JP2002264026A - Abrasive cloth - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide an abrasive product having ductile resistance and durability and not occurring clogging of holes irrespective of types of base plates having different thickness. SOLUTION: Block assemblies 2 of abrasive including glue are fixed on a surface of a base material. A clearance between the assemblies 2 next to each other is 1-4 mm. The assembly 2 has a size of 4-200 nm<2> and height dimension of 0.5-5 mm. Arranging angles θ of the assemblies 2 are the same inclination within 5-60 deg.. A hook-and-loop fastener is attached to a base material rear face 3.

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a polishing cloth effectively used for vibration polishing of a printed circuit board or the like.

[0002]

2. Description of the Related Art After drilling or plating a printed wiring board, burrs, plating bumps, or projections may be formed on the surface. To remove these, a belt method, a wheel method, a vibration method, or the like is used. Removal is performed. In particular, in the case of a thin substrate, extension or warpage of the substrate is apt to occur, and a vibration method is effective as a polishing method for measures against the elongation or warpage.

[0003]

In the above-mentioned vibration method, ordinary polishing cloths and non-woven cloth abrasives are used. There is. Abrasive cloth with electrostatic sand is one in which the abrasive is fixed on the substrate with an electrostatic sand through an adhesive, and the abrasive layer can be evaluated in terms of polishing performance, but the abrasive layer is a single layer, In addition, since chips cannot be removed smoothly, there is a problem that durability is lacking, there is a problem with ductility, and animal scratches may occur.
The nonwoven fabric abrasive, in which the abrasive is fixed with an adhesive by a nonwoven fabric, has superiority in durability due to its multilayer structure, but it is dressed for the problem of sharpness and the recovery of the polishing power due to the cut end. In addition to the above, often there is a problem of clogging due to buffing generated during polishing,
There is a problem limited to the PWB (printed wiring board) to be polished. An object of the present invention is to provide a polishing product which has ductility and durability and does not cause clogging of holes in a vibration polishing method, regardless of the types of substrates having different thicknesses.

[0004]

A polishing cloth according to the present invention comprises a substrate having a block-shaped aggregate of an abrasive containing an adhesive fixed to a surface of a base material, and a gap between adjacent aggregates between the aggregates. 1 mm to 4 mm, and one size of the aggregate is 4 m
m ^{2 to} 200 mm ² , the height dimension is 0.5 mm to 5 mm, the arrangement angle θ of the assembly is the same inclination angle in the range of 5 ° to 60 °, and a surface fastener is provided on the back surface of the base material. It is characterized by being attached. At this time, the ratio of the total plane area of the aggregate to the plane area of the base material is preferably set to 44% to 86%, and alumina, silicon carbide,
Diamond and a mixture thereof are used, and the shape of the aggregate is a square, a rhombus, a round, an ellipse, or the like. In addition, as the adhesive of the aggregate, phenol resin,
The use of epoxy resins and their mixed resins is preferred.

[0005]

FIG. 1 is a perspective view of a polishing cloth according to the present invention, and FIG. 2 is a sectional view taken along line XX of FIG. 1 is cotton fabric,
A base material such as a synthetic woven fabric, a blended woven fabric, or a film thereof, and a block-shaped aggregate 2 of an abrasive containing an adhesive is fixed on the base material 1.

[0006] This again, the block-like aggregate 2 is than form one planar view size and ^{4 mm} 2 to 200 mm ^2, and its thickness height dimensions are of eggplant with 0.5 mm to 5 mm, or next The gap s between the matching aggregates 2 and 2 is 1
mm to 4 mm. The above-mentioned aggregates 2, 2
.. Are formed in a group having a fixed form, that is, in the present invention, they are formed into an aggregate having an inclination angle θ of 5 ° to 60 °.

Here, the aggregates 2, 2,... Are composed of an epoxy resin, a phenol resin, or a mixture of both, an abrasive such as alumina, silicon carbide, diamond and / or a mixture thereof, calcium carbonate, silicate, and the like. be made of a mixture of the inorganic powder, square, rhombic, round, with formed shape, such as elliptical, one size of each assembly 2, 2 is 4 mm ² to 200 mm ² And the thickness t is 0.5 mm to 5 mm.

[0008] Thus, on the back side of the substrate 1 having the above structure,
The lower substrate 3 formed with the surface fastener n is integrally fixed using a urethane resin. Here, the formation of the hook-and-loop fastener n has a remarkable effect in facilitating the replacement and removal of the polishing pad.

In the present invention, the abrasive layer is formed from a single layer to a multi-layer by fixing the aggregate of the abrasive layer containing the adhesive on the substrate without using the nonwoven fabric which causes buffing. is there. On the other hand, adjacent aggregate 2 and aggregate 2
If the gap s is less than 1 mm, the chips cannot be discharged smoothly during the polishing operation. On the other hand, if the gap is too wide, the aggregates are consumed more quickly. 4m from our experimental results
It was understood that good results could be obtained for those up to m.
On the other hand, in order to obtain sharpness, the flat area of the aggregate should be reduced in order to increase the load per unit area. On the other hand, in order to improve polishing sustainability, the flat area of the aggregate should be increased. not occupy the good, it was found that and from many experimental results by the present inventors in ^{4 mm} 2 to 200 mm ² that sets the height dimension in the range of 0.5mm~5mm obtain a good result.

In forming the above-mentioned aggregate,
If each of the assemblies is not arranged with a fixed angle, there is a problem of causing uneven contact with the cut material.
It was found that good results were obtained when the angle was within the range of 5 to 60 degrees.

[0011]

EXAMPLE A mixture of 100% by weight of an epoxy resin, 85% by weight of a particle size 600 of silicon carbide and 8% by weight of a silicate was prepared, and this was used as a block-like aggregate having a size of 3.5 mm square. None, the gap s between an assembly and an adjacent assembly is 1.5 mm, the thickness t is 1 mm, and the inclination angle θ of each assembly is 15 ° from the horizontal to the right. Then, after being molded and adhered on a polyester / cotton blend substrate, it was cured at a final curing temperature of 130 ° C. for 2 hours.
After curing, it is cut into a predetermined size (eg, 100 mm * 710 mm). Apply urethane resin to the non-brushed surface of the lower substrate with a female fastener formed on the back and this,
Both were pressure-bonded. The above product was used by engaging it with a male surface fastener on the pad surface of a vibration type polishing machine. The polishing cloth could be easily reattached and detached, and the polishing effect was as follows. After the light dressing adjustment of the pellet surface was performed first, thousands of substrates could be polished (deburring of printed circuit boards) as described below without any intermediate polishing surface dressing. (A) It is possible to achieve a uniform surface state without any difference in the initial → middle → late processing surfaces without damage to the hole side. (B) It is possible to suppress elongation of 50 μm / 500 width (0.25 mm thick substrate) or less. (C) The problem of hole clogging can be solved.

[0012]

The present invention is constituted as described above, that is, a polishing cloth is formed into a block-shaped aggregate having a special structure, and the polishing cloth is appropriately polished and detached from the pad surface of the polishing machine. It can be performed flexibly and simply according to conditions and the like. In addition, the polished surface of the block-shaped assembly can uniformly form the substrate processing surface without any difference in the initial, middle, and late stages of polishing without any damage around the holes. Thus, even with a substrate having a thickness of 0.25 mm, the elongation caused during polishing can be suppressed to 50 μm or less with a width of 500. In addition, it was possible not only to eliminate the buff residue and to solve the problem of clogging of holes or the occurrence of animal scratches, which had occurred during the process with the conventional nonwoven fabric polishing material, but also to improve the ductility.

[Brief description of the drawings]

FIG. 1 is a perspective view of a polishing cloth according to the present invention.

FIG. 2 is a sectional view taken along line XX of FIG.

[Explanation of symbols]

 DESCRIPTION OF SYMBOLS 1 Base material 2 Block-shaped aggregate 3 Lower base material

Continued on the front page F term (reference) 3C058 AA09 CA01 CB02 CB03 CB07 CB10 3C063 AA03 AB07 BA03 BA08 BA24 BB02 BB03 BB04 BC03 BG08 BG14 BG21 BH12 CC02 CC19 FF08 FF20 FF23

Claims (5)

[Claims] 1. A block-shaped aggregate of an abrasive containing an adhesive is fixed to the surface of a base material, the gap between adjacent aggregates is 1 mm to 4 mm, and one of the aggregates One size of ^{4 mm} 2 to 200 mm ^2, in addition to the height and 0.5 mm to 5 mm, arrangement angle θ of 5 ° to 60 ° range in the same inclination angle and without the assembly, also the substrate back surface A polishing cloth, characterized in that a hook-and-loop fastener is attached to the polishing cloth. 2. The polishing cloth according to claim 1, wherein the ratio of the total plane area of the aggregate to the plane area of the base material is 44% to 86%. 3. The polishing cloth according to claim 1, wherein the abrasive is alumina, silicon carbide, diamond and / or a mixture thereof. 4. The polishing cloth according to claim 1, wherein the shape of the aggregate is square, rhombic, round, or elliptical. 5. The polishing cloth according to claim 1, wherein a phenol resin, an epoxy resin and / or a mixed resin thereof are used as an adhesive for the aggregate.