JP2002226660A - Resin molding material for electronic part cleaning implement and electronic part cleaning implement using the same - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide a molding material in which development of warpage and cracks are suppressed and a residual stress is reduced even at cleaning by ultrasonic cleaning using an organic solvent cleaning agent, and to provide an electronic parts cleaning implement obtained by molding the same requiring a high degree of cleaning such as a magnetic head. SOLUTION: The resin molding material for the electronic parts cleaning implement and the electronic parts cleaning implement obtained by molding the same include a fluororesin, a thermoplastic resin except the fluororesin and a reinforcing filler.

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a molding material suitable as a jig for cleaning electronic components, and a jig for cleaning electronic components formed by molding the same.

[0002]

2. Description of the Related Art An electronic component, for example, a magnetic head of a magnetic disk drive is required to have an extremely high cleanliness in order to prevent an accident called disk crash. JP-A-6-103511 proposes cleaning by ultrasonic cleaning using an aqueous solution of a surfactant. In the ultrasonic cleaning, an object to be cleaned is immersed in an aqueous solution of a surfactant, and ultrasonic waves are radiated to the object to remove contaminants attached to the object to be cleaned. As a cleaning jig used for this, ABS or PBT is used in terms of moldability and cost. However, in recent years, giant magneto-resistive type (Giant-Magneto-Resistive:
It has become clear that cleaning a GMR (Head GMR) head corrodes element metal and degrades element characteristics.

[0003] Japanese Patent Application Laid-Open No. H11-256196 proposes ultrasonic cleaning using an organic solvent-based cleaning agent. In this case, the jig used in the past has poor solvent resistance, and even with solvent-resistant materials such as PPS and PEEK, the jig is warped or cracked and particles are generated by washing about 1 to 3 times. There is a problem that impairs the cleaning performance.
This is because the shape of the GMR head is smaller than that of the conventional MR head, so that the shape of the cleaning jig is also more complicated. It is considered that stress is concentrated by cleaning by ultrasonic cleaning using a solvent-based cleaning agent, and warpage and cracks are generated.

[0004]

SUMMARY OF THE INVENTION In view of the above-mentioned circumstances, the present invention provides a molding material in which the generation of warpage and cracks is suppressed and the residual stress is reduced even in cleaning by ultrasonic cleaning using an organic solvent-based cleaning agent, and It is an object of the present invention to provide a jig for cleaning an electronic component such as a magnetic head, which requires a high degree of cleanability, formed by molding the same.

[0005]

That is, the present invention is a resin molding material for a jig for cleaning electronic parts, comprising a fluororesin, a thermoplastic resin other than the fluororesin, and a reinforcing filler. The present invention is also an electronic component cleaning jig formed by molding the above molding material. Hereinafter, the present invention will be described in detail.

The first component of the resin molding material for an electronic part cleaning jig of the present invention is a fluororesin. The fluororesin is not particularly limited as long as it is a synthetic polymer containing a fluorine atom in the molecule, and a known polymer can be used.
Examples of such a material include polytetrafluoroethylene (PTFE), tetrafluoroethylene-perfluoroalkylvinyl ether copolymer (PFA), tetrafluoroethylene-hexafluoropropylene copolymer (FEP), and tetrafluoroethylene-ethylene. Copolymers (ETFE) and the like are preferred. More preferably, P
TFE.

[0007] The PFA is at least one of tetrafluoroethylene and a fluoroalkyl vinyl ether represented by the formula: CF ₂ ＣＦCF—O—Rf (where Rf represents a fluoroalkyl group having 1 to 10 carbon atoms). It is a copolymer with a seed. As the fluoroalkyl vinyl ether, perfluoro (alkyl vinyl ether) is preferable. The PFA preferably comprises 99 to 92% by weight of tetrafluoroethylene and 1 to 8% by weight of a fluoroalkyl vinyl ether.

The above-mentioned FEP preferably comprises 99 to 80% by weight of tetrafluoroethylene and 1 to 20% by weight of hexafluoropropylene. The ETFE preferably comprises 90 to 74% by weight of tetrafluoroethylene and 10 to 26% by weight of ethylene.

The above-mentioned fluororesin may contain other monomers as long as the essential properties of the resin are not impaired. Examples of the other monomers include tetrafluoroethylene (however, excluding PFA, FEP and ETFE),
Hexafluoropropylene (however, excluding FEP), perfluoroalkyl vinyl ether (however, excluding PFA), perfluoroalkyl ethylene (alkyl group having 1 to 10 carbon atoms), perfluoroalkyl allyl ether (carbon group of alkyl group) Formulas 1 to 10) and the formula: CF ₂ = CF [OCF ₂ CF (CF ₃ )] _n OCF
₂ (CF ₂ ) _p Y (where Y is halogen, n is an integer of 0 to 5, p is 0 to 2
Represents an integer. )). The amount of other monomers is up to 50% by weight of the polymer, preferably from 0.01 to 45% by weight.

[0010] The molecular weight of the fluororesin is not particularly limited, but particularly in the case of PTFE, those having a melt viscosity at 380 ° C of 10 ⁷ poise or less are preferred. These fluororesins may be used alone or in combination of two or more.

The second component of the resin molding material for a jig for cleaning electronic parts of the present invention is a thermoplastic resin other than a fluororesin. The thermoplastic resin is not particularly limited, and known resins can be used. Examples thereof include polyphenylene sulfide (PPS), polyether ether ketone (PEEK), aromatic polyester, thermoplastic polyimide, and polyamideimide (PAI). Is preferred. More preferred are PPS and PEEK. The molecular weight of the thermoplastic resin is not particularly limited. These thermoplastic resins may be used alone or in combination of two or more.

The third component of the resin molding material for a jig for cleaning electronic parts of the present invention is a reinforcing filler. The reinforcing filler is not particularly limited, and examples thereof include a powdery filler, a fibrous filler, and a flake-like filler. Among these, a fibrous filler is preferable from the viewpoint of compatibility with the resin.

The fibrous filler is not particularly limited. Examples thereof include glass fiber, carbon fiber, graphite fiber, ceramic fiber, rock wool, slag wool, potassium titanate whisker, silicone carbide whisker, sapphire whisker, and aluminum borate whisker. Well-known materials such as wollastonite, copper wire, steel wire, stainless steel wire, silicon carbide fiber; aromatic polyamide fiber, rayon, phenol resin, and organic fiber such as polybenzimidazole fiber can be used. Among these, glass fibers, carbon fibers, ceramic fibers, and organic fibers are preferable, and carbon fibers are particularly preferable, from the viewpoint of moldability of the resin molding material for an electronic component cleaning jig of the present invention.

The carbon fibers may be any of PAN, pitch, cellulose and the like. The fiber diameter of the carbon fiber is preferably 5 to 30 μm in order to meet the purpose of the present invention. The shape of the carbon fiber preferably has an aspect ratio of 10 to 300 for the purpose of imparting good hardness.

In the present invention, the fluororesin is 20 to 60% by weight based on the total amount of the fluororesin, the thermoplastic resin other than the fluororesin, and the reinforcing filler, and the thermoplastic resin other than the fluororesin is 30 to 60% by weight. It is preferably 75% by weight, and the reinforcing filler is preferably 5 to 30% by weight.

When the content of the fluororesin is less than 20% by weight, a large internal distortion remains in a molded article having a complicated shape,
There is a tendency that warpage and cracks are generated by cleaning by ultrasonic cleaning using an organic solvent-based cleaning agent, particles are generated, and cleaning properties are impaired. On the other hand, when the content exceeds 60% by weight, the fluidity of the mixture becomes low, and it may be difficult to form a complicated molded product. The content of the fluororesin is more preferably 20 to 50% by weight.

When the thermoplastic resin other than the above-mentioned fluororesin is 30
If the amount is less than the weight percentage, the fluidity of the mixture becomes low, and it may be difficult to form a molded article having a complicated shape. On the other hand, if the content exceeds 75% by weight, large internal distortion remains when a molded article having a complicated shape is formed, and warpage and cracks are generated by ultrasonic cleaning using an organic solvent-based cleaning agent, and particles are generated. Tends to impair the cleaning performance. The content of the thermoplastic resin other than the fluororesin is more preferably 30 to 65% by weight.

If the reinforcing filler is less than 5% by weight,
In some cases, good shape stability cannot be maintained in terms of strength. When the content exceeds 30% by weight, the fluidity of the mixture becomes low, and it may be difficult to form a molded article having a complicated shape. is there. The content of the reinforcing filler is 5 to 20.
% Is more preferred.

Although the resin molding material for jigs for cleaning electronic parts of the present invention has excellent moldability, the flow distance of a bar flow test can be used as a measure of the moldability. The bar flow test is one of test methods for evaluating moldability (fluidity) by injection molding using a bar flow mold, and indicates that the longer the flow length, the better the moldability. The molding material of the present invention has a flow length (mm) of 5
Those having a value of 0 or more are preferable, those having a value of 60 or more are more preferable, and those having a value of 70 or more are still more preferable.

The method for producing the resin molding material for a jig for cleaning electronic parts of the present invention is not particularly limited, and a known kneading method or the like can be employed. For example, it can be manufactured by preliminarily mixing a fluororesin and a thermoplastic resin other than the fluororesin with a mixer, a tumbler or the like, adding a reinforcing filler, and melt-kneading the mixture with a twin-screw extruder or the like.

The resin molding material for a jig for cleaning electronic parts of the present invention may contain components other than those described above as long as the present invention is not impaired. Such components include, for example, one or two of known antioxidants, heat stabilizers, ultraviolet absorbers, lubricants, release agents, dyes, pigments, flame retardants, flame retardant auxiliaries, and antistatic agents. The above can be mentioned.

The method for manufacturing the electronic part cleaning jig by molding the resin molding material for an electronic part cleaning jig of the present invention is not particularly limited. For example, a cylinder temperature of 200 to 200 may be used by a known injection molding machine or the like. 400 ° C, mold temperature 100-200
A method of molding under conditions of about ° C can be preferably employed, and a method of machining after obtaining an intermediate processed product by compression molding, extrusion molding, or the like can also be employed.

The electronic part cleaning jig of the present invention is obtained by molding the above resin molding material for electronic part cleaning jig. The shape is not particularly limited as long as the electronic component can be held when the electronic component is washed, and can be easily arranged or detached before or after the washing. Specifically, for example, one having a shape as shown in FIG. In the jig of FIG. 1, the electronic components are cleaned in a state where one electronic component is arranged in each recess.

The electronic component in the resin molding material for an electronic part cleaning jig or the electronic part cleaning jig of the present invention is preferably a magnetic head of a magnetic disk drive, and particularly preferably a GMR. Further, the cleaning conditions that can exert the effects of the present invention are based on ultrasonic cleaning using an organic solvent-based cleaning agent. Examples of the organic solvent-based detergent include N-methylpyrrolidone, normal paraffin, isoparaffin, naphthene, and an aromatic solvent.

[0025]

EXAMPLES Examples of the present invention will be described below.
Is not limited only to these examples.Examples 1 to 7 and Comparative Example 1  (Preparation of molding material) PPS (manufactured by Toprene, melting point 28)
5 ° C), PTFE (L-5F, manufactured by Daikin Industries, Ltd.)
Premixed with a mixer at the ratio shown in 1
(Kureha Chemical Industry Co., Ltd.) at the ratio shown in Table 1
Departure machine (Ikegai Iron Works, PCM46) 280-320
The mixture was melted and kneaded at ℃ to obtain a pellet mixture. This pere
Preparation and flow of test pieces according to the following conditions
Length measurements were taken.

(Preparation of test piece) The pellet obtained above was injection molded at a cylinder temperature of 270 to 320 ° C and a mold temperature of 140 ° C using an injection molding machine (SG50, manufactured by Sumitomo Heavy Industries, Ltd.). I got The test piece was measured for tensile strength, elongation and flexural modulus under the following conditions.

(Washing Test) A washing test was performed on the test pieces obtained as described above as follows. Since the cleaning of the jig for cleaning electronic parts by ultrasonic waves using an organic solvent-based cleaning agent is usually performed at about 30 to 60 ° C. for only a few minutes, the cleaning test described below is an accelerated test. First, a cleaning agent (NMP: N-methylpyrrolidone) is put into a 1 L beaker, and this is suspended and fixed in a cleaning tank of an ultrasonic cleaner (38 kHz, 120 W) containing pure water, and then washed. The cleaning liquid was indirectly heated to 55 ° C. by heating the pure water in the tank to 55 ° C. using a heater. Next, the test piece was immersed in a cleaning solution in a beaker and irradiated with ultrasonic waves for 6 hours to perform cleaning. Thereafter, the test piece was taken out, a test piece after washing was obtained, and deformed warpage and cracks in the appearance were visually observed.

[0028]Evaluation method  1. Bar flow test of molding material Using a precision injection molding machine SG50 manufactured by Sumitomo Heavy Industries, Ltd.
When the mold temperature is 280-320 ° C and the mold temperature is 140 ° C,
The bar flow (thickness 1 mm) was evaluated according to the following conditions.
went. Bar flow mold gate: Figure 2 shows the shape of the cavity
You. The dimensions of the cavity are 1mm thick and 20mm wide
Yes, the gate is a film gate. Bar flow test conditions: Cylinder temperature: 280 to 320 ° C Nozzle temperature: 320 ° C Mold temperature: 140 ° C Screw rotation speed: 120 rpm Injection speed: 20 mm / s Measurement value: 55 mm Cooling time: 15 sec

2. Tensile strength and elongation of test specimen ASTM D63 using an Orientec universal testing machine
8 was measured. 3. Flexural Modulus of Test Piece ASTM D79 using a universal testing machine manufactured by Orientec.
Measured according to 0.

4. Appearance of test piece after washing After the washing test under the above conditions, the specimen was visually observed according to the following criteria. A: No deformation, no or almost no crack B: No deformation, no crack C: Both deformation and crack

[0031]

[Table 1]

From the results shown in Table 1, it was found that the molding materials of Examples 1 to 7 had a long flow length, and no deformation warping occurred even when the obtained test pieces were washed under the above conditions. on the other hand,
Since the molding material of Comparative Example 1 did not contain a fluororesin, deformation warpage and cracks were observed on the test piece. In addition,
Since the test piece of Comparative Example 1 has high tensile strength and flexural modulus, it is considered that the internal distortion of the molded product is large.

Example 8 The composition of Example 1 was applied to an injection molding machine (manufactured by Sumitomo Heavy Industries, Ltd., S
G50) was used for injection molding at a cylinder temperature of 270 to 320 ° C. and a mold temperature of 140 ° C. to produce a jig as shown in FIG. A jig with a well-defined shape was obtained.

[0034]

The resin molding material for cleaning electronic parts according to the present invention has the above-mentioned structure, so that it has good moldability, is excellent in molding a complicated shape, and is free from deformation due to cleaning. A jig for cleaning parts can be obtained.

[Brief description of the drawings]

FIG. 1 is a perspective view of an electronic component cleaning jig prepared in Example 8.

Fig. 2 Shape of bar flow cavity used for bar flow test

 ──────────────────────────────────────────────────続 き Continuing from the front page (72) Inventor Tsuyoshi Miyamori 1-1 Nishiichitsuya, Settsu-shi, Osaka Daikin Industries, Ltd. Yodogawa Works (72) Inventor Tetsuo Shimizu 1-1-1, Nishiichitsuya, Settsu-shi, Osaka Daikin Industries F-term (reference) in Yodogawa Works 4F071 AA01 AA02 AA26 AA27 AA45 AA48 AA51 AA60 AA62 AB03 AB28 AD01 AF02 AF54 AH19 BA01 BB05 BC07 4J002 AA00Y AA01X BD12W BD15W CF04X CF16X CH09X CM04X CN006FA10

Claims (6)

[Claims] 1. A resin molding material for an electronic component cleaning jig, comprising a fluororesin, a thermoplastic resin other than the fluororesin, and a reinforcing filler. 2. The composition according to claim 1, wherein the fluororesin is 20 to 60% by weight.
The molding material according to claim 1, wherein the thermoplastic resin other than the fluororesin is 30 to 75% by weight, and the reinforcing filler is 5 to 30% by weight. 3. The fluororesin is selected from the group consisting of polytetrafluoroethylene, tetrafluoroethylene-perfluoroalkylvinyl ether copolymer, tetrafluoroethylene-hexafluoropropylene copolymer and tetrafluoroethylene-ethylene copolymer. 3. The molding material according to claim 1, which is at least one of the following. 4. The reinforcing filler according to claim 1, wherein the reinforcing filler is at least one fibrous filler selected from the group consisting of carbon fibers, glass fibers, organic fibers, and ceramic fibers.
4. The molding material according to 2 or 3. 5. The thermoplastic resin other than the fluororesin is at least one selected from the group consisting of polyphenylene sulfide, polyether ether ketone, aromatic polyester, thermoplastic polyimide, and polyamide imide. The molding material according to 3 or 4. 6. A jig for cleaning electronic parts, wherein the molding material according to claim 1, 2, 3, 4, or 5 is molded.