JP2002182179A - Liquid crystal device and method of manufacturing the same - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide a liquid crystal device reducing the generation of a galvanic corrosion or the like in a region between substrates outside a sealing material and a method of manufacturing the same. SOLUTION: The width of the region between the substrates outside the sealing material is reduced by carrying out laser cutting along scribe grooves 110a, 120a formed on the upper side of outer peripheries of the sealing material 13, and thereby, a galvanic corrosion is prevented.

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

[0001] 1. Field of the Invention [0002] The present invention relates to a liquid crystal device and a method of manufacturing the same, and more particularly, to a substrate dividing process.

[0002]

2. Description of the Related Art Generally, a liquid crystal panel constituting a liquid crystal device is formed by bonding two substrates made of glass or the like with a sealing material and sealing liquid crystal inside the sealing material. A relatively small-sized liquid crystal panel is composed of a large-sized mother board including a plurality of portions corresponding to the liquid-crystal panel, which are bonded to each other with a sealing material to form a large-sized panel, and the large-sized panel is divided to form individual liquid-crystal panels. It is manufactured by an individual manufacturing process.

FIG. 14 is a longitudinal sectional view (a) showing a schematic structure of a conventional liquid crystal panel, and a partial plan perspective view (b) showing an enlarged portion indicated by B in the longitudinal sectional view. The liquid crystal panel 9 is formed by bonding substrates 1 and 2 made of glass or the like with a sealing material 3, and a liquid crystal (not shown) is sealed inside the sealing material 3. The substrate 1 is an end surface 2 of the substrate 2
and a substrate overhanging portion 1a which extends outwardly from a. Electrodes (not shown) are formed on the inner surfaces of the substrates 1 and 2, and wirings 1b shown in FIG. 14B are conductively connected to these electrodes.
It is formed so as to be drawn out on the surface of the.

The end faces (including the end face 2a shown) formed on the outer periphery of the substrates 1 and 2 in the liquid crystal panel 9 break the mother substrate constituting the large format panel by a known scribe-break method or the like. Formed by At this time, scribe grooves are formed on the substrate surface by the scribe processing, and the substrate is broken by applying stress along the scribe grooves. Here, if the scribe groove is formed so as to pass directly above the seal material 3, breakage failures such as the fracture surface being formed shifted from the scribe groove due to the presence of the seal material 3 are likely to occur. Therefore, generally, a scribe groove is formed at a position away from the sealing material 3 by a certain distance so that a breakage failure does not occur.

[0005]

In the manufacturing process of the liquid crystal panel 9, liquid crystal is injected from an opening (not shown) of the sealing material 3 and sealing is performed. May enter the region C between the substrates 1 and 2 (hereinafter, simply referred to as “the region between the outer substrates”). Therefore, cleaning is performed to remove the liquid crystal. The distance between the substrates 1 and 2 is about 3 to 10 μm, which is the same as the cell gap. As described above, in order to avoid breaking failure, usually 0.5 to 1.0
Since the width is not less than about mm, the liquid crystal which has entered cannot be sufficiently removed from the outer inter-substrate region C only by washing, and as a result, the wiring facing the outer inter-substrate region C when the liquid crystal device is used. 1b has a problem that corrosion and erosion may occur.

SUMMARY OF THE INVENTION The present invention has been made to solve the above problems, and has as its object to provide a liquid crystal device capable of reducing the occurrence of electrolytic corrosion and the like in a region between outer substrates and a method of manufacturing the same.

[0007]

In order to solve the above-mentioned problems, a liquid crystal device according to the present invention comprises two substrates bonded together via a sealing material, and liquid crystal is sealed between the substrates inside the sealing material. Wherein at least a part of an end face of an outer periphery of the substrate is formed within a range of 100 μm on the sealing material or outside from an outer edge of the sealing material.

Since the end face of the substrate is formed on the seal material or outside the outer edge of the seal material within a range of 100 μm or less, the distance between the outer edge of the seal material and the end face of the substrate can be reduced even when an outer inter-substrate region exists. Since the thickness is 100 μm or less, the penetrated liquid crystal can be easily removed by washing, and the occurrence of corrosion and erosion in the region between the outer substrates can be reduced.

Here, it is preferable that the end face be within a range of 100 μm inward from the outer edge of the sealing material. In this case, even when the end face is located on the sealing material, the protrusion width of the sealing material is within 100 μm.
Since the deformation and the amount of division of the sealing material when the substrate is broken are reduced, it is possible to prevent poor sealing.

In the present invention, it is preferable that the end face is formed within a range of 60 μm outside the outer edge of the sealing material. In this case, since the width of the region between the outer substrates is limited to 60 μm or less, the electrolyte remaining in the region between the outer substrates can be further reduced.

In the present invention, it is preferable that the end face is arranged on the sealing material. Since the end face is disposed on the sealing material, there is no region between the outer substrates, so that occurrence of corrosion or erosion can be prevented.

In the present invention, of the two substrates,
One of the substrates is provided with a substrate overhang extending outside the outer edge of the other substrate, and wiring is drawn out of the sealing material on the surface of the substrate overhang, and the end face is Preferably, it is provided at the outer end of the other substrate facing the substrate overhang. Since the end face formed on the seal material or outside the outer edge of the seal material within a range of 100 μm is formed at the outer end portion opposite to the substrate overhang portion, it is possible to prevent the wiring formed on the substrate overhang portion from being formed. Corrosion and erosion can be reduced.

In the present invention, it is preferable that the end face has a fractured surface caused by internal stress caused by local expansion and contraction of the substrate material. The fracture surface caused by internal stress caused by local expansion and contraction of the substrate material is different from the fracture surface caused by external stress.
It is formed into a smooth surface with almost no chipping or steps. Such an internal stress can be generated by locally heating or cooling the substrate material, and includes, for example, heating by light irradiation such as laser light irradiation and subsequent cooling. By not using external stress, even when the substrate near the seal material or the substrate part on the seal material is broken, no stress is applied to the seal material, and the seal material is not affected and stable. The substrate material can be easily broken. Moreover, since microcracks are not easily formed on the fractured surface, the panel strength can be increased.

In the present invention, the end face may be formed with a rib mark extending along a ridge line between the end face and the substrate surface.

In the present invention, a rib mark may be formed near a corner of the end face.

The rib mark is a mark of a scar (a scribe groove or the like) for starting the breaking action of the substrate. By forming the scar, the internal stress is concentrated on the portion where the scar is formed, and the break is started from the position where the scar is formed. Let it proceed.

In the present invention, a rib mark is formed on the end surface along a ridge line between the end surface and the substrate surface, and the rib mark is located between an end of the ridge line and both ends of the ridge line. Preferably, the depth of the rib mark located at the end is different from the depth of at least one rib mark located between both ends of the ridge line. According to this means, for example, by reducing the depth of the scar between the two ends of the planned dividing line where the straightness of laser cutting is more stable than the vicinity of the end face of the substrate, the depth of the scar is reduced. The amount of cracks can be reduced and the panel strength can be improved, the possibility of the substrate cracking at an undesired timing in the intermediate process can be reduced, and the depth of the end scar is deep. Thereby, the straightness of laser cutting near the substrate end surface where the heat distribution is unstable due to laser cutting can be stabilized.

Next, a method for manufacturing a liquid crystal device according to the present invention is a method for manufacturing a liquid crystal device in which two substrates are bonded together via a sealing material and a liquid crystal is sealed between the substrates inside the sealing material. Wherein at least one of the two substrates is provided with a step of breaking a portion of the at least one substrate within a range of 100 μm on the sealing material or outside from the outer edge of the sealing material. I do. Here, the portion is 100 μm inward from the outer edge of the sealing material.
It is preferably within the range of m or less.

In the present invention, it is preferable that the portion is a portion within a range of 60 μm outside the outer edge of the sealing material.

In the present invention, the part may be a part arranged on the sealing material.

In the present invention, light is irradiated to the site,
It is preferable that the portion is broken by internal stress generated by local expansion and contraction of the substrate material due to the light irradiation. According to this means, the desired portion can be broken in a non-contact manner without applying external stress to the substrate. In particular, since a desired portion can be ruptured by internal stress, a stress load on the seal material can be reduced, sealing failure and the like can be prevented, and the influence of the rupture action from the seal material is also reduced. it can. further,
Since the fractured surface can also be a smooth surface without a step, the occurrence of microcracks is reduced and the panel strength can be increased.

Another method of manufacturing a liquid crystal device according to the present invention is a method of manufacturing a liquid crystal device in which two substrates are bonded together via a sealing material and a liquid crystal is sealed between the substrates inside the sealing material. A step of irradiating a portion of the substrate on the sealing material with light and breaking the portion by internal stress caused by local expansion and contraction of the substrate material due to the irradiation of light. I do.

In the present invention, it is preferable to irradiate the portion of one of the substrates with light and simultaneously irradiate the other of the substrates with light to simultaneously divide the two substrates. According to this means, the two substrates can be simultaneously divided in a non-contact manner, so that the processing can be performed quickly, and the substrate can be surely divided without being disturbed by the other substrate. Can be. Also, 2
When both of the substrates receive light irradiation, panel distortion due to expansion and contraction caused during light irradiation can be reduced.

In the present invention, it is preferable that a scar is formed along a division line passing through the site, and the substrate is broken from the scar.

In the present invention, the scar may be formed as a scribe groove extending along the predetermined dividing line.

In the present invention, the scar may be partially formed at an end of the substrate on the dividing line.

In the present invention, the scar is located between an end of the planned dividing line and both ends of the planned dividing line on the substrate, and a depth of the scar located at the end is: It is preferable that the depth is different from the depth of at least one scar located between both ends of the planned dividing line. According to this means, for example, by reducing the depth of the scar between the two ends of the planned dividing line where the straightness of laser cutting is more stable than the vicinity of the end face of the substrate, the depth of the scar is reduced. The amount of cracks can be reduced and the panel strength can be improved, the possibility of the substrate cracking at an undesired timing in the intermediate process can be reduced, and the depth of the end scar is deep. Thereby, the straightness of laser cutting near the substrate end surface where the heat distribution is unstable due to laser cutting can be stabilized.

In the present invention, it is preferable that the scar is partially formed on both ends of the substrate on the dividing line.

[0029]

DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS Next, an embodiment of a liquid crystal device and a method for manufacturing the same according to the present invention will be described in detail with reference to the accompanying drawings.

[First Embodiment] FIG. 1 is a schematic process explanatory view schematically showing a method of manufacturing a liquid crystal device according to a first embodiment of the present invention. As shown in FIG. 1A, mother substrates 110 and 120 made of glass are bonded with a sealant 13 to form a large-sized panel 100. On the inner surfaces of mother substrates 110 and 120 constituting large format panel 100, a conductor pattern in which electrodes and wiring (not shown) are formed in a predetermined pattern shape is formed. Mother board 1
On portions 10 and 120, portions to be substrates 11 and portions to be substrates 12 are alternately arranged, and the conductor pattern is formed for each of the portions. The mother board 110 and the mother board 120 are a part to be the board 11 in one mother board and a board 12 in the other mother board.
Are bonded to each other so as to face each other.

In the large format panel 100, the mother substrate 1
10, scribe grooves 110a and 110b are formed.
b is formed. These scribe grooves are formed by the scribe device 20 shown in FIG.

The scribing device 20 includes a rotatable base 21, a linear motion mechanism 22 disposed above the base 21, and a scribing device configured to be movable left and right in the drawing by the linear motion mechanism 22. And a head 23. The scribe head 23 is provided with a scribe cutter 25 having a rotary blade shape and rotatably mounted. The lowermost position of the scribe cutter 25 is limited to a predetermined height, and a predetermined pressure is constantly applied downward.

The large-sized panel 100 is placed on the base 21 and fixed by an appropriate method such as vacuum suction. Then, the scribe head 23 starts to move from the left end in the figure to the right side in the figure, for example, by the linear motion mechanism 22, whereby the scribe cutter 25 moves the large format panel 1 on the base 21.
00, and moves to the right end in the figure while forming scribe grooves on the outer surface of the mother substrate on the upper side of the large format panel 100.

FIG. 4 is an enlarged view of the scribed state. The scribe cutter 25 has an indentation amount Da due to a mechanical structure in the scribe head 23.
And a pressing pressure Fa. That is, the lowest position of the cutting edge 25a of the scribe cutter 25 is
The scribe cutter 25 is configured to be able to be lowered to a position below the upper surface position of the upper substrate of the large format panel 100 fixed thereon by a pushing amount Da, and the scribe cutter 25 is always pushed down by the pushing pressure Fa. Therefore, the scribe cutter 25 collides with the corner of the large-format panel 10 in a state where the lowermost position is lower than the upper surface of the substrate of the large-format panel 10 by the indentation amount Da, and rides on the upper surface of the substrate of the large-format panel 100 as it is. Large format panel 10
0 while forming a scribe groove on the upper surface.
The indentation amount Da is a margin for preventing the scribe cutter 25 from separating from the upper surface of the substrate due to the curvature of the large-size panel or the like during the scribe processing. The indentation pressure Fa is determined by the cutting edge 25a of the scribe cutter 25. This is a processing pressure for forming a scribe groove having a predetermined groove depth Ds on the substrate surface of the large format panel 100.

The scribe device 20 is used to scribe grooves 110 on one substrate 110 of the large format panel 100.
a, 110b are formed, and then the large format panel 100 is turned over and the scribe grooves 120a,
120b is formed. Thereafter, the substrates 110 and 120 are divided using the laser cutting device 30 shown in FIG.

As shown in FIG. 5, the laser cutting device 30
Is a pair of laser oscillators 31 and 32, irradiation optical systems 33 and 34 for guiding laser light emitted from the laser oscillators 31 and 32 to a processing target, and condensing the laser light, and holding for holding the processing target. A plate 35, a support 36 supporting the holding plate 35, a driving mechanism 37 for driving the support 36 to adjust the position and orientation of the processing target, the laser oscillators 31 and 32, the irradiation optical system 33, 34, and a control unit 38 for controlling the driving mechanism 37.

As the laser oscillators 31 and 32, CO ₂
Gas laser such as laser, solid-state laser such as YAG laser,
Alternatively, a semiconductor laser or other various laser oscillators can be used, but in consideration of the light absorption characteristics of the object to be processed,
It is necessary to select an object having an oscillation wavelength in a band that can be effectively absorbed by the object to be processed. For example, when a glass material (silica glass) such as soda glass, borosilicate glass, and quartz glass, which is generally used as a substrate material of a liquid crystal panel, is to be processed, a CO ₂ laser can be used. The laser oscillators 31 and 32 are configured so that their oscillation output (optical power) can be controlled from the outside.

As the irradiation optical systems 33 and 34, there are usually those provided with a reflecting mirror and a condenser lens as shown in FIG.
An appropriate optical configuration can be designed according to the light guide path and the irradiation spot diameter. The irradiation optical systems 33 and 34
The light guide path and the irradiation spot diameter (light collection characteristics) can be controlled from the outside.

The holding plate 35 is configured so that the large-sized panel 100 can be placed (preferably fixed). Holding plate 3
5 is provided with, for example, an optical window 35a formed in a slit shape along the scribe groove 17 so that light can be emitted from the side opposite to the surface on which the large format panel 100 is placed or fixed (from below in the figure). ing. The optical window 35a may be an opening or may be made of a material that can transmit laser light. It is preferable that the holding plate 35 is configured so that the mounting posture can be changed depending on the size of the processing target and the position and direction of the scribe groove.
Further, it is preferable that the holding plate is attached to the support 36 so that a holding plate having a different shape can be exchanged.

The support 36 is connected to the holding plate 35 and is configured to be movable in the horizontal and vertical directions by a drive mechanism 37. The drive mechanism 37 for driving the support 36 is configured to move the support 36 in the horizontal and vertical directions.

The control unit 38 controls the laser oscillators 31 and 3
2, the light output path, the light guide path and the light collecting characteristics of the irradiation optical systems 33 and 34, and the presence / absence and position of the driving mechanism 37 can be adjusted. When the laser oscillators 31 and 32 are configured to be able to switch the oscillation wavelength, it is preferable that the control unit 38 is also configured to be able to switch the oscillation wavelength. Further, when scanning the irradiation spot of the laser beam on the panel, the irradiation energy amount (density) at a predetermined portion of the panel is proportional to the laser output and inversely proportional to the scanning speed of the irradiation spot. On the other hand, since the cleaving action of the substrate has a positive correlation with the irradiation energy amount (density) of the laser beam, in order to maintain the cleaving action in a good state, the laser output and the scanning speed of the irradiation spot are sent to the control unit 38. It is preferable that the irradiation energy amount (density) falls within a predetermined range.

In the present embodiment, by using the above-described laser cutting device 30, the mother substrate 110 and the mother substrate 120 on the front and back of the large format panel 100 can be simultaneously formed along the scribe grooves 110a, 120a formed respectively. Break. Similarly, the scribe grooves 110b, 12b
Both mother substrates are simultaneously broken along 0b.

In the case where the scribe line is formed as described above, the irradiation area of the substrate is heated by irradiating the laser beam, and the substrate expands to temporarily generate a compressive stress. As the temperature decreases, the substrate material shrinks, and a tensile stress is generated to separate the substrate material on both sides of the scribe line, whereby the substrate is cut along the scribe line. Therefore, by scanning the laser light along the scribe line,
Since a tensile stress is generated in a portion after the irradiation spot of the laser light has passed, the fracture along the scribe groove progresses slightly after the irradiation of the laser light.

Here, in order to promote the generation of the tensile stress, it is possible to perform cooling by blowing an air current at a position slightly behind the irradiation spot of the laser beam in the scanning direction.

In the case where the substrate is cut by a laser beam on the large format panel 100 and other liquid crystal panels,
As shown in FIG. 13, local stress occurs. For example,
As shown in FIG. 13A, a panel 50 in which two substrates 51 and 52 are bonded together with a sealing material 53 is considered. In this case, scribe grooves or cracks 5
When forming a 1a and irradiating a laser beam near the scribe groove or crack 51a, the compressive stress and the tensile stress are generated around the scribe groove or crack 51a,
For example, tensile stress tends to separate scribe grooves or cracks 51a. This stress causes the substrate 51 to break, but in the panel 50, since the other substrate 52 exists via the sealing material 53, the stress is transmitted to the substrate 52 via the sealing material 53 and , Substrate 5
The breaking action at 1 is prevented by the sealing material 53 and the substrate 52.

Therefore, as shown in FIG.
As compared with the case where only one substrate 51 is laser-cut, the substrate 51 constituting the panel 50 as shown in FIG.
Laser cutting is generally difficult. For example, 0.4m
When a single substrate 51 shown in FIG. 13B is irradiated with a laser beam using a substrate having a thickness of 0.7 mm and a thickness of 0.7 mm, the substrate is satisfactorily cleaved regardless of the substrate thickness. The substrate 5 constituting the panel 50 shown in FIG.
Irradiation of the laser light with respect to No. 1 made it impossible to cut when the thickness was 0.7 mm, and in some cases, it was impossible to cut even when the thickness was 0.4 mm. Further, as shown in FIG. 13D, when a scribe groove 52a is also formed on the outer surface of the substrate 52 facing the substrate 51, the substrate can be cut with a 0.4 mm thickness, but can be cut with a 0.7 mm thickness. In some cases, the substrate could not be cut. Also, as shown in FIG.
With the substrate 52 broken at the fracture surface 52b,
By irradiating the laser light to No. 1, the cleaving could be performed favorably at any thickness.

As described above, when the laser cutting is performed on one substrate of the panel, the cutting operation is prevented by the other substrate via the sealing material. It is preferable to irradiate laser beams simultaneously from both the front and back sides to perform cutting, in order to prevent cutting failure. In this case, the effect of the stress of the other substrate can be reduced, so that there is an effect that a good fracture surface can be obtained.

When laser cutting is performed in the situation shown in FIG. 13A, the substrate 5 is heated by laser light.
Panel 50 may be distorted by both the compressive stress generated in 1 and the tensile stress generated by cooling. On the other hand, by adopting the method of simultaneously irradiating the laser beams to the substrates on both sides as in the present embodiment, the substrates on both sides expand or contract at the same time, so that the effect of reducing the distortion generated in the panel can be reduced. is there.

In the present embodiment, as described above, FIG.
A laser beam is simultaneously applied to the scribe grooves 110a and 120a shown in FIG.
By scanning the irradiation spot of the laser light along, the mother substrates 110 and 120 are broken along the scribe grooves 110a and 120a. At this time, the scribe grooves 110a and 120a are formed with the outer edge of the sealing material 13 (the edge opposite to the liquid crystal sealing region A, that is, the region where the liquid crystal is sealed by the sealing material 13 or the region where the liquid crystal is to be sealed). By performing the above-mentioned laser cutting along this scribe groove,
The fracture surface 12a is formed on the outer edge of the sealing material 13.

Also, by dividing the mother substrates 110 and 120 along the scribe grooves 110b and 120b by the laser cutting, the liquid crystal panel 10 having the substrates 11 and 12 is formed. The division of the substrate by laser cutting is caused by internal stress generated due to local expansion and contraction of the substrate material, and it is necessary to apply external stress to the sealing material 13 disposed immediately below the division. Therefore, the deformation of the sealing material 13 and the deterioration of the adhesion between the sealing material 13 and the substrates 11 and 12 hardly occur.

In dividing the substrate by the conventional scribe-break method, an external stress is applied along the scribe groove.
External stress is dispersed by the sealing material 13 and the sealing material 1
In the case where the scribe groove is formed on 3, there is a possibility that the position of the fracture surface is shifted so as to avoid over the seal material 13. However, in the present embodiment, since the internal stress can be generated regardless of the presence or absence of the sealing material 13 by the laser cutting, the substrate can be reliably broken starting from the scribe groove by the internal stress. Therefore, even if the scribe groove is formed on the sealing material 13 or the sealing material 1
Even if the scribe groove is formed in the vicinity of 3, the substrate can be broken along the scribe groove regardless of the position of the sealing material 13. In particular, when the scribe groove is located immediately above the seal material 13, the substrate can be divided accurately without causing breakage failure, which is very effective.

FIG. 2 is an enlarged partial cross-sectional view showing the structure near the fractured surface formed by the scribe groove 120a in an enlarged manner. A fracture surface formed by laser cutting from the scribe groove 120a, that is, the end surface 1 of the substrate 12
2a is formed so as to fall within a range of a width W1 inside (toward the liquid crystal enclosing area A side) and a distance of W2 outside on the basis of the outer edge of the sealing material 13. Here, both W1 and W2 are preferably 100 μm. Generally, sealing material 1
Numeral 3 is arranged on the mother board by screen printing or coating with a precision dispenser, etc., but the arrangement accuracy is relatively low.
Because the reproducibility of the spread of the seal material 13 is low, the outer edge position of the seal material 13 varies within a range of about ± 100 μm.
Therefore, when the position of the scribe groove 120a is set in advance with respect to the predetermined reference position of the panel body in the manufacturing process, the scribe groove 120a is made to coincide with the expected position of the outer edge of the sealing material 13, and as a result, The scribe groove may be set within the range of the widths W1 and W2.

When the end face 12a is formed at a position exceeding the width W1 = 100 μm, the distance from the outer edge of the sealing material 13 to the end face 12a of the substrate increases, and liquid crystal or the like remains in the outer inter-substrate region. The risk of corrosion and erosion increases. In particular, in order to reliably reduce the occurrence of corrosion and erosion, it is desirable to set the above W1 = 60 μm.

On the other hand, if the end face 12a is formed at a position exceeding W2 = 100 μm, a part of the sealing material 13 is cut off while separating the substrate to be separated (the substrate on the left side of the scribe groove 120a in the drawing). There is a problem that the possibility increases, the probability of occurrence of sealing failure increases, or a part of the sealing material 13 remains attached to the edge of the substrate to be separated, which may hinder the subsequent manufacturing process. A point occurs.

In this embodiment, as shown by the dotted line in the figure,
Even if the scribe groove 120a is formed above the sealing material 13, the substrate can be divided without any problem by using the laser cutting as described above.

FIG. 6 is a partial plan view showing how the large format substrate 100 of the above embodiment is divided. FIG. 6 (a)
In a rectangular large-sized substrate 100 (liquid crystal enclosing area A, that is, a plurality of liquid crystal panel portions arranged in the left and right directions in the figure), scribe grooves 11 are formed between the liquid crystal panel portions.
By forming laser beams 0a and 120a and scanning the irradiation spot of the laser beam along the arrows shown in the figure, the substrate is broken along the scribe grooves 110a and 120a, and each liquid crystal panel is divided.

FIG. 6B shows a large-sized substrate 10 similar to the above.
0, scratches 110c and 120c are formed at the end of the substrate instead of the scribe grooves 110a and 120a,
A method of starting to irradiate a laser beam from the scars 110c and 120c and scanning an irradiation spot along an arrow in the drawing to break the substrate is shown. According to this method, the substrate can be divided without any trouble.

In this method, it is not necessary to form scribe grooves over the entire length of the planned dividing line, so that the occurrence of microcracks can be reduced and the panel strength can be increased.

FIG. 6C shows a large-sized substrate 1 similar to the above.
At 00, the scars 110c,
A method of forming scars 110d and 120d on the other end of the substrate in addition to forming the scratches 110d will be described. In this method, scars 110c,
The irradiation of the laser beam is started from the portion 120c, and the irradiation spot is scanned to the scars 110d and 120d formed on the other substrate edge.

Normally, in laser cutting, the breaking direction becomes unstable in the vicinity of the scanning start position and the scanning end position at both ends of the substrate, and the deviation of the fractured surface from the planned dividing line is likely to occur. Therefore, as shown in FIG. 6 (c), by forming scars at both ends of the substrate, a stable and smooth fracture surface can be obtained, and the amount of microcracks can be reduced, so that the panel strength can be reduced. Can be improved.

Instead of forming scribe grooves extending over the entire length of the planned dividing line as in the above embodiment, FIG.
As shown in (b) and (c), when a scar is formed only at the edge of the substrate, the length of the scar is 2 to 15
mm, particularly 3 to 10 m
It is desirable to be within the range of m. If the scar is longer than this range, the degree of improvement in the effect of guiding the fractured surface is diminished, and the formation of the scar increases the microcracks and decreases the panel strength. If the scar is shorter than this range, the effect of guiding the fractured surface is insufficient, and the positional accuracy of the fractured surface is reduced.

[Second Embodiment] FIG. 7 shows a substrate dividing process according to a second embodiment of the present invention. In this embodiment, a large-sized panel 150 is formed by laminating two mother substrates with a sealing material 153, and a sealing portion 153a between a plurality of liquid crystal sealing regions A adjacent in the longitudinal direction.
Are integrally formed with the liquid crystal enclosing areas A on both sides to form a common seal portion. In the large format panel 150, wiring (not shown) is drawn out from the liquid crystal sealing area A to the upper end in the drawing, and input terminals are formed.

In this embodiment, as shown in FIG. 7A, scribe grooves 151a (152a) similar to the above are formed so as to divide substantially the center in the width direction of the seal portion 153, and these scribe grooves are formed. By performing the same laser beam scanning along the lines 151a and 152a, the adjacent liquid crystal panel regions are divided as shown in FIG. 7B. In this embodiment, since the divided portion by the laser cutting is always located immediately above the seal portion 153, it is difficult to obtain a stable fractured surface by the conventional scribe-break method. Thus, the break can be performed with little influence on the seal portion 153.

In FIG. 7C, the scribe grooves of the embodiment shown in FIG. 7A and FIG.
FIG. 7D shows a case in which scratches 151b and 152b are formed on the edge of the substrate in the same manner as in FIG. 6B. FIG. 7D shows scratches 151c and 152c in the edge of the substrate on the opposite side as in FIG. Is shown. As described above, even when there is a planned division line immediately above the seal portion 153a, the substrate can be divided without any trouble simply by providing a scar on the substrate end as described above.

[Details of scribe processing]

In each of the above embodiments, the groove depth Ds of the scribe groove formed by the above scribe processing is:
It is much smaller than the conventional method of applying a so-called scribe-break method for applying a mechanical stress.

FIG. 8 shows the scribe groove depth required when performing a conventional scribe-break method on a glass substrate, and the scribe width required when performing the scribe-laser cutting according to the present embodiment. It is a graph which shows the groove depth of a groove. The vertical axis is the groove depth Ds of the scribe groove.
[Μm], and the horizontal axis is the substrate thickness t [mm]. In the conventional scribe-break method, unless the groove depth Ds of the scribe groove is equal to or greater than the value on the dotted line A shown in FIG. Therefore, when a glass substrate of a liquid crystal panel is divided by a conventional scribe-break method, a groove depth Ds of about 80 to 120 μm and a 0.7 mm When adopted, the thickness was about 120 to 180 μm.

However, if the groove depth Ds of the scribe groove is increased in this manner, the number of micro cracks generated when the scribe groove is formed increases and increases, and the panel strength decreases. From the viewpoint of reducing the decrease in panel strength, it is necessary to suppress the groove depth Ds to a value equal to or less than the value on the dashed line C shown in FIG.

If the scribe groove is formed deep, the substrate may be undesirably broken after the scribe and before the break. In this case, the fracture surface may be shifted from the planned dividing line due to the influence of the sealing material. There are many. In order to prevent such a substrate crack beforehand, it is necessary to suppress the groove depth Ds to a value equal to or less than the value on the solid line B (Ds = (200/3) t + 70/3) shown in FIG. If the groove depth is less than the solid line B, undesired substrate cracking hardly occurs.

According to the laser cutting of this embodiment, even if the groove depth Ds is equal to or less than the solid line B in FIG. 8, the cutting can be performed without any problem as long as the scribe groove exists. Further, if the substrate thickness t is a substrate for a liquid crystal panel having a thickness of about 0.2 to 1.2 mm, regardless of the substrate thickness t, if the groove depth Ds is about 50 μm or less, the panel strength may decrease or the process may be interrupted. Substrate cracks can be substantially avoided. Although there is no lower limit of the groove depth Ds from this viewpoint, in order to stably form the scribe groove during the scribe processing, the groove depth Ds is required.
s is preferably 5 μm or more, and particularly preferably 10 μm or more.

FIG. 9 is a plan view (a) of a panel body 250 for explaining still another scribing method of the present invention.
And (b). In this scribing method, as shown in FIG. 9A, of the substrates 251 and 252 constituting the panel body 250, scribe grooves 252a extending in the left-right direction on the surface of the substrate 52 are formed in the same manner as in the above embodiment. Formed by a method. However, the scribe groove 252a is
A groove depth of 50 μm or (200
/ 3) t + 70/3) (t is the thickness of the substrate), preferably a deep groove 252a1 formed to exceed 80 μm.
And the groove depth is 50 μm or (200/3) t + 70
/ 3) (t is a substrate thickness) and is different from the above-described embodiment in that it has a shallow groove 252a2 formed so as to be equal to or less than (t is the substrate thickness). Deep groove portion 252a1 and shallow groove portion 252a2
When the scribe groove 252a is carved using the scribe device of the embodiment shown in FIGS. 3 and 4,
It is formed by changing the indentation pressure Fa on the way. The groove depth increases as the indentation pressure Fa increases, and the groove depth decreases as the indentation pressure Fa decreases.

Deep groove portion 252a1 of scribe groove 252a
Are formed at both ends of the scribe groove 252a (portions formed at left and right ends of the substrate 252 in the drawing). In addition, the shallow groove portion 252a2 is
2 except for both ends.

In this scribing method, since the deep groove 252a1 is formed at the end of the substrate, especially when laser cutting is performed, the cutting position is the deep groove 252a1.
, The dividing position of the substrate can be obtained with high accuracy. In particular, as shown in the figure, when the scribe groove 252a is formed on the sealing material 253 to which the substrates 251 and 252 are attached,
The fact that the position of the fractured surface of the substrate 52 deviates from the planned dividing line due to the presence of the sealing material 253 immediately below is determined by the deep groove 252a1.
Can be prevented.

Further, since only a part of the scribe groove is provided with a deep groove only in a part of the scribe groove, the generation amount of micro cracks accompanying the scribe can be reduced as a whole. A decrease in substrate strength can be suppressed.

When the substrate is divided using laser cutting, the breaking position tends to deviate from the dividing line at the part where the scanning of the laser beam starts and the part where the scanning ends (ie, both ends of the substrate). is there. This is because the temperature distribution and the traveling direction of the heating region generated by the irradiation of the laser beam become unstable at the start of scanning and at the end of scanning. However, in the above-described scribing method, the deep groove 52 is formed at the end of the substrate, particularly at both ends of the substrate.
Since the a1 is formed, the breaking position is determined by the scribe groove in the relevant portion, so that a shift of the breaking position from the planned dividing line can be prevented, and the substrate can be accurately divided.

In the example shown in FIG. 9B, in the panel body 250 similar to the above, scratches 252b, 252c, 252d are formed on the surface of the substrate 252 along the same predetermined dividing line. The scars 252b and 252c are formed at both ends in the horizontal direction in the drawing of the substrate 252 on the dividing line. The scar 252d is located in a region between the scratches 252b and 252c, for example, in the illustrated example at the center on the dividing line.
Are formed in a state of being separated from. Here, scar 2
52b and 252c have a groove depth of 50 μm or (20
0/3) t + 70/3) (t is the thickness of the substrate), preferably more than 80 μm. The scar 252d has a groove depth of 50 μm or (200 /
3) t + 70/3) (t is the thickness of the substrate) or less.

Also in this example, the substrate 252 can be divided with high accuracy even at a position immediately above the sealing material 253, as described above. Further, since the amount of generation of microcracks can be further reduced, the strength of the substrate after division can be further improved.

[Structure of Liquid Crystal Panel] FIGS. 10 and 11
1 shows a schematic structure of the liquid crystal panel 10 of the first embodiment formed as described above. LCD panel 10
In the first embodiment, substrates 11 and 12 are bonded together with a sealing material 13, and a liquid crystal 14 is sealed between the substrates 11 and 12 inside the sealing material 13. Here, the liquid crystal injection port 1
3a is closed by a sealing material 15.

A transparent electrode 16 and an alignment film 17 are formed on the inner surface of the substrate 11, and the transparent electrode 16 is a wiring extending out of the sealing material 13 and extending to the substrate overhang portion 11a. In addition, a transparent electrode 18 and an alignment film 19 are formed on the inner surface of the substrate 12, and the transparent electrode 18 is constituted by a vertically conductive portion (not shown) (for example, a part of the sealing material 13 formed as an anisotropic conductor). .) Is connected to the wiring on the substrate overhang portion 11a.

A semiconductor chip 40 constituting a liquid crystal drive circuit is mounted on the surface of the substrate overhang 11a. The semiconductor chip 40 is in a state of being electrically connected to the wiring on the substrate overhang 11a that is electrically connected to the transparent electrodes 16 and 18 and the input terminal 41 formed at the end of the substrate overhang 11a. I have. In the process after the liquid crystal panel 10 is formed, processing such as conductive connection of the flexible wiring board to the input terminal 41 and sealing of the surface of the board overhang portion 11a with a sealing agent such as silicone resin are performed. Is performed.

[Properties of fracture surface by laser cutting]
The properties of the end face 12a, which is a fractured surface cut by the laser beam as described above, will be described. As shown in FIG. 12A, the end surface 12a formed by the laser cutting in each of the above embodiments has a rib mark 12a-1, which is a trace of the scribe groove, near the ridge line with the substrate surface. It is composed of a flat surface 12a-2 formed extremely smoothly in a portion other than the rib mark 12a-1. The rib mark 12a-1 is provided on the cutting edge 2 of the scribe cutter 25 of the scribe device 20.
5a, a large number of fine steps are formed along the ridgeline. On the other hand, the flat surface 12a
-2 is a very smooth plane without any step even when observed at a magnification of about 50 to 100 times.

FIG. 12 (b) shows the nature of the end face 12a 'in the case where a scar formed only at the end of the substrate is formed instead of the scribe groove and the substrate is broken from the scar by laser cutting. Show. In this case as well, a large number of fine steps are formed in the rib mark 12a-3 which is a trace of a scar, whereas the flat surface 12 other than the rib mark is formed.
a-4 has no step at all even when observed at a magnification of about 50 to 100 times, and is formed on an extremely smooth plane.

An end face 1 formed by a conventional scribe-break method is formed on the end faces 12a and 12a '.
Fig. 12 (c) shows the properties of 2 ". The rib mark 12a-
Numeral 1 is the same as that shown in FIG. 12A, and is a trace of the scribe groove. A portion other than the rib mark 12a-1 on the end face 12a ″ is a fractured surface 12a on which fine steps, that is, many chippings are formed due to external stress.
−5. The figure is schematic and has a different appearance depending on the individual fracture surface, but is clearly different from the fracture surface due to laser cutting.

In each of the embodiments of the present invention, in the substrate dividing method using laser cutting, the flat surface 1 shown in FIGS.
As shown in FIGS. 2a-2 and 12a-4, smooth fracture surfaces without chipping were obtained, and these were clearly apparent in FIG.
The conventional scribing device shown in FIG.
It can be distinguished from a fractured surface formed by the break method. This is because the cutting method in each embodiment is based on internal stress generated by local expansion and contraction of the substrate material, and the internal stress acts intensively on the scar formed on the substrate or the bottom end of the scribe groove. It is thought that it is because. With the method of mechanically applying external stress, it is extremely difficult to concentrate stress on a scar or a specific portion of a scribe groove.

The liquid crystal device and the method of manufacturing the same according to the present invention are not limited to the above-described examples, but various modifications can be made without departing from the scope of the present invention.

For example, the liquid crystal panel constituting the liquid crystal device is not limited to the above-mentioned multi-cavity liquid crystal panel, but may be a method of dividing the substrate simply to locally remove the edge of the substrate. It is also possible to apply to a liquid crystal panel formed by using.

Further, the scribing method is not limited to the above-mentioned method, and various scribing methods such as rubbing abrasive grains or pins can be used.

Further, the breaking method is not limited to the laser cutting described above, but any method may be used as long as it can generate internal stress due to local expansion and contraction of the substrate material. Thermal contact with a heat source for locally performing irradiation, rapid heating or cooling may be used.

[0089]

As described above, according to the present invention,
Corrosion and erosion caused by liquid crystal and the like remaining in a region between the outer edge of the sealing material and the end face of the substrate can be reduced. Further, by using the internal stress generated by local expansion and contraction of the substrate material, the substrate can be divided accurately and without difficulty even in the vicinity of the sealing material.

[Brief description of the drawings]

FIG. 1 is a first view of a liquid crystal device and a method of manufacturing the same according to the present invention.
It is process sectional drawing (a) and (b) which show the board | substrate division aspect of embodiment.

FIG. 2 is an enlarged cross-sectional view of the vicinity of a substrate division part in the first embodiment.

FIG. 3 is a schematic configuration diagram showing an overall configuration of a scribe device for forming a scribe groove on a substrate surface.

FIG. 4 is an enlarged cross-sectional view showing a state in which scribe processing is performed by the apparatus shown in FIG. 3;

FIG. 5 is a schematic configuration diagram showing an overall configuration of a laser cutting device used in the embodiment.

FIG. 6A is a partial plan view illustrating a substrate dividing method according to the embodiment, and FIG. 6B is a partial plan view illustrating a different substrate dividing method.
And (c).

FIGS. 7A and 7B are partial plan views (a) and (b) showing a substrate dividing method according to a second embodiment of the present invention, and partial plan views (c) and (d) showing different substrate dividing methods.

FIG. 8 is a graph for explaining a relationship between a substrate thickness t and a groove depth Ds of a scribe groove, a substrate crack, a break failure, and the like.

FIGS. 9A and 9B are partial plan views (a) and (b) of the panel body 250 for explaining different scribing methods (scratch forming methods).

FIG. 10 is a perspective plan view of a liquid crystal panel formed according to the first embodiment.

FIG. 11 is a schematic sectional view of a liquid crystal panel formed according to the first embodiment.

FIGS. 12A and 12B are end views schematically showing an end face shape of a substrate divided according to an embodiment of the present invention, and end views schematically showing an end face shape of a substrate divided by a conventional method. (C).

13A to 13E are diagrams illustrating a case where a panel is divided by laser cutting.

FIG. 14 is a schematic longitudinal sectional view (a) and an enlarged partial plan view (b) showing a schematic structure of a conventional liquid crystal panel.

[Explanation of symbols]

DESCRIPTION OF SYMBOLS 10 Liquid crystal panel 11, 12, 251, 252 Substrate 11a Substrate overhang 12a End surface 12a-1, 12a-3 Rib mark 12a-2, 12a-4 Flat surface 13 Sealing material 14 Liquid crystal 20 Scribe device 30 Laser cutting device 100 Large format panel 110, 120 Mother substrate 110a, 120a, 110b, 120b, 252a
Scribe grooves 110c, 120c, 110d, 120d, 252b,
252c, 252d Scar 250 Panel body 252a1 Deep groove 252a2 Shallow groove

Claims (19)

[Claims] 1. A liquid crystal device comprising two substrates bonded together via a sealing material and a liquid crystal sealed between the substrates inside the sealing material, wherein at least a part of an end surface of an outer periphery of the substrate is provided. Is formed in a range of 100 μm or less on the sealing material or outside from the outer edge of the sealing material. 2. The liquid crystal device according to claim 1, wherein the end face is formed within a range of 60 μm outside the outer edge of the sealing material. 3. The liquid crystal device according to claim 1, wherein the end face is disposed on the sealing material. 4. A substrate overhang provided on one of the two substrates over an outer edge of an outer edge of the other substrate, and the seal is provided on a surface of the substrate overhang. The wiring is drawn out of a material, and the end surface is provided at an outer end portion of the other substrate facing the substrate overhanging portion. A liquid crystal device according to the item. 5. The liquid crystal device according to claim 1, wherein the end face has a fracture surface caused by internal stress caused by local expansion and contraction of the substrate material. . 6. The liquid crystal device according to claim 5, wherein a rib mark extending along a ridge line between the end surface and the substrate surface is formed on the end face. 7. The liquid crystal device according to claim 5, wherein a rib mark is formed near a corner of the end face. 8. A rib mark is formed on the end face along a ridge line between the end face and the substrate surface, wherein the rib mark is located between an end of the ridge and both ends of the ridge. The liquid crystal device according to claim 5, wherein the depth of the rib mark located at the end is different from the depth of at least one rib mark located between both ends of the ridge. 9. A method for manufacturing a liquid crystal device, comprising: bonding two substrates together via a sealing material; and sealing a liquid crystal between the substrates inside the sealing material. A method for manufacturing a liquid crystal device, the method further comprising the step of: breaking a portion of at least one of the substrates, which is located within 100 μm on the sealing material or outside from the outer edge of the sealing material. 10. The method for manufacturing a liquid crystal device according to claim 9, wherein the portion is a portion within a range of 60 μm outside the outer edge of the sealing material. 11. The method according to claim 9, wherein the part is a part disposed on the seal material. 12. The method according to claim 9, wherein the part is irradiated with light, and the part is broken by an internal stress generated by local expansion and contraction of the substrate material due to the irradiation of the light. A method for manufacturing the liquid crystal device according to claim 1. 13. A method of manufacturing a liquid crystal device, comprising: bonding two substrates together via a sealing material; and sealing a liquid crystal between the substrates inside the sealing material. Irradiate light to the part of
A method for manufacturing a liquid crystal device, comprising a step of breaking the portion by internal stress generated by local expansion and contraction of a substrate material due to the light irradiation. 14. The method according to claim 1, further comprising irradiating the portion of one substrate with light and simultaneously irradiating the other substrate with light to divide the two substrates simultaneously. A method for manufacturing a liquid crystal device according to claim 12. 15. The substrate according to claim 12, wherein a scar is formed along a predetermined dividing line passing through the part, and the substrate is broken from the scar. Of manufacturing a liquid crystal device. 16. The method according to claim 15, wherein the scar is formed as a scribe groove extending along the predetermined dividing line. 17. The method according to claim 15, wherein the scar is partially formed at an end of the substrate on the division line. 18. The scar is located between an end of the planned dividing line and both ends of the planned dividing line on the substrate, and a depth of the scar located at the end is determined by the dividing. The method according to claim 15, wherein the depth of the at least one scar located between both ends of the predetermined line is different. 19. The method of manufacturing a liquid crystal device according to claim 17, wherein the scar is partially formed on both ends of the substrate on the predetermined dividing line.