JP2002171096A - Lead wire cutting device of electronic component - Google Patents
Lead wire cutting device of electronic componentInfo
- Publication number
- JP2002171096A JP2002171096A JP2000368085A JP2000368085A JP2002171096A JP 2002171096 A JP2002171096 A JP 2002171096A JP 2000368085 A JP2000368085 A JP 2000368085A JP 2000368085 A JP2000368085 A JP 2000368085A JP 2002171096 A JP2002171096 A JP 2002171096A
- Authority
- JP
- Japan
- Prior art keywords
- upper blade
- lead wire
- blade plate
- plate
- hole
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Landscapes
- Supply And Installment Of Electrical Components (AREA)
Abstract
Description
【0001】[0001]
【発明の属する技術分野】本発明は電子部品のリード線
切断装置に係り、特に、回路基板に貫通させた電子部品
のリード線を除去するリード線切断装置の改良に関す
る。BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a lead wire cutting device for an electronic component, and more particularly to an improvement of a lead wire cutting device for removing a lead wire of an electronic component penetrating a circuit board.
【0002】[0002]
【従来の技術】リード線を有する電子部品を装着した回
路基板を製造する場合、その回路基板の表面側から裏面
側へ突出するリード線をその裏面側で切断除去した後、
その裏面側にフラックスを塗布して溶融半田槽に浸け、
電子部品を回路パターンに半田付け接続するのが一般的
である。2. Description of the Related Art When manufacturing a circuit board on which electronic parts having lead wires are mounted, a lead wire projecting from the front side to the back side of the circuit board is cut and removed on the back side.
Apply flux to the back side and immerse it in the molten solder tank,
Generally, an electronic component is connected to a circuit pattern by soldering.
【0003】そして、回路基板に装着される電子部品は
多数あるうえ、個々の電子部品には複数のリード線があ
り、リード線を切断する作業が極めて煩雑であった。[0003] In addition to the large number of electronic components mounted on the circuit board, each electronic component has a plurality of lead wires, and the work of cutting the lead wires is extremely complicated.
【0004】そこで、本出願人は、既に特願平3−19
2445号(特公開平5−13840号)をもって新規
な電子部品のリード線切断装置を開示した。Accordingly, the present applicant has already filed Japanese Patent Application No. Hei.
No. 2445 (JP-A-5-13840) discloses a new electronic component lead wire cutting apparatus.
【0005】この構成の概略は、リード線切断装置を含
む回路基板の製造装置を示す例えば図7のように、電子
部品1のリード線(図7では図示せず。)を表面側から
裏面側へ貫通した回路基板3を枠形キャリア5に着脱自
在に取付け、このキャリア5を搬送ガイド装置7に配置
し、この搬送ガイド装置7の搬送路途中に円盤型の回転
刃からなるカッター9を配置したものであり、更に、そ
の搬送路にフラックス塗布装置11及び溶融半田槽13
を配列した全体構成となっていた。The outline of this configuration is as shown in FIG. 7, which shows an apparatus for manufacturing a circuit board including a lead wire cutting apparatus. For example, as shown in FIG. The circuit board 3 penetrated into the frame-shaped carrier 5 is detachably attached to the frame-shaped carrier 5, the carrier 5 is arranged on the conveyance guide device 7, and a cutter 9 composed of a disk-shaped rotary blade is arranged in the conveyance path of the conveyance guide device 7. Further, the flux applying device 11 and the molten solder tank 13
Were arranged as a whole.
【0006】そして、回路基板3をキャリア5に取付け
て所定の方向(図7では左から右方向)へ搬送する過程
で、図8に示すように、回転するカッター9によって電
子部品1のリード線15を切断した後、図7に示すフラ
ックス塗布部11で回路基板3の裏面にフラックスを塗
布してから溶融半田槽13に浸け、電子部品1のリード
線を回路基板3の図示しない回路パターンに半田付けし
ていた。図8において符号17はカッター9の回転軸で
ある。In the process of mounting the circuit board 3 on the carrier 5 and transporting the circuit board 3 in a predetermined direction (from left to right in FIG. 7), as shown in FIG. After cutting 15, a flux is applied to the back surface of the circuit board 3 by the flux application section 11 shown in FIG. 7 and then immersed in the molten solder tank 13, and the lead wire of the electronic component 1 is formed into a circuit pattern (not shown) of the circuit board 3. I was soldering. In FIG. 8, reference numeral 17 denotes a rotation axis of the cutter 9.
【0007】しかも、回転するカッター9で電子部品1
のリード線15をカットすることから、カッター9がリ
ード線15に当ると衝撃や振動が発生して電子部品1が
浮き上がり易くなるので、図8に示すように、押圧蓋1
9に固定した弾性材21で電子部品1の頭部を押圧しな
がら回路基板1を搬送し、搬送途中で電子部品1の浮き
上がりによってリード線15の不揃いな切断、フラック
スの塗布洩れや半田付け不良などが発生しないようにし
ていた。In addition, the electronic component 1 can be
When the cutter 9 hits the lead 15, an impact or vibration is generated, and the electronic component 1 is easily lifted. Therefore, as shown in FIG.
9, the circuit board 1 is conveyed while pressing the head of the electronic component 1 with the elastic material 21 fixed thereto. And so on.
【0008】[0008]
【発明が解決しようとする課題】しかしながら、上述し
た電子部品のリード線切断装置では、回転するカッター
9を使用することから、カッター9と回路基板1間に若
干の隙間を設ける必要があり、回路基板1がカッター9
部分を通過しても、一部のリード線が突出根元から曲っ
た状態で残り、リード線15の切り残りが生ずることが
分かったし、切断時にリード線屑が四方に飛散り易く、
飛散ったリード線屑を除去する手間が必要であるうえ、
搬送途中で電子部品1の浮き上がりを防止するため、弾
性材21付きの押圧蓋19を必要とし、更に改良の余地
があった。However, in the above-described apparatus for cutting lead wires of electronic components, since the rotating cutter 9 is used, it is necessary to provide a slight gap between the cutter 9 and the circuit board 1, and the circuit Substrate 1 is cutter 9
Even through a portion, remaining in a state where part of the lead wire is bent from the projecting root, to it was found that cutting the remaining lead 15 occurs, easily lead scraps scatter in all directions at the time of cutting,
It requires time and effort to remove scattered lead wire debris.
In order to prevent the electronic component 1 from being lifted during transportation, a pressing lid 19 with an elastic material 21 is required, and there is room for further improvement.
【0009】本発明はこのような状況の下になされたも
ので、電子部品のリード線の切り残りが生じ難く、リー
ド線屑が四方へ飛散り難く、切断時に押圧部材を不要と
した電子部品のリード線切断装置の提供を目的とする。The present invention has been made under such circumstances, and it is difficult for the lead wire of the electronic component to be left uncut, the lead wire debris is hardly scattered in all directions, and an electronic component which does not require a pressing member at the time of cutting. The purpose of the present invention is to provide a lead wire cutting device.
【0010】[0010]
【課題を解決するための手段】そのような課題を解決す
るために本発明の電子部品のリード線切断装置は、貫通
孔を有しこれに電子部品のリード線を貫通させてその電
子部品を装着した回路基板が重ねられる上刃プレートで
あって、その貫通孔に揃えた貫通孔を有しこれにそのリ
ード線が貫通される上刃プレートと、少なくともその上
刃プレートを支持する支持部と、そのリード線の突出側
においてこの上刃プレート面を1方向に摺動自在に配置
され、この摺動方向を横切る刃先を有しこれをその上刃
プレートに当接させた可動カッターと、この可動カッタ
ーをその上刃プレートの一方の端部側の静止位置に位置
させ、対向する端部側へ瞬発的にその可動カッターを摺
動させるとともに静止位置に戻す駆動機構と、この駆動
機構の瞬発的摺動動作をオンさせるスイッチとを具備し
ている。SUMMARY OF THE INVENTION In order to solve such a problem, a lead wire cutting device for an electronic component according to the present invention has a through hole through which a lead wire of the electronic component is passed. An upper blade plate on which the mounted circuit board is superimposed, an upper blade plate having a through hole aligned with the through hole and the lead wire penetrating therethrough, and a support portion supporting at least the upper blade plate. A movable cutter having a cutting edge slidable in one direction on the upper blade plate surface on the protruding side of the lead wire and having a cutting edge traversing the sliding direction and contacting the upper blade plate with the movable cutter; A drive mechanism for positioning the movable cutter at a stationary position on one end side of the upper blade plate, instantaneously sliding the movable cutter to the opposite end side, and returning the movable cutter to the stationary position; Sliding It is equipped with a switch that turns on the work.
【0011】また、本発明では、上記上刃プレートがそ
の可動カッターに圧接されるよう上記支持部を配置する
ことが好ましい。In the present invention, it is preferable that the support portion is arranged so that the upper blade plate is pressed against the movable cutter.
【0012】[0012]
【発明の実施の形態】以下、本発明の実施の形態を図面
を参照して説明する。図1は本発明に係る電子部品のリ
ード線切断装置の実施の形態を示す要部断面図(一部側
面で示す。)である。Embodiments of the present invention will be described below with reference to the drawings. FIG. 1 is a cross-sectional view (partially shown in a side view) of a main part showing an embodiment of an electronic component lead wire cutting apparatus according to the present invention.
【0013】図1において、本体ケース23は、長方形
状の底板23a及びこの4辺から立上げられた4つの側
板23bを有する長方形の箱型となっており、この本体
ケース23には支持板(支持部)25が図示しない固定
手段によって蓋として着脱自在に被せるように固定さ
れ、本体ケース23の開口部が塞がれている。In FIG. 1, the main body case 23 has a rectangular box shape having a rectangular bottom plate 23a and four side plates 23b raised from four sides thereof. The support portion 25 is fixed by a fixing means (not shown) so as to be detachably attached as a lid, and the opening of the main body case 23 is closed.
【0014】支持板25において、長手方向の一方の半
分領域(図中左側領域)には、後述する上刃プレート2
7と同様な形状の開口窓29が形成されるとともにこの
開口窓29に面する3辺が段部31となっており、これ
ら段部31に上刃プレート27がはまるように載置さ
れ、図示しない固定手段によって着脱可能に仮固定され
ており、支持板25と上刃プレート27の表面(上面)
が揃うようになっている。On the support plate 25, one half region (left region in the drawing) in the longitudinal direction is provided with an upper blade plate 2 described later.
An opening window 29 having the same shape as that of FIG. 7 is formed, and three sides facing the opening window 29 are stepped portions 31, and the upper blade plate 27 is placed on these stepped portions 31 so as to fit therein. Are temporarily fixed in a detachable manner by a fixing means that does not work, and the surfaces (upper surface) of the support plate 25 and the upper blade plate 27 are fixed.
Are aligned.
【0015】支持板25に形成した開口窓29におい
て、これに面し支持板25の長手方向の中央部を横切る
1辺には、段部が形成されていない。In the opening window 29 formed in the support plate 25, no step is formed on one side crossing the longitudinal center of the support plate 25 facing the window.
【0016】上刃プレート27のはまった支持板25上
に回路基板33が重ねられるようになっている。A circuit board 33 is placed on the support plate 25 in which the upper blade plate 27 is fitted.
【0017】回路基板33は従来公知の材料や形状を有
し、図2及び図3に示すように、少なくとも裏面に回路
パターン(図示せず)を有して上刃プレート27より大
きく形成されており、表裏面側を貫通する多数の貫通孔
35が形成されている。The circuit board 33 has a conventionally known material and shape. As shown in FIGS. 2 and 3, the circuit board 33 has a circuit pattern (not shown) on at least the back surface and is formed larger than the upper blade plate 27. In addition, a large number of through holes 35 penetrating the front and back sides are formed.
【0018】図2及び図3中の符号41は、後述するよ
うに回路基板33を支持板25の所定位置に位置決めす
る位置決孔であり、図3に示すように、支持板25にそ
の位置決め孔41にはまる突起43(図3では一方の図
示を省略した。)が突設されている。Reference numerals 41 in FIGS. 2 and 3 denote positioning holes for positioning the circuit board 33 at predetermined positions on the support plate 25, as will be described later. As shown in FIG. A projection 43 (one of which is not shown in FIG. 3) that protrudes into the hole 41 is provided in a protruding manner.
【0019】回路基板33には、図1に示すように、公
知の電子部品(図1以外では図示省略)37のリード線
39が表面側から裏面側へ貫通孔35を貫通され、複数
の電子部品37が装着されている。As shown in FIG. 1, a lead wire 39 of a known electronic component (not shown in FIG. 1) is passed through a through hole 35 from the front side to the back side of the circuit board 33, as shown in FIG. The component 37 is mounted.
【0020】支持板25に支持される上刃プレート27
は、従来公知の刃物材料、例えばSKH材などの超硬合
金から開口窓29より若干大きな同形状に形成された偏
平な板状となっており、後述するように回路基板33を
支持板25の所定位置に重ねたとき、回路基板33の貫
通孔35に揃う位置に貫通形成された挿通孔45を有し
ている。Upper blade plate 27 supported by support plate 25
Has a flat plate shape formed of a conventionally known blade material, for example, a cemented carbide such as SKH material, having a slightly larger shape than the opening window 29. The circuit board 33 has an insertion hole 45 formed at a position aligned with the through hole 35 of the circuit board 33 when it is overlapped at a predetermined position.
【0021】回路基板33及び上刃プレート27は対に
なっており、回路基板33の種類が変れば、すなわち貫
通孔35の位置や数が変れば、これに応じて上刃プレー
ト27も変更される。The circuit board 33 and the upper blade plate 27 are paired. If the type of the circuit board 33 changes, that is, if the position or the number of the through holes 35 changes, the upper blade plate 27 changes accordingly. You.
【0022】もっもと、上刃プレート27において、使
用予定の回路基板33全ての貫通孔35に揃う位置に挿
通孔45を設けることが可能であれば、複数の回路基板
33に対して1枚で足りる。If it is possible to provide the insertion holes 45 in the upper blade plate 27 at the positions aligned with all the through holes 35 of the circuit board 33 to be used, one of the plurality of circuit boards 33 is provided. Is enough.
【0023】これら貫通孔35及び挿通孔45は、リー
ド線39の直径より0.2mm程度大径に形成されてお
り、これらを形成する前の回路基板33及び上刃プレー
ト27を重ねて揃え、例えばレーザ切削加工、又は回路
基板33の貫通孔35の穴加データに基づき例えばワイ
ヤ放電加工などによって挿通穴45を穿孔可能である。The through-holes 35 and the through-holes 45 are formed to have a diameter about 0.2 mm larger than the diameter of the lead wire 39, and the circuit board 33 and the upper blade plate 27 before these are formed by overlapping and aligning. For example, the insertion hole 45 can be formed by, for example, laser cutting or wire electric discharge machining based on the hole addition data of the through hole 35 of the circuit board 33.
【0024】本体ケース23内において、長手方向の他
方の半分領域(図中右側領域)にはエアーシリンダ47
がその長手方向に沿って底板23aに直接又は間接的に
固定されており、突出して進退動するシリンダ軸49が
一方の半分領域(図中左側領域)すなわち開口窓29側
領域に向けられている。In the main case 23, an air cylinder 47 is provided in the other half area (the right area in the figure) in the longitudinal direction.
Are fixed directly or indirectly to the bottom plate 23a along its longitudinal direction, and the protruding and retracting cylinder shaft 49 is directed to one half region (the left region in the drawing), that is, the opening window 29 side region. .
【0025】本体ケース23の底板23aにおいて、支
持板25の開口窓29下側には、2本のガイドレール5
1a、51bが、開口窓29下側領域を挟むようにエア
ーシリンダ47近傍から長手方向に沿って並行に配置さ
れている。On the bottom plate 23a of the main body case 23, below the opening window 29 of the support plate 25, two guide rails 5 are provided.
1a and 51b are arranged in parallel along the longitudinal direction from the vicinity of the air cylinder 47 so as to sandwich the area below the opening window 29.
【0026】各ガイドレール51a、51bには横断面
凹状のスライダ53a、53bがはまり、ガイドレール
51a、51bを滑らかにスライド自在になっている。Sliders 53a, 53b having concave cross sections are fitted on the respective guide rails 51a, 51b so that the guide rails 51a, 51b can be slid smoothly.
【0027】エアーシリンダ47のシリンダ軸49は、
駆動動作によってガイドレール51a、51bと並行に
突出可能となっており、スライダ53a、53bのスラ
イド方向に直交するようにスライダ53a、53bに縦
置き固定された連結板55に固定されている。The cylinder shaft 49 of the air cylinder 47 is
It can project in parallel with the guide rails 51a and 51b by a driving operation, and is fixed to a connecting plate 55 which is vertically fixed to the sliders 53a and 53b so as to be orthogonal to the sliding direction of the sliders 53a and 53b.
【0028】連結板55の上端には、図3及び図4Aに
示すように、台形状の可動カッター57が横置きするよ
うに固定されている。図4Cは同図A中のc−c間断面
図である。As shown in FIGS. 3 and 4A, a trapezoidal movable cutter 57 is fixed to the upper end of the connecting plate 55 so as to be placed horizontally. FIG. 4C is a sectional view taken along the line cc in FIG.
【0029】この可動カッター57は、上刃プレート2
7と同様に従来公知の刃物材料、例えばSKH材などの
超硬合金から形成されており、斜めの刃先57aを突出
方向に向けスライダ53a、53bのスライド方向に斜
めに交差するように配置されている。The movable cutter 57 is provided with the upper blade plate 2
Similarly to 7, the blade is made of a conventionally known blade material, for example, a cemented carbide such as SKH material, and is arranged so that the oblique cutting edge 57a is directed in the projecting direction and obliquely intersects the sliding direction of the sliders 53a and 53b. I have.
【0030】エアーシリンダ47のシリンダ軸49、連
結板55、スライダ53a、53b及び可動カッター5
7が一体的に連結されており、ガイドレール51a、5
1b上を滑らかにスライド可能になっている。The cylinder shaft 49 of the air cylinder 47, the connecting plate 55, the sliders 53a and 53b, and the movable cutter 5
7 are integrally connected, and guide rails 51a, 5
1b can be slid smoothly.
【0031】エアーシリンダ47のシリンダ軸49は、
そのオン動作により、最も引込んだ状態すなわち上刃プ
レート27の片方の端部(静止状態)から、上刃プレー
ト27の対向端部まで瞬発的に前進動した後、後退動し
て元の静止位置に停止するようになっている。The cylinder shaft 49 of the air cylinder 47 is
As a result of the ON operation, the upper blade plate 27 instantaneously moves forward from the most retracted state, that is, one end (stationary state) of the upper blade plate 27, and then moves backward to return to the original stationary state. It stops at the position.
【0032】そのため、図1に示すように、支持板25
の端に設けたスイッチSWのオン操作によってエアーシ
リンダ47がオン動作すると、シリンダ軸49が連結板
55、スライダ53a、53b及び可動カッター57と
ともに一体的に飛出すとともに、元の位置に戻って停止
する。For this reason, as shown in FIG.
When the air cylinder 47 is turned on by turning on a switch SW provided at the end of the cylinder, the cylinder shaft 49 is ejected integrally with the connecting plate 55, the sliders 53a and 53b and the movable cutter 57, and returns to the original position and stops. I do.
【0033】しかも、本体ケース23に被せられた支持
板25に上刃プレート27がはめ込まれて固定されたと
き、可動カッター57の上面、少なくとも刃先57aが
上刃プレート27の下面に圧接するような位置関係で、
それら支持板25及び上刃プレート27が配置されてお
り、エアーシリンダ47をオン動作されると、上刃プレ
ート27の片方の端部から対向する端部まで可動カッタ
ー57の上面が上刃プレート27の下面を摺動しながら
前進動し、片方の端部まで後退動して停止するようにな
っている。Moreover, when the upper blade plate 27 is fitted into and fixed to the support plate 25 covered by the main body case 23, the upper surface of the movable cutter 57, at least the blade edge 57a, is pressed against the lower surface of the upper blade plate 27. In the positional relationship,
The support plate 25 and the upper blade plate 27 are arranged, and when the air cylinder 47 is turned on, the upper surface of the movable cutter 57 is moved from one end to the opposite end of the upper blade plate 27. Is moved forward while sliding on the lower surface, and retreats to one end to stop.
【0034】次に、上述した本発明のリード線切断装置
の使用方法を説明する。初期状態では、エアーシリンダ
47のシリンダ軸49は、最も引込んだ静止状態となっ
ているとともに、上刃プレート27の下面端部に可動カ
ッター57の少なくとも刃先57a部分の上面が圧接し
た状態となっている。Next, a method of using the above-described lead wire cutting apparatus of the present invention will be described. In the initial state, the cylinder shaft 49 of the air cylinder 47 is at the most retracted and stationary state, and at least the upper surface of the cutting edge 57a of the movable cutter 57 is pressed against the lower surface end of the upper blade plate 27. ing.
【0035】まず、貫通孔35に位置の揃った挿通孔4
5を有する回路基板33及び上刃プレート27を用意
し、図1及び図5に示すように、本体ケース23を塞ぐ
ように固定された支持板25の開口窓29に上刃プレー
ト27をはめて段部31に載置し、適当な手段、例えば
ねじによってこれを仮固定する。First, the insertion holes 4 aligned with the through holes 35
1 and 5, the upper blade plate 27 is fitted to the opening window 29 of the support plate 25 fixed so as to close the main body case 23, as shown in FIGS. It is placed on the step 31 and temporarily fixed by a suitable means, for example, a screw.
【0036】挿通孔45に貫通孔35を合わせるととも
に、回路基板33の位置決孔41を支持板25の突起4
3にはめ込むようにして回路基板33を上刃プレート2
7上に重ねる。The through hole 35 is aligned with the insertion hole 45, and the positioning hole 41 of the circuit board 33 is
3 so that the circuit board 33 is inserted into the upper blade plate 2.
7 on top.
【0037】その後、図1に示すように、電子部品37
のリード線39を回路基板33側から貫通孔35及び挿
通孔45に差込み、上刃プレート27の下面から突出さ
せる。Thereafter, as shown in FIG.
The lead wire 39 is inserted into the through hole 35 and the insertion hole 45 from the circuit board 33 side, and protrudes from the lower surface of the upper blade plate 27.
【0038】そして、支持板25の端に設けたスイッチ
SWをオン操作すると、エアーシリンダ47がオン動作
し、図6に示すように、可動カッター57が上刃プレー
ト27の片方の端部から対向する端部まで上刃プレート
27の下面を摺動しながら瞬発的に前進し、電子部品3
7のリード線39が一気に切断される。その後、可動カ
ッター57は元の静止位置まで後退動して停止する。When the switch SW provided at the end of the support plate 25 is turned on, the air cylinder 47 is turned on, and the movable cutter 57 is opposed from one end of the upper blade plate 27 as shown in FIG. The lower part of the upper blade plate 27 while sliding forward to the end where
7 are cut at a stretch. Thereafter, the movable cutter 57 moves backward to the original stationary position and stops.
【0039】リード線39が切断された回路基板33
は、支持板25から取外され、図示しないフラックス塗
布装置や溶融半田槽へ送られる(図7参照)。The circuit board 33 from which the lead wires 39 have been cut
Is removed from the support plate 25 and sent to a flux coating device or a molten solder tank (not shown) (see FIG. 7).
【0040】このように本発明のリード線切断装置で
は、支持板25に上刃プレート27を重ね、この上刃プ
レート27にはこれに重ねる回路基板37に設けた貫通
孔35に揃えた挿通孔45を形成し、それら貫通孔35
側から挿通孔45に挿通した電子部品37のリード線3
9の突出側において、その上刃プレート27の下面を1
方向に摺動自在にしてこの摺動方向を横切る板状の可動
カッター57を圧接配置し、この可動カッター57に
は、上刃プレート27の端部側の静止位置に位置させ、
瞬発的に突出するように摺動させるとともに静止位置に
戻すエアーシリンダ47を連結し、このエアーシリンダ
47をスイッチSWにて起動可能に構成した。As described above, in the lead wire cutting apparatus of the present invention, the upper blade plate 27 is superimposed on the support plate 25, and the upper blade plate 27 is provided with the insertion holes aligned with the through holes 35 provided in the circuit board 37 superposed thereon. 45 are formed, and the through holes 35 are formed.
Lead 3 of the electronic component 37 inserted into the insertion hole 45 from the side
9, the lower surface of the upper blade plate 27 is
A plate-shaped movable cutter 57 which is slidable in the direction in which the movable cutter 57 traverses the sliding direction is disposed in pressure contact with the movable cutter 57, and the movable cutter 57 is positioned at a stationary position on the end side of the upper blade plate 27,
An air cylinder 47, which is slid so as to protrude instantaneously and is returned to a rest position, is connected, and this air cylinder 47 is configured to be startable by a switch SW.
【0041】そのため、エアーシリンダ47のシリンダ
軸49の瞬発的な突出動作により、上刃プレート27の
下面を摺動する可動カッター57がリード線39を切断
するから、リード線39の切り残りが生じないし、切断
時にリード線39の切屑が例えば可動カッター57の突
出方向といった一方に集り易くなって四方に飛散り難く
なる。As a result, the movable cutter 57 sliding on the lower surface of the upper blade plate 27 cuts the lead wire 39 due to the instantaneous projecting operation of the cylinder shaft 49 of the air cylinder 47, so that the lead wire 39 is left uncut. Also, when cutting, the chips of the lead wire 39 tend to collect on one side, for example, the projecting direction of the movable cutter 57, and are less likely to scatter in all directions.
【0042】その結果、従来のように切断処理をした
後、切り残ったリード線39をニッパーなどによって手
作業で一々切断する必要がなく、切屑の除去も簡単で、
製造が簡単となるうえ、リード線39の切断位置(残っ
たリード長)も揃い易い。As a result, it is not necessary to cut the remaining lead wires 39 one by one manually with a nipper or the like after the cutting process as in the prior art, and it is easy to remove chips.
The manufacturing is simplified, and the cutting positions (remaining lead lengths) of the lead wires 39 are easily aligned.
【0043】さらに、従来のように回転振動するカッタ
ー9を用いないから、その振動や衝撃によるリード線3
9の浮き上がりが生じ難くなり、搬送途中の電子部品1
を抑える押圧蓋19を必要とせず、この点からも製造が
簡単で安価となり、製造装置の複雑化を防止できるし、
可動カッター57の耐久性や寿命も良好である。Furthermore, since the cutter 9 that rotates and vibrates is not used unlike the prior art, the lead wire 3 due to the vibration or impact is not used.
9 is less likely to rise, and the electronic component 1 being transported
In this respect, the production is simple and inexpensive, and the production apparatus can be prevented from becoming complicated,
The durability and life of the movable cutter 57 are also good.
【0044】ところで、上刃プレート27と可動カッタ
ー57間に目に見えるような隙間が形成されなければ、
必ずしも上刃プレート27を可動カッター57に圧接さ
せなくともリード線39の切断が可能であるが、双方を
圧接させた方が切断もスムースでリード線39の切断面
も綺麗である。By the way, if a visible gap is not formed between the upper blade plate 27 and the movable cutter 57,
The lead wire 39 can be cut without necessarily pressing the upper blade plate 27 against the movable cutter 57. However, when both are pressed, the cut is smoother and the cut surface of the lead wire 39 is more beautiful.
【0045】上刃プレート27に可動カッター57を圧
接させる構成としては、上述した図1に係る構成では、
可動カッター57が本体ケース23の底板23aにガイ
ドレール51a、51b及び連結板55を介して固定さ
れており、他方、上刃プレート27が本体ケース23に
被せられた支持板25に支持されているから、上刃プレ
ート27と可動カッター57が当接した状態で、本体ケ
ース23の側板23bの先端と支持板25の間に若干の
隙間を形成しておけば、支持板25を本体ケース23の
側板23bに抑えるように止め金などで支持板25と側
板23b間を固定し、上刃プレート27に可動カッター
57を圧接させることが可能である。もちろん、この構
成に限定されるものではない。As a configuration for bringing the movable cutter 57 into pressure contact with the upper blade plate 27, in the configuration shown in FIG.
The movable cutter 57 is fixed to the bottom plate 23 a of the main body case 23 via the guide rails 51 a and 51 b and the connecting plate 55, while the upper blade plate 27 is supported by the support plate 25 covered on the main body case 23. Therefore, if a slight gap is formed between the tip of the side plate 23b of the main body case 23 and the support plate 25 in a state where the upper blade plate 27 and the movable cutter 57 are in contact with each other, the support plate 25 The movable cutter 57 can be pressed against the upper blade plate 27 by fixing the support plate 25 and the side plate 23b with a stopper or the like so as to hold the movable cutter 57 on the side plate 23b. Of course, the invention is not limited to this configuration.
【0046】本発明における可動カッター57は、上述
したように刃先57aが摺動方向に対して斜めになった
形状である必要はなく、例えば図4B及びDに示すよう
に、長方形状であっても良い。The movable cutter 57 according to the present invention does not need to have a shape in which the cutting edge 57a is inclined with respect to the sliding direction as described above. For example, as shown in FIGS. Is also good.
【0047】要は、その摺動方向を横切る刃先57aを
有するものであれば本発明の目的達成が可能である。図
4Dは同図B中のd−d間断面図である。The point is that the object of the present invention can be achieved as long as it has a cutting edge 57a crossing the sliding direction. Figure 4D is a between d-d sectional view in the figure B.
【0048】また、上述した支持板25も本体ケース2
3を塞ぐ蓋体である必要はなく、上刃プレート27を支
持して着脱自在に仮固定できる部材であれば良く、支持
板25以外にも支持可能である。The above-mentioned support plate 25 is also used for the main body case 2.
It is not necessary to be a lid that closes 3, and any member may be used as long as it can support and detachably temporarily fix the upper blade plate 27, and can support other than the support plate 25.
【0049】可動カッター57の摺動を開始させるスイ
ッチも、従来公知の構成で良いし、任意の場所に配置可
能である。The switch for starting the sliding of the movable cutter 57 may have a conventionally known configuration, and may be arranged at any position.
【0050】さらに、上述したエアーシリンダ47は一
例であり、可動カッター57を上刃プレート27の片方
の端部から対向端部まで、瞬発的に摺動動作させるとと
もに、元の静止位置まで後退動して停止させる駆動機構
であれば任意に選択可能であり、例えば電磁的ソレノイ
ドやモータなどを組合せて形成可能である。Further, the above-described air cylinder 47 is an example, and the movable cutter 57 slides instantaneously from one end of the upper blade plate 27 to the opposing end, and moves back to the original stationary position. The drive mechanism can be arbitrarily selected as long as the drive mechanism is stopped. For example, the drive mechanism can be formed by combining an electromagnetic solenoid or a motor.
【0051】さらにまた、エアーシリンダ47の進退動
に応じて可動カッター57を進退動させるガイドレール
51a、51b、スライダ53a、53b及び連結板5
5についても、上述した構成に限定されず、エアーシリ
ンダ47の進退動に応じて可動カッター57を滑らかに
進退動させるガイド機構であれば、本発明の目的達成が
可能である。Further, guide rails 51a, 51b, sliders 53a, 53b, and connecting plate 5 for moving the movable cutter 57 forward and backward in accordance with the forward and backward movement of the air cylinder 47.
The configuration of 5 is not limited to the above-described configuration, and the object of the present invention can be achieved as long as the guide mechanism smoothly moves the movable cutter 57 in accordance with the advance and retreat of the air cylinder 47.
【0052】[0052]
【発明の効果】以上説明したように本発明のリード線切
断装置は、支持部に支持されかつ貫通孔を有する回路基
板の重ねられる上刃プレートに、その貫通孔に揃う位置
に挿通孔を形成し、その貫通孔側から挿通孔を挿通した
電子部品のリード線の突出側において、駆動機構に連結
させた可動カッターを上刃プレートに当接させて1方向
に摺動自在に配置し、その駆動機構によって可動カッタ
ーを上刃プレートの端部側の静止位置に位置させるとと
もに、瞬発的に対向端部側へ摺動させて静止位置に戻す
よう構成した。そのため、電子部品のリード線の切り残
りが生じ難く、リード線屑が四方へ飛散り難く、切断時
に電子部品を押圧する押圧部材が不要となる利点があ
る。また、上記上刃プレートがその可動カッターに圧接
されるよう上記支持部を配置する構成では、電子部品の
リード線の切断がスムースであるうえ、より一層確実に
リード線を切断可能となる。As described above, according to the lead wire cutting device of the present invention, an insertion hole is formed at a position aligned with the through hole in the upper blade plate on which the circuit board having the through hole and supported by the support portion is overlapped. On the projecting side of the lead wire of the electronic component inserted through the insertion hole from the through hole side, the movable cutter connected to the drive mechanism is brought into contact with the upper blade plate and slidably disposed in one direction. The drive mechanism positions the movable cutter at a stationary position on the end side of the upper blade plate, and instantaneously slides to the opposite end side to return to the stationary position. Therefore, there is an advantage that the lead wire of the electronic component is hardly left uncut, lead wire chips are hardly scattered in all directions, and a pressing member for pressing the electronic component at the time of cutting is unnecessary. Further, in the configuration in which the support portion is arranged such that the upper blade plate is pressed against the movable cutter, the lead wire of the electronic component can be cut smoothly, and the lead wire can be cut more reliably.
【図1】本発明に係る電子部品のリード線切断装置の実
施の形態を示す要部断面図(一部側面で示す。)であ
る。FIG. 1 is a sectional view (partially shown in side view) of an essential part showing an embodiment of an electronic component lead wire cutting apparatus according to the present invention.
【図2】図1中の回路基板及び上刃プレートを示す斜視
図である。FIG. 2 is a perspective view showing a circuit board and an upper blade plate in FIG. 1;
【図3】図1におけるリード線切断装置の一部を破断し
て示す要部破断斜視図である。FIG. 3 is a fragmentary perspective view with a part cut away of the lead wire cutting device in FIG. 1;
【図4】図1中の可動カッターを示す底面図(A、B)
及び断面図(C、D)である。FIG. 4 is a bottom view (A, B) showing the movable cutter in FIG. 1;
And sectional views (C, D).
【図5】図1におけるリード線切断装置の斜視図であ
る。FIG. 5 is a perspective view of the lead wire cutting device in FIG. 1;
【図6】図1におけるリード線切断装置の動作を説明す
る要部断面図(一部側面で示す。)である。FIG. 6 is a sectional view of a main part (partly shown in side view) for explaining the operation of the lead wire cutting device in FIG.
【図7】本発明の参考となるリード線切断装置を含む搬
送ガイド装置の概略を示す平面図である。FIG. 7 is a plan view schematically showing a transport guide device including a lead wire cutting device which is a reference of the present invention.
【図8】図7におけるリード線切断装置の要部断面図で
ある。FIG. 8 is a sectional view of a main part of the lead wire cutting device in FIG. 7;
1、37 電子部品 3、33 回路基板 5 キャリア 7 搬送ガイド装置 9 カッター 11 フラックス塗布装置 13 溶融半田槽 15、39 リード線 17 回転軸 19 押圧蓋 21 弾性材 23 本体ケース 23a 底板 23b 側板 25 支持板(支持部) 27 上刃プレート 29 開口窓 31 段部 35 貫通孔 41 位置決孔 43 突起 45 挿通孔 47 エアーシリンダ(駆動機構) 49 シリンダ軸(駆動軸) 51a、51b ガイドレール(ガイド機構) 53a、53b スライダ(ガイド機構) 55 連結板(ガイド機構) 57 可動カッター 57a 刃先 DESCRIPTION OF SYMBOLS 1, 37 Electronic component 3, 33 Circuit board 5 Carrier 7 Transport guide device 9 Cutter 11 Flux coating device 13 Fused solder tank 15, 39 Lead wire 17 Rotating shaft 19 Pressing lid 21 Elastic material 23 Main body case 23a Bottom plate 23b Side plate 25 Support plate (Supporting part) 27 Upper blade plate 29 Opening window 31 Stepped part 35 Through hole 41 Positioning hole 43 Projection 45 Insertion hole 47 Air cylinder (drive mechanism) 49 Cylinder shaft (drive shaft) 51a, 51b Guide rail (guide mechanism) 53a Numeral 53b Slider (guide mechanism) 55 Connecting plate (guide mechanism) 57 Movable cutter 57a Cutting edge
Claims (2)
を貫通させて前記電子部品を装着した回路基板が重ねら
れる上刃プレートであって、前記貫通孔に揃えた貫通孔
を有しこれに前記リード線が貫通される上刃プレート
と、 少なくとも前記上刃プレートを支持する支持部と、 前記リード線の突出側において前記上刃プレート面を1
方向に摺動自在に配置され、この摺動方向を横切る刃先
を有し、これを前記上刃プレートに当接させた可動カッ
ターと、 この可動カッターを前記上刃プレートの一方の端部側の
静止位置に位置させ、対向する端部側へ瞬発的に前記可
動カッターを摺動させるとともに前記静止位置に戻す駆
動機構と、 この駆動機構の瞬発的摺動動作をオンさせるスイッチ
と、 を具備することを特徴とする電子部品のリード線切断装
置。1. An upper blade plate having a through hole, on which a circuit board on which the electronic component is mounted is inserted through a lead wire of an electronic component and has a through hole aligned with the through hole. An upper blade plate through which the lead wire penetrates, a support portion for supporting at least the upper blade plate, and an upper blade plate surface on a protruding side of the lead wire.
A movable cutter having a cutting edge traversing the sliding direction and contacting the movable cutter with the upper blade plate; and a movable cutter on one end side of the upper blade plate. A drive mechanism which is positioned at a stationary position, slides the movable cutter instantaneously to the opposite end side, and returns to the stationary position; and a switch which turns on the instantaneous sliding operation of the drive mechanism. A lead wire cutting device for an electronic component, comprising:
されるよう前記支持部が配置されてなる請求項1記載の
電子部品のリード線切断装置。2. The apparatus according to claim 1, wherein the support portion is arranged so that the upper blade plate is pressed against a movable cutter.
Priority Applications (1)
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JP2000368085A JP3613331B2 (en) | 2000-12-04 | 2000-12-04 | Electronic component lead wire cutting device |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2000368085A JP3613331B2 (en) | 2000-12-04 | 2000-12-04 | Electronic component lead wire cutting device |
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JP2002171096A true JP2002171096A (en) | 2002-06-14 |
JP3613331B2 JP3613331B2 (en) | 2005-01-26 |
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Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
WO2018207354A1 (en) * | 2017-05-12 | 2018-11-15 | 株式会社Fuji | Component insertion machine and lead cutting method |
CN112775359A (en) * | 2021-01-29 | 2021-05-11 | 重庆溢哲渝实业有限公司 | Electronic components pin cuts forming device |
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CN103495680A (en) * | 2013-09-26 | 2014-01-08 | 中江县凯讯电子有限公司 | Network transformer pin cutting machine with disordered-splashing-preventing function |
CN103495679A (en) * | 2013-09-26 | 2014-01-08 | 中江县凯讯电子有限公司 | Cutting machine for pins of network transformer |
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Cited By (7)
Publication number | Priority date | Publication date | Assignee | Title |
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WO2018207354A1 (en) * | 2017-05-12 | 2018-11-15 | 株式会社Fuji | Component insertion machine and lead cutting method |
CN110603910A (en) * | 2017-05-12 | 2019-12-20 | 株式会社富士 | Component insertion machine and pin cutting method |
JPWO2018207354A1 (en) * | 2017-05-12 | 2020-03-12 | 株式会社Fuji | Component insertion machine and lead cutting method |
CN110603910B (en) * | 2017-05-12 | 2021-08-13 | 株式会社富士 | Component insertion machine and pin cutting method |
US11412649B2 (en) | 2017-05-12 | 2022-08-09 | Fuji Corporation | Component insertion machine and lead cutting method |
CN112775359A (en) * | 2021-01-29 | 2021-05-11 | 重庆溢哲渝实业有限公司 | Electronic components pin cuts forming device |
CN112775359B (en) * | 2021-01-29 | 2022-09-27 | 重庆溢哲渝科技有限公司 | Electronic components pin cuts forming device |
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