JP2002204017A5 - - Google Patents
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- Publication number
- JP2002204017A5 JP2002204017A5 JP2000399114A JP2000399114A JP2002204017A5 JP 2002204017 A5 JP2002204017 A5 JP 2002204017A5 JP 2000399114 A JP2000399114 A JP 2000399114A JP 2000399114 A JP2000399114 A JP 2000399114A JP 2002204017 A5 JP2002204017 A5 JP 2002204017A5
- Authority
- JP
- Japan
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
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Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2000399114A JP4618885B2 (ja) | 2000-12-27 | 2000-12-27 | 加熱装置及びそれを用いた光モジュールの製造方法 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2000399114A JP4618885B2 (ja) | 2000-12-27 | 2000-12-27 | 加熱装置及びそれを用いた光モジュールの製造方法 |
Publications (3)
| Publication Number | Publication Date |
|---|---|
| JP2002204017A JP2002204017A (ja) | 2002-07-19 |
| JP2002204017A5 true JP2002204017A5 (ru) | 2007-05-10 |
| JP4618885B2 JP4618885B2 (ja) | 2011-01-26 |
Family
ID=18863950
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2000399114A Expired - Fee Related JP4618885B2 (ja) | 2000-12-27 | 2000-12-27 | 加熱装置及びそれを用いた光モジュールの製造方法 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JP4618885B2 (ru) |
Families Citing this family (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN115485595A (zh) * | 2020-05-04 | 2022-12-16 | 3M创新有限公司 | 使用热膨胀来维持对准的光学连接器 |
Family Cites Families (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH11260534A (ja) * | 1998-01-09 | 1999-09-24 | Ngk Insulators Ltd | 加熱装置およびその製造方法 |
| JPH11251040A (ja) * | 1998-02-27 | 1999-09-17 | Kyocera Corp | セラミックヒータ及びその製造方法 |
| JP2000208855A (ja) * | 1999-01-13 | 2000-07-28 | Hitachi Ltd | 光半導体素子の実装方法及びその装置 |
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2000
- 2000-12-27 JP JP2000399114A patent/JP4618885B2/ja not_active Expired - Fee Related