JP2002200552A5 - - Google Patents

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Publication number
JP2002200552A5
JP2002200552A5 JP2001009536A JP2001009536A JP2002200552A5 JP 2002200552 A5 JP2002200552 A5 JP 2002200552A5 JP 2001009536 A JP2001009536 A JP 2001009536A JP 2001009536 A JP2001009536 A JP 2001009536A JP 2002200552 A5 JP2002200552 A5 JP 2002200552A5
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JP
Japan
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Application number
JP2001009536A
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Japanese (ja)
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JP2002200552A (ja
JP4349752B2 (ja
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Priority to JP2001009536A priority Critical patent/JP4349752B2/ja
Priority claimed from JP2001009536A external-priority patent/JP4349752B2/ja
Publication of JP2002200552A publication Critical patent/JP2002200552A/ja
Publication of JP2002200552A5 publication Critical patent/JP2002200552A5/ja
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Publication of JP4349752B2 publication Critical patent/JP4349752B2/ja
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Expired - Lifetime legal-status Critical Current

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JP2001009536A 2000-10-24 2001-01-17 ポリッシング方法 Expired - Lifetime JP4349752B2 (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP2001009536A JP4349752B2 (ja) 2000-10-24 2001-01-17 ポリッシング方法

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP2000-324290 2000-10-24
JP2000324290 2000-10-24
JP2001009536A JP4349752B2 (ja) 2000-10-24 2001-01-17 ポリッシング方法

Publications (3)

Publication Number Publication Date
JP2002200552A JP2002200552A (ja) 2002-07-16
JP2002200552A5 true JP2002200552A5 (cg-RX-API-DMAC7.html) 2006-06-15
JP4349752B2 JP4349752B2 (ja) 2009-10-21

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ID=26602669

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2001009536A Expired - Lifetime JP4349752B2 (ja) 2000-10-24 2001-01-17 ポリッシング方法

Country Status (1)

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JP (1) JP4349752B2 (cg-RX-API-DMAC7.html)

Families Citing this family (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR20040040101A (ko) * 2002-11-06 2004-05-12 동부전자 주식회사 드레서 구동용 스위프 모터를 갖는 화학기계연마장치
JP4658182B2 (ja) * 2007-11-28 2011-03-23 株式会社荏原製作所 研磨パッドのプロファイル測定方法
JP5898420B2 (ja) 2011-06-08 2016-04-06 株式会社荏原製作所 研磨パッドのコンディショニング方法及び装置
JP5964262B2 (ja) * 2013-02-25 2016-08-03 株式会社荏原製作所 研磨装置に使用される研磨部材のプロファイル調整方法、および研磨装置
WO2016196216A1 (en) 2015-05-29 2016-12-08 Sunedison Semiconductor Limited Methods for processing semiconductor wafers having a polycrystalline finish
JP7160725B2 (ja) * 2019-03-06 2022-10-25 株式会社荏原製作所 基板処理装置
JP7181818B2 (ja) * 2019-03-08 2022-12-01 株式会社荏原製作所 光触媒を用いた基板処理装置および基板処理方法
JP7534142B2 (ja) * 2020-07-16 2024-08-14 株式会社岡本工作機械製作所 ドレッシング装置及び研磨装置
JP2025099046A (ja) 2023-12-21 2025-07-03 株式会社荏原製作所 非接触パッド洗浄装置

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