JP2002141466A - Surface mounted component - Google Patents

Abstract

PROBLEM TO BE SOLVED: To integrate electronic components provided with different functions to be loaded on a mobile communication component and to perform miniaturization. SOLUTION: In this surface mounted component, a container structure is formed on the front and back of a substrate by forming a wall from the front and back of the periphery of the substrate, and a surface electrode is provided as an external terminal on at least the bottom surface of the container outer surface. An oscillator is constituted at one of the containers, and a surface acoustic wave device is constituted at the other container.

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a surface mounting component in which electronic components having different functions are mounted on the front and back of a multilayer ceramic container and can be operated individually or different electronic components can be connected to each other.

[0002]

2. Description of the Related Art In recent years, with the miniaturization and high performance of mobile communication devices, piezoelectric vibrators, piezoelectric oscillators, and surface acoustic wave devices have been required to efficiently mount piezoelectric components and mounted electronic components at high density. A container having a multilayer ceramic substrate layer is used.

As an example of the container structure, a multilayer ceramic substrate (plate) is laminated (laminated),
A donut-shaped substrate is bonded to a part of the ceramic substrate to form a concave portion, and electronic components (piezoelectric vibrator, semiconductor circuit, surface acoustic wave element) are mounted in the concave portion, thereby reducing the size of the container itself. Technology for reducing the thickness has been adopted.

On the other hand, taking a cellular phone typified by recent mobile communication equipment as an example, a temperature-compensated piezoelectric oscillator and a surface acoustic wave device are generally indispensable components. The temperature-compensated piezoelectric oscillator has a function as a reference frequency of a mobile phone, and the surface acoustic wave device has a function of ensuring channel separation of a communication transmission signal.

[0005]

As described above, mobile communication devices (especially mobile phones) have recently been required to be reduced in size, improved in performance and saved in power, while the temperature of mobile phones has been increasing. Compensated piezoelectric oscillators and surface acoustic wave devices are positioned as indispensable components. However, the two types of components (temperature-compensated piezoelectric oscillator and surface acoustic wave device) that are indispensable for the configuration of a mobile phone require the mounting of individual components in order to reduce the size, performance, and power consumption of the mobile phone. However, there is a problem that the current requirements are limited.

[0006]

In order to solve this problem, a container structure is formed on the front and back of the substrate by forming a wall from the front and back around the substrate, and external terminals are provided on at least the bottom surface (end surface) of the outer surface of the container. A surface mounting component having a surface electrode as a component, wherein one of the containers forms an oscillator and the other container forms a surface acoustic wave device. It is. In this case, the surface mounting component can operate and function the functions of the electronic components housed in the container on the front and back individually, and a surface electrode for connecting to each functional component is formed. Naturally, it is possible to perform the function of each individual electronic component housed on the front and back, and on the other hand, by connecting the electronic components housed and configured in the container on the front and back to each other, Another feature is that the mounting component can be used as a new additional function.

[0007] In short, by housing the temperature-compensated piezoelectric oscillator and the surface acoustic wave device, which are indispensable for a mobile phone, in a single container, it is possible to reduce the size and improve the performance required in the prior art.
It satisfies power saving and improves the overall characteristics of products by housing electronic components with different functions (here, temperature-compensated piezoelectric oscillator and surface acoustic wave device) in the same container form. It is also possible to do.

[0008]

Embodiments of the present invention will be described below with reference to the accompanying drawings. In each drawing, the same reference numeral indicates the same object. FIG. 1 is a partial cross-sectional view of a component for surface mounting according to the present invention. A wall is formed from the front and back of the periphery of a substrate 1 to form a container structure on the front and back of the substrate 1. 1 illustrates a form of a surface mounting component 5 having (not shown). In FIG. 1, as an example, a surface acoustic wave device 10 is mounted on a container structure portion above the substrate 1 to constitute a surface acoustic wave device 4, and a semiconductor component 11 and a piezoelectric vibrator are provided below the substrate 1 (on the mounting substrate surface). By mounting the piezoelectric oscillator 3 with 12 (crystal oscillator, etc.) mounted, it is possible to accommodate two electronic components (piezoelectric oscillator 3 and surface acoustic wave device 4) having different functions in one container. Is what you do. Here, the surface acoustic wave element 1
0 and the components of the oscillator are electrically connected to the surface mounting component 5 by a flip chip 6, a conductive adhesive (not shown), and wire bonding (not shown).
Since the internal structure of the surface mounting component 5 is complicated, a laminated substrate is used for the container. A lid 7 is joined to the surface mounting component 5 (solder sealing, seam sealing, silver brazing, etc.) to improve airtightness.

The different electronic components housed in the surface mounting component 5 are individually formed by operating the functions of the electronic components housed on the end faces of the front and back container structures, and the surface electrodes 2 for connection to the outside are formed. And electronic components having different functions can be used independently.

[0010] On the other hand, electronic components housed in front and back container structures can be connected to each other, and used as functional components for integrating electronic components having different functions.

FIG. 2 is a plan view in which a part of a lid (7a, 7b) is omitted for explaining the form of the surface mounting component of the present invention. FIG. FIG. 2B is a plan view as seen from the lower surface (the side where the piezoelectric oscillator 3 is housed). By providing a conductive portion formed by a metallizing process or the like on the side surface of the surface mounting component 5, conduction with the surface electrode 2 formed on the end surface (the upper surface portion and the lower surface portion of the container) of the surface mounting component 5 is achieved. I have. In addition, lids 7a and 7b (ceramic, metal plate, etc.) are put on and joined to the upper surface and the lower surface of the surface mounting component 5 in order to make the container part a closed structure. The joining is not limited by the adhesive, solder welding, seam welding and the like.

The present invention is a surface mounting component having a container structure formed on the front and back of the substrate by forming walls from the front and back of the periphery of the substrate, and having a surface electrode as an external terminal on at least an end surface of the outer surface of the container. In this embodiment, since one of the containers and the other container are electronic components having different functions and are housed in a closed container structure, the surface acoustic wave element 10 and the piezoelectric Although the description includes the combination of the oscillator 3, there is no limitation even if a piezoelectric vibrator alone is housed instead of the piezoelectric oscillator 3 or housed in combination with other electronic components.

[0013]

According to the present invention, by arranging electronic components having different functions in a single container, it is possible to achieve higher density mounting than before when the arrangement on the mounting board is considered. In addition, by integrating different functions in a single container, it is possible to correlate both electronic components, and further improve the quality.

[Brief description of the drawings]

FIG. 1 is a partial sectional view showing an internal structure of a surface mounting component of the present invention.

FIG. 2 is a plan view showing the concept of the container configuration of the present invention.

[Explanation of symbols]

 DESCRIPTION OF SYMBOLS 1 Substrate 2 Surface electrode 3 Oscillator 4 Surface acoustic wave device 5 Surface mounting component

Claims (5)

[Claims] 1. A surface mounting component having a container structure formed on the front and back of a substrate by forming walls from the front and back of the periphery of the substrate, and having a surface electrode as an external terminal on at least an end surface of an outer surface of the container. A surface mounting component, wherein electronic components having different functions are stored in one of the containers and the other of the containers to form a closed container structure. 2. A surface mounting component comprising a container structure formed on the front and back of the substrate by forming walls from the front and back of the periphery of the substrate, and having a surface electrode as an external terminal on at least an end surface of the outer surface of the container. A surface mounting component, wherein one of the containers forms an oscillator and the other of the containers forms a surface acoustic wave device. 3. The surface mounting component according to claim 1, wherein a surface electrode is formed for individually operating and functioning the functions of the electronic components housed and configured in the front and back containers. A surface mounting component which can be connected as individual electronic components housed on the front and back. 4. The surface mounting component according to claim 1, wherein the electronic components housed in the container on the front and back are connected to each other, so that the surface mounting component is integrated. A surface mounting component characterized by the following: 5. The surface mounting component according to claim 2,
A surface mounting component comprising only a piezoelectric vibrator instead of an oscillator.