JP2002240048A - Resin curing method and apparatus therefor - Google Patents

Abstract

PROBLEM TO BE SOLVED: To efficiently prevent a temperature drop at the alteration part of a feed state. SOLUTION: A resin curing method has a tape supply and discharge process for supplying a feed tape 5 coated with a resin 4 for sealing an element 3 from the tape inlet 41 of a furnace body 2 and discharging the same from the tape outlet 42 of the furnace body 2, and a heating and curing process for heating and curing the resin 4 in the furnace body 2 while reversing the sending direction of the feed tape 5 by feed state alteration means 6 and 7 during the tape supply and discharge process. In the heating and curing process, heaters 11, 12 and 13 for horizontal feed passages are arranged to the horizontal feed passages 8, 9 and 10 through which the feed tape 5 is moved horizontally, heaters 14 and 15 for the feed state alteration parts are further arranged in the feed state alteration regions where the feed tape 5 is turned back by the feed state alteration means 6 and 7 so as to be set under the feed state alteration means 6 and 7, and the feed tape 5 is heated by the respective heaters 11, 12, 13, 14 and 15. A resin curing apparatus is adapted to the resin curing method.

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a resin curing method and a resin curing device for sealing an element of a transport tape with a resin and heating and curing the sealed resin.

[0002]

2. Description of the Related Art Conventionally, when a sealed resin is cured by heating, the resin on the transport tape is directly heated and cured by using a far-infrared heater as a heating element, or directly heated by hot air. And curing.

In this conventional method, the resin is directly heated by far-infrared rays or warm air, so that the quality of the resin called "burn" is changed on the surface of the resin or the shape of the resin is frequently deformed. . In particular, there is a problem that the resin surface is hardened quickly due to direct heating, and when the solvent trapped by the hardened film on the surface evaporates, the hardened film is pushed up, causing a quality defect called swelling. Was. In addition, since the peripheral part of the resin is quickly cured by heating,
There was also a problem that the resin in the peripheral portion could not go around to the surface of the transport tape, the adhesion to the transport tape was poor, and the resin peeled off.

In order to solve such a problem, the present applicant has previously made an invention relating to indirect heating (Japanese Patent Laid-Open No. 7-1).
No. 78368). Although the above-mentioned problem has been solved by this application, the conveying tape is folded back by the reversing means and moved upward by one stage, and in the case of a multi-stage type furnace, there is no heater at the reversing portion of the conveying tape, and this reversing is performed. The temperature decreased in the portion, and cracks and the like occurred in the resin.

To cope with such a problem in the inverted portion, Japanese Utility Model Laid-Open Publication No. 5-57846 and Japanese Unexamined Patent Publication No.
In some cases, a technique disclosed in Japanese Patent No. 21488 is adopted. That is, a heater is arranged on the side of the inverted portion where the transport tape is folded, and the sealing resin is heated to a higher temperature as the transport tape moves to the upper stage.

[0006]

However, the technique disclosed in Japanese Utility Model Laid-Open Publication No. 5-57846 in which a heater for heating is arranged at the reversal portion has the following problems when it is intended to heat the transport tape uniformly. Have a point. The amount of far-infrared rays reaching the transport tape from the heater is approximately inversely proportional to the square of the distance. Therefore, in order to heat the transport tape traveling along the curvature of the reversing means substantially uniformly at the far position and the near position with the flat heater, the distance between the transport tape and the heater is 300 mm or more, depending on the curvature. I need. Further, the sum of the thickness of the heater and the mounting jig of the heater is approximately 50 mm. In the technique disclosed in Japanese Utility Model Application Laid-Open No. 5-57846, in which a heater for heating is disposed at the reversal portion, there are two reversing portions, so that the furnace length is longer than when the heating heater is not disposed at the reversing portion. Approx. 700 mm
Is also longer. At present, when miniaturization is required, this increase in furnace length is a major problem.

On the other hand, the technique of disposing a curved surface heater at the reversal portion shown in Japanese Patent Application Laid-Open No. Hei 5-21488 is excellent in that the furnace length is not significantly increased. However, a curved heater adapted to the curvature of the cure guide is extremely expensive compared to a flat heater, and it is not easy to attach the curved heater so that the distance to the transport tape is constant, and workability is not good. Inferior in terms of aspect.

SUMMARY OF THE INVENTION The present invention has been made to solve the above-mentioned problems, and an object of the present invention is to provide a resin curing method and a resin curing apparatus capable of reliably and efficiently heating a portion where a conveyance state is changed, such as inversion. Aim.

[0009]

In order to achieve the above object, a method for curing a resin according to the present invention comprises the steps of: supplying a transfer tape coated with a resin for sealing an element from a tape inlet of a furnace body; A tape supply / discharge step of discharging from the tape outlet of the body, and a heat curing step of heating and curing the resin in the furnace while reversing the feed direction of the transport tape by the transport state changing means during the tape supply / discharge step, In the resin curing method having a heating and curing step, the transporting tape is folded back by the transporting state changing means while disposing the heating element for the horizontal transporting path in the horizontal transporting path in which the transporting tape moves horizontally, A heating element for the transfer state changing unit is further arranged below the transfer state changing means, and the heating tape is heated by each heating element.

[0010] Therefore, the heating element for the transfer state changing unit disposed in the transfer state change area efficiently heats the transfer tape turned back by the transfer state changing means without increasing the furnace length. As a result, a temperature drop in the conveyance state changing portion is less likely to occur, and the conveyance tape can be heated at a constant temperature, and the quality of resin curing is stabilized. In addition, since it becomes easy to maintain each location in the furnace at the set temperature, it is possible to perform heating that matches the characteristics of the resin and the quality of the transport tape.

[0011] A resin curing method according to another aspect of the present invention includes a tape supply / discharge step of supplying a transport tape coated with a resin for sealing an element from a tape inlet of a furnace body and discharging the tape from a tape outlet of the furnace body. A heating and curing step of heating and curing the resin during the tape supply and discharge step, wherein in the heating and curing step, a heating element for a horizontal transport path is disposed on a horizontal transport path in which the transport tape moves horizontally. In addition, a heating state for the conveyance state changing unit is further arranged below the conveyance state changing means in the conveyance state change area where the conveyance state of the conveyance tape is changed by the conveyance state changing means, and the conveyance tape is heated by each heating element. are doing.

With this configuration, the heating element for the transfer state changing unit disposed in the transfer state change area efficiently heats the transfer tape whose transfer state is changed by the transfer state changing unit without increasing the furnace length. Become. As a result, a temperature drop in the conveyance state changing area is less likely to occur, and the conveyance tape can be heated at a constant temperature, so that the quality of the cured resin is stabilized. In addition, since it becomes easy to maintain each location in the furnace at the set temperature, it is possible to perform heating that matches the characteristics of the resin and the quality of the transport tape.

According to another aspect of the present invention, in addition to the resin curing method of each of the above-described inventions, in the heating and curing step, the horizontal transport path and the transport state changing area are heated by the horizontal transport path heating element and the transport state changing section heating element. The temperature at which the transport tape is heated is set within ± 5 ° C. with respect to the same predetermined temperature. By such a method, each place in the furnace body has a constant temperature, and the resin can be cured at the constant temperature, and the resin can be cured with stable quality.

In still another aspect of the invention, in addition to the resin curing method of each of the above-described inventions, a heating element for a transport state changing unit is disposed immediately below a point where the transport state of the transport tape changes. For this reason, the transport tape at the transport state change point where the problem is likely to occur is reliably and efficiently heated by the transport state change section heating element. This heating is performed by convection generated by heating by the heating element for the transfer state changing unit and radiant heat from the heating element for the transfer state changing unit.

According to another aspect of the present invention, in addition to the resin curing method of each of the above-described inventions, the present invention covers the transport tape being transported by the transport state changing means and receives heat from the heating element for the transport state changing section to transport the tape. A hot plate for indirectly heating the tape is provided in the transport state change area, and indirect heating is performed in this area. For this reason, burns, blisters, peeling off from the tape, and the like, which are adverse effects of direct heating, do not occur in the transport state change area where folding is performed. Since the transport state change area is a portion where these adverse effects are most likely to occur, it is very preferable that the above-mentioned adverse effects do not occur in terms of quality stability.

Still another aspect of the present invention provides, in addition to the resin curing method of each of the above-described aspects, a plurality of transport state changing means for folding back the transport tape, and three or more horizontal transport paths which are vertically stacked to form three or more horizontal transport paths. Heating is performed in each of the transport path and each transport state change area. As described above, by heating the transport tape in the horizontal transport path stacked in three or more stages, the heat for heating can be effectively used. In addition, since both sides of the transport tape are heated evenly, the resin curing becomes stable.

In order to achieve the above object, the resin curing device of the present invention is provided with a tape inlet through which a transport tape coated with a resin for sealing an element is supplied into a furnace, and a feed direction of the transport tape. In a resin curing device having transport state changing means for inverting, heating and curing means disposed in the furnace for heating and curing the resin, and a tape outlet for discharging the transport tape to the outside of the furnace, the transport tape is used as the heat curing means. A heating element for a horizontal transport path disposed in a horizontal transport path that moves horizontally, and a transport disposed in a transport state changing area where the transport tape is folded back by the transport state changing means and positioned below the transport state changing means; A heating element for the state changing section is provided, and the heating tape is heated by each heating element.

When this resin curing device is used, the heating element for the transfer state changing unit disposed in the transfer state change area efficiently warms the transfer tape folded back by the transfer state changing means without lengthening the furnace. Becomes As a result, a temperature drop in the conveyance state changing area is less likely to occur, and the conveyance tape can be heated at a constant temperature, so that the quality of the cured resin is stabilized. In addition, since it becomes easy to maintain each location in the furnace at the set temperature, it is possible to perform heating that matches the characteristics of the resin and the quality of the transport tape.

A resin curing apparatus according to another aspect of the present invention includes a tape inlet to which a transport tape coated with a resin for sealing an element is supplied, and a heat-curing means disposed therein for heating and curing the resin; In a resin curing device having a tape outlet for discharging a transport tape, a heating element for a horizontal transport path disposed in a horizontal transport path in which the transport tape moves horizontally, as a heating and curing means, Heating elements for a conveying state changing unit are provided in a conveying state changing area where the conveying state is changed and are located below the conveying state changing means, and the conveying tape is heated by each heat generating element.

When this resin curing device is used, without increasing the furnace length, the heating element for the transfer state changing unit disposed in the transfer state change area can use the transfer tape whose transfer state is changed by the transfer state changing means. It will warm up efficiently. As a result, a temperature drop in the conveyance state changing area is less likely to occur, and the conveyance tape can be heated at a constant temperature, so that the quality of the cured resin is stabilized. Also,
Because it is easy to keep each place in the furnace at the set temperature,
Heating that matches the characteristics of the resin and the quality of the transport tape can be performed.

According to another aspect of the present invention, in addition to the resin curing device of each of the above-described inventions, a heating element for the horizontal transport path and a heating element for the transport state changing section heat the transport tape in the horizontal transport path and the transport state changing area. In this case, the temperatures to be set are within ± 5 ° C. of the same predetermined temperature. With such a configuration, each location in the furnace body has a constant temperature. As a result, the resin can be cured at the constant temperature, and the resin of stable quality can be cured.

In still another aspect of the invention, in addition to the resin curing device of each of the above-mentioned inventions, a heating element for a transfer state changing unit is disposed immediately below a transfer state change point of the transfer tape. For this reason, the transport tape at the transport state change point where problems are likely to occur is
It is reliably and efficiently heated by the heating element for the transfer state changing unit. This heating is performed by convection generated by heating by the heating element for the transfer state changing unit and radiant heat from the heating element for the transfer state changing unit.

According to another aspect of the present invention, in addition to the resin curing device of each of the above-described inventions, the present invention covers a transport tape transported along the transport state changing means and receives heat from the heating element for the transport state changing section. A hot plate for indirectly heating the transport tape is provided in the transport state change area. For this reason, burning, blistering, peeling off from the tape, and the like, which are adverse effects of direct heating, do not occur in the conveyance state change area where the conveyance change such as folding is performed. Since the transport state change area is a portion where these adverse effects are most likely to occur, it is very preferable that the above-mentioned adverse effects do not occur in terms of quality stability.

According to still another aspect of the present invention, in addition to the resin curing device of each of the above-described inventions, a plurality of transport state changing means for folding back the transport tape are provided, and the horizontal transport paths are vertically stacked to form three or more stages. And each of the transfer state changing areas is heated. As described above, by heating the transport tape in the horizontal transport path stacked in three or more stages, the heat for heating can be effectively used. In addition, since both sides of the transport tape are heated evenly, the resin curing becomes stable.

[0025]

DESCRIPTION OF THE PREFERRED EMBODIMENTS A resin curing apparatus and a resin curing method according to an embodiment of the present invention will be described with reference to the drawings.
1 to 5 are configuration diagrams of a housing and a furnace body of a resin curing device showing an embodiment according to the present invention. FIGS. 1 and 2 are schematic diagrams of the configuration of the present embodiment, showing only the main configuration for easy understanding of the description. FIG.
FIG. 2 is a view showing a heating element used in the present invention. FIG.
FIG. 8 is a diagram illustrating a temperature sensor disposed in a horizontal transport path and a peripheral structure thereof, and FIG. 8 is a diagram illustrating a temperature sensor disposed in a transport state change area and a peripheral structure thereof.
FIGS. 9 and 10 are diagrams showing the temperature state in the furnace of the resin curing device shown in FIGS. 1 to 5.

The resin curing device according to this embodiment includes a housing 1
And a furnace 2 provided on the housing 1. Then, a transport tape 5 for sealing and fixing the bonded element 3 with a resin 4 is transported in the furnace body 2. In the furnace body 2, cure guides 6 and 7 serving as conveyance state changing means for reversing the conveyance tape 5 are provided.

Further, in the furnace body 2, heat curing is performed between the transport tape 5 in the lowermost horizontal transport path 8 and the transport tape 5 in the middle horizontal transport path 9 inverted by the cure guide 6. Heating elements 11 and 12 for the horizontal transport path, which are a part of the means, are provided. Is provided.
Immediately below the point where the transport tape 5 is folded back by the cure guides 6 and 7, heating elements 14 and 15 for a transport state changing unit are provided.

In the furnace body 2, a heating plate 21 which is further disposed between the transport tape 5 and the heating element 11 for the horizontal transport path, serves as a part of the heat hardening means and serves as an indirect heating means, Disposed between the tape 5 and the heating element 12 for the horizontal transport path,
The heating plate 22 which is a part of the heat-curing means and also serves as the indirect heating means, is disposed between the transport tape 5 and the heating element 13 for the horizontal transport path. And a heating plate 23 serving as a heating plate.

Further, inside the furnace body 2, a reflecting plate 31 which becomes a part of the heating and curing means disposed at a position facing the heating plate 21 with the transport tape 5 interposed therebetween and also serves as an indirect heating means
And a reflection plate 32 having a similar function disposed at a position facing the hot plate 22 with the transport tape 5 interposed therebetween, and a similar reflection plate disposed at a position facing the hot plate 23 with the transport tape 5 interposed therebetween. A reflecting plate 33 having a function is provided.

In the wall of the furnace 2, a tape inlet 41, a tape outlet 42, and a through hole (not shown) through which a gas pipe 43 for introducing nitrogen gas into the lowermost horizontal conveying path 8 penetrates.
And two through holes (not shown) through which gas pipes 44 and 45 penetrate for introducing nitrogen gas into the middle and uppermost horizontal transfer paths 9 and 10, respectively, and an outlet 4 for discharging nitrogen gas and the like.
6 and an exhaust hole 47 for the solvent.

The resin curing apparatus further includes a breaker opening / closing door 51 for opening / closing a breaker storage portion at the lower part of the housing 1 and on the front side thereof, and performs temperature setting and nitrogen gas flow rate control. An operation panel 52 provided with an operation section, a temperature recorder section 53 in which a recorder for recording the temperature of each section in the furnace body 2 by a temperature sensor is provided, and a storage section 54 in which various miscellaneous items are stored, A flow meter section 55 in which a flow meter that measures the amount of nitrogen gas introduced is provided.

On the front side of the furnace body 2, two pairs of front heat insulating doors 56 for heat insulation and airtightness are provided so as to be openable. Further, a plurality of doors having handles 57 are provided on the rear surface of the furnace body 2 so that each part in the furnace body 2 can be adjusted from the back side. A piping port 2a for various sensors is provided on the side of the furnace body 2 and above the tape entrance 41.

In the furnace body 2, a rectangular parallelepiped first heat-insulating partitioning section 59 containing a glass wool 58 as a heat insulating agent for separating the horizontal conveying path 8 and the horizontal conveying path 9 is provided.
A rectangular parallelepiped second heat-insulating partitioning section 60 in which glass wool 58 for partitioning the horizontal transfer path 10 is provided, so that the high temperature inside the furnace 2 does not affect the control section at the lower portion of the housing 1. Cuboid-shaped third heat-insulating partition 6 containing glass wool 58 disposed below the horizontal conveying path 8
1 is further provided.

The element 3 is a semiconductor element such as an integrated circuit (IC) or a central processing unit (CPU).
The size is about 0.5 mm to 50 × 50 mm. The thickness is about 0.1 to 2.0 mm. The resin 4 is used when the element 3 is sealed by resin sealing means before the transport tape 5 is introduced into the furnace body 2. The resin 4 employs a resin that does not easily generate air bubbles when heated, and is packed in a resin syringe (30 cc or 50 cc) attached to the resin sealing means after defoaming.

The transport tape 5 is made of a polyimide material and has three tape widths of 35 mm, 48 mm and 70 mm. On both sides of the transport tape 5, perforations 5a (see FIG. 7) are formed, and a sprocket provided in the tape transport means enters to transport the transport tape 5.

The cure guide 6 is a transport state changing means disposed in the first transport state change area 62. In this embodiment, the transport tape 5 is folded back by 180 degrees. A heating plate 63 serving as an indirect heating means is provided in a semicircular shape so as to surround the cure guide 6.

The cure guide 7 is a conveyance state changing means disposed in the second conveyance state change area 64, and is configured to fold the conveyance tape 5 by 180 degrees in a direction opposite to the cure guide 6. The cure guide 7 is also provided with a semicircular heating plate 65 serving as an indirect heating means. This hot plate 65 is provided in an allowable space 6 for allowing the cure guide 7 to move.
The hot plate 65 is set so that the side portions thereof are separated from the cure guide 7 so that 6 is generated.

The cure guides 6 and 7 are not the same size, and the cure guide 6 is larger in diameter than the cure guide 7. This is the case of the transport tape 5 located on the lower side,
There is a possibility that the resin 4 is not sufficiently fixed to the transport tape 5. By increasing the diameter of the lower cure guide 6, the resin 4 is bent gently, and the resin 4 is separated from the transport tape 5. It is preventing it.

A counter-tension mechanism (not shown) using a weight is connected to the cure guide 7 so that a tension opposite to the winding direction is applied to the transport tape 5.
This mechanism is used in combination with the function that the cure guide 7 moves in the horizontal direction. Move.

As a result, the transport of the transport tape 5 can be continued without a sudden increase in the load on the tension against the transient fluctuation. A limiter (not shown) for preventing the cure guide 7 from moving too much.
Is provided, and the transport of the transport tape 5 is stopped when it exceeds the limiter.

Further, as described above, the cure guide 7 is configured so that the center position thereof is shifted in the horizontal direction by the applied force. By these measures, the transport tape 5 in the horizontal transport paths 8, 9, 10 is transported without slack with appropriate tension.

Each of the horizontal transport paths 8, 9, 10 is a space partitioned by first, second, and third heat insulating partition portions 59, 60, 61. In addition, a portion that communicates with both the horizontal transport path 8 and the horizontal transport path 9 and connects the two is a first transport state change area 62. Further, a portion that communicates with both the horizontal transport path 9 and the horizontal transport path 10 and connects the two is a second transport state change area 64.

The heating elements 11, 12, 13 for the horizontal transport path and the heating elements 14, 15 for the transport state changing unit are respectively shown in FIG.
Panel-type far-infrared heater 7 having the shape shown in FIG.
1 is composed of a plurality. Heating element 11 for horizontal transport path
Is formed by vertically arranging six far-infrared heaters 71 shown in FIG. Each far-infrared heater 71 arranged at the lowermost stage has a vertical length L1 of 400 mm and a width L2 of 100 mm.
And the maximum capacity is 700 W. In addition, two arranged in a row are controlled by a common temperature sensor. For this reason, three temperature sensors are provided for the lowermost six far-infrared heaters 71.

The far-infrared heater 71 includes a heater section 72 made of a far-infrared radiation ceramic heater and a heater section 7.
2 and a hook portion 74 for engagement. And the heater part 72 becomes a heat generation part.

The horizontal transport heating element 12 is composed of five far-infrared heaters 71 having the same shape as the far-infrared heater 71 disposed on the horizontal transport path 8. However, the maximum capacity is 400 W. Further, the temperature is controlled in pairs in the order in which the transport tapes 5 are transported. Therefore, only one far-infrared heater 71 closest to the cure guide 7 is controlled by one temperature sensor for the one.

The heating element 13 for the horizontal transport path is
Is composed of five far-infrared heaters 71 having the same shape and the same capacity as the far-infrared heater 71 arranged in the first embodiment. For the temperature control, one far-infrared heater 71 closest to the cure guide 7 is controlled by one temperature sensor, and the other four are continuously arranged in a pair, and one for each pair. Is controlled by the temperature sensor.

Heating element 1 for horizontal conveyance path arranged at the bottom
The reason why the capacity of the far-infrared heater 71 constituting the heating element 13 for the horizontal transport path 1 and the uppermost stage is set to 700 W is that the cool air from the tape inlet 41 and the tape outlet 42 enters the furnace body 2. This is because strong heating is required to enter. Set the capacity of the far-infrared heater 51 in the middle stage to 400
The reason why W is made small is that the middle stage requires delicate control and that heat that rises from the bottom stage can be used, so that strong heating is not required.

In the vicinity of the tape inlet 41 of the furnace body 2, more heat is dissipated and cooled as compared with the central part of the furnace body 2, so that the set temperature should be higher than that of the center part of the furnace body 2. Thereby, the flat temperature range of the horizontal transport path 8 can be widened, and the resin curing time in the horizontal transport path 8 can be further lengthened.

However, the horizontal transport path 8 where the transport tape 5 is first introduced into the furnace body 2 can be heated at a temperature increasing rate that does not cause “blistering” in the resin and the transport guide 5 is bent by the cure guide 6. The temperature profile is such that the adhesive strength between the resin and the transport tape 5 increases. In this embodiment, the temperature setting of the far-infrared heater 71 in the horizontal transport path 8 is set to the same temperature at three locations by three temperature sensors, and the temperature rise rate is adjusted by the feed rate of the transport tape 5. ing. The heating capability of the far-infrared heater 71 by the 11 temperature sensors is designed such that the ON-OFF duty ratio is about 50%.

Each of the heating elements 14 and 15 for the transfer state changing unit is constituted by a small far infrared heater 75 having a half shape of the far infrared heater 71 shown in FIG. That is, the length is L1 / 2 and the width is L2. The output capacities are each 350 W. Also, one temperature sensor is provided for each.

The hot plates 21, 22, 23 are each formed of a vertically elongated copper plate having a plate-like shape, and perform a soaking action, and receive heat of the heating elements 11, 12, 13 for the horizontal transport path. The heat is made uniform and transmitted to the transport tape 5 side. Each of the heating plates 21, 22, and 23 has a width (see FIG. 2) wider than the width of each of the heating elements 11, 12, and 13 for the horizontal transport path, and the heat of each of the heating elements 11, 12, and 13 serving as a heat source. We are trying to make effective use. The heating plate 23 is a reflection plate 33
At the same time, as shown in FIG. 3, it extends further from the portion where the far-infrared heater 71 is arranged to the tape outlet 42 side. As a result, the transport tape 5 is firmly warmed.

The distance between the transport tape 5 and each of the heating plates 21, 22, and 23 is made smaller than the distance between each of the heating plates 21, 22 and 23 and each of the heating elements 11, 12 and 13 for the horizontal transport path. (See FIG. 2). In addition, as shown in FIG.
The width of 22 and 23 is wider than the width of the transport tape. These are to enhance the heat equalizing action of each of the heat plates 21, 22, 23 and to transmit the uniformized heat to the transport tape 5 in the uniform state. As a result, the heat of the heating elements 11, 12, and 13 for the horizontal transport path can be efficiently and uniformly transmitted to the transport tape 5.

As shown in FIG. 7, a thermocouple 8 as a temperature sensor is provided on each of the hot plates 21, 22, 23 on the side of the transport tape 5.
1 is attached by a fixing member 82. The thermocouple 81 measures the temperature of each of the attached hot plates 21, 22, and 23, and each of the heating elements 11, 12, 13, 1
Used for temperature control of 4,15.

The horizontal transport path 8 is provided with a total of six far infrared heaters 71 in three pairs, and at least three thermocouples 81 for controlling the temperature of each pair. Similarly, three thermocouples 81 are also arranged on the horizontal transport paths 9 and 10, and a total of nine thermocouples 81 are provided on all the horizontal transport paths 8, 9 and 10.
Is installed. Further, each transport state change area 62, 64
One thermocouple 81 is provided for controlling the temperature of the heating elements 14 and 15 for the transfer state changing unit, which are arranged in the first position.

In this way, at least 11 thermocouples 81 are arranged, and the inside of the furnace body 2 is divided into 11 blocks, and each block is independently temperature-controlled. In this embodiment, although the block is divided into 11 blocks, of the 11 blocks, two far-infrared heaters 71 constitute one block in a total of 7 blocks.
There are pieces. Each of these seven blocks has a configuration in which one thermocouple 81 is arranged for one far-infrared heater 71, and in total, a total of 18 thermocouples 81 are arranged in the furnace body 2. And

As shown in FIG. 7, the thermocouples 81 face substantially the center of one far-infrared heater 71 (actually, each hot plate 2
1, 22, and 23). Each thermocouple 81 and each of the far-infrared heaters 71 and 75 are connected to a temperature controller arranged in the operation panel 52. Although only one far-infrared heater 71 is shown in FIG. 7, the same far-infrared heaters 71 are arranged in the horizontal direction, and the thermocouples 81 are also arranged correspondingly.

Further, the heating elements 14 and 15 for the transfer state changing unit are provided.
In the case of, cure guides 6 for semicircular hot plates 63 and 65
7 and the side most (transfer state change point 8
3 (around FIG. 8) (see FIG. 8). However, for the transfer state change areas 62 and 64, the hot plates 63 and
The thermocouple 81 may be attached to the side 65 not facing the cure guides 6 and 7, that is, to the side of the heating elements 14 and 15 for the transfer state changing unit (see the dashed line in FIG. 8).

The portion directly above the center N1 of the heating element 14 for the transfer state changing portion is the transfer state change point 8 of the cure guide 6.
It is located substantially at the center of the space between 3 and the hot plate 63. The portion directly above the center N2 of the heating element 15 for the transfer state changing portion is substantially at the center position of the sagging allowance space 66 which is a space between the transfer state change point 83 of the cure guide 7 and the hot plate 65. I have.

The reflectors 31, 32 and 33 are made of mirror-finished stainless steel material.
The width L2 of 12, 13 (100 m in this embodiment)
It is a rectangular flat plate having substantially the same width as that of m).
The tape inlet 41 is disposed below the left side of the furnace body 2 when viewed from the front side, and serves as a portion for introducing the transport tape 5 conveyed from the resin sealing means into the furnace body 2. The tape outlet 42 is disposed above the right side when viewed from the front side of the furnace body 2, and discharges the transport tape 5 having passed through the inside of the furnace body 2 to the tape storage means side.

The gas pipe 43 for the nitrogen gas disposed in the horizontal transport path 8 is introduced into the furnace body 2 from below the vicinity of the tape inlet 41, and passes through the space below the reflection plate 31 to the vicinity of the cure guide 6. Extending in the direction. The number of the gas pipes 43 is one at the introduction part into the furnace body 2, but is branched into two after the introduction, and becomes two in the horizontal conveyance path 8 as shown in FIG. 2.
A plurality of ejection holes are provided above the gas pipe 43, and nitrogen gas is ejected upward from each ejection hole. The ejection hole may be provided on the side of the gas pipe 43.

The gas pipe 44 for the nitrogen gas disposed in the horizontal transfer path 9 is introduced into the furnace body 2 from below the vicinity of the cure guide 6. Then, the space in which the cure guide 6 is disposed is vertically raised, and is bent at a right angle in the lateral direction at the second heat insulating partition part 60, so that the reflection plate 32 and the second heat insulating partition part 6 are bent.
In the space between 0 and 0, it extends laterally to the vicinity of the cure guide 7. This gas pipe 44 is one, and FIG.
As shown in FIG. 7, a plurality of ejection holes are provided below the gas pipe 44, and nitrogen gas is ejected downward from each of the ejection holes. In addition, when a continuous porous body having a large number of holes having a diameter of several μm to several tens of μm is arranged so as to cover the ejection holes, the ejection of nitrogen gas serving as ejection gas can be reduced. The arrangement may be performed on the gas pipes 43 and 45.

The gas pipe 45 for the nitrogen gas installed in the horizontal transfer path 10 is introduced into the furnace body 2 from below the vicinity of the cure guide 6 like the gas pipe 44 and rises vertically. Then, it penetrates through the second heat insulating partition part 60,
It is arranged on the heat insulating partition part 60 and extends to the vicinity of the cure guide 7 (see FIG. 2). This gas pipe 45 is also one,
As shown in FIG. 2, a plurality of ejection holes are provided above the gas pipe 45, and nitrogen gas is ejected upward from each of the ejection holes. In addition, each gas pipe 43,44,4
The position of the ejection hole provided in 5 may be any of upper, lower, left and right as long as the structure is such that nitrogen gas does not directly hit the transport tape 5.

The discharge port 46 is disposed above the tape inlet 41 side and substantially immediately above the position where the gas pipe 43 for introducing nitrogen gas is introduced into the furnace body 2. In the discharge port 46,
Butterfly damper 84 and furnace body 2 for adjusting the displacement
Forced exhaust fan 85 for forcibly exhausting nitrogen gas and the like inside
And are attached. An air flow meter is attached to the outlet 46, and the angle of the butterfly damper 84 and the number of revolutions per minute of the forced exhaust fan 85 can be adjusted by the value of the air flow meter.

The exhaust hole 47 is provided in the front half area of the lower horizontal conveying path 8 and on the back side of the furnace body 2. When the solvent such as the curing agent in the resin 4 potted by the resin sealing means is heated in the furnace body 2, the exhaust hole 47 jumps out into the furnace body 2. It is discharged to the outside. If the solvent that jumps out into the furnace body 2 is left as it is, it sticks to the surface of the transport tape 5 and causes problems such as hindering the transport.

In this embodiment, the exhaust hole 47 is arranged on the far side of the portion where the far-infrared heater 71 closest to the tape entrance 41 is arranged. Thus, by arranging the exhaust hole 47 at the heating start portion, the adverse effect of the solvent is eliminated. It should be noted that if the exhaust holes 47 are disposed closer to the tape inlet 41 than the center of the horizontal transport path 8, the exhaust holes 47 have a considerable elimination effect.

In this embodiment, an unillustrated ionizer device for countermeasures against static electricity is provided, which is designed to blow out at the cure guides 6 and 7. The ionizer smoothes the contact and separation of the transport tape 5, that is, the contact and separation between the cure guides 6, 7 and the transport tape 5,
The transport function has been improved.

This resin curing apparatus supplies a transport tape 5 with an element 3 to which an inner lead is bonded, performs resin sealing and pre-cure (temporary curing) in-line, and winds up on a reel. It is partly incorporated. That is, the transport tape 5 having the bonded elements 3 is sent to the resin sealing means by the tape feeding means, and the transport tape 5 after the potting of the resin 4 is performed.
Is sent to the precure device. The resin 4 is heated by the resin curing device, and the transport tape 5 is wound up by the tape housing means.

In this embodiment, the transport tape 5 is intermittently fed, and averages 2 to 200 m / sec inside the furnace body 2.
m. The effective heating length of the furnace body 2 is about 74
00 mm (the furnace length is about 8400 mm). Therefore, if the transport tape is transported at a speed of 5 mm per second,
It is conveyed from the tape entrance 41 to the tape exit 42 in about 28 minutes.

The specifications of the resin curing device have the following specifications in addition to the above-mentioned specifications. That is, the operating temperature is 60 to 200 ° C., the 11-block independent control system (on / off pulse type PID control) is used, and the temperature recording is a 12 or 24 point system with upper and lower alarms. In addition, an overload detection mechanism and a high / low temperature alarm function of the transport tape 5 in the furnace body 2 are provided, and a 300 ° C. temperature fuse is added to prevent excessive temperature rise. In addition, a weekly timer is attached, and weekly automatic operation is possible.

Next, the operation of the resin curing device configured as described above will be described.

First, the temperatures of the far-infrared heaters 71 and 75 of each block are set so that the temperature inside the furnace body 2 of the resin curing device has a desired temperature profile. This setting is performed by actually transporting the transport tape to which the temperature sensor is fixed and measuring the temperature, and setting the far-infrared heaters 71 and 7 so that each location (each block) in the furnace body 2 has a desired temperature.
Set the temperature of 5. This temperature setting is performed using the thermocouple 81.

After the temperature of each of the heaters 71 and 75 is set, the transport tape 5 is introduced. The transport tape 5 is supplied from a tape inlet 41, inverted by cure guides 6 and 7, and discharged from a tape outlet 42. The transport tape 5 supplied from the tape entrance 41 is
In the heating start stage until the heating is reversed, heating is performed as follows.

That is, the resin 4 in which the element 3 is sealed is indirectly heated by the hot plate 21 heated by the horizontal-conveying-path heating element 11 composed of the far-infrared heater 71 and faces the hot plate 21. The heat of the heating plate 21 is radiated by the reflection plate 31 disposed at the position, and indirectly heats the back side of the transport tape 5. As a result, the front side and the back side of the transport tape 5 are uniformly heated. Thereby, the resin 4 is indirectly heated by the heating plate 21 and the reflection plate 31, so that
The resin 4 can be cured without "burn", "blow", and shape deformation. Further, the resin 4 can be easily wrapped around the surface of the transport tape 5, the adhesiveness between the transport tape 5 and the peripheral portion of the resin 4 is improved, and the resin 4 can be adhered to the transport tape 5.

In a heating intermediate stage before being reversed by the cure guide 7, the transport tape 5 is heated by the horizontal transport path heating element 12 composed of the far-infrared heater 71, and is heated by the heat plate 22. It is indirectly heated by the reflection plate 32 that reflects radiant heat. Thereby, the resin 4
Is accelerated.

The tape exit 4 after being inverted by the cure guide 7
In the final stage of heating up to 2, the transport tape 5 is indirectly heated by the hot plate 23 heated by the heating element 13 for the horizontal transport path and the reflective plate 23 that reflects radiant heat from the hot plate 23. . Thereby, the curing of the resin 4 is further promoted.

Since the furnace body 2 is kept airtight, gas pipes 43, 44, and 45 for introducing nitrogen gas are introduced from through holes provided in the housing 1, and the furnace body 2 By discharging from the discharge port 46 provided in the furnace 2, the inside of the furnace body 2 can be kept in a non-oxidizing atmosphere state, and the curing of the resin can be stabilized. Further, by discharging the solvent generated near the tape entrance 41 from the exhaust hole 47, the conveyance becomes smooth, and the quality of resin curing can be improved.

Next, the temperature control in the furnace 2 of the resin curing device will be described.

FIG. 9 shows a temperature profile in the furnace body 2. In the figure, the left end is on the tape entrance 41 side, and the right end is on the tape exit 42 side. A solid line is a temperature profile in the furnace body 2 of this embodiment, and a part of the broken line is a temperature profile when the heating elements 14 and 15 for the transfer state changing unit are not present. In FIG. 9, those indicated by numbers with circles indicate the above-described blocks. In the horizontal transport path 8, three blocks are arranged in order from the tape entrance 41 side.

Next, a fourth block is disposed in the first transfer state changing area 62, and thereafter, the fifth and sixth blocks each comprising one to two far-infrared heaters 75 in the middle horizontal transfer path. Then, one far infrared heater 7
A seventh block 5 is arranged. Further, an eighth block is provided in the second transfer state changing area 64. Then, three blocks (10) and (11) (in the description of the blocks 10 and 11, () is used in place of。 in the description of the blocks 10 and 11; the same applies hereinafter) is arranged in the uppermost horizontal transport path 10. You. Here, the ninth block is composed of one far-infrared heater 71, and the two blocks (10) and (11) are each composed of two far-infrared heaters 71.

Each far infrared heater 7 in each block
Table 1 shows the set temperatures of the thermocouples 1 and 75 by the thermocouple 81.

[Table 1]

By setting the temperature as shown in Table 1,
The temperature profile shown in FIG. 9 is obtained. The temperature profile shown in FIG. 9 is obtained by attaching a temperature sensor to the transport tape 5 and flowing it through the furnace body 2 at a speed of about 4 mm per second, and transporting the transport tape 5 from the tape inlet 41 to the tape outlet 42 over a total of 35 minutes. It is the actual measurement value when it is made to do.

As shown in FIG. 9, when the transport tape 5 enters the tape inlet 41 and is transported for 4 minutes, the temperature thereof becomes about 120 ° C. That is, the temperature setting of the furnace body 2 shown in this example is an example in which the inside of the furnace body 2 is set to a constant temperature of 120 ° C., and the inside of the furnace body 2 has a desired temperature at the second half position of the first block. It is shown that. With respect to the desired temperature of 120 ° C., the temperature profile is within ± 5 ° C. at each location up to the first half position of the eleventh block (11).

The portion shown by the dotted line in FIG. 9 shows a case where the far infrared heater 75 is not arranged at this position.
At a predetermined temperature (120 ° C. in this example), a temperature drop of about 12 ° C. appears. As shown by the solid line in FIG. 9, 120 from the second block to the tenth block (10).
The temperature profile is completely within ± 5 ° C with respect to the temperature of ° C.

In order to keep the inside of the furnace body 2 at a constant temperature in this way, the set temperature of each far-infrared heater 71 in the lower horizontal conveying path 8 should be between 135 and 137 ° C. as shown in Table 1. Each far-infrared heater 71 of the set horizontal conveyance path 9 is set.
Is about 10 ° C. lower than the lower stage, that is, 122 ° C.
~ 126 ° C. Further, the temperature of each far-infrared heater 71 in the uppermost horizontal transport path 10 is set to a value several degrees lower than that of the middle stage, that is, 117 to 120 ° C.

The temperature setting of the far-infrared heater 75 (of the fourth block) in the first transfer state change area 62 which connects the horizontal transfer path 8 and the horizontal transfer path 9 is performed in the following fifth block. 124 ° C. which is substantially the same as The temperature setting of the far-infrared heater 75 (of the eighth block) in the second transfer state changing area 64 which connects the horizontal transfer path 9 and the horizontal transfer path 10 is the same as the next ninth block.
20 ° C. In the furnace body 2 having the temperature profile shown in FIG. 9, the opening angle of the butterfly damper 84 is set to about 30 degrees, and the exhaust speed from the discharge port 46 is set to 0.5 m / sec.

Next, FIG. 10 shows an example of a temperature profile in which the temperature is gradually increased from the lower stage to the upper stage.
In this example, the set temperatures in each block are shown in Table 2 below.

[Table 2]

In the case of the temperature profile shown in FIG. 10, the transport tape 5 is transported at a speed of 5 mm per second, and the inside of the furnace body 2 is measured by a temperature sensor fixed to the transport tape 5. About 4 minutes after entering from the tape inlet 41, the temperature in the furnace body 2 at that location becomes a temperature (about 80 ° C.) that is rapidly rising from room temperature. After that, it keeps gradually rising as the block progresses,
In the first half position of the tenth block (10), the temperature becomes about 145 ° C., which is the highest temperature.

When the far-infrared heater 75 does not exist in the fourth block or the eighth block, the temperature drops greatly at that point. However, in the present invention, as shown in FIG. 9 and FIG. 10, the temperature drop does not occur in the fourth and eighth blocks with respect to the previous blocks.

Each of the above embodiments is an example of a preferred embodiment of the present invention, but various modifications can be made without departing from the gist of the invention. For example, the heaters 71 and 75 as the heating means serving as heat sources may be other heating means such as a simple infrared heater or an electric heater instead of the far-infrared heater. Further, the heat plates 21, 22, 23 and the reflection plate 3
Although it is preferable to provide 1, 32, and 33, these may not necessarily be provided from the viewpoint of only preventing the temperature from decreasing in the transport state change areas 62 and 64. The hot plate may be made of brass or aluminum other than the copper material, or may be a copper plate or an aluminum plate coated with a resin or the like. Further, it may be a far-infrared radiation material or a black color close to blackbody radiation.

It is preferable to dispose the heating elements 14 and 15 for the transfer state changing section directly below the transfer state change point 83, but it is preferable to arrange them below the cure guides 6 and 7 serving as the transfer state changing means. For example, the effect of preventing a temperature drop can be exhibited more than before. Furthermore, in addition to the heating elements 14 and 15 for the transfer state changing unit in the above-described embodiment, the actual state of the invention is not limited to the embodiment.
As shown in JP 57846, Cure Guide 6,
7 may be added, or a heater arranged above the cure guides 6 and 7 may be added.

Further, in the above-described embodiment, the example in which the transport direction is reversed by 180 degrees by the cure guides 6 and 7 has been described. The direction change may be about 150 degrees. Further, a single-stage furnace in which only the cure guide 6 is disposed is used, and the conveyance guide 5 is turned obliquely upward (45-degree direction change) or 90-degree direction by the cure guide 6 to discharge the transport tape 5 from the side or above the furnace body 2. You may do it. Even in such a case, by arranging the heating element 14 for the transfer state changing unit below the cure guide 6, it is possible to efficiently prevent a temperature drop at that point.

In addition, instead of using a three-stage furnace, a one-stage furnace, a two-stage furnace,
The present invention can be applied to various furnaces such as a step furnace and a five-step furnace. Further, the transport tape 5 may be directly heated by the transport state changing portion heating elements 14 and 15 without providing the hot plates 63 and 65 provided so as to cover the semicircles of the cure guides 6 and 7. Further, the number of far-infrared heaters 71 in each of the horizontal transport paths 8, 9, 10 may be increased or decreased. For example, the number of far-infrared heaters 71 may be set to 8, 7, 7 or 4, 3, 3 for each of the horizontal transfer paths 8, 9, 10. The number of far-infrared heaters 71 may be the same in each stage by devising the positions of the cure guides 6 and 7.

[0093]

According to the resin curing method and the resin curing apparatus of the present invention, it is possible to reliably and efficiently perform heating in the conveyance state changing area without increasing the furnace length. For this reason, it is easy to prevent a temperature drop in this area, and it is possible to heat the transport tape at a constant temperature, so that the quality of resin curing is stabilized.

In particular, since a clean room has a high construction cost and a high management cost, it is not allowed to increase the floor area of the equipment even if the performance of the installed equipment is improved. The present invention is particularly effective when applied to equipment to which such severe conditions are imposed, that is, a furnace for semiconductors or a furnace for display bodies, which is equipment installed in a clean room.

[Brief description of the drawings]

FIG. 1 is a schematic sectional view of a housing and a furnace body of a resin curing device according to an embodiment of the present invention, and a partially enlarged view thereof.

FIG. 2 is an enlarged sectional view taken along line AA of FIG.

3 is a view showing a detailed configuration of the resin curing device of FIGS. 1 and 2, and is a front view in a state where a front heat insulating door on a front surface is removed.

FIG. 4 is a plan view seen from above in FIG. 3;

FIG. 5 is a side view seen from the left side of FIG. 3;

6A and 6B are diagrams showing a far-infrared heater serving as a heating element used in the resin curing device shown in FIGS. 1 to 5, wherein FIG. 6A is a perspective view, FIG. 6B is a front view, and FIG. It is the side view seen from the right of (B).

FIG. 7 is a perspective view showing a temperature sensor used in the resin curing device shown in FIGS. 1 to 5 and a structure around the temperature sensor.

FIG. 8 is a view showing the structure of a heating element for a transfer state changing unit used in the resin curing device shown in FIGS.
(A) is a diagram showing a first transport state change area portion, and (B) is a diagram showing a second transport state change area portion.

FIG. 9 is a diagram showing an example of a temperature profile in a furnace of the resin curing device shown in FIGS. 1 to 5;

FIG. 10 is a view showing another example of the temperature profile in the furnace of the resin curing device shown in FIGS. 1 to 5;

[Explanation of symbols]

DESCRIPTION OF SYMBOLS 1 Case 2 Furnace body 3 Element 4 Resin 5 Transport tape 6,7 Cure guide (transport state changing means) 8,9,10 Horizontal transport path 11,12,13 Heating element for horizontal transport path (part of heat curing means 14, 15 Heating element for transfer state changing section (part of heating and curing means) 21, 22, 23 Heat plate (part of heating and curing means and indirect heating means) 31, 32, 33 Reflecting plate (heating and curing means) 41 Tape inlet 42 Tape outlet 43, 44, 45 Gas pipe 46 Outlet 47 Exhaust hole 62 First transport state change area 64 Second transport state change area

 ──────────────────────────────────────────────────続 き Continued on the front page F term (reference) 4D075 AC72 AC74 AC80 BB26Z BB37Z BB38Z BB93Z CA47 DA04 DB53 DC19 DC21 EA19 4F042 AA22 DB02 DB10 DB12 DB19 DB20 DF16 DF20 DF26 DF28 DF32 4F203 AC03 AR06 DA12 DB01 DC01 DC01 DC01

Claims (12)

[Claims] 1. A tape supply / discharge step of supplying a transport tape coated with a resin for sealing an element from a tape inlet of a furnace body and discharging the tape from a tape outlet of the furnace body; A heat curing step of heating and curing the resin in the furnace while reversing the feed direction of the transport tape by a transport state changing unit, and a resin curing method comprising: A transport state changing section in which a heating element for a horizontal transport path is disposed on a horizontal transport path that moves horizontally and a transport state changing area in which the transport tape is folded back by the transport state changing means and below the transport state changing means. A resin curing method, further comprising disposing heating elements for heating, and heating the transport tape by the respective heating elements. 2. A tape supply / discharge step of supplying a transfer tape coated with a resin for sealing the element from a tape inlet of the furnace body and discharging the tape from a tape outlet of the furnace body; And a heat curing step of heating and curing the resin. In the heat curing step, the heating element for a horizontal transport path is disposed and transported on a horizontal transport path in which the transport tape moves horizontally. A transfer state change area in which the transfer state of the transfer tape is changed by the state change unit, and a heating element for a transfer state changing unit is further arranged below the transfer state change unit,
A resin curing method, wherein the transport tape is heated by the heating elements. 3. In the heat curing step, the temperature at which the horizontal transport path and the transport tape in the transport state change area are heated by the horizontal transport path heating element and the transport state changing section heating element are both set. 3. The resin curing method according to claim 1, wherein the temperature is set within ± 5 ° C. for the same predetermined temperature. 4. The resin curing method according to claim 1, wherein the heating element for the transfer state changing unit is disposed immediately below a transfer state change point of the transfer tape. 5. A heating plate that covers the transport tape being transported by the transport state changing means and receives heat from the heating element for the transport state changing unit to indirectly heat the transport tape. The resin curing method according to any one of claims 1 to 4, wherein the resin is provided in a state change area, and indirect heating is performed in this area. 6. A transport state changing means for folding back the transport tape, a plurality of the horizontal transport paths are vertically stacked to form three or more stages, and each of the horizontal transport paths and each of the transport state change areas is provided. The resin curing method according to any one of claims 1 to 5, wherein the heating is performed by heating. 7. A tape inlet through which a transport tape coated with a resin for sealing the element is supplied into the furnace, transport state changing means for reversing a feed direction of the transport tape,
In a resin curing device having a heating and curing means disposed in a furnace for heating and curing the resin, and a tape outlet for discharging the transport tape to the outside of the furnace, the transport tape moves horizontally as the heating and curing means. A heating element for a horizontal transport path arranged in the horizontal transport path, and a transport state which is a transport state changing area where the transport tape is folded back by the transport state changing means and is located at a lower position as viewed from the transport state changing means; A resin curing device comprising: a heating element for a change section; and the heating element heats the transport tape. 8. A tape inlet to which a transport tape coated with a resin for encapsulating the element is supplied, a heating and curing means disposed inside the tape for heating and curing the resin, and discharging the transport tape. In a resin curing device having a tape outlet, as the heating and curing means, a heating element for a horizontal transport path arranged on a horizontal transport path in which the transport tape moves horizontally, and a transport state of the transport tape by a transport state changing means And a heating element for a transport state changing unit disposed below the transport state changing means when viewed from the transport state changing means, and heating the transport tape by each of the heating elements. Resin curing device. 9. The temperature at which the horizontal transport path and the transport tape in the transport state change area are heated to the same predetermined temperature by the horizontal transport path heating element and the transport state changing section heating element. 9. The resin curing device according to claim 7, wherein the temperature is set within ± 5 ° C. 10. The resin curing device according to claim 7, wherein the heating element for the transfer state changing unit is disposed immediately below a transfer state change point of the transfer tape. 11. A heating plate for covering the transport tape transported along the transport state changing means, receiving heat from the heating element for the transport state changing unit, and indirectly heating the transport tape, The resin curing device according to any one of claims 7 to 10, wherein the resin curing device is provided in a conveyance state changing area. 12. The apparatus according to claim 12, wherein a plurality of the transfer state changing means for folding the transfer tape are provided, and the horizontal transfer paths are vertically stacked to form three or more stages. The resin curing device according to any one of claims 7 to 11, wherein the heating is performed by: