in the temperature control heads 53a to 53c. The control device 54a is arranged at a predetermined location together with a control device (not shown) of the various units disposed in the rear part 2c, and is controlled in cooperation with the control devices of the various units disposed in the rear part 2c. As described later in detail, water (secondary temperature-regulated water) having a predetermined temperature is prepared in the temperature-regulating heads 53a to 53c. Also chiller 5
In 2, water at a lower temperature than the secondary temperature control water (primary temperature control water)
Is prepared.

Between the temperature control heads 53a to 53c and the chiller 52, a pipe 61a for circulating a predetermined amount of water.
61b are provided. The pipe 61a has a structure in which the pipe 61a is branched in three directions by a branch member 58a provided in the middle thereof.
A predetermined amount of primary temperature-regulated water is sent to each of 3c. In addition, secondary temperature-regulated water is returned from the temperature-regulating heads 53a to 53c to the chiller 52 using the pipe 61b. For this reason, the piping 61b has a structure in which the piping provided in each of the temperature control heads 53a to 53c is unified by the joining member 57a.

Temperature control head 53a and temperature control block 33
Pipes 62a and 62b for circulating a predetermined amount of secondary temperature water between the cooling unit (COL) and the cooling unit (COL)
Similarly, pipes 63a and 63b are provided between the temperature control head 53b and the cooling unit (COL) disposed in the temperature control block 32, and the temperature control head 5b
Pipes 64a and 64b are provided between the developing unit 3c and the developing units (DEV) 24a to 24c.

Like the temperature control block 51a, the temperature control block 51b includes three temperature control heads (secondary temperature control units).
53d to 53f, a power supply 56b for operating the temperature control heads 53d to 53f, a control device 54b for the temperature control heads 53d to 53f, and a chiller 52 when an abnormality or the like occurs in the temperature control heads 53d to 53f. Relay panel 55 when sending to
b. Here, the control device 54b is disposed at a predetermined location together with a control device (not shown) of various units disposed in the middle section 2b, and is controlled in cooperation with the control devices of various units disposed in the middle section 2b. You.

A pipe 65a for circulating a predetermined amount of water is provided between the temperature control heads 53d to 53f and the chiller 52.
65b are provided. A branching member 58b and a merging member 57b are provided in the middle of the pipes 65a and 65b, respectively, and have the same structure as the pipes 61a and 61b. Further, pipes 66a and 66b for circulating a predetermined amount of secondary temperature control water are provided between the temperature control head 53d and the cooling unit (COL) disposed in the temperature control block 30. Similarly, pipes 67a and 67b are provided between the temperature control head 53e and the cooling unit (COL) provided in the temperature control block 29, and the temperature control head 53e
Pipings 68 a and 68 b are provided between f and the resist coating unit (CT) 22.

The temperature control block 51c includes two temperature control heads (secondary temperature control units) 53g and 53h and a temperature control head 53
g · 53h power supply 56c and temperature control head 53g
53h control device 54c and temperature control heads 53g and 53
and a relay panel 55c for sending a signal to the chiller 52 when an abnormality or the like occurs in the h. Relay panel 55
c is connected to the control unit of the chiller 52, and the temperature control head 53a
When an abnormality or the like occurs in 〜53h, the operation of the chiller 52 is stopped or the like. The temperature control heads 53a to 53h are provided with alarms when an abnormality occurs, respectively.
It is possible to easily identify the temperature control head that caused the operation of the chiller 52 to stop. The control device 54c is disposed at a predetermined location together with a control device (not shown) of various units disposed in the front section 2a, and is controlled in cooperation with a control device of various units disposed in the front section 2a. .

Between the temperature control heads 53g and 53h and the chiller 52, pipes 69a and 69b for circulating a predetermined amount of primary temperature control water are provided. Piping 69a / 69b
A branching member 58c and a merging member 57c are respectively disposed in the middle of, and have the same structure as the pipes 61a and 61b. Between the temperature control head 53g and the cooling unit (COL) disposed in the temperature control block 27, pipes 78a and 78b for circulating a predetermined amount of secondary temperature control water are provided. Pipes 79a and 79b are provided between the temperature control head 53h and the cooling unit (COL) disposed in the temperature control block 25.

Since the temperature control blocks 51a to 51c have the same structure, the temperature control blocks 51a
The configuration will be described in detail with reference to an example.

FIG. 3 is an explanatory view showing a schematic structure of the temperature control head 53a. The temperature control heads 53b and 53c also have the same structure as the temperature control head 53a. Temperature control head 53a
Has a tank 71 and a predetermined amount of low-temperature primary temperature water sent from the chiller 52 and a heated secondary temperature control returned from a cooling unit (COL) provided in the temperature control block 33. Water flows into this tank 71 and is mixed.

The temperature control head 53a has a temperature sensor 74 and a heater 72. The heater 72 is turned on / off based on the temperature measured by the temperature sensor 74, and the tank 71
The temperature of the water inside is heated to a predetermined temperature to prepare secondary temperature-regulated water. The secondary temperature adjusted water thus prepared is sent from the tank 71 to the cooling unit (COL) by a predetermined amount, and a predetermined amount of the secondary temperature adjusted water is returned to the chiller 52. The supply of the secondary temperature control water from the temperature control head 53a to the cooling unit (COL) is performed by the pump 73, and the temperature sensor 7
4, the control of the temperature of the inside of the tank 71, the ON / OFF operation of the heater 72 based on the result of the temperature measurement, and the drive control of the pump 73 are performed by one controller 54a.

In the temperature control system 50, the two types of water, that is, the primary temperature control water and the secondary temperature control water are used, for example, by using a cooling plate arranged in a cooling unit (COL). In order to cool the substrate G while maintaining it at a constant temperature, it is necessary to increase the flow rate of the water to be sent to the cooling unit, and the chiller is directly connected to the cooling unit (COL).
This is to prevent the chiller from being mounted on a large chiller, since the burden on the chiller increases and a large chiller is required.
Further, the temperature control head for preparing the secondary temperature control water is connected to a processing unit requiring temperature control (in the case of the temperature control head 53a, the cooling unit (C
OL)), it is possible to shorten the piping and the like from the temperature control head to the processing unit, thereby disturbing the secondary temperature control water, for example, the secondary temperature control water in the middle of the pipe. Heat absorption and diffusion are reduced, and the temperature of the processing unit can be controlled with higher accuracy.

In FIG. 3, the temperature sensor 74 is arranged at a position for measuring the temperature of the secondary temperature control water returned from the cooling unit (COL). This is for the following reasons. That is, the cooling unit (COL) includes the temperature control head 5
A cooling plate that is maintained at a predetermined temperature by the secondary temperature control water sent from the cooling plate 3a. When the substrate G subjected to the heat treatment is placed on the cooling plate, the heat of the substrate G is reduced. The heat exchange that warms the secondary temperature control water along the cooling plate occurs, and the secondary temperature control water thus warmed is returned to the tank 71 of the temperature control head 53a.

That is, the temperature of the secondary temperature control water returned from the cooling unit (COL) changes according to whether the substrate G is carried into the cooling unit (COL) and the elapse of the cooling time of the substrate G. From the temperature sensor 7
4 is made to follow such a temperature change, so that the heater 7
2, it is possible to prepare the secondary temperature-regulated water by reducing the load on the water.

In the above-described temperature control block 51a, the distance between the branching member 58a and the merging member 57a and the temperature control heads 53a to 53c can be reduced.
Further, since the branching member 58a and the merging member 57a are not large-sized devices but small devices such as a branch valve can be used, by providing the branching member 58a and the merging member 57a, the chiller 52 and the temperature control heads 53a to 53a. Compared to a case where a separate liquid supply pipe is provided between the liquid supply pipe 53c and the liquid supply pipe 53c, the number of pipes is reduced to save space, and the apparatus structure is simplified, so that the apparatus can be easily manufactured and maintained. be able to.

When comparing the temperature control system 50 with the conventional temperature control system 80 shown in FIG. 4 described above, the temperature control system 80 includes a control device 8 provided in a chiller 81.
5 and the power supply 86 are connected to the temperature control head 82, the wiring of the control cable and the power supply cable is long, and the wiring of many temperature control heads 82 is concentrated on the control device 85 and the power supply 86 of the chiller 81. Therefore, there is a high possibility that a wiring error will occur. However, the temperature control heads 53a to 53c
Since the control device 54a can be arranged at a position close to the temperature control heads 53a to 53c, the wiring can be shortened, and the number of wirings is small, so that the temperature control block 51a can be easily manufactured, and Can be prevented. Further, the temperature control heads 53a to 53c are
Since operation can be performed independently of the operation 2, operation confirmation and the like can be easily performed. Temperature control block 51
These effects obtained for a can also be obtained for the temperature control blocks 51b and 51c.

In the temperature control system 80, the number of the temperature control heads 82 attached to the chiller 81 is changed because the control device 85 and the power supply 86 provided in the chiller 81 are connected to the temperature control head 82. At this time, the control device 8
In some cases, the chiller 81 needs to be manufactured or replaced. However, in the temperature control system 50, one kind of the chiller 52 is prepared. If so, it is possible to construct various temperature control systems by connecting a required number of temperature control heads.

Next, the operation of the temperature control block 51a will be described. As described above, the cooling unit (COL) of the temperature control block 33 includes the temperature control head 5.
A cooling plate that is maintained at a predetermined temperature by the secondary temperature control water sent from the cooling plate 3a. When the substrate G subjected to the heat treatment is placed on the cooling plate, the heat of the substrate G is reduced. The heat exchange that warms the secondary temperature control water along the cooling plate occurs, and the secondary temperature control water thus warmed is returned to the tank 71 of the temperature control head 53a.

In the chiller 52, the cooling unit (C
OL) from the temperature control head 53a to the cooling unit (COL) in order to balance the heat with the warmed secondary temperature control water flowing into the temperature control head 53a from the temperature control head 53a. Is prepared and sent to the temperature control head 53a. And the temperature control head 53
In (a), based on the temperature measurement result by the temperature sensor 74, and the temperature flowing from the chiller 52, the secondary temperature regulated water adjusted to a predetermined temperature can be sent to the cooling unit (COL). Of the primary temperature control water having a low temperature and the flow rate of the secondary temperature control water having a high temperature flowing from the cooling unit (COL), and the temperature and flow rate of the secondary temperature control water flowing out to the cooling unit (COL) and the chiller 52. The heater 72 is turned on / off in consideration of the balance. The supply of the primary temperature control water from the chiller 52 to the temperature control heads 53a to 53c is performed by a pump (not shown in FIG. 2) provided in the chiller 52.

The temperature control head 53b can be controlled similarly to the temperature control head 53a, and is supplied from the chiller 52 to the temperature control head 53b according to the set temperature of the cooling plate in the cooling unit (COL) of the temperature control block 32. Increase or decrease the amount of primary temperature control water to be
2 by adjusting the operation time of the temperature control head 53b.
It is possible to send secondary temperature regulated water at a predetermined temperature to the cooling unit (COL) of the temperature control block 32.

From the temperature control head 53c to the developing unit (DE)
V) The secondary temperature-regulated water sent to the 24a to 24c is more specifically used to control the temperature of the developer used in the developing units (DEV) 24a to 24c, thereby making the developing characteristics constant. It is possible to maintain quality. For example, a tank for storing the developer, a nozzle for discharging the developer toward the substrate G, a pipe connecting the tank and the nozzle, and the like are maintained at a constant temperature as a jacket structure through which secondary temperature water can be circulated. The temperature of the developer can be kept constant by sending the secondary temperature-regulated water maintained at a predetermined temperature from the temperature control head 53c to these members.

The configuration and operation of the temperature control blocks 51b and 51c are the same as those of the above-described temperature control block 51a.
That is, the control mode between the cooling unit (COL) arranged in the temperature control block 33 and the temperature control head 53a is based on the cooling units (COL) arranged in the temperature control blocks 30, 29, 27, and 25, respectively. ) And the temperature control heads 53d, 53e,
This is applied to a control mode between 53g and 53h.

The control mode between the temperature control head 53f and the resist coating unit (CT) 22 is as follows.
3c and the developing unit (DEV) 24a to 24c. In other words, a tank for storing the resist solution, a nozzle for discharging the resist solution toward the substrate G, a pipe connecting the tank and the nozzle, and the like are maintained at a constant temperature as a jacket structure through which secondary temperature water can circulate. The temperature of the resist solution can be kept constant by sending secondary temperature-regulated water maintained at a predetermined temperature from the temperature control head 53f to these members.
Thus, for example, it is possible to prevent the problem that the film thickness formed when the resist solution is applied to the substrate G differs for each substrate G, and to reduce the variation in quality for each substrate G.

The temperature control heads 53a to 53a to
While the temperature of the primary temperature control water supplied to 53h is almost the same temperature, the set temperature of the secondary temperature control water in the temperature control heads 53a to 53h may be different. For this reason, the set temperature of the primary temperature control water in the chiller 52 is controlled by the temperature control head 5.
It is preferable that the temperature is set lower than the lowest set temperature of the secondary temperature control water in 3a to 53h.

Although the embodiments of the present invention have been described above, the present invention is not limited to the above embodiments. For example, the number of temperature control heads that can be disposed in each of the temperature control blocks 51a to 51c is not limited to two or three, but may be more. The temperature control blocks are also 3 like the temperature control blocks 51a to 51c.
It is not limited to blocks.

In the temperature control system 50 described above, the operation of the chiller 52 is stopped via the relay panels 55a to 55c when an abnormality occurs in the temperature control heads 53a to 53h. Without stopping the chiller 52, stopping the operation of only the temperature control head in which the abnormality has occurred,
The operation status of the resist coating / developing processing system 100 is checked, and the processing of the substrate G being processed is completed so that the processing in each unit provided in the resist coating / developing processing system 100 does not end halfway. It is also preferable that the operation is continued until the chiller 52 is stopped.

Further, the temperature control target using the temperature control heads 53a to 53h is a cooling unit (CO
L), not limited to the resist solution and the developing solution, but other processing solutions such as the cleaning solution used in the cleaning units (SCR) 21a and 21b, the peripheral resist removing unit (ER)
In 23, a solvent such as a thinner used for removing the resist film on the peripheral edge of the substrate after applying the resist,
The rinsing liquid supplied to the substrate G after the elapse of the development processing time in the development units (DEV) 24a to 24c can also be subjected to temperature control by the temperature control head.

Further, in the temperature control heads 53a to 53h, the temperature sensor 74 must be arranged at a position for measuring the temperature of the secondary temperature control water returned from the cooling unit (COL) or the like. Instead, it may be provided on the pipe side for sending the prepared secondary temperature-regulated water. For example,
When the temperature change of the object whose temperature is to be adjusted, such as a developing solution or a resist solution, is small, a pipe 64 a for sending the temperature sensor 74 to the developing units (DEV) 24 a to 24 c or the resist coating unit (CT) 22. By providing it on the 68a side, it is possible to always supply a constant temperature secondary water to these units and keep the temperature of the developing solution or the resist solution constant.

When each of the control devices 54a to 54c can control three temperature control heads in parallel, the two temperature control heads 53g as in the control device 54c.
When only 53h is controlled, for example, the temperature control of the heating unit (HP) arranged in the temperature control block 26 can be performed using the remaining control system of the control device 54c. In this case, there is no need to separately provide a temperature control device for the heating unit (HP), and the number of components can be reduced, and the reliability of the device is improved. Note that the number of temperature control heads and other devices that can be controlled by the control devices 54a to 54c in parallel is not limited to three.

The temperature control medium used in the temperature control system 50 is not limited to water, and other liquids such as oil can be used. When water is used, a predetermined amount of water is used. Addition of a rust inhibitor or the like is also preferable for maintenance of various devices. In the above embodiment,
Although an LCD substrate has been described as an object to be processed, other substrates such as a semiconductor wafer and a CD substrate may be used, and the object to be processed is not limited to one having such a substrate-like shape. Absent.

[0067]

As described above, according to the processing apparatus and the temperature control system of the present invention, control of a plurality of units requiring temperature control by temperature control water in a plurality of temperature control blocks is performed for each temperature control block. As a result, the number of piping for the temperature control water and the length of the control cable of the temperature control circulating device can be reduced, and the effect that the device structure can be simplified can be obtained. Further, in this case, there are obtained effects that the assembling and maintenance of the processing device are facilitated, and that erroneous wiring can be prevented. Further, by separately providing the control devices of the temperature adjusting and circulating device, an effect that operability and manageability are improved can be obtained. When the temperature of the resist solution is adjusted by applying the processing apparatus of the present invention to a resist coating / developing processing system, it is necessary to prevent a problem that the thickness of a resist film formed on a substrate varies from substrate to substrate. In addition, when the temperature of the developing solution is adjusted, it is possible to prevent the occurrence of a quality difference between the substrates due to constant development characteristics.

[Brief description of the drawings]

FIG. 1 is a plan view showing a resist coating / developing processing system which is an embodiment of a processing apparatus of the present invention.

FIG. 2 is an explanatory diagram showing a configuration of a temperature control system of a resist coating / developing processing system.

FIG. 3 is an explanatory diagram showing a configuration of a temperature control head used in the temperature control system.

FIG. 4 is an explanatory diagram showing a configuration of a conventional temperature control system of a resist coating / developing processing system.

[Explanation of symbols]

 21a, 21b; cleaning unit (SCR) 22; resist coating unit (CT) 24a to 24c; developing unit (DEV) 50; temperature control system 51a to 51c; temperature control block 52; chillers 53a to 53h; Control devices 55a to 55c; Relay panels 56a to 56c; Power supplies 57a to 57c; Merging members 58a to 58c; Branch members 61a to 69a, 78a, 79a; Heater 73; Pump 74; Temperature sensor 100; Resist coating and developing system COL; Cooling unit G; Substrate (LCD substrate)

──────────────────────────────────────────────────続 き Continued on the front page (51) Int.Cl. ⁷ Identification symbol FI Theme coat ゛ (Reference) H01L 21/30 569F

Claims (11)

[Claims] 1. A processing apparatus comprising a plurality of processing units, comprising: a temperature control system for supplying a temperature control medium to the plurality of processing units and performing a predetermined temperature control on each processing unit. A first temperature control circulating device that controls a temperature control medium to be sent to the plurality of processing units to a predetermined temperature and circulates a predetermined amount of the temperature control medium between the plurality of processing units; A second temperature control unit that adjusts a temperature control medium to be sent to the first temperature control circulator to a constant temperature and circulates a predetermined amount of the temperature control medium with the first temperature control circulator. A circulation device; a first control device for controlling the temperature and flow rate of the temperature control medium in the first temperature control and circulation device; and a temperature control and flow rate control for the temperature control medium in the second temperature control and circulation device. A second control device provided separately from the first control device, A processing device, comprising: 2. A processing apparatus for performing a liquid process and a thermal process after the liquid process on a processing target, comprising: a liquid processing unit configured to perform a predetermined liquid processing on the processing target; A thermal processing unit for performing predetermined thermal processing on the object to be processed by performing heat exchange between the thermal processing medium and a temperature for circulating a predetermined amount of the temperature controlling medium between the thermal processing unit and the thermal processing unit. A temperature control medium circulating device, wherein the temperature control medium circulating device adjusts a temperature control medium to be sent to the thermal processing unit to a predetermined temperature, and controls a predetermined amount of temperature between the temperature control medium and the thermal processing unit. A first temperature control circulating device that circulates the temperature control medium, and a temperature control medium that is sent to the first temperature control circulator is adjusted to a constant temperature, and a predetermined amount is set between the first temperature control circulator and the first temperature control circulator. A second temperature control circulating device that circulates the temperature control medium, and a temperature control of the temperature control medium in the first temperature control circulating device. And a first control device that performs flow control and a second control that is provided separately from the first control device that performs temperature control and flow control of the temperature control medium in the second temperature control circulation device. A processing device comprising: a device. 3. A processing apparatus for performing a predetermined liquid processing on an object to be processed, a liquid processing unit for performing a predetermined liquid processing on the object to be processed, and a processing liquid used in the liquid processing unit. A processing liquid temperature control device that maintains the processing liquid at a predetermined temperature by performing heat exchange between the processing liquid and a temperature control device that circulates a predetermined amount of the temperature control medium between the processing liquid temperature control device and the processing liquid temperature control device. And a medium circulation device, wherein the temperature adjustment medium circulation device adjusts the temperature adjustment medium to be sent to the processing liquid temperature adjustment device to a predetermined temperature, and a predetermined amount between the temperature adjustment medium and the processing liquid temperature adjustment device. A first temperature control circulating device that circulates a temperature control medium, and a temperature control medium that is sent to the first temperature control circulator is adjusted to a constant temperature, and a first temperature control circulating device is connected to the first temperature control circulator. A second temperature control circulating device for circulating a fixed amount of temperature control medium, and a temperature control medium in the first temperature control circulating device A first control device that performs temperature control and flow rate control; and a second control device that is provided separately from the first control device that performs temperature control and flow rate control of a temperature control medium in the second temperature control circulating device. And a control device. 4. A processing apparatus for performing liquid processing and thermal processing after liquid processing on an object to be processed, wherein the processing liquid is adjusted to a predetermined temperature by performing heat exchange with a temperature control medium. A liquid processing unit for performing a predetermined liquid treatment on the object to be processed using the heat treatment, a heating unit for performing a predetermined heat treatment on the object to be processed after the liquid treatment, and a heat treatment unit. A cooling unit that cools the object by performing heat exchange with the temperature control medium; and a temperature control medium that is sent to the liquid processing unit is adjusted to a predetermined temperature, and a predetermined amount of temperature is set between the liquid processing unit and the liquid processing unit. A first temperature control circulating device that circulates a temperature control medium, and a second temperature control device that controls a temperature control medium to be sent to the cooling unit to a predetermined temperature and circulates a predetermined amount of the temperature control medium between the temperature control medium and the cooling unit. A temperature regulating circulating device, the first temperature regulating circulating device and a second temperature regulating circulating device A third temperature control circulation in which the temperature control medium to be supplied to the apparatus is adjusted to a constant temperature, and a predetermined amount of the temperature control medium is circulated between the first temperature control circulating device and the second temperature control circulating device. A first control device for controlling the temperature and flow rate of each temperature control medium in the first temperature control circulating device and the second temperature control circulating device; and a temperature control device for controlling the temperature in the third temperature control circulating device. A second control device provided separately from the first control device for controlling the temperature and flow rate of the conditioning medium. 5. A processing apparatus for performing liquid processing and thermal processing after liquid processing on a target object, a liquid processing unit for performing predetermined liquid processing on the target object, and the liquid processing unit. A plurality of thermal processing units for performing a predetermined thermal treatment on the object to be processed by performing a heat exchange with the object to be processed which has been subjected to the predetermined liquid treatment in the temperature control medium; Provided for each individual processing unit,
A plurality of first temperature control circulating devices that adjust a temperature control medium to be sent to a corresponding thermal processing unit to a predetermined temperature and circulate a predetermined amount of the temperature control medium with the thermal processing unit; A second temperature control unit that adjusts the temperature control medium to be sent to the first temperature control circulating device to a constant temperature, and circulates a predetermined amount of the temperature control medium between the plurality of first temperature control circulating devices. A circulation device; a first control device for controlling the temperature and flow rate of the temperature control medium in the plurality of first temperature control and circulation devices; and a temperature control and flow rate for the temperature control medium in the second temperature control and circulation device And a second control device provided separately from the first control device for performing control. 6. A processing apparatus for performing liquid processing and thermal processing after liquid processing on an object to be processed, wherein the processing liquid is adjusted to a predetermined temperature by performing heat exchange with a temperature control medium. Using a temperature control medium to perform heat exchange between a liquid processing unit that performs predetermined liquid processing on the object to be processed using the method and a processing object that has been subjected to the predetermined liquid processing in the liquid processing unit. A plurality of thermal processing units for performing predetermined thermal processing on the object to be processed, and a corresponding liquid processing unit or thermal processing unit provided for each of the liquid processing unit and the plurality of thermal processing units A plurality of first temperature control circulating devices for circulating a predetermined amount of temperature control medium between a liquid processing unit or a thermal processing unit by adjusting the temperature control medium to be sent to the predetermined temperature; 1 of the temperature control medium in the temperature control circulation device A plurality of temperature control blocks having a first control device for performing temperature control and a flow rate control; and adjusting a temperature control medium to be sent to a first temperature control circulation device in the plurality of temperature control blocks to a constant temperature. A second temperature control circulating device that circulates a predetermined amount of temperature control medium between the plurality of first temperature control circulating devices, and a temperature control of the temperature control medium in the second temperature control circulating device. And a second control device provided separately from the first control device for controlling the flow rate. 7. A processing apparatus for performing a series of processing including cleaning, resist coating, and development after exposure to an object to be processed, comprising: a cleaning unit for performing a cleaning process on the object to be processed; A resist coating unit for applying a resist liquid of the type described above, a developing unit for performing a predetermined developing process on the object to be processed after exposure, and a processing unit for the cleaning unit or the resist applying unit or the object processed in the developing unit. A plurality of heating units for performing a predetermined heating process, and for the object to be processed in the plurality of heating units, heat exchange between the object to be processed and the object to be processed is performed by using a temperature control medium. A plurality of cooling units for cooling to a predetermined temperature, and a cooling unit corresponding to each of the plurality of cooling units by adjusting a temperature control medium to be supplied to a predetermined temperature. A plurality of first temperature control circulating devices for circulating a predetermined amount of a temperature control medium therebetween, and a processing solution for each of the plurality of processing solutions used in the cleaning unit or the resist coating unit or the developing unit. A plurality of second temperature control circulating devices for maintaining the processing liquid at a predetermined temperature by performing heat exchange between the first temperature control circulating device and the second temperature control circulating device A first control device for controlling the temperature and flow rate of a temperature control medium used for cleaning the object to be processed in the apparatus; and a plurality of the first temperature control circulating devices and a second temperature control device. A second control device for controlling the temperature and flow rate of the temperature control medium used for the resist coating process on the object to be processed in the control and circulating device; and the plurality of first temperature control and circulating devices. Of the object to be processed in the temperature control circulation device 2 A third control device for controlling the temperature and flow rate of the temperature control medium used for the temperature control medium, and a temperature control for sending the liquid to the plurality of first temperature control circulating devices and the second temperature control circulating devices. A third temperature control circulating device that adjusts the medium to a constant temperature and circulates a predetermined amount of temperature control medium between the plurality of first temperature control circulating devices and the second temperature controlling circulating device; And a fourth control device provided separately from the first control device for performing temperature control and flow rate control of the temperature control medium in the temperature control circulating device of (3). 8. The third temperature control circulating device sets the temperature control medium at a temperature lower than the temperature of the temperature control medium adjusted in the plurality of first temperature control circulating devices and the second temperature control circulating device. The processing apparatus according to claim 7, wherein the processing apparatus is cooled to a constant temperature and is sent to the plurality of first temperature control circulating apparatuses and the second temperature control circulating apparatus. 9. The apparatus according to claim 7, wherein each of the first and second temperature control circulating devices includes a heater for heating a temperature control medium to be circulated. 9. The processing apparatus according to 8. 10. The processing apparatus according to claim 1, wherein a main component of the temperature control medium is water. 11. A temperature control system for performing a predetermined temperature control by supplying a temperature control medium to each processing unit in a processing apparatus having a plurality of processing units, wherein the temperature control system sends the liquid to the plurality of processing units. A first temperature adjusting and circulating device that adjusts the medium to a predetermined temperature and circulates a predetermined amount of the temperature adjusting medium between the plurality of processing units; and a temperature adjusting medium that sends the liquid to the first temperature adjusting and circulating device. And a second temperature control circulating device that circulates a predetermined amount of temperature control medium between the first temperature control circulating device and the first temperature control circulating device. A first control device that performs temperature control and flow rate control; and a second control device that is provided separately from the first control device that performs temperature control and flow rate control of a temperature control medium in the second temperature control circulating device. A temperature control system, comprising: a control device;