JP2002149243A - Temperature control device - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide a temperature control device which effectively cope with the generation of heat accompanying operation. SOLUTION: The temperature control device 1 is provided inside an external cover 1C and equipped with a heat shield plate 90 which covers a tank 10, a pump 20, a cooler (cooling means) 30, and a halogen lamp heater (heating means) 40 from above and a water cooling tube (plate cooling means) 901 which cools the heat shield plate 90 with water. Further, the temperature control device 1 is provided with a light shield plate between an end of the halogen lamp heater 40 having a lamp as a heat source and a rear plate 1R (external cover 1C) covering the end part of the halogen lamp heater 40. Furthermore, the temperature control device 1 is equipped with a cooling water supply block which is cooled with temperature fluid and a motor cooling block, and components, such as a connector Ec harness Eh, which are intolerant of high temperature are provided in the space surrounded with the cooling water supply block and motor cooling block.

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention comprises a tank for storing a temperature fluid, a pump for circulating the temperature fluid, a heating means for heating the temperature fluid, and a cooling means for cooling the temperature fluid. The present invention relates to a temperature control device for circulating a cooled temperature fluid between a temperature-controlled object and a temperature of the temperature-controlled object.

[0002]

2. Description of the Related Art Temperature fluid such as air supplied to a constant temperature chamber,
Alternatively, a temperature fluid such as water or Fluorinert (registered trademark) used for air conditioning or wall surface temperature control of a chamber applied when manufacturing a semiconductor device or a liquid crystal device needs to be controlled to a target temperature according to each purpose. .

For this reason, in a semiconductor manufacturing system, for example, a temperature fluid used for temperature control in a chamber flows into heating / cooling means such as a heater or a cooler, and the temperature fluid is adjusted to a desired temperature by the heating / cooling means. After that, a circulating heating / cooling system is applied in which the pump is circulated to a chamber by a pump.

FIGS. 25 to 27 show a heating device constituting a conventional circulation type heating / cooling system. The heating device A is a heat storage tank T for temporarily storing a temperature fluid sent from a cooling device (not shown). , A fluid circulation supply pump P and a drive motor M, a halogen lamp heater H for heating the temperature fluid, and a pressure absorber (bellows tube) V for absorbing pressure fluctuation of the temperature fluid.

[0005] In this heating device A, independent components such as the heat storage tank T and the halogen lamp heater H described above are connected to each other by complicatedly arranged piping. The heater H is connected to each other through a pipe O, and the temperature fluid stored in the heat storage tank T is supplied to the halogen lamp heater H through the pipe O by the operation of the fluid circulation supply pump P. You.

Here, in a configuration in which independent components are connected by piping as in the above-mentioned circulation type heating / cooling system, since the radius of curvature of the piping is limited, for example, adjacent components are connected. Even in such a case, there is a disadvantage that a large space is required for installation of the piping, which leads to an increase in the size of the external appearance.

Therefore, the applicant of the present application filed an earlier application (Japanese Patent Application No.
-308996), comprising a tank for storing the temperature fluid, a pump for circulating the temperature fluid, and heating / cooling means for heating and cooling the temperature fluid, wherein the heated or cooled temperature fluid is interposed between the temperature-controlled object. A circulation type heating / cooling system for controlling the temperature of the temperature-controlled object, wherein the pump and the heating / cooling means are connected to each other via a block having a flow path therein. A heating and cooling system was provided.

[0008] According to the above configuration, by connecting the pump and the heating and cooling means via the block having the flow path therein without using a pipe, the inconvenience caused by the use of the pipe such as the routing can be eliminated. In addition, a compact appearance can be achieved.

[0009]

In the heating and cooling system described above, the components such as the tank and the pump are provided in an outer case for the purpose of protecting the components such as the tank and the pump or improving the appearance. However, the heat generated by a motor for driving the pump and heating means such as a halogen lamp heater is trapped inside the outer case, so that the surface temperature of the outer case is extremely high. There is a problem.

In order to solve the above-mentioned problems, it is possible to adopt a structure in which a heat insulating material is attached to components such as a halogen lamp heater, and further, a sufficient heat radiation space is secured between the heater and the exterior cover. Even in the configuration, there is a disadvantage that the appearance of the entire apparatus is unnecessarily enlarged.

Further, as described above, since the inside of the outer case becomes high in temperature with the operation, the electric parts (I
For electronic parts such as C, mechanical parts such as harnesses and connectors, etc., products having high heat-resistant temperatures have to be used, which has the disadvantage of increasing costs.

The present invention has been made in view of the above circumstances, and has as its object to provide a temperature control device capable of effectively coping with the generation of heat during operation.

[0013]

In order to achieve the above object, a temperature control apparatus according to the first aspect of the present invention comprises:
A tank that stores the temperature fluid, a pump that circulates the temperature fluid, a heating unit that heats the temperature fluid, and a cooling unit that cools the temperature fluid, wherein the heated or cooled temperature fluid is connected to a temperature-controlled object. In a temperature control device that circulates between and controls the temperature of the temperature-controlled object, the temperature control device includes a heat shielding plate that is provided inside the outer cover and covers the tank, the pump, the heating unit, and the cooling unit. It is characterized by comprising. According to the above configuration,
A heat shield plate is provided inside the outer cover to prevent the outer cover from being directly exposed to the heat released from the heating means or the like. As a result, it is possible to prevent adverse effects on the surroundings due to the high temperature.

According to a second aspect of the present invention, there is provided a temperature control device comprising:
The temperature control device according to the first aspect of the present invention is characterized in that the temperature control device further comprises a plate cooling means for cooling the heat shielding plate. According to the above configuration, the exterior cover is prevented from being directly exposed to the heat released from the heating means and the like by the heat shielding plate, and the temperature rise of the thermal shielding plate is suppressed by the plate cooling means. In this case, a remarkable increase in the surface temperature can be suppressed, so that adverse effects on the surroundings due to the high temperature can be prevented.

A temperature control device according to a third aspect of the present invention includes a tank for storing a temperature fluid, a pump for circulating the temperature fluid, heating means for heating the temperature fluid, and cooling means for cooling the temperature fluid. A temperature control device for circulating a heated or cooled temperature fluid between the temperature-controlled object and controlling the temperature of the temperature-controlled object, comprising: an end portion of the heating means having a lamp as a heat source; A light shielding plate is provided between the heating means and an exterior cover that covers an end of the heating means. According to the above configuration, a light-shielding plate is provided between the heating unit and the exterior cover to prevent light from the heating unit from being irradiated to the exterior cover.
It is possible to suppress a remarkable rise in the surface temperature of the outer cover, and to prevent adverse effects on the surroundings due to the high temperature.

A temperature controller according to a fourth aspect of the present invention includes a tank for storing a temperature fluid, a pump for circulating the temperature fluid, heating means for heating the temperature fluid, and cooling means for cooling the temperature fluid. A temperature control device for circulating a heated or cooled temperature fluid between the temperature controlled object and controlling the temperature of the temperature controlled object, including a block cooled by cooling water, It is characterized by providing parts that dislike high temperature in the enclosed space. According to the above configuration, the temperature of the space surrounded by the block is low. Therefore, by disposing components that dislike high temperature in this space, it is possible to adopt inexpensive electrical components that are vulnerable to heat. Thus, it is possible to achieve a reduction in manufacturing costs.

[0017]

DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS Hereinafter, the present invention will be described in detail with reference to the drawings showing one embodiment. FIGS. 1 to 8 circulate and supply a temperature fluid to a vacuum chamber (temperature-controlled object) which is applied to a temperature control device according to the present invention when performing various semiconductor processes on a semiconductor wafer. Shows an embodiment applied to a temperature control device for constantly maintaining a semiconductor wafer at a target temperature according to its execution processing.

As shown in FIG. 8, this temperature control device 1
A fluid circulation supply system 2 for circulating the temperature fluid to the vacuum chamber C by operating the pump P is provided.

The fluid circulating supply system 2 includes a tank 10, a pump 20, and a cooler in this order from the outlet side of the vacuum chamber C.
(Cooling means) 30 and halogen lamp heater (heating means)
40 are interposed.

The tank 10 constituting the fluid circulating supply system 2 is provided with float switches S1 and S2 for monitoring the amount of the temperature fluid, and further includes a suction pressure cap Cs and a discharge pressure cap Cs. Cd and drain line 10D with stop valve DV interposed
Are provided.

Downstream of the pump 20 in the fluid circulation supply system 2, an air vent plug Ap and a pressure gauge P1 for checking the pump pressure are provided.

The cooler 3 in the fluid circulation supply system 2
The upstream portion and the downstream portion are connected to each other by a bypass passage 2b, and a flow rate sensor F for displaying a flow rate is interposed in the bypass passage 2b.

Further, the halogen lamp heater 40 includes:
A temperature switch TS for interlock is provided,
Downstream of the halogen lamp heater 40, a temperature sensor T for controlling temperature is provided.

The inlet side of the tank 10 and the outlet side of the halogen lamp heater 40 in the fluid circulation supply system 2 have an inlet side valve block VBi and an outlet side valve block VB manually operated by an operator.
o are provided respectively.

The inlet side valve block VBi includes an inlet passage Bi having an inlet side stop valve SVi interposed therebetween.
Inlet passage B with purge stop valve SVp interposed
and a purge passage Bp that merges with i.

The outlet valve block VBo is connected to an outlet passage Bo having an outlet stop valve SVo interposed therebetween.
And a purge passage Bd branched from the outlet passage Bo with a purge stop valve SVd interposed therebetween.

On the other hand, the circulation heating / cooling system 1
A heat exchange fluid circulation system 3 that circulates and supplies cooling water as a heat exchange fluid to the cooler 30 is provided.

The heat exchange fluid circulation system 3 has a supply passage 3i for supplying cooling water to the cooler 30 and a discharge passage 3o for discharging cooling water from the cooler 30. Is provided with a radiator-side proportional valve 51.

The upstream of the radiator-side proportional valve 51 in the supply passage 3i and the discharge passage 3o are communicated with each other by a bypass passage 3b. The bypass passage 3b has a bypass-side proportional valve. 52 is interposed.

A flow ratio adjusting means for adjusting the flow ratio of the cooling water passing through the cooler 30 and the cooling water passing through the bypass passage 3b by the radiator side proportional valve 51 and the bypass side proportional valve 52 described above. Is configured.

The supply passage 3i of the heat exchange fluid circulation system 3 is provided with a pressure gauge P2 for checking the cooling water inlet pressure, and the discharge passage 3o is provided with an interlock flow rate switch FS and Constant flow valve CV for flow setting
And a pressure gauge P3 for checking the cooling water outlet pressure.

Further, a motor cooling block 80, which will be described in detail later, is interposed in the supply passage 3i of the heat exchange fluid circulating system 3, and between the motor cooling block 80 and the discharge passage 3o. Water-cooled tube detailed later
(Plate cooling means) 91 is connected.

Here, the above-described temperature control device 1 includes a heater control unit and a valve control unit (not shown).

[0034] The heater control unit determines the halogen temperature based on a preset target temperature and the temperature of the temperature fluid after passing through the halogen lamp heater 40 detected via the temperature sensor T of the fluid circulating supply system 2. The output of the lamp heater 40 is controlled. Specifically, the duty ratio of the lamp lighting time and the light emission amount are appropriately adjusted.

Further, the valve control unit is configured to control the radiator-side proportional valve 51 and the bypass-side proportional valve based on the lamp output control signal from the heater control unit, the target temperature, the temperature of the temperature fluid detected by the temperature sensor T, and the like. The opening of each of the valves 52 is controlled.

The specific operation mode and control method in the above-mentioned temperature control device 1 are described in “Circulation type heating / cooling system” previously filed by the present applicant (Japanese Patent Application No. 11-308996).
Since there is basically no difference from the above, a detailed description of the operation mode and control method of the temperature control device 1 according to the present invention will be omitted.

On the other hand, as is apparent from FIGS. 3 to 7, the temperature control device 1 according to the present invention includes the above-described tank 10,
Each component such as the pump 20, the cooler 30, the halogen lamp heater 40 and the like is arranged side by side on the base frame 1B in the horizontal direction and connected to each other via various blocks.

As shown in FIGS. 3 and 4, a tank 10 is installed at the front (left end in the figure) of the base frame 1B. On the front wall of the tank 10, an inlet valve block VBi, an outlet valve block VBo, a drain pipe 1
0D and an air bleeding plug Ap are provided, and a tank level gauge 10L is further mounted.

At the rear of the tank 10 (left side in FIG. 3) and on the right side of the base frame 1B (lower side in FIG. 3),
A pump 20 is provided, and a pump driving motor 21 is mounted behind the pump 20 via a coupling 22.

The pump 20 includes a first connection block 61
Through the flow path (not shown) formed in the first connection block 61, the tank 1
The temperature fluid within 0 is supplied to the pump 20.

A cooler 30 is installed behind the tank 10 (left side in FIG. 3) and substantially at the center of the base frame 1B so as to extend in the front-rear direction of the base frame 1B. .

Also, behind the tank 10 (left side in FIG. 3) and on the left side of the base frame 1B (upper side in FIG. 3).
Is provided with a halogen lamp heater 40 so as to extend in the front-rear direction of the base frame 1B.

The cooler 30 is connected to the pump 20 via the tank 10 and the second connection block 62,
Through a flow path (not shown) formed in the tank 10 and the second connection block 62, the pump 20
Is supplied with a temperature fluid.

The tank 10 has a flow path (not shown) connecting the pump 20 and the second connection block 62 and a flow path (not shown) connecting the flow path and the air vent plug Ap. Is formed.

The halogen lamp heater 40 is connected to the cooler 30 via a third connection block 63,
Channel (not shown) formed in the third connection block 63
, The temperature fluid is supplied from the cooler 30 to the halogen lamp heater 40.

Here, the second connection block 62 and the third
The connection block 63 is connected to the connection passage 63 by a pipe 60P constituting a bypass passage 2b (see FIG. 8). After the temperature fluid branched in the second connection block 62 is merged in the third connection block 63, the halogen fluid heater 40 Supplied to

The halogen lamp heater 40 is connected to the tank 10, and the temperature fluid discharged from the halogen lamp heater 40 passes through a flow path (not shown) formed in the tank 10 and passes through the outlet side. It is supplied to the vacuum chamber C via the valve block BVo. Incidentally, the temperature fluid circulated from the vacuum chamber C is supplied to the tank 10 via the inlet side valve block BVi.

On the other hand, at the rear of the tank 10 (to the left in FIG. 3) and substantially at the center of the base frame 1B, the space between the above-described pump driving motor 21 and the cooler 30 is divided. In a mode extending in the front-back direction of 1B,
A cooling water supply block 70 is provided.

On the left side (the right side in FIG. 7) of the cooling water supply block 70, a cooler 30 is connected.
A radiator-side proportional valve 51 and a bypass-side proportional valve 52 are connected via a first connection block 71 to the right side surface (the left side surface in FIG. 7) of the cooling water supply block 70.

On the right side (left side in FIG. 7) of the cooling water supply block 70, a cooling block 80 for cooling the pump driving motor 21 is mounted.

The cooling block 80 has an opening for accommodating the front part of the pump driving motor 21, and has a shape surrounding the front part of the pump driving motor 21. A cooling water passage (not shown) is formed around the periphery of the pump driving motor 21, and the temperature of the cooling water passes through the cooling water passage. The motor 21 is efficiently cooled.

The cooling water supplied to the cooling water supply block 70 flows into the cooling block 80 through a flow path (not shown) of the cooling water supply block 70, and after passing through the cooling block, the cooling water is cooled. The water flows into the first connection block 71 through a flow path (not shown) of the water supply block 70.

The cooling water flowing into the first connection block 71 passes through the branch flow path (not shown) of the first connection block 71, passes through the radiator-side proportional valve 51, and then flows through the first connection block 71. It is supplied to the cooler 30 through a path (not shown).

On the other hand, the branch flow path of the first connection block 71
(Not shown), flows into the bypass proportional valve 52, and the cooling water that has passed through the bypass proportional valve 52 flows into a flow path (not shown) of the cooling water supply block 70, 3
After the cooling water is discharged from the cooling water supply block 70 and flows into a flow path (not shown) of the cooling water supply block 70, the cooling water flows into the flow path (not shown) of the second connection block 72 attached to the upper part of the cooling water supply block 70. (Not shown).

At the upper part of the cooling water supply block 70,
A third connection block 73 having a flow switch FS and a constant flow valve CV interposed therebetween is mounted between the second connection block 72 and the cooling water flowing into the flow path of the second connection block 72. After passing through the FS and the constant flow valve CV, the gas is discharged through a flow path (not shown) of the third connection block 73.

FIGS. 1 and 2 show the appearance of a temperature control device 1 according to the present embodiment. The components described above include a front plate 1F and a rear plate 1R, a top plate 1T and left and right side plates 1S. It is covered by an exterior cover 1C composed of an integrated main cover 1M.

The front plate 1F and the rear plate 1R are shown in FIG.
5, the main cover 1M is detachably attached to the front plate 1F, the rear plate 1R, and the base frame 1B. Also, the front plate 1F and the rear plate 1R
The left and right side plates 1S of the main cover 1M have a large number of heat-dissipating slits 1s.

An access door 1D for covering the cap of the tank 10 is provided on the top plate 1T of the main cover 1M so as to be openable and closable, and three openings 1o for observing the pressure gauges P1, P2, P3. Are formed. Carrying handles 1H are attached to left and right side plates 1S of the main cover 1M, respectively.

Reference numeral 1G in FIG. 1 is a guard plate for protecting the inlet-side valve block VBi, outlet-side valve block VBo, and the like. Reference numeral 1P in FIG. 2A is a halogen lamp. The access panel is removed when the lamp of the heater 40 is replaced.

As described above, in the temperature control device 1 according to the present invention, the tank 10, the pump 20, the cooler 30
By arranging the respective components such as the halogen lamp heater 40 and the like in the horizontal direction, the appearance can be made as thin as possible. As is clear from FIGS. It has a flat appearance with reduced size.

As described above, by making the appearance as thin as possible, the upper space of the temperature control device 1 can be effectively utilized, and the temperature control device can be provided immediately below the manufacturing device in the clean room. 1, it is possible to reduce the floor area of the clean room, in other words, it is possible to reduce the size of the clean room itself.

By installing the temperature control device 1 immediately below the manufacturing device, the length of the circulating fluid pipe connecting the temperature control device 1 and the manufacturing device (chamber) can be reduced,
Thus, heat loss from the circulating fluid pipe can be suppressed.

In a down-flow clean room, the temperature control device 1 is placed on the floor, so that contamination of the clean room due to dust from the temperature control device 1 can be eliminated. Because the position of the center of gravity is low, vibration during operation is small, so that it can be installed near a device that requires precise positioning.

On the other hand, as shown in FIG. 9, a heat shield plate 90 for covering the above-described tank 10, pump 20, cooler 30, and halogen lamp heater 40 is provided inside the outer cover 1C in the above-described temperature control device 1. Is provided.

This heat shielding plate 90 has a top plate 90T, a front plate 90F, a right plate 90R and a left plate 90L as shown in FIG. 10, and is provided on the front plate 1F and the rear plate 1R as shown in FIG. To the plurality of brackets 1b
It is attached by screwing the edge of the top plate 90T.

The top plate 90T of the heat shielding plate 90 has openings 90a and 90b for exposing the float switches S1 and S2, an opening 90c for exposing the cap 10C of the tank 10, and a pressure gauge P1. 90d is formed. In addition, front plate 90F
A cutout is formed in the left side plate 90L to prevent interference with other components.

Further, the top plate 90T of the heat shielding plate 90
Is provided with a water-cooling tube 91 as a cooling means. The water-cooling tube 91 is formed to bend over the entire area of the top plate 90T, and is fixed to the upper surface of the top plate 90T using a plurality of staples 1s. Have been.

As shown in FIG. 9, one end of the water cooling tube 91 is connected to the motor cooling block 8 through a joint 90i.
0, and the other end is connected to the third connection block 73 via the joint 90o. The cooling water branched from the flow path (not shown) of the motor cooling block 80 is circulated to the heat shielding plate 90. Is configured to cool.

Here, when the heat shielding plate 90 and the water cooling tube 91 are not provided, the outer cover 1C is directly exposed to the heat radiated from the halogen lamp heater 40 and the like, so that the surface of the outer cover 1C is exposed. The temperature rises significantly and can cause various adverse effects due to the high temperature around the device.

In order to solve the above-mentioned inconvenience, it is necessary to provide a large heat radiation space between the components such as the halogen lamp heater 40 and the outer cover 1C covering the components. Will be bigger.

On the other hand, as described above, the outer cover 1
By providing the heat shield plate 90 inside C, it is possible to prevent the exterior cover 1C from being directly exposed to heat emitted from the halogen lamp heater 40 and the like. Since the rise in temperature is suppressed by the function, the remarkable rise in the surface temperature of the outer cover 1C can be suppressed, and according to the temperature control device 1 according to the present invention, the adverse effect on the surroundings due to the high temperature is prevented. be able to.

Further, according to the above configuration, the outer cover 1 is provided by installing the heat shielding plate 90 and the water cooling tube 91.
Since the temperature rise of C can be prevented, the appearance of the temperature control device 1 can be made as compact as possible as compared with a configuration in which a large heat radiation space is provided between the halogen lamp heater 40 and the like and the outer cover 1C. .

Here, the heat shielding plate 90 is the same as that shown in FIG.
As shown in FIG. 0, the front cover 90F, the right side plate 90R, and the left side plate 90L are provided at the edge of the top plate 90T to effectively capture heat emitted from the halogen lamp heater 40 and the like, so that the exterior cover 1C It is configured not to be exposed to heat released from the halogen lamp heater 40 and the like.

Further, the heat shielding plate 90 is provided as shown in FIG.
9, a notch 90N is formed at a corner of the top plate 90T, and the edges 90x and 90y of the notch 90N are respectively connected to a cooling water supply block 70 (see FIG. 3) and a motor cooling block 80 (see FIG. 9). See).

Here, a part of the hot air captured by the heat shielding plate 90 as described above is transferred to the notch 90 of the top plate 90T.
By escaping from N, it is possible to prevent the portion covered with the heat shielding plate 90 from becoming too hot due to heat trapped therein.

The cooling water supply block 70 and the motor cooling block 80 are both low in temperature due to the flow of cooling water through internal flow paths (not shown).
When the hot air escapes from the edges 90x and 90y of the notch 90N at T, the temperature of the hot air escaping from the heat shielding plate 90 decreases by touching the cooling water supply block 70 and the motor cooling block 80. The temperature rise of 1C can be suppressed.

It is preferable that the openings 90a to 90d of the above-mentioned heat shielding plate 90 have a gap as small as possible with the cap 10C or the like so that the captured hot air does not escape upward.

If the heat is too deep in the heat shield plate 90, the gap between the heat shield plate 90 and the cap 10C or the like can be set wide so as to actively release the hot air. Therefore, by forming an opening at a specific location, it is possible to prevent the temperature of the heat shielding plate 90 from locally increasing.

Further, it is effective to lay out the water cooling tube 91 attached to the top plate 90T of the heat shielding plate 90 so that the portion where the temperature is expected to rise due to the heat trap is sufficiently cooled. .

On the other hand, as shown in FIGS. 11 and 12, the end of the halogen lamp heater 40 and the exterior cover 1C facing the end of the halogen lamp heater 40, more specifically, the rear panel 1R (access panel 1P). A light shielding plate 40P for blocking light from the halogen lamp heater 40 and preventing the rear plate 1R from being irradiated with light is provided therebetween.

When the light-shielding plate 40P is not provided, the light from the halogen lamp heater 40 is directly applied to the rear plate 1R, so that the surface temperature of the rear plate 1R is significantly increased. Therefore, various adverse effects due to the high temperature may be caused around the device.

Further, in order to solve the above inconvenience, it is necessary to provide a large heat radiating space of, for example, about 10 cm between the end of the halogen lamp heater 40 and the rear plate 1R. turn into.

On the other hand, as described above, the light shielding plate 40P is located between the end of the halogen lamp heater 40 and the rear plate 1R.
And the light from the halogen lamp heater 40 is
R is prevented from being irradiated to the rear plate 1R
In this case, according to the temperature control device 1 of the present invention, it is possible to prevent adverse effects on the surroundings due to high temperatures.

As shown in FIG. 11, the gap t1 between the halogen lamp heater 40 and the light shielding plate 40P is set to about 15 mm so that the temperature at the end of the halogen lamp heater 40 does not increase. T2 between the rear plate 1R and the rear plate 1R
It is set to around 10mm to prevent transmission to

As described above, by providing the light shielding plate 40P between the halogen lamp heater 40 and the rear plate 1R,
The end of the halogen lamp heater 40 and the rear plate 1R can be made as close as possible, and according to the temperature control device 1 according to the present invention, the appearance can be made as compact as possible. It becomes possible.

On the other hand, as shown in FIGS. 3, 4 and 7,
In a space surrounded by the cooling water supply block 70 and the motor cooling block 80, various electrical components that are easily affected by heat, such as the connector Ec and the harness Eh, are arranged as is clear from FIG.

Here, the cooling water supply block 70 and the motor cooling block 80 are both at low temperatures because cooling water flows through internal flow paths (not shown). The space surrounded by the block 80 is a low-temperature space inside the exterior cover 1C.

For this reason, the connector Ec and the harness Eh disposed in the space are not expensive products with high heat-resistant temperature but ordinary low-cost products.

As described above, in the temperature control apparatus 1 according to the present invention, it is possible to use inexpensive electric parts that are weak against heat, even if the apparatus is heated to a high temperature during operation, thereby reducing manufacturing costs. Can be achieved.

It goes without saying that in the space surrounded by the cooling water supply block 70 and the motor cooling block 80, not only the above-described heat-sensitive electric parts but also various parts that dislike high temperatures can be arranged.

On the other hand, as shown in FIG. 13 to FIG.
F, a temperature fluid introduction hole 10i is formed and the side wall 10
A temperature fluid outlet 10o is formed in S,
A float switch S1 for warning of replenishment and the like and a float switch S2 for interlock are provided.

An inlet side valve block BVi (not shown) (see FIG. 3) is attached to the outer surface of the front wall 10F so as to face the temperature fluid introduction hole 10i.
A first connection block 61 (see FIG. 3) (not shown) is attached to the outer surface of S facing the temperature fluid discharge port 10o.

The deenergizing member 11 is provided on the bottom wall 10B of the tank 10 so as to face the front of the temperature fluid inlet 10i.
Is attached. The deenergizing member 11 includes a face plate 11
are formed by zigzag bending a punching metal having a number of small holes 11o, 11o,. The screw 1
It is fixed to the bottom wall 10B of the tank 10 by 1 s.

Further, on the side wall 10S of the tank 10,
The wave suppressing member 12 is attached to the inner wall surface. As shown in FIG. 16, the wave suppressing member 12 has a substantially rectangular wave suppressing plate 12P and a mounting bracket 12B extending upward from the wave suppressing plate 12P. As shown in FIGS. 13 and 14, the wave suppressing plate 12P is installed above the temperature fluid discharge port 10o so as to spread out on a horizontal plane.

Further, as shown in FIGS. 13 and 14, the wave suppressing plate 12P is located immediately above the temperature fluid discharge port 10o so as to contact the opening edge of the temperature fluid discharge port 10o. It has a shape that expands to the full inner width of the tank 1.

Here, when the deenergizing member 11 and the wave suppressing member 12 are not attached to the tank 10, the temperature fluid flows vigorously from the temperature fluid introduction port 10i, and is stored inside the tank 10. The liquid surface of the flowing temperature fluid is waved and rises and falls violently.

At this time, if the amount of the temperature fluid stored in the tank 10 is small, the temperature fluid outlet 10o is exposed due to the rise and fall of the liquid level, and air is sucked from the temperature fluid outlet 10o. However, there is a disadvantage that the pump 20 is damaged.

In order to eliminate such inconvenience, the temperature fluid discharge port 10o should be taken into account in consideration of the liquid fluid runaway (up and down movement) of the temperature fluid.
In order to raise the liquid level to a sufficiently high position, there is a method of setting the height of the tank 10 large, or a method of installing the pump 20 below the tank 10. However, there is a problem that it becomes bulky.

On the other hand, the deenergizing member 11
And the wave suppressing member 12 are attached, the temperature suppressing member 12P of the wave suppressing member 12 allows the temperature fluid outlet 1
0o Since the suction of air from above is prevented, the temperature fluid outlet 10
It is possible to set the lower limit of the liquid level just above o, thereby making it possible to set the size of the tank 10 in the height direction small, thereby achieving the thinnest possible temperature control device 1. Can be.

Further, the wave suppression plate 12P provided immediately above the temperature fluid discharge port 10o acts as a guide for the temperature fluid, so that the temperature fluid in the tank 10 flows into the temperature fluid discharge port 10o smoothly.

The temperature fluid flowing from the temperature fluid inlet 10i impinges on the deenergizing member 11 so that the power is attenuated, thereby suppressing the liquid surface from waving. Therefore, the function of the wave suppressing plate 12P is further improved. Will be encouraged.

Further, as described above, the ripple of the temperature fluid is suppressed by the deenergizing member 11, so that the malfunction of the float switches S1 and S2 due to the ripple of the temperature fluid is prevented.

The tank 10 'shown in FIG. 17 is provided with a cylindrical tube 13' extending vertically, and a float Sf 'of a funnel switch S' is vertically movable on the tube 13 '. Is housed.

The upper and lower peripheral surfaces of the cylindrical body 13 'are provided with the cylindrical body 13' associated with the vertical movement of the float Sf '.
A small hole 13o 'communicating between the inside and the outside of the cylindrical body 13' is provided to compensate for the internal pressure fluctuation.

The low plate 10B 'of the tank 10' has
An extinguishing member 11 ′ made of a punching metal or the like is provided facing the temperature fluid introduction hole 10 i ′ formed in the front wall 10 F ′.

According to the tank 10 'having the above-described structure, the runaway of the temperature fluid is blocked by the cylindrical body 13'.
The float Sf 'accommodated in the cylindrical body 13' is less likely to be affected by the liquid turbulence of the temperature fluid, and the accuracy of detecting the liquid level by the float switch S 'is greatly improved.

The small holes 13 in the cylindrical body 13 '
The diameter of o 'is such that the liquid level in the cylinder 13' is
It is needless to say that the dimensions are appropriately set so as to be the average of the wavy liquid surface inside.

It is needless to say that not only the illustrated cylindrical body but also a cylindrical body having various cross-sectional shapes such as a square cylinder can be used as the cylindrical body 13 '.

Here, in order to enable accurate liquid level detection by the float switch, the shape of the tank is devised to create a stagnation in which the temperature fluid does not flow vigorously, and the float switch is disposed here. A configuration is also conceivable.

According to this configuration, it is possible to accurately detect the liquid level by the float switch without devising a separate component just by devising the shape of the tank.

Further, by setting the float of the float switch to be heavy, it is possible to suppress the size of the tank in the height direction. That is, a heavy float sinks deeper than a normal float and has a smaller dimension protruding from the liquid surface, so that the dimension in the height direction of the tank can be suppressed, and the temperature controller 1 can be made more compact. It is connected.

By the way, the tank 10 of the temperature control device 1
Is for absorbing expansion / contraction of the temperature fluid due to heating / cooling, and in order to prevent the internal pressure from becoming too high or negative pressure, as shown in FIG. A relief valve such as Cd and a suction pressure cap Cs is provided.

When the internal pressure of the tank 10 becomes high, the heated temperature fluid becomes a part of gas and is blown out together with the air in the tank 10 via the relief valve. Since the outside air temperature is low, the gaseous temperature fluid contained in the discharged air is condensed in a relief valve close to the outside air temperature or in a pipe connecting the tank 10 and the relief valve, and becomes a liquid, There was an inconvenience of leaking out.

As described above, when the temperature fluid is discharged together with the gas from the tank 10, the temperature fluid circulating in the temperature control device 1 decreases with the operation, so that replenishment is required, and the environment is adversely affected. There was a fear that it would.

Therefore, in the temperature control device 1 of the embodiment, as shown in FIG. 18, the relief valve (discharge pressure cap) Vr is directly connected to the cap 10C of the tank 10 with the outlet Vo facing upward. Attached to.

According to the above configuration, the gaseous temperature fluid contained in the air discharged from the tank 10 is supplied to the relief valve V
r, the liquid is condensed into a liquid.
Since the outlet Vo of r is directed upward, only air is discharged from the outlet Vo, and the temperature fluid that has become a liquid is returned into the tank 10 by its own weight.

In the embodiment shown in FIG. 19, the relief valve Vr is connected to the cap 10C of the tank 10 and the pipe V
The pipe Vp is connected to the pipe Vp, and the pipe Vp is arranged so as to be inclined downward toward the cap 10C.

According to the above configuration, the gaseous temperature fluid contained in the air discharged from the tank 10 is supplied to the relief valve V
In the pipe Vp before reaching r, only the air is discharged from the outlet Vo of the relief valve Vr, and the temperature fluid that has become a liquid flows down the pipe Vp and returns to the tank 10.

As described above, according to the configurations shown in FIGS. 18 and 19, only the air is discharged from the relief valve Vr to the outside, so that the replenishment of the temperature fluid accompanying the operation of the temperature control device 1 becomes unnecessary. Also, since the temperature fluid is not discharged to the outside, it leads to environmental protection.

In the embodiment shown in FIG. 19,
The pipe Vr is connected to, for example, a motor cooling block 80 (see FIG. 3).
And forcibly cooling it, the temperature fluid can be reliably liquefied in the pipe Vr, and a great effect can be obtained in discharging and discharging only air from the relief valve Vr.

On the other hand, when the temperature control device 1 having the above-described configuration is started, the temperature control target chamber C, the chamber 10 to be controlled, and the chamber C and the temperature control device 1 are started. It is also necessary to fill the circulating fluid pipe connecting with the temperature fluid with the temperature fluid.

Here, the supply of the temperature fluid is performed by the temperature control device 1.
Since the tank 10 is made small in order to absorb the expansion / contraction of the temperature fluid, the entire system including the chamber C and the circulating fluid piping is filled with the temperature fluid. Must supply the temperature fluid to the tank 10 many times.

Further, in the operation of charging the temperature fluid, in order to prevent the pump 20 from being damaged by idling, the tank 1
It is necessary to stop the pump 20 before 0 becomes empty,
Every time the temperature fluid is supplied to the tank 10, the operation of the pump 20, the confirmation of the amount of the temperature fluid, and the stop of the pump 20 must be repeated, which has a disadvantage that an extremely complicated operation is required.

When the temperature control device 1 is started,
After filling the entire system with the temperature fluid as described above, it is necessary to adjust the level of the temperature fluid in the tank 10 to a specific range in consideration of expansion / contraction of the temperature fluid accompanying heating / cooling during operation. is there.

This liquid level adjustment is performed by draining the temperature fluid from the drain pipe 10D (see FIGS. 2 and 3) provided in the tank 10. For this purpose, the drain pipe 10D is Since it is provided at the lower part, the operation of liquid level adjustment may be complicated.

For example, when the temperature control device 1 is installed on the floor, the space between the floor surface and the drain line 10D is narrow, so that the air is discharged from the drain line 10D using a short container. Although it receives the temperature fluid, the short container has a small content as a whole, so that the temperature fluid must be frequently transferred to another large container, and there is a disadvantage that an extremely complicated operation is forced.

The liquid filling jig 10 shown in FIGS.
Numeral 0 is provided to solve the above-mentioned inconvenience. This liquid filling jig 100 is composed of a large tank 101 for storing a temperature fluid, and an introduction pipe 102 provided at the bottom of the tank 101. Is provided.

The tank 101 has a cylindrical shape with an open top and an open bottom, and has a sufficient temperature fluid to supply the entire system including the tank 10, the chamber C, and the circulating fluid pipe of the temperature control device 1. Has an internal capacity capable of storing water.

The introduction pipe 102 is attached to a liquid supply port (not shown) of the tank 10 in the temperature control device 1 and connects the tank 101 and the tank 10, and is opened and closed by a lever 103L. Stop valve 103
Is interposed.

A liquid return tube 104 is connected via a relief valve 105 upstream of the stop valve 103 in the introduction pipe 102, and a check valve for supplying air is provided downstream of the stop valve 103. 10
6 is attached.

The steps of filling the temperature fluid and adjusting the liquid level using the liquid filling jig 100 will be described with reference to FIG. 8 and FIGS.

First, the introduction pipe 102 of the liquid filling jig 100
Is attached to a liquid supply port (not shown) of the tank 10 in the temperature control device 1, and the liquid return tube 104 is connected to a purge passage Bd in the outlet valve block VBo of the temperature control device 1. The liquid return tube 1
04 is a purge passage Bp of the inlet side valve block VBi.
May be connected.

After attaching the liquid filling jig 100 to the temperature control device 1, the stop valve 103 is opened by operating the lever 103L, and a predetermined amount of temperature fluid is supplied to the tank 101 of the liquid filling jig 100. Next, after confirming that the inlet side stop valve SVi and the outlet side stop valve SVo are open, and that the purge stop valve SVp and the purge stop valve SVd are closed, the pump 20 is operated. The temperature fluid in the tank 101 is continuously supplied to the tank 10 of the temperature control device 1, and the entire system is filled with the temperature fluid.

As described above, the liquid filling jig 100
Is used, the temperature fluid stored in the large tank 101 can be continuously supplied to the tank 10 of the temperature control device 1, so that the entire system can be filled with the temperature fluid very easily. It becomes possible.

After the entire system is filled with the temperature fluid as described above, to perform the operation in the tank 10, the stop valve 103 is closed by operating the lever 103L of the liquid filling jig 100, and the pump of the temperature control device 1 is operated. Drive 20. Note that, while the pump 20 is operating, the stop valve 103 of the liquid filling jig 100 may be closed.

Next, in a state where the temperature fluid is circulated by the operation of the pump 20, the purge stop valve SVd provided in the purge passage Bd of the outlet side valve block VBo to which the liquid return tube 104 is connected is operated. open.

As a result, as shown by arrows a, b and c in FIG. 22, the excess temperature fluid in the tank 10 is transferred to the liquid filling jig 10 via the liquid return tube 104.
0, and the level of the temperature fluid in the tank 10 gradually decreases.

The liquid level meter 10L (see FIGS. 2 and 6) of the tank 10 is monitored, and when the liquid level reaches an intended level, the purge stop valve SVd is closed to adjust the liquid level. Is complete.

As described above, the liquid filling jig 100
By using the conventional method, a complicated operation caused by extracting the temperature fluid from the conventional drain pipe 10D becomes unnecessary, and thus, the liquid level adjustment operation of the temperature fluid can be performed extremely easily.

The excess temperature fluid in the tank 10 is
Since the liquid is returned to the tank 101 of the liquid holding jig 100 via the liquid return tube 104, the temperature fluid is not exposed to the outside at all at the time of liquid level adjustment, thereby leading to environmental protection.

Although the pressure of the temperature fluid returning to the tank 101 via the liquid return tube 104 is high, the relief valve 105 connected to the liquid return tube 104 is orthogonal to the introduction pipe 102 as shown in FIG. Since the temperature fluid is ejected from the relief valve 105 and is deenergized by colliding with the inner wall of the introduction pipe 102, the temperature fluid does not blow up into the tank 101.

On the other hand, the pump 2 constituting the temperature control device 1
0, when a non-self-priming centrifugal pump or the like is used, when the temperature control device 1 is started, when the entire system is filled with a temperature fluid, an air vent plug communicating with the discharge side of the pump 20 is used. It is necessary to release the Ap (see FIGS. 2 and 3), bleed the air in the pump 20, and fill the pump 20 with the temperature fluid.

Here, the above-described air bleeding operation is usually performed by
Since it is an independent operation, mistakes such as running the pump 20 while omitting the air bleeding operation and forgetting to close the air bleeding plug Ap after performing the air bleeding operation are likely to occur. There is a fear that the pump 20 may be damaged or the temperature fluid may leak out of the apparatus.

The liquid filling jig 20 shown in FIGS.
0 is provided to solve the above-mentioned inconvenience. This liquid filling jig 200 includes a tank 201 for storing a temperature fluid, and an introduction pipe 202 provided at the bottom of the tank 201. .

The tank 201 has a cylindrical shape with an open bottom and an upper end, and one end of an air release hose 203 is fixed. A quick coupler 204 is connected to the other end of the air release hose 203. Is provided.

The quick coupler 204 is connected to the air release plug Ap of the temperature control device 1. In the connected state, the quick coupler 204 opens the plug of the air release plug Ap which is normally closed.

In order to fill the temperature fluid and bleed the pump using the liquid filling jig 200 described above, first, the introduction pipe 202 of the liquid filling jig 200 is connected to the tank 10 of the temperature control device 1. Attach it to the liquid supply port (not shown) and connect the air release hose 203 to the quick coupler 20.
4 is connected to the air release plug Ap of the temperature control device 1.

After the liquid filling jig 200 is mounted on the temperature control device 1, about half the temperature fluid is supplied to the tank 201 of the liquid filling jig 200.

As a result, the temperature fluid in the tank 201 flows into the tank of the temperature control device 1 and enters the pump 20 from the tank 10, whereby the air in the pump 20 is pushed out, and the quick coupler 204 The liquid is discharged into the tank 201 of the liquid filling jig 200 via the air release hose 203.

After the pump is evacuated as described above, the air bleeding hose 203 is removed from the air bleeding plug Ap.
By repeatedly supplying the temperature fluid to the tank 201 of No. 00, the entire system is filled with the temperature fluid.

As described above, the liquid filling jig 200 described above is used.
, The tank 201 used for the filling operation of the temperature fluid
And the air bleeding hose 203 used for the air bleeding operation, and when the liquid filling jig 200 is set in the temperature control device 1, the tank 201 is attached to the tank 10;
Since the connection of the air bleeding hose 203 to the air bleeding plug Ap is set as one set, there is no need to forget the connection of the air bleeding hose 203 to the air bleeding plug Ap. An error such as damage to the pump 20 can be prevented beforehand.

Further, by using the quick coupler 204 to connect the air release plug Ap and the air release hose 203, it is possible to prevent the leakage of the temperature fluid due to forgetting to tighten the air release plug Ap after the work. it can.

[Brief description of the drawings]

1 (a) and 1 (b) are a plan view and a side view showing a temperature control device of the present invention.

FIGS. 2A and 2B are a front view and a rear view showing a temperature control device of the present invention.

FIG. 3 is a plan view showing an arrangement of each element constituting the temperature control device.

FIG. 4 is a front view showing an arrangement of each element constituting the temperature control device.

FIG. 5 is a rear view showing an arrangement mode of each element constituting the temperature control device.

FIG. 6 is a right side view showing an arrangement mode of each element constituting the temperature control device.

FIG. 7 is a left side view showing an arrangement mode of each element constituting the temperature control device.

FIG. 8 is a circuit diagram showing a configuration of a temperature control device according to the present invention.

FIG. 9 is a plan view showing an installation state of a heat shielding plate and a cooling unit.

FIG. 10 is an external perspective view showing a heat shielding plate and a cooling unit.

FIG. 11 is a side view conceptually showing an installation mode of a light shielding plate.

FIG. 12 is a perspective view conceptually showing an installation mode of a light shielding plate.

FIG. 13 is a plan view showing a tank of the temperature control device.

FIG. 14 is a sectional view taken along line XIV-XIV in FIG. 13;

FIG. 15 is a sectional view taken along line XV-XV in FIG. 13;

FIGS. 16 (a), (b) and (c) are a plan view, a side view and a rear view showing a wave suppressing member.

FIG. 17 is a cross-sectional side view of a main part showing another embodiment of the tank of the temperature control device.

FIG. 18 is a conceptual diagram showing an installation mode of a relief valve.

FIG. 19 is a conceptual diagram showing an installation mode of a relief valve.

FIG. 20 is a side view showing a liquid filling jig.

FIGS. 21A and 21B are a front view and a side view showing a state in which a liquid filling jig is mounted on the temperature control device.

FIG. 22 is a circuit diagram in a state where the liquid filling jig is mounted on the temperature control device.

FIGS. 23A and 23B are a top view and a side view showing a liquid filling jig.

FIG. 24 is a side view showing a state where a liquid filling jig is mounted on the temperature control device.

FIG. 25 is a plan view showing a heating device in a conventional circulation-type heating / cooling system.

FIG. 26 is a front view showing a heating device in a conventional circulation-type heating / cooling system.

FIG. 27 is a side view showing a heating device in a conventional circulation-type heating / cooling system.

[Explanation of symbols]

 DESCRIPTION OF SYMBOLS 1 ... Temperature control apparatus, 1C ... Exterior cover, 10 ... Tank, 20 ... Pump, 30 ... Cooler (cooling means), 40 ... Halogen lamp heater (Heating means), 40P ... Light shielding plate, 70 ... Cooling water supply block, 80: motor cooling block, 90: heat shielding plate, 91: water cooling tube (plate cooling means).

 ──────────────────────────────────────────────────続 き Continued on the front page (72) Inventor Takumi Sugihara 1200 Manda, Hiratsuka-shi, Kanagawa Prefecture, Komatsu Seisakusho Laboratories (72) Inventor Tsutomu Hatanaka 1200 Manda, Hiratsuka-shi, Kanagawa Pref. Terms (reference) 3L044 AA04 BA06 CA13 DB01 DD07 FA02 KA03 KA04 5H323 AA40 BB11 BB13 CA04 CB04 CB23 CB32 CB33 CB44 DA01 DA04 DB13 DB15 FF01 JJ06 KK05 MM09

Claims (4)

[Claims] A temperature fluid storage tank, a pump for circulating the temperature fluid, a heating means for heating the temperature fluid, and a cooling means for cooling the temperature fluid, wherein the heated or cooled temperature fluid is covered. A temperature control device that circulates between a temperature control object and a temperature control device that controls the temperature of the temperature control target object, the temperature control device being provided inside an outer cover, the tank, the pump, the heating unit, and the cooling unit. A temperature control device comprising a heat shield plate covering an upper part. 2. The temperature control device according to claim 1, further comprising plate cooling means for cooling the shielding plate. 3. A tank for storing a temperature fluid, a pump for circulating the temperature fluid, a heating means for heating the temperature fluid, and a cooling means for cooling the temperature fluid, wherein the heated or cooled temperature fluid is covered. A temperature control device that circulates between a temperature control object and controls the temperature of the temperature controlled object, wherein the temperature control device covers an end of the heating unit having a lamp as a heat source and an end of the heating unit. A temperature control device comprising a light-shielding plate provided between an exterior cover. 4. A tank for storing a temperature fluid, a pump for circulating the temperature fluid, a heating means for heating the temperature fluid, and a cooling means for cooling the temperature fluid, wherein the heated or cooled temperature fluid is covered. A temperature control device that circulates between a temperature controlled object and controls the temperature of the temperature controlled object, comprising a block cooled by cooling water,
A temperature control device characterized by providing a part that dislikes high temperature in a space surrounded by the block.