JP2002144224A5 - - Google Patents
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- Publication number
- JP2002144224A5 JP2002144224A5 JP2000345540A JP2000345540A JP2002144224A5 JP 2002144224 A5 JP2002144224 A5 JP 2002144224A5 JP 2000345540 A JP2000345540 A JP 2000345540A JP 2000345540 A JP2000345540 A JP 2000345540A JP 2002144224 A5 JP2002144224 A5 JP 2002144224A5
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- JP
- Japan
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2000345540A JP2002144224A (ja) | 2000-11-13 | 2000-11-13 | 遊離砥粒により研磨加工するための研磨装置及びその停止方法 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2000345540A JP2002144224A (ja) | 2000-11-13 | 2000-11-13 | 遊離砥粒により研磨加工するための研磨装置及びその停止方法 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JP2002144224A JP2002144224A (ja) | 2002-05-21 |
| JP2002144224A5 true JP2002144224A5 (hu) | 2007-12-27 |
Family
ID=18819558
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2000345540A Pending JP2002144224A (ja) | 2000-11-13 | 2000-11-13 | 遊離砥粒により研磨加工するための研磨装置及びその停止方法 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JP2002144224A (hu) |
Families Citing this family (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2012069897A (ja) * | 2010-08-27 | 2012-04-05 | Covalent Materials Corp | 半導体ウエハの研磨方法及び半導体ウエハ研磨装置 |
| JP5570065B2 (ja) * | 2010-09-17 | 2014-08-13 | グローバルウェーハズ・ジャパン株式会社 | 半導体ウエハの研磨方法及び半導体ウエハ研磨装置 |
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2000
- 2000-11-13 JP JP2000345540A patent/JP2002144224A/ja active Pending