JP2002248640A - Method for molding large-sized thin plate-shaped molded product - Google Patents

Method for molding large-sized thin plate-shaped molded product

Info

Publication number
JP2002248640A
JP2002248640A JP2001049791A JP2001049791A JP2002248640A JP 2002248640 A JP2002248640 A JP 2002248640A JP 2001049791 A JP2001049791 A JP 2001049791A JP 2001049791 A JP2001049791 A JP 2001049791A JP 2002248640 A JP2002248640 A JP 2002248640A
Authority
JP
Japan
Prior art keywords
molding
molded product
thickness
thin plate
preform
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP2001049791A
Other languages
Japanese (ja)
Inventor
Hideki Murayama
英樹 村山
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Sumitomo Bakelite Co Ltd
Original Assignee
Sumitomo Bakelite Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Sumitomo Bakelite Co Ltd filed Critical Sumitomo Bakelite Co Ltd
Priority to JP2001049791A priority Critical patent/JP2002248640A/en
Publication of JP2002248640A publication Critical patent/JP2002248640A/en
Pending legal-status Critical Current

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  • Casting Or Compression Moulding Of Plastics Or The Like (AREA)

Abstract

PROBLEM TO BE SOLVED: To easily mold a large-sized thin plate-shaped molded product with high accuracy in a method for molding the large-sized thin plate-shaped molded product from a thermosetting resin molding compound much in the content of a base material and low in flowability. SOLUTION: In the method for molding the large-sized thin plate-shaped molded product with a plane size of 200 cm<2> or more and a thickness of 2.5 mm or less from a thermosetting resin molding compound containing 80-95 wt.% of an inorganic or organic base material, a preformed molded object, which is molded so as to have a size being 95-100% of the plane size of the molded product and the thickness of the peripheral part of the molded object to the thickness 1 of the center part thereof of 1.1-1.4, is used to be subjected to compression molding.

Description

【発明の詳細な説明】DETAILED DESCRIPTION OF THE INVENTION

【0001】[0001]

【発明の属する技術分野】本発明は、基材含有割合が多
く、流動性の小さい成形材料を用いて大型の薄板形状成
形品を容易に且つ、高精度に成形する方法に関するもの
である。本発明の成形方法は、例えば、基材として黒鉛
を多量に含有する燃料電池用セパレータの成形に好適に
用いられる。
BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a method for easily and accurately forming a large thin plate-shaped molded product using a molding material having a large content of a base material and low fluidity. The molding method of the present invention is suitably used, for example, for molding a fuel cell separator containing a large amount of graphite as a base material.

【0002】[0002]

【従来の技術】一般に熱硬化性樹脂成形品を得ようとす
る場合、破砕状または顆粒状である成形材料を用いて圧
縮成形、トランスファー成形またはインジェクション成
形により成形している。しかし、基材含有割合が多く、
流動性の小さい成形材料を用いて大型で薄板形状の成形
品を得ようとする場合、通常の成形方法では材料の流動
性が十分ではなく、成形性に問題を生じることがあるた
め、予め成形品平面サイズの40〜100%の板状予備
成形体を成形し、この予備成形体を成形型内で加圧成形
することにより充填不足や圧縮時の金型の変形による寸
法精度低下を防ぐ方法がとられることがある。
2. Description of the Related Art Generally, when a thermosetting resin molded product is to be obtained, it is molded by compression molding, transfer molding or injection molding using a crushed or granular molding material. However, the base material content ratio is large,
When trying to obtain a large, thin plate-shaped molded product using a molding material with low fluidity, the usual molding method does not have sufficient fluidity and may cause problems in moldability. A method of forming a plate-shaped preform having a size of 40 to 100% of the product plane size and press-forming the preform in a molding die to prevent dimensional accuracy deterioration due to insufficient filling or deformation of the mold during compression. May be taken.

【0003】しかし、基材の含有量が80〜95重量%
であるような基材が高充填された成形材料の場合、流動
性が極めて小さいために板状の平面予備成形体を用いて
成形する方法でも、成形性を確保するためには成形品平
面サイズのほぼ100%の面積を有する予備成形体が必
要となる。しかし、このような予備成形体を金型に投入
する際には金型壁面と予備成形体との間の隙間がないた
めに、予備成形体が破損することがあり、作業性の面で
必ずしも満足のゆくものではなかった。
However, the content of the base material is 80 to 95% by weight.
In the case of a molding material that is highly filled with a base material such as that described above, the flowability is extremely small, so even with a method of molding using a plate-shaped planar preform, in order to ensure moldability, the molded product planar size A preform having an area of almost 100% of the above is required. However, when such a preform is put into a mold, there is no gap between the mold wall surface and the preform. It was not satisfactory.

【0004】このような問題を回避するためには平面予
備成形体のサイズを成形品の98%以下に小さくして金
型壁面と予備成形体との隙間を開けるようにすることが
考えられるが、この方法では成形品の周辺部が充填しな
かったり、中央部が厚くなったりする不具合が生じるこ
とがあった。
In order to avoid such a problem, it is conceivable to reduce the size of the planar preform to 98% or less of the molded product so as to provide a gap between the mold wall surface and the preform. However, in this method, there are cases where the peripheral portion of the molded product is not filled or the central portion becomes thick.

【0005】[0005]

【発明が解決しようとする課題】本発明は、基材含有割
合が多く、流動性の小さい熱硬化性樹脂成形材料による
大型の薄板成形品の成形方法に関して、上記のような欠
点を改良するものであり、従来では難しかった大型の薄
板状成形品を容易に、且つ高精度に成形する方法を提供
するものである。
SUMMARY OF THE INVENTION The present invention is directed to a method of forming a large thin plate formed from a thermosetting resin molding material having a high content of a base material and a low fluidity, which has the above-mentioned disadvantages. It is another object of the present invention to provide a method for easily and accurately forming a large thin plate-like molded product, which has been difficult in the past.

【0006】[0006]

【課題を解決するための手段】本発明は、無機基材また
は有機基材を80〜95重量%含有する熱硬化性樹脂成
形材料を、平面サイズ200cm2 以上、厚さ2.5m
m以下の大型薄板状成形品に成形する方法において、成
形品平面サイズの95〜100%のサイズを有し、中心
部の厚さ1に対して周辺部の厚さが1.1〜1.4にな
るように成形した予備成形体を用いて圧縮成形すること
を特徴とする大型薄板状成形品の成形方法である。
According to the present invention, a thermosetting resin molding material containing 80 to 95% by weight of an inorganic base material or an organic base material is prepared by using a thermosetting resin molding material having a plane size of 200 cm 2 or more and a thickness of 2.5 m.
m, which has a size of 95 to 100% of the planar size of the molded product, and a thickness of 1.1 to 1. 4 is a method for molding a large thin plate-shaped molded product, which is performed by compression molding using a pre-formed body molded to be 4.

【0007】[0007]

【発明の実施の形態】本発明は、基材含有割合が多く成
形時の流動性が小さい成形材料を用いて、平面サイズ2
00cm2 以上、厚さ2.5mm以下の成型品を成形す
る方法を提供することにある。通常、かかる形状を有す
る成形品を寸法精度良く成形するのが困難であり、一
方、平面サイズ200cm2 未満、厚さ2.5mmを越
える成型品については、通常の成型方法で外観が良好で
寸法安定精度良く成形できるからである。本発明は成形
品の平面サイズと同等もしくは若干小さな予備成形体を
用いて、できるだけ成形時の材料の流動距離を小さくす
ることと、予備成形体の厚さを周辺部で厚く、中心部で
薄くすることにより、大型の薄板状成形品を容易に且
つ、高精度に成形する方法を提供するものである。
BEST MODE FOR CARRYING OUT THE INVENTION The present invention uses a molding material having a large content of a base material and a low fluidity during molding, and a planar size of 2%.
It is an object of the present invention to provide a method for molding a molded product having a thickness of not less than 00 cm 2 and not more than 2.5 mm. Usually, it is difficult to mold a molded article having such a shape with high dimensional accuracy, while a molded article having a plane size of less than 200 cm 2 and a thickness of more than 2.5 mm has a good appearance and a dimensional size by a normal molding method. This is because molding can be performed with high stability and accuracy. The present invention uses a preform that is equal to or slightly smaller than the plane size of the molded product to reduce the flow distance of the material during molding as much as possible, and makes the thickness of the preform thicker at the periphery and thinner at the center. By doing so, it is possible to provide a method for easily and accurately forming a large thin plate-like molded product.

【0008】予備成形体のサイズは成形材料の流動性を
補完するために成形品の平面サイズに極力近いことが必
要である。従って、予備成形体の平面サイズは成形品に
対して95〜100%であることが好ましいが、従来の
技術の欄で述べたように、成形作業の効率を考えるとあ
る程度金型壁面と予備成形体の隙間は確保したほうがよ
いので、予備成形体の平面サイズはより好ましくは95
〜98%である。
[0008] The size of the preform must be as close as possible to the planar size of the molded product in order to complement the fluidity of the molding material. Therefore, the plane size of the preformed body is preferably 95 to 100% with respect to the formed product. Since it is better to secure a gap between the bodies, the plane size of the preformed body is more preferably 95%.
~ 98%.

【0009】基材を高い割合で充填した流動性が小さい
成形材料は、平面状の予備成形体を成形すると成形品周
辺部において充填不足気味となり、周辺部厚みが薄く、
必要な厚み精度が得られないことが多い。そのために中
心部の厚みを1とすると周辺部の厚みを1.1〜1.4
になるような傾斜を持たせた断面形状にするのが好まし
い。厚み比が1.1より小さい場合は周辺部で未充填と
なることがあり、1.4を超える場合は中心部の厚みが
薄くなりやすく、十分な厚み精度が得られないことがあ
る。
A molding material having a low flowability filled with a high proportion of a base material tends to be insufficiently filled at the peripheral portion of the molded product when a planar preform is molded, and the peripheral portion has a small thickness.
In many cases, required thickness accuracy cannot be obtained. Therefore, assuming that the thickness of the central portion is 1, the thickness of the peripheral portion is 1.1 to 1.4.
It is preferable that the cross-sectional shape has a slope such that When the thickness ratio is less than 1.1, the peripheral portion may be unfilled, and when it exceeds 1.4, the thickness of the central portion tends to be thin and sufficient thickness accuracy may not be obtained.

【0010】基材含有量が85重量%を超え、95重量
%以下の成形材料や成形品の厚みが1.0mm以上1.
5mm未満、平面サイズが300cm2 を超えるなどの
ように、充填しにくい条件では、予備成形体の厚み比は
より厳密に調整する必要があり、予備成形体の前記厚み
比は、好ましくは1.2〜1.3である。一方、基材含
有量が80重量%以上85重量%以下の成形材料や成形
品の厚みが1.5mm以上2.5mm以下、平面サイズ
が200cm2以上300cm2以下の比較的充填しやす
い条件では、材料の流動性がよいために予備成形体の中
心部と周辺部の厚み比は1.1〜1.4の範囲で選択す
ればよい。
The thickness of a molding material or molded article having a substrate content of more than 85% by weight and not more than 95% by weight is 1.0 mm or more.
Under conditions that are difficult to fill, such as less than 5 mm and a plane size exceeding 300 cm 2 , the thickness ratio of the preform needs to be more strictly adjusted, and the thickness ratio of the preform is preferably 1. 2 to 1.3. On the other hand, under the condition that the thickness of a molding material or a molded article having a base material content of 80% by weight or more and 85% by weight or less and a thickness of 1.5 mm or more and 2.5 mm or less and a plane size of 200 cm 2 or more and 300 cm 2 or less is relatively easy to fill. The thickness ratio of the central portion to the peripheral portion of the preform may be selected in the range of 1.1 to 1.4 because the material has good fluidity.

【0011】予備成形体を成形するための金型は、通常
予備成形体の中心部の厚み1に対して周辺部の厚みが
1.1〜1.4になるように、下型のキャビティ面を加
工する。形状としてはその中心に頂点を有する四角錐や
円錐、または周辺部だけ厚みを増したような形状などが
考えられるが特に限定されず、成形品や成形材料の種類
によって選択できる。上型は通常の平らな形状でよい。
金型に成形材料を投入する際には下型に材料が平らにな
らしてから成形することが望ましい。投入した材料が平
らでないと予備成形体の密度が不均一となり、成形品の
厚み精度が得られない。
The mold for molding the preform is usually provided with a cavity surface of the lower mold so that the thickness of the peripheral portion is 1.1 to 1.4 with respect to the thickness of the central portion of the preform. To process. The shape may be a quadrangular pyramid or a cone having an apex at the center thereof, or a shape in which the thickness is increased only at the peripheral portion. However, the shape is not particularly limited, and can be selected depending on the type of a molded product or a molding material. The upper mold may have a normal flat shape.
When the molding material is charged into the mold, it is desirable that the material be leveled in the lower mold before molding. If the input material is not flat, the density of the preform becomes uneven, and the thickness accuracy of the molded product cannot be obtained.

【0012】本発明において用いる成形材料に配合する
熱硬化性樹脂は、特に限定されないが、例えば、フェノ
ール樹脂、エポキシ樹脂、不飽和ポリエステル樹脂、ジ
アリルフタレート樹脂等が使用できる。また、基材につ
いても特に限定されないが、木紛、ガラス繊維、ガラス
ビーズ、シリカ、黒鉛などが使用できる。
The thermosetting resin to be added to the molding material used in the present invention is not particularly limited. For example, a phenol resin, an epoxy resin, an unsaturated polyester resin, a diallyl phthalate resin and the like can be used. The substrate is not particularly limited, but wood powder, glass fiber, glass beads, silica, graphite, and the like can be used.

【0013】本発明において使用する熱硬化性樹脂成形
材料を製造する方法は、通常の方法が採用される。即
ち、樹脂、基材のほか、必要に応じて硬化剤、硬化助
剤、顔料、離型剤等を加えて混合した後、加熱ロール等
により溶融混練し、冷却後粉砕して製造する。
As a method for producing the thermosetting resin molding material used in the present invention, an ordinary method is employed. That is, after adding and mixing a resin, a base material, and if necessary, a curing agent, a curing assistant, a pigment, a release agent, and the like, melt kneading with a heating roll or the like;

【0014】次に予備成形体を成形するための成形条件
について規定する。予備成形体の成形は硬化が進行しな
いような低い温度で行わなければならないため、成形材
料が十分に溶融しなくても成形できる圧縮成形が最適で
ある。成形温度は40〜90℃が望ましい。40℃未満
では成形材料の粒子間の密着性が乏しいため大型の薄板
状予備成形体になりにくい。また、90℃を超えると金
型と成形材料との密着性が増大し、予備成形体の離型性
が阻害される。成形圧は200〜300kg/cm2
適当である。
Next, the molding conditions for molding the preformed body will be specified. Since the molding of the preform must be performed at a low temperature at which the curing does not proceed, compression molding that can be molded without sufficiently melting the molding material is optimal. The molding temperature is preferably from 40 to 90 ° C. If the temperature is lower than 40 ° C., the adhesion between particles of the molding material is poor, so that it is difficult to form a large thin plate-shaped preform. On the other hand, when the temperature exceeds 90 ° C., the adhesion between the mold and the molding material increases, and the releasability of the preform is hindered. The molding pressure is suitably 200 to 300 kg / cm 2 .

【0015】このようにして得られた予備成形体を通常
の圧縮成形機に投入して成形する。例えば、金型温度1
70〜200℃、成形圧力500〜800kgf/cm
2の条件で、300×300×2.0mmの大きさの成
形品を容易に得ることができる。
The thus obtained preform is put into a usual compression molding machine and molded. For example, mold temperature 1
70-200 ° C, molding pressure 500-800kgf / cm
Under the condition 2 , a molded product having a size of 300 × 300 × 2.0 mm can be easily obtained.

【0016】[0016]

【実施例】以下に本発明を実施例により詳しく説明す
る。
The present invention will be described below in more detail with reference to examples.

【0017】<実施例1>成形材料として黒鉛粉85重
量%、レゾール型フェノール樹脂14重量%、離型剤
(ステアリン酸)1重量%からなるフェノール樹脂成形
材料を使用する。生産段階もしくは後工程で衝撃式粉砕
機等を用いて粒度を3mm以下に調整する。この成形材
料350gを60℃に設定した290×290mmのキ
ャビティをもち、下型形状が四角錐である予備成形金型
に均一に投入する。上型を型締め圧300kgf/cm
2 で約1分間型締めを行い、中心部が2.0mm、周辺
部が2.4mmである予備成形体を作製し、型形状30
0×300mm、深さ2.0mmの金型の中央に配置
し、金型温度170℃、成形圧力300kgf/cm
2 、成形時間3分で圧縮成形して300×300×1.
8mmの成形品を得た。
Example 1 A phenol resin molding material comprising 85% by weight of graphite powder, 14% by weight of a resol type phenol resin and 1% by weight of a release agent (stearic acid) is used as a molding material. The particle size is adjusted to 3 mm or less in a production stage or a post-process using an impact-type pulverizer or the like. 350 g of this molding material is uniformly charged into a preforming die having a 290 × 290 mm cavity set at 60 ° C. and a lower die shape of a quadrangular pyramid. The upper mold is clamped at 300kgf / cm
2 for about 1 minute to produce a preform having a center portion of 2.0 mm and a peripheral portion of 2.4 mm.
Placed at the center of a mold having a size of 0 × 300 mm and a depth of 2.0 mm, a mold temperature of 170 ° C. and a molding pressure of 300 kgf / cm
2. Compression molding in 3 minutes molding time 300 × 300 × 1.
An 8 mm molded product was obtained.

【0018】<実施例2>予備成形体形状が中心部で
2.1mm、周辺部で2.3mmである予備成形体を用
いた以外は実施例1と同じ方法で300×300×1.
8mmの成形品を成形した。
<Example 2> A preform having a shape of 300 mm x 300 mm x 1.1 mm was used in the same manner as in Example 1 except that a preform having a shape of 2.1 mm at the center and 2.3 mm at the periphery was used.
An 8 mm molded article was molded.

【0019】<実施例3>黒鉛粉90重量%、レゾール
型フェノール樹脂7重量%、離型剤(ステアリン酸)3
重量%からなるフェノール樹脂成形材料を使用した以外
は実施例1と同じ方法で300×300×1.8mmの
成形品を成形した。
Example 3 90% by weight of graphite powder, 7% by weight of resol type phenol resin, release agent (stearic acid) 3
A molded product having a size of 300 × 300 × 1.8 mm was molded in the same manner as in Example 1 except that a phenol resin molding material consisting of weight% was used.

【0020】<比較例1>290×290×2.0mm
の平面状予備成形体を用いた以外は実施例1と同じ方法
で300×300×1.8mmの成形品を成形した。
Comparative Example 1 290 × 290 × 2.0 mm
A molded product of 300 × 300 × 1.8 mm was molded in the same manner as in Example 1 except that the planar preform was used.

【0021】<比較例2>予備成形体のサイズを270
×270mmとした以外は実施例1と同じ方法で300
×300×1.8mmの成形品を成形した。
<Comparative Example 2> The size of the preform was 270
X 300 mm in the same manner as in Example 1 except that
A molded product of × 300 × 1.8 mm was molded.

【0022】<比較例3>予備成形体の厚みを中心部で
1.8mm、周辺部で2.7mmとした以外は実施例1
と同じ方法で300×300×1.8mmの成形品を成
形した。
Comparative Example 3 Example 1 was repeated except that the thickness of the preform was 1.8 mm at the center and 2.7 mm at the periphery.
A molded product of 300 × 300 × 1.8 mm was molded in the same manner as in the above.

【0023】実施例、比較例で得られた成形品の特性を
表1に示す。
Table 1 shows the characteristics of the molded articles obtained in the examples and comparative examples.

【表1】 [Table 1]

【0024】(測定方法) 1.充填性:完全充填したものを○、一部でも未充填部
があるものは×とした。 2.厚み精度:成形品の中央部と四隅の厚みをマイクロ
メーターで測定し、その最 大値と最小値の差を厚み
精度とした。
(Measurement method) Fillability: Completely filled was evaluated as ○, and even partially unfilled was evaluated as ×. 2. Thickness accuracy: The thickness at the center and four corners of the molded product was measured with a micrometer, and the difference between the maximum value and the minimum value was defined as the thickness accuracy.

【0025】表1から明らかなように、実施例1〜3で
は、予備成形体の厚みを1.1〜1.2、成型品に対す
る予備成形体の面積比率を93%としており、成形品の
充填性、厚み精度とも良好であった。比較例1は、平面
状の予備成形体を用いたため周辺部に充填不良が発生
し、厚み精度が悪化した。比較例2では、予備成形体の
厚み比は1.2であるが、面積比率が81%と小さいた
め、厚み精度は良好であったものの周辺部に充填不良が
発生した。また、比較例3では厚み比を1.5としたた
め、成型品中央部に充填不良が発生し、厚み精度も劣る
ものとなった。
As is clear from Table 1, in Examples 1 to 3, the thickness of the preform is 1.1 to 1.2, and the area ratio of the preform to the molded product is 93%. Both fillability and thickness accuracy were good. In Comparative Example 1, since the planar preform was used, defective filling occurred in the peripheral portion, and the thickness accuracy was deteriorated. In Comparative Example 2, although the thickness ratio of the preformed body was 1.2, the area ratio was as small as 81%, so that the thickness accuracy was good, but filling failure occurred in the peripheral portion. Further, in Comparative Example 3, since the thickness ratio was set to 1.5, poor filling occurred at the center of the molded product, resulting in poor thickness accuracy.

【0026】[0026]

【発明の効果】本発明は、無機基材または有機基材を8
0〜95重量%含有する熱硬化性樹脂成形材料を、平面
サイズ200cm2 以上、厚さ2.5mm以下の大型薄
板状成形品に成形する方法において、成形品平面サイズ
の95〜100%のサイズを有し、中心部の厚さ1に対
して周辺部の厚さが1.1〜1.4になるように成形し
た予備成形体を用いて圧縮成形することを特徴とする大
型薄板状成形品の成形方法であり、基材含有割合が多い
熱硬化性樹脂成形材料において成形時の流動性不足を補
完し、大型で薄板状の成形品を容易に且つ高精度に成形
することが出来る。このように本発明は工業的な成形方
法として好適である。
According to the present invention, an inorganic substrate or an organic substrate is used.
In a method of molding a thermosetting resin molding material containing 0 to 95% by weight into a large thin plate-shaped molded product having a planar size of 200 cm 2 or more and a thickness of 2.5 mm or less, a size of 95 to 100% of the planar size of the molded product. Compression molding using a preformed body formed so that the thickness of the peripheral portion is 1.1 to 1.4 with respect to the thickness of 1 at the central portion. This is a molding method of a product, and can compensate for insufficient fluidity during molding in a thermosetting resin molding material having a large content of a base material, and can easily and highly precisely mold a large thin plate-like molded product. Thus, the present invention is suitable as an industrial molding method.

Claims (1)

【特許請求の範囲】[Claims] 【請求項1】無機基材または有機基材を80〜95重量
%含有する熱硬化性樹脂成形材料を、平面サイズ200
cm2 以上、厚さ2.5mm以下の大型薄板状成形品に
成形する方法において、成形品平面サイズの95〜10
0%のサイズを有し、中心部の厚さ1に対して周辺部の
厚さが1.1〜1.4になるように成形した予備成形体
を用いて圧縮成形することを特徴とする大型薄板状成形
品の成形方法。
1. A thermosetting resin molding material containing 80 to 95% by weight of an inorganic base material or an organic base material is prepared by a method using a flat plate having a plane size of 200%.
cm 2 or more and a thickness of 2.5 mm or less in the method of molding into a large thin plate-like molded product, the molded product plane size of 95-10
It is characterized by being compression molded using a preform having a size of 0% and a thickness of 1.1 to 1.4 at a peripheral portion with respect to a thickness of 1 at a central portion. A molding method for large thin plate-like molded products.
JP2001049791A 2001-02-26 2001-02-26 Method for molding large-sized thin plate-shaped molded product Pending JP2002248640A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP2001049791A JP2002248640A (en) 2001-02-26 2001-02-26 Method for molding large-sized thin plate-shaped molded product

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2001049791A JP2002248640A (en) 2001-02-26 2001-02-26 Method for molding large-sized thin plate-shaped molded product

Publications (1)

Publication Number Publication Date
JP2002248640A true JP2002248640A (en) 2002-09-03

Family

ID=18910848

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2001049791A Pending JP2002248640A (en) 2001-02-26 2001-02-26 Method for molding large-sized thin plate-shaped molded product

Country Status (1)

Country Link
JP (1) JP2002248640A (en)

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