JP2002144224A5 - - Google Patents

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Publication number
JP2002144224A5
JP2002144224A5 JP2000345540A JP2000345540A JP2002144224A5 JP 2002144224 A5 JP2002144224 A5 JP 2002144224A5 JP 2000345540 A JP2000345540 A JP 2000345540A JP 2000345540 A JP2000345540 A JP 2000345540A JP 2002144224 A5 JP2002144224 A5 JP 2002144224A5
Authority
JP
Japan
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP2000345540A
Other languages
Japanese (ja)
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JP2002144224A (ja
Filing date
Publication date
Application filed filed Critical
Priority to JP2000345540A priority Critical patent/JP2002144224A/ja
Priority claimed from JP2000345540A external-priority patent/JP2002144224A/ja
Publication of JP2002144224A publication Critical patent/JP2002144224A/ja
Publication of JP2002144224A5 publication Critical patent/JP2002144224A5/ja
Pending legal-status Critical Current

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JP2000345540A 2000-11-13 2000-11-13 遊離砥粒により研磨加工するための研磨装置及びその停止方法 Pending JP2002144224A (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP2000345540A JP2002144224A (ja) 2000-11-13 2000-11-13 遊離砥粒により研磨加工するための研磨装置及びその停止方法

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2000345540A JP2002144224A (ja) 2000-11-13 2000-11-13 遊離砥粒により研磨加工するための研磨装置及びその停止方法

Publications (2)

Publication Number Publication Date
JP2002144224A JP2002144224A (ja) 2002-05-21
JP2002144224A5 true JP2002144224A5 (cg-RX-API-DMAC7.html) 2007-12-27

Family

ID=18819558

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2000345540A Pending JP2002144224A (ja) 2000-11-13 2000-11-13 遊離砥粒により研磨加工するための研磨装置及びその停止方法

Country Status (1)

Country Link
JP (1) JP2002144224A (cg-RX-API-DMAC7.html)

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2012069897A (ja) * 2010-08-27 2012-04-05 Covalent Materials Corp 半導体ウエハの研磨方法及び半導体ウエハ研磨装置
JP5570065B2 (ja) * 2010-09-17 2014-08-13 グローバルウェーハズ・ジャパン株式会社 半導体ウエハの研磨方法及び半導体ウエハ研磨装置

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