JP2002223086A - Circuit connection method and circuit formation body and portable terminal unit - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide a connection method of a circuit substrate, which can realize both miniaturization of a substrate without mounting a connector and a lead frame on a substrate and reduction in a cost, a circuit formation body and a portable terminal unit having such a circuit formation body. SOLUTION: A film 8 with wiring, which is formed along an inner side of a housing for storage, is stored in a housing, substrates 6, 6a are further stored in a housing, and an electrode 9 of a film and an electrode of a substrate are connected and made electrically conductive mutually.

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a method for connecting a circuit board after mounting electronic components on the circuit board, a circuit forming body, and a portable terminal having such a circuit forming body.

[0002]

2. Description of the Related Art In recent years, portable devices have become lighter and smaller. Although the housing of a portable device has become thinner along with its weight reduction, it is necessary to secure sufficient strength because it is carried and is subjected to external vibration or impact by falling. To this end, ribs are structurally provided inside the housing as well as the material is studied, thereby ensuring the strength of the housing. Since the housing of a mobile device must house the board on which the display unit, operation unit, and electronic components that display its functions are mounted, the rib structure for ensuring strength is not necessarily effective in housing them. Sometimes it is disturbing.

In order to avoid these problems, as shown in FIG. 8, the substrate 6 is divided into two parts, a connector 17 is mounted on each substrate 6, and each substrate 6 is
A method for achieving electrical continuity is used.

As shown in FIGS. 9 and 10, a method of mounting a lead frame 19 having resiliency on the substrates 6 in place of the connectors to achieve electrical conduction between the substrates 6 is used. The lead frame 19 has leads 20 on the side to be mounted on the board 6 and is soldered to the board 6. In addition, a lead 21 is provided above the lead frame 19, and by using the spring property of the lead frame 19, the lead 21 comes into contact with the land 6a of the substrate 6 to which the lead 21 is connected, thereby electrically establishing electrical conduction.

[0005]

However, in the above-mentioned conventional circuit board connection method, since the connector is mounted on the board, an occupied area of the connector itself and a connection area with the board are required, which hinders miniaturization of the board. ing. In addition, an assembly process such as a process of mounting the connector and connecting the film to the connector is required, which hinders cost reduction in terms of cost.

Further, even when a lead frame having a spring property is used in place of the connector, a mounting area is required and a mounting cost is naturally required.

In view of the above problems, it is an object of the present invention to reduce the size of a board without mounting a connector or a lead frame on the board, and at the same time, to connect a circuit board capable of reducing cost. Provided are a method, a circuit forming body, and a portable terminal having such a circuit forming body.

[0008]

In order to achieve the above object, the present invention is configured as follows.

According to the first aspect of the present invention, the film with the wiring formed along the inner surface of the housing for housing the film with the wiring is housed in the housing, and the substrate is housed in the housing. Then, there is provided a circuit connection method, wherein the electrode of the film and the electrode of the substrate are connected to establish electrical continuity between the film with wiring and the substrate.

[0010] According to a second aspect of the present invention, there is provided the first aspect of the present invention, wherein the electrode disposed on the elastically bent portion of the wiring-provided film and the electrode of the substrate are brought into contact to establish electrical continuity. A circuit connection method is provided.

[0011] According to a third aspect of the present invention, there is provided the second aspect of the present invention, further comprising a bent plate on the back surface of the bent portion, the bent portion providing an elastic force to the electrode of the film with wiring. Circuit connection method.

[0012] According to a fourth aspect of the present invention, a second plate having an elastic plate for applying an elastic force to the electrode of the film with wiring is provided on the back surface of the bent portion.
The circuit connection method according to the aspect is provided.

According to a fifth aspect of the present invention, there is provided the first aspect of the present invention, wherein the electrodes arranged on the elastic projecting portion of the film with wiring come into contact with the electrodes of the substrate to establish electrical continuity. A circuit connection method is provided.

According to a sixth aspect of the present invention, there is provided the circuit connection method according to the fifth aspect, wherein the projecting portion is an overhang portion surrounded by a notch formed in the film with wiring.

According to a seventh aspect of the present invention, there is provided the circuit connection method according to the fifth aspect, wherein the protruding portion is a curved portion formed integrally with the film with wiring.

According to an eighth aspect of the present invention, any of the fifth to seventh aspects has a bent plate for providing an elastic force to the electrode of the film with wiring on the rear surface of the projecting portion. The circuit connection method according to one aspect is provided.

According to a ninth aspect of the present invention, any one of the fifth to seventh aspects has an elastic plate for applying an elastic force to the electrode of the film with wiring on the back surface of the projecting portion. A circuit connection method according to an aspect is provided.

According to a tenth aspect of the present invention, there is provided a circuit formed body including the above-mentioned wiring film and the above-mentioned substrate, which are connected by the circuit connecting method according to any one of the first to seventh aspects.

According to the eleventh aspect of the present invention, the above-mentioned film with wiring and the substrate formed along the inner surface of the case for housing the film with wiring are housed in the case, and the electrodes of the film are A circuit forming body is provided, wherein the circuit-forming body is connected to an electrode of the substrate so that the film with wiring is electrically connected to the substrate.

According to the twelfth aspect of the present invention, the first electrode which is arranged in the elastically bent portion of the film with wiring and the electrode of the substrate are in contact with each other to establish electrical continuity.
A circuit forming body according to one embodiment is provided.

According to a thirteenth aspect of the present invention, there is provided the twelfth aspect, wherein a bent plate for providing an elastic force to the electrode of the film with wiring is provided on the back surface of the bent portion. The present invention provides a circuit formed body.

According to a fourteenth aspect of the present invention, there is provided the circuit according to the twelfth aspect, further comprising an elastic plate for applying an elastic force to the electrode of the film with wiring on the back surface of the bent portion. Providing a formed body.

According to a fifteenth aspect of the present invention, there is provided the eleventh aspect of the present invention, wherein the electrodes arranged on the elastic projecting portions of the film with wiring come into contact with the electrodes of the substrate to establish electrical continuity. A circuit former is provided.

According to a sixteenth aspect of the present invention, there is provided the circuit formed body according to the fifteenth aspect, wherein the protruding portion is an overhang portion surrounded by a notch formed in the film with wiring.

According to a seventeenth aspect of the present invention, there is provided the circuit forming body according to the fifteenth aspect, wherein the protruding portion is a curved portion formed integrally with the film with wiring.

According to an eighteenth aspect of the present invention, any of the fifteenth to seventeenth aspects has a bent plate for providing an elastic force to the electrode of the film with wiring on the back surface of the projecting portion. A circuit former according to one aspect is provided.

According to a nineteenth aspect of the present invention, there is provided a fifteenth to one having an elastic plate for applying an elastic force to the electrode of the film with wiring on the rear surface of the projecting portion.
7. A circuit forming body according to any one of the seventh to seventh aspects.

According to a twentieth aspect of the present invention, a display unit;
A portable terminal device comprising: an operation unit; and the circuit forming body according to any one of the tenth to nineteenth aspects, including the substrate on which the display unit and the electronic component for driving the operation unit are mounted.

[0029]

Embodiments of the present invention will be described below in detail with reference to the drawings.

Hereinafter, embodiments of the present invention will be described with reference to the drawings.

FIGS. 1 and 2 show two examples of a portable terminal to which the circuit connection method and the circuit forming body according to the first embodiment of the present invention are applied. Note that reference numeral 10 in FIG.
Is a wiring film 8 arranged to prevent the wiring film 8 from shifting before the rear side housing 2 is attached.
Is a locking guide.

The exterior of the portable device comprises a front case 1, a rear case 2, and a battery 3. In order to use a portable device, a display unit 4 such as a liquid crystal screen and an operation unit 5 such as keys, which are respectively arranged on the front-side housing 1, are indispensable.
Are mounted inside the front housing 1, and an external connector 7 for signal transmission with the outside of the portable device and for charging the battery is held by the front housing 1. However, the external connector 7 may be fixed to the board 6a as shown in FIG. Further, a rib 1a is provided inside the housing 1 as necessary to secure the strength of the entire housing.

Specifically, when the configuration as shown in FIG. 1 is adopted,
The substrate 6 is disposed on the back side of the display unit 4 of the front side housing 1 and the battery 3 is disposed on the back side of the operation unit 5 of the front side housing 1 so that the space of the battery 3 can be sufficiently used. Can be. When the configuration as shown in FIG. 2 is adopted, the substrate 6a is disposed on the back side of the operation unit 5 of the front-side housing 1, and it is possible to further reduce the thickness as compared with the configuration of FIG. It is.

Here, the display unit 4, the operation unit 5, and the substrate 6
One of the external connector 7 and the external connector 7 is electrically connected by the electrode 9 of the film 8 with wiring. Specifically, in FIG. 1, the display unit 4, the operation unit 5, and the substrate 6
The external connector 7 and the like are all connected via a film 8 with wiring. In order to enable this, the film 8 with wiring is connected to the front housing 1 and the display unit 4 and the operation unit 5 in advance. The display unit 4, the operation unit 5, the substrate 6, the external connector 7, and the like are all connected to the electrodes 9 of the film 8 with wiring, while being formed along each part. FIG.
In the above, the display unit 4, the operation unit 5, the substrate 6a, the external connector 7 and the like are all connected via the electrodes 9 of the film 8 with wiring, and in order to enable this, the film 8 with wiring is It is molded along the front side housing 1 and each part such as the display unit 4 and the operation unit 5 and the like.
The display unit 4, the operation unit 5, the board 6a, the external connector 7 and the like are all connected to the electrodes 9 of the film 8 with wiring. The electrodes 9 connected to the display unit 4, the operation unit 5, the substrate 6 a, and the external connector 7 are portions that are pressed by the protrusions 11.

The electrodes 9 of the film 8 with wiring, the display unit 4, the operation unit 5, the substrate 6a, the external connector 7 and the like are connected by the circuit connection method according to the first embodiment described below. I have.

First, the film with wiring 8 is formed along the front side housing 1 for housing the film with wiring 8 and the display unit 4 and the operation unit 5. As the material of the film 8, polyimide which is most used at present and has high reliability is preferable. The thickness of the film 8 is 10 to 10
0 μm is good, and especially considering bending, it is 10 to 30 μm.
m is preferred.

At this time, the electrodes 9 of the film with wiring 8 are
It is folded back into a V shape as shown in FIG.
To be ready for connection with the display unit 4 or the like. The folding angle, folding angle, folding width and length, and folding width and length are preferably as small as possible.

In order to ensure the contact between the electrodes 9 of the film 8 with wiring and the electrodes of the substrate 6 and each part, it is preferable that the electrodes 9 have elasticity. When the electrode 9 is made to have elasticity, when the film with wiring 8 is connected to, for example, the electrode of the display unit 4, the electrode 9 of the film with wiring 8 is connected to the electrode of the display unit 4 and the electrode 9 is made elastic. After the electrode of the display unit 4 is connected to the electrode 9 of the film 8 with the wiring, the film 9 with the wiring 8 and the display unit 4 are assembled. 4 is constantly pressed against the electrodes, and the contact between both electrodes can be ensured. The electrodes are constantly pressed and connected when the substrate 6 and the housing 2 are assembled. Specifically, for example, as shown in FIG. 3A, the electrode forming portion 8e of the film with wiring 8 on which the plurality of electrodes 9 are formed is folded back in a V-shape, and the back surface of the electrode forming portion 8e is made of resin or The electrode forming portion 8e and hence the electrode 9 are made elastic by attaching a plate 13 folded in a V shape made of sheet metal, or the electrode forming portion 8e is folded in a V shape as shown in FIG. 3B. By sandwiching an elastic plate 14 made of rubber or resin having elasticity on the back surface of the electrode forming portion 8e, the contact between the electrode 9 of the film with wiring 8 and the substrate 6 or the electrode of each part can be ensured. As an example, the plate 13 is made of resin and the elastic plate 14 is a block made of rubber. FIG.
In (a), the plate 13 is attached to the back surface of the electrode 9, but the plate 13 may be formed by injection molding when forming the film 8 with wiring. That is, in order to improve the productivity, the multi-cavity film 8 may be put in a mold to form the plate 13.

Similarly, as shown in FIG. 4, when the electrodes 9 of the film with wiring 8 are bent, a plurality of electrodes 9 are formed.
Electrode forming portion 8 at the end of film 8 with wiring formed with
It is preferable to provide a plate 13 on the back surface of f. When the electrode 9 is arranged in the electrode forming portion 8f at the end of the film 8 with wiring, as shown in FIG.
The electrode 9 can be arranged on the front surface of the electrode forming portion 8f at the end of the above, while the plate 13 can be arranged on the back surface of the electrode forming portion 8f. On the other hand, the electrode 9
When a notch is required, as shown in FIG. 4B, a notch 8a is formed at an intermediate portion of the film 8 with wiring, and a notch 8h is formed.
A plurality of electrodes 9 can be formed on the overhang 8g surrounded by a circle, and the plate 13 can be arranged on the back surface of the overhang 8g.
3 and 4 (a) are all applied only to those having the electrode 9 at the end, whereas in FIG. 4 (b), there is no such restriction, and connection is made at an arbitrary place. Can be.

It is to be noted that a circuit formed body including the wiring-attached film 8 and the substrate 6 connected by the circuit connecting method is referred to as a circuit forming body. The portable terminal (such as a telephone or a PDA (Personal Digital Assistant)) shown in FIGS. 1 and 2 has the circuit forming body.

As a modification of FIG. 3A, FIG.
As shown in (1), a slit 13a may be formed at the tip of the plate 13 so that the nuclear electrodes can be securely and individually pressed. As another modified example of FIG. 3A, as shown in FIG. 12, the plate 13 may be arranged together with the electrode forming portions 8 e without protruding from the film 8 with wiring.

According to the first embodiment, the front case 1
Even if a rib structure or the like in which a rib 1a is formed is provided, the film with wiring 8 formed along the inner surface of the front-side housing 1 is housed in the front-side housing 1, and Since the electrodes 9 of the film 8 and the electrodes of the substrates 6 and 6a are directly connected to establish electrical continuity, a connector or a lead frame is not required, and the connector itself for mounting the connector on the substrates 6 and 6a. The occupied area of the substrate and the connection area with the substrate are not required, and the substrates 6, 6a can be reduced in size. Moreover, since there is no step of mounting and connecting to the connector, cost reduction can be achieved in terms of cost.

According to the first embodiment, the electrodes 9 of the substrates 6 and 6a can be reliably brought into contact with the electrodes 9 of the film 8 with the wiring by projecting or bending the film 8 with the wiring. . According to this configuration, the degree of freedom of the film with wiring 8 can be utilized, and the electrodes 9 of the film with wiring 8 can abut against the electrodes of the substrates 6 and 6a with an appropriate pressure. In particular, since the portion of the film with wiring 8 on which the electrodes 9 are arranged is a protruding portion or a bent portion and has elasticity, the relative distance between the film with wiring 8 and the substrates 6 and 6a may vary somewhat. The film 8 with the wiring is also
Can reliably contact the electrodes 9 of the substrates 6 and 6a, and electrical and electrical continuity can always be ensured.

It should be noted that the present invention is not limited to the above embodiment, but can be implemented in various other modes.

For example, in the first embodiment, a member for imparting elasticity to the electrode 9 is provided on the film with wiring 8 side. However, a circuit connection method, a circuit formed body, and a portable terminal according to the second embodiment of the present invention. In the machine, as shown in FIGS. 5 and 6, even if a member for imparting elasticity to the electrode 9 is provided on the front housing 1 side, the same effect as in the first embodiment can be obtained.

FIG. 5 shows a case in which a notch 8a is formed in the middle of the film 8 with wiring, a plurality of electrodes 9 are provided in an overhanging portion 8b surrounded by the notch 8a, and the film 8 with wiring is connected to the front side housing 1. Plate 1 having elasticity on the front side housing 1 corresponding to the electrode 9 of the film 8 with wiring when stored in
5 is attached, and the film 8 with the wiring is stored in the front side housing 1 so that the electrode 9 of the film 8 with the wiring is
The plate 15 is in contact with the back surface of the electrode 9 to make the electrode 9 elastic. The plate 15 attached to the front side housing 1
May be integrally formed when the front-side housing 1 is manufactured,
In order to reduce the number of parts and the number of attaching operations, it is preferable to form them integrally.

Further, as shown in FIG. 6, instead of the plate 15 attached to the front side housing 1, a film 8 with wiring is used.
When the film 8 with wiring is attached to the front side housing 1 corresponding to the electrode 9 of the film 8 with wiring when the housing is housed in the front side housing 1, a projection 16 made of an elastic material such as rubber or resin is attached. When housed in the housing 1, the projection 16 comes into contact with the back surface of the electrode 9 of the film 8 with wiring, and the electrode 9 can have elasticity.

It is to be noted that a circuit-forming body is provided with the above-mentioned wiring-attached film 8 and the above-mentioned substrate 6a connected by the above-mentioned circuit connection method. The portable terminal (such as a telephone or a PDA (Personal Digital Assistant)) shown in FIGS. 1 and 2 has the circuit forming body.

According to the second embodiment, the same effects as those of the first embodiment can be obtained. At the time of manufacture, FIG.
Is not impossible to integrally mold, but the example of FIG. 6 is likely to be limited to sticking. However, in FIG. 6, unlike a member such as a hard plate, which is made of rubber, each electrode 9 can be pressed individually.

Further, in the circuit connection method, the circuit forming body and the portable terminal according to the third embodiment of the present invention, as shown in FIG. Alternatively, the convex portion 8j may be integrally formed, the electrode 9 may be formed on the convex portion 8j, and the electrode 9 may be elastically protruded. In FIG. 7A, a curved protruding portion 8j is integrally formed on the film with wiring 8 itself, and an electrode 9 is formed on the protruding portion 8j so that the electrode 9 is elastically protruded. In FIG. 7B, a curved convex portion 8j is integrally formed on the film with wiring 8 itself, and a rubber that is curved on the back surface of the convex portion 8j in the same manner as the convex portion 8j and can apply elastic force to the electrode 9 is formed. Alternatively, a resin plate 23 is provided so that the electrode 9 is elastically projected.
In FIG. 7 (c), a curved protruding portion 8j is integrally formed on the film with wiring 8 itself, and an elastic plate 24 made of rubber or resin is provided on the back surface of the protruding portion 8j. It is made to protrude. As an example, the plate 23 is made of resin and the elastic plate 24 is made of rubber. These three examples are:
Depending on the front side housing 1, the film with wiring 8, the substrates 6, 6a, they can be used properly.

In FIG. 7, reference numeral 23 denotes a plate made of resin or metal, and reference numeral 24 denotes an elastic body such as rubber. In the case of FIG. 7A, since there is no member on the back surface of the film 8 with wiring, when the protrusion 11 as shown in FIG. Can be connected. In the case of FIG. 7 (b), even if there is no protrusion 11 described above, that is, even if it is a simple flat surface without the protrusion 11 on the back surface case 2, if it is pressed on the surface of the back surface case 2, , Plate 23 can be used for connection. 7 (c) is the same as FIG. 7 (b).
Since the rubber as an example of the elastic plate 24 fits into the projection 8j, the manufacturing becomes easier than attaching the plate 23 to the projection 8j. Therefore, in the examples of FIGS. 7A to 7C, from the viewpoint of proper use of the housing, FIG. 7A requires the protrusion 11 on the rear housing 2, and FIGS. c) is a projection 11
May be omitted, so that it may be pressed anywhere as long as it is a flat surface of the back side housing 2. In other words, in the case of FIG. 7A, the connection can be ensured only by attaching the projection 11 to the back side housing 2, and FIGS. 7B and 7C show the plate 23 and the elastic plate 24.
However, it is preferable to select the best one after considering the circuit design, the design and the cost of the back-side housing 2, and the like.

The configuration of the electrodes 9 of the film with wiring 8 has mainly been described above, but as shown in FIG.
The projections 11 may be provided on the (or the back-side housing 2), and thereby the electrodes 9 of the film with wiring 8 may be brought into contact with the electrodes of the substrate 6a. As described above, the protrusions 11 may be formed by applying rubber to the front-side housing 1 or applying resin, or may be integrally formed with the front-side housing 1. As long as the followability is good, the projection 11 formed as a single piece may not have elasticity.

Further, by providing the projections 12 separately from the projections 11 on the front side housing 1, the positioning of the film 8 with wiring can be easily performed. The same effect can be obtained by using the wall of the body 1. The protrusions 12 are provided on the bottom surface or side surfaces of the front-side housing 1 in the same manner as in the case of the film 8 with wiring so that the substrate 6 can be positioned and fixed when stored in the front-side housing 1. It is suitable.

In the first and second embodiments, only one substrate 6 or 6a is accommodated in the housing 1. However, even if there are a plurality of substrates, the substrates are connected to each other with the wiring film 8 in the same manner. It is possible to reduce the size and cost of the portable device. That is, the film with wiring 8 formed along the inner surface of the housing 1 or 2 is housed in the housing 1 or 2, and the film 8 with wiring and the plurality of substrates 6,
Even when the electrodes 6a are electrically connected to each other, the electrodes 9 of the film with wiring 8 and the electrodes of the substrates 6, 6a are directly electrically connected to each other without a connector or a lead frame. Can be electrically connected.

In addition, due to environmental problems, in recycling home electric appliances, each baht can be easily separated simply by disassembling the housing, which can be said to lead to reduction in the cost of sorting and disposal and recycling.

It is to be noted that by appropriately combining any of the above-described various embodiments, the effects of the respective embodiments can be exhibited.

[0057]

As described above, according to the present invention, even if a rib structure or the like is provided in the housing, the film with the wiring formed along the inner surface of the housing is housed in the housing. Since the electrodes of the film with wiring and the electrodes of the substrate are directly connected to establish electrical continuity, a connector or a lead frame is not required, and the occupied area of the connector itself for mounting the connector on the substrate and the substrate. No connection area is required, the substrate can be reduced in size, and the cost can be reduced because there are no steps for mounting and connecting to the connector. Therefore, even when the film with the wiring formed along the inner surface of the housing is housed in the housing and the film with the wiring is electrically connected to a plurality of substrates, the wiring with the wiring can be provided without a connector or a lead frame. The direct electrical connection between the electrode of the film and the electrode of each substrate allows electrical connection between a plurality of substrates.

Further, according to the present invention, if the film with wiring is projected or bent, the electrode of the film with wiring and the electrode of the substrate can be reliably contacted. According to this configuration, the degree of freedom of the film with the wiring can be utilized, and the electrode of the film with the wiring can contact the electrode of the substrate with an appropriate pressure. In particular, since the portion where the electrodes of the film with wiring are arranged is a protruding portion or a bent portion and has elasticity, even if the relative distance between the film with wiring and the substrate slightly varies, the elastic force is used. The electrodes of the film with wiring can reliably contact the electrodes of the substrate, and electrical and electrical continuity can always be ensured.

[Brief description of the drawings]

FIG. 1 is a cross-sectional view of an example of a portable device to which a circuit connection method and a circuit forming body according to a first embodiment of the present invention are applied.

FIG. 2 is a cross-sectional view of another example of a portable device to which the circuit connection method and the circuit forming body according to the first embodiment of the present invention are applied.

FIGS. 3A and 3B are explanatory diagrams respectively showing two examples of forming an electrode by folding a film with wiring in the circuit connection method and the circuit forming body according to the first embodiment.

FIGS. 4A and 4B are explanatory diagrams respectively showing two examples of forming an electrode by bending a film with wiring in the circuit connection method and the circuit forming body according to the first embodiment.

FIG. 5 is a diagram showing that an elastic plate is provided on a housing in a circuit connection method and a circuit forming body according to a second embodiment of the present invention.

FIG. 6 is an explanatory diagram showing that a housing is provided with rubber in a circuit connection method and a circuit forming body according to a second embodiment of the present invention.

FIGS. 7A, 7B and 7C show a circuit connection method and a circuit forming body according to a third embodiment of the present invention;
It is explanatory drawing which respectively shows three examples which protrude a film with wiring and form an electrode.

FIG. 8 is a diagram showing a connection method using a conventional connector.

FIG. 9 is a view showing a lead frame in a conventional connection method using a lead frame.

FIG. 10 is a diagram showing connection of substrates by the connection method using the conventional lead frame of FIG. 9;

FIG. 11 is an explanatory diagram showing a modified example of an example in which an electrode is formed by folding a film with wiring in the circuit connection method and the circuit formed body according to the first embodiment of FIG. 3 (a).

FIG. 12 is an explanatory diagram showing another modification of the example of forming an electrode by folding a film with wiring in the circuit connection method and the circuit forming body according to the first embodiment of FIG. 3 (a).

[Explanation of symbols]

DESCRIPTION OF SYMBOLS 1 ... Front side housing, 1a ... Rib, 2 ... Back side housing, 3 ... Battery, 4 ... Display part, 5 ... Operation part, 6 ... Substrate, 6a ...
Substrate, 7: External connector, 8: Film with wiring, 8
a, 8h: Notch, 8b, 8g: Overhang, 8e,
8f: electrode forming portion, 8j: convex portion, 9: electrode of film with wiring, 10: locking guide, 11: projection, 12: projection,
13, 23 ... plate, 14, 24 ... rubber or resin elastic plate,
15: plate, 16: convex portion made of rubber or resin, 30: electronic component.

 ──────────────────────────────────────────────────続 き Continuing on the front page (72) Inventor Mikiya Nakata 1006 Kadoma Kadoma, Osaka Prefecture Matsushita Electric Industrial Co., Ltd. 72) Inventor Kazuhiro Mori 1006 Kadoma, Kazuma, Osaka Prefecture F-term in Matsushita Electric Industrial Co., Ltd. CC08 KK06 KK07 MM04 MM17

Claims (20)

[Claims] 1. A housing (1) for accommodating a film (8) for accommodating a film (8) for accommodating the film with a wiring, which is accommodated in the housing and a substrate (6, 6a).
In the case, and the electrode (9) of the film and the electrode of the substrate are connected to establish electrical continuity between the film with wiring and the substrate. 2. The circuit connection method according to claim 1, wherein an electrode (9) arranged on the elastically bent portion (8e) of the film with wiring comes into contact with an electrode on the substrate to establish electrical continuity. . 3. A bent plate (13) for applying elastic force to the electrodes (9) of the film with wiring on the back surface of the bent portion (8e). Circuit connection method. 4. The circuit according to claim 2, further comprising an elastic plate (14) for applying an elastic force to the electrode (9) of the film with wiring on the back surface of the bent portion (8e). Connection method. 5. An electrode (9) arranged on an elastic protruding portion (8b, 8f, 8g, 8j) of the film with wiring comes into contact with an electrode of the substrate to establish electrical continuity. Circuit connection method described in 1. 6. The circuit connection method according to claim 5, wherein the projecting portions (8b, 8g) are overhangs surrounded by cutouts (8a, 8h) formed in the film with wiring. 7. The projecting portion (8j) is a curved portion formed integrally with the film with wiring.
Circuit connection method described in 1. 8. The protruding portion (8b) has a bent plate (13, 23) on the rear surface thereof for imparting an elastic force to the electrode (9) of the film with wiring. 8. The circuit connection method according to any one of items 7 to 7. 9. A back surface of the projecting portions (8b, 8j)
The circuit connecting method according to any one of claims 5 to 7, wherein the projecting portion has an elastic plate (16, 24) for applying an elastic force to the electrode (9) of the film with wiring. 10. A circuit formed body comprising the film with wiring and the substrate connected by the circuit connection method according to claim 1. 11. The wiring film and the substrate (6, 6a) formed along the inner surface of the housing (1) for housing the wiring film (8) are housed in the housing, and the film is stored in the housing. Wherein the electrode (9) is connected to the electrode of the substrate, and the film with wiring and the substrate are electrically connected to each other. 12. The circuit forming body according to claim 11, wherein an electrode (9) disposed on the elastically bent portion (8e) of the film with wiring comes into contact with an electrode on the substrate to establish electrical continuity. . 13. A back surface of the bent portion (8e),
13. The circuit forming body according to claim 12, wherein the bent portion has a bent plate (13) for applying an elastic force to the electrode (9) of the film with wiring. 14. A back surface of the bent portion (8e),
The circuit forming body according to claim 12, wherein the bent portion has an elastic plate (14) for applying an elastic force to the electrode (9) of the film with wiring. 15. An electrode (9) disposed on an elastic protruding portion (8b, 8f, 8g, 8j) of the film with wiring comes into contact with an electrode of the substrate to establish electrical continuity. 3. The circuit forming body according to 1. 16. The notch (8a, 8h) formed in the film with wiring, wherein the protruding portions (8b, 8g) are formed.
The circuit forming body according to claim 15, wherein the circuit forming body is an overhang portion surrounded by: 17. The circuit forming body according to claim 15, wherein the protruding portion (8j) is a curved portion formed integrally with the film with wiring. 18. A bent plate (13, 23) for applying elastic force to the electrode (9) of the wiring-attached film on the back surface of the projecting portion (8b). 18. The circuit forming body according to any one of items 17 to 17. 19. An elastic plate (16, 24) for applying elastic force to the electrode (9) of the film with wiring on the rear surface of the projecting portion (8b, 8j). 18. The circuit forming body according to any one of items 17 to 17. 20. A substrate comprising a display unit (4), an operation unit (5), and an electronic component (30) for driving the display unit (4) and the operation unit (5). 10
20. A mobile terminal comprising: the circuit forming body according to any one of 19.