JP2002198138A - Ic receptacle, ic package loading jig, and ic package loading method - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide an IC receptacle with which a contact will be brought into contacts with a reed by sufficient contact pressure, even if the number of parts is reduced with regard to the IC receptacle of ZIF(Zero Insertion Force) type, to an IC package loading jig to load the IC package to this IC receptacle, and to the IC package loading method in which the IC package is loaded to the IC receptacle using this IC package loading jig. SOLUTION: The IC package 90 is mounted on the housing 10, in a state with a lever part 112 having been pushed down, and a reed 91 is arranged between a contact part 113 and a support part 1021, by making the IC package 90 slide along the face 101 on which the IC package is mounted, and by releasing the lever part 112, the reed 91 is pinched and retained between the contact part 113 and the support part 1021.

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

The present invention relates to a ZIF (Zero).
Insertion Force) type IC socket and an IC package mounted on the IC socket.
The present invention relates to a C package mounting jig and an IC package mounting method for mounting an IC package in an IC socket using the IC package mounting jig.

[0002]

2. Description of the Related Art Conventionally, an IC socket has been used for electrically connecting wiring on a substrate to leads of an IC package. As this IC socket, a ZIF type has been proposed to facilitate mounting of an IC package.

For example, Japanese Utility Model Publication No. 7-49752 discloses that
A ZIF type IC socket including a housing, a plurality of contacts, and a cover member is disclosed. This I
In the C socket, each contact is pressed against each lead of the IC package by pushing the cover member toward the housing from above the housing on which the IC package is mounted. However, there is a disadvantage that the cost of the IC socket is increased because the cover member is required.

[0004] To solve this drawback, an IC socket which does not require a cover member has been proposed in Japanese Patent Application Laid-Open No. 7-65920. This IC socket is a ZIF type IC socket comprising a housing and a plurality of contacts. The IC package is inserted from above by inserting the IC package in a state where each contact is largely bent outward by a jig. Place each lead in place,
Thereafter, the jig is removed, and each contact and each lead are pressed and contacted by the elastic force of each contact. However, the contacts may bend until the elastic limit of each contact is exceeded, and the contact may be plastically deformed and a sufficient contact pressure of the contact with the lead may not be obtained.

[0005]

SUMMARY OF THE INVENTION In view of the above circumstances, an object of the present invention is to provide an IC socket in which a contact contacts a lead with a sufficient contact pressure even if the number of parts is reduced,
An object of the present invention is to provide an IC package mounting jig for mounting an IC package on a socket, and an IC package mounting method for mounting an IC package on an IC socket using the IC package mounting jig.

[0006]

According to another aspect of the present invention, there is provided an IC socket comprising at least one row of contacts for contacting arranged leads of an IC package, and a housing for supporting the contacts. , Each of the above contacts has an intermediate portion folded back so as to be substantially U-shaped.
It has a substrate connection portion at one end, and has a contact portion with the lead and a lever portion which is elastically pressed at the other end, and the housing is in contact with the IC package mounting surface and the contact portion. And a comb-shaped support portion in which individual support portions for contacting the upper surface of the lead are formed on the respective contact portions corresponding to the contact portions, and the IC package is mounted on the housing with the lever portion being pressed down. Then, the IC package is
The lead is arranged between the contact portion and the support portion by sliding along the C package mounting surface, and the lever is released to release the lead between the contact portion and the support portion. It is characterized by holding the lead.

According to the IC socket of the present invention, each lead of the IC package can be positioned between the contact portion and the support portion by moving the IC package in the lateral direction. The contact may be elastically deformed by an amount corresponding to the thickness of the lead, and the contact hardly undergoes plastic deformation, and the contact can be brought into contact with the lead with a sufficient contact pressure. Also,
By releasing the pressing of the lever part of the contact, the lead is held between the contact part of the contact and the support part of the housing, so that the cover member is unnecessary even though it is a ZIF type IC socket, The number of parts can be reduced.

In the IC socket according to the present invention, it is preferable that an arm for urging the IC package mounted on the IC package mounting surface upward is formed integrally with the housing.

According to this aspect, when the pressing of the lever portion of the contact is released, the position of the IC package can be prevented from being displaced by the arm, and more reliable contact between the contact and the lead can be obtained. it can.

According to the present invention, there is provided an IC package mounting jig according to the present invention, comprising: a frame member having a pressing portion for pressing down a lever portion of a contact of an IC socket according to the present invention; Mountable and IC
A driving member for sliding the package in the arrangement direction of the contacts along the IC package mounting surface of the housing of the IC socket.

According to the IC package mounting jig of the present invention, the IC package can be ZIF-connected to the IC socket of the present invention at low cost.

According to a first aspect of the present invention, there is provided an IC package mounting method comprising: at least one row of contacts in contact with leads arranged in an IC package; and a housing for supporting the contacts. However, the intermediate portion is folded to form a substantially U-shape as a whole, and has a substrate connection portion at one end, and a contact portion with the lead and a lever portion that is elastically pressed at the other end, A housing having an IC package mounting surface, and a comb-shaped support portion formed with individual support portions corresponding to the contact portions on each of the contact portions to contact the upper surface of the lead; The IC package is placed on the housing while the IC package is pressed down, and the IC package is slid along the IC package placement surface to thereby allow the contact portion and the support portion to move between the contact portion and the support portion. A frame member having a pressing portion for pushing down the lever portion in an IC socket for holding the lead between the contact portion and the supporting portion by releasing the lever portion and releasing the lever portion; The IC package is mounted by using an IC package mounting jig that is slidably mounted on a member and includes a driving member that slides the IC package along the IC package mounting surface in the arrangement direction of the contacts. An IC package mounting method, wherein the lead of the IC package is the IC
Disposing an IC package on an IC package mounting surface of an IC socket housing so as to be disposed between adjacent support portions of a comb-like support portion of a socket housing, and mounting the IC package mounting jig on the IC socket; So that the IC package mounting jig frame member pushes down the lever portion of the IC socket contact so that the lead is disposed between the contact portion of the IC socket contact and the support portion. The IC package mounting jig is driven by the driving member to slide the IC package in the direction of arrangement of the contacts of the IC socket, and the IC package mounting jig is removed from the IC socket to release the lever portion. And

According to the IC package mounting method of the present invention, the IC package is easily ZIF-connected to the IC socket of the present invention using the IC package mounting jig without giving excessive stress to the contact. be able to.

[0014]

Embodiments of the present invention will be described below.

First, an embodiment of the IC socket of the present invention will be described with reference to FIGS.

FIG. 1 is a plan view of the IC socket of the present embodiment, FIG. 2 is a bottom view of the IC socket of the present embodiment, and FIG. 3 is a sectional view of the IC socket shown in FIG. FIG. 4 is a longitudinal sectional view of a housing constituting the IC socket of the present embodiment.

The IC socket 1 has a housing 10 and a plurality of contacts 11 arranged on both sides of the housing 10. The housing 10 supports the plurality of contacts 11, and includes a mounting surface 101 on which an IC package (not shown) is mounted, and a comb-shaped support portion 10.
2 and a reverse insertion prevention unit 103.

The mounting surface 101 is a surface having a shape determined according to the IC package to be mounted, and has a rectangular outer shape in the present embodiment. Here, as will be described later, when mounting the IC package in the IC socket 1, it is necessary to move the IC package in the direction of the arrow shown in FIG. 1 (the arrangement direction of the contacts 11 on both sides). . That is, the right side in FIG. 1 is the upstream side in the movement direction of the IC package, and the left side is the downstream side. In moving the IC package, the IC package is slid on the mounting surface 101. Therefore, the mounting surface 101
Has a dimension longer than the IC package by the moving distance of the IC package in the direction of the arrow in FIG. In addition, two arms 1011 and 11
1012 are provided. These arm parts 101
1 and 1012 are formed integrally with the housing 10 so as to extend from the center of the mounting surface 101 to the end of the mounting surface 101 along the arrangement of the contacts 11, This urges the IC package placed on the surface 101 upward. Also, two arm parts 10
A protruding ridge 1012a is provided at the tip of the right arm 1012 in FIG. The ridge 1012a has a detent function for the IC package moved to a predetermined position. Further, guide walls 1013 are provided upright on both sides of the mounting surface 101, and the IC package is guided and moved by these guide walls 1013.

The comb-shaped support portions 102 are provided on both sides of the housing 10 and are composed of a plurality of support portions 1021 protruding in a comb shape. That is, the adjacent support portions 1021 are provided along the contact arrangement direction with an interval larger than the width of each lead of the IC package.

The reverse insertion preventing portion 103 is two projecting portions provided on the end wall on the downstream side in the moving direction of the IC package. The reverse insertion preventing unit 103 is for preventing the IC package from being mounted in the longitudinal direction of the IC package when the IC package is mounted on the mounting surface 101.

Next, the contact 11 will be described with reference to FIG. 5 together with FIGS.

FIG. 5 is a diagram showing the contacts before they are attached to the housing.

The contact 11 is formed by punching a metal plate having conductivity and elasticity and bending it into a shape shown in FIG. That is, the contact 11
Has a tine portion 111 connected to the substrate at one end and a lever portion 112 elastically pressed down at the other end,
The lever portion 11 is located above the tine portion 111 provided at one end.
2 has a shape bent at an intermediate portion so as to be located. The contact portion 1 of the contact 11 between the lever portion 112 and the intermediate portion contacts the lead of the IC package.
13 are provided, and a plurality of press fitting protrusions 114 are provided between the tine portion 111 and the intermediate portion. The portion of the contact 11 where these press-fit projections 114 are provided is wider than other portions. The contact 11 is mounted on the housing 1 such that the upper surface of the contact portion 113 contacts the lower surface of the protruding end of the support portion 1021.
0 in the contact accommodation room 104. In this attachment, the contact portion 11 having the shape shown in FIG. Therefore, the contact 11 attached to the housing 10
Has a generally U-shaped shape as shown in FIG.
The contact portion 113 presses and contacts the support portion 1021 of the housing 10 and has an extra load to urge upward. Also, I
With respect to the movement direction of the C package (the direction of the arrow in FIG. 1), each support portion 1021 protrudes downstream of the IC package in the movement direction of each of the arranged contacts 11.
As shown in FIG. 2, the contacts 11 are fixed in the contact housing chamber 104 by pressing the plurality of press-fit projections 114 into the inner wall of the contact housing chamber 104 of the housing 10.

As described above, the IC socket 1 according to the present embodiment does not include the cover member that presses each contact 11 and each lead of the IC package, so that the height and cost can be reduced. be able to.

Next, an embodiment of an IC package mounting jig according to the present invention will be described with reference to FIGS.

FIG. 6 is a plan view of the IC package mounting jig of this embodiment, FIG. 7 is a sectional view taken along the line BB of the IC package mounting jig shown in FIG. 6, and FIG. 8 is an IC shown in FIG. It is CC sectional drawing of a package mounting jig.

The IC package mounting jig 2 of the present embodiment
Is used when the IC package is mounted on the IC socket 1 described above, and is disposed from above on the IC socket 1 on which the IC package is mounted on the mounting surface 101. Such an IC package mounting jig 2 includes a driving member 21, a frame member 22, and two connection pins 23.

The driving member 21 is slidably connected to the frame member 22 by two connecting pins 23. The driving member 21 has two long holes 211, a grip portion 212, and a contact portion 21.
3 (see FIG. 7). The driving member 21 is slid in the direction of the arrow in FIGS. 6 and 7 when the IC package is mounted on the IC socket 1. The jig 2 for mounting an IC package shown in each of FIGS.
Is in a state of being slid to the slide end position. The elongated hole 211 is a hole elongated in the sliding direction provided at each of the upstream and downstream ends of the driving member in the sliding direction (the direction of the arrow in FIGS. 6 and 7). The connecting pin 23 is inserted into 211.
The grip portion 212 is formed by raising the center of the drive member 21 in the sliding direction,
It is gripped when the drive member 21 is slid. FIG.
The contact portion 213 shown in FIG.
The sliding contact of the drive member 21 causes the IC package to be pushed against the contact portion 213 by sliding the driving member 21. And slides on the mounting surface 101.

The frame member 22 surrounds the periphery of the IC socket 1 on which the IC package is mounted, and has a pressing portion 221 for pressing the lever portion 112 of the contact 11. The pressing portions 221 are provided on both sides of the frame member 22, extend in the sliding direction, and are protrusions protruding so as to face each other. IC socket 1 in which IC package mounting jig 2 is arranged from above
Each of the lever portions 112 is elastically pressed toward the tine portion 111 by the lower surface of the protruding end of the pressing portion 221. Also,
The frame member 22 includes two stoppers 222 for stopping the driving member 21 from sliding. These stoppers 222 are provided at the ends on the downstream side in the sliding direction, and prevent further sliding of the driving member 21 by contacting the sliding driving member 21.

Finally, an embodiment of the IC package mounting method of the present invention will be described with reference to FIGS.

FIG. 9 is a view showing a state in which an IC package is mounted on an IC socket using an IC package mounting jig, and FIG. 10 is a process chart showing an IC package mounting method of the present embodiment.

The present embodiment is an IC package mounting method for mounting an IC package in the above-described IC socket 1 using the above-described IC package mounting jig 2. In addition,
FIG. 9 shows an IC package 9 having a plurality of leads 91.
0 is shown.

First, the leads 91 of the IC package 90
Then, the IC package 90 is mounted on the mounting surface 101 of the IC socket 1 so as to be located between the adjacent support portions 1021 (step (a) in FIG. 10). Subsequently, the IC package mounting jig 2 is disposed from above on the IC socket 1 on which the IC package 90 is placed (step (b) in FIG. 10). IC on which IC package mounting jig 2 is arranged
The socket 1 is surrounded by a frame member 22 and
The lever portion 112 of each contact 11 is elastically pressed toward the tine portion 111 by the pressing portion 221. In addition,
At this time, an operator may press the frame member 22 in order to surely press the lever portion 112. Then, the contact portions 113 (see FIG. 3) of the respective contacts 11 that have been pressed against the respective support portions 1021 are displaced downward, and the respective contact portions 113 are separated from the respective support portions 1021. When the IC package mounting jig 2 is disposed, the arms 1011 and 1
012 has once dropped down. Subsequently, the driving member 2
1 in the arrangement direction of the contacts 11 (FIG. 1).
0 (step (c)). Then, the IC package 90 mounted on the mounting surface 101 of the IC socket 1 is pushed by the contact portion 213 and moves on the mounting surface 101 to the guide wall 1013.
It slides while being guided by. The driving member 21 is slid until the connecting pin 23 contacts the sliding direction upstream end of the elongated hole 211 and also contacts the stopper 222 of the frame member 22. Then, each of the leads 91 of the IC package 90 is located between each of the contact portions 113 and each of the support portions 1021, and the ZIF connection between each of the contacts 11 and each of the leads 91 becomes possible. FIG. 9 shows this state. Finally, the IC package mounting jig 2 is removed from the IC socket 1 (step (d) in FIG. 10). Then, the lever portion 112 of each contact 11 pressed down by the pressing portion 221 of the IC package mounting jig 2 is raised upward by the elastic force of the contact 11 itself, and each contact 11 is in a shape before being pressed by the pressing portion 221. Return to
As a result, the upper surface of each lead 91 of the IC package 90 is pressed by each contact portion 113 against each support portion 1021, and each contact portion 113 presses and contacts the lower surface of each lead 91. Normally, tin or nickel plating is only applied to the lead of the IC package, and an oxide is likely to be generated on the surface in a long-term use, and this oxide causes poor contact between the lead 91 and the contact 11. Prone to problems. However, in the present embodiment, the contact 11 having the shape as shown in FIG. 5 is pressed and attached to the contact accommodating chamber 104 of the housing 10, that is, the contact 11 is accommodated in a preloaded state. Since the contact 11 is accommodated in the chamber 104, the contact 11 comes into contact with the lead 91 with a sufficient contact pressure, and the problem of poor contact due to oxide generated on the lead does not occur. When the IC package mounting jig 2 is arranged in the IC socket 1, the arms 1011 and 1012, which have been lowered, move the IC package mounting jig 2 to the IC socket 1.
When the IC package 90 is removed from the C socket 1, the IC package 90 is urged upward.
1012 prevents displacement of the IC package.

As described above, the IC socket 1 of the present embodiment moves the IC package 90 in the direction in which the contacts 11 are arranged so that the IC package 90 is moved.
Of each contact 91 and each support portion 1021
Since the contact 11 may be elastically deformed by the thickness of the lead 91, the contact 11 is less likely to be plastically deformed, so that the contact reliability can be improved and the contact 11 can be improved. It can withstand mounting of the package 90 many times. Further, the IC package mounting jig 2 of the present embodiment, when mounting the IC package 90 on the IC socket 1,
1 can be ZIF-connected between the contact 11 and the lead 91 with a simple structure without giving excessive stress. Furthermore, the IC package mounting method of the present embodiment does not apply excessive stress to the contact 11 and
The ZIF connection between the contact 11 and the lead 91 can be made at low cost.

[0035]

As described above, according to the present invention, an IC socket in which a contact contacts a lead with a sufficient contact pressure even if the number of components is reduced, and an IC package in which an IC package is mounted in the IC socket. A mounting jig and an IC package mounting method for mounting an IC package in an IC socket using the IC package mounting jig can be provided.

[Brief description of the drawings]

FIG. 1 is a plan view of an IC socket according to an embodiment.

FIG. 2 is a bottom view of the IC socket of the embodiment.

FIG. 3 is a sectional view taken along line AA of the IC socket shown in FIG. 1;

FIG. 4 is a longitudinal sectional view of a housing constituting the IC socket of the embodiment.

FIG. 5 is a view showing a contact before being attached to a housing.

FIG. 6 is a plan view of the jig for mounting an IC package according to the present embodiment.

FIG. 7 is a cross-sectional view of the IC package mounting jig shown in FIG.
It is B sectional drawing.

FIG. 8 is a cross-sectional view of the IC package mounting jig shown in FIG.
It is C sectional drawing.

FIG. 9 is a diagram showing a state in which an IC package is mounted on an IC socket using an IC package mounting jig.

FIG. 10 is a process chart showing an IC package mounting method according to the embodiment.

[Explanation of symbols]

 DESCRIPTION OF SYMBOLS 1 IC socket 10 Housing 101 Placement surface 1011, 1012 Arm part 1012a Ridge part 1013 Guide wall 102 Comb-like support part 1021 Support part 103 Reverse insertion prevention part 11 Contact 111 Tine part 112 Lever part 113 Contact part 114 Press-fit projection 2 IC package mounting jig 21 Driving member 211 Long hole 212 Gripping part 213 Contact part 22 Frame member 221 Pressing part 222 Stopper 23 Connecting pin 90 IC package 91 Lead

Claims (4)

[Claims] 1. A semiconductor device comprising: at least one row of contacts in contact with leads arranged on an IC package; and a housing for supporting the contacts, wherein each of the contacts has a substantially U-shape with an intermediate portion folded back. And has a board connection portion at one end, and a contact portion with the lead and a lever portion that is elastically pressed at the other end, wherein the housing is provided on an IC package mounting surface and the contact portion. Correspondingly, a comb-shaped support portion on which an individual support portion for contacting the upper surface of the lead is formed on each contact portion, and mounting the IC package on the housing with the lever portion pressed down; The lead is arranged between the contact portion and the support portion by sliding the IC package along the IC package mounting surface, and the contact is formed by releasing the lever portion. An IC socket for holding the lead between the contact portion and the support portion. 2. The IC socket according to claim 1, wherein an arm for urging the IC package mounted on the IC package mounting surface upward is formed integrally with the housing. 3. A frame member having a pressing portion for pressing down a lever portion of a contact of the IC socket according to claim 1, and an IC package slidably mounted on the frame member and mounting the IC package on a housing of the IC socket. An IC package mounting jig comprising: a driving member that slides in a direction in which the contacts are arranged along a mounting surface. 4. At least one row of contacts in contact with the arranged leads of the IC package, and a housing for supporting the contacts, wherein each of the contacts has a substantially U-shape with an intermediate portion folded back. Having a substrate connecting portion at one end and a contact portion with the lead and a lever portion elastically pressed at the other end,
Wherein the housing has an IC package mounting surface, and a comb-shaped support portion formed with individual support portions corresponding to the contact portions on each of the contact portions for contacting the upper surface of the lead; Placing the lead between the contact portion and the support portion by placing the IC package on the housing with the portion pressed down, and sliding the IC package along the IC package placement surface; By releasing the lever portion, a frame member having a pressing portion for pushing down the lever portion in an IC socket for holding the lead between the contact portion and the support portion, and slidable with respect to the frame member And a driving member that slides the IC package along the IC package mounting surface in the arrangement direction of the contacts, and mounts the IC package using an IC package mounting jig. An IC package mounting method, IC to IC package housing of the IC socket as IC package leads are arranged between the supporting portions adjacent the comb-like supporting portion of the housing of the IC socket
The IC package mounting jig is arranged on the IC socket, and the IC package mounting jig is framed by the frame member of the IC package mounting jig.
The lever portion of the contact of the C socket is pushed down, and the IC package is moved by the driving member of the IC package mounting jig so that the lead is disposed between the contact portion of the contact of the IC socket and the support portion. And mounting the IC package mounting jig from the IC socket by releasing the lever portion by sliding the IC package mounting jig from the IC socket.