JP2002194574A - Tin or tin alloy film remover - Google Patents
Tin or tin alloy film removerInfo
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- JP2002194574A JP2002194574A JP2000393207A JP2000393207A JP2002194574A JP 2002194574 A JP2002194574 A JP 2002194574A JP 2000393207 A JP2000393207 A JP 2000393207A JP 2000393207 A JP2000393207 A JP 2000393207A JP 2002194574 A JP2002194574 A JP 2002194574A
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- weight
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- tin
- alloy film
- amidosulfate
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Abstract
(57)【要約】
【課題】 下地金属基材上から錫又は錫合金
皮膜を高速度で剥離するための剥離液を提供する。
【解決手段】 （ａ）過酸化水素、（ｂ）酸性フ
ッ化アンモニウム、（ｃ）無機酸、（ｄ）アミド硫酸又
はアミド硫酸塩、及び（ｅ）チオアミド化合物を含有す
る水溶液である錫又は錫合金皮膜剥離液。(57) Abstract: There is provided a stripping solution for stripping a tin or tin alloy film from a base metal substrate at a high speed. SOLUTION: Tin or tin is an aqueous solution containing (a) hydrogen peroxide, (b) ammonium fluoride, (c) inorganic acid, (d) amidosulfuric acid or amidosulfate, and (e) a thioamide compound. Alloy film stripper.
Description
【０００１】[0001]
【発明の属する技術分野】本発明は、下地金属基材上か
ら錫又は錫合金皮膜を高速度で剥離するための剥離液に
関するものである。BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a stripping solution for stripping a tin or tin alloy film from a base metal substrate at a high speed.
【０００２】[0002]
【従来の技術】昨今の環境規制の観点から、鉛の不使用
の傾向が強く従来の鉛含有半田（錫：鉛＝６０：４０）
から鉛フリー半田に移行している。鉛フリー半田組成は
主として、錫：銀、ビスマス、銅、亜鉛、インジウム等
で錫含有率は９５％以上であり、従来の鉛含有半田とは
組成が大きく違う。そのため、従来の無機酸−過酸化水
素系、過酸化水素−フッ化物系等の浸漬剥離液、又、硫
酸−ニトロベンゼンスルホン酸系等の電解剥離液では、
鉛フリー半田皮膜が十分に剥離出来ない。十分に剥離す
るためには、長い時間を要してしまう。例えば、半田メ
ッキラインにおいて、通常、導通用治具はメッキ液に浸
漬されるので治具もメッキされる。2. Description of the Related Art From the viewpoint of recent environmental regulations, there is a strong tendency to use no lead, and the conventional lead-containing solder (tin: lead = 60: 40).
Has shifted to lead-free solder. The lead-free solder composition is mainly tin: silver, bismuth, copper, zinc, indium, etc., and the tin content is 95% or more, which is significantly different from the conventional lead-containing solder. Therefore, conventional inorganic acid-hydrogen peroxide-based, hydrogen peroxide-fluoride-based immersion stripper, or sulfuric acid-nitrobenzenesulfonic acid-based electrolytic stripper,
The lead-free solder film cannot be peeled off sufficiently. It takes a long time to peel sufficiently. For example, in a solder plating line, a conduction jig is usually immersed in a plating solution, so that the jig is also plated.
【０００３】鉛フリー半田メッキは、従来の鉛含有半田
メッキの剥離時間では十分に剥離出来ないため、取り外
すことの出来ない治具はメッキされたままになり、その
結果導電性が変わって被メッキ物のメッキ厚にバラツキ
が生じて問題となる。又、治具にメッキされた皮膜を剥
離するため剥離時間を長くすると、生産性が低下し、こ
れも問題となる。従って、メッキの分野では鉛フリー半
田皮膜を鉛含有半田皮膜と同等の速度で剥離できる処理
液の早急な実用化が求められている。[0003] In the lead-free solder plating, the jig that cannot be removed remains plated because the jig that cannot be removed cannot be sufficiently separated in the stripping time of the conventional lead-containing solder plating. There is a problem in that the plating thickness of the object varies. Further, if the peeling time is increased to peel off the film plated on the jig, the productivity is reduced, which is also a problem. Therefore, in the field of plating, there is a demand for an immediate practical use of a treatment solution capable of peeling a lead-free solder film at the same speed as a lead-containing solder film.
【０００４】[0004]
【発明が解決しようとする課題】本発明の目的は、下地
金属基材上から錫又は錫合金皮膜を高速度で剥離するた
めの剥離液を提供することである。SUMMARY OF THE INVENTION An object of the present invention is to provide a stripping solution for stripping a tin or tin alloy film from a base metal substrate at a high speed.
【０００５】[0005]
【問題を解決するための手段】本発明者らは鋭意検討を
重ねた結果、過酸化水素−フッ化物系に剥離促進剤及び
過酸化水素安定剤を添加することで錫又は錫合金皮膜を
高速で剥離出来ることを見出し、本発明に到達した。Means for Solving the Problems As a result of intensive studies, the present inventors have found that a tin or tin alloy film can be formed at a high speed by adding a peeling accelerator and a hydrogen peroxide stabilizer to a hydrogen peroxide-fluoride system. And found that they can be peeled off, and arrived at the present invention.
【０００６】すなわち、本発明は（ａ）過酸化水素、
（ｂ）酸性フッ化アンモニウム、（ｃ）無機酸、（ｄ）
アミド硫酸又はアミド硫酸塩、及び（ｅ）下記式（１）
で示されるチオアミド化合物を含有する水溶液である錫
又は錫合金皮膜剥離液に関するものである。That is, the present invention relates to (a) hydrogen peroxide,
(B) ammonium acid fluoride, (c) inorganic acid, (d)
Amidosulfuric acid or amidosulfate, and (e) the following formula (1)
The present invention relates to a tin or tin alloy film stripping solution which is an aqueous solution containing a thioamide compound represented by the formula:
【０００７】[0007]
【化２】 Embedded image
【０００８】[0008]
【発明の実施の形態】本発明は、以下の５種類の成分を
含有する水溶液である。成分（ａ）の過酸化水素の添加
量は、特に制限はないが１〜３０重量％が好ましい。添
加量が１重量％未満では酸化効果が不十分であり十分な
剥離速度が得られず、又添加量が３０重量％を超えると
それ以上の酸化効果が得られず経済上好ましくない。DESCRIPTION OF THE PREFERRED EMBODIMENTS The present invention is an aqueous solution containing the following five components. The amount of the hydrogen peroxide added as the component (a) is not particularly limited, but is preferably 1 to 30% by weight. If the added amount is less than 1% by weight, the oxidizing effect is insufficient and a sufficient peeling rate cannot be obtained. If the added amount exceeds 30% by weight, a further oxidizing effect cannot be obtained, which is not economically preferable.
【０００９】成分（ｂ）の酸性フッ化アンモニウムの添
加量は、特に制限はないが１〜３５重量％が好ましい。
添加量が１重量％未満では十分な剥離速度が得られず、
又添加量が３５重量％を超えるとそれ以上の剥離速度向
上が得られず経済上好ましくない。The amount of the ammonium acid fluoride of the component (b) is not particularly limited, but is preferably 1 to 35% by weight.
If the addition amount is less than 1% by weight, a sufficient peeling speed cannot be obtained,
On the other hand, if the amount exceeds 35% by weight, no further improvement in the peeling rate can be obtained, which is economically undesirable.
【００１０】成分（ｃ）の無機酸は、塩酸、硫酸、硝
酸、燐酸、ホウ酸等が挙げられるが、このうち好ましい
ものは、塩酸、硫酸、硝酸である。成分（ｃ）の無機酸
の添加量は、特に制限はないが１〜４０重量％が好まし
い。添加量が１重量％未満では十分な剥離速度が得られ
ず、又添加量が４０重量％を超えるとそれ以上の剥離速
度向上が得られず経済上好ましくない。The inorganic acid of component (c) includes hydrochloric acid, sulfuric acid, nitric acid, phosphoric acid, boric acid and the like, and among them, preferred are hydrochloric acid, sulfuric acid and nitric acid. The amount of the inorganic acid added as the component (c) is not particularly limited, but is preferably 1 to 40% by weight. If the amount is less than 1% by weight, a sufficient peeling rate cannot be obtained, and if the amount exceeds 40% by weight, no further improvement in the peeling rate can be obtained, which is not economically preferable.
【００１１】成分（ｄ）のアミド硫酸又はアミド硫酸塩
は、剥離速度促進剤としての効果がある。主なものとし
ては、アミド硫酸、アミド硫酸カリウム、アミド硫酸ナ
トリウム、アミド硫酸カルシウム、アミド硫酸アンモニ
ウム等が挙げられる。これらのうち好ましいものは、ア
ミド硫酸、アミド硫酸カリウム、アミド硫酸アンモニウ
ムである。成分（ｄ）のアミド硫酸又はアミド硫酸塩の
添加量は、特に制限はないが１〜３０重量％が好まし
い。添加量が１重量％未満では十分な剥離速度が得られ
ず、又添加量が３０重量％を超えるとそれ以上の剥離速
度向上が得られず経済上好ましくない。The amidosulfuric acid or amidosulfate of the component (d) has an effect as a peeling speed accelerator. The main ones include amidosulfuric acid, potassium amidosulfate, sodium amidosulfate, calcium amidosulfate, ammonium amidosulfate and the like. Of these, amidosulfuric acid, potassium amidosulfate and ammonium amidosulfate are preferred. The addition amount of the amidosulfuric acid or the amidosulfate of the component (d) is not particularly limited, but is preferably 1 to 30% by weight. If the added amount is less than 1% by weight, a sufficient peeling rate cannot be obtained, and if the added amount exceeds 30% by weight, a further increase in the peeling rate cannot be obtained, which is not economically preferable.
【００１２】成分（ｅ）のチオアミド化合物は、過酸化
水素の安定剤として効果がある。成分（ｄ）のアミド硫
酸又はアミド硫酸塩を添加することにより、錫又は錫合
金皮膜に対しての剥離速度は向上するが、その反面、過
酸化水素の分解が起こり高剥離速度を維持することが出
来ない。そのため、これまでは実用化が困難であった
が、成分（ｅ）のチオアミド化合物を添加することによ
り過酸化水素の分解を抑制させ、高剥離速度を維持する
ことが可能となる。The thioamide compound of component (e) is effective as a stabilizer for hydrogen peroxide. By adding the amidosulfuric acid or amidosulfate of the component (d), the peeling rate to the tin or tin alloy film is improved, but on the other hand, hydrogen peroxide is decomposed and the high peeling rate is maintained. Can not do. For this reason, it has been difficult to put it into practical use until now, but by adding the thioamide compound as the component (e), the decomposition of hydrogen peroxide can be suppressed, and a high peeling rate can be maintained.
【００１３】主なものとしては、チオホルムアミド、チ
オアセトアミド、チオプロピオンアミド、チオベンズア
ミド、チオニコチンアミド、チオアセトアニリド、チオ
ベンズアニリド、チオ尿素、１,３−ジメチルチオ尿
素、１,３−ジエチル−２−チオ尿素、１−フェニル−
２−チオ尿素、１,３−ジフェニル−２−チオ尿素、チ
オカルバジド、チオセミカルバジド、４,４−ジメチル
−３−チオセミカルバジド、２−メルカプトイミダゾリ
ン、２−チオウラシル、２−チオヒダントイン、３−チ
オウラゾール、２−チオウラミル、４−チオウラミル、
チオペンタール、２−チオバルビツール酸、チオシアヌ
ル酸、２−メルカプトキノリン、チオクマゾン、チオク
モチアゾン、チオサッカリン、２−メルカプトベンズイ
ミダゾール等が挙げられる。これらのうち好ましいもの
は、チオアセトアミド、チオ尿素、２−チオウラシル、
チオシアヌル酸であり、より好ましいものはチオ尿素、
チオシアヌル酸である。The main ones are thioformamide, thioacetamide, thiopropionamide, thiobenzamide, thionicotinamide, thioacetanilide, thiobenzanilide, thiourea, 1,3-dimethylthiourea, and 1,3-diethyl-2. -Thiourea, 1-phenyl-
2-thiourea, 1,3-diphenyl-2-thiourea, thiocarbazide, thiosemicarbazide, 4,4-dimethyl-3-thiosemicarbazide, 2-mercaptoimidazoline, 2-thiouracil, 2-thiohydantoin, 3-thiourazole, 2-thiouramil, 4-thiouramil,
Examples thereof include thiopental, 2-thiobarbituric acid, thiocyanuric acid, 2-mercaptoquinoline, thiocoumazone, thiocumothiazone, thiosaccharin, and 2-mercaptobenzimidazole. Among these, preferred are thioacetamide, thiourea, 2-thiouracil,
Thiocyanuric acid, more preferably thiourea,
Thiocyanuric acid.
【００１４】成分（ｅ）のチオアミド化合物の添加量
は、特に制限はないが０．０１〜５重量％が好ましい。
添加量が０．０１重量％未満では、過酸化水素の安定剤
としての効果が十分に得られない場合があり、又、添加
量が５重量％を超えると経済上好ましくない。成分
（ｅ）のチオアミド化合物は、一種類のみを添加しても
良いし、二種類以上添加しても良い。更に、一般的に知
られている過酸化水素安定剤との併用も可能である。The amount of the thioamide compound (e) to be added is not particularly limited, but is preferably 0.01 to 5% by weight.
If the addition amount is less than 0.01% by weight, the effect of hydrogen peroxide as a stabilizer may not be sufficiently obtained, and if the addition amount exceeds 5% by weight, it is economically undesirable. As the thioamide compound as the component (e), only one kind may be added, or two or more kinds may be added. Further, it can be used in combination with a generally known hydrogen peroxide stabilizer.
【００１５】本発明の剥離液は、錫又は錫合金皮膜の下
地金属が銅又は銅合金であってそれらの金属の溶解を防
止したい場合は、一般的に知られているアゾール類等の
銅インヒビターを配合することができる。又、本発明の
剥離液の使用温度に関しては特に制限はないが、２０〜
６０℃が好ましい。使用温度が高いほど剥離速度は速く
なるが、６０℃を超えると過酸化水素の分解が激しくな
り好ましくない。[0015] The stripping solution of the present invention is a copper or copper alloy which is commonly known as a copper inhibitor such as azoles, when the underlying metal of the tin or tin alloy film is copper or copper alloy and the dissolution of those metals is desired to be prevented. Can be blended. The use temperature of the stripping solution of the present invention is not particularly limited.
60 ° C. is preferred. The peeling rate increases as the use temperature increases, but if it exceeds 60 ° C., the decomposition of hydrogen peroxide becomes severe, which is not preferable.
【００１６】[0016]
【実施例】以下に実施例及び比較例を示し、本発明を具
体的に説明するが、以下の実施例に限定されるものでは
ない。EXAMPLES The present invention will be specifically described below with reference to examples and comparative examples, but the present invention is not limited to the following examples.
【００１７】実施例１ １００×３０×０．３ｍｍのＳＵＳ３０４板上に、錫合
金（錫：ビスマス＝９７：３）メッキ皮膜を２０μｍ形
成させた試料を、過酸化水素５重量％、酸性フッ化アン
モニウム１５重量％、硫酸５重量％、アミド硫酸１０重
量％、チオシアヌル酸０．０５重量％添加された剥離液
に３５℃で３０秒間浸漬させた。錫合金皮膜の剥離速度
及び剥離後２４ｈ経過での過酸化水素の分解率を表１に
示す。Example 1 A sample in which a tin alloy (tin: bismuth = 97: 3) plating film was formed to a thickness of 20 μm on a SUS304 plate of 100 × 30 × 0.3 mm, 5% by weight of hydrogen peroxide, acid fluoride It was immersed in a stripping solution containing 15% by weight of ammonium, 5% by weight of sulfuric acid, 10% by weight of amidosulfuric acid and 0.05% by weight of thiocyanuric acid at 35 ° C. for 30 seconds. Table 1 shows the peeling rate of the tin alloy film and the decomposition rate of hydrogen peroxide 24 hours after the peeling.
【００１８】[0018]
【数１】 (Equation 1)
【００１９】実施例２ 過酸化水素５重量％、酸性フッ化アンモニウム１５重量
％、硫酸５重量％、アミド硫酸１０重量％、チオシアヌ
ル酸０．０５重量％添加された剥離液を用いる代わり
に、過酸化水素１０重量％、酸性フッ化アンモニウム２
０重量％、塩酸１重量％、アミド硫酸カリウム２０重量
％、チオ尿素０．２重量％添加された剥離液を用いる以
外は実施例１と同様の条件で行った。結果を表１に示
す。Example 2 Instead of using a stripping solution containing 5% by weight of hydrogen peroxide, 15% by weight of acidic ammonium fluoride, 5% by weight of sulfuric acid, 10% by weight of amidosulfuric acid, and 0.05% by weight of thiocyanuric acid, a peroxide solution was used. Hydrogen oxide 10% by weight, ammonium acid fluoride 2
The procedure was performed under the same conditions as in Example 1 except that a stripping solution containing 0% by weight, 1% by weight of hydrochloric acid, 20% by weight of potassium amidosulfate and 0.2% by weight of thiourea was used. Table 1 shows the results.
【００２０】実施例３ １００×３０×０．３ｍｍのＳＵＳ３０４板上に、錫合
金（錫：銀＝９６．５：３．５）メッキ皮膜を２０μｍ
形成させた試料を、過酸化水素５重量％、酸性フッ化ア
ンモニウム１５重量％、硫酸５重量％、アミド硫酸１０
重量％、チオシアヌル酸０．０２重量％添加された剥離
液に３５℃で３０秒間浸漬させた。結果を表１に示す。Example 3 A tin alloy (tin: silver = 96.5: 3.5) plated film having a thickness of 20 μm was formed on a SUS304 plate of 100 × 30 × 0.3 mm.
The formed sample was subjected to 5% by weight of hydrogen peroxide, 15% by weight of ammonium acid fluoride, 5% by weight of sulfuric acid, and 10% by weight of amide sulfuric acid.
It was immersed for 30 seconds at 35 ° C. in a stripping solution to which 0.02% by weight of thiocyanuric acid was added. Table 1 shows the results.
【００２１】実施例４ 過酸化水素５重量％、酸性フッ化アンモニウム１５重量
％、硫酸５重量％、アミド硫酸１０重量％、チオシアヌ
ル酸０．０２重量％添加された剥離液を用いる代わり
に、過酸化水素１０重量％、酸性フッ化アンモニウム２
０重量％、硝酸２０重量％、アミド硫酸アンモニウム２
０重量％、２−チオウラシル０．０５重量％添加された
剥離液を用いる以外は実施例３と同様の条件で行った。
結果を表１に示す。Example 4 Instead of using a stripping solution containing 5% by weight of hydrogen peroxide, 15% by weight of acidic ammonium fluoride, 5% by weight of sulfuric acid, 10% by weight of amidosulfuric acid, and 0.02% by weight of thiocyanuric acid, a peroxide solution was used. Hydrogen oxide 10% by weight, ammonium acid fluoride 2
0% by weight, nitric acid 20% by weight, ammonium amidosulfate 2
The procedure was carried out under the same conditions as in Example 3 except that a stripping solution containing 0% by weight and 0.05% by weight of 2-thiouracil was used.
Table 1 shows the results.
【００２２】実施例５ １００×３０×０．３ｍｍのＳＵＳ３０４板上に、錫合
金（錫：鉛＝６０：４０）メッキ皮膜を２０μｍ形成さ
せた試料を、過酸化水素５重量％、酸性フッ化アンモニ
ウム１５重量％、硫酸５重量％、アミド硫酸１０重量
％、チオシアヌル酸０．０２重量％添加された剥離液に
３５℃で３０秒間浸漬させた。結果を表１に示す。Example 5 A sample in which a tin alloy (tin: lead = 60: 40) plating film was formed to a thickness of 20 μm on a SUS304 plate of 100 × 30 × 0.3 mm was subjected to hydrogen peroxide 5% by weight and acid fluoride. It was immersed in a stripping solution containing 15% by weight of ammonium, 5% by weight of sulfuric acid, 10% by weight of amidosulfuric acid and 0.02% by weight of thiocyanuric acid at 35 ° C. for 30 seconds. Table 1 shows the results.
【００２３】比較例１ 過酸化水素５重量％、酸性フッ化アンモニウム１５重量
％、硫酸５重量％、アミド硫酸１０重量％、チオシアヌ
ル酸０．０５重量％添加された剥離液を用いる代わり
に、酸性フッ化アンモニウム１５重量％、硫酸５重量
％、アミド硫酸１０重量％、チオシアヌル酸０．０５重
量％添加された剥離液を用いる以外は実施例１と同様の
条件で行った。結果を表１に示す。COMPARATIVE EXAMPLE 1 Instead of using a stripper containing 5% by weight of hydrogen peroxide, 15% by weight of acidic ammonium fluoride, 5% by weight of sulfuric acid, 10% by weight of amidosulfuric acid and 0.05% by weight of thiocyanuric acid, an acidic solution was used. The procedure was carried out under the same conditions as in Example 1 except that a stripping solution containing 15% by weight of ammonium fluoride, 5% by weight of sulfuric acid, 10% by weight of amidosulfuric acid and 0.05% by weight of thiocyanuric acid was used. Table 1 shows the results.
【００２４】比較例２ 過酸化水素５重量％、酸性フッ化アンモニウム１５重量
％、硫酸５重量％、アミド硫酸１０重量％、チオシアヌ
ル酸０．０５重量％添加された剥離液を用いる代わり
に、過酸化水素５重量％、硫酸５重量％、アミド硫酸１
０重量％、チオシアヌル酸０．０５重量％添加された剥
離液を用いる以外は実施例１と同様の条件で行った。結
果を表１に示す。Comparative Example 2 Instead of using a stripping solution containing 5% by weight of hydrogen peroxide, 15% by weight of acidic ammonium fluoride, 5% by weight of sulfuric acid, 10% by weight of amidosulfuric acid and 0.05% by weight of thiocyanuric acid, Hydrogen oxide 5% by weight, sulfuric acid 5% by weight, amidosulfuric acid 1
The procedure was performed under the same conditions as in Example 1 except that a stripping solution containing 0% by weight and 0.05% by weight of thiocyanuric acid was used. Table 1 shows the results.
【００２５】比較例３ 過酸化水素５重量％、酸性フッ化アンモニウム１５重量
％、硫酸５重量％、アミド硫酸１０重量％、チオシアヌ
ル酸０．０２重量％添加された剥離液を用いる代わり
に、過酸化水素５重量％、酸性フッ化アンモニウム１５
重量％、アミド硫酸１０重量％、チオシアヌル酸０．０
２重量％添加された剥離液を用いる以外は実施例３と同
様の条件で行った。結果を表１に示す。COMPARATIVE EXAMPLE 3 Instead of using a stripper containing 5% by weight of hydrogen peroxide, 15% by weight of ammonium acid fluoride, 5% by weight of sulfuric acid, 10% by weight of amidosulfuric acid and 0.02% by weight of thiocyanuric acid, Hydrogen oxide 5% by weight, acidic ammonium fluoride 15
Wt%, amidosulfuric acid 10 wt%, thiocyanuric acid 0.0
The procedure was performed under the same conditions as in Example 3 except that a stripping solution to which 2% by weight was added was used. Table 1 shows the results.
【００２６】比較例４ 過酸化水素５重量％、酸性フッ化アンモニウム１５重量
％、硫酸５重量％、アミド硫酸１０重量％、チオシアヌ
ル酸０．０２重量％添加された剥離液を用いる代わり
に、過酸化水素５重量％、酸性フッ化アンモニウム１５
重量％、硫酸５重量％、チオシアヌル酸０．０２重量％
添加された剥離液を用いる以外は実施例３と同様の条件
で行った。結果を表１に示す。Comparative Example 4 Instead of using a stripping solution containing 5% by weight of hydrogen peroxide, 15% by weight of ammonium acid fluoride, 5% by weight of sulfuric acid, 10% by weight of amidosulfuric acid and 0.02% by weight of thiocyanuric acid, Hydrogen oxide 5% by weight, acidic ammonium fluoride 15
Weight%, sulfuric acid 5 weight%, thiocyanuric acid 0.02 weight%
The operation was performed under the same conditions as in Example 3 except that the added stripping solution was used. Table 1 shows the results.
【００２７】比較例５ 過酸化水素５重量％、酸性フッ化アンモニウム１５重量
％、硫酸５重量％、アミド硫酸１０重量％、チオシアヌ
ル酸０．０２重量％添加された剥離液を用いる代わり
に、過酸化水素５重量％、酸性フッ化アンモニウム１５
重量％、硫酸５重量％、アミド硫酸１０重量％添加され
た剥離液を用いる以外は実施例３と同様の条件で行っ
た。結果を表１に示す。Comparative Example 5 Instead of using a stripping solution containing 5% by weight of hydrogen peroxide, 15% by weight of acidic ammonium fluoride, 5% by weight of sulfuric acid, 10% by weight of amidosulfuric acid, and 0.02% by weight of thiocyanuric acid, Hydrogen oxide 5% by weight, acidic ammonium fluoride 15
The procedure was performed under the same conditions as in Example 3 except that a stripping solution containing 5% by weight of sulfuric acid, 5% by weight of sulfuric acid and 10% by weight of amide sulfuric acid was used. Table 1 shows the results.
【００２８】比較例６ 過酸化水素５重量％、酸性フッ化アンモニウム１５重量
％、硫酸５重量％、アミド硫酸１０重量％、チオシアヌ
ル酸０．０２重量％添加された剥離液を用いる代わり
に、過酸化水素５重量％、酸性フッ化アンモニウム１５
重量％、硫酸５重量％、アミド硫酸１０重量％、エチレ
ンジアミン４酢酸４ナトリウム塩０．１重量％添加され
た剥離液を用いる以外は実施例３と同様の条件で行っ
た。結果を表１に示す。Comparative Example 6 Instead of using a stripping solution containing 5% by weight of hydrogen peroxide, 15% by weight of acidic ammonium fluoride, 5% by weight of sulfuric acid, 10% by weight of amidosulfuric acid and 0.02% by weight of thiocyanuric acid, Hydrogen oxide 5% by weight, acidic ammonium fluoride 15
The procedure was performed under the same conditions as in Example 3 except that a stripping solution containing 5% by weight of sulfuric acid, 5% by weight of sulfuric acid, 10% by weight of amidosulfuric acid and 0.1% by weight of ethylenediaminetetraacetic acid tetrasodium salt was used. Table 1 shows the results.
【００２９】[0029]
【表１】 [Table 1]
【００３０】[0030]
【発明の効果】本発明の剥離剤を使用することにより、
鉛フリー半田皮膜に対して鉛含有半田皮膜と同等の速度
での剥離が可能となる。By using the release agent of the present invention,
It is possible to peel the lead-free solder film at the same speed as the lead-containing solder film.
フロントページの続き Ｆターム(参考） 4K057 WA01 WA08 WB11 WE02 WE03 WE07 WE08 WE25 WE30 WG02 WG03 Continued on the front page F term (reference) 4K057 WA01 WA08 WB11 WE02 WE03 WE07 WE08 WE25 WE30 WG02 WG03
Claims (5)
ンモニウム、（ｃ）無機酸、（ｄ）アミド硫酸又はアミ
ド硫酸塩、及び（ｅ）式（１）で示されるチオアミド化
合物を含有する水溶液である錫又は錫合金皮膜剥離液。 【化１】 1. A method according to claim 1, wherein (a) hydrogen peroxide, (b) ammonium fluoride, (c) an inorganic acid, (d) amidosulfuric acid or amidosulfate, and (e) a thioamide compound represented by the formula (1). An aqueous solution containing tin or tin alloy film. Embedded image
酸から選ばれた少なくとも一種である請求項１記載の錫
又は錫合金皮膜剥離液。2. The tin or tin alloy film stripper according to claim 1, wherein the inorganic acid of the component (c) is at least one selected from hydrochloric acid, sulfuric acid and nitric acid.
塩がアミド硫酸、アミド硫酸カリウム及びアミド硫酸ア
ンモニウムから選ばれた少なくとも一種である請求項１
記載の錫又は錫合金皮膜剥離液。3. The amidosulfuric acid or amidosulfate of the component (d) is at least one selected from the group consisting of amidosulfuric acid, potassium amidosulfate and ammonium amidosulfate.
The tin or tin alloy film stripper according to the above.
素、チオシアヌル酸から選ばれた少なくとも一種である
請求項１記載の錫又は錫合金皮膜剥離液。4. The tin or tin alloy film stripper according to claim 1, wherein the thioamide compound as the component (e) is at least one selected from thiourea and thiocyanuric acid.
１〜３０重量％、（ｂ）１〜３５重量％、（ｃ）１〜４
０重量％、（ｄ）１〜３０重量％及び（ｅ）０．０１〜
５重量％であり、且つ（ａ）〜（ｅ）の合計重量が７０
重量％以下の水溶液である請求項１記載の錫又は錫合金
皮膜剥離液。5. The composition according to claim 1, wherein the content of the components (a) to (e) is (a)
1 to 30% by weight, (b) 1 to 35% by weight, (c) 1 to 4
0% by weight, (d) 1 to 30% by weight and (e) 0.01 to
5% by weight and the total weight of (a) to (e) is 70%
The tin or tin alloy film stripping solution according to claim 1, which is an aqueous solution of not more than weight%.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2000393207A JP2002194574A (en) | 2000-12-25 | 2000-12-25 | Tin or tin alloy film remover |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2000393207A JP2002194574A (en) | 2000-12-25 | 2000-12-25 | Tin or tin alloy film remover |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JP2002194574A true JP2002194574A (en) | 2002-07-10 |
Family
ID=18859059
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2000393207A Pending JP2002194574A (en) | 2000-12-25 | 2000-12-25 | Tin or tin alloy film remover |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JP2002194574A (en) |
Cited By (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2008106354A (en) * | 2006-09-25 | 2008-05-08 | Mec Kk | Metal removal liquid and metal removal method using the same |
| WO2008143170A1 (en) * | 2007-05-18 | 2008-11-27 | Yazaki Corporation | Method for quantitative analysis of tin or tin alloy plating layer |
| JP2011228618A (en) * | 2010-04-20 | 2011-11-10 | Samsung Electronics Co Ltd | Etchant composition for metal wiring, and method for manufacturing thin-film transistor display panel using the same |
| CN105220154A (en) * | 2014-06-27 | 2016-01-06 | 日照旭日电子有限公司 | The removing process of tinning or eleetrotinplate on a kind of copper or Ni-based material |
| CN113755841A (en) * | 2021-09-10 | 2021-12-07 | 珠海市板明科技有限公司 | Environment-friendly fixture coating cleaning agent, preparation method and fixture cleaning method |
| CN114232030A (en) * | 2021-12-23 | 2022-03-25 | 广东鑫菱环境科技有限公司 | PCB methanesulfonic acid tin stripping waste liquid recycling method and application thereof |
| JP7500088B2 (en) | 2022-04-11 | 2024-06-17 | 奥野製薬工業株式会社 | Metal Stripper |
-
2000
- 2000-12-25 JP JP2000393207A patent/JP2002194574A/en active Pending
Cited By (8)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2008106354A (en) * | 2006-09-25 | 2008-05-08 | Mec Kk | Metal removal liquid and metal removal method using the same |
| WO2008143170A1 (en) * | 2007-05-18 | 2008-11-27 | Yazaki Corporation | Method for quantitative analysis of tin or tin alloy plating layer |
| JP2011228618A (en) * | 2010-04-20 | 2011-11-10 | Samsung Electronics Co Ltd | Etchant composition for metal wiring, and method for manufacturing thin-film transistor display panel using the same |
| US8894876B2 (en) | 2010-04-20 | 2014-11-25 | Samsung Display Co., Ltd. | Etchant for electrode and method of fabricating thin film transistor array panel using the same |
| CN105220154A (en) * | 2014-06-27 | 2016-01-06 | 日照旭日电子有限公司 | The removing process of tinning or eleetrotinplate on a kind of copper or Ni-based material |
| CN113755841A (en) * | 2021-09-10 | 2021-12-07 | 珠海市板明科技有限公司 | Environment-friendly fixture coating cleaning agent, preparation method and fixture cleaning method |
| CN114232030A (en) * | 2021-12-23 | 2022-03-25 | 广东鑫菱环境科技有限公司 | PCB methanesulfonic acid tin stripping waste liquid recycling method and application thereof |
| JP7500088B2 (en) | 2022-04-11 | 2024-06-17 | 奥野製薬工業株式会社 | Metal Stripper |
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