JP2002141656A5 - - Google Patents
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- Publication number
- JP2002141656A5 JP2002141656A5 JP2000332749A JP2000332749A JP2002141656A5 JP 2002141656 A5 JP2002141656 A5 JP 2002141656A5 JP 2000332749 A JP2000332749 A JP 2000332749A JP 2000332749 A JP2000332749 A JP 2000332749A JP 2002141656 A5 JP2002141656 A5 JP 2002141656A5
- Authority
- JP
- Japan
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2000332749A JP4577974B2 (ja) | 2000-10-31 | 2000-10-31 | フローはんだ付け方法および装置 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2000332749A JP4577974B2 (ja) | 2000-10-31 | 2000-10-31 | フローはんだ付け方法および装置 |
Publications (3)
| Publication Number | Publication Date |
|---|---|
| JP2002141656A JP2002141656A (ja) | 2002-05-17 |
| JP2002141656A5 true JP2002141656A5 (enExample) | 2007-11-01 |
| JP4577974B2 JP4577974B2 (ja) | 2010-11-10 |
Family
ID=18808917
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2000332749A Expired - Fee Related JP4577974B2 (ja) | 2000-10-31 | 2000-10-31 | フローはんだ付け方法および装置 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JP4577974B2 (enExample) |
Families Citing this family (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2003051671A (ja) * | 2001-06-01 | 2003-02-21 | Nec Corp | 実装構造体の製造方法および実装構造体 |
| WO2013089568A1 (en) | 2011-12-12 | 2013-06-20 | Iif Spółka Akcyjna | Method of making payment transaction via cellular telephone system and telecommunication system for conducting payment transactions |
Family Cites Families (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP3224185B2 (ja) * | 1994-09-29 | 2001-10-29 | 富士通株式会社 | はんだ合金及びはんだ粉末及びはんだペースト及びプリント配線板及び電子部品及びはんだ付け方法及びはんだ付け装置 |
| JP3414263B2 (ja) * | 1998-06-04 | 2003-06-09 | 株式会社日立製作所 | 電子回路基板の製造方法 |
| JP2000244108A (ja) * | 1999-02-22 | 2000-09-08 | Senju Metal Ind Co Ltd | プリント基板のはんだ付け方法、プリント基板のはんだ付け装置およびはんだ付け装置用冷却装置 |
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2000
- 2000-10-31 JP JP2000332749A patent/JP4577974B2/ja not_active Expired - Fee Related