JP2002246528A5 - - Google Patents

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Publication number
JP2002246528A5
JP2002246528A5 JP2001036827A JP2001036827A JP2002246528A5 JP 2002246528 A5 JP2002246528 A5 JP 2002246528A5 JP 2001036827 A JP2001036827 A JP 2001036827A JP 2001036827 A JP2001036827 A JP 2001036827A JP 2002246528 A5 JP2002246528 A5 JP 2002246528A5
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JP
Japan
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP2001036827A
Other languages
Japanese (ja)
Other versions
JP4570797B2 (en
JP2002246528A (en
Filing date
Publication date
Application filed filed Critical
Priority to JP2001036827A priority Critical patent/JP4570797B2/en
Priority claimed from JP2001036827A external-priority patent/JP4570797B2/en
Publication of JP2002246528A publication Critical patent/JP2002246528A/en
Publication of JP2002246528A5 publication Critical patent/JP2002246528A5/ja
Application granted granted Critical
Publication of JP4570797B2 publication Critical patent/JP4570797B2/en
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

Links

JP2001036827A 2001-02-14 2001-02-14 Manufacturing method of semiconductor device Expired - Fee Related JP4570797B2 (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP2001036827A JP4570797B2 (en) 2001-02-14 2001-02-14 Manufacturing method of semiconductor device

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2001036827A JP4570797B2 (en) 2001-02-14 2001-02-14 Manufacturing method of semiconductor device

Publications (3)

Publication Number Publication Date
JP2002246528A JP2002246528A (en) 2002-08-30
JP2002246528A5 true JP2002246528A5 (en) 2008-04-03
JP4570797B2 JP4570797B2 (en) 2010-10-27

Family

ID=18900046

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2001036827A Expired - Fee Related JP4570797B2 (en) 2001-02-14 2001-02-14 Manufacturing method of semiconductor device

Country Status (1)

Country Link
JP (1) JP4570797B2 (en)

Families Citing this family (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US7195953B2 (en) 2003-04-02 2007-03-27 Yamaha Corporation Method of manufacturing a semiconductor package using a lead frame having through holes or hollows therein
JP4055158B2 (en) 2003-05-28 2008-03-05 ヤマハ株式会社 Lead frame and semiconductor device provided with lead frame
JP2006179760A (en) 2004-12-24 2006-07-06 Yamaha Corp Semiconductor package and lead frame used therefor

Family Cites Families (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5632461U (en) * 1979-08-18 1981-03-30
JPS6265445A (en) * 1985-09-18 1987-03-24 Hitachi Hokkai Semiconductor Ltd Lead frame
JPH03296254A (en) * 1990-02-06 1991-12-26 Dainippon Printing Co Ltd Lead frame
JPH06120398A (en) * 1992-10-08 1994-04-28 Toshiba Corp Lead frame

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