JP2002171096A - Lead wire cutting device of electronic component - Google Patents

Abstract

PROBLEM TO BE SOLVED: To dispense with a pressing member for pressing an electronic component at a cutting time by preventing scattering of cutting residue of a lead wire of the component inserted into a circuit board in all directions. SOLUTION: The circuit board 33, having a through-hole 35 is superposed on an upper cutter plate 27 supported to a support plate 25 and having an insertion hole 45, and the hole 35 and the hole 45 are aligned. Lead wires 39 of the component 37 are inserted from the hole 35 side into the hole 45. A plate-like movable cutter 57 is contacted with the plate 21 at the projection side of the wire 39. The cutter 57 is couped to a cylinder shaft 49 of the cylinder 41, and slidably disposed in one direction. The cylinder 47 disposes the cutter 57 at a steady position of the end side of the plate 21, instantaneously slides the cutter to an opposite end side, and then returned to the steady position.

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a lead wire cutting device for an electronic component, and more particularly to an improvement of a lead wire cutting device for removing a lead wire of an electronic component penetrating a circuit board.

[0002]

2. Description of the Related Art When manufacturing a circuit board on which electronic parts having lead wires are mounted, a lead wire projecting from the front side to the back side of the circuit board is cut and removed on the back side.
Apply flux to the back side and immerse it in the molten solder tank,
Generally, an electronic component is connected to a circuit pattern by soldering.

[0003] In addition to the large number of electronic components mounted on the circuit board, each electronic component has a plurality of lead wires, and the work of cutting the lead wires is extremely complicated.

Accordingly, the present applicant has already filed Japanese Patent Application No. Hei.
No. 2445 (JP-A-5-13840) discloses a new electronic component lead wire cutting apparatus.

The outline of this configuration is as shown in FIG. 7, which shows an apparatus for manufacturing a circuit board including a lead wire cutting apparatus. For example, as shown in FIG. The circuit board 3 penetrated into the frame-shaped carrier 5 is detachably attached to the frame-shaped carrier 5, the carrier 5 is arranged on the conveyance guide device 7, and a cutter 9 composed of a disk-shaped rotary blade is arranged in the conveyance path of the conveyance guide device 7. Further, the flux applying device 11 and the molten solder tank 13
Were arranged as a whole.

In the process of mounting the circuit board 3 on the carrier 5 and transporting the circuit board 3 in a predetermined direction (from left to right in FIG. 7), as shown in FIG. After cutting 15, a flux is applied to the back surface of the circuit board 3 by the flux application section 11 shown in FIG. 7 and then immersed in the molten solder tank 13, and the lead wire of the electronic component 1 is formed into a circuit pattern (not shown) of the circuit board 3. I was soldering. In FIG. 8, reference numeral 17 denotes a rotation axis of the cutter 9.

In addition, the electronic component 1 can be
When the cutter 9 hits the lead 15, an impact or vibration is generated, and the electronic component 1 is easily lifted. Therefore, as shown in FIG.
9, the circuit board 1 is conveyed while pressing the head of the electronic component 1 with the elastic material 21 fixed thereto. And so on.

[0008]

However, in the above-described apparatus for cutting lead wires of electronic components, since the rotating cutter 9 is used, it is necessary to provide a slight gap between the cutter 9 and the circuit board 1, and the circuit Substrate 1 is cutter 9
Even through a portion, remaining in a state where part of the lead wire is bent from the projecting root, to it was found that cutting the remaining lead 15 occurs, easily lead scraps scatter in all directions at the time of cutting,
It requires time and effort to remove scattered lead wire debris.
In order to prevent the electronic component 1 from being lifted during transportation, a pressing lid 19 with an elastic material 21 is required, and there is room for further improvement.

The present invention has been made under such circumstances, and it is difficult for the lead wire of the electronic component to be left uncut, the lead wire debris is hardly scattered in all directions, and an electronic component which does not require a pressing member at the time of cutting. The purpose of the present invention is to provide a lead wire cutting device.

[0010]

SUMMARY OF THE INVENTION In order to solve such a problem, a lead wire cutting device for an electronic component according to the present invention has a through hole through which a lead wire of the electronic component is passed. An upper blade plate on which the mounted circuit board is superimposed, an upper blade plate having a through hole aligned with the through hole and the lead wire penetrating therethrough, and a support portion supporting at least the upper blade plate. A movable cutter having a cutting edge slidable in one direction on the upper blade plate surface on the protruding side of the lead wire and having a cutting edge traversing the sliding direction and contacting the upper blade plate with the movable cutter; A drive mechanism for positioning the movable cutter at a stationary position on one end side of the upper blade plate, instantaneously sliding the movable cutter to the opposite end side, and returning the movable cutter to the stationary position; Sliding It is equipped with a switch that turns on the work.

In the present invention, it is preferable that the support portion is arranged so that the upper blade plate is pressed against the movable cutter.

[0012]

Embodiments of the present invention will be described below with reference to the drawings. FIG. 1 is a cross-sectional view (partially shown in a side view) of a main part showing an embodiment of an electronic component lead wire cutting apparatus according to the present invention.

In FIG. 1, the main body case 23 has a rectangular box shape having a rectangular bottom plate 23a and four side plates 23b raised from four sides thereof. The support portion 25 is fixed by a fixing means (not shown) so as to be detachably attached as a lid, and the opening of the main body case 23 is closed.

On the support plate 25, one half region (left region in the drawing) in the longitudinal direction is provided with an upper blade plate 2 described later.
An opening window 29 having the same shape as that of FIG. 7 is formed, and three sides facing the opening window 29 are stepped portions 31, and the upper blade plate 27 is placed on these stepped portions 31 so as to fit therein. Are temporarily fixed in a detachable manner by a fixing means that does not work, and the surfaces (upper surface) of the support plate 25 and the upper blade plate 27 are fixed.
Are aligned.

In the opening window 29 formed in the support plate 25, no step is formed on one side crossing the longitudinal center of the support plate 25 facing the window.

A circuit board 33 is placed on the support plate 25 in which the upper blade plate 27 is fitted.

The circuit board 33 has a conventionally known material and shape. As shown in FIGS. 2 and 3, the circuit board 33 has a circuit pattern (not shown) on at least the back surface and is formed larger than the upper blade plate 27. In addition, a large number of through holes 35 penetrating the front and back sides are formed.

Reference numerals 41 in FIGS. 2 and 3 denote positioning holes for positioning the circuit board 33 at predetermined positions on the support plate 25, as will be described later. As shown in FIG. A projection 43 (one of which is not shown in FIG. 3) that protrudes into the hole 41 is provided in a protruding manner.

As shown in FIG. 1, a lead wire 39 of a known electronic component (not shown in FIG. 1) is passed through a through hole 35 from the front side to the back side of the circuit board 33, as shown in FIG. The component 37 is mounted.

Upper blade plate 27 supported by support plate 25
Has a flat plate shape formed of a conventionally known blade material, for example, a cemented carbide such as SKH material, having a slightly larger shape than the opening window 29. The circuit board 33 has an insertion hole 45 formed at a position aligned with the through hole 35 of the circuit board 33 when it is overlapped at a predetermined position.

The circuit board 33 and the upper blade plate 27 are paired. If the type of the circuit board 33 changes, that is, if the position or the number of the through holes 35 changes, the upper blade plate 27 changes accordingly. You.

If it is possible to provide the insertion holes 45 in the upper blade plate 27 at the positions aligned with all the through holes 35 of the circuit board 33 to be used, one of the plurality of circuit boards 33 is provided. Is enough.

The through-holes 35 and the through-holes 45 are formed to have a diameter about 0.2 mm larger than the diameter of the lead wire 39, and the circuit board 33 and the upper blade plate 27 before these are formed by overlapping and aligning. For example, the insertion hole 45 can be formed by, for example, laser cutting or wire electric discharge machining based on the hole addition data of the through hole 35 of the circuit board 33.

In the main case 23, an air cylinder 47 is provided in the other half area (the right area in the figure) in the longitudinal direction.
Are fixed directly or indirectly to the bottom plate 23a along its longitudinal direction, and the protruding and retracting cylinder shaft 49 is directed to one half region (the left region in the drawing), that is, the opening window 29 side region. .

On the bottom plate 23a of the main body case 23, below the opening window 29 of the support plate 25, two guide rails 5 are provided.
1a and 51b are arranged in parallel along the longitudinal direction from the vicinity of the air cylinder 47 so as to sandwich the area below the opening window 29.

Sliders 53a, 53b having concave cross sections are fitted on the respective guide rails 51a, 51b so that the guide rails 51a, 51b can be slid smoothly.

The cylinder shaft 49 of the air cylinder 47 is
It can project in parallel with the guide rails 51a and 51b by a driving operation, and is fixed to a connecting plate 55 which is vertically fixed to the sliders 53a and 53b so as to be orthogonal to the sliding direction of the sliders 53a and 53b.

As shown in FIGS. 3 and 4A, a trapezoidal movable cutter 57 is fixed to the upper end of the connecting plate 55 so as to be placed horizontally. FIG. 4C is a sectional view taken along the line cc in FIG.

The movable cutter 57 is provided with the upper blade plate 2
Similarly to 7, the blade is made of a conventionally known blade material, for example, a cemented carbide such as SKH material, and is arranged so that the oblique cutting edge 57a is directed in the projecting direction and obliquely intersects the sliding direction of the sliders 53a and 53b. I have.

The cylinder shaft 49 of the air cylinder 47, the connecting plate 55, the sliders 53a and 53b, and the movable cutter 5
7 are integrally connected, and guide rails 51a, 5
1b can be slid smoothly.

The cylinder shaft 49 of the air cylinder 47 is
As a result of the ON operation, the upper blade plate 27 instantaneously moves forward from the most retracted state, that is, one end (stationary state) of the upper blade plate 27, and then moves backward to return to the original stationary state. It stops at the position.

For this reason, as shown in FIG.
When the air cylinder 47 is turned on by turning on a switch SW provided at the end of the cylinder, the cylinder shaft 49 is ejected integrally with the connecting plate 55, the sliders 53a and 53b and the movable cutter 57, and returns to the original position and stops. I do.

Moreover, when the upper blade plate 27 is fitted into and fixed to the support plate 25 covered by the main body case 23, the upper surface of the movable cutter 57, at least the blade edge 57a, is pressed against the lower surface of the upper blade plate 27. In the positional relationship,
The support plate 25 and the upper blade plate 27 are arranged, and when the air cylinder 47 is turned on, the upper surface of the movable cutter 57 is moved from one end to the opposite end of the upper blade plate 27. Is moved forward while sliding on the lower surface, and retreats to one end to stop.

Next, a method of using the above-described lead wire cutting apparatus of the present invention will be described. In the initial state, the cylinder shaft 49 of the air cylinder 47 is at the most retracted and stationary state, and at least the upper surface of the cutting edge 57a of the movable cutter 57 is pressed against the lower surface end of the upper blade plate 27. ing.

First, the insertion holes 4 aligned with the through holes 35
1 and 5, the upper blade plate 27 is fitted to the opening window 29 of the support plate 25 fixed so as to close the main body case 23, as shown in FIGS. It is placed on the step 31 and temporarily fixed by a suitable means, for example, a screw.

The through hole 35 is aligned with the insertion hole 45, and the positioning hole 41 of the circuit board 33 is
3 so that the circuit board 33 is inserted into the upper blade plate 2.
7 on top.

Thereafter, as shown in FIG.
The lead wire 39 is inserted into the through hole 35 and the insertion hole 45 from the circuit board 33 side, and protrudes from the lower surface of the upper blade plate 27.

When the switch SW provided at the end of the support plate 25 is turned on, the air cylinder 47 is turned on, and the movable cutter 57 is opposed from one end of the upper blade plate 27 as shown in FIG. The lower part of the upper blade plate 27 while sliding forward to the end where
7 are cut at a stretch. Thereafter, the movable cutter 57 moves backward to the original stationary position and stops.

The circuit board 33 from which the lead wires 39 have been cut
Is removed from the support plate 25 and sent to a flux coating device or a molten solder tank (not shown) (see FIG. 7).

As described above, in the lead wire cutting apparatus of the present invention, the upper blade plate 27 is superimposed on the support plate 25, and the upper blade plate 27 is provided with the insertion holes aligned with the through holes 35 provided in the circuit board 37 superposed thereon. 45 are formed, and the through holes 35 are formed.
Lead 3 of the electronic component 37 inserted into the insertion hole 45 from the side
9, the lower surface of the upper blade plate 27 is
A plate-shaped movable cutter 57 which is slidable in the direction in which the movable cutter 57 traverses the sliding direction is disposed in pressure contact with the movable cutter 57, and the movable cutter 57 is positioned at a stationary position on the end side of the upper blade plate 27,
An air cylinder 47, which is slid so as to protrude instantaneously and is returned to a rest position, is connected, and this air cylinder 47 is configured to be startable by a switch SW.

As a result, the movable cutter 57 sliding on the lower surface of the upper blade plate 27 cuts the lead wire 39 due to the instantaneous projecting operation of the cylinder shaft 49 of the air cylinder 47, so that the lead wire 39 is left uncut. Also, when cutting, the chips of the lead wire 39 tend to collect on one side, for example, the projecting direction of the movable cutter 57, and are less likely to scatter in all directions.

As a result, it is not necessary to cut the remaining lead wires 39 one by one manually with a nipper or the like after the cutting process as in the prior art, and it is easy to remove chips.
The manufacturing is simplified, and the cutting positions (remaining lead lengths) of the lead wires 39 are easily aligned.

Furthermore, since the cutter 9 that rotates and vibrates is not used unlike the prior art, the lead wire 3 due to the vibration or impact is not used.
9 is less likely to rise, and the electronic component 1 being transported
In this respect, the production is simple and inexpensive, and the production apparatus can be prevented from becoming complicated,
The durability and life of the movable cutter 57 are also good.

By the way, if a visible gap is not formed between the upper blade plate 27 and the movable cutter 57,
The lead wire 39 can be cut without necessarily pressing the upper blade plate 27 against the movable cutter 57. However, when both are pressed, the cut is smoother and the cut surface of the lead wire 39 is more beautiful.

As a configuration for bringing the movable cutter 57 into pressure contact with the upper blade plate 27, in the configuration shown in FIG.
The movable cutter 57 is fixed to the bottom plate 23 a of the main body case 23 via the guide rails 51 a and 51 b and the connecting plate 55, while the upper blade plate 27 is supported by the support plate 25 covered on the main body case 23. Therefore, if a slight gap is formed between the tip of the side plate 23b of the main body case 23 and the support plate 25 in a state where the upper blade plate 27 and the movable cutter 57 are in contact with each other, the support plate 25 The movable cutter 57 can be pressed against the upper blade plate 27 by fixing the support plate 25 and the side plate 23b with a stopper or the like so as to hold the movable cutter 57 on the side plate 23b. Of course, the invention is not limited to this configuration.

The movable cutter 57 according to the present invention does not need to have a shape in which the cutting edge 57a is inclined with respect to the sliding direction as described above. For example, as shown in FIGS. Is also good.

The point is that the object of the present invention can be achieved as long as it has a cutting edge 57a crossing the sliding direction. Figure 4D is a between d-d sectional view in the figure B.

The above-mentioned support plate 25 is also used for the main body case 2.
It is not necessary to be a lid that closes 3, and any member may be used as long as it can support and detachably temporarily fix the upper blade plate 27, and can support other than the support plate 25.

The switch for starting the sliding of the movable cutter 57 may have a conventionally known configuration, and may be arranged at any position.

Further, the above-described air cylinder 47 is an example, and the movable cutter 57 slides instantaneously from one end of the upper blade plate 27 to the opposing end, and moves back to the original stationary position. The drive mechanism can be arbitrarily selected as long as the drive mechanism is stopped. For example, the drive mechanism can be formed by combining an electromagnetic solenoid or a motor.

Further, guide rails 51a, 51b, sliders 53a, 53b, and connecting plate 5 for moving the movable cutter 57 forward and backward in accordance with the forward and backward movement of the air cylinder 47.
The configuration of 5 is not limited to the above-described configuration, and the object of the present invention can be achieved as long as the guide mechanism smoothly moves the movable cutter 57 in accordance with the advance and retreat of the air cylinder 47.

[0052]

As described above, according to the lead wire cutting device of the present invention, an insertion hole is formed at a position aligned with the through hole in the upper blade plate on which the circuit board having the through hole and supported by the support portion is overlapped. On the projecting side of the lead wire of the electronic component inserted through the insertion hole from the through hole side, the movable cutter connected to the drive mechanism is brought into contact with the upper blade plate and slidably disposed in one direction. The drive mechanism positions the movable cutter at a stationary position on the end side of the upper blade plate, and instantaneously slides to the opposite end side to return to the stationary position. Therefore, there is an advantage that the lead wire of the electronic component is hardly left uncut, lead wire chips are hardly scattered in all directions, and a pressing member for pressing the electronic component at the time of cutting is unnecessary. Further, in the configuration in which the support portion is arranged such that the upper blade plate is pressed against the movable cutter, the lead wire of the electronic component can be cut smoothly, and the lead wire can be cut more reliably.

[Brief description of the drawings]

FIG. 1 is a sectional view (partially shown in side view) of an essential part showing an embodiment of an electronic component lead wire cutting apparatus according to the present invention.

FIG. 2 is a perspective view showing a circuit board and an upper blade plate in FIG. 1;

FIG. 3 is a fragmentary perspective view with a part cut away of the lead wire cutting device in FIG. 1;

FIG. 4 is a bottom view (A, B) showing the movable cutter in FIG. 1;
And sectional views (C, D).

FIG. 5 is a perspective view of the lead wire cutting device in FIG. 1;

FIG. 6 is a sectional view of a main part (partly shown in side view) for explaining the operation of the lead wire cutting device in FIG.

FIG. 7 is a plan view schematically showing a transport guide device including a lead wire cutting device which is a reference of the present invention.

FIG. 8 is a sectional view of a main part of the lead wire cutting device in FIG. 7;

[Description of Issue]

 DESCRIPTION OF SYMBOLS 1, 37 Electronic component 3, 33 Circuit board 5 Carrier 7 Transport guide device 9 Cutter 11 Flux coating device 13 Fused solder tank 15, 39 Lead wire 17 Rotating shaft 19 Pressing lid 21 Elastic material 23 Main body case 23a Bottom plate 23b Side plate 25 Support plate (Supporting part) 27 Upper blade plate 29 Opening window 31 Stepped part 35 Through hole 41 Positioning hole 43 Projection 45 Insertion hole 47 Air cylinder (drive mechanism) 49 Cylinder shaft (drive shaft) 51a, 51b Guide rail (guide mechanism) 53a Numeral 53b Slider (guide mechanism) 55 Connecting plate (guide mechanism) 57 Movable cutter 57a Cutting edge

Claims (2)

[Claims] 1. An upper blade plate having a through hole, on which a circuit board on which the electronic component is mounted is inserted through a lead wire of an electronic component and has a through hole aligned with the through hole. An upper blade plate through which the lead wire penetrates, a support portion for supporting at least the upper blade plate, and an upper blade plate surface on a protruding side of the lead wire.
A movable cutter having a cutting edge traversing the sliding direction and contacting the movable cutter with the upper blade plate; and a movable cutter on one end side of the upper blade plate. A drive mechanism which is positioned at a stationary position, slides the movable cutter instantaneously to the opposite end side, and returns to the stationary position; and a switch which turns on the instantaneous sliding operation of the drive mechanism. A lead wire cutting device for an electronic component, comprising: 2. The apparatus according to claim 1, wherein the support portion is arranged so that the upper blade plate is pressed against a movable cutter.