JP2002232124A - Electric circuit board and air conditioner, and manufacturing method thereof - Google Patents

Electric circuit board and air conditioner, and manufacturing method thereof

Info

Publication number
JP2002232124A
JP2002232124A JP2001024416A JP2001024416A JP2002232124A JP 2002232124 A JP2002232124 A JP 2002232124A JP 2001024416 A JP2001024416 A JP 2001024416A JP 2001024416 A JP2001024416 A JP 2001024416A JP 2002232124 A JP2002232124 A JP 2002232124A
Authority
JP
Japan
Prior art keywords
insertion hole
conductor wiring
circuit board
electronic component
refrigerant
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP2001024416A
Other languages
Japanese (ja)
Inventor
Hiroyuki Matsubara
弘之 松原
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Daikin Industries Ltd
Original Assignee
Daikin Industries Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Daikin Industries Ltd filed Critical Daikin Industries Ltd
Priority to JP2001024416A priority Critical patent/JP2002232124A/en
Publication of JP2002232124A publication Critical patent/JP2002232124A/en
Pending legal-status Critical Current

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Landscapes

  • Electric Connection Of Electric Components To Printed Circuits (AREA)
  • Structure Of Printed Boards (AREA)
  • Air Conditioning Control Device (AREA)

Abstract

PROBLEM TO BE SOLVED: To easily package electronic components on an electric circuit board. SOLUTION: In the electric circuit board 33 provided at the outdoor machine of an air conditioner, a projection 33c of conductor wiring 33a is removed by punching, using a puncher. As a result, the diameter of a first contact hole 34 of the conductor wiring 33a becomes the same as that of a second contact hole 35 of a resin material 33b. When the electronic components are to be packaged, a lead cannot be hooked to the projection 33c, thus the lead can be inserted and second insertion holes 34 and 35.

Description

【発明の詳細な説明】DETAILED DESCRIPTION OF THE INVENTION

【0001】[0001]

【発明の属する技術分野】本発明は、電路板、特に、空
気調和機に用いられる電路板に関する。また本発明は、
空気調和機、特に、室外機に配置される電路板を備える
空気調和機に関する。
The present invention relates to an electric circuit board, and more particularly to an electric circuit board used for an air conditioner. The present invention also provides
The present invention relates to an air conditioner, particularly to an air conditioner having an electric circuit board disposed in an outdoor unit.

【0002】[0002]

【従来の技術】室内機と室外機とから構成されるセパレ
ート型の空気調和機では、リモコンからの信号(運転モ
ード・設定室温など)が室内機に受信されると、その信
号は、電気ケーブルを介して室外機の制御板に送信され
る。制御板は、受信した信号(運転モード・設定室温な
ど)に基づいて、冷媒回路を制御し、室内機から室内に
冷気又は暖気が供給される。また制御板は、室温が設定
室温になるように冷気又は暖気の温度を調節する。
2. Description of the Related Art In a separate type air conditioner including an indoor unit and an outdoor unit, when a signal (operation mode, set room temperature, etc.) from a remote controller is received by an indoor unit, the signal is transmitted to an electric cable. Is transmitted to the control panel of the outdoor unit via the. The control plate controls the refrigerant circuit based on the received signal (operation mode, set room temperature, etc.), and cool air or warm air is supplied from the indoor unit to the room. The control plate adjusts the temperature of the cold air or the warm air so that the room temperature becomes the set room temperature.

【0003】このような空気調和機では、金属薄板の導
体配線を樹脂と一体成型した電路板が、例えば室外機に
設けられる。制御板・商用電源及び室内機からの電気ケ
ーブルが電路板に接続され、制御板・商用電源及び室内
機が互いに電気的に接続される。
[0003] In such an air conditioner, an electric circuit board in which conductor wiring of a thin metal plate is integrally formed with resin is provided in, for example, an outdoor unit. An electric cable from the control board / commercial power supply and the indoor unit is connected to the electric circuit board, and the control board / commercial power supply and the indoor unit are electrically connected to each other.

【0004】[0004]

【発明が解決しようとする課題】電路板は、電子部品を
実装するための挿入孔を有している。この挿入孔は、樹
脂及び導体配線を貫通して形成され、内部の導体配線を
露出するように形成される。導体配線に樹脂を一体成型
する段階では、導体配線に部品挿入用の挿入孔を形成
し、導体配線の挿入孔を金型の突起部にはめ込んで固定
し、樹脂を流し込む。このとき樹脂に形成される孔は導
体配線の孔よりも大きくなり、樹脂の孔から導体配線が
はみ出して形成される。電路板に電子部品を実装する際
には、電子部品のリードがはみ出した導体配線に引っか
って実装作業が困難となっている。
The electric circuit board has an insertion hole for mounting an electronic component. The insertion hole is formed to penetrate the resin and the conductor wiring, and is formed so as to expose the internal conductor wiring. In the step of integrally molding the resin with the conductor wiring, an insertion hole for inserting a component is formed in the conductor wiring, the insertion hole of the conductor wiring is fitted into the protrusion of the mold and fixed, and the resin is poured. At this time, the hole formed in the resin becomes larger than the hole of the conductor wiring, and the conductor wiring protrudes from the hole of the resin and is formed. When mounting an electronic component on a circuit board, the mounting work is difficult due to the conductor wiring protruding from the lead of the electronic component.

【0005】本発明の課題は、電路板への電子部品の実
装を容易にすることである。
An object of the present invention is to facilitate mounting of electronic components on a circuit board.

【0006】[0006]

【課題を解決するための手段】請求項1に係る電路板
は、室内機及び室外機を備える空気調和機に設けられ、
電子部品が実装可能であり、電子部品と外部の回路とを
電気的に接続可能な電路板に関し、導体配線と樹脂部材
とを備えている。導体配線は、金属薄板で形成され、電
子部品を実装する実装面、電子部品を実装するための第
1挿入孔、実装面側から第1挿入孔を介して挿入された
電子部品を半田付けするための半田面を有している。樹
脂部材は、導体配線の実装面及び半田面に一体成型さ
れ、第1挿入孔に対応する位置に第2挿入孔を有してい
る。また、樹脂部材の第2挿入孔は、導体配線の実装面
側において第1挿入孔と略同一であり、導体配線の半田
面において第1挿入孔よりも大きく形成されている。
An electric circuit board according to claim 1 is provided in an air conditioner having an indoor unit and an outdoor unit,
An electric circuit board on which an electronic component can be mounted and which can electrically connect the electronic component to an external circuit is provided with a conductor wiring and a resin member. The conductor wiring is formed of a thin metal plate, and is used to solder an electronic component inserted through the first insertion hole from the mounting surface on which the electronic component is mounted, the first insertion hole for mounting the electronic component, and the mounting surface. For soldering. The resin member is integrally molded with the mounting surface and the solder surface of the conductor wiring, and has a second insertion hole at a position corresponding to the first insertion hole. The second insertion hole of the resin member is substantially the same as the first insertion hole on the mounting surface side of the conductor wiring, and is formed larger than the first insertion hole on the solder surface of the conductor wiring.

【0007】このような電路板では、部品実装面側にお
いて、導体配線及び樹脂部材の第1挿入孔及び第2挿入
孔が略同一に形成されているために、電子部品のリード
が引っかかることなく挿入される。請求項1に係る電路
板によれば、電子部品の実装が容易となる。
In such an electric circuit board, the first and second insertion holes of the conductor wiring and the resin member are formed substantially identically on the component mounting surface side, so that the leads of the electronic component are not caught. Inserted. According to the electric circuit board according to the first aspect, mounting of the electronic component becomes easy.

【0008】請求項2に係る電路板は、請求項1に係る
電路板において、導体配線は第1挿入孔の縁部において
折り曲げ部を有している。この電路板も、第1挿入孔及
び第2挿入孔が略同一に形成されているため、請求項1
に係る電路板と同様の作用・効果を奏する。さらに、導
体配線の折り曲げ部と電子部品のリードとの接触面積が
大きく、導体配線と電子部品の接触不良を起こしにく
い。
According to a second aspect of the present invention, in the electrical circuit board according to the first aspect, the conductor wiring has a bent portion at an edge of the first insertion hole. Also in this electric circuit board, the first insertion hole and the second insertion hole are formed to be substantially the same,
The same operations and effects as those of the electric circuit board according to the first embodiment are obtained. Further, the contact area between the bent portion of the conductor wiring and the lead of the electronic component is large, and poor contact between the conductor wiring and the electronic component hardly occurs.

【0009】請求項3に係る空気調和機は、室内機と冷
媒配管と室外機と制御板と電路板とを備えている。室内
機は、室内空気を冷媒との間で熱交換させ、室内に冷気
又は暖気を供給する。冷媒配管は、室内機に一端が接続
され、冷媒を流通可能である。室外機は、冷媒配管の他
端に接続され、室内機及び冷媒配管と共に冷媒回路を構
成しており、圧縮又は減圧した冷媒を冷媒配管を介して
室内機に供給する。制御板は、冷媒回路を制御する。電
路板は、請求項1又は2に記載の電路板であり、例えば
室外機に設けられ、制御板、室内機及び商用電源に電気
的に接続されている。請求項3に係る空気調和機によれ
ば、請求項1又は2に係る電路板の場合と同様の効果を
奏する。
An air conditioner according to a third aspect includes an indoor unit, a refrigerant pipe, an outdoor unit, a control plate, and an electric circuit board. The indoor unit causes indoor air to exchange heat with the refrigerant, and supplies cool air or warm air to the room. One end of the refrigerant pipe is connected to the indoor unit, and the refrigerant pipe can flow the refrigerant. The outdoor unit is connected to the other end of the refrigerant pipe, constitutes a refrigerant circuit together with the indoor unit and the refrigerant pipe, and supplies the compressed or decompressed refrigerant to the indoor unit via the refrigerant pipe. The control plate controls the refrigerant circuit. The electric circuit board is the electric circuit board according to claim 1 or 2, and is provided in, for example, an outdoor unit, and is electrically connected to a control board, an indoor unit, and a commercial power supply. According to the air conditioner according to the third aspect, the same effect as in the case of the electric circuit board according to the first or second aspect is exerted.

【0010】請求項4に係る電路板の製造方法は、室内
機及び室外機を備える空気調和機に設けられ電子部品が
実装可能であり、電子部品と外部の回路とを電気的に接
続可能な電路板の製造方法に関し、以下の段階を含んで
いる。即ち、電子部品を実装する実装面、電子部品を実
装するための第1挿入孔、実装面側から第1挿入孔を介
して挿入された電子部品を半田付けするための半田面を
有する金属薄板の導体配線を形成する段階と;導体配線
の実装面及び半田面に樹脂を一体成型し、第1挿入孔に
対応する位置に第1挿入孔よりも大きい第2挿入孔を樹
脂に形成する段階と;第1挿入孔が第2挿入孔の部品実
装面側の大きさと略同一になるように導体配線を打ち抜
く段階と;を含んでいる。
According to a fourth aspect of the present invention, there is provided a method of manufacturing an electric circuit board, wherein an electronic component is mounted on an air conditioner having an indoor unit and an outdoor unit, and an electronic circuit can be electrically connected to an external circuit. The method for manufacturing a circuit board includes the following steps. That is, a thin metal plate having a mounting surface for mounting an electronic component, a first insertion hole for mounting the electronic component, and a solder surface for soldering the electronic component inserted from the mounting surface side through the first insertion hole. Forming a conductor wiring; and molding a resin integrally with the mounting surface and the solder surface of the conductor wiring, and forming a second insertion hole larger than the first insertion hole in the resin at a position corresponding to the first insertion hole. And punching out the conductor wiring so that the first insertion hole has substantially the same size as the second insertion hole on the component mounting surface side.

【0011】請求項4に係る製造方法では、複数の導体
配線を同時に一体に形成し;一体に形成された複数の導
体配線を金型に固定した後に樹脂成形し、第2挿入孔を
樹脂に形成し;導体配線を分離して回路を完成させると
同時に第2挿入孔の部品実装面側からはみ出した導体配
線を打ち抜く。この場合、複数の導体配線を同時に形成
し金型に固定するので、導体配線の金型への固定が容易
である。また、導体配線を分離すると同時に第2挿入孔
の部品実装面からはみ出した導体配線を打ち抜くため、
打ち抜き作業によって工数が増えることはない。
According to a fourth aspect of the present invention, a plurality of conductor wirings are formed integrally at the same time; the plurality of integrally formed conductor wirings are fixed to a mold and then molded with a resin, and the second insertion hole is formed in the resin. Forming; separating the conductor wiring to complete the circuit, and simultaneously punching out the conductor wiring protruding from the component mounting surface side of the second insertion hole. In this case, since a plurality of conductor wirings are simultaneously formed and fixed to the mold, it is easy to fix the conductor wiring to the mold. Also, in order to separate the conductor wiring and simultaneously punch out the conductor wiring protruding from the component mounting surface of the second insertion hole,
The work does not increase by the punching work.

【0012】請求項4に係る電路板の製造方法によれ
ば、請求項1に係る電路板の場合と同様の作用効果を奏
する。また、導体配線を分離すると同時に第2挿入孔の
部品実装面側からはみ出した部分を打ち抜けば良いの
で、打ち抜き作業によって工数が増えることがない。
According to the circuit board manufacturing method of the fourth aspect, the same operation and effect as those of the circuit board of the first aspect can be obtained. In addition, since it is only necessary to punch out the portion of the second insertion hole protruding from the component mounting surface side at the same time as separating the conductor wiring, the number of steps does not increase due to the punching operation.

【0013】請求項5に係る電路板の製造方法は、第2
挿入孔からはみ出した導体配線を折り曲げて、第1挿入
孔を第2挿入孔の部品実装面側の大きさと略同一に形成
する。請求項5に係る電路板の製造方法によれば、請求
項2に係る電路板の場合と同様の作用効果を奏する。ま
た、従来通り導体配線に樹脂を一体成型した後に、はみ
出した導体配線を折り曲げて第1挿入孔を第2挿入孔の
部品実装面側の大きさと略同一に形成すればよいので、
電路板の製造が容易である。
According to a fifth aspect of the present invention, there is provided a method of manufacturing an electric circuit board.
The conductor wiring protruding from the insertion hole is bent, and the first insertion hole is formed to have substantially the same size as the second insertion hole on the component mounting surface side. According to the method of manufacturing the electric circuit board according to the fifth aspect, the same operation and effect as in the case of the electric circuit board according to the second aspect are exhibited. In addition, after the resin is integrally molded with the conductor wiring as before, the protruding conductor wiring may be bent to form the first insertion hole with substantially the same size as the second insertion hole on the component mounting surface side.
The manufacture of the circuit board is easy.

【0014】[0014]

【発明の実施の形態】〔全体構成〕図1は、本発明の一
実施形態に係る空気調和機の概略構成を示すブロック図
である。本発明の空気調和機は、図1に示すように、冷
媒回路1と駆動回路2と制御回路3とを備えている。制
御回路3は、冷媒回路1及び駆動回路2を制御し、駆動
回路2からの出力によって冷媒回路1を駆動し、冷媒回
路1の冷媒の流れを制御して、室温を調節する。
DESCRIPTION OF THE PREFERRED EMBODIMENTS [Overall Configuration] FIG. 1 is a block diagram showing a schematic configuration of an air conditioner according to one embodiment of the present invention. The air conditioner of the present invention includes a refrigerant circuit 1, a drive circuit 2, and a control circuit 3, as shown in FIG. The control circuit 3 controls the refrigerant circuit 1 and the drive circuit 2, drives the refrigerant circuit 1 by the output from the drive circuit 2, controls the flow of the refrigerant in the refrigerant circuit 1, and adjusts the room temperature.

【0015】冷媒回路1の具体的な構成を図2に示す。
この冷媒回路1は、圧縮機11と、圧縮機11の吐出側
に接続された四方切換弁12と、四方切換弁12に接続
された室外熱交換器13と、室外熱交換器13に接続さ
れた減圧器(電動膨張弁)14と、減圧器14に接続さ
れた室内熱交換器15と、アキュムレータ16とを備え
ている。圧縮機11、四方切換弁12、室外熱交換器1
3、減圧器14及びアキュムレータ16は室外機に設け
られており、室内熱交換器15は室内機に設けられてい
る。また室外機及び室内機には、室外熱交換器13と室
内熱交換器15とに空気流を供給するためのファンがそ
れぞれ配置されている。
FIG. 2 shows a specific configuration of the refrigerant circuit 1.
The refrigerant circuit 1 is connected to a compressor 11, a four-way switching valve 12 connected to the discharge side of the compressor 11, an outdoor heat exchanger 13 connected to the four-way switching valve 12, and an outdoor heat exchanger 13. A pressure reducer (electric expansion valve) 14, an indoor heat exchanger 15 connected to the pressure reducer 14, and an accumulator 16. Compressor 11, four-way switching valve 12, outdoor heat exchanger 1
3, the decompressor 14 and the accumulator 16 are provided in the outdoor unit, and the indoor heat exchanger 15 is provided in the indoor unit. In the outdoor unit and the indoor unit, fans for supplying airflow to the outdoor heat exchanger 13 and the indoor heat exchanger 15 are arranged.

【0016】圧縮機11は、吸入側から冷媒を吸引し、
冷媒を圧縮し、圧縮された冷媒を吐出側から排出する装
置である。四方切換弁12は、4つの配管接続部(A,
B,C,D)を有しており、それぞれに接続される配管
をA−B間・C−D間(実線)又はA−D間・B−C間
(点線)で導通させ、流路を変更する装置である。室外
熱交換器13は、冷媒配管を折り返して平面視L字形に
形成されている。平面視L字形にするのは、空気流との
接触面積を大きくするためである。減圧器14は、冷媒
を減圧して排出する装置であり、例えば電動膨張弁が用
いられる。室内熱交換器15は、平行に配列される複数
の平板状のフィンと、それらを貫通する冷媒配管とから
構成されている。フィンは、アルミニウム等の熱伝導性
の良好な材質で形成され、複数が平行に配列される。こ
れによりフィンは、空気との接触面積が大きくなり、空
気と冷媒との熱交換効率を高めている。アキュムレータ
16は、圧縮機11の吸引側に接続され、圧縮機11に
液状の冷媒が混入するのを防止するための装置である。
The compressor 11 sucks the refrigerant from the suction side,
This is a device that compresses the refrigerant and discharges the compressed refrigerant from the discharge side. The four-way switching valve 12 has four pipe connection parts (A,
B, C, D), and pipes connected to each other are conducted between A and B and between C and D (solid line) or between A and D and between B and C (dotted line), thereby forming a flow path. Is a device for changing The outdoor heat exchanger 13 is formed by folding a refrigerant pipe to have an L shape in plan view. The reason why the shape is an L shape in a plan view is to increase the contact area with the air flow. The decompressor 14 is a device that decompresses and discharges the refrigerant, for example, an electric expansion valve is used. The indoor heat exchanger 15 is composed of a plurality of flat fins arranged in parallel and a refrigerant pipe penetrating therethrough. The fins are formed of a material having good heat conductivity such as aluminum, and a plurality of fins are arranged in parallel. As a result, the contact area between the fin and the air is increased, and the heat exchange efficiency between the air and the refrigerant is increased. The accumulator 16 is a device that is connected to the suction side of the compressor 11 and that prevents liquid refrigerant from being mixed into the compressor 11.

【0017】冷媒回路1を駆動する駆動回路2の構成を
図3に示す。駆動回路2は、主に、整流回路21とイン
バータ22とを備えている。整流回路21は、ダイオー
ドブリッジや大容量のアルミ電解コンデンサ等から構成
され、入力側が商用電源20に接続されている。インバ
ータ22は、FETやIGBT等のパワー素子で構成さ
れるブリッジ回路であり、制御回路3からのドライブ信
号によって駆動される。この駆動回路では、商用電源2
0からの電力が整流回路21に入力されると、整流回路
21のダイオードブリッジによって整流され、アルミ電
解コンデンサによって平滑される。この整流及び平滑さ
れた電力がインバータ22に入力される。インバータ2
2のパワー素子が、制御回路3からのドライブ信号によ
って駆動されると、整流回路21からの出力が所定周波
数の電力信号に変換されて圧縮機11のモータ11aに
出力される。このようにして圧縮機11が駆動される。
また、制御回路3からのドライブ信号の周波数を調節す
ることによって圧縮機11の回転周波数を調節し、冷房
又は暖房の能力を調節する。
FIG. 3 shows the configuration of the drive circuit 2 for driving the refrigerant circuit 1. The drive circuit 2 mainly includes a rectifier circuit 21 and an inverter 22. The rectifier circuit 21 includes a diode bridge, a large-capacity aluminum electrolytic capacitor, and the like, and has an input side connected to the commercial power supply 20. The inverter 22 is a bridge circuit including a power element such as an FET or an IGBT, and is driven by a drive signal from the control circuit 3. In this drive circuit, the commercial power supply 2
When power from 0 is input to the rectifier circuit 21, it is rectified by the diode bridge of the rectifier circuit 21 and smoothed by the aluminum electrolytic capacitor. The rectified and smoothed power is input to the inverter 22. Inverter 2
When the two power elements are driven by the drive signal from the control circuit 3, the output from the rectifier circuit 21 is converted into a power signal of a predetermined frequency and output to the motor 11a of the compressor 11. Thus, the compressor 11 is driven.
Further, by adjusting the frequency of the drive signal from the control circuit 3, the rotation frequency of the compressor 11 is adjusted, and the cooling or heating capacity is adjusted.

【0018】図4には、制御回路3の構成を示す。制御
回路3は、主に、制御部30、メモリ31、センサ3
2、電路板33、室内機マイコン51、I/F52、受
信部53及びセンサ54を備えている。室内機マイコン
51、I/F52、受信部53及びセンサ54は、室内
機50に備えられている。また、制御部30、メモリ3
1、センサ32及び駆動回路2は、後述するように、室
外機40の制御板45に実装されている。また、室外機
40には電路板33が設けられ、この電路板33によっ
て制御板45、商用電源20及び室内機50が互いに電
気的に接続されている。
FIG. 4 shows the configuration of the control circuit 3. The control circuit 3 mainly includes a control unit 30, a memory 31, a sensor 3,
2, a circuit board 33, an indoor unit microcomputer 51, an I / F 52, a receiving unit 53, and a sensor 54. The indoor unit microcomputer 51, the I / F 52, the receiving unit 53, and the sensor 54 are provided in the indoor unit 50. The control unit 30 and the memory 3
1, the sensor 32 and the drive circuit 2 are mounted on a control plate 45 of the outdoor unit 40 as described later. An electric circuit board 33 is provided in the outdoor unit 40, and the control board 45, the commercial power supply 20, and the indoor unit 50 are electrically connected to each other by the electric circuit board 33.

【0019】制御部30は、冷媒回路1及び駆動回路2
を制御するための構成である。制御部30は、予め定め
られた制御手順のプログラムを実行して冷媒回路1及び
駆動回路2を制御するマイクロプロセッサや、駆動回路
2に出力するドライブ信号を発生させるためのドライブ
回路で構成されている。メモリ31は、設定室温、設定
湿度、運転モードや制御手順のプログラム等を格納して
いる。メモリ31は、図4のように制御部30と別途設
けても良いし、マイクロプロセッサに内蔵してもよい。
センサ32は、外気温を検出する温度センサや冷媒配管
温度を検出する温度センサを含んでいる。電路板33
は、I/F52からの電気信号及び商用電源20に含ま
れるノイズを除去するノイズ除去回路や、I/F52か
らの電気信号を制御部30が受信可能な電気信号に変換
するインターフェース回路を含んでいる。室内機マイコ
ン51は、受信部53、センサ54からの電気信号をI
/F52を介して電路板33に送信する。I/F52
は、室内機マイコン51からの電気信号を所定レベルの
電気信号に変換して電路板33に出力する。受信部53
は、リモコン等からの信号を受信して室内機マイコン5
1に出力する。センサ54は、室温を検出する温度セン
サや室内湿度を検出する湿度センサを含んでいる。
The control unit 30 includes a refrigerant circuit 1 and a drive circuit 2
This is a configuration for controlling. The control unit 30 includes a microprocessor that executes a program of a predetermined control procedure to control the refrigerant circuit 1 and the drive circuit 2, and a drive circuit that generates a drive signal to be output to the drive circuit 2. I have. The memory 31 stores a set room temperature, a set humidity, an operation mode, a control procedure program, and the like. The memory 31 may be provided separately from the control unit 30 as shown in FIG. 4 or may be built in the microprocessor.
The sensors 32 include a temperature sensor that detects an outside air temperature and a temperature sensor that detects a refrigerant pipe temperature. Circuit board 33
Includes a noise removal circuit that removes an electric signal from the I / F 52 and noise included in the commercial power supply 20, and an interface circuit that converts the electric signal from the I / F 52 into an electric signal that can be received by the control unit 30. I have. The indoor unit microcomputer 51 converts the electric signals from the receiving unit 53 and the sensor 54 into I
The signal is transmitted to the electric circuit board 33 via / F52. I / F52
Converts an electric signal from the indoor unit microcomputer 51 into an electric signal of a predetermined level and outputs the electric signal to the electric circuit board 33. Receiver 53
Receives signals from a remote controller or the like and
Output to 1. The sensors 54 include a temperature sensor for detecting room temperature and a humidity sensor for detecting indoor humidity.

【0020】〔空調運転〕このような空気調和機では、
受信部53が運転モード、設定室温等を受信すると、こ
の指示の信号がマイコン51からI/F52に出力さ
れ、所定レベルの電気信号に変換されて電路板33に出
力される。この電気信号(運転モード、設定室温)は、
電路板33のノイズ除去回路でノイズを取り除かれ、イ
ンターフェース回路でマイコンが受信可能な電気信号に
変換される。そして、これらの指令(運転モード、設定
室温)は、制御部30によりメモリ31の所定領域に格
納される。制御部30は、この指令(運転モード、設定
室温)及びメモリ31に格納されているプログラムに基
づいて、冷媒回路1を制御し、駆動回路2にドライブ信
号を出力する。具体的には、制御部30は、四方切換弁
12を切り換え、減圧器14の弁を所定の開度に調節す
る。また、商用電源20から電路板33を介して駆動回
路2に入力される電力を所定周波数の電力信号に変換し
て、冷媒回路1の圧縮機11を駆動する。
[Air-conditioning operation] In such an air conditioner,
When the receiving unit 53 receives the operation mode, the set room temperature, and the like, the instruction signal is output from the microcomputer 51 to the I / F 52, converted into an electric signal of a predetermined level, and output to the electric circuit board 33. This electric signal (operation mode, set room temperature)
The noise is removed by the noise removal circuit of the circuit board 33, and the interface circuit converts the noise into an electric signal that can be received by the microcomputer. Then, these commands (operation mode, set room temperature) are stored in a predetermined area of the memory 31 by the control unit 30. The control unit 30 controls the refrigerant circuit 1 based on the command (operation mode, set room temperature) and a program stored in the memory 31 and outputs a drive signal to the drive circuit 2. Specifically, the control unit 30 switches the four-way switching valve 12 and adjusts the valve of the pressure reducer 14 to a predetermined opening. In addition, the compressor 11 of the refrigerant circuit 1 is driven by converting the power input from the commercial power supply 20 to the drive circuit 2 via the electric circuit board 33 into a power signal of a predetermined frequency.

【0021】以下、冷房時及び暖房時における冷媒回路
1での冷媒の流れを、図2を参照して説明する。冷房運
転時には、四方切換弁12を実線の位置とし、減圧器1
4を所定の開度に絞り、圧縮機11を起動する。圧縮機
11から吐出される高圧冷媒は、室外熱交換器13で凝
縮した後、減圧器14で減圧される。減圧された低圧冷
媒は、室内熱交換器15で蒸発した後、四方切換弁1
2、アキュムレータ16を介して圧縮機11に戻る。室
内熱交換器15で冷媒が蒸発する際に、室内空気は冷媒
に熱を奪われ、この熱を奪われた室内空気が冷気として
働く。
Hereinafter, the flow of the refrigerant in the refrigerant circuit 1 during cooling and heating will be described with reference to FIG. During the cooling operation, the four-way switching valve 12 is set to the position indicated by the solid line,
4 is reduced to a predetermined opening, and the compressor 11 is started. The high-pressure refrigerant discharged from the compressor 11 is condensed in the outdoor heat exchanger 13 and then decompressed by the decompressor 14. After the decompressed low-pressure refrigerant evaporates in the indoor heat exchanger 15, the four-way switching valve 1
2. Return to the compressor 11 via the accumulator 16. When the refrigerant evaporates in the indoor heat exchanger 15, the indoor air deprives the refrigerant of heat, and the deprived indoor air acts as cool air.

【0022】暖房運転時には、四方切換弁12を点線の
位置とし、減圧器14を所定の開度に絞り、圧縮機11
を起動する。圧縮機11から吐出される高圧冷媒は、室
内熱交換器15で凝縮した後、減圧器14によって減圧
される。減圧された低圧冷媒は、室外熱交換器13で蒸
発した後、四方切換弁12、アキュムレータ16を介し
て圧縮機11の吐出側に戻る。室内熱交換器15で冷媒
が凝縮する際に、室内空気に熱を放出するため、この熱
を吸収した室内空気が暖気として働く。
During the heating operation, the four-way switching valve 12 is set to the position indicated by the dotted line, and the pressure reducer 14 is throttled to a predetermined opening.
Start The high-pressure refrigerant discharged from the compressor 11 is condensed in the indoor heat exchanger 15 and then decompressed by the decompressor 14. The decompressed low-pressure refrigerant evaporates in the outdoor heat exchanger 13 and returns to the discharge side of the compressor 11 via the four-way switching valve 12 and the accumulator 16. When the refrigerant is condensed in the indoor heat exchanger 15, heat is released to the room air, and the room air that has absorbed this heat acts as warm air.

【0023】〔電路板〕以下、本実施形態に係る空気調
和機の室外機40と室内機50との具体的な構成及び配
置を説明し、その後、電路板33について説明する。
[Electric Circuit Board] Hereinafter, the specific configuration and arrangement of the outdoor unit 40 and the indoor unit 50 of the air conditioner according to the present embodiment will be described, and then the electric circuit board 33 will be described.

【0024】図5は、本実施形態に係る空気調和機の室
外機40及び室内機50の斜視図である。図6は、室外
機40の内部の斜視図である。室外機40は、屋外に後
面を建物に向けて設置される。プロペラファン(図示せ
ず)が駆動されると、室外機40の後面から外気が導入
され、導入された外気は室外熱交換器13に接触し、プ
ロペラファンにより前面から排出される。室内機50
は、上方から吸い込んだ室内空気を室内熱交換器15と
接触させ、クロスフローファン(図示せず)により前面
下方の吹き出し口から室内に供給する。
FIG. 5 is a perspective view of the outdoor unit 40 and the indoor unit 50 of the air conditioner according to the present embodiment. FIG. 6 is a perspective view of the inside of the outdoor unit 40. The outdoor unit 40 is installed outdoors with the rear surface facing the building. When a propeller fan (not shown) is driven, outside air is introduced from the rear surface of the outdoor unit 40, and the introduced outside air comes into contact with the outdoor heat exchanger 13 and is discharged from the front surface by the propeller fan. Indoor unit 50
, The indoor air sucked from above is brought into contact with the indoor heat exchanger 15 and is supplied into the room from the outlet at the lower front by a cross flow fan (not shown).

【0025】室内機50は、上述した室内熱交換機1
5、室内機マイコン51、I/F52、受信部53及び
センサ54が本体ケーシング55の内部に設けられてい
る。室外機40は、図5に示すように、本体ケーシング
41と閉鎖弁カバー42とを備えている。その内部に
は、図6に示すように、室外熱交換器13と機械室43
と電装箱44とを備えている。
The indoor unit 50 includes the indoor heat exchanger 1 described above.
5. The indoor unit microcomputer 51, the I / F 52, the receiving unit 53, and the sensor 54 are provided inside the main body casing 55. As shown in FIG. 5, the outdoor unit 40 includes a main body casing 41 and a closing valve cover 42. Inside, the outdoor heat exchanger 13 and the machine room 43 are installed as shown in FIG.
And an electrical box 44.

【0026】機械室43には、圧縮機11、四方切換弁
12、減圧器14及びアキュムレータ16が設けられて
いる。これらの圧縮機11、四方切換弁12、減圧器1
4及びアキュムレータ16と室外熱交換器13とは、そ
れぞれ図2に示すように冷媒配管により接続され、さら
に配管46,47によって室内熱交換器15に接続され
ている。電装箱44には、制御板45及び電路板33が
設けられている。制御板45は、上述したように、制御
部30、メモリ31、センサ32及び駆動回路2を備え
ている。駆動回路2の出力が圧縮機11に接続されてお
り、制御部30が四方切換弁12及び減圧器14に接続
されている。
The machine room 43 is provided with a compressor 11, a four-way switching valve 12, a pressure reducer 14, and an accumulator 16. These compressor 11, four-way switching valve 12, pressure reducer 1
As shown in FIG. 2, the accumulator 4, the accumulator 16 and the outdoor heat exchanger 13 are connected by refrigerant pipes, respectively, and further connected to the indoor heat exchanger 15 by pipes 46 and 47. The control box 45 and the electric circuit board 33 are provided in the electric component box 44. The control plate 45 includes the control unit 30, the memory 31, the sensor 32, and the drive circuit 2, as described above. The output of the drive circuit 2 is connected to the compressor 11, and the control unit 30 is connected to the four-way switching valve 12 and the pressure reducer 14.

【0027】電路板33は、図6に示すように、制御板
45の一端に並んで配置されており、制御板45上の制
御部30及び駆動回路2の入力側と電気的に接続されて
いる。また電路板33は、電気ケーブル48を介して商
用電源20及び室内機50(I/F52)と接続されて
いる。電路板33は、金属薄板の導体配線を樹脂と一体
成型した装置であり、図6に示すようにほぼ直方体に形
成される。
As shown in FIG. 6, the electric circuit board 33 is arranged along one end of the control board 45, and is electrically connected to the control unit 30 on the control board 45 and the input side of the drive circuit 2. I have. The electric circuit board 33 is connected to the commercial power supply 20 and the indoor unit 50 (I / F 52) via an electric cable 48. The electric circuit board 33 is a device in which conductor wiring of a thin metal plate is integrally formed with resin, and is formed in a substantially rectangular parallelepiped as shown in FIG.

【0028】電路板33の制御板45に対向する面の拡
大図(以下、表面という)を図7に、電路板33の制御
板45に対向しない面(以下、裏面という)の拡大図を
図8に示す。
FIG. 7 is an enlarged view of a surface of the electric circuit board 33 facing the control plate 45 (hereinafter referred to as a front surface), and FIG. 7 is an enlarged view of a surface of the electric circuit board 33 not facing the control plate 45 (hereinafter referred to as a back surface). FIG.

【0029】図7に示すように、電路板33の表面は部
品実装面であり、ノイズ除去回路及びインターフェイス
回路を構成する電子部品が実装される。また電路板33
には、これらの電子部品のリードを挿入するために挿入
孔34,35(後述)が多数設けられている。また実装
面には、駆動回路2と電気的に接続される接続孔61及
び制御部30と電気的に接続されるハーネス62とが設
けられている。これらの接続孔61・ハーネス62がそ
れぞれ制御基板45上の導体パターンと接続され、接続
孔61と駆動回路2、ハーネス62と制御部30がそれ
ぞれ電気的に接続される。
As shown in FIG. 7, the surface of the circuit board 33 is a component mounting surface, on which electronic components constituting a noise removing circuit and an interface circuit are mounted. The circuit board 33
Are provided with a large number of insertion holes 34 and 35 (described later) for inserting leads of these electronic components. A connection hole 61 electrically connected to the drive circuit 2 and a harness 62 electrically connected to the control unit 30 are provided on the mounting surface. The connection hole 61 and the harness 62 are respectively connected to the conductor pattern on the control board 45, and the connection hole 61 and the drive circuit 2 are electrically connected, and the harness 62 and the control unit 30 are electrically connected respectively.

【0030】本実施形態に係る電路板33の製造方法に
ついて、図9から図12を参照して説明する。まず、図
9(a)に示すように、第1挿入孔34が形成された導
体配線33aを金型70に固定する。金型70は、突起
部70aと、突起部70aの先端に連続して形成される
突起部70bと、突起部70aの先端に形成される凹部
70cとを有している。突起部70aの径は、第1挿入
孔34よりも大きく形成されている。突起部70bは、
図9(b)に示すように円筒形に形成し、その径が導体
配線33aの第1挿入孔34の径に合致するように形成
されている。凹部70cは、その内径が突起部70bの
径に合致するように形成されている。この突起部70b
に導体配線33aの第1挿入孔34をはめ込んみ、さら
に、突起部70bに凹部70cをはめ込んで、導体配線
33aを金型70に固定する。
A method of manufacturing the electric circuit board 33 according to the present embodiment will be described with reference to FIGS. First, as shown in FIG. 9A, the conductor wiring 33a in which the first insertion hole 34 is formed is fixed to the mold 70. The mold 70 has a projection 70a, a projection 70b formed continuously at the tip of the projection 70a, and a recess 70c formed at the tip of the projection 70a. The diameter of the protrusion 70a is formed larger than the first insertion hole 34. The protrusion 70b
As shown in FIG. 9 (b), it is formed in a cylindrical shape, and its diameter matches the diameter of the first insertion hole 34 of the conductor wiring 33a. The recess 70c is formed such that its inner diameter matches the diameter of the projection 70b. This projection 70b
Then, the first insertion hole 34 of the conductor wiring 33a is fitted therein, and further, the recess 70c is fitted in the projection 70b, thereby fixing the conductor wiring 33a to the mold 70.

【0031】次に、上下の金型70の間に樹脂を流し込
み、導体配線33aに樹脂を一体成型する。但し、上下
の突起部70aの部分には樹脂は流れ込まず、この部分
が後述する第2挿入孔35となる。
Next, a resin is poured between the upper and lower molds 70, and the resin is integrally molded with the conductor wiring 33a. However, the resin does not flow into the upper and lower protruding portions 70a, and this portion becomes a second insertion hole 35 described later.

【0032】上記の樹脂成型が終了すると、図10に示
すように、樹脂部材33bが導体配線33aを上下から
覆うように一体に形成されている。樹脂部材33bに
は、導体配線33aの第1挿入孔34に対応する位置に
第2挿入孔35が形成されている。その第2挿入孔35
は第1挿入孔34よりも大きく形成され、第2挿入孔3
5の部品実装面側には、導体配線33aのはみ出し部3
3cが形成されている。
When the resin molding is completed, as shown in FIG. 10, a resin member 33b is integrally formed so as to cover the conductor wiring 33a from above and below. A second insertion hole 35 is formed in the resin member 33b at a position corresponding to the first insertion hole 34 of the conductor wiring 33a. The second insertion hole 35
Are formed larger than the first insertion hole 34 and the second insertion hole 3
5, the protruding portion 3 of the conductor wiring 33a is provided on the component mounting surface side.
3c is formed.

【0033】ここで、このはみ出し部33cにリードが
引っかかって、電子部品のリードを第1挿入孔34に挿
入することが困難である。そこで、図11に示すよう
に、打ち抜き機71の上下の突起部71aによってはみ
出し部33cを打ち抜いて取り除く。打ち抜き処理を行
った後の第1挿入孔34は、図12に示すように、部品
実装面側において第2挿入孔35とほぼ同一の径とな
り、リードの挿入が容易になる。
Here, the lead is caught by the protruding portion 33c, and it is difficult to insert the lead of the electronic component into the first insertion hole 34. Therefore, as shown in FIG. 11, the protruding portion 33c is punched and removed by the upper and lower protrusions 71a of the punching machine 71. As shown in FIG. 12, the diameter of the first insertion hole 34 after the punching process is substantially the same as that of the second insertion hole 35 on the component mounting surface side, thereby facilitating the insertion of the lead.

【0034】〔他の実施形態〕他の実施形態に係る電路
板33の製造方法を、図13及び図14を参照して説明
する。この実施形態では、図13に示すように、樹脂成
型後の電路板33において、はみ出し部33cを半田面
側にバーリング処理する。バーリング処理後にはみ出し
部33cが折り曲げられて折り曲げ部33dとなり、部
品実装面側において第1挿入孔34と第2挿入孔35と
がほぼ同一の径となる。その結果、電子部品のリードを
第1挿入孔34に容易に挿入することができる。また、
折り曲げ部33dが形成されるためリードと折り曲げ部
33dとの接触面積が大きく、電子部品と導体配線33
aとの間の接触不良を起こしにくい。
[Other Embodiments] A method of manufacturing an electric circuit board 33 according to another embodiment will be described with reference to FIGS. In this embodiment, as shown in FIG. 13, in the circuit board 33 after resin molding, the protruding portion 33c is subjected to burring processing on the solder surface side. After the burring process, the protruding portion 33c is bent to form a bent portion 33d, and the first insertion hole 34 and the second insertion hole 35 have substantially the same diameter on the component mounting surface side. As a result, the lead of the electronic component can be easily inserted into the first insertion hole 34. Also,
Since the bent portion 33d is formed, the contact area between the lead and the bent portion 33d is large, and the electronic component and the conductor wiring 33 are formed.
It is unlikely to cause poor contact with a.

【0035】[0035]

【発明の効果】請求項1に係る電路板によれば、導体配
線及び樹脂部材の第1挿入孔及び第2挿入孔が略同一に
形成されているために、電子部品のリードが引っかかる
ことなく挿入され、電子部品の実装が容易となる。
According to the electric circuit board according to the first aspect, since the first insertion hole and the second insertion hole of the conductor wiring and the resin member are formed substantially the same, the lead of the electronic component is not caught. Insertion makes mounting of electronic components easy.

【0036】請求項2に係る電路板も、第1挿入孔及び
第2挿入孔が略同一に形成されているため、請求項1に
係る電路板と同様の作用・効果を奏する。さらに、導体
配線の折り曲げ部と電子部品のリードとの接触面積が大
きく、導体配線と電子部品の接触不良を起こしにくい。
The electric circuit board according to the second aspect also has the same operation and effect as the electric circuit board according to the first aspect, since the first insertion hole and the second insertion hole are formed substantially identically. Further, the contact area between the bent portion of the conductor wiring and the lead of the electronic component is large, and poor contact between the conductor wiring and the electronic component hardly occurs.

【0037】請求項3に係る空気調和機によれば、請求
項1又は2に係る電路板の場合と同様の効果を奏する。
請求項4に係る電路板の製造方法によれば、請求項1に
係る電路板の場合と同様の作用効果を奏する。また、導
体配線を分離すると同時に第2挿入孔の部品実装面側か
らはみ出した部分を打ち抜けば良いので、打ち抜き作業
によって工数が増えることがない。
According to the air conditioner of the third aspect, the same effects as those of the electric circuit board of the first or second aspect can be obtained.
According to the circuit board manufacturing method of the fourth aspect, the same operation and effect as in the case of the circuit board of the first aspect are achieved. In addition, since it is only necessary to punch out the portion of the second insertion hole protruding from the component mounting surface side at the same time as separating the conductor wiring, the number of steps does not increase due to the punching operation.

【0038】請求項5に係る電路板の製造方法によれ
ば、請求項2に係る電路板の場合と同様の作用効果を奏
する。また、従来通り導体配線に樹脂を一体成型した後
に、はみ出した導体配線を折り曲げて第1挿入孔を第2
挿入孔の部品実装面側の大きさと略同一に形成すればよ
いので、電路板の製造が容易である。
According to the method of manufacturing the electric circuit board according to the fifth aspect, the same operation and effect as those of the electric circuit board according to the second aspect can be obtained. Further, after the resin is integrally molded with the conductor wiring as before, the protruding conductor wiring is bent and the first insertion hole is formed in the second insertion hole.
Since the size of the insertion hole may be substantially the same as the size on the component mounting surface side, manufacture of the electric circuit board is easy.

【図面の簡単な説明】[Brief description of the drawings]

【図1】本発明の一実施形態による空気調和機の概略ブ
ロック図。
FIG. 1 is a schematic block diagram of an air conditioner according to an embodiment of the present invention.

【図2】その冷媒回路。FIG. 2 shows the refrigerant circuit.

【図3】その駆動回路。FIG. 3 is a drive circuit thereof.

【図4】その制御回路。FIG. 4 is a control circuit thereof.

【図5】本発明の一実施形態による空気調和機の斜視
図。
FIG. 5 is a perspective view of an air conditioner according to an embodiment of the present invention.

【図6】その室外機の内部。FIG. 6 is the inside of the outdoor unit.

【図7】その電路板の部品実装面。FIG. 7 is a component mounting surface of the circuit board.

【図8】その電路板の端子接続面。FIG. 8 is a terminal connection surface of the circuit board.

【図9】金型による樹脂成型。FIG. 9 shows resin molding using a mold.

【図10】樹脂成型後の電路板。FIG. 10 is an electric circuit board after resin molding.

【図11】打ち抜き加工。FIG. 11 shows a punching process.

【図12】打ち抜き加工後の電路板。FIG. 12 is an electric circuit board after punching.

【図13】バーリング加工後の電路板。FIG. 13 is a circuit board after burring.

【符号の説明】[Explanation of symbols]

1 冷媒回路 33 電路板 33a 樹脂部材 33b 導体配線 33c はみ出し部 33d 折り曲げ部 34 第1挿入孔 35 第2挿入孔 40 室外機 45 制御板 46,47 冷媒配管 50 室内機 DESCRIPTION OF SYMBOLS 1 Refrigerant circuit 33 Electric circuit board 33a Resin member 33b Conductor wiring 33c Protruding part 33d Bending part 34 First insertion hole 35 Second insertion hole 40 Outdoor unit 45 Control plate 46, 47 Refrigerant piping 50 Indoor unit

Claims (5)

【特許請求の範囲】[Claims] 【請求項1】室内機及び室外機を備える空気調和機に設
けられ、電子部品が実装可能であり、電子部品と外部の
回路とを電気的に接続可能な電路板であって、 前記電子部品を実装する実装面、前記電子部品を実装す
るための第1挿入孔、前記実装面側から第1挿入孔を介
して挿入された電子部品を半田付けするための半田面を
有する金属薄板の導体配線と、 前記導体配線の実装面及び半田面に一体成型され、前記
第1挿入孔に対応する位置に第2挿入孔を有する樹脂部
材と、を備え、 前記樹脂部材の第2挿入孔は、前記導体配線の実装面側
において前記第1挿入孔と略同一であり、前記導体配線
の半田面において前記第1挿入孔よりも大きく形成され
ている、電路板。
An electronic circuit board provided in an air conditioner including an indoor unit and an outdoor unit, on which electronic components can be mounted, and which can electrically connect the electronic components to an external circuit. A metal thin plate conductor having a mounting surface for mounting the electronic component, a first insertion hole for mounting the electronic component, and a solder surface for soldering the electronic component inserted from the mounting surface side through the first insertion hole. Wiring, and a resin member integrally molded on the mounting surface and the solder surface of the conductor wiring and having a second insertion hole at a position corresponding to the first insertion hole, wherein the second insertion hole of the resin member includes: An electric circuit board, which is substantially the same as the first insertion hole on the mounting surface side of the conductor wiring, and is formed larger than the first insertion hole on the solder surface of the conductor wiring.
【請求項2】前記導体配線は前記第1挿入孔の縁部にお
いて折り曲げ部を有する、請求項1に記載の電路板。
2. The circuit board according to claim 1, wherein said conductor wiring has a bent portion at an edge of said first insertion hole.
【請求項3】室内空気を冷媒との間で熱交換させ、室内
に冷気又は暖気を供給する室内機と、 前記室内機に一端が接続され、冷媒を流通可能な冷媒配
管と、 前記冷媒配管の他端に接続され、前記室内機及び冷媒配
管と共に冷媒回路を構成し、圧縮又は減圧した冷媒を前
記冷媒配管を介して前記室内機に供給するための室外機
と、 前記冷媒回路を制御する制御板と、 前記制御板、室内機及び商用電源に電気的に接続される
請求項1又は2に記載の電路板と、 を備える空気調和機。
3. An indoor unit for exchanging heat between indoor air and a refrigerant to supply cool air or warm air to a room, a refrigerant pipe having one end connected to the indoor unit and capable of flowing a refrigerant, And an outdoor unit connected to the other end of the refrigerant unit and configured to form a refrigerant circuit together with the indoor unit and the refrigerant pipe, and to supply the compressed or decompressed refrigerant to the indoor unit through the refrigerant pipe, and the refrigerant circuit. An air conditioner comprising: a control board; and the electric circuit board according to claim 1, which is electrically connected to the control board, an indoor unit, and a commercial power supply.
【請求項4】室内機及び室外機を備える空気調和機に設
けられ電子部品が実装可能であり、電子部品と外部の回
路とを電気的に接続可能な電路板の製造方法であって、 前記電子部品を実装する実装面、前記電子部品を実装す
るための第1挿入孔、前記実装面側から第1挿入孔を介
して挿入された電子部品を半田付けするための半田面を
有する金属薄板の導体配線を形成する段階と、 前記導体配線の実装面及び半田面に樹脂を一体成型し、
前記第1挿入孔に対応する位置に前記第1挿入孔よりも
大きい第2挿入孔を形成する段階と、 前記第1挿入孔が前記第2挿入孔の前記導体配線の実装
面側の大きさと略同一になるように前記導体配線を打ち
抜く段階と、を含む電路板の製造方法。
4. A method of manufacturing an electric circuit board provided in an air conditioner including an indoor unit and an outdoor unit, on which an electronic component can be mounted, and wherein the electronic component can be electrically connected to an external circuit. A thin metal plate having a mounting surface for mounting an electronic component, a first insertion hole for mounting the electronic component, and a solder surface for soldering an electronic component inserted from the mounting surface side through the first insertion hole. Forming a conductor wiring of, and integrally molding a resin on the mounting surface and the solder surface of the conductor wiring,
Forming a second insertion hole larger than the first insertion hole at a position corresponding to the first insertion hole; and determining the size of the second insertion hole on the mounting surface side of the conductor wiring of the second insertion hole. Punching the conductor wiring so as to be substantially the same.
【請求項5】室内機及び室外機を備える空気調和機に設
けられ電子部品が実装可能であり、電子部品と外部の回
路とを電気的に接続可能な電路板の製造方法であって、 前記電子部品を実装する実装面、前記電子部品を実装す
るための第1挿入孔、前記実装面側から第1挿入孔を介
して挿入された電子部品を半田付けするための半田面を
有する金属薄板の導体配線を形成する段階と、 前記導体配線の実装面及び半田面に樹脂を一体成型し、
前記第1挿入孔に対応する位置に前記第1挿入孔よりも
大きい第2挿入孔を形成する段階と、 前記第1挿入孔が前記第2挿入孔の前記導体配線の実装
面側の大きさと略同一になるように前記導体配線を半田
面側に折り曲げる段階と、を含む電路板の製造方法。
5. A method of manufacturing an electric circuit board provided in an air conditioner including an indoor unit and an outdoor unit, on which an electronic component can be mounted, and wherein the electronic component can be electrically connected to an external circuit. A thin metal plate having a mounting surface for mounting an electronic component, a first insertion hole for mounting the electronic component, and a solder surface for soldering an electronic component inserted from the mounting surface side through the first insertion hole. Forming a conductor wiring of, and integrally molding a resin on the mounting surface and the solder surface of the conductor wiring,
Forming a second insertion hole larger than the first insertion hole at a position corresponding to the first insertion hole; and determining the size of the second insertion hole on the mounting surface side of the conductor wiring of the second insertion hole. Bending the conductor wiring to the solder surface side so as to be substantially the same.
JP2001024416A 2001-01-31 2001-01-31 Electric circuit board and air conditioner, and manufacturing method thereof Pending JP2002232124A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP2001024416A JP2002232124A (en) 2001-01-31 2001-01-31 Electric circuit board and air conditioner, and manufacturing method thereof

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2001024416A JP2002232124A (en) 2001-01-31 2001-01-31 Electric circuit board and air conditioner, and manufacturing method thereof

Publications (1)

Publication Number Publication Date
JP2002232124A true JP2002232124A (en) 2002-08-16

Family

ID=18889560

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2001024416A Pending JP2002232124A (en) 2001-01-31 2001-01-31 Electric circuit board and air conditioner, and manufacturing method thereof

Country Status (1)

Country Link
JP (1) JP2002232124A (en)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2018105000A1 (en) * 2016-12-05 2018-06-14 三菱電機株式会社 Printed wiring board, air conditioner, and method for manufacturing printed wiring board
JP2020181929A (en) * 2019-04-26 2020-11-05 住友電装株式会社 Substrate, component mounting substrate, electric connection box and method for manufacturing substrate

Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0550760U (en) * 1991-12-03 1993-07-02 株式会社三協精機製作所 Resin circuit board
JPH10321985A (en) * 1997-05-21 1998-12-04 Matsushita Electric Ind Co Ltd Circuit board
JPH11248234A (en) * 1998-02-26 1999-09-14 Hitachi Ltd Air-conditioner

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0550760U (en) * 1991-12-03 1993-07-02 株式会社三協精機製作所 Resin circuit board
JPH10321985A (en) * 1997-05-21 1998-12-04 Matsushita Electric Ind Co Ltd Circuit board
JPH11248234A (en) * 1998-02-26 1999-09-14 Hitachi Ltd Air-conditioner

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2018105000A1 (en) * 2016-12-05 2018-06-14 三菱電機株式会社 Printed wiring board, air conditioner, and method for manufacturing printed wiring board
CN110036698A (en) * 2016-12-05 2019-07-19 三菱电机株式会社 The production method of printed wiring board, air-conditioning and printed wiring board
JP2020181929A (en) * 2019-04-26 2020-11-05 住友電装株式会社 Substrate, component mounting substrate, electric connection box and method for manufacturing substrate
JP7156162B2 (en) 2019-04-26 2022-10-19 住友電装株式会社 Substrate and substrate manufacturing method

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