JP2002246528A5 - - Google Patents
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- Publication number
- JP2002246528A5 JP2002246528A5 JP2001036827A JP2001036827A JP2002246528A5 JP 2002246528 A5 JP2002246528 A5 JP 2002246528A5 JP 2001036827 A JP2001036827 A JP 2001036827A JP 2001036827 A JP2001036827 A JP 2001036827A JP 2002246528 A5 JP2002246528 A5 JP 2002246528A5
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Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2001036827A JP4570797B2 (en) | 2001-02-14 | 2001-02-14 | Manufacturing method of semiconductor device |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2001036827A JP4570797B2 (en) | 2001-02-14 | 2001-02-14 | Manufacturing method of semiconductor device |
Publications (3)
Publication Number | Publication Date |
---|---|
JP2002246528A JP2002246528A (en) | 2002-08-30 |
JP2002246528A5 true JP2002246528A5 (en) | 2008-04-03 |
JP4570797B2 JP4570797B2 (en) | 2010-10-27 |
Family
ID=18900046
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2001036827A Expired - Fee Related JP4570797B2 (en) | 2001-02-14 | 2001-02-14 | Manufacturing method of semiconductor device |
Country Status (1)
Country | Link |
---|---|
JP (1) | JP4570797B2 (en) |
Families Citing this family (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US7195953B2 (en) | 2003-04-02 | 2007-03-27 | Yamaha Corporation | Method of manufacturing a semiconductor package using a lead frame having through holes or hollows therein |
JP4055158B2 (en) | 2003-05-28 | 2008-03-05 | ヤマハ株式会社 | Lead frame and semiconductor device provided with lead frame |
JP2006179760A (en) | 2004-12-24 | 2006-07-06 | Yamaha Corp | Semiconductor package and lead frame used therefor |
Family Cites Families (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS5632461U (en) * | 1979-08-18 | 1981-03-30 | ||
JPS6265445A (en) * | 1985-09-18 | 1987-03-24 | Hitachi Hokkai Semiconductor Ltd | Lead frame |
JPH03296254A (en) * | 1990-02-06 | 1991-12-26 | Dainippon Printing Co Ltd | Lead frame |
JPH06120398A (en) * | 1992-10-08 | 1994-04-28 | Toshiba Corp | Lead frame |
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2001
- 2001-02-14 JP JP2001036827A patent/JP4570797B2/en not_active Expired - Fee Related