JP2002184534A - Relay connector - Google Patents

Abstract

PROBLEM TO BE SOLVED: To make a board 11 compact. SOLUTION: A board 11 is used to connect an input terminal for a modular jack 21 and an output terminal for a cable jack 22 through a conductive pattern 12. The conductive pattern 12 forms capacitance for anti-crosstalk as well as anti-reflection with the use of a parallel part within a single side of the board 11 and a polymerized part between both sides of the board 11.

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a relay connector particularly suitable for constructing a LAN system using an unshielded twisted pair cable.

[0002]

2. Description of the Related Art A LAN system constructed by unshielded twisted pair cables includes ISO / IEC11801.
Standards, TIA / EIA-568-A standards are widely applied.

[0003] On the other hand, if a connector portion such as a modular plug or a modular jack is included in the middle of a twisted pair cable, the balance of the twisted pair capacity of each pair is lost, and crosstalk characteristics and reflection characteristics deteriorate. As a countermeasure, a technique of forming a compensation capacitor on a printed circuit board has been proposed (for example, Japanese Patent Application Laid-Open No. H11-167959). In this device, a conductor pattern connecting an input terminal and an output terminal includes a comb pattern, and a compensation capacitor is realized via the comb pattern. The printed circuit board is a double-sided printed wiring board, and the comb patterns are formed independently on each side of the printed circuit board.

[0004]

According to the prior art, since the comb pattern is formed independently for each side of the printed board, the area occupied on the board becomes large, and the comb pattern is present on both sides of the board. Since the capacitance between conductors is not used at all, a high-grade substrate with a low dielectric constant is required, and the problem that the material cost tends to rise is inevitable.

In view of the above-mentioned problems in the prior art, an object of the present invention is to use both a parallel portion on one side of a double-sided printed wiring board and a superposed portion between both sides, or to use an auxiliary substrate. Another object of the present invention is to provide a relay connector capable of reducing the material cost by downsizing a substrate.

[0006]

According to a first aspect of the present invention for achieving the above object, a plurality of sets of twisted pair input terminals and output terminals are individually connected via a conductor pattern. The gist of the conductor pattern is to form a capacitor for crosstalk prevention and reflection countermeasures using a parallel portion in one surface of the substrate and a superimposed portion between both surfaces of the substrate. .

[0007] In the conductor pattern, the length between the input terminal and the output terminal can be made equal for each pair of twisted wires.

The conductor pattern may include a loop pattern, and the conductor pattern may be provided with a land pattern for forming a capacitance.

A second aspect of the present invention comprises a board for individually connecting a plurality of pairs of input terminals and output terminals for twisted pair via a conductor pattern, and an auxiliary board mounted on the board. The gist of the pattern is to make the length and the interval uniform for each pair of twisted wires, and the auxiliary board is to form a crosstalk countermeasure capacitor using land patterns on both sides.

The auxiliary board can be provided near one of the input terminal and the output terminal.

In the first and second aspects of the present invention, one or both of the input terminal and the output terminal can be adapted to the pin arrangement of an RJ45 type modular jack, and the substrate is a double-sided printed wiring having plated through holes. It can be a plate.

[0012]

According to the structure of the first aspect of the invention, the conductor pattern is used for compensating for crosstalk and reflection by utilizing the overlapping portion between the two surfaces of the substrate in addition to the parallel portion on one surface of the substrate. , The required area of the substrate can be minimized. This is because the superposed portion can easily produce a large capacity with a small area by using the substrate itself as a dielectric. The substrate is a rigid substrate such as a glass epoxy substrate, a paper epoxy substrate, a paper phenol substrate, a paper polyester substrate, a glass polyimide substrate, a glass bismaleimide triazine resin substrate, an aramid substrate, a composite substrate, a polyester substrate, a polyimide substrate, or the like. It is preferable to select a flexible substrate having a small change over time in the dielectric constant. Further, the substrate may be of a lead frame type in which a conductive pattern formed by lead wires is fixed and held on both sides of the support plate in addition to the double-sided printed wiring board.

In the conductor pattern, by equalizing the length between the input terminal and the output terminal for each pair of twisted pairs, it is possible to realize the equal length wiring of each twisted pair and improve the reflection characteristics. .

Further, since the conductor pattern includes a loop-shaped pattern, a two-path line can be formed, and no special branching pattern or cross pattern is provided. The capacitance can be easily formed. Further, by providing the conductor pattern with a land pattern, a large compensating capacitance can be easily realized. However, the land pattern is
It is formed at the same position on both sides of the substrate, and the capacitance is formed by the overlapping portion between both sides of the substrate.

According to the structure of the second aspect of the invention, the conductor pattern is formed such that the length and the interval between the input terminal and the output terminal are aligned for each pair of twisted wires, so that equal length, equal interval wiring is provided for each pair. As a result, good reflection characteristics and good crosstalk characteristics can be realized. In addition, the auxiliary board mounted on the board forms a capacity for crosstalk prevention using land patterns on both sides, and can compensate for the imbalance in capacity between each pair of twisted pairs,
It is not necessary to form a capacitor for preventing crosstalk on the substrate, so that the conductor pattern on the substrate can be simplified and the required area of the substrate can be reduced. Since the auxiliary substrate uses the capacitance between the land patterns on both surfaces, the variation in the capacitance at the time of manufacturing is small, and the fine adjustment of the capacitance is easy by changing the area of the land pattern. However, as the substrate and the auxiliary substrate, similarly to the substrate of the first invention, a rigid substrate or a flexible substrate having a small change with time in the dielectric constant can be used.

If the auxiliary board is provided in the vicinity of one of the input terminal and the output terminal, the conductor pattern on the board up to the auxiliary board can substantially ignore its resistance component and inductance component, and The design can be further simplified.

One or both of the input terminal and the output terminal are connected to R
By adapting to the pin arrangement of the J45 type modular jack, the cable can be easily relayed through the same type modular jack and the corresponding modular plug. However, one of the input terminal and the output terminal may be adapted to the pin arrangement of another type of cable jack, instead of being adapted to a modular jack of the same type, and an IDC (Ins) for directly connecting a cable core may be employed.
ULATION DISPLACEMENT CONN
(action) terminal. It is preferable that the input terminals or output terminals on the side not using the RJ45 type modular jack have a narrower spacing between the terminals of each pair of twisted wires than the distance to the terminals of the other pairs to improve crosstalk characteristics. .

By using a double-sided printed wiring board with plated through holes, a high degree of reliability can be easily realized. The plated through hole is
In addition to the input terminal portion and the output terminal portion, the present invention can be applied to a transition portion that transitions the conductor pattern from one surface of the substrate to another surface. When the plated through hole is not used, the input terminal portion and the output terminal portion may use the pins of the modular jack, cable jack, or IDC terminal as jumper wires, and the conductor pattern other than the input terminal portion and the output terminal portion may be used. It is preferable to use a mechanical connection by eyelet or jumper wire, a conductive paste connection by screen printing method, or the like for the transition portion.

[0019]

Embodiments of the present invention will be described below with reference to the drawings.

The relay connector is composed of an RJ45 type modular jack 21 and a cable jack 22 connected to the board 11.
Modular jack 21, cable jack 2
A conductor pattern 12 is formed between the two (FIG. 1).

A modular plug 21a is removably combined with the modular jack 21 (FIGS. 1 and 2), and cable plugs 22a, 22
a is detachably combined. The cable 23 connected to the modular plug 21a or the cable plugs 22a, 22a is, for example, an unshielded twisted pair cable including four pairs of twisted pairs, and each pair of twisted pairs is different from each other. Twisted to the pitch. The twisted pair of each set of the cables 23 corresponds to the modular plug 21a and the pin numbers 1-2, 3-6, 5-4, and 7-8 of the modular jack 21 (FIG. 2).
(B)).

The substrate 11 is a double-sided printed wiring board with plated through holes (FIGS. 3 and 4). That is, the input terminal T1 for the modular jack 21 (terminal numbers 1, 2
.. 8) are formed by plated through holes, respectively, and conform to the pin arrangement of the modular jack 21.
The output terminals T2 for the cable jack 22 (terminal numbers 1, 2,..., 8) are also formed by plated through holes, and conform to the pin arrangement of the cable jack 22. The terminal numbers 1, 2,..., 8 of the input terminal T1 and the terminal numbers 1, 2,.
... corresponds to 8.

The conductor pattern 12 on the substrate 11
1 pattern 12a on the front side and the pattern 12
and b. However, FIG.
(A) illustrates the pattern 12a on the front surface of the substrate 11, and (B) illustrates the pattern 12b on the rear surface as seen through from the front surface of the substrate 11. FIG.
2 also shows patterns 12a and 12b on the front side and the back side as viewed from the front side of the substrate 11.

The substrate 11 individually connects the terminal numbers 1, 2,..., 8 of the input terminals T1 and the terminal numbers 1, 2,. However, the conductor patterns 12 between the terminal numbers 1 and 1, between the terminal numbers 6 and 6, and between the terminal numbers 8 and 8 are formed by plating through holes K1, K6 and K8 in the middle, respectively, so that the pattern 12a on the front side and the back side can be The transition portion between 12b is formed. Also,
The conductor pattern 12 has pin numbers 1-2, 3-6, 5-
For each pair of twisted wires corresponding to 4, 7-8, the input terminal T
1, the lengths between the output terminals T2 are almost the same. For example, the length between the terminal numbers 1 and 1 of the input terminal T1 and the output terminal T2 is substantially equal to the length between the terminal numbers 2 and 2, and the length between the terminal numbers 3 and 3 is the terminal numbers 6 and 6. It is almost equal to the length between them. Further, the length between the terminal numbers 5 and 5 is substantially equal to the length between the terminal numbers 4 and 4, and the length between the terminal numbers 7 and 7 is substantially equal to the length between the terminal numbers 8 and 8.

The conductor pattern 12 includes a loop pattern. For example, the pattern 12a on the front side between the terminal numbers 3 and 3 and the pattern 1 on the back side between the terminal numbers 6 and 6
2b each form a rectangular loop in the middle. However, the pattern 12b between the terminal numbers 6 and 6 has shifted to the pattern 12a via the plated through hole K6 in the middle.

The conductor pattern 12 has a capacitance Cijc (i = 1, 2,... 8, j = 1, 2,..., I) at a parallel portion within one surface of the substrate 11 and a superposed portion between both surfaces of the substrate 11.
j). For example, the pattern 12 on the front side
a is the capacitance C12c, C13c, C35c of the parallel portion in one side.
, C36c and C58c are formed (FIG. 4A), and the pattern 12b on the back side is formed by the capacitances C14c and C of parallel portions in one surface.
46c, C68c, and C78c are formed (FIG. 4B).
Further, the conductor pattern 12 has a capacitance C of a superposed portion between both surfaces.
12c, C36c and C78c are formed (FIG. 3). Further, the conductor pattern 12 has a terminal number 3 of the output terminal T2,
5 are attached to the front side pattern 12a (FIG. 4 (A)), and the land patterns P6, P4 connected to the terminal numbers 6 and 4 of the output terminal T2 are connected to the back side pattern 12b. By adding them (FIG. 3 (B)), the capacitances C36c and C45c of the overlapping portions of the land patterns P3 and P6 and the land patterns P5 and P4 are formed (FIG. 3).

The conductor pattern 12 has a terminal spacing d1 for each pair of twisted pairs of the cable 23 and a distance d2 to another adjacent pair of terminals on the output terminal T2 side not using the modular jack 21. Is set to d1 <d2.

Generally, the twisted pair of each set of the cable 23 is untwisted in the modular plug 21a (the untwisting range a in FIG. 2A), and
a and connected to the modular jack 21 via pin contacts (FIG. 5). Therefore, in the modular plug 21a and the modular jack 21, a capacity imbalance occurs between each pair of twisted pairs, and the capacities C23a, C34a, C56a, C67a, C13b, C24b which cause crosstalk.
, C35b, C46b, C57b, and C68b, respectively. Therefore, by setting the capacitance Cijc formed in the substrate 11 so as to satisfy the following equations, it is possible to realize good crosstalk characteristics between each pair. C23a = C13b + C13c (1) C34a = C35b + C35c (2) C56a = C46b + C46c (3) C67a = C68b + C68c (4) C24b = C14c ... (5) C57b = C58 6)

On the other hand, capacitors C12c, C36c, C45c, C78
c compensates for a reduction in the capacitance between the twisted pairs of each pair from the modular plug 21a to the modular jack 21, thereby improving the reflection characteristics. That is, equations (1) to
The capacitance Cijc shown in (6) is a capacitance for measures against crosstalk, and the capacitances C12c, C36c, C45c and C78c are capacitances for measures against reflection. However, capacity C12c, C78c
Uses the sum of the respective capacitances formed in the parallel portion and the overlapping portion of the conductor pattern 12, and the capacitance C36c is
The sum of the capacities of the parallel portions and the overlapping portions of the conductor patterns 12 and the overlapping portions of the land patterns P3 and P6 is used. The capacitance C45c is determined by the land patterns P5, P5
4 The capacity of the polymerized part is used.

FIGS. 6 and 7 show examples of crosstalk characteristics and reflection characteristics of the relay connector shown in FIGS. However, in FIG. 6 and FIG. 7, the curve (1) corresponds to the ISO / IEC11
801 standard, TIA / EIA-568-A standard category 5 limit values, curve (2) is the worst crosstalk characteristic between pairs of twisted pairs, twisted pair corresponding to pin number 3-6 Are shown. Use frequency 100
Crosstalk characteristics are approximately 6 to
A margin of 10 dB is realized, and the reflection characteristic is at least about 12
A margin of dB could be realized.

In the above description, the board 11 is composed of a plurality of modular jacks 21, 21.
Are mounted between the modular jack 21 and the cable jack 22 to form a multi-port type relay connector. Note that the input terminals T1 for the modular jack 21,
The output terminal T2 for the cable jack 22 may be replaced with an output terminal and an input terminal, respectively. Also,
The cable jack 22 may be replaced with an IDC terminal for directly connecting the core of the cable 23.
It may be replaced with an RJ45 type modular jack having the same shape as 1.

Note that the compensation capacitance Cijc formed on the substrate 11 is a combination of the capacitance of the parallel portion of the conductor pattern 12, the capacitance of the overlap portion, and the capacitance of the overlap portion by the land patterns P3, P6 and the land patterns P5, P4. Can be arbitrarily selected.

[0033]

[Other Embodiments] A modular jack 2 is provided on a substrate 11.
Auxiliary substrate 1 near input terminals T1, T1 for
5 and 15 can be mounted (FIGS. 8 and 9). However, two RJ45 type modular jacks 21, 21 and cable jacks 22, 2,
2 is also installed.

The substrate 11 is a double-sided printed wiring board with plated through holes, and is formed with input terminals T1 for the modular jacks 21 and output terminals T2, T2... For the cable jacks 22, 22, and the input terminals T1, T2,. In the vicinity of T1, mounting positions H, H of auxiliary substrates 15, 15 parallel to the input terminals T1, T1 are provided.

The front and rear two rows of cable jacks 22, 22
Are cable plugs 22a, 2
2a is inserted into one side of each, and used by dividing into two. That is, the front and rear output terminals T2 and T2 corresponding to each side of the cable jacks 22 and 22 are respectively connected to one set 1-2 and 7-8 of the twisted pair of the cable 23 and the other set 3-6 and 5-6. -4.

At the mounting positions H, H of the auxiliary substrates 15, 15, legs 15a, 15b,.
.., Hd are formed.
Further, the terminal numbers m, n (m = m = n) of the input terminal T1 are inserted into the respective insertion holes Hx (x = a, b... D) through the conductor pattern 13.
Auxiliary land H connected to 1, 5, 4, 8, n = 3, 6)
xm and Hxn are attached. That is, auxiliary lands Ha1 and Ha3 are provided in the insertion hole Ha, and auxiliary lands Hb5 and Hb3 are provided in the insertion hole Hb. Auxiliary lands Hc4 and Hc6 are provided in the insertion hole Hc, and auxiliary lands Hd8 and Hd6 are provided in the insertion hole Hd.
The auxiliary lands Hxm and Hxn are plated with solder on the back surface of the substrate 11.

The conductor pattern 12 connecting each input terminal T1 and the corresponding output terminal T2, T2 has a twisted pair corresponding to the pin numbers 1-2, 3-6, 5-4, and 7-8. The length and interval between the input terminal T1, the output terminal T2, and T2 are almost the same for each set (see FIGS. 9 and 1).
0). For example, the conductor pattern 12 has input terminals T1,
The length of the pair of the output terminals T2 between the terminal numbers 1 and 1 and the terminal numbers 2 and 2 is substantially equal, and is maintained at a constant interval over substantially the entire length. A set between terminal numbers 3 and 3 and terminal numbers 6 and 6; a set between terminal numbers 5 and 5 and terminal numbers 4 and 4; a set between terminal numbers 7 and 7 and terminal numbers 8 and 8 The same applies to. However, FIG. 9 is a diagram corresponding to FIG. 3, and FIG. 10 shows only the lower half of FIG. 9, and FIGS. 4A and 4B show FIGS. 4A and 4B, respectively. FIG.

The auxiliary board 15 includes legs 15a, 15b.
Land patterns Q1 and Q2 on the front side to be individually drawn out to d
.., Q4 and the land patterns Q5, Q6,..., Q8 on the back side, and the capacitors C13c, C35c, C46c, C68c for preventing crosstalk.
Are formed. The land patterns Q1, Q2,.
Q8 has at least legs 15a, 15b.
Above is a solder plated finish. The auxiliary board 15 includes legs 15a, 15b,.
Into the insertion holes Ha, Hb... Hd.
The land patterns Q1, Q2,..., Q8 on b... 15c can be mounted on the substrate 11 by soldering to the corresponding auxiliary lands Hxm, Hxn.

In the modular plug 21a and the modular jack 21, the capacitances C23a, C34a, C34a and C34a, which cause crosstalk due to the imbalance of the capacitance between each pair of twisted pairs of the cable 23, are provided.
C56a, C67a, capacity C23b, C34b, C56b, C67b
Parasitic (FIG. 11). Therefore, by setting the capacitances C13c, C35c, C46c, and C68c formed on the auxiliary substrate 15 so as to satisfy the following equations, it is possible to realize good crosstalk characteristics between each pair. C13c = C23a + C23b (1) C35c = C34a + C34b (2) C46c = C56a + C56b (3) C68c = C67a + C67b (4)

FIGS. 12 and 13 show examples of crosstalk characteristics and reflection characteristics of the relay connector shown in FIGS. However,
Curves (1) and (2) in FIGS. 12 and 13 correspond to curves (1) and (2) in FIGS. 6 and 7, respectively. That is, a margin of about 8 to 12 dB was realized as a crosstalk characteristic and a margin of about 12 dB or more was achieved as a reflection characteristic with respect to the limit value of category 5 at a used frequency of 100 MHz.

8 and 9, the input terminals T1, T1 for the modular jack 21 and the cable jack 2
Can be used as an output terminal and an input terminal, respectively. At this time, the auxiliary substrates 15, 15 are provided near the output terminals. Also, connect the cable jack 22 to the modular jack 2
1, the auxiliary board 15 is connected to the input terminals T1,
It can be provided near each output terminal T2 and used for each modular jack 21. 8 and 9
The substrate 11 can be used as a simple relay substrate by omitting the auxiliary substrates 15 and 15.

[0042]

As described above, according to the first invention of the present application, by utilizing both the parallel portion on one side of the conductor pattern of the substrate and the overlapping portion between both surfaces,
Since the substrate itself can be used as a dielectric to form a compensation capacitor in a small area for anti-crosstalk and anti-reflection, it can be made sufficiently small to reduce material costs. Has an excellent effect.

According to the second aspect of the present invention, the length and spacing of the conductor patterns for each pair of twisted wires on the substrate are made uniform, and the auxiliary substrate for forming a capacitance for preventing crosstalk is provided. The pattern does not require crosstalk protection,
The shape can be simplified.

[Brief description of the drawings]

FIG. 1 is an explanatory perspective view of the overall configuration.

FIG. 2 is an explanatory view of a use state.

FIG. 3 is an explanatory plan view of a substrate (1).

FIG. 4 is an explanatory plan view of a substrate (2).

FIG. 5 is an equivalent circuit diagram

FIG. 6 is a characteristic diagram (1).

FIG. 7 is a characteristic diagram (2).

FIG. 8 is a view corresponding to FIG. 1, showing another embodiment.

FIG. 9 is a diagram corresponding to FIG. 3;

FIG. 10 is a diagram corresponding to FIG. 4;

FIG. 11 is a diagram corresponding to FIG. 5;

FIG. 12 is a diagram corresponding to FIG. 6;

FIG. 13 is a diagram corresponding to FIG. 7;

[Explanation of symbols]

 T1 ... input terminal T2 ... output terminal K1, K6, K8 ... plated through hole Cijc (i = 1, 2, ... 8, j = 1, 2, ... 8) ... capacitance P3, P4 ... P6, Q1, Q2 ... Q8 ... land Pattern 11 ... Board 12 ... Conductor pattern 15 ... Auxiliary board 21 ... Modular jack

Claims (8)

[Claims] 1. A board for individually connecting a plurality of sets of twisted pair input terminals and output terminals via a conductor pattern, wherein the conductor pattern comprises: a parallel portion on one surface of the substrate; A relay connector characterized in that a capacitor for preventing crosstalk and a countermeasure for reflection is formed by utilizing a superposed portion between both surfaces of the substrate. 2. The relay connector according to claim 1, wherein the conductor pattern has the same length between the input terminal and the output terminal for each pair of twisted wires. 3. The relay connector according to claim 1, wherein the conductor pattern includes a loop pattern. 4. The relay connector according to claim 1, wherein a land pattern for forming a capacitance is attached to the conductor pattern. 5. A board for individually connecting a plurality of pairs of input terminals and output terminals for twisted pair via a conductor pattern, and an auxiliary board mounted on the board, wherein the conductor pattern comprises: A relay connector characterized in that the length and the interval are aligned for each pair of twisted wires, and the auxiliary board forms a capacity for preventing crosstalk using land patterns on both sides. 6. The relay connector according to claim 5, wherein the auxiliary board is provided near one of the input terminal and the output terminal. 7. The relay connector according to claim 1, wherein one or both of the input terminal and the output terminal are adapted to a pin arrangement of an RJ45 type modular jack. 8. The relay connector according to claim 1, wherein the substrate is a double-sided printed wiring board having plated through holes.