JP2002231402A - Socket for electric part - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide a socket for an electric part capable of surely holding the electric part in a prescribed position by preventing parting of the electric part by a latch member. SOLUTION: In an IC socket 11, a socket body 13 for housing an IC package is provided with a contact pin capable of contacting with and separating from a solder ball of the IC package, and the socket body 13 is provided with the latch member 38 for pressing down the IC package. The latch member 38 is constituted so as to press down a corner part in the diagonal line direction of the quadrangular IC package.

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to an electrical component socket for detachably holding an electrical component such as a semiconductor device (hereinafter referred to as an "IC package"), and more particularly to an improvement in a latch member for holding the electrical component. is there.

[0002]

2. Description of the Related Art Conventionally, as this kind of "socket for electric parts", there is an IC socket for detachably holding an IC package as an "electric part".

[0003] This IC package includes a BGA (Ball G
There is a so-called “rid Array” type in which a large number of solder balls as terminals are provided in a matrix on the lower surface of a rectangular package body.

Further, a contact pin is provided on the IC socket, and a pair of elastic pieces are formed on the contact pin, and the ends of these elastic pieces are separated from the side portions of the solder balls of the IC package. A contact portion to be contacted is formed, and one of the elastic pieces is elastically deformed by being pressed by a slide plate as a “moving plate” that moves in the lateral direction.

[0005] An operating member is arranged to be vertically movable with respect to the socket body, and by lowering the operating member, the slide plate is moved via a link mechanism to elastically deform one elastic piece. By letting
At the same time as increasing the distance between the two contact portions of the two elastic pieces, the latch member is rotated and opened to be retracted from the IC package insertion range.

In this state, the IC package is accommodated in the socket body, and the solder balls of the IC package are inserted between the contact portions of the opened contact pins. Thereafter, when the operation member is raised, the slide plate is returned to the original position, the contact portion of one elastic piece returns to the original position, and the solder ball is sandwiched by both contact portions, and the And the latch member closes, and the electrical component is pressed by the latch member.

In this state, after performing a performance test such as a burn-in test, for example, the latch member is opened and the slide plate is moved to displace the contact portion of one elastic piece in the same manner as described above. The distance between the parts is increased and separated from the solder balls, and the IC package is
I take it out of the socket.

[0008] In this case, the IC package can be mounted in a non-insertion / extraction manner by simply moving the slide plate.
Since removal can be performed, work efficiency can be significantly improved.

[0009]

However, in such a conventional device, as shown in FIG. 21, a pair of left and right latch members 1 are arranged facing opposite sides of a square IC package 2. In the case where one latch member 1 closes earlier than the other,
As shown by the two-dot chain line in FIG. 21B, there is a possibility that the other latch member 1 collides and the IC package 2 cannot be reliably held at a predetermined position.

SUMMARY OF THE INVENTION It is an object of the present invention to provide a socket for an electric component which can suppress the floating of the electric component by a latch member and can press the electric component at a predetermined position.

[0011]

According to a first aspect of the present invention, there is provided a socket body for accommodating an electric component, wherein a contact pin detachable from a terminal of the electric component is disposed on the socket body. In the electrical component socket in which a latch member for holding the electrical component is provided in the socket body, the latch member is configured to hold a diagonal corner of the square electrical component. It is characterized in that it is a socket for electric parts.

According to a second aspect of the present invention, in addition to the configuration of the first aspect, a pair of the latch members are provided on a diagonal line of the outer shape of the socket so as to press a diagonal corner of the electric component. It is characterized by the following.

[0013] The invention according to claim 3 is the invention according to claim 1 or 2.
In addition to the configuration described in the above, the large number of contact pins are arranged in a matrix in a rectangular arrangement range, a pair of the latch members are arranged on a diagonal line of the arrangement range, and a diagonal direction of the electric component. It is characterized in that the corners are pressed.

The invention described in claim 4 is the first to third aspects of the present invention.
In addition to the configuration according to any one of the above, the latch member,
A base is rotatably provided on the socket body by a rotation shaft, and a pressing piece for pressing the electric component is extended from the base, and the pressing piece is formed in an arc shape about the rotation axis. It is characterized by having.

[0015] The invention according to claim 5 provides the invention according to claims 1 to 4.
In addition to the configuration according to any one of the above, a moving plate is movably provided on the socket main body, and an operation member is disposed on the socket main body movably in a direction perpendicular to an upper surface of the socket main body. Moving the operating member to move the moving plate via a moving mechanism, thereby elastically deforming the contact pin and displacing a contact portion provided at a tip end of the contact pin, thereby displacing the electric component. Characterized in that the terminal is separated from and connected to the terminal.

According to a sixth aspect of the present invention, in addition to the configuration of the fifth aspect, the movable plate is provided so as to be movable along a diagonal direction different from a diagonal line where the latch member is provided. It is characterized by having.

[0017]

Embodiments of the present invention will be described below.

1 to 20 show an embodiment of the present invention.

First, the structure will be described.
An IC socket as an “electric component socket”. The IC socket 11 is used for performing a performance test of the IC package 12 as an “electric component”.
The purpose is to electrically connect the solder balls 12b, which are the "terminals" of No. 2, to a printed wiring board (not shown) of a measuring instrument (tester).

The IC package 12 is a so-called BGA (Ball Grid Array) type as shown in FIG. 3, for example, and has a rectangular package body 12a.
A large number of substantially spherical solder balls 12b protrude from the lower surface of are arranged in a matrix.

On the other hand, as shown in FIG. 2, for example, the IC socket 11 generally has a socket body 13 mounted on a printed wiring board. Contact pin 1
5 and the preload plate 16, the "moving plate"
Slide plate 17 and top plate 18
Are arranged so as to be sequentially stacked. An operation member 19 for moving the slide plate 17 is provided above the top plate 18 which is a part of the socket body 13, and a latch member 38 for holding the accommodated IC package 12 is provided. Has been established.

The contact pins 15 are formed of a plate material having spring properties and excellent conductivity by press working into a shape as shown in FIG.

More specifically, the contact pin 15 has a fixed-side elastic piece 15h and a movable-side elastic piece 15i (a pair of elastic pieces) formed on the upper side, and one solder tail portion 15b formed on the lower side. I have. Each of these elastic pieces 15h, 1
5i are formed to be opposed to each other by bending the base 15c into a substantially U-shape. ICs are provided at the upper ends (tips) of the elastic pieces 15h and 15i.
A contact portion 15d is formed on the side surface of the solder ball 12b of the package 12 so as to be in contact with and separate from the solder ball 12b. The solder ball 12b is sandwiched between the contact portions 15d.

The solder tail portion 15b and the base portion 15c of the contact pin 15 are
Is press-fitted into the press-fitting hole 13a formed at the bottom. And
The solder tail portion 15b projecting downward from the socket body 13 projects further downward through the locate board 21, and is inserted into each through hole of a printed wiring board (not shown) and connected by soldering. It has become.

As shown in FIG. 10, the preload plate 16 is detachably mounted on the socket body 13, and the preload plate 16 is provided with a preload in which the elastic pieces 15h and 15i of the contact pins 15 are inserted. A hole 16a is formed,
With the elastic pieces 15h and 15i inserted into the preload hole 16a, the diameter of the preload hole 16a is set such that the elastic pieces 15h and 15i are elastically deformed by pressing the elastic pieces 15h and 15i in a direction in which the contact portions 15d are narrowed. ing.

Here, a bent portion 15e is formed on the pair of elastic pieces 15h and 15i of the contact pin 15, and the apex of the bent portion 15e is pressed by the inner wall of the preload hole 16a. I have.

On the other hand, the slide plate 17 is disposed so as to be movable in a direction substantially parallel to the upper surface 13d of the socket body and substantially in the diagonal direction of the square outer shape of the IC socket 11, and by moving the slide plate 17, the socket The movable elastic piece 15i of the contact pin 15 disposed on the main body 13 is elastically deformed, so that the contact portion 15d is displaced by a predetermined amount.

The slide plate 17 is used for the operation member 1.
9 is moved up and down (moved in a direction perpendicular to the upper surface 13d of the socket body) by a mechanism to be described later. Pressing part 17 to be deformed
a is formed.

The top plate 18 has an accommodating portion 18a for accommodating the IC package 12 on the upper side, and a guide portion 18b for positioning the IC package 12 at a predetermined position is provided as shown in FIG.
It is provided corresponding to the peripheral part of a.

Further, as shown in FIG. 10A, a positioning portion 18c inserted between a pair of contact portions 15d of each contact pin 15 is formed on the top plate 18. Both elastic pieces 15h, 15
In the state where no external force acts on i (the state where both contact portions 15d are closed), the positioning portion 18c
h, 15i.

Further, as shown in FIG. 2, the operating member 19 has an opening 19a large enough to insert the IC package 12, and the IC package 12 is inserted through the opening 19a. 18 accommodation sections 18a
It is designed to be accommodated in a predetermined upper position. The operation member 19 is disposed so as to be vertically movable with respect to the socket body 13 and is urged upward by a spring 20 shown in FIG. 15, and as shown in FIGS.
An operating projection 19b for rotating the latch member 38 is formed.

As shown in FIG. 1, the latch members 38 are configured to press the diagonal peripheral corners 12c of the square IC package 12, and are arranged in a diagonal direction of the outer shape of the socket and in a matrix. The contact pins 15 are arranged in a pair in a diagonal direction of a rectangular arrangement range E.

This latch member 38 is shown in FIGS.
As shown in FIG. 5, a base 38a is rotatably provided on a top plate 18 which is a part of the socket body 13 by a rotation shaft 40, and a pressing piece 38b for pressing the IC package 12 is extended from the base 38a. I have. The pressing piece 38b is formed in an arc shape centered on the rotation shaft 40, and has a contact surface 38c formed at the tip thereof for contacting and pressing the IC package 12.

In the latch member 38, pressed portions 38d are formed on both sides of an arc-shaped pressing piece 38b so as to protrude sideways, and by lowering the operation member 19,
The pressed portion 38 d is pressed by the operation convex portion 19 b of the operation member 19, and the latch member 38
17 is rotated in the opening direction (outside the socket body 13) as shown by the arrow in FIG. 17, and the pressing piece 38b is retracted from the IC package 12 insertion range.

Further, a mechanism for moving the slide plate 17 is provided between the operation member 19 and the slide plate 17.

That is, as shown in FIG. 7, the operating member 19 has a pair of support posts 19 on a diagonal line on the lower surface.
c is protruded, and a support shaft 19d is attached to these support posts 19c.
A moving roller 19e is supported at the center of the support shaft 19d, and reaction force rollers 19f are independently rotatably supported on both sides of the moving roller 19e.

As shown in FIG. 9, the slide plate 17 has an inclined surface portion 1 on which a moving roller 19e rolls.
7b is formed, the operation member 19 is lowered, and the moving roller 19e rolls on the inclined surface portion 17b, so that the slide plate 17 is moved in the direction of the arrow in FIGS. I have. This moving roller 1
The “moving mechanism” is constituted by 9e and the inclined surface 17b.

Further, as shown in FIGS. 6 and 8, a rolling wall 13b on which the reaction force roller 19f rolls protrudes upward from the socket body 13, so that the slide plate 17 is moved. At the time of the operation, a reaction force acting on the operation member 19 is received by the rolling wall portion 13b via the reaction force roller 19f. Moreover, the rolling wall 13
A guide wall portion 13c protrudes parallel to and adjacent to b, and a reaction force roller 19f is inserted between the guide wall portion 13c and the rolling wall portion 13b to guide the operation member 19 up and down. It has become.

Next, the operation will be described.

In order to set the IC packages 12 into a large number of IC sockets 11 arranged on the printed wiring board in advance by an automatic machine, first, the operating member 19 is pushed down. Then, in a state where the reaction force roller 19f is inserted between the guide wall portion 13c and the rolling wall portion 13b, the operation member 19 is operated by the reaction force roller 19f.
f is guided, and the operating member 19 is accurately lowered in the vertical direction with respect to the housing portion 18a.

Then, as the operating member 19 is lowered, the moving roller 19e rolls on the inclined surface 17b of the slide plate 17, so that the slide plate 17 is moved in the direction of the arrow in FIG. Then, the movable elastic piece 15i of the contact pin 15 is pressed by the pressing portion 17a of the slide plate 17 and is elastically deformed. The other fixed-side elastic piece 15h is held at a predetermined position by a positioning portion 18c of the top plate 18.

Thus, as shown in FIG. 10B, the pair of contact portions 15d of the contact pin 15 are opened.

At the same time, the pressed portion 38d of the latch member 38 is pushed by the operation convex portion 19b of the operating member 19, and the latch member 38 is moved against the urging force of the spring 39 as shown in FIGS. 16 and 18 from the closed state shown in FIG.
And the pressing piece 38b is displaced to the retracted position.

In this state, the IC conveyed by the automatic machine
The package 12 is accommodated at a predetermined position on the accommodation portion 18a of the top plate 18 by being guided by the guide portion 18b, and each solder ball 12b of the IC package 12 is connected to a pair of contact portions 15d where the contact pins 15 are opened. In between, it is inserted in a non-contact state.

Thereafter, when the downward pressing force of the operation member 19 is released, the operation member 19 is raised by the urging force of the spring 20 and the slide plate 17 is attached to the movable elastic piece 15 i of the contact pin 15. The latch member 38 is moved from the state shown in FIG. 18 to the state shown in FIG. 19 by the urging force of the spring 39 and returns to the original position while being moved by the urging force.

As described above, the slide plate 17 is
When the contact pin 15 is moved in the middle left direction, the pressing force of the contact pin 15 against the movable elastic piece 15i is released, the movable elastic piece 15i returns to the original position, and the contact portion of the movable elastic piece 15i. The solder ball 12b is sandwiched between the contact portion 15d and the contact portion 15d of the fixed elastic piece 15h (FIG. 1).
0 (c), see FIG. 11). At this time, the fixed-side elastic piece 15h is also slightly elastically deformed.
The contact portion 15d of 5h is slightly displaced in the direction in which it spreads. At the same time, the contact surface 38c of the latch member 38
As shown in FIG. 19, the IC package 12 is pressed and held by making surface contact with the upper surface of the C package 12.

Thus, each solder ball 12b of the IC package 12 and the printed wiring board are electrically connected via the contact pins 15.

As described above, the IC package 12 is
The printed wiring board held by the socket 11 and on which the IC socket 11 is arranged is set in, for example, a burn-in tank to perform a burn-in test.

On the other hand, to remove the IC package 12 from the mounted state, the operating member 19 is similarly lowered. Then, similarly to the above, the slide plate 17 is moved rightward from the state shown in FIG. 11, and as shown in FIG.
The movable elastic piece 15i is elastically deformed rightward, and the contact portion 15d of the movable elastic piece 15i is displaced. with this,
The pair of contact portions 15d are separated from the solder balls 12b of the IC package 12, the latch member 38 is rotated, and the pressing pieces 38b are retracted from the IC package 12 insertion range. 12 can be removed from the IC socket 11 without force.

As described above, the latch member 38 is connected to a square IC.
Since the diagonal peripheral corner 12c of the package 12 is configured to be pressed, as shown in FIG.
Even when the IC package 12 is pressed, since the pressing position is the diagonal peripheral corner 12c of the IC package 12, the other side of the IC package 12 is unlikely to float in the direction indicated by the arrow in FIG. Package 12
Can be reliably held at a predetermined position.

Further, since the latch member 38 is arranged on a diagonal line of the outer shape of the socket, this portion has a relatively larger space than the portion corresponding to each side.
8 can be easily arranged, and the arrangement of the latch member 38 does not increase the size of the socket.

Further, by forming the pressing piece 38b of the latch member 38 into an arc shape, even when the latch member 38 is rotated, the rotation locus (rotation range) of the entire latch member 38 can be minimized. Therefore, the latch member 38
In addition, the size of the IC socket 11 can be reduced while securing the rotation range of the IC socket 11.

Further, the slide plate 17 is provided so as to be movable in a diagonal direction, and a moving mechanism such as a transfer roller 19e for moving the slide plate 17 is arranged diagonally. By arranging the latch member 38, the latch member 38 can be arranged by utilizing the space more effectively.

In the above-described embodiment, the present invention is applied to the IC socket 11 as a "socket for electric parts". However, the present invention is not limited to this and can be applied to other devices. Further, in the above embodiment, the slide plate 17 is provided as the “moving plate” and is moved in the horizontal direction. However, the present invention is not limited to this. It may be something that causes it. Furthermore, in the above embodiment, the fixed pin elastic piece 15h and the movable elastic piece 15i are provided on the contact pin 15, but the present invention can be applied to a case where only the movable elastic piece 15i is provided.

[0055]

As described above, according to the first aspect of the present invention, since the latch member is configured to press the diagonal corner of the rectangular electric component, one of the latch members is connected to the other. Even when the electric component is pressed before the electric component, the pressing position is the diagonal corner of the electric component, so that the other side of the electric component does not rise as in the related art, Can be securely held in position.

According to the second aspect of the present invention, in addition to the above-described effects, by arranging the latch member on a diagonal line of the socket outer shape, this portion has a relatively larger space than the portion corresponding to each side. Therefore, the latch member can be easily arranged, and the arrangement of the latch member does not cause an increase in the size of the socket.

According to the fourth aspect of the present invention, in addition to the above-described effects, even when the latch member is rotated by turning the pressing piece of the latch member into an arc shape, the rotation of the entire latch member is achieved. Since the trajectory (rotation range) can be minimized, the socket can be downsized while securing the rotation range of the latch member.

According to the sixth aspect of the present invention, the movable plate is provided movably in the diagonal direction, and the latch member is arranged on a diagonal line different from the diagonal line, so that the space can be more effectively used. And a latch member can be provided.

[Brief description of the drawings]

FIG. 1 is a plan view of an IC socket according to an embodiment of the present invention.

FIG. 2 is a sectional view showing an arrangement state of contact pins of the IC socket according to the embodiment.

3A and 3B are diagrams showing an IC package housed in the IC socket according to the embodiment, wherein FIG. 3A is a front view and FIG. 3B is a bottom view.

FIG. 4 is a diagram showing contact pins of the IC socket according to the embodiment, wherein (a) is a front view of the contact pins,
(B) is a right side view of (a), and (c) is a cross-sectional view taken along line CC of (a).

FIG. 5 is a schematic sectional view taken along line DD of FIG. 1 according to the embodiment.

FIG. 6 is a schematic sectional view taken along line EE in FIG. 1 according to the embodiment;

FIG. 7 is a rear view of the operation member according to the embodiment.

FIG. 8 is a schematic plan view showing a state where a slide plate is mounted on the socket body of the IC socket according to the embodiment.

FIG. 9 is a view showing a slide plate of the IC socket according to the embodiment, wherein (a) is a schematic plan view of the slide plate, and (b) is a schematic front view of the slide plate.

FIG. 10 is a sectional view showing an operation according to the embodiment;
(A) is a state in which a pair of contact portions of a contact pin is closed,
(B) is a state where a pair of contact portions of the contact pin is opened,
(C) is a sectional view of a state in which a solder ball is held between a pair of contact portions of a contact pin.

FIG. 11 is a longitudinal sectional view showing a state in which the solder ball according to the embodiment is held between a pair of contact portions.

FIG. 12 is a longitudinal sectional view corresponding to FIG. 11 and showing a state in which a pair of contact portions according to the embodiment is opened.

FIG. 13 is a perspective view of the IC socket according to the embodiment with an operation member removed.

FIG. 14 is a plan view of the IC socket according to the embodiment with an operation member removed.

FIG. 15 is a perspective view of the IC socket according to the embodiment in which the operating member is at a highest position, with a part thereof cut away.

FIG. 16 is a partially broken perspective view of the IC socket according to the embodiment in a state where an operation member is at a lowermost position;

FIG. 17 is a cross-sectional view showing the latch member and the like in a state where the operation member of the IC socket according to the embodiment is at the highest position.

FIG. 18 is a cross-sectional view showing the latch member and the like in a state where the operation member of the IC socket according to the embodiment is at the lowest position.

FIG. 19 is a cross-sectional view showing the latch member and the like of the IC socket according to the embodiment in which the IC package is housed.

FIG. 20 is an explanatory diagram showing an operation according to the embodiment.

21A and 21B are explanatory views showing a conventional example, in which FIG. 21A is a schematic perspective view showing a state where an IC package is pressed by a latch member, and FIG.
FIG. 4 is an explanatory view showing an operation.

[Explanation of symbols]

 11 IC socket (electric component socket) 12 IC package (electric component) 12a Package body 12b Solder ball (terminal) 13 Socket body 15 Contact pin 15d Contact part 15h Fixed elastic piece 15i Movable elastic piece 17 Slide plate (moving plate) ) 17b Inclined surface part (moving mechanism) 18 Top plate 18a Housing part 19 Operating member 19b Operating convex part 19e Moving roller (moving mechanism) 38 Latch member 38a Base 38b Pressing piece 38c Contact surface 38d Pressed part 40 Rotating shaft

Claims (6)

[Claims] 1. An electric device comprising: a socket body for accommodating an electric component; a contact pin detachable from a terminal of the electric component; and a latch member for pressing the electric component on the socket body. In the component socket, the latch member is configured to press a diagonal corner of the quadrangular electrical component. 2. The electrical component socket according to claim 1, wherein a pair of the latch members are arranged on a diagonal line of the outer shape of the socket so as to press diagonal corners of the electrical component. . 3. A plurality of contact pins are arranged in a matrix in a rectangular arrangement area, and a pair of latch members are arranged on a diagonal line of the arrangement area, and a diagonal corner of the electric component. The electrical component socket according to claim 1, wherein the socket is pressed. 4. The latch member has a base portion rotatably provided on the socket body by a rotation shaft, and a pressing piece for pressing the electric component is extended from the base portion, and the pressing piece is rotated by the rotation member. The electrical component socket according to any one of claims 1 to 3, wherein the socket is formed in an arc shape centered on an axis. 5. A moving plate is movably provided on the socket body, and an operating member is provided on the socket body movably in a direction perpendicular to an upper surface of the socket body, and the operating member is moved. Then, by moving the moving plate via a moving mechanism, the contact pin is elastically deformed, and a contact portion provided at a tip end portion of the contact pin is displaced so as to be separated from and connected to a terminal of the electric component. The electrical component socket according to any one of claims 1 to 4, wherein: 6. The electrical component socket according to claim 5, wherein the movable plate is provided so as to be movable along a diagonal direction different from a diagonal line where the latch member is provided. .