JP2002162433A - Thermostatic chamber - Google Patents

Abstract

PROBLEM TO BE SOLVED: To perform efficient schooling test, independently of foreign matters in a thermostatic chamber. SOLUTION: A metal filter 6 (dust removal means) for removing foreign matters is provided in the thermostatic chamber 1 for holding an object in a prescribed temperature environment.

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a thermostat for holding an object under a predetermined temperature environment.

[0002]

2. Description of the Related Art In a schooling test of a semiconductor device, various device test devices such as a burn-in device, a test burn-in device, a static burn-in device, a dynamic burn-in device, and a monitored burn-in device are used. In addition, such a device test apparatus includes a constant temperature bath that holds a semiconductor device mounted on a burn-in board (printed wiring board) in a temperature environment corresponding to a schooling test.

[0003] In such various device test apparatuses, various foreign substances are generated in the thermostat. For example, since the burn-in board is repeatedly used while applying a temperature load, the resist on the surface of the burn-in board is peeled off, dust or dust is generated when the burn-in board is inserted or removed, or metal scrap is generated from the burn-in board itself. . On the other hand, since the device test apparatus accommodates a large number of burn-in boards at a time to perform a test, the thermostat is configured to have a relatively large capacity, and the temperature distribution of each part in the thermostat is uniform. The air is circulated through.

That is, in a conventional device test apparatus,
Since the air containing the various foreign substances circulates in the thermostat, there is a problem that the foreign substances adhere to the periphery of the device on the burn-in board and cause poor electrical contact. Conventionally, when such a problem occurs, cleaning for removing foreign substances is performed each time, so that the operation efficiency of the device test apparatus is poor, and an efficient schooling test cannot be performed.

The present invention has been made in view of the above problems, and has as its object to perform an efficient schooling test irrespective of foreign matter in a thermostat.

[0006]

In order to achieve the above-mentioned object, according to the present invention, as a first means, there is provided a dust removing means for removing foreign matter therein in a constant temperature bath for holding an object under a predetermined temperature environment. Means is provided.

Further, as the second means, a means in which the dust removing means is detachably provided in the first means is adopted.

[0008] As a third means, in the above first or second means, an air circulating means for circulating the internal air is provided, and the dust removing means is a metal filter provided in the middle of the air circulating path. Adopt means.

As a fourth means, in any one of the first to third means, means for mounting the semiconductor device on a device test apparatus for a schooling test of a semiconductor device is employed.

As a fifth means, in the above-mentioned third or fourth means, means for providing dust removing means at a position which does not obstruct the air circulation path is employed.

[0011]

DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS Hereinafter, an embodiment of a thermostat according to the present invention will be described with reference to the drawings.

FIG. 1 is a diagram showing a configuration of a main part of the present embodiment. In this drawing, reference numeral 1 denotes a constant temperature bath, 2 denotes a carrier rack, 3 denotes a burn-in board, 4 denotes a fan (air circulation means), 5 denotes a heater, and 6 denotes a metal filter (dust removing means).
Is The thermostat 1 is a burn-in board 3 (object)
Is maintained in a predetermined temperature environment, and a carrier rack 2 for accommodating a plurality of the burn-in boards 3 is accommodated substantially in the center thereof, and a fan 4 and a heater 5
And the metal filters 6 are arranged in a line.

The carrier rack 2 is, as shown in FIG.
A plurality of shelves 2a are provided at predetermined intervals from the lower side to the upper side, and the spaces between the shelves 2a are open so that ventilation from the side is good. Each shelf 2a
Each has a rectangular burn-in board 3 accommodated therein. The burn-in board 3 has a plurality of semiconductor devices to be subjected to a schooling test mounted thereon, and supplies power to the semiconductor devices and inputs / outputs various signals.

The fan 4 is disposed at the upper right of the carrier rack 2 and circulates the air in the thermostat 1. The heater 5 is disposed on the left side of the fan 4 and heats the air in the thermostat 1 to a predetermined temperature. Note that the front-rear relationship between the fan 4 and the heater 5 may be reversed. That is, the heater 5 may be located on the rightmost side, and the fan 4 may be located on the left side.

The metal filter 6 is formed by knitting a metal wire into a mesh, and collects and removes foreign matters floating in the thermostat 1 with the circulation of the air.
The metal filters 6 are arranged in a line with the fan 4 on the upper part of the carrier rack 2 at a position not obstructing a circulation path of the air in the thermostat 1, which will be described below, and are easily replaced. It is configured to be detachable from the thermostat 1.

Next, the operation of the thus-configured thermostat 1 will be described in detail. An air circulation path indicated by an arrow is formed in the constant temperature bath 1 by the operation of the fan 4. The air flowing along the circulation path is heated at a predetermined temperature by the heater 5.

That is, the heated air blown rightward from the fan 4 is turned downward by the wall surface of the thermostat 1, flows between the burn-in boards 3 from the right side of the carrier rack 2, and further flows from the left side. It blows upward through the carrier rack 2. And this carrier rack 2
The heated air blown up from the left side of the is sucked into the fan 4 again via the metal filter 6 and the heater 5. By such a circulating flow of the heated air, the semiconductor devices on the burn-in boards 3 arranged at predetermined intervals are uniformly heated to the same temperature, and the schooling test is performed.

The wind speed of such a circulating flow is 1 to 1.
The resist is separated from the surface of the burn-in board 3 by the metal filter 6, dust and dust generated when the burn-in board 3 is inserted and removed, or foreign matters such as metal chips generated from the burn-in board 3 itself are heated. It is entrained in the air and passes through the metal filter 6, where it is collected and removed. That is, as the circulation of the heated air is repeated, the foreign matter in the thermostat 1 is gradually collected in the metal filter 6, so that the degree of cleanliness in the thermostat 1 improves with time.

In the present embodiment, the metal filter 6 acts as a load on the circulating flow.
Are arranged in a line with the fan 4 at the upper part of the. That is, this configuration is intended to prevent a situation in which the provision of the metal filter 6 changes the circulation path of the air in the constant temperature bath 1 and the semiconductor devices on each burn-in board 3 do not reach a uniform temperature.

In this embodiment, a metal filter is employed as the dust removing means, but it is a matter of course that the present invention is not limited to this.

[0021]

As described above, according to the constant temperature bath according to the present invention, foreign substances inside the constant temperature bath can be removed by the dust removing means, so that the inside of the constant temperature bath can be kept clean. When such a thermostat is applied to, for example, a thermostat mounted on a device test apparatus for performing a schooling test, it is possible to suppress a decrease in the efficiency of the schooling test due to foreign substances in the thermostat.

[Brief description of the drawings]

FIG. 1 is a plan view showing a configuration of a main part of an embodiment of the present invention.

FIG. 2 is a perspective view of a carrier rack according to the embodiment of the present invention.

[Explanation of symbols]

 1 ... constant temperature bath 2 ... carrier rack 3 ... burn-in board 4 ... fan (air circulation means) 5 ... heater 6 ... metal filter (dust removal means)

Claims (5)

[Claims] 1. A constant temperature bath for holding an object under a predetermined temperature environment, wherein the constant temperature bath includes dust removing means for removing foreign matter therein. 2. The constant temperature bath according to claim 1, wherein said dust removing means is detachably provided. 3. The constant temperature bath according to claim 1, further comprising an air circulating means for circulating the internal air, and wherein the dust removing means is a metal filter provided in the middle of the air circulation path. 4. The constant temperature bath according to claim 1, wherein the constant temperature bath is mounted on a device test apparatus for a schooling test of a semiconductor device. 5. The constant temperature bath according to claim 3, wherein the dust removing means is provided at a position which does not obstruct the air circulation path.