JP2002181879A - Estimation test apparatus for semiconductor device - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide an estimation test apparatus for a semiconductor device capable of executing an accurate estimation test in a short time by automating a series of processes from a baking process for the device to weight measurement. SOLUTION: This test apparatus has a constant temperature/constant humidity processing part 1 executing a hygroscopic process for the semiconductor device; a weight measurement part 2 measuring weight of the semiconductor device; a carrying and processing part 3 disposed between them, carrying the moisture-absorbed semiconductor device in the constant temperature/constant humidity processing part 1 to the weight measurement part 2, and carrying the weight-measured semiconductor device in the weight measurement part 2 to the constant temperature/constant humidity processing part 1; and a control unit 4 executing the control and finding hygroscopic data from the weight- measured semiconductor device.

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

The present invention relates to an evaluation test apparatus for performing a durability test of a semiconductor device. In particular, the present invention relates to an evaluation test apparatus for performing baking and constant temperature / humidity treatment performed during pretreatment of a solder heat resistance test.

[0002]

2. Description of the Related Art The most problematic in a surface mount type plastic device is cracking and peeling due to rapid thermal stress during reflow. The cracking and peeling are considerably affected by the amount of moisture absorbed by the device itself. That is, the moisture that has entered the device evaporates and expands due to thermal stress during mounting (reflow), thereby causing cracks and peeling. The rate of occurrence varies depending on the amount of moisture absorption. The amount of moisture absorption is affected by the shape of the device and the conditions of moisture absorption (temperature, humidity, time), the amount of saturated moisture absorption depends on relative humidity, and the diffusion rate of moisture depends on temperature. Therefore, a heat resistance test is usually performed in advance in order to prevent troubles in the market. In the heat resistance test, the device is subjected to moisture absorption under predetermined moisture absorption conditions, and is evaluated by reflow.

In performing the above evaluation, the moisture absorption rate is an important evaluation parameter. Therefore, conventionally, the following method has been employed to measure the moisture absorption rate.

[0004] (a) The moisture in the device is discharged by an oven, and then the moisture is absorbed for a certain period of time by another constant temperature and humidity device, which is then taken out.

(B) Thereafter, the weight of the device is measured by a separately provided weight measuring device (electronic balance), and the device is again put into a constant temperature and humidity apparatus.

(C) The above process is repeated 10 to 20 times to derive the moisture absorption profile of the target device.

[0007]

However, since the above-described devices are all manually operated, it takes a long time to perform an evaluation, and it is not possible to obtain an accurate evaluation result. is there.

Accordingly, an object of the present invention is to provide a semiconductor device evaluation test apparatus which can automate a series of processes from a baking process to a weight measurement of a device and can perform an accurate evaluation test in a short time. I do.

[0009]

SUMMARY OF THE INVENTION The present invention is configured as follows to solve the above-mentioned problems.

(1) A constant-temperature and constant-humidity processing unit for performing a moisture absorption process on a semiconductor device, a weight measuring unit for measuring the weight of the semiconductor device, and a semiconductor device absorbed by the constant-temperature and constant-humidity processing unit are transported to the weight measurement unit. A transport processing unit that transports the semiconductor device weighed by the weight measurement unit to the constant temperature and humidity processing unit, and obtains moisture absorption data from the weight of the weighed semiconductor device, and also obtains the constant temperature and constant moisture absorption processing unit, the weight measurement unit, And a control unit for controlling the transport processing unit.

In the evaluation test apparatus of the present invention, the semiconductor device is automatically transported between the constant temperature and humidity processing section and the weight measuring section by the transport processing section. These controls are automatically performed according to a schedule predetermined by the control unit.

[0012] By such automation, the burden on the operator involved in the evaluation test can be greatly reduced, and the result of the evaluation test can be made accurate because no misreading of data, omission of entry, or entry error does not occur. Can be.

(2) The constant temperature / humidity processing section is hermetically sealed and provided with a first automatic opening / closing door which is automatically opened / closed by the control section with the transport processing section.

In the evaluation test apparatus of the present invention, the constant temperature / humidity processing section is usually closed, and the first automatic opening / closing door is opened and closed only when the semiconductor device is taken out. Can be brought into a desired state, and is not affected by the outside air. Thereby, the accuracy of the evaluation test can be improved.

(3) The weight measuring section is hermetically sealed, and a second automatic opening / closing door which is automatically opened / closed by the control section is provided between the weight measuring section and the transport processing section.

According to the present invention, the accuracy of the evaluation test can be improved for the same reason as the above (2).

(4) The transfer processing unit includes an arm for holding a semiconductor device which enters and exits the constant temperature / humidity processing unit and the weight measuring unit via the first and second automatic opening / closing doors. An XY stage that moves the X and Y axes in the X and Y directions, and a θ stage that rotates the X direction in the θ direction.

The arm for holding the semiconductor device is XY
The semiconductor device can be moved between the constant temperature / humidity processing unit and the weight measuring unit regardless of the positions of the first and second automatic opening / closing doors by the straight movement in the direction and the rotation in the θ direction.

(5) The control unit is configured to detect a completely saturated state of the semiconductor device based on the moisture absorption data.
The semiconductor device is controlled so as to be repeatedly transported between the constant temperature / humidity processing unit and the weight measuring unit.

When a full saturation state of a semiconductor device is detected, it is not usually necessary to perform an evaluation test thereafter. Therefore, according to the present invention, when the full saturation state is detected, the operation of the evaluation test apparatus is automatically stopped. It becomes possible.
Therefore, there is no need for the operator to check the operation state of the device or to check the moisture absorption state of the device.

(6) The control section controls the semiconductor device to be repeatedly transported between the constant temperature and constant humidity processing section and the weight measurement section until a predetermined moisture absorption rate is detected based on the moisture absorption data.

According to the present invention, similarly to the above (5), the apparatus can be automatically stopped, and it is not necessary for the operator to check the operation state of the apparatus or the state of moisture absorption of the device.

(7) The control section outputs continuous moisture absorption data obtained by the repeated transport control.

In the present invention, since it is possible to obtain continuous moisture absorption data, it becomes possible to confirm the moisture absorption state of the device in detail.

(8) The constant temperature / humidity processing unit includes a plurality of semiconductor device mounting tables.

By providing a plurality of semiconductor device holders, it is possible to simultaneously measure the temperatures of these devices for a plurality of devices under the same moisture absorption conditions.

(9) The internal temperature and humidity of the weight measuring section and the transport processing section can be adjusted.

According to the present invention, since the internal temperature and humidity can be adjusted, the evaluation test can be performed without being affected by the outside air, and the result is accurate. Further, by providing the automatic opening / closing door as described in (2) and (3) above, it is possible to further improve the accuracy.

[0029]

FIG. 1 is a structural view of a semiconductor device evaluation test apparatus according to an embodiment of the present invention.

This apparatus comprises a constant temperature and humidity processing section 1, a weight measuring section 2, a transport processing section 3, a control unit 4, and an operation panel section 5.

The constant temperature / humidity processing unit 1 and the weight measuring unit 2
Each is connected to the left and right sides of the transport processing unit 3.

The constant-temperature and constant-humidity processing unit 1 includes a table 12 on which a net basket 11 in which semiconductor devices are placed is set. In the constant temperature / humidity processing section 1, baking processing, heating and humidification processing of the semiconductor device are performed. Also,
In the constant temperature / humidity processing unit 1, a first automatic opening / closing door 13 is provided at a connection portion with the transport processing unit 3. The first automatic opening / closing door 13 can be moved up and down, and by moving downward, the closed state of the constant temperature / humidity processing section 1 is released, and an arm described later passes through the window to carry the transfer processing. Part 3
Can be moved into the constant temperature / humidity processing section.

The weight measuring section 2 has an electronic balance 21 capable of measuring the weight in units of 0.1 mg. This weight measurement unit 2
Measures the weight of the semiconductor device (actually, the net basket 11 containing the device) heated and humidified by the constant temperature and humidity processing unit 1. The weight measuring unit 2 and the transport processing unit 3
A second automatic opening / closing door 22 is provided at the connecting portion with the second automatic opening / closing door 22. The second automatic opening / closing door 22 is movable in the vertical direction, and moves downward to release the sealed state of the weight measuring unit 2, and the arm is moved into the weight measuring unit 2 through the window. It can be moved.

The temperature and humidity of the constant temperature / humidity processing unit 1, the weight measuring unit 2, and the transport processing unit 3 can be adjusted by a device (not shown).

The transport processing unit 3 includes an X stage 31, a Y stage 32, a θ stage 33, and an air-driven Z stage 34.
And an arm 35 for holding the net basket 11. The X stage 31 and the Y stage 32 enable linear movement of the arm 35 in the X and Y directions.
Enables the arm 35 to rotate in the θ direction (180 ° rotation direction). The Z stage 34 allows the arm 35 to move up and down by an air cylinder. These controls are performed by the control unit 4.

With the above configuration, it becomes possible to take out the net basket 11 containing the semiconductor device subjected to the moisture absorption processing in the constant temperature and humidity processing section 1 by the arm 35 and move it to the weight measuring section 2. In order to hold the net basket 11 in the thermo-hygrostat processing unit 1 by the arm 35, the first automatic opening / closing door 13 is moved downward. In addition, net basket 1 which we took out
To move 1 to the weight measuring section 2, the second automatic opening / closing door 22 is moved downward. When the second automatic opening / closing door 22 is moved downward, the first automatic opening / closing door 13 is moved upward, and the constant temperature / humidity processing section 1 is again closed.

The control unit 4 controls the constant temperature / humidity processing section 1, the weight measurement section 2, and the transport processing section 3 based on the test information set on the operation panel section 5 and the weight information from the weight measurement section 2. . The constant temperature / humidity processing unit 1 is controlled based on temperature, humidity, and time information set in the operation panel unit 5 in advance. Depending on the settings, two or more stages of temperature and humidity control are possible. For example, 120 ° C
The baking process is performed only at the temperature setting of
Temperature and humidity control at 70 ° C and 70% enables constant temperature and humidity processing. Although not shown, temperature and humidity can be controlled also in the transport processing unit 3 and the weight measurement unit 2.

For the transport processing unit 3, the opening and closing operation of the first automatic opening and closing door 13 of the constant temperature and humidity processing unit 1 is controlled based on the processing end signal from the constant temperature and humidity processing unit 1. Movement control of the drive unit such as the stage 31 and the second
Of the automatic opening / closing door 22 is controlled. further,
The control for moving the net basket 11 set in the constant temperature and humidity processing section 1 to the weight measuring section 2 by the arm 35 is also performed.

The control unit 4 repeats the above operation, and when the semiconductor device is saturated and there is no change in the amount of absorbed moisture, when the amount of absorbed moisture reaches a preset amount of moisture absorption, or when the operation panel unit 5 When the specified moisture absorption period has elapsed, a series of operations of the apparatus is stopped.

The operation panel unit 5 has a display unit capable of monitoring the weight measurement result of the semiconductor device based on the weight measurement information from the control unit 4. The display unit is also used as a screen for inputting the amount of moisture absorption, since the operation of the apparatus is stopped when the target amount of moisture absorption is reached. Further, it has a function of transmitting an operation start signal and an operation stop signal for controlling the evaluation test device to the control unit 4.

Next, the operation of the semiconductor device evaluation test apparatus having the above configuration will be described with reference to FIGS. 2 to 9 are state diagrams of the evaluation test apparatus, FIG. 10 is a top view of the evaluation test apparatus, and FIG. 11 shows a moisture absorption profile. FIG. 13 is a flowchart showing the control operation.

(A) The semiconductor device to be subjected to the reflow soldering heat resistance test is placed in the net basket 11 and set on the table 12 of the constant temperature / humidity processing unit 1. As shown in FIG.
The table 12 has three notches 12a at regular intervals. At the position of each notch 12a, the mesh basket 11
Can be arranged. The arm 35 moves to the position of the notch 12a to be moved, and lifts it upward, thereby holding and moving the net basket 11 at the position of the notch 12a. As described above, when a plurality of net baskets 11 are arranged on one placing table 12, the semiconductor devices put in each net basket 11 are measured on the assumption that the moisture absorption conditions of temperature and humidity are the same. In the operation panel section 5, the baking process temperature, time, moisture absorption temperature, humidity, and period are input. Further, the weight measurement conditions (number of measurements, number of times, discharge time after moisture absorption, etc.) are also input.

(B) When an operation start instruction is given on the operation panel section 5 (step 1 (see FIG. 12: the same applies hereinafter)), the control unit 4 first
A baking process is performed under the conditions set by the operation panel unit 5 (step 2). When the conditions set in the baking process are completed, the initial weight after the baking process is measured (step 3). The initial weight is measured by transporting the net basket 11 to the weight measuring unit 2 by the transport processing unit 3 in the same manner as the weight measuring method described later. Details will be described later.

(C) The net basket 11 whose initial weight has been measured is returned to the constant temperature / humidity processing section 1 again, and performs heating and humidification processing under the conditions set on the operation panel 5. Moisture absorption is performed by this process (step 4). When the set conditions (moisture absorption temperature and moisture absorption time, etc.) are completed, the constant temperature and constant humidity processing section 1
Set the temperature inside to room temperature. When the temperature returns to the normal temperature, the constant temperature / humidity processing section 1 outputs a processing end signal to the control unit 4. FIG. 2 shows this state. The control unit 4 having received the processing end signal moves the automatic opening / closing door 13 of the constant temperature / humidity processing unit 1 downward to form a window. Thereafter, the drive unit in the transport processing unit 3 starts driving, and the arm 35
Control is performed so that the net basket 11 is transported to the weight measurement unit 2.
Specifically, the Y stage 32 is moved to move the arm 35 directly below the net basket 11 (see FIG. 3). Further, the net basket 11 is lifted by an ascending operation by an air cylinder (not shown) (see FIG. 4), the net basket 11 is taken out of the constant temperature / humidity processing section 1, moved, and the automatic opening / closing door 13 is closed (see FIG. 5). . After that, the mesh basket 11 is
The Y-stage 32 is rotated by 0 ° (see FIG. 6), and the Y-stage 32 is moved to open the automatic opening / closing door 22 of the weight measuring unit 2 and move the net basket 11 to the weight measuring unit 2. Electronic balance 2
When the arm 35 reaches just above (see FIG. 7), the arm 35 is lowered and the net basket 11 is placed on the electronic balance 21 (see FIG. 8). Subsequently, the arm 35 is pulled out of the weight measuring section 2 and the automatic opening / closing door 22 is closed (see FIG. 9; step 5).

(D) After a lapse of a predetermined time, the weight of the net basket 11 is measured by the weight measuring section 2, and the measured value is output to the control unit 4 (step 6). Since the weight of the net basket 11 is known, the weight measuring unit 2 substantially measures the weight of the semiconductor device.

(E) In step 7, when the control unit 4 detects a completely saturated state of the semiconductor device based on the moisture absorption data obtained, or when a predetermined amount of moisture absorption is detected based on the moisture absorption data, or When the predetermined period has elapsed, the process proceeds to step 8; otherwise, the transport process of step 11 is performed and the process returns to step 4 again.
In the transport process of step 11, the net basket 1 of the weight measurement unit 11 is
1 is transported to the constant temperature / humidity processing unit 1 again. During this repetitive processing, the display of the operation panel unit 5 displays
The result of continuous measurement is displayed. The result may be printed or stored in a printer or a recorder. FIG. 11 shows a moisture absorption profile. When the processing is completed in step 7, the operation panel unit 5 conveys the net basket 11 to a predetermined position (step 8), turns off an indicator light (not shown) for indicating that the processing is completed, Thereafter, the constant temperature / humidity processing operation is stopped (Steps 9 and 10).

With the above operation, the evaluation test of the semiconductor device can be performed fully automatically. As shown in FIG. 10, a plurality of net baskets 11 can be set on the table 12. Thus, a plurality of semiconductor devices can be tested and measured under the same conditions. In this embodiment, as shown in FIG.
Is provided, the arm 35 is lifted and the net basket 1 is lifted.
1, the arm 35 can be moved by sandwiching the net basket 11 by providing a gripping portion at the tip of the arm 35.

[0048]

According to the present invention, the pre-processing at the time of the reflow heat resistance evaluation can be carried out easily and quickly, and the burden on the operator can be reduced. Since omission of entry, entry error and the like can be eliminated, the reliability of the evaluation test can be improved.
In addition, by controlling the automatic opening / closing door, the constant temperature / humidity processing unit and the weight measuring unit can be shut off from the outside air, so that accurate condition setting and weight measurement can be performed. Furthermore, by enabling adjustment of the temperature and humidity of the weight measurement unit and the transport processing unit, the influence of the outside air can be further eliminated, leading to high reliability measurement.

[Brief description of the drawings]

FIG. 1 is a configuration diagram of a semiconductor device evaluation test apparatus according to an embodiment of the present invention.

FIG. 2 is a state diagram of the evaluation test apparatus.

FIG. 3 is a state diagram of the evaluation test apparatus.

FIG. 4 is a state diagram of the evaluation test apparatus.

FIG. 5 is a state diagram of the evaluation test apparatus.

FIG. 6 is a state diagram of the evaluation test apparatus.

FIG. 7 is a state diagram of the evaluation test apparatus.

FIG. 8 is a state diagram of the evaluation test apparatus.

FIG. 9 is a state diagram of the evaluation test apparatus.

FIG. 10 is a top view of a transport processing unit.

FIG. 11 shows a moisture absorption profile.

FIG. 12 is a flowchart showing the operation of the evaluation test apparatus.

[Explanation of symbols]

 1—Constant temperature / humidity processing unit 2—Weight measuring unit 3—Transportation processing unit 11—Network basket in which semiconductor devices are put

Claims (9)

[Claims] 1. A constant-temperature and constant-humidity processing unit for performing moisture absorption processing on a semiconductor device, a weight measuring unit for measuring the weight of the semiconductor device, and a semiconductor device that has absorbed moisture in the constant-temperature and constant-humidity processing unit is transferred to a weight measurement unit. A transport processing unit that transports the semiconductor device weighed by the measurement unit to the constant temperature and humidity processing unit, and obtains moisture absorption data from the weight of the semiconductor device whose weight has been measured. An evaluation test apparatus for a semiconductor device, comprising: a control unit configured to control a processing unit. 2. The constant temperature and humidity processing section is hermetically sealed, and a first automatic opening / closing door which is automatically opened and closed by the control section is provided between the processing section and the transport processing section.
An evaluation test apparatus for a semiconductor device as described in the above. 3. The semiconductor according to claim 1, wherein said weight measuring section is hermetically sealed, and a second automatic opening / closing door which is automatically opened / closed by said control section is provided between said weight measuring section and said transport processing section. Device evaluation test equipment. 4. The transport processing unit according to claim 1, wherein
An arm for holding a semiconductor device which enters and exits the constant temperature and humidity processing section and the weight measuring section via an automatic opening / closing door, and moves the arm in the X and Y directions.
4. The semiconductor device evaluation test apparatus according to claim 3, further comprising a Y stage and a θ stage that rotates in the θ direction. 5. The control section controls the semiconductor device to be repeatedly transported between a constant temperature and humidity processing section and a weight measurement section until a complete saturation state of the semiconductor device is detected based on the moisture absorption data. The semiconductor device evaluation test apparatus according to any one of claims 1 to 4. 6. The control section controls the semiconductor device to be repeatedly transported between a constant temperature and humidity processing section and a weight measurement section until a predetermined moisture absorption rate is detected based on the moisture absorption data. 5. The apparatus for evaluating and testing a semiconductor device according to claim 4. 7. The controller according to claim 5, wherein the controller outputs continuous moisture absorption data obtained by the repeated transport control.
Or the evaluation test apparatus for a semiconductor device according to 6. 8. The apparatus for evaluating and testing a semiconductor device according to claim 1, wherein said constant-temperature and constant-humidity processing unit includes a plurality of semiconductor device holders. 9. The weight measuring section and the transport processing section are capable of adjusting internal temperature and humidity.
An evaluation test apparatus for a semiconductor device according to any one of claims 1 to 8, Constant