JP2002141380A - Inspection equipment for semiconductor wafer - Google Patents

Abstract

PROBLEM TO BE SOLVED: To improve the reliability of an inspection without generating pressurizing force insufficiency, to perform application even to the inspection of a semiconductor wafer with the large number of contact points of a high density memory or the like with a margin, and to improve versatility and expandability. SOLUTION: In addition to a suction means 3 for sucking the semiconductor wafer W and probe terminals P or the like held by a cassette C housed in inspection equipment main body 2 by a negative pressure, a fluid pressurizing means 4 for pressurizing the semiconductor wafer W and the probe terminals P or the like by pressure fluid A is provided.

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a semiconductor wafer inspection apparatus for performing inspection by bringing probe terminals into contact with electrodes on a semiconductor wafer at once.

[0002]

2. Description of the Related Art Conventionally, there has been known a semiconductor wafer inspection apparatus for inspecting an initial failure by applying a temperature load to a semiconductor wafer (see Japanese Patent Application Laid-Open No. 11-284037).

[0003] This type of inspection apparatus employs a batch contact system in which probe terminals are collectively brought into contact with electrodes on a semiconductor wafer to perform an inspection. Therefore, a semiconductor wafer is held and the semiconductor wafer and the probe terminal are connected to each other. Is provided with a cassette for sucking the negative pressure by negative pressure. FIG. 9 shows the cassette C. The cassette C has a square-shaped cassette base 21. A reinforcing frame 22 is fixed to the lower peripheral edge of the cassette base 21, and a locking frame 23 is fixed to the upper peripheral edge of the cassette base 21. In addition, a cassette base 2 serving as a back surface of the cassette C
A plurality of one-side connectors 24 are disposed at predetermined positions on the lower surface of the cassette 1, and a disc-shaped contactor 25 containing a sub-heater is mounted on the upper surface of the cassette base 21. The semiconductor wafer W is held between the contactor 25 and the disc-shaped wafer tray 26.

In this case, the contactor 25 is a board for bringing a plurality of electrodes We on a semiconductor wafer W into contact with probe terminals (bumps) P at once as shown in a partially enlarged view in FIG. , A glass substrate 27 having conductor wiring connected to the one-side connector 24, an anisotropic conductive rubber 28 overlapping the glass substrate 27, and a thin film sheet overlapping the anisotropic conductive rubber 28 and having bumps B. Consists of 29. Are conductive portions of the anisotropic conductive rubber 28 having conductive particles.

On the other hand, on the outer peripheral surface of the disc-shaped wafer tray 26, an intake port mounting portion 30 protruding outward is provided, and a pair of a check valve is provided at the tip of the intake port mounting portion 30. The intake ports 31, 31 are attached (see FIG. 3). The directions of the intake ports 31 are radial with respect to the center of the cassette C.

In the cassette C thus configured, the suction state (negative pressure) between the wafer tray 26 and the contactor 25 is maintained by vacuum suction from the intake ports 31 in advance. The cassette base 21 is provided with a positioning portion (not shown) for the connection base 52 (see FIG. 2).

[0007]

In the cassette C described above, the number of contacts (the number of bumps) is usually 10,000 to 2
Therefore, variation in the height of the tip of each probe terminal P becomes a problem. For this reason, a predetermined negative pressure is generated between the wafer tray 26 and the contactor 25 by vacuum suction, and the predetermined contact pressure is set so that a contact failure between the electrodes We on the semiconductor wafer W and the probe terminals P does not occur. Is secured. Specifically, the pressing force per contact is 0.
1 [N] is required, so if the number of contacts is 10,000,
Vacuum suction is performed so that a pressing force of about 10000 × 0.1 = 1 [kN] is applied.

[0008] However, in the case of vacuum suction, the obtained pressure is limited to the atmospheric pressure at the maximum, so that for an 8-inch wafer, the maximum pressure is 2.5 [kN]. Therefore, if the number of contacts exceeds 25,000 points, there is a possibility that the pressure may be insufficient and the reliability of the inspection may be reduced. In addition, a high-density memory or the like having 40,000 to 60,000 contacts may be used. In the case of (1), since a pressing force of 4.0 to 6.0 [kN] is required, there is a problem that it cannot be applied practically.

The present invention has been made to solve the problems existing in the prior art, and can improve the reliability of inspection without causing insufficient pressurizing force, and can reduce the number of contacts of a high-density memory or the like. It is an object of the present invention to provide a semiconductor wafer inspection apparatus having high versatility and developability that can be applied to inspection of a large number of semiconductor wafers with a margin.

[0010]

SUMMARY OF THE INVENTION According to the present invention, a semiconductor wafer W is provided.
A semiconductor C comprising a cassette C for contacting the probe terminals P at once with the upper electrodes We, and an inspection apparatus main body 2 for accommodating the cassette C and connecting to the probe terminals P to inspect the semiconductor wafer W; When configuring the wafer inspection apparatus 1, the cassette C housed in the inspection apparatus main body 2
In addition to the suction means 3 for sucking the semiconductor wafer W and the probe terminals P... Held by the vacuum pressure, the semiconductor wafer W and the probe terminals P are pressurized by a pressure fluid (pressure air A, pressure liquid L). A pressure means 4 is provided.

In this case, according to a preferred embodiment, the fluid pressurizing means 4 comprises a regulating frame mechanism 11 for accommodating one or more cassettes C between a pair of regulating boards 12u and 12d.
Are inserted into gaps S formed between the pair of regulating plates 12u and 12d when the cassettes C are accommodated, and pressurized fluids (pressure air A and pressure liquid L) are press-fitted to pressurized surfaces Mf.
, And one or more fluid bags (air bags, liquid bags) 13u, 13m, 13d,.
It is also possible to provide a closed chamber 14 for accommodating b and Mc and supplying compressed air A. Note that the closed chamber 14 may house the entire cassette C,
It may be constituted by a combination of the chamber divided bodies 14u and 14d, and may accommodate a part of the cassette C.

Thus, between the semiconductor wafer W and the probe terminals P, in addition to the negative pressure (atmospheric pressure) from the inside by the vacuum suction using the suction means 3, the external pressure using the fluid pressurizing means 4 For example, even when the number of contacts exceeds 25,000 points, insufficient pressurizing force is avoided, and inspection of a semiconductor wafer having a large number of contacts such as a high-density memory is performed. It can also be applied to

[0013]

Next, preferred embodiments according to the present invention will be described in detail with reference to the drawings.

First, the configuration of a semiconductor wafer inspection apparatus 1 according to the present embodiment will be described with reference to FIGS.

FIG. 5 shows the appearance of the inspection apparatus main body 2 in the semiconductor wafer inspection apparatus 1. The inspection apparatus main body 2 includes an environmental test tank 42 having a plurality of entrances and exits 41 provided on a front panel 40. An equipment box 43 is provided on the right side of the environmental test tank 42. A display 45 and a pull-out keyboard (operation unit) 46 are arranged on a front panel 44 of the equipment box 43, and a housing for a computer or the like is provided below. 47 are provided. Reference numeral 48a denotes a touch panel display, 48b denotes a two-handed safety lock switch, and 48c denotes an emergency stop switch.

On the other hand, C is a cassette for holding the semiconductor wafer W, and is formed separately from the inspection apparatus main body 2 as shown in FIG. As described above, the configuration of the cassette C includes the cassette base 21 and the cassette base 2.
The reinforcing frame 22 is fixed to the peripheral edge of the lower surface of the cassette 1, and the locking frame 23 is fixed to the peripheral edge of the upper surface of the cassette base 21. Further, a plurality of one-side connectors 24 are provided at predetermined positions on the lower surface of the cassette base 21 which is the rear surface of the cassette C. The lower surface of the cassette base 21 has a portion to be positioned (not shown) with respect to a connection base 52 described later. Further, a disc-shaped contactor 25 containing a sub-heater is mounted on the upper surface of the cassette base 21, and the semiconductor wafer W is held between the contactor 25 and the disc-shaped wafer tray 26.
The outer peripheral surface of the wafer tray 26 is provided with an intake port mounting portion 30 protruding outward, and a tip of the intake port mounting portion 30 is provided with a pair of intake ports 3 having a built-in check valve.
1 and 31 are provided. The direction of the intake ports 31, 31 is as follows.
The direction is radial with respect to the center of the cassette C. Then, the suction state (negative pressure) of the wafer tray 26 and the contactor 25 is maintained in the cassette C in advance by vacuum suction from the air intake ports 31. 32 indicates a sealing member.

1 to 4 show the internal structure of the inspection apparatus main body 2. FIG. In FIG. 1, reference numeral 11 denotes a regulating frame mechanism which also serves as an internal frame mechanism, and is constituted by a pair of regulating boards 12u and 12d facing vertically and four connecting shafts 50 connecting the regulating boards 12u and 12d. . Also,
A plurality of horizontal support plates 51 are provided between the control boards 12u and 12d.
Are arranged at regular intervals in the vertical direction, and each horizontal support plate 51.
Are connected to the connecting shafts 50.

A connection base 52 is fixed on the upper surface of an arbitrary horizontal support plate 51 (the other horizontal support plates 51 are the same). The connection base 52 has a built-in circuit board having a drive circuit for supplying an inspection signal to the semiconductor wafer W, and has a connector 24 on one side of the cassette C on the upper surface.
Are connected to a plurality of other connectors 53. The upper surface of the connection base 52 has a positioning portion (not shown) for the cassette C.

As shown in FIGS. 2 and 3, four guide shafts 54 are vertically erected on the upper surface of the horizontal support plate 51, and the cassette support portions 55 and the heaters are provided by the guide shafts 54. The support portion 56 is supported so as to be able to move up and down. In this case, a linear bearing 57 is attached to the cassette supporting portion 55 at a position corresponding to the guide shaft 54.
, And a linear bearing 58 is also provided on the heater supporting portion 56 at a position corresponding to the guide shaft 54.
, And guide shafts 54 are inserted through the linear bearings 58. As a result, the cassette support portion 55 that can move up and down above the connection base portion 52 whose position is fixed.
Are arranged, and a heater support portion 56 that can move up and down is arranged above the cassette support portion 55. Further, on the upper surface of the horizontal support plate 51, a pair of left and right drive cylinders 59p and 59q for raising and lowering the heater support portion 56 are provided.

On the other hand, as shown in FIGS. 2 and 3, the cassette support portion 55 includes a left support plate portion 55p and a right support plate portion 55p.
q, the rear support plate portion 55r and the front support plate portion 55f are formed into a rectangular frame shape, and the inner edges of the left support plate portion 55p and the right support plate portion 55q are provided with the left and right engagement sides Cp and Slit rail section 61 into which Cq is loaded (inserted)
p and 61q are provided. On the other hand, the heater support 56
A heater section 62 for heating the upper surface of the cassette C is provided. The heater section (main heater) 62 is supported by a heater support section 56 so as to be displaceable upward. That is, the heater support 5
6, an opening 63 is formed. The heater 62 is accommodated inside the opening 63, and locking plates 64i, 64j provided to protrude outward from the heater 62 are provided on the upper surface of the heater support 56. Are placed on the stepped recesses 65i and 65j formed in the step (c). The guide pins 66 shown in FIG. 2 are erected in the stepped recesses 65i and 65j.
Guide holes 67 provided in the locking plates 64i, 64j.
Are slidably engaged. Also, the heater unit 62
It is adapted to the upper surface of the wafer tray 26 described above via an adapter 62d provided on the bottom surface.

Further, on the cassette supporting portion 55, FIG.
As shown by a virtual line in FIG.
8, 68 are automatically positioned and the intake port 3 of the cassette C is
1 and 31, an automatic intake system connecting portion 69 is provided for automatic connection to the intake ports 68 and 68, as shown in FIG.
It is connected to the intake device 70 via the air pipes Rn. Thus, the intake means 3 is configured. Further, the cassette C is attached to the cassette support portion 55 by the slit rail portions 61p and 61p.
An automatic loading unit (not shown) is provided for automatically pulling in the cassette C and loading the cassette C at a proper position when the vehicle has entered a predetermined position in 1q.

On the other hand, four link shafts 71 for connecting the cassette support 55 and the heater support 56 are provided between the cassette support 55 and the heater support 56. Due to the function of the link shafts 71, the cassette support 55
Is supported so as to be able to move up and down within a certain stroke range with respect to the heater supporting portion 56.

Then, a fluid pressurizing means 4 is added to such a basic structure according to the present invention. The fluid pressurizing means 4 includes three airbags 13u, 13m, and 13d per stage for pressurizing the pressurized surfaces Mf.
3u are formed in the cassette supporting portion 55 disposed between the pair of upper and lower regulating boards 12u and 12d, and the gap S between the pair of regulating boards 12u and 12d generated when the cassette C is accommodated.
... to be arranged respectively. In this case, the pressurized surfaces Mf ...
As shown in FIG. 2, the upper surface of the heater 62, the lower surface of the cassette C, and the upper and lower surfaces of the connection base 52 are formed. Each of the airbags 13u, 13m, 13d is formed in a flat shape, and the upper surface of the airbag 13u disposed between the lower surface of the horizontal support plate 51 (restriction plate 12u) and the upper surface of the heater section 62 has the upper surface of the horizontal support plate 51 ( The airbag 13m fixed to the lower surface of the control panel 12u) and disposed between the lower surface of the cassette C and the upper surface of the connection base 52 has its lower surface fixed to the upper surface of the connection base 52, and further has the lower surface of the connection base 52. The airbag 13d disposed between the upper surface of the horizontal support plate 51 (restriction panel 12d) and
The lower surface is fixed to the upper surface of the horizontal support plate 51 (regulation board 12d).

On the other hand, each of the airbags 13u is connected to an air pipe Rp as shown in FIG.
6 and the intake device 70. Therefore, by switching the switch 75, the air pipes Rp... Can be selectively connected to the pressure air supply device 76 or the suction device 70. In this case, the air pipes Rp.
, The pressurized air A from the pressurized air supply device 76 can be press-fitted into each of the airbags 13u to pressurize the pressurized surfaces Mf. On the other hand, when the air pipes Rp are connected to the intake device 70 by switching the switch 75 in a state where the pressure air A is press-fitted into the airbags 13u, the pressure air A is discharged from the airbags 13u. ,
Further, by sucking air into each airbag 13u, each airbag 13u can be contracted as shown in FIG. Thereby, each airbag 13u ...
Can be prevented from hindering the lifting and lowering operation of each part and the accommodation or removal of the cassette C. In addition, each airbag 13
If u... are formed of an elastic material, such switching to the intake device 70 is not required.

Next, a method of using the semiconductor wafer inspection apparatus 1 according to the present embodiment and the operation of each unit will be described with reference to FIGS. Note that only the operation of one stage will be described, but the other stages operate similarly.

First, when not in use, the cassette support 55
The heater support 56 is stopped at the raised position shown in FIG. Are in a contracted state.

On the other hand, at the time of use, the cassette C prepared in advance is inserted into the environmental test tank 22 through the entrance 21 of the inspection apparatus main body 2.
And the engagement sides Cp, Cq of the cassette C are inserted into the slit rails 61p, 61q of the cassette support 55. At this time, if the cassette C is inserted to a predetermined position and a touch operation is performed on the touch panel of the touch panel display unit 28a, the cassette C is automatically pulled in and loaded into a regular position by an automatic loading unit (not shown). Further, the automatic intake system connecting portion 69 indicated by a virtual line in FIG.
31 are automatically positioned and automatically connected. Thereby, the wafer tray 26 and the contactor 25 of the cassette C are vacuum-sucked by the suction device 70, and a set negative pressure (for example, -53 [kPa]) is applied between the semiconductor wafer W and the probe terminals P. You.

Next, when the start switch is turned on, the driving of the drive cylinders 59p and 59q is controlled, so that the connection between the cassette C and the connection base 52 and the setting of the heater 62 are performed. That is, the entirety including the heater support portion 56 (heater portion 62) and the cassette support portion 55 (cassette C) is lowered together, and the one-side connectors 24 provided on the cassette C held by the cassette support portion 55 are connected. Base 52
, The lowering of the cassette support portion 55 stops. At this time, the cassette support 5
5 are connected to the heater support 56 by link shafts 71 so as to be able to move up and down within a certain stroke range. Therefore, even if the cassette support 55 stops descending, the heater support 56 is further moved. Descend. When the heater unit 62 comes into contact with the upper surface of the cassette C, the lowering of the heater unit 62 stops. At this time, since the heater portion 62 is supported by the heater support portion 56 so as to be displaceable upward, even if the lowering of the heater portion 62 is stopped, the heater support portion 5 is stopped.
6 falls further.

Thereafter, when the heater support portion 56 further descends, the cassette support portion 55 is moved by the link shafts 71.
Is pressed, and the cassette supporting portion 55 is forcibly lowered. As a result, the one-side connector 2 provided on the cassette C
And the other connectors 53 provided on the connection base 52 are completely connected. On the other hand, if the connectors 24 and 53 are completely connected, the drive control of the drive cylinders 59p and 59q is stopped. FIG. 4 shows the positional relationship in this state.

Next, pressurized air A is press-fitted into each of the airbags 13u from the pressurized air supply device 76. Thereby, each airbag 13u ... expands as shown by the solid line in FIG. 4, and presses the to-be-pressed surface Mf .... That is, while the upper surface of the heater section 62 is pressurized by the airbag 13u,
The lower surface of the cassette C and the connection base 5 are formed by the airbag 13m.
2 is pressed, and the lower surface of the connection base 52 is further pressed by the airbag 13d. In this case, the pressure of each of the airbags 13u can be controlled based on a pressure detection value detected from a pressure sensor (not shown) so as to be a preset pressure set value.

As described above, the cassette C is moved to the inspection apparatus main body 2.
, The semiconductor wafer W is heated to 125 ° C. by the heater unit (main heater) 62 and the sub-heater built in the contactor 25. Further, the inside of the environmental test tank 22 is maintained at a relatively low temperature of 45 ° C. by a ventilation fan and a ventilation duct (not shown). On the other hand, the semiconductor wafer W is provided with the connector 5 from the drive circuit of the connection base 52.
An inspection signal is given via 3... And 24..., And the intended inspection is performed for a preset time.

When the inspection is completed, the pressure air A is discharged from each airbag 13u by switching the switch 75, and further, the air pipes Rp are connected to the suction device 70 to connect the airbags 13u to each other. Inhale. Further, the drive of the drive cylinders 59p and 59q is controlled, the contact between the heater section 62 and the cassettes C is released by raising the heater support section 56, and the cassette C and the connection base section 52 are raised by raising the cassette support section 55. The connection is released. Further, the connection between the intake ports 68, 68 and the intake ports 31, 31 is released by the automatic intake system connection section 69. Then, the cassette C is automatically pushed out to a predetermined position by an automatic loading unit (not shown).
1 can be taken out.

Therefore, according to the inspection apparatus 1 for a semiconductor wafer according to this embodiment, a negative pressure is applied between the semiconductor wafer W and the probe terminals P by vacuum suction using the suction means 3. In addition, since an external pressing force using the fluid pressurizing means 4 is added, for example, even when the number of contacts exceeds 25,000 points, the inspection can be performed without insufficient pressing force. Reliability can be improved. Further, the present invention can be applied to inspection of a semiconductor wafer having a large number of contacts, such as a high-density memory, with a margin, so that versatility and developability can be improved.

Next, a semiconductor wafer inspection apparatus 1 according to a modified embodiment of the present invention will be described with reference to FIGS.

An inspection apparatus 1 for a semiconductor wafer shown in FIG.
Is different from the embodiment shown in FIG. 1 in that a pressure liquid L is used instead of the pressure air A as a pressure fluid.
2 in that a heated pressure liquid L is used instead of the heater section 62. Therefore, the semiconductor wafer inspection apparatus 1 shown in FIG. 6 includes the liquid bags 13u, 13m, and 13d into which the pressurized liquid L is injected.
The liquid bag 13u also serves as a heater, and the liquid bag 13u
The lower surface of u directly contacts the upper surface of the adapter 62d. In addition, a pressure liquid supply device 81 that presses the pressure liquid L into the liquid bag 13u and a heating device (temperature control device) 82 that heats the pressure liquid L are provided.
A pressure liquid supply device 83 for press-fitting the unheated pressure liquid L into d. Therefore, in this case, similarly to the embodiment shown in FIG. 1, an external pressure using the pressure liquid supply devices 81 and 83 can be applied between the semiconductor wafer W and the probe terminals P. In FIG. 6, the same parts as those in FIG. 4 are denoted by the same reference numerals, and the configuration is clarified.
Detailed description is omitted.

On the other hand, the semiconductor wafer inspection apparatus 1 shown in FIG. 7 has a closed chamber 14 for accommodating the pressurized portion Mb and, in particular, a closed chamber 14 for accommodating the entire cassette C. . In this case, the pressurized portion Mb is the cassette C including the heater portion 62. Thus, if the pressure air A is supplied from the pressure air supply device 76 to the inside of the closed chamber 14, the pressure air supply device 76 is provided between the semiconductor wafer W and the probe terminals P, as in the embodiment shown in FIG. An external pressing force can be applied by using. In FIG. 7, the same parts as those in FIGS. 1 and 2 are denoted by the same reference numerals, to clarify the configuration and omit detailed description.

Further, the semiconductor wafer inspection apparatus 1 shown in FIG. 8 includes a closed chamber 14 for accommodating the pressurized portion Mc.
14d to accommodate a part of the cassette C. In this case, the pressurized portion Mc
Is a cassette C including the heater section 62 and excluding the one-side connector 24. Thereby, the compressed air supply device 76
When the pressurized air A is supplied to the inside of the sealed chamber 14 from the outside, a pressurized external pressure using the pressurized air supply device 76 is applied between the semiconductor wafer W and the probe terminals P, as in the embodiment of FIG. can do. Reference numeral 84 denotes a sealing member. In FIG. 8, the same parts as those in FIG. 7 are denoted by the same reference numerals, and the configuration is clarified.

According to this modified embodiment, similarly to the embodiment shown in FIG. 1, a vacuum is applied between the semiconductor wafer W and the probe terminals P. Since the external pressing force using the fluid pressurizing means 4 is applied, the reliability of the inspection can be improved without insufficient pressing force, and the semiconductor wafer having a large number of contacts such as a high-density memory can be obtained. Can be applied with margin.

The embodiment has been described in detail above.
The present invention is not limited to such an embodiment,
The configuration, shape, material, quantity, numerical value, and the like of the details can be arbitrarily changed, added, or deleted without departing from the spirit of the present invention.

[0040]

As described above, the inspection apparatus for semiconductor wafers according to the present invention includes a semiconductor wafer held in a cassette housed in the inspection apparatus main body and suction means for sucking probe terminals by negative pressure. Fluid pressurizing means for pressurizing the probe terminal with pressure fluid is provided,
It has the following remarkable effects.

(1) Between the semiconductor wafer and the probe terminals, in addition to an internal negative pressure caused by vacuum suction using suction means, and an external pressure applied using air pressurization means, For example, even when the number of contacts exceeds 25,000 points, the reliability of the inspection can be improved without insufficient pressure.

(2) The present invention can be applied to inspection of a semiconductor wafer having a large number of contacts, such as a high-density memory, with a margin, and versatility and developability can be improved.

[Brief description of the drawings]

FIG. 1 is a configuration diagram including a part of an internal structure of a semiconductor wafer inspection apparatus according to a preferred embodiment of the present invention;

FIG. 2 is a partial cross-sectional front view showing the internal structure of the semiconductor wafer inspection apparatus (cross section taken along line XX in FIG. 3);

FIG. 3 is a partial sectional plan view showing the internal structure of the semiconductor wafer inspection apparatus;

FIG. 4 is a partial cross-sectional front view showing a state where a cassette is set in an inspection apparatus main body of the semiconductor wafer inspection apparatus;

FIG. 5 is an external front view of the semiconductor wafer inspection apparatus.

FIG. 6 is a configuration diagram including a part of an internal structure of a semiconductor wafer inspection apparatus according to a modified embodiment of the present invention;

FIG. 7 is a schematic configuration diagram showing a part of a semiconductor wafer inspection apparatus according to another modified embodiment of the present invention;

FIG. 8 is a schematic configuration diagram showing a part of a semiconductor wafer inspection apparatus according to another modified embodiment of the present invention;

FIG. 9 is a partial cross-sectional front view of a cassette used in a semiconductor wafer inspection apparatus according to a preferred embodiment (modified embodiment) of the present invention;

[Explanation of symbols]

 DESCRIPTION OF SYMBOLS 1 Inspection apparatus for semiconductor wafers 2 Inspection apparatus main body 3 Suction means 4 Fluid pressurization means 11 Regulation frame mechanism 12u Regulation board 12d Regulation board 13 ... Fluid bag (airbag, liquid bag) 14 Closed chamber 14u Chamber divided body 14d Chamber divided body W Semiconductor wafer We ... Electrode on semiconductor wafer P ... Probe terminal C Cassette A Pressure air (pressure fluid) L Pressure liquid (pressure fluid) S ... Gap Mf ... Pressurized surface Mb Pressurized portion Mc Pressurized portion

Continued on the front page (72) Inventor Yumio Nakamura 246 Koyuki, Oaza, Suzaka City, Nagano Prefecture Inside Orion Machinery Co., Ltd. (72) Inventor Katsukazu Ezawa 4-3-1 Tsunashima Higashi, Kohoku-ku, Yokohama, Kanagawa Prefecture F-term (reference) in Communication Industry Co., Ltd. 2G003 AA10 AD09 AG04 AG08 AG12 AH05 2G032 AE03 AE11 AF04 AL03 4M106 AA01 BA01 BA14 DD06 DD10 DD30 DJ02

Claims (6)

[Claims] 1. A cassette for holding a semiconductor wafer and simultaneously contacting probe terminals with electrodes on the semiconductor wafer, and accommodating the cassette and connecting to the probe terminals to inspect the semiconductor wafer. In a semiconductor wafer inspection apparatus including an inspection apparatus main body, in addition to suction means for suctioning the semiconductor wafer and the probe terminal held by the cassette housed in the inspection apparatus main body by negative pressure, the semiconductor wafer and the probe An inspection apparatus for a semiconductor wafer, comprising a fluid pressurizing means for pressurizing a terminal with a pressurized fluid. 2. The fluid pressurizing means includes: a regulating frame mechanism for accommodating one or more cassettes between a pair of regulating boards; and a gap formed between the pair of regulating boards when the cassette is accommodated. 2. The semiconductor wafer inspection apparatus according to claim 1, further comprising one or more fluid bags interposed and pressurizing the pressurized surface by pressurizing a pressurized fluid. 3. The semiconductor wafer inspection apparatus according to claim 2, wherein the pressure fluid is pressure air or pressure liquid. 4. The semiconductor wafer inspection apparatus according to claim 1, wherein the fluid pressurizing means includes a sealed chamber that accommodates a pressurized portion including the cassette and supplies pressure air. 5. The semiconductor wafer inspection apparatus according to claim 4, wherein the closed chamber accommodates the entire cassette. 6. The semiconductor wafer inspection apparatus according to claim 4, wherein said closed chamber is constituted by a combination of chamber divided bodies and accommodates a part of said cassette.