JP2002237017A - Suspension and head gimbals assembly - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide a suspension capable of more effectively radiating heat from an IC chip, and an HGA. SOLUTION: The suspension is provided with a magnetic head slider having at least one thin-film magnetic head, an elastic stainless steel flexure having the magnetic head slider secured thereto, a stainless steel load beam for supporting the flexure and applying a specified load to the magnetic head slider, a base plate secured to the base part of the load beam, an IC chip having a circuit mounted thereon for the thin-film magnetic head element, and a wiring member having the IC chip mounted in the vicinity of the base plate. The base plate is made of a member having thermal conductivity higher than that of stainless steel.

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a suspension for mounting an IC chip for a thin-film magnetic head element used for, for example, a magnetic disk drive (HDD) and a head gimbal assembly (HGA) provided with the suspension. .

[0002]

2. Description of the Related Art In an HDD, a magnetic head slider attached to the tip of a suspension is levitated from the surface of a rotating magnetic disk. In this state, the magnetic disk slider is mounted on a thin-film magnetic head element mounted on the magnetic head slider. And / or reproduction from the magnetic disk.

[0003] With the recent increase in capacity and recording density of HDDs, the recording frequency has been increasing. One of the means for realizing this has been proposed for magnetic head elements. This is a structure (a chip-on-suspension structure) in which a part of the drive circuit is formed into an IC chip and mounted on a suspension. By adopting this structure, the wiring distance from the drive circuit to the magnetic head element is shortened, so that unnecessary noise added to the head drive signal can be reduced, and as a result, the recording characteristics in the high frequency region are improved. I do. In addition, the magnetoresistance effect (M
R) A weak signal output from the read head element can be amplified closer to the MR head element.

[0004]

The size of an IC chip used in such a chip-on-suspension structure must be very small due to its mounting structure. However, when the size is reduced, the surface area is reduced accordingly. The heat dissipation is quite poor. Also, since it must be mounted on a suspension with a small space, and 500 MHz
In a near high-frequency region, the capacitance of the lead frame which becomes a terminal when packaged becomes noise and adversely affects the electrical characteristics. Therefore, the IC chip needs to be a bare chip. For this reason, the heat radiation of the IC chip deteriorates, and the chip temperature rises. In addition, since an extremely large current flows through the IC chip during recording, heat generation becomes extremely large, so that insufficient heat dissipation is a serious problem.

A spring member of the suspension is usually a leaf spring made of stainless steel. However, this stainless steel has a low thermal conductivity as a metal material and is very thin, so that it has a chip-on-suspension structure. In that case, cooling by heat radiation cannot be expected so much.

As described above, the conventional HGA having the chip-on-suspension structure has the following problems. (1) Since the IC chip is very thin and small, its surface area is small, and it is difficult to effectively take measures against heat generation. The stainless steel used as a material has low thermal conductivity and is very thin, so that sufficient heat cannot be dissipated by the ordinary chip-on-suspension structure. (3) The IC chip is mounted on the suspension on the side facing the magnetic medium. Therefore, I
There is a problem that it is difficult to directly attach the heat radiation structure to the C chip itself.

When the temperature of the IC chip becomes high due to heat generation and almost no heat dissipation, not only the operation of the IC becomes unstable but also the suspension may be thermally deformed.

Accordingly, the present invention is to solve the above-mentioned problems of the prior art, and an object of the present invention is to provide a suspension and an HGA capable of more effectively dissipating heat from an IC chip.

[0009]

According to the present invention, an elastic stainless steel flexure for supporting a magnetic head slider having at least one thin film magnetic head element, and a flexure supporting the flexure are provided. A wiring configured so that a load beam made of stainless steel for applying a predetermined load to the slider, a base plate fixed to the base of the load beam, and an IC chip mounting a circuit for a thin-film magnetic head element are mounted near the base plate. And a base plate formed of a member having higher thermal conductivity than stainless steel.

According to the present invention, there is further provided a magnetic head slider having at least one thin-film magnetic head element,
A flexure made of stainless steel having elasticity to which the magnetic head slider is fixed, a load beam supporting the flexure, and a stainless steel load beam for applying a predetermined load to the magnetic head slider, and a flexure fixed to the base of the load beam. An HGA including a base plate, an IC chip on which a circuit for a thin-film magnetic head element is mounted, and a wiring member having the IC chip mounted near the base plate, wherein the base plate is formed of a member having higher thermal conductivity than stainless steel. Is provided.

The IC chip is mounted or actually mounted on a wiring member near the base plate, and the base plate is formed of a member having higher thermal conductivity than stainless steel. Therefore, not only the heat capacity of the suspension is increased, but also the heat generated by the member having high thermal conductivity can be diffused over a wide area and cooled, so that the temperature of the IC chip itself can be reduced. At the same time, a local temperature rise of the surrounding suspension can be suppressed. In particular, in the HGA, since the base plate is attached to each movable arm of the E block and attached to the HDD, heat can be transmitted to the E block very efficiently by configuring the base plate with a member having high thermal conductivity. In addition, the E block has a large heat capacity because it is thick and has a large volume.
In many cases, the thermal conductivity is very high because it is formed of an Al material, so that the cooling effect of the IC chip becomes very high. As a result, the operation of the IC circuit can be stabilized, and thermal deformation of the suspension can be prevented.

[0012] The wiring member is formed directly on the flexure, is formed of FPC, or has a portion formed directly on the flexure and a portion formed of FPC. Is preferred.

It is also preferable that the IC chip is configured to be mounted on the wiring member at a side position of the base plate or is actually mounted.

[0014] It is also preferred that the IC chip is configured or actually mounted on the FPC at a position behind the base plate.

A member having higher thermal conductivity than stainless steel is
It is preferable that the metal member includes one selected from Al, Cu, Mg, an Al alloy, a Cu alloy, and an Mg alloy.

[0016]

FIG. 1 is a perspective view showing a schematic structure of an HGA according to an embodiment of the present invention, and FIG.
3 is an exploded perspective view of the HGA of FIG.

As shown in these figures, the HGA has a magnetic head slider 11 having at least one thin-film magnetic head element fixed to a tip end of a suspension 10 and a head located at a lateral position of a base of the suspension 10. A drive and readout signal amplifying IC chip 12 is mounted. Magnetic head slider 11 and IC chip 1
2 is mounted on the surface of the suspension 10 facing the magnetic disk medium so as to face the surface of the magnetic disk medium.

The suspension 10 has an elastic flexure 13 for supporting the magnetic head slider 11 at one end and supporting the IC chip 12 near the other end.
And a flexure 13 which supports and fixes the flexure 13, which is also mainly constituted by an elastic load beam 14 and a base plate 15 provided at the base of the load beam 14.

The magnetic head slider 11 has at least one thin-film magnetic head element formed by a write head element and an MR read head element. The size of the magnetic head slider 11 is merely an example, but it is 1.25.
mm × 1.0 mm × 0.3 mm.

In the IC chip 12, a drive circuit as a head amplifier and a read signal amplifying circuit are mounted as ICs. Although the size of the IC chip 12 is merely an example, it is 1.4 mm × 1.0 mm × 0.13 mm. Thus, the IC chip 12 has a very small and thin shape.

The flexure 13 has a soft tongue 13a centered on a dimple provided on the load beam 14, and has elasticity for stably supporting the magnetic head slider 11 with the tongue 13a to stabilize the flying attitude. ing. In this embodiment, the flexure 13 has a thickness of about 2 mm.
It is made of a 5 μm stainless steel plate (for example, SUS304TA), and is formed into a shape having a substantially uniform width.

On the flexure 13, a thin film pattern is directly formed by the same known patterning method as used for forming a printed circuit board on a thin metal plate. This thin film pattern constitutes a plurality of lead conductors as wiring members, and one end of these lead conductors is provided at one end (tip) of the flexure 13 on the magnetic head slider 11.
The other end is connected to an external circuit connection pad 17 provided at the other end (rear end) of the flexure 13. An IC chip connection pad 18 is formed near the other end of the lead conductor.

The load beam 14 has elasticity for pressing the magnetic head slider 11 in the direction of the magnetic disk to stabilize the flying height. This load beam 14
Is about 60-65 μm with a width narrowing toward the tip
The flexure 13 is fixedly supported over its entire length by spot welding using a laser beam or the like.

As in the present embodiment, the flexure 1
In a three-piece suspension in which the load beam 3 and the load beam 14 are independent components, the rigidity of the load beam 14 is higher than the rigidity of the flexure 13. The flexure 13 and the load beam 14 may not be separately provided, and a suspension having a two-piece structure of a base plate and a flexure load beam may be used.

The base plate 15 is formed of a plate member having a higher thermal conductivity than stainless steel. This high thermal conductivity plate member has high thermal conductivity and is lightweight,
Further, an Al plate is most preferable in terms of corrosion resistance and the like, but is not limited thereto, and Al, Cu, Mg, an Al alloy,
A metal plate member containing one selected from a Cu alloy and a Mg alloy can be used. The base plate 15 has a greater thickness than the load beam 14 and is fixed to the base of the load beam 14 by spot welding using a laser or the like.

As shown in FIG. 3, such an HGA is EGA
It is mounted on the HDD by being fixed to each movable arm 31 of the block 30. As shown in FIG. 4A, the HGA is attached by attaching the attaching portion 15a of the base plate 15 to the fixed portion 32 provided on the movable arm 31 by swaging, as shown in FIG. 4), or by screwing using screws 35 as shown in FIG. 4 (C). In the case of attachment by bonding, it is more preferable to use an adhesive having good thermal conductivity, for example, a silver paste-based adhesive.

The IC chip 12 is a bare chip, is located on the side of the base plate 15, and has a flexure 1
3 is flip-chip mounted on an IC chip connection pad 18 formed in the vicinity of the other end, for example, using a gold ball. The gap between the bottom surface of the IC chip 12 and the thin film pattern is filled with an underfill layer for improving heat radiation characteristics, improving mechanical strength, and covering the IC chip 12.

As described above, the IC chip 12 has a size of several tens of mA despite its extremely small size and thickness.
A large amount of heat is generated in order to allow the writing current to flow. In conventional suspensions, this heat not only affects the IC chip itself, but also causes the problem of locally heating the stainless steel that composes the flexure and load beam that are the spring members of the suspension. Was. Air cooling effect caused by rotation of magnetic disk
Although the C chip can be cooled somewhat, the air cooling effect cannot be expected so much because the IC chip itself has a very small surface area. In addition, since the clearance between the IC chip and the surface of the magnetic disk is very small, it is difficult to take measures to further enhance the air cooling effect on the IC chip side of the suspension, which means that contact with the surface of the magnetic disk is completely suppressed.

Therefore, in the suspension having the conventional structure, the heat of the IC chip is conducted to the suspension through the terminal portion made of gold or solder. However, since heat conduction hardly occurs in the suspension having low thermal conductivity, heat is hardly dissipated. Otherwise, this part of the suspension will be locally hot.

On the other hand, in this embodiment, since the base plate 15 near the mounting position of the IC chip 12 is formed of a high thermal conductivity member having high thermal conductivity, that is, an Al plate, the base plate 15 The generated heat is conducted to the Al plate and further diffused to the E block side, so that the IC chip 1
2 can be cooled effectively. Also,
Since the heat capacity of the suspension is increased by the Al plate itself acting as a heat sink, the cooling of the IC chip 12 is promoted in that sense.

Actually, assuming that the temperature of the IC chip when the base plate is made of a stainless steel plate is 100%, the temperature of the IC chip when the base plate is made of an Al plate is considerably reduced to about 92.8%. Has been confirmed.

As described above, the temperature of the IC chip itself can be reduced, and the local temperature rise of the suspension around the IC chip can be suppressed. As a result, the operation of the IC circuit can be stabilized, the thermal deformation of the suspension can be prevented, and the adverse effect of heat on the thin-film magnetic head element can be prevented. Moreover, the space between the HGA and the magnetic disk is not hindered.

FIG. 5 shows an HG according to another embodiment of the present invention.
FIG. 6A is a perspective view showing a schematic structure of FIG.
It is an exploded perspective view of A.

As shown in these figures, the HGA has a magnetic head slider 51 provided with at least one thin-film magnetic head element fixed to the tip of a suspension 50 and a head drive at a position behind the base of the suspension 50. And a read signal amplifying IC chip 52 mounted thereon. Magnetic head slider 51 and IC chip 5
Numeral 2 is attached to the surface of the suspension 50 facing the magnetic disk medium so as to face the surface of the magnetic disk medium.

The suspension 50 has an elastic flexure 53 that supports the magnetic head slider 51 at one end, a load beam 54 that supports and fixes the flexure 53, and also has an elastic load beam 54 and a base portion of the load beam 54. The base plate 55 and the second chip, which support the IC chip 52 near one end thereof and are electrically connected to a first wiring member formed on the flexure 53, are provided.
Flexible Printed Circuit (FP)
C) 59 mainly.

The magnetic head slider 51 has at least one thin-film magnetic head element formed by a write head element and an MR read head element. The size of the magnetic head slider 51 is merely an example, but it is 1.25.
mm × 1.0 mm × 0.3 mm.

In the IC chip 52, a drive circuit as a head amplifier and a read signal amplifying circuit are mounted as ICs. The size of the IC chip 52 is merely an example, but is 1.4 mm × 1.0 mm × 0.13 mm. Thus, the IC chip 52 has a very small and thin shape.

The flexure 53 has a soft tongue 53a centered on a dimple provided on the load beam 54, and has elasticity for stably supporting the magnetic head slider 51 with the tongue 53a to stabilize the flying attitude. ing. The flexure 53 has a thickness of about 2 in the present embodiment.
It is made of a 5 μm stainless steel plate (for example, SUS304TA), and is formed into a shape having a substantially uniform width.

On the flexure 53, a thin film pattern is directly formed by the same known patterning method as used for forming a printed circuit board on a thin metal plate. This thin film pattern constitutes a plurality of lead conductors and connection pads as a first wiring member, and one end of the lead conductor is provided on one end (tip) of the flexure 53 by the magnetic head slider 51. The other end is connected to an intermediate connection pad 60 provided at the other end (rear end) of the flexure 53.

The FPC 59 is formed by forming a lead conductor and a connection pad as a second wiring member on a resin layer and forming a resin coating layer on the lead conductor. Is adhered to the end of.

One end of each of the plurality of lead conductors formed on the FPC 59 is connected to an intermediate connection pad 61 provided at one end (tip) of the FPC 59, and the other end is connected to the other end of the FPC 59. It is connected to an external circuit connection pad 57 provided at the portion (rear end). An IC chip connection pad 58 is located at an intermediate position near one end of the lead conductor so as to be located near the rear of the load beam 54.
Are formed.

The load beam 54 has elasticity for pressing the magnetic head slider 51 in the direction of the magnetic disk to stabilize the flying height. This load beam 54
Is about 60-65 μm with a width narrowing toward the tip
The flexure 53 is fixedly supported over the entire length thereof by spot welding using a laser beam or the like.

As in the present embodiment, the flexure 5
In a suspension having a three-piece structure in which the load beam 3 and the load beam 54 are independent components, the rigidity of the load beam 54 is higher than the rigidity of the flexure 53. Instead of separately providing the flexure 53 and the load beam 54, a suspension having a two-piece structure of a base plate and a flexure load beam may be used.

The base plate 55 is formed of a plate member having higher thermal conductivity than stainless steel. This high thermal conductivity plate member has high thermal conductivity and is lightweight,
Further, an Al plate is most preferable in terms of corrosion resistance and the like, but is not limited thereto, and Al, Cu, Mg, an Al alloy,
A metal plate member containing one selected from a Cu alloy and a Mg alloy can be used. The base plate 55 is thicker than the load beam 54, and is fixed to the base of the load beam 54 by spot welding using a laser or the like.

The HGA is mounted on the base plate 55
The mounting portion 55a of the movable arm 3 as shown in FIG.
The fixing is performed by fixing to the fixing portion 32 provided in 1 by some method.

As in the case of the embodiment of FIGS. 1 and 2,
The IC chip 52 is a bare chip, is located behind the base plate 55, and is flip-chip mounted on an IC chip connection pad 58 formed near one end of the FPC 59 by, for example, a gold ball. The gap between the bottom surface of the IC chip 52 and the thin film pattern is filled with an underfill layer for improving heat radiation characteristics, improving mechanical strength, and covering the IC chip 52.

Since the base plate 55 near the mounting position of the IC chip 52 is formed of a high thermal conductivity member having high thermal conductivity, that is, an Al plate, the heat generated by the IC chip 52 is conducted to the Al plate. Further, the IC chip 52 is further diffused toward the E block side, so that the IC chip 52 can be effectively cooled. In addition, since the heat capacity of the suspension is increased by the Al plate itself acting as a heat sink, the cooling of the IC chip 52 is promoted in that sense.

As described above, the temperature of the IC chip itself can be reduced, and the local temperature rise of the suspension around the IC chip can be suppressed. As a result, the operation of the IC circuit can be stabilized, the thermal deformation of the suspension can be prevented, and the adverse effect of heat on the thin-film magnetic head element can be prevented. Moreover, the space between the HGA and the magnetic disk is not hindered.

FIG. 7 is a perspective view showing a schematic structure of an HGA according to still another embodiment of the present invention, and FIG.
3 is an exploded perspective view of the HGA of FIG.

As shown in these figures, in the HGA, a magnetic head slider 71 having at least one thin-film magnetic head element is fixed to a tip end of a suspension 70, and a head is provided at a lateral position of a base of the suspension 70. A drive and readout signal amplifying IC chip 72 is mounted. Magnetic head slider 71 and IC chip 7
2 is mounted on the surface of the suspension 70 facing the magnetic disk medium so as to face the surface of the magnetic disk medium.

The suspension 70 has an elastic flexure 73 that carries the magnetic head slider 71 at one end, a load beam 74 that also supports and fixes the flexure 73 at the distal end, and a load beam 74 that also has elasticity.
4. A flexible printed circuit (FPC) supporting a base plate 75 provided at the base of the IC chip 72 and an IC chip 72 at an intermediate portion thereof, and having lead conductors and connection pads electrically connected to the magnetic head slider 71 and the IC chip 72. 79 mainly.

The magnetic head slider 71 has at least one thin-film magnetic head element formed by a write head element and an MR read head element. The size of the magnetic head slider 71 is merely an example, but it is 1.25.
mm × 1.0 mm × 0.3 mm.

In the IC chip 72, a drive circuit as a head amplifier and a read signal amplifying circuit are mounted as ICs. The size of the IC chip 72 is merely an example, but is 1.4 mm × 1.0 mm × 0.13 mm. Thus, the IC chip 72 has a very small and thin shape.

The flexure 73 has a soft tongue 73a centered on a dimple provided on the load beam 74. The tongue 73a has elasticity to flexibly support the magnetic head slider 71 and stabilize the flying posture. ing. In this embodiment, the flexure 73 has a thickness of about 2 mm.
It is made of a 5 μm stainless steel plate (for example, SUS304TA), and is formed into a shape having a substantially uniform width.

The FPC 79 is formed by forming a lead conductor and a connection pad as a wiring member on a resin layer, and forming a resin coating layer on the lead conductor. Is fixed with an adhesive. The FPC 79 has a structure in which the other end extends long behind the suspension 70 (long tail structure).

One end of each of the plurality of lead conductors formed on the FPC 79 is connected to a terminal electrode of the magnetic head slider 71 and is connected to a head connection pad 76 formed at one end (tip) of the FPC 79. The other end is connected to an external circuit connection pad 77 formed on the other end (rear end) of the FPC 79. In the middle of the lead conductor is the middle part of the FPC 79, but the base plate 7
The IC chip connection pads 78 are formed so as to be located on the sides of the IC chip 5.

The load beam 74 has elasticity for pressing the magnetic head slider 71 in the direction of the magnetic disk to stabilize the flying height. This load beam 74
Is about 60-65 μm with a width narrowing toward the tip
The flexure 73 is fixedly supported over the entire length thereof by spot welding using a laser beam or the like.

As in the present embodiment, the flexure 7
In a suspension having a three-piece structure in which the load beam 3 and the load beam 74 are independent components, the rigidity of the load beam 74 is higher than the rigidity of the flexure 73. The flexure 73 and the load beam 74 may not be separately provided, and may be a two-piece suspension of a base plate and a flexure load beam.

The base plate 75 is formed of a plate member having a higher thermal conductivity than stainless steel. This high thermal conductivity plate member has high thermal conductivity and is lightweight,
Further, an Al plate is most preferable in terms of corrosion resistance and the like, but is not limited thereto, and Al, Cu, Mg, an Al alloy,
A metal plate member containing one selected from a Cu alloy and a Mg alloy can be used. The base plate 75 is thicker than the load beam 74, and is fixed to the base of the load beam 74 by spot welding using a laser or the like.

The HGA is mounted on the base plate 75
The mounting portion 75a of the movable arm 3 as shown in FIG.
The fixing is performed by fixing to the fixing portion 32 provided in 1 by some method.

As in the case of the embodiment of FIGS. 1 and 2,
The IC chip 72 is a bare chip, is located on the side of the base plate 75, and is flip-chip mounted on the IC chip connection pad 78 formed on the FPC 79 using, for example, a gold ball. The gap between the bottom surface of the IC chip 72 and the thin film pattern is filled with an underfill layer for improving heat radiation characteristics, improving mechanical strength, and covering the IC chip 72.

Since the base plate 75 near the mounting position of the IC chip 72 is formed of a high thermal conductivity member having a high thermal conductivity, that is, an Al plate, the heat generated by the IC chip 72 is conducted to the Al plate. Further, the IC chip 72 can be effectively cooled by diffusing it further to the E block side. In addition, since the heat capacity of the suspension is increased by the Al plate itself acting as a heat sink, the cooling of the IC chip 72 is promoted in that sense.

As described above, the temperature of the IC chip itself can be reduced, and the local temperature rise of the suspension around the IC chip can be suppressed. As a result, the operation of the IC circuit can be stabilized, the thermal deformation of the suspension can be prevented, and the adverse effect of heat on the thin-film magnetic head element can be prevented. Moreover, the space between the HGA and the magnetic disk is not hindered.

The embodiments described above all show the present invention by way of example and not by way of limitation, and the present invention can be embodied in other various modifications and alterations. Therefore, the scope of the present invention is defined only by the appended claims and their equivalents.

[0065]

According to the present invention, as described in detail above, the IC chip is configured to be mounted on the wiring member near the base plate or is actually mounted.
The base plate is formed of a member having higher thermal conductivity than stainless steel. Therefore, not only the heat capacity of the suspension is increased, but also the heat generated by the member having high thermal conductivity can be diffused over a wide area and cooled, so that the temperature of the IC chip itself can be reduced. At the same time, a local temperature rise of the surrounding suspension can be suppressed. In particular, in the HGA, since a base plate is attached to each movable arm of the E block and attached to the HDD, heat can be transmitted to the E block very efficiently by configuring the base plate with a member having high thermal conductivity. In addition, since the E block is thick and large in volume, it has a large heat capacity. In many cases, the E block is made of an Al material and has a very high thermal conductivity, so that the cooling effect of the IC chip is very high. As a result, the operation of the IC circuit can be stabilized, and thermal deformation of the suspension can be prevented.

[Brief description of the drawings]

FIG. 1 is a perspective view showing a schematic structure of an HGA according to an embodiment of the present invention.

FIG. 2 is an exploded perspective view of the HGA in the embodiment of FIG.

FIG. 3 is an explanatory diagram showing an HGA and an E block to which the HGA is attached.

FIG. 4 is a diagram illustrating various mounting modes of the HGA to the movable arm.

FIG. 5 is a perspective view showing a schematic structure of an HGA according to another embodiment of the present invention.

FIG. 6 is an exploded perspective view of the HGA in the embodiment of FIG.

FIG. 7 is a perspective view showing a schematic structure of an HGA according to still another embodiment of the present invention.

8 is an exploded perspective view of the HGA in the embodiment of FIG.

[Explanation of symbols]

 10, 50, 70 Suspension 11, 51, 71 Magnetic head slider 12, 52, 72 IC chip 13, 53, 73 Flexure 13a, 53a, 73a Tongue 14, 54, 74 Load beam 15, 55, 75 Base plate 15a, 55a , 75a Attachment section 16, 56, 76 Connection pad for head 17, 57, 77 Connection pad for external circuit 18, 58, 78 Connection pad for IC chip 30 E block 31 Movable arm 32 Fixed section 33 Adhesive 34 Rivet 35 Screw 59 , 79 FPC 60, 61 Intermediate connection pad

Continuation of front page (72) Inventor Ken Wada, 1-13-1 Nihonbashi, Chuo-ku, Tokyo TDK Corporation (72) Inventor Norioka Ota 1-13-1 Nihonbashi, Chuo-ku, Tokyo TDK Corporation (72) Inventor Takashi Honda 1-13-1, Nihonbashi, Chuo-ku, Tokyo F-term in TDK Corporation 5D042 NA02 PA01 PA09 TA07 TA09 5D059 AA01 BA01 CA26 CA29 DA33 DA36 EA08

Claims (14)

[Claims] 1. A flexure made of stainless steel having elasticity for supporting a magnetic head slider having at least one thin-film magnetic head element, and a flexure supporting the flexure for applying a predetermined load to the magnetic head slider. A load beam made of stainless steel, a base plate fixed to the base of the load beam, and a wiring member configured to mount an IC chip mounted with a circuit for the thin-film magnetic head element near the base plate. And the base plate is formed of a member having a higher thermal conductivity than stainless steel. 2. The suspension according to claim 1, wherein the wiring member is formed directly on the flexure. 3. The suspension according to claim 1, wherein the wiring member is made of an FPC. 4. The suspension according to claim 1, wherein the wiring member includes a portion formed directly on the flexure and a portion formed of an FPC. 5. The suspension according to claim 1, wherein the IC chip is mounted on the wiring member at a position lateral to the base plate. 6. The semiconductor device according to claim 1, wherein the IC chip is mounted on the FPC at a position behind the base plate.
Suspension according to item. 7. A member having a higher thermal conductivity than the stainless steel is made of Al, Cu, Mg, an Al alloy, a Cu alloy and Mg.
The suspension according to any one of claims 1 to 6, wherein the suspension is a metal member including one selected from alloys. 8. A magnetic head slider having at least one thin-film magnetic head element, a flexure made of stainless steel having elasticity fixing the magnetic head slider, and supporting the flexure. A load beam made of stainless steel for applying a predetermined load, a base plate fixed to a base of the load beam, an IC chip on which a circuit for the thin-film magnetic head element is mounted, and the IC chip mounted near the base plate A head gimbal assembly, wherein the base plate is formed of a member having higher thermal conductivity than stainless steel. 9. The head gimbal assembly according to claim 8, wherein said wiring member is formed directly on said flexure. 10. The head gimbal assembly according to claim 8, wherein the wiring member is made of an FPC. 11. The head gimbal assembly according to claim 8, wherein the wiring member includes a portion formed directly on the flexure and a portion formed of an FPC. 12. The head gimbal assembly according to claim 8, wherein the IC chip is mounted on the wiring member at a position lateral to the base plate. 13. The head gimbal assembly according to claim 8, wherein the IC chip is mounted on the FPC at a position behind the base plate. 14. A member having a higher thermal conductivity than the stainless steel is made of Al, Cu, Mg, an Al alloy, a Cu alloy and M
The head gimbal assembly according to any one of claims 8 to 13, wherein the head gimbal assembly is a metal member including one selected from g alloys.