JP2002237689A - Substrate drawing structure - Google Patents

Substrate drawing structure

Info

Publication number
JP2002237689A
JP2002237689A JP2001031629A JP2001031629A JP2002237689A JP 2002237689 A JP2002237689 A JP 2002237689A JP 2001031629 A JP2001031629 A JP 2001031629A JP 2001031629 A JP2001031629 A JP 2001031629A JP 2002237689 A JP2002237689 A JP 2002237689A
Authority
JP
Japan
Prior art keywords
substrate
handle
chassis
projection
hole
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP2001031629A
Other languages
Japanese (ja)
Inventor
Yukiya Yamanaka
幸哉 山中
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Hitachi Kokusai Electric Inc
Original Assignee
Hitachi Kokusai Electric Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Hitachi Kokusai Electric Inc filed Critical Hitachi Kokusai Electric Inc
Priority to JP2001031629A priority Critical patent/JP2002237689A/en
Publication of JP2002237689A publication Critical patent/JP2002237689A/en
Pending legal-status Critical Current

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  • Mounting Of Printed Circuit Boards And The Like (AREA)

Abstract

PROBLEM TO BE SOLVED: To draw a plurality of substrates mounted in a housing or the like by a substrate drawing handle corresponding to one sheet of substrate. SOLUTION: The plurality of the substrates 2 are drawn by the substrate drawing handle for the one substrate, by providing a guide hole 11 at a chassis 1 for mounting the substrates 2, mounting the handle on the chassis 1, and moving the handle 4 along the guide hole 11 up to the prescribed position with respect to the substrate which is desired to be drawn.

Description

【発明の詳細な説明】DETAILED DESCRIPTION OF THE INVENTION

【0001】[0001]

【発明の属する技術分野】本発明は筐体等のシャーシに
実装された基板抜き構造に関するものである。
BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a board removing structure mounted on a chassis such as a housing.

【0002】[0002]

【従来の技術】図6〜8を用い、従来の基板抜き構造の
一例を説明する。
2. Description of the Related Art An example of a conventional substrate punching structure will be described with reference to FIGS.

【0003】1はシャーシ、2は基板、14はハンドル、
15はハンドル14の構成要素で回転軸、16、17はハンドル
14の構成要素で突起、20は突起16に加える力、21は突起
17に作用する力、22は基板2に作用する力である。
[0003] 1 is a chassis, 2 is a board, 14 is a handle,
15 is a component of the handle 14, which is a rotation axis, and 16, 17 are handles
14 components, projection 20; force applied to projection 16; 21 projection
A force acting on 17 and 22 are forces acting on the substrate 2.

【0004】基板2はシャーシ1上に実装され、ハンド
ル14は回転軸15を介して基板2に取り付けられている。
[0004] The board 2 is mounted on the chassis 1, and a handle 14 is attached to the board 2 via a rotating shaft 15.

【0005】基板2をシャーシ1より取り外すために、
図7のように力20を突起16に加える。突起16はハンドル
14の構成要素のため、ハンドル14は回転軸15を支点とし
て回転移動する。突起17はハンドル14の構成要素である
ため、ハンドル14が回転移動することにより、シャーシ
1を押し出すように力21が作用する。しかし、シャーシ
1は絶対的に固定、保持されているため、実際にはシャ
ーシ1は移動せずに、図8のように基板2に力21とは反
対方向の力22が作用し、基板2は平行移動し、シャーシ
1から取り外される。
In order to remove the substrate 2 from the chassis 1,
A force 20 is applied to the protrusion 16 as shown in FIG. The projection 16 is a handle
Due to the fourteen components, the handle 14 rotates around the rotation shaft 15 as a fulcrum. Since the projection 17 is a component of the handle 14, a force 21 acts to push the chassis 1 by rotating the handle 14. However, since the chassis 1 is absolutely fixed and held, the chassis 1 does not actually move, and a force 22 in a direction opposite to the force 21 acts on the substrate 2 as shown in FIG. Moves in parallel and is removed from the chassis 1.

【0006】[0006]

【発明が解決しようとする課題】図6により本発明が解
決しようとする課題を説明する。
Problems to be solved by the present invention will be described with reference to FIG.

【0007】前述の従来の基板抜き構造では、シャーシ
1に実装されている基板が複数になった場合、ハンドル
14はそれぞれの基板2に取り付いているため、シャーシ
1に実装するためには、各基板2にハンドル14の取り付
け作業をわざわざ行わなければならないという欠点があ
る。また、基板2を保守等で交換する場合、ハンドル14
も一緒に交換しなければならない。このハンドル14の
交換は材料、工数両面でコスト高になるという欠点があ
る。
[0007] In the above-mentioned conventional board removing structure, when a plurality of boards are mounted on the chassis 1, the handle is not used.
Since 14 is attached to each substrate 2, there is a disadvantage that the mounting operation of the handle 14 to each substrate 2 must be performed in order to mount it on the chassis 1. When the board 2 is replaced for maintenance or the like, the handle 14
Must also be replaced together. This replacement of the handle 14 has the disadvantage of increasing costs in terms of both materials and man-hours.

【0008】そこで本発明の目的は、上記欠点を除去し
た基板抜き構造を提供することにある。
An object of the present invention is to provide a substrate punching structure in which the above-mentioned disadvantages are eliminated.

【0009】[0009]

【課題を解決するための手段】本発明は上記目的を達成
するためにシャーシにガイド穴を設け、シャーシにハン
ドルと取り付けたとき、ガイド穴に沿ってハンドルが移
動するようにしたものである。更に基板端部の穴に挿入
する第一の突起を設けると共に第一の突起に直交する第
二の突起を設けるようにしたものである。その結果、第
一の突起を基板端部の穴に挿入して第二の突起に力を加
えてハンドルを回転させることにより、基板一枚分のハ
ンドル(シャーシ上部に取り付けたハンドルとシャーシ
下部に取り付けたハンドルと)で複数の基板を抜くこと
を可能となるようにしたものである。
According to the present invention, a guide hole is provided in a chassis to achieve the above object, and the handle moves along the guide hole when the handle is attached to the chassis. Further, a first projection to be inserted into the hole at the end of the substrate is provided, and a second projection orthogonal to the first projection is provided. As a result, the first protrusion is inserted into the hole at the end of the board, and the handle is rotated by applying force to the second protrusion. With the attached handle, it is possible to remove a plurality of substrates.

【0010】[0010]

【発明の実施の形態】図1〜5、及び図9を用いて本発
明の一実施例である基板抜き構造について説明する。
DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS A substrate cutting structure according to an embodiment of the present invention will be described with reference to FIGS. 1 to 5 and FIG.

【0011】4は本実施例のハンドル、3は基板2の構
成要素で穴、11はシャーシ1の構成要素でガイド穴、5
はハンドル4の構成要素で回転軸、6、7はハンドル4
の構成要素で突起、8は突起6に加えられる力、9はハ
ンドルに作用する力、10は基板2に作用する力である。
Reference numeral 4 denotes a handle of this embodiment, 3 denotes a hole of a component of the substrate 2, 11 denotes a component of the chassis 1, and a guide hole.
Is a component of the handle 4 and a rotation axis, and 6 and 7 are handles 4
Is a force applied to the protrusion 6, 9 is a force acting on the handle, and 10 is a force acting on the substrate 2.

【0012】基板2はシャーシ1に実装され、ハンドル
4は回転軸5を介して、ガイド穴11上に取り付けられて
いる。突起7は穴3に入り込む位置に有る。
The board 2 is mounted on the chassis 1, and the handle 4 is mounted on the guide hole 11 via the rotating shaft 5. The projection 7 is located at a position to enter the hole 3.

【0013】また、ガイド穴11は図5のような形状をし
ており、ハンドル4は回転軸5を介してカイド穴11に取
り付けられているため、ガイド穴11上を自由に平行移動
する。
The guide hole 11 has a shape as shown in FIG. 5, and the handle 4 is attached to the guide hole 11 via the rotary shaft 5, so that the handle 4 freely moves in parallel on the guide hole 11.

【0014】基板2をシャーシ1より取り外すために、
図2のように力8を突起6に加える。ハンドル4は回転
軸5によりシャーシ1に取り付いているため、力9が作
用し、回転軸5を支点として回転移動する。突起7はハ
ンドル4の構成要素であるため、ハンドル4が回転移動
することにより、同様に回転軸5を支点として基板2に
近づくように回転移動し、図3のように穴3に入り込
み、穴3の内壁を押し出すように力10が作用し、図4の
ように基板2は平行移動し、シャーシ1から取り外され
る。
In order to remove the substrate 2 from the chassis 1,
A force 8 is applied to the protrusion 6 as shown in FIG. Since the handle 4 is attached to the chassis 1 by the rotation shaft 5, a force 9 is applied, and the handle 4 rotates around the rotation shaft 5 as a fulcrum. Since the projection 7 is a component of the handle 4, the handle 4 rotates to move in a similar manner to the substrate 2 with the rotation shaft 5 as a fulcrum, and enters the hole 3 as shown in FIG. A force 10 acts so as to push the inner wall of the board 3, and the board 2 moves in parallel as shown in FIG.

【0015】ハンドル4は図5のように左端の基板2を
抜く位置にあるが、ガイド穴11上を自由に平行移動する
ことにより、図5のように中央、右端の基板2を抜くた
めの位置に移動することが出来る。
As shown in FIG. 5, the handle 4 is located at a position where the leftmost substrate 2 is to be pulled out. By freely moving the guide hole 11 in parallel, as shown in FIG. You can move to the position.

【0016】以上により、ハンドル4のみで三個の基板
2を総て抜く事が可能で、保守交換時にハンドルを一緒
に交換すること無しに、複数の基板を交換することが出
来る。
As described above, all the three boards 2 can be pulled out only by the handle 4, and a plurality of boards can be replaced without replacing the handle together at the time of maintenance replacement.

【0017】なお、ハンドル4のシャーシ1への取付方
法について図9を用いて説明する。ハンドル4はハンド
ル上部23とハンドル下部24とに分かれている。そし
て、ハンドル上部23には突起7とD軸(断面がD形で
ある軸)25が設けられていると共にハンドル下部24
には突起6とD穴(断面がD形である穴。D軸25が挿
入される穴)26が設けられている。更にD軸25にネ
ジ穴27が設けられている。D軸25をガイド穴11に
挿入した後、D穴26に挿入してシャーシ1をハンドル
上部23とハンドル下部24で挟み込みビス28により
ネジ止めすることでハンドル4をシャーシ1へ取り付け
ることができる。
A method of attaching the handle 4 to the chassis 1 will be described with reference to FIG. The handle 4 is divided into a handle upper portion 23 and a handle lower portion 24. A projection 7 and a D-axis (a shaft having a D-shaped cross section) 25 are provided on the upper handle 23 and the lower handle 24.
Are provided with a projection 6 and a D hole (a hole having a D-shaped cross section; a hole into which a D-axis 25 is inserted). Further, a screw hole 27 is provided in the D-axis 25. After the D shaft 25 is inserted into the guide hole 11, the handle 4 can be attached to the chassis 1 by inserting the chassis 1 into the D hole 26 and sandwiching the chassis 1 between the upper handle 23 and the lower handle 24 with screws 28.

【0018】[0018]

【発明の効果】本発明の効果を説明する。The effects of the present invention will be described.

【0019】本発明によれば、基板抜きハンドルの必要
数が基板一枚分(シャーシ上部に取り付けたハンドルと
シャーシ下部に取り付けたハンドルの2個)で満足され
るため、各基板に基板抜きハンドルを取り付けるための
材料費及び工数が不要となり、コスト削減を行うことが
出来る。
According to the present invention, the required number of handles for removing a board is satisfied by one board (two handles: a handle attached to the upper part of the chassis and a handle attached to the lower part of the chassis). Material cost and man-hours for mounting are unnecessary, and the cost can be reduced.

【図面の簡単な説明】[Brief description of the drawings]

【図1】本発明の一実施例である基板抜き構造を示す斜
視図。
FIG. 1 is a perspective view showing a substrate cutting structure according to an embodiment of the present invention.

【図2】本発明の一実施例である基板抜き構造におい
て、基板を抜く方法を示す図。
FIG. 2 is a diagram showing a method of removing a substrate in a substrate removal structure according to one embodiment of the present invention.

【図3】本発明の一実施例である基板抜き構造におい
て、基板を抜く方法を示す図。
FIG. 3 is a view showing a method of removing a substrate in a substrate removal structure according to an embodiment of the present invention.

【図4】本発明の一実施例である基板抜き構造におい
て、基板を抜く方法を示す図。
FIG. 4 is a view showing a method of removing a substrate in a substrate removal structure according to one embodiment of the present invention.

【図5】本発明の一実施例である基板抜き構造におい
て、ハンドルを移動させる方法を示す図。
FIG. 5 is a view showing a method of moving a handle in the substrate punching structure according to one embodiment of the present invention.

【図6】従来の基板抜き構造を示す斜視図。FIG. 6 is a perspective view showing a conventional substrate cutting structure.

【図7】従来の基板抜き構造において、基板を抜く方法
を示す図。
FIG. 7 is a diagram showing a method of removing a substrate in a conventional substrate removal structure.

【図8】従来の基板抜き構造において、基板を抜く方法
を示す図。
FIG. 8 is a diagram showing a method for removing a substrate in a conventional substrate removal structure.

【図9】本発明の一実施例である基板抜き構造におい
て、ハンドルのシャーシへの取付方法を示す図。
FIG. 9 is a view showing a method of attaching a handle to a chassis in the board-extracting structure according to one embodiment of the present invention.

【符号の説明】[Explanation of symbols]

1:シャーシ,2:基板,3:穴,4:ハンドル,5:
回転軸 6:突起 7:突起,8:力,9:力,10:力,11:ガイド穴 14:ハンドル 15:回転軸,16:突起,17:突起,20:力,2
1:力 22:力 23:ハンドル上部,24:ハンドル下部,25:D
軸,26:D穴 27:ネジ穴,28:ビス
1: chassis, 2: board, 3: hole, 4: handle, 5:
Rotation axis 6: projection 7: projection, 8: force, 9: force, 10: force, 11: guide hole 14: handle 15: rotation axis, 16: projection, 17: projection, 20: force, 2
1: Force 22: Force 23: Upper handle, 24: Lower handle, 25: D
Shaft, 26: D hole 27: Screw hole, 28: Screw

Claims (2)

【特許請求の範囲】[Claims] 【請求項1】回転軸と、該回転軸の側面に設けられた第
一の突起と、前記回転軸の側面に設けられ第一の突起に
直交する第二の突起とを備え、前記回転軸を支点、第一
の突起を作用点、第二の突起を力点として第一の突起を
シャーシに実装された基板の端部穴に挿入して第二の突
起を回転させたとき、前記基板が移動して前記シャーシ
から抜けるように構成したことを特徴とする基板抜き構
造。
A rotating shaft, a first protrusion provided on a side surface of the rotating shaft, and a second protrusion provided on a side surface of the rotating shaft and orthogonal to the first protrusion; When the first projection is inserted into an end hole of the board mounted on the chassis and the second projection is rotated using the first projection as an operating point, the second projection as a point of force, A substrate removing structure, wherein the substrate removing structure is configured to move to be removed from the chassis.
【請求項2】請求項1記載の基板抜き構造において、 断面がD形状であるD軸を下面に設けた基板抜き上部
と、断面がD形状であり前記D軸が挿入されるD穴を上
面に設けた基板抜き下部と、前記基板抜き上部と前記基
板抜き下部とを締結する締結部とを備え、前記D軸を前
記シャーシに設けられたガイド穴及び前記D穴に挿入し
て前記シャーシを挟み込んで前記基板抜き上部と前記基
板抜き下部とを締結したとき、前記ガイド穴に沿って自
在に移動するように構成したことを特徴とする基板抜き
構造。
2. The substrate punching structure according to claim 1, wherein a D-shape having a D-shaped cross section is provided on a lower surface, and a D-hole having a D-shape cross-section into which the D-axis is inserted. And a fastening portion for fastening the upper portion of the substrate and the lower portion of the substrate, wherein the D-axis is inserted into the guide hole and the D hole provided in the chassis, and the chassis is removed. A substrate punching structure, wherein when the substrate punching upper portion and the substrate punching lower portion are clamped and fastened, the substrate punching structure is configured to move freely along the guide hole.
JP2001031629A 2001-02-08 2001-02-08 Substrate drawing structure Pending JP2002237689A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP2001031629A JP2002237689A (en) 2001-02-08 2001-02-08 Substrate drawing structure

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2001031629A JP2002237689A (en) 2001-02-08 2001-02-08 Substrate drawing structure

Publications (1)

Publication Number Publication Date
JP2002237689A true JP2002237689A (en) 2002-08-23

Family

ID=18895689

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2001031629A Pending JP2002237689A (en) 2001-02-08 2001-02-08 Substrate drawing structure

Country Status (1)

Country Link
JP (1) JP2002237689A (en)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2010239685A (en) * 2009-03-30 2010-10-21 Mitsubishi Electric Corp Mounting/dismounting apparatus for unit equipment
US11297750B2 (en) 2018-03-22 2022-04-05 Quanta Computer Inc. Mechanism to release cards and other components from computer

Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0969696A (en) * 1995-08-31 1997-03-11 Oki Electric Ind Co Ltd Printed board plug-in/out structure
JPH11186758A (en) * 1997-12-19 1999-07-09 Matsushita Electric Ind Co Ltd Electrical equipment board fixing device for electronic apparatus

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0969696A (en) * 1995-08-31 1997-03-11 Oki Electric Ind Co Ltd Printed board plug-in/out structure
JPH11186758A (en) * 1997-12-19 1999-07-09 Matsushita Electric Ind Co Ltd Electrical equipment board fixing device for electronic apparatus

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2010239685A (en) * 2009-03-30 2010-10-21 Mitsubishi Electric Corp Mounting/dismounting apparatus for unit equipment
US11297750B2 (en) 2018-03-22 2022-04-05 Quanta Computer Inc. Mechanism to release cards and other components from computer

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