JP2002164362A5 - - Google Patents

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Publication number
JP2002164362A5
JP2002164362A5 JP2000356312A JP2000356312A JP2002164362A5 JP 2002164362 A5 JP2002164362 A5 JP 2002164362A5 JP 2000356312 A JP2000356312 A JP 2000356312A JP 2000356312 A JP2000356312 A JP 2000356312A JP 2002164362 A5 JP2002164362 A5 JP 2002164362A5
Authority
JP
Japan
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP2000356312A
Other languages
Japanese (ja)
Other versions
JP2002164362A (ja
Filing date
Publication date
Application filed filed Critical
Priority to JP2000356312A priority Critical patent/JP2002164362A/ja
Priority claimed from JP2000356312A external-priority patent/JP2002164362A/ja
Publication of JP2002164362A publication Critical patent/JP2002164362A/ja
Publication of JP2002164362A5 publication Critical patent/JP2002164362A5/ja
Pending legal-status Critical Current

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JP2000356312A 2000-11-22 2000-11-22 チップサイズ半導体装置及びその製造方法 Pending JP2002164362A (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP2000356312A JP2002164362A (ja) 2000-11-22 2000-11-22 チップサイズ半導体装置及びその製造方法

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2000356312A JP2002164362A (ja) 2000-11-22 2000-11-22 チップサイズ半導体装置及びその製造方法

Publications (2)

Publication Number Publication Date
JP2002164362A JP2002164362A (ja) 2002-06-07
JP2002164362A5 true JP2002164362A5 (enExample) 2008-02-07

Family

ID=18828589

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2000356312A Pending JP2002164362A (ja) 2000-11-22 2000-11-22 チップサイズ半導体装置及びその製造方法

Country Status (1)

Country Link
JP (1) JP2002164362A (enExample)

Families Citing this family (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR100586607B1 (ko) 2004-12-28 2006-06-07 동부일렉트로닉스 주식회사 차단판을 이용한 반도체 칩 표면의 보호 방법
JP2007266421A (ja) * 2006-03-29 2007-10-11 Sanyo Electric Co Ltd 半導体装置およびその製造方法
CN103283019A (zh) * 2011-02-10 2013-09-04 松下电器产业株式会社 半导体装置

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