JP2002140017A - Electrooptical unit and electronic equipment - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide an electrooptical unit which electrically connects electronic parts to an electrooptical panel in a proper manner and to provide an electronic equipment using the unit. SOLUTION: In the electrooptical unit 100 mounted on a portable telephone, a flexible substrate 70 is mounted on a liquid crystal panel 400 by an anisotropic electrically conductive film and the rear surface terminals of the substrate 70 are electrically connected to the terminals made of an ITO film of the panel 400. Capacitors 91 are mounted on front surface side terminals 72 that are electrically connected to the rear surface side terminals through through-holes by soldering. Connector electrodes of a rubber connector are pressure contacted to the terminals 72 in order to make electric connections to a circuit substrate.

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

[0001] 1. Field of the Invention [0002] The present invention relates to an electro-optical unit in which an electro-optical panel and a circuit board are arranged so as to overlap with each other, and an electronic apparatus using the electro-optical unit. More specifically, the present invention relates to a structure for electrically connecting a panel-side terminal formed on an electro-optical panel.

[0002]

2. Description of the Related Art Among various electronic devices, portable telephones are:
For example, as shown in FIG. 2, a lower case 6, a circuit board 7 on which various electric circuits for operating the mobile phone 1 are formed, a lighting device 10, a light diffusion sheet 8, and various displays as an electro-optical panel. And the upper case 9 are stacked in this order.
The lighting device 10 includes a light source 11 composed of an LED or the like, a light guide plate 12, a first reflector 15, and a sheet-like second reflector 17.

In this lighting device 10, a display area 121 in which a liquid crystal panel 400 is arranged is formed in the light guide plate 12 as a rectangular recess. In the display area 121, a rectangular through hole 125 for electrically connecting the liquid crystal panel 400 and the circuit board 7 is formed in a corner portion on the distal end side of the bottom wall 124. The first reflector 15 has three side wall portions 151, 152, 153 surrounding the rectangular display region 121 of the light guide plate 12 from three sides, and a bottom wall portion 154 overlapped on the lower surface of the display region 121. Have been. The bottom wall portion 154 also has a rectangular through hole 155 at a position overlapping the through hole 125 of the light guide plate 12.

[0004] Therefore, as shown in FIG.
When the electro-optical unit 100 is configured by stacking the first reflector 15, the light guide plate 12, the light reflection sheet 8, and the liquid crystal panel 400 on the upper surface side of the
Although the first reflector 15 and the light guide plate 12 are interposed between the liquid crystal panel 0 and the circuit board 7, the circuit board 7 and the liquid crystal panel 400 face each other through the through holes 125 and 155. Therefore, when the rubber connector 60 is sandwiched between the circuit board 7 and the liquid crystal panel 400, the connector electrodes of the rubber connector 60
It is elastically pressed against the input / output terminals 481 of the liquid crystal panel 400 and is also elastically pressed against the input / output terminals 781 of the circuit board 7. Therefore, the input / output terminals 481 and 781 can be electrically connected between the liquid crystal panel 400 and the circuit board 7.

The electro-optical unit 100 having such a configuration
In FIG. 16, the liquid crystal panel 400 includes, as shown in FIG.
First transparent substrate 41 bonded through a predetermined gap
Liquid crystal (not shown) is held between the first transparent substrate 420 and the second transparent substrate 420. In the first transparent substrate 410 and the second transparent substrate 420, the surfaces facing each other include:
An electrode pattern (not shown) is formed by an ITO film (Indium Tin Oxide / transparent conductive film).

Here, the drive IC 490 is anisotropically formed on the portion 425 of the second transparent substrate 420 projecting from the first transparent substrate 410 by an ITO film formed by using an electrode pattern forming process. CO by conductive agent
A terminal (not shown) for mounting G, the driving IC 4
Input / output terminal 4 for inputting / outputting signals etc. to / from 90
81 and a terminal (not shown) for mounting a boosting capacitor 91 externally attached to the driving IC 490 with an anisotropic conductive agent or the like. The input / output terminal 481 is connected to the input / output terminal 781 of the circuit board 7 through the rubber connector 60 as described with reference to FIG.
Are electrically connected to the

[0007]

However, in the conventional electro-optical unit 100, the terminals formed on the liquid crystal panel 400 are formed of an ITO film formed simultaneously with an electrode pattern for driving pixels. Since the connection resistance is large and the variation in the film thickness is large, when the electronic components are electrically connected to the liquid crystal panel 400, the following problems are likely to occur.

First, since the terminal on which the surface-mount type capacitor 91 is mounted is formed of an ITO film, there is a problem that the connection resistance is large and the circuit constant is apt to vary.

The input / output terminal 781 of the circuit board 7
Since the surface is plated with gold, rubber connector 6
The electrical connection with the connector electrode of 0 has a small connection resistance even if it is simply pressed, and its resistance change with time does not matter, whereas the input / output terminal 481 of the liquid crystal panel 400 is , The electrical connection between the input / output terminal 481 of the liquid crystal panel 400 and the connector electrode of the rubber connector 79 has a large connection resistance only by press-contacting, and the resistance increases with time. There is a problem that it increases. Such a problem of the connection resistance causes a problem that the display is not performed or the display becomes thin when the display is performed on the liquid crystal panel 400.

In the electro-optical unit 100,
It is necessary to extend a large number of electrode patterns from the driving IC 490 to the image display area 401 of the liquid crystal panel 400, and the periphery of the mounting area of the driving IC 490 does not substantially contribute to display. There is a demand that the pitch of the terminals 481 be narrowed so that these terminal formation regions are narrowed.

However, the rubber connector 60 for electrically connecting the input / output terminal 481 of the liquid crystal panel 400 and the input / output terminal 781 of the circuit board 7 has a structure in which the connector electrode elastically contacts the terminal. The connector electrodes need to have a fairly wide pitch. Therefore, conventionally, it is necessary to secure a wide pitch for the input / output terminals 481 in accordance with the pitch of the connector electrodes of the rubber connector 60.
At 0, the formation area of the input / output terminal 481 cannot be reduced. Therefore, the liquid crystal panel 400 has a problem in that it is necessary to secure a wide area that does not directly contribute to image display. Further, there is also a problem that the resistance value of the electrode pattern is increased due to a long routing distance of the electrode pattern, thereby causing a voltage drop of an input signal.

In view of the above problems, an object of the present invention is to
An object of the present invention is to provide an electro-optical unit capable of satisfactorily electrically connecting electronic components to an electro-optical panel, and an electronic apparatus using the electro-optical unit.

Another object of the present invention is to provide an electro-optical unit capable of electrically connecting a circuit board via a rubber connector or the like even if input / output terminals of an electro-optical panel are formed at a narrow pitch. And an electronic apparatus using the electro-optical unit.

[0014]

According to the present invention, there is provided an electro-optical panel comprising: an electro-optical panel; and a circuit board which is overlapped with the electro-optical panel at a predetermined interval. In an electro-optical unit in which a panel-side terminal and a circuit-board-side terminal are formed on opposing surfaces of the optical panel and the circuit board, respectively, the flexible board is superimposed with the back side facing the electro-optical panel, The flexible substrate includes a plurality of front side terminals formed on the front side, a plurality of back side terminals formed on the back side, and a plurality of through holes for electrically connecting the front side terminals and the back side terminals. And the back surface side terminal comprises:
The panel-side terminals are electrically connected by a conductive material, and the front-side terminals are electrically connected to electronic components.

In the present invention, what is electrically connected to the panel side terminal of the electro-optical panel is the back side terminal of the flexible substrate, and the surface side terminal of the flexible substrate is connected to a surface mount type capacitor or rubber connector. And other electronic components are electrically connected. Here, since the flexible substrate has flexibility, even if the thickness of the panel-side terminal varies, the back-side terminal of the flexible substrate is electrically connected to the panel-side terminal of the electro-optical panel. In this case, or when the electronic component is electrically connected to the front surface side terminal of the flexible substrate, it is possible to absorb the variation in the film thickness of the panel side terminal. Moreover, the terminals of the flexible substrate are usually plated with gold. For this reason, when electronic components such as surface-mounted capacitors and rubber connectors are electrically connected to the panel-side terminals via the flexible substrate, these electronic components are directly electrically connected to the panel-side terminals. Unlike the case where the connection is performed, the problem that the connection resistance is initially large or the problem that the connection resistance increases with time does not occur.

In the present invention, the flexible substrate may be overlapped with the electro-optical panel including a region where the through hole is formed, or the entire flexible substrate may be overlapped with the electro-optical panel. Can be adopted. With this configuration, the size of the electro-optical unit including the electro-optical panel and the flexible substrate can be reduced.

In the present invention, the flexible substrate may have a structure in which a region where the through hole is formed protrudes from an edge of the electro-optical panel. With this configuration, the area where the through-holes are formed in the flexible substrate protrudes from the edge of the electro-optical panel, so that the area where the wiring pattern is routed on the rear surface and the front surface of the flexible substrate is large. Therefore, it is easy to electrically connect the panel-side terminal to the front-side terminal of the flexible substrate located at a position distant from the panel-side terminal.

In the present invention, the electronic component may include, for example, a first front terminal among the front terminals in a state sandwiched between the flexible board and the circuit board;
And a connector having a connector electrode elastically in contact with the circuit board side terminal. With this configuration, the connector such as a rubber connector is not directly pressed against the panel side terminal, but is electrically connected to the front side terminal of the flexible substrate, and
The back side terminal electrically connected to the front side terminal via the through hole is satisfactorily electrically connected to the panel side terminal by a conductive material such as an anisotropic conductive agent. Here, a connector electrode such as a rubber connector has a structure in which a connector electrode such as a rubber connector is elastically pressed against the front side terminal of the flexible board, but the front side terminal of the flexible board is usually plated with gold or the like. Therefore, these electrical connection portions have a small connection resistance even if they are pressed against each other, and the change of the resistance with time does not matter. In addition, connector electrodes such as rubber connectors have a structure in which they are elastically pressed against the terminals on the circuit board side. However, since the power terminals on the circuit board side are usually plated with gold, etc. The connection part has a small connection resistance just by being pressed, and its resistance change with time does not matter. Therefore, when displaying on the electro-optical panel, it is possible to avoid problems such as non-lighting and a thin display due to an increase in resistance of an electrical connection portion.

In the present invention, the electronic component may include an electric circuit element surface-mounted on the second surface-side terminal among the surface-side terminals. With such a configuration, it is not necessary to route the wiring pattern from the driving IC to the mounting area of the electric circuit element on the side of the electro-optical panel in a complicated manner, so that the arrangement of the wiring pattern can be simplified. Also, there is no need to directly electrically connect the electric circuit element to the terminal made of an ITO film or the like formed on the electro-optical panel with an anisotropic conductive agent. Therefore, the electrical connection may be made by soldering or the like. Therefore, in this electrical connection portion, the connection resistance is small, and the change of the resistance with time does not matter.

In the present invention, the electronic component may include a first surface-side terminal of the front-side terminals and a circuit-board-side terminal sandwiched between the flexible substrate and the circuit substrate. In some cases, the connector includes a connector provided with a connector electrode that contacts with elasticity, and an electric circuit element surface-mounted on the second surface-side terminal of the surface-side terminals.

In the present invention, a drive IC may be mounted on the electro-optical panel by COG. In this case, the panel-side terminals include input / output terminals for the drive IC. In the case of such a configuration, the electric circuit element is, for example, an external element for operating the driving IC. As such an external element, for example, a surface mount type capacitor is used.

In the present invention, when the driving IC is mounted on the electro-optical panel, a plurality of electrode patterns extend from the mounting area of the driving IC toward the image display area of the electro-optical panel. In this type of electro-optical unit, if the input / output terminals for the drive IC are formed as the panel-side terminals, a design margin can be provided in the layout of these input / output terminals and electrode patterns. it can.

In the present invention, the pitch of the first surface side terminal is wider than that of the panel side terminal electrically connected to the first surface side terminal via the through hole and the rear surface side terminal. It is preferable to form a plurality. In the present invention, what is electrically connected directly to the panel-side terminal of the electro-optical panel is the back-side terminal of the flexible substrate, and such a back-side terminal and the panel-side terminal are anisotropic conductive agent. Thus, even if the panel-side terminals are formed at a narrow pitch, electrical connection can be achieved. Also, the connector electrode of the connector that electrically connects the circuit board side terminal and the panel side terminal is directly electrically connected is the first front side terminal formed on the front side of the flexible board, Since such first surface side terminals are formed on the front side of the flexible substrate, they can be formed at a wide pitch in accordance with the pitch of the connector electrodes. Therefore, the panel-side terminals can be formed at a narrow pitch without being affected by the pitch of the connector electrodes. Therefore, the area where the panel-side terminals are formed can be reduced, so that the area of the electro-optical panel that does not directly contribute to image display can be reduced. In addition, since the length of the electrode pattern can be shortened, the resistance value can be suppressed low. Moreover, in the flexible board, the back side terminal and the first front side terminal are electrically connected through the through hole of the flexible board, so that the panel side terminal and the circuit board side terminal are connected to the flexible board and the connector. Can be electrically connected to each other. Further, in the electro-optical panel, the panel side terminal is often formed of an ITO film or the like. Since the ITO film has a higher resistance value than a metal, the connection resistance increases. Also, when the thickness of the ITO film varies, when a connector electrode such as a rubber connector is directly pressed into contact with the panel side terminal, a problem that the connection resistance is initially large at this connection portion, or the connection resistance increases with time. Problems such as increase in number are likely to occur. However, in the present invention, what is directly connected to the panel-side terminal is a flexible substrate, and since this flexible substrate has flexibility, it can absorb the variation in the film thickness of the panel-side terminal, and The first surface side terminal of the flexible substrate is usually plated with gold. Therefore, unlike the case where a connector electrode such as a rubber connector is directly electrically connected to the panel side terminal,
The problem that the connection resistance is initially large or the problem that the connection resistance increases with time does not occur.

In the present invention, it is preferable that each of the first surface-side terminals is formed in a region overlapping with at least one of the panel-side terminals in a plane. When mounting the flexible substrate on the electro-optical panel with an anisotropic conductive agent or the like, the head is applied to the upper surface of the flexible substrate and heated and pressed, but at this time, the head contacts the first surface side terminal, On the lower layer side of the first front side terminal, there are a rear side terminal and a panel side terminal.
Therefore, since the first front side terminal is formed in a state where there is no height, the head applies heat and pressure evenly between any rear side terminal and the panel side terminal. Therefore, the back side terminal and the panel side terminal are reliably electrically connected.

In the present invention, the panel side terminal is, for example, an ITO film. When a liquid crystal panel or the like is used as the electro-optical panel, such an ITO film can be formed simultaneously with an electrode pattern for driving pixels.

In the present invention, the electro-optical panel includes:
It is a liquid crystal panel.

In the present invention, the conductive material is, for example,
It is an anisotropic conductive agent.

The electro-optical unit to which the present invention is applied is suitable for use as a display unit of an electronic device such as a mobile phone.

[0029]

Embodiments of the present invention will be described with reference to the accompanying drawings.

Embodiment 1 (Overall Configuration of Electronic Apparatus) FIG. 1 is a perspective view showing the appearance of a mobile phone as an example of an electronic apparatus to which the present invention is applied. FIG. 2 is an exploded perspective view showing a configuration of a main part of the mobile phone. FIG. 3 is an enlarged longitudinal cross-sectional view showing a state in which a circuit board, a first reflector, a second reflector, a light guide plate, a light diffusion sheet, and a liquid crystal panel are stacked to form an electro-optical unit in the mobile phone. FIG. Since the basic configurations of the electronic device and the electro-optical unit according to the present embodiment are common to those of the related art, the corresponding portions are denoted by the same reference numerals and described.

In FIG. 1, a mobile phone 1 of the present embodiment has a display unit 2 using a liquid crystal panel 400 as an electro-optical panel in an upper half thereof, and a plurality of key buttons in a lower half thereof. The operation unit 3 in which the 101 is arranged is configured. A speaker hole 4 is formed above the display unit 2, and a microphone hole 5 is formed below the operation unit 3.

As shown in FIG. 2, the portable telephone 1 has a lower case 6, a circuit board 7 on which various electric circuits for operating the portable telephone 1 are formed, a lighting device 10, a light diffusion sheet 8, an electric A liquid crystal panel 400 for performing various displays as an optical panel and an upper case 9 are stacked in this order. In FIG. 2, illustration of a speaker or a microphone is omitted.

The lighting device 10 includes a light source 11 composed of an LED or the like, and a light guide plate 1 composed of a transparent plastic molded product.
2. First reflector 1 made of plastic molded product
5 and a sheet-like second reflector 17.

In the lighting device 10, the light guide plate 12 includes
A display area 121 in which the liquid crystal panel 400 is arranged is formed as a rectangular recess, and a keypad area 122 in which a plurality of key buttons 101 are arranged is formed in an area adjacent to the display area 121. Light guide plate 12
Are formed at two places at the tip of the light emitting device, each of which has a light source 11 made of an LED or the like.

In the display area 121 of the light guide plate 12, the bottom wall 1
A rectangular through-hole 125 for electrically connecting the liquid crystal panel 400 and the circuit board 7 is formed in a corner portion on the front end side of 24.

The first reflector 15 has three side walls 151, 152, and 153 surrounding the rectangular display area 121 of the light guide plate 12 from three sides, and a bottom wall 154 overlapped on the lower surface of the display area 121. Are formed. The bottom wall portion 154 of the first reflector 15 has a concave portion 12 of the light guide plate 12.
A through hole 159 is formed at a position overlapping with No. 3. The through hole 159 is a hole for passing the light source 11 mounted on the circuit board 7 through the concave portion 123 of the light guide plate 12 when the first reflection member 15 and the light guide plate 12 are stacked on the circuit board 7.

The bottom wall portion 154 of the first reflector 15
, A rectangular through hole 155 is also formed at a position overlapping the through hole 125 of the light guide plate 12.

Accordingly, as shown in FIG. 3, the electro-optical unit 100 is assembled by stacking the first reflector 15, the light guide plate 12, the light diffusion sheet 8, and the liquid crystal panel 400 on the upper surface side of the circuit board 7. When the circuit board 7 and the liquid crystal panel 4
The first reflective material 15 and the light guide plate 12 are interposed between the first reflective member 15 and the light guide plate 00, but the circuit board 7 and the liquid crystal panel 400 face each other through the through holes 125 and 155. Therefore, as described later, by arranging a rubber connector or the like in a portion where the circuit board 7 and the liquid crystal panel 400 face each other, the input / output terminals 481 and 781 can be electrically connected to each other.

In FIG. 2, translucent key buttons 101 are arranged on the operation section 3 of the upper case 9, the keypad area 122 of the light guide plate 12, and the sheet-like second reflection member 17. Button holes 90, 120, and 170 are formed at positions overlapping each other, and the plurality of button holes 9 are formed.
The key buttons 101 are arranged inside 0, 120, and 170, respectively.

(Structure of Liquid Crystal Panel 400) The structure of the liquid crystal panel 400 used as the electro-optical panel in the electro-optical unit of the portable telephone 1 of the present embodiment will be described with reference to FIGS.

FIGS. 4 and 5 show the liquid crystal panel 4 respectively.
FIG. 2 is a perspective view and an exploded perspective view when 00 is viewed from obliquely below. FIG. 6 is an explanatory diagram showing an enlarged plan view of the panel-side terminals formed on the liquid crystal panel in the electro-optical unit of the mobile phone according to the present embodiment.

Referring to FIGS. 4 and 5, a liquid crystal panel 40 is shown.
Reference numeral 0 denotes a passive matrix type color liquid crystal panel. In the liquid crystal panel 400, a liquid crystal sealing area 435 is defined by a sealing material 430 between a pair of transparent substrates made of rectangular glass or the like bonded by a sealing material 430 with a predetermined gap therebetween. Liquid crystal is sealed in 435. The liquid crystal sealed area 435 forms an image display area 401 for displaying an image.

Here, of the pair of transparent substrates, the substrate on which a plurality of rows of first electrode patterns 440 extending in the vertical direction in the liquid crystal sealing region 435 are formed is referred to as a first transparent substrate 410. The substrate on which a plurality of rows of second electrode patterns 450 extending in the horizontal direction in the liquid crystal sealing region 435 is formed is referred to as a second transparent substrate 420.

The liquid crystal panel 400 shown here is of a transmissive type, and performs a predetermined display using the illumination device 10 shown in FIG. 2 as a backlight. Therefore, a polarizing plate 461 is attached to the outer surface of the second transparent substrate 420, and the first transparent substrate 41
A polarizing plate 462 is attached to the outer surface of the zero. In addition,
Although not shown, the second transparent substrate 420 includes red (R), green (G), and blue (B) regions corresponding to intersections of the first electrode pattern 440 and the second electrode pattern 450. ) Are formed, and an insulating flattening film and a second electrode pattern 45 are formed on the surface side of these color filters.
0 and an alignment film are formed in this order. On the other hand, on the first transparent substrate 410, a first electrode pattern 440 and an alignment film are formed in this order. In this liquid crystal panel 400, the first electrode pattern 440 and the second electrode pattern 450 are both formed of an ITO film.

In the liquid crystal panel 400, each of the first transparent substrate 410 and the second transparent substrate 420 located in the same direction is used for both inputting and outputting signals to the outside and conduction between the substrates. A first terminal formation region 411 and a second terminal formation region 421 formed on each of the first transparent substrate 410 and the second transparent substrate 420 near the substrate sides 418 and 428 are used. As the second transparent substrate 420, a substrate larger than the first transparent substrate 410 is used, and when the first transparent substrate 410 and the second transparent substrate 420 are bonded to each other, the first transparent substrate 410
A driving IC 490 is mounted on a portion 425 where the second transparent substrate 420 protrudes from the substrate side 418 by COG mounting.
For this reason, in the second transparent substrate 420, the driving IC 49
A large number of patterns such as the second electrode pattern 450 extend from the mounting area 0 to the image display area 401.

Here, in the second terminal formation region 421, the portion located on the liquid crystal sealing region 435 side with respect to the driving IC 490 is used for inter-substrate conduction with the first transparent substrate 410 side. One of the transparent substrates 410 is formed in an overlapping portion. In the first transparent substrate 410, the first terminal formation region 411 is
Since it is used for conduction between the substrate and the 0 side, it is formed at the overlapping portion with the second transparent substrate 420.

On the other hand, as shown in an enlarged manner in FIG. 6, the second terminal formation region 421 of the second transparent substrate 420 is formed.
In a part located on the substrate side 428 side of the driving IC 490, a plurality of panel-side terminals 480
28 are formed in a line. These panel-side terminals 480 serve as input / output terminals 4 for the driving IC 490.
81, and a terminal 482 to which an electrode of a surface mount type boosting capacitor 91 externally attached to the driving IC 490 is to be electrically connected.

The first transparent substrate 410 thus configured
As shown in FIGS. 4 and 5, the second transparent substrate 420 and the second transparent substrate 420 are bonded to each other with a sealant 430 containing an inter-substrate conducting agent, and the inter-substrate conducting terminals are conducted between the substrates. When a signal is input from the input / output terminal 481 of the second transparent substrate 420 to the driving IC 490, the driving IC 490
Are supplied to the first electrode pattern 440 and the second electrode pattern 450. Therefore, each pixel corresponding to the intersection of the first electrode pattern 440 and the second electrode pattern 450 can be driven.

In the liquid crystal panel 400 thus configured, the panel-side terminals 480 (input / output terminals 481 and terminals 482) are each formed of an ITO film formed simultaneously with the second electrode pattern 450. The inter-substrate conduction terminals formed on the first transparent substrate 410 and the second transparent substrate 420 are also formed of an ITO film formed simultaneously with the first electrode pattern 440 and the second electrode pattern 450.

(Electrical Connection Structure to Terminals of Liquid Crystal Panel 400) Panel-side terminals 480 (input / output terminals 481 and terminals 48) of the liquid crystal panel 400 thus configured.
When electrically connecting the circuit board side terminal 781 and the capacitor 91 to 2), in this embodiment, FIG.
The flexible substrate shown in FIGS. 8B, 8A, 8B, and 9 is used.

FIGS. 7A and 7B are a perspective view of the flexible substrate 70 used in this embodiment as viewed obliquely from the front side and a perspective view of the flexible substrate 70 viewed obliquely from the rear side. is there. FIG. 8A shows the front side terminals and the front side wiring pattern formed on the front side of the flexible board 70 used in the present embodiment by solid lines, and the rear side terminals and the back side formed on the back side of the flexible board 70. FIG. 8 is an explanatory diagram showing a wiring pattern by a dotted line, and FIG.
(B) shows the back side terminal and the back side wiring pattern formed on the back side of the flexible substrate 70 by a solid line, and the front side terminal and the front side wiring pattern formed on the front side of the flexible substrate 70 by a dotted line. FIG. FIG. 9 shows a case where the terminal forming region shown in FIG.
FIG. 9 is an explanatory view showing a state where the flexible substrates shown in FIGS. 8A and 8B and FIGS.

FIGS. 7A and 7B and FIG.
In (B), the flexible substrate 70 used in this embodiment is used.
A plurality of front-side terminals 71 and a plurality of front-side wiring patterns 710 extending from each of the front-side terminals 71 toward the end of the flexible substrate 70 are formed on the front side of the substrate. On the other hand, on the back side of the flexible substrate 70, a plurality of back side terminals 72 and a plurality of back side wiring patterns 720 extending from each of these back side terminals 72 toward the end of the flexible substrate 70 are provided. Are formed. Here, the front side wiring pattern 710 and the back side wiring pattern 720 have planar ends overlapping each other, and a through hole 713 is formed in the overlapping portion. For this reason, the front side terminal 71 and the back side terminal 72 are electrically connected via the through hole 713.

In this embodiment, the flexible substrate 70 is overlaid on the overhanging portion 725 of the second transparent substrate 20, as can be seen by comparing FIG. 6 and FIG. When the first overlapping with the input / output terminal 481
Back side terminal 721 and second back side terminal 722 overlapping terminal 482 to be electrically connected to capacitor 91.
And are included.

As can be seen by comparing FIGS. 8A and 8B, the front side terminal 71 is connected to the first rear side terminal 7.
First surface-side terminal 711 (connector connection terminal) that is electrically connected to 21 via through-hole 713
And the through hole 71 with respect to the second back side terminal 722.
3, a second surface-side terminal 712 electrically connected through
(Capacitor mounting terminal).

Here, the front side terminal 71 (first front side terminal 711 and second front side terminal 712) and the back side terminal 72 (first back side terminal 721 and second back side terminal 722) The surface of is gold plated.

The flexible substrate 70 thus configured
In this embodiment, the electrode of the capacitor 91 is electrically connected to the terminal 482 of the liquid crystal panel 400, and the circuit of the circuit board 7 is connected to the input / output terminal 481 of the liquid crystal panel 400 as described below. The board-side terminals 781 are electrically connected (see FIG. 3). The circuit board-side terminals 781 of the circuit board 7 are also plated with gold.

First, as shown in FIG. 9, the capacitor 91 is surface-mounted on the second surface-side terminal 712 of the flexible substrate 70 by soldering.

Next, the flexible substrate 70 on which the capacitors 91 are surface-mounted is differently arranged so as to face the liquid crystal panel 400 (the second transparent substrate 420) with the back side facing the overhanging portion 425 of the second transparent substrate 420. It is mounted using an isotropic conductive agent. As a result, the flexible substrate 70
Is mounted so as to overlap the transparent substrate 420. In this state, the entire flexible substrate 70 including the portion where the through hole 713 is formed is the second transparent substrate 420.
And does not protrude from the substrate side 428.

A first back side terminal 72 is provided between the back side of the flexible substrate 70 and the liquid crystal panel 400.
1 is electrically connected to the input / output terminal 481 of the liquid crystal panel 400 by the anisotropic conductive agent,
2 is a terminal 4 of the liquid crystal panel 400 using an anisotropic conductive agent.
82 is electrically connected.

Next, as shown in FIG. 3, the electro-optical unit 100 is assembled by stacking the first reflector 15, the light guide plate 12, and the liquid crystal panel 400 on the upper surface side of the circuit board 7. At this time, the rubber connector 60 is arranged between the flexible board 70 and the circuit board 7.

As a result, the connector electrode of the rubber connector 60 is connected to the first surface side terminal 71 of the flexible substrate 70.
1 and elastically presses the input / output terminals 781 of the circuit board 7 with elasticity. Therefore, the input / output terminal 481 of the liquid crystal panel 400 and the input / output terminal 781 of the circuit board 7 are connected to the first back side terminal 721, the through hole 713, the first front side terminal 7
11. Electrical connection is made via the connector electrode of the rubber connector 60.

The capacitor 91 is connected to the second surface side terminal 712 of the flexible substrate 70 and the through hole 71.
Third, it is electrically connected to the driving IC 490 via the second back side terminal 721 and the terminal 482.

(Effects of this embodiment) As described above, in this embodiment,
The panel side terminal 480 of the liquid crystal panel 400 (terminal 481,
482) are electrically connected directly to the back side terminals 72 of the flexible substrate 70, and electronic components such as the capacitor 91 and the rubber connector 60 are electrically connected to the front side terminals 71 of the flexible substrate 70. Connected. Here, since the flexible substrate 70 has flexibility, the variation in the thickness of the ITO film forming the terminals 481 and 482 of the liquid crystal panel 400 can be absorbed, and the back side terminal 72 of the flexible substrate 70 can be absorbed. Is gold-plated, so that the surface-mounted capacitor 91 and the rubber connector 60 can be directly connected to the terminals 481 and 481 of the liquid crystal panel 400.
Unlike the case where the electrical connection is made directly to the 482, the problem that the connection resistance is initially large or the problem that the connection resistance increases with time does not occur.

That is, the surface mount type capacitor 91
Are not directly electrically connected to the terminals 482 of the liquid crystal panel 400 by the anisotropic conductive agent, but are electrically connected to the second surface side terminals 712 of the flexible substrate 70 by solder. These second surface side terminals 712 are satisfactorily electrically connected to the terminals 482 of the liquid crystal panel 400. For this reason, the electrical connection at this portion has a small connection resistance, and the change in resistance with time does not matter.

The rubber connector 60 is not directly in pressure contact with the input / output terminal 481 of the liquid crystal panel 400, but is connected to the first front terminal 711 of the flexible substrate 70.
And these first surface side terminals 711 are
It is satisfactorily electrically connected to the input / output terminal 481 of the liquid crystal panel 400. Here, the first of the flexible substrate 70
Has a structure in which the connector electrode of the rubber connector 60 is simply pressed against the surface side terminal 711 with elasticity.
Because gold plating is applied, these electrical connection parts have a small connection resistance even if they are pressed, and
The change in resistance over time does not matter. Further, the connector electrode of the rubber connector 60 has a structure in which it is only elastically pressed against the input / output terminal 781 of the circuit board 7, but the input / output terminal 781 is also plated with gold. In addition, these electrical connection portions have a small connection resistance even if they are pressed against each other, and the change in the resistance with time does not matter. Therefore, the liquid crystal panel 40
When the display is performed at 0, it is possible to avoid the problem of non-lighting and a thin display due to an increase in the resistance of the electrical connection part.

[Modification of First Embodiment] In the first embodiment, the entire flexible substrate 70 including the end portion where the through hole 713 is formed is overlapped with the liquid crystal panel 400. Therefore, the size of the electro-optical unit 100 has been reduced. On the other hand, in the present embodiment, as shown in FIG.
The region where the through-hole 713 is formed protrudes from the edge of the liquid crystal panel 400 (the substrate edge 481 of the second transparent substrate 420). Other configurations are the same as those of the first embodiment, and thus common portions are denoted by the same reference numerals, and description thereof will be omitted.

With this configuration, the area where the wiring pattern is routed on the back side and the front side of the flexible substrate 70 is large because the end of the flexible substrate 70 protrudes from the edge of the liquid crystal panel 400. Therefore, when designing the flexible substrate 70, there is an advantage that the degree of freedom of design is high.

[Embodiment 2] FIG. 11 shows a planar configuration of a panel-side terminal formed on a liquid crystal panel in an electro-optical unit of a portable telephone (electronic device) according to Embodiment 2 of the present invention. FIG. FIG.
(A) shows, in this electro-optical unit, front side terminals and front side wiring patterns formed on the front side of the flexible substrate overlaid on the liquid crystal panel by solid lines, and back side terminals formed on the back side of the flexible substrate. Explanatory diagram showing the back side wiring pattern by a dotted line, FIG.
FIG. 5 is an explanatory diagram showing a back side terminal and a back side wiring pattern formed on the back side of the flexible substrate by solid lines, and a front side terminal and a front side wiring pattern formed on the front side of the flexible substrate by dotted lines. FIG.
FIG. 12 is an explanatory view showing a state in which the flexible substrate shown in FIGS. 12A and 12B is mounted on the terminal forming region of the liquid crystal panel shown in FIG. 11 in this electro-optical unit.

Note that the mobile phone according to the second embodiment
Since the basic configurations of the electro-optical unit and the liquid crystal panel are the same as those described in the first embodiment, corresponding portions are denoted by the same reference numerals and description thereof will be omitted.

Also in the present embodiment, as described with reference to FIGS. 4 and 5, in liquid crystal panel 400, input / output of signals to / from the outside and conduction between substrates are performed. , First transparent substrate 410 and second transparent substrate 4
20, the first transparent substrate 410 and the second transparent substrate 4 near the respective substrate sides 418 and 428 located in the same direction.
20 each of the first terminal formation regions 4
11 and the second terminal formation region 421 are used. As the second transparent substrate 420, a substrate larger than the first transparent substrate 410 is used, and when the first transparent substrate 410 and the second transparent substrate 420 are bonded to each other, A driving IC 490 is mounted by COG on a portion 425 where the second transparent substrate 420 protrudes from the substrate side 418, and a large number of electrode patterns extend from a mounting area of the driving IC 490 toward the image display area 401.

Here, in the second terminal formation region 421, a portion located on the liquid crystal sealing region 435 side with respect to the driving IC 490 is used for inter-substrate conduction with the first transparent substrate 410 side. One of the transparent substrates 410 is formed in an overlapping portion. In the first transparent substrate 410, the first terminal formation region 411 is
Since it is used for conduction between the substrate and the 0 side, it is formed at the overlapping portion with the second transparent substrate 420.

On the other hand, as shown in an enlarged manner in FIG. 11, the second terminal formation region 421 of the second transparent substrate 420 is formed.
In a part located on the substrate side 428 side of the driving IC 490, a plurality of panel-side terminals 480
28 are formed in a line. These panel-side terminals 480 serve as input / output terminals 4 for the driving IC 490.
81, and a terminal 482 to which an electrode of a surface mount type boosting capacitor 91 externally attached to the driving IC 490 is to be electrically connected.

In the liquid crystal panel 400 thus configured, the panel-side terminals 480 (input / output terminals 481 and terminals 482) are formed of an ITO film formed simultaneously with the second electrode pattern 450 (see FIG. 5). Become.

The panel side terminal 480 (input / output terminal 481 and terminal 48) of the liquid crystal panel 400 thus configured
In electrically connecting the circuit board side terminal 781 and the capacitor 91 to 2), in this embodiment, FIG.
The flexible substrate 70 shown in FIGS.

In FIGS. 12A and 12B, on the front side of the flexible board 70 used in this embodiment, a plurality of front side terminals 71 and the end of the flexible board 70 from each of these front side terminals 71 are shown. A surface side wiring pattern 710 extending toward the portion is formed. On the other hand, on the back side of the flexible substrate 70, a plurality of back side terminals 72 are provided.
And a backside wiring pattern 72 extending from each of these backside terminals 72 toward the end of the flexible substrate 70.
0 is formed. Here, the surface side wiring pattern 7
The ends of the 10 and the rear-side wiring pattern 720 are planarly overlapped with each other, and a through hole 713 is formed in the overlapping portion. For this reason, the front side terminal 71 and the back side terminal 72 are electrically connected via the through hole 713.

In this embodiment, when the flexible substrate 70 is placed on the overhanging portion 725 of the second transparent substrate 20 as shown in FIG. 11 and FIG. The first back side terminal 721 overlapping the input / output terminal 481 and the second back side terminal 7 overlapping the terminal 482 to be electrically connected to the electrode of the capacitor 91
22 are included.

As can be seen by comparing FIGS. 12A and 12B, the front side terminal 71 is electrically connected to the first back side terminal 721 through the through hole 713. First surface side terminal 711 (terminal for connector connection)
And the through hole 71 with respect to the second back side terminal 722.
3, a second surface-side terminal 712 electrically connected through
(Capacitor mounting terminal).

Here, the front side terminal 71 (first front side terminal 711 and second front side terminal 712) and the back side terminal 72 (first back side terminal 721 and second back side terminal 722) The surface of is gold plated.

In this embodiment, FIG. 11 and FIG.
As can be seen from (B), on the second transparent substrate 420 of the liquid crystal panel 400, the panel-side terminals 480 (input / output terminals 481 and terminals 482) are formed at a considerably narrow pitch. Further, in the flexible substrate 70, the back surface terminals 72 overlap the panel terminals 480 (input / output terminals 481 and terminals 482) and are directly and electrically connected. Is formed.

On the other hand, the first surface side terminal 711
Although the number is smaller than the number of input / output terminals 481 and terminals 482, they are formed using the entire area where the panel-side terminals 480 are formed. Therefore, the first front terminals 711 are formed at a wider pitch than the panel terminals 480. In this configuration, in the present embodiment, the first front terminal 711 has a structure in which one or a plurality of panel terminals 480 are planarly overlapped.

Since the second front side terminal 712 is formed in a region apart from the first front side terminal 711 in accordance with the electrode pitch of the capacitor 91 mounted here, the panel side terminal 480 is formed. Are formed at a pitch that is considerably wider than the pitch.

The flexible substrate 70 thus configured
In this embodiment, the electrode of the capacitor 91 is electrically connected to the terminal 482 of the liquid crystal panel 400, and the circuit of the circuit board 7 is connected to the input / output terminal 481 of the liquid crystal panel 400 as described below. The board-side terminals 781 are electrically connected (see FIG. 3). The circuit board-side terminals 781 of the circuit board 7 are also plated with gold.

First, as shown in FIG. 13, the capacitor 91 is surface-mounted on the second surface side terminal 712 of the flexible substrate 70 by soldering.

Next, the flexible substrate 70 on which the capacitors 91 are surface-mounted is attached so that the back surface of the flexible substrate 70 faces the liquid crystal panel 400 (the second transparent substrate 420) and overlaps the overhanging portion 725 of the second transparent substrate 420. It is mounted using an isotropic conductive agent. As a result, the flexible substrate 70
Is mounted so as to overlap the transparent substrate 420. In this state, the through holes 71
The portion where 3 is formed protrudes from the substrate side 428 of the second transparent substrate 420.

The first back side terminal 72 is provided between the back side of the flexible substrate 70 and the liquid crystal panel 400.
1 is electrically connected to the input / output terminal 481 of the liquid crystal panel 400 by the anisotropic conductive agent,
2 is a terminal 4 of the liquid crystal panel 400 using an anisotropic conductive agent.
82 is electrically connected.

Next, as shown in FIG. 3, the electro-optical unit 100 is assembled by stacking the first reflector 15, the light guide plate 12, and the liquid crystal panel 400 on the upper surface of the circuit board 7. At this time, the rubber connector 60 is arranged between the flexible board 70 and the circuit board 7.

As a result, the connector electrode of the rubber connector 60 is connected to the first surface side terminal 71 of the flexible substrate 70.
1 and elastically presses the input / output terminals 781 of the circuit board 7 with elasticity. Therefore, the input / output terminal 481 of the liquid crystal panel 400 and the input / output terminal 781 of the circuit board 7 are connected to the first back side terminal 721, the through hole 713, the first front side terminal 7
11. Electrical connection is made via the connector electrode of the rubber connector 60.

The capacitor 91 is connected to the second surface side terminal 712 of the flexible substrate 70 and the through hole 71.
Third, it is electrically connected to the driving IC 490 via the second back side terminal 721 and the terminal 482.

As described above, the electro-optical unit 1 of the present embodiment
00 and the mobile phone 1, what is electrically connected directly to the panel side terminal 480 of the liquid crystal panel 400 is
The back side terminals 72 (first back side terminals 721 and second back side terminals 722) of the flexible substrate 70. The back side terminals 72 and the panel side terminals 480 are electrically connected by an anisotropic conductive agent or the like. , The electrical connection can be achieved even if the panel-side terminals 480 are formed at a narrow pitch. The connector electrode of the connector 60 that electrically connects the circuit board side terminal 781 and the input / output terminal 481 of the liquid crystal panel 400 is directly and electrically connected to the first surface side terminal of the flexible board 70. 7
Since the first surface side terminals 711 are formed on the front side of the flexible substrate 70, they can be formed at a wide pitch in accordance with the pitch of the connector electrodes. Therefore, the input / output terminals 481 can be formed at a narrow pitch without being affected by the pitch of the connector electrodes. Therefore, the area where the panel-side terminals 480 are formed can be narrowed, so that the liquid crystal panel 400
In the above, an area that does not directly contribute to image display can be narrowed. Further, the resistance value of the electrode pattern is reduced by shortening the length of the electrode pattern, thereby preventing a voltage drop of the input signal.

Further, in the flexible substrate 70,
The first back side terminal 721 and the first front side terminal 711 are
Since the connection is made electrically through the through hole 713 of the flexible board 70, the input / output terminal 481 and the circuit board side terminal 781 can be electrically connected through the flexible board 70 and the connector 60. Also,
In the flexible substrate 70, the second back side terminal 72
2 and the second front side terminal 712 are connected to the flexible substrate 70.
The terminal 482 and the second surface terminal 712 can be electrically connected via the flexible substrate 70 because the terminal 482 is electrically connected through the through hole 713.

Further, since the flexible substrate 70 has flexibility, the ITO constituting the panel-side terminals 480 is
Since the thickness variation of the film can be absorbed and the back surface side terminals 72 of the flexible substrate 70 are plated with gold, the surface mount type capacitor 91 and the rubber connector 60
Unlike the case where the connection resistance is directly and directly connected to the panel-side terminal 480 of the liquid crystal panel 400, the problem that the connection resistance is initially large or the problem that the connection resistance increases with time does not occur.

That is, the rubber connector 60 is not directly pressed against the input / output terminal 481 of the liquid crystal panel 400, but is connected to the input / output terminal 481 of the liquid crystal panel 400.
Are pressed against the first front terminals 711 of the flexible substrate 70, which are well connected electrically. In such a state, the rubber connector 6 is attached to the first surface side terminal 711 of the flexible substrate 70.
Although the connector electrodes of No. 0 are elastically pressed against each other, the surface-side terminals 71 of the flexible board 60 are plated with gold. However, the connection resistance is small, and the change in resistance with time does not matter. The connector electrode of the rubber connector 60 is connected to the circuit board 7.
The input / output terminal 781 is simply elastically pressed against the input / output terminal 781. However, since the input / output terminal 781 is also plated with gold, these electrical connection parts are pressed against each other. Connection resistance is small, and
The change in resistance over time does not matter. Therefore, when displaying on the liquid crystal panel 400, it is possible to avoid problems such as non-lighting and thin display due to an increase in resistance of an electrical connection portion.

Further, the surface mount type capacitor 91 is not directly electrically connected to the terminal 482 of the liquid crystal panel 400 by an anisotropic conductive agent, but is connected to the terminal 482 of the liquid crystal panel 400 by the second. Is electrically connected by solder to the second front side terminal 712 of the flexible substrate 70 to which the back side terminal 722 is electrically connected favorably. It is small and its resistance change with time does not matter.

Moreover, in the flexible substrate 70,
The first surface side terminals 711 are formed with a wide pitch as connector connection terminals in accordance with the connector electrodes of the rubber connector 60, and in the liquid crystal panel 400, a large number of panel side terminals 480 are formed in a narrow area. Therefore, the first front terminal 711 always overlaps one or more of the panel terminals 480 in a plane. Therefore, when mounting the flexible substrate 70 on the liquid crystal panel 400 with an anisotropic conductive agent or the like, the head is brought into contact with the upper surface of the flexible substrate 70 for heating and pressure bonding. At this time, the head contacts the first surface side terminal. In each of the first front-side terminals 711, the lower-side terminal 72 of the flexible substrate 70 and the panel-side terminal 480 are present on the lower layer side. Accordingly, since the first front side terminal 711 is formed in a state where there is no height, the head applies heat and pressure evenly between any rear side terminal 72 and the panel side terminal 480. Therefore, between the flexible substrate 70 and the liquid crystal panel 400, the back surface side terminal 72 and the panel side terminal 480 are reliably electrically connected.

Further, in this embodiment, the flexible substrate 70 is arranged such that the region where the through hole 713 is formed protrudes from the substrate side 428 of the liquid crystal panel 400, as can be seen from FIG. Therefore, since the area where the through-hole 713 is formed in the flexible board 70 protrudes, the flexible board 70
The area where the wiring patterns 710 and 720 are routed is wide on the front side and the back side. Therefore, after the panel-side terminal 480 is electrically connected to the back-side terminal 72, the front-side terminal 71 (the first front-side terminal 711 and the second front-side terminal 712) of the flexible board located at a position distant therefrom. ) Is easy to electrically.

[Modification of Second Embodiment] In the second embodiment, the end of the flexible substrate 70 where the through-hole 713 is formed is the edge of the liquid crystal panel 400 (the substrate of the second transparent substrate 420). Although the configuration protrudes from the side 428), as shown in FIG. 14, the entire flexible substrate 70 including the end portion where the through hole 713 is formed is overlapped with the liquid crystal panel 400. There may be. Other configurations are described in Embodiment 2.
Therefore, common portions are denoted by the same reference numerals, and description thereof is omitted.

With this configuration, the liquid crystal panel 400
In addition, the entire electro-optical unit 100 including the flexible substrate 70 can be reduced in size.

[Other Embodiments] In the first and second embodiments, an example in which the present invention is applied to the mobile phone 1 as an electronic device has been described. However, the present invention is applied to other electronic devices. You may.

In this embodiment, an example using the liquid crystal panel 400 as the electro-optical panel has been described. However, the electro-optical panel is not limited to the liquid crystal panel 400, and an organic electroluminescence type electro-optical panel is used. The present invention may be applied to an electronic device.

Further, in this embodiment, the rubber connector 60 is used as the connector, but any connector having any connector electrode can be used as long as it can perform pressure contact with elastic force. For example, a connector having a spring structure that performs pressure contact by the restoring force of a U-shaped metal spring may be used.

[0101]

As described above, in the electro-optical unit and the electronic apparatus according to the present invention, what is electrically connected to the panel-side terminal of the electro-optical panel is the back side terminal of the flexible substrate, Electronic components are electrically connected to the front surface side terminals of the flexible substrate. Here, since the flexible substrate has flexibility, it can absorb variations in the film thickness of the panel-side terminals. The terminals of the flexible substrate are usually plated with gold. Therefore, unlike the case where a surface-mounted capacitor or a rubber connector is directly electrically connected to the panel side terminal, there is a problem that the connection resistance is initially large or a problem that the connection resistance increases with time. Does not occur.

Also, what is electrically connected directly to the panel-side terminals of the electro-optical panel is the back-side terminals of the flexible substrate, and the back-side terminals and the panel-side terminals are connected by an anisotropic conductive agent or the like. Since they are electrically connected, they can be electrically connected even if the panel terminals are formed at a narrow pitch. Furthermore, the first surface side terminal formed on the front side of the flexible substrate is where the connector electrode of the connector that electrically connects the circuit board side and the panel side terminal is directly electrically connected. Since such a first surface side terminal is formed on the front side of the flexible substrate, it can be formed at a wide pitch in accordance with the pitch of the connector electrodes. Therefore, for the panel side terminal,
It can be formed at a narrow pitch without being affected by the pitch of the connector electrodes. Therefore, the area where the panel-side terminals are formed can be reduced, so that the area of the electro-optical panel that does not directly contribute to image display can be reduced. Moreover, in the flexible board, the back side terminal and the first front side terminal are electrically connected through the through hole of the flexible board, so that the panel side terminal and the circuit board side terminal are connected to the flexible board and the connector. Can be electrically connected to each other.

[Brief description of the drawings]

FIG. 1 is a perspective view showing the appearance of a mobile phone as an example of an electronic apparatus to which the present invention is applied.

FIG. 2 is an exploded perspective view showing a configuration of a main part of the mobile phone shown in FIG.

FIG. 3 is a circuit board, a first reflective material, a second reflective material, a light guide plate, a mobile phone according to Embodiment 1 of the present invention;
It is a longitudinal cross-sectional view which expands and shows the electro-optical unit which laminated | stacked the light-diffusion sheet and the liquid crystal panel.

FIG. 4 is a perspective view of the liquid crystal panel viewed from obliquely below in the electro-optical unit of the mobile phone according to Embodiment 1 of the present invention.

FIG. 5 is an exploded perspective view of the liquid crystal panel viewed from obliquely below in the electro-optical unit of the mobile phone according to Embodiment 1 of the present invention.

FIG. 6 is an explanatory diagram showing an enlarged plan view of a panel-side terminal formed on a liquid crystal panel in the electro-optical unit of the mobile phone according to the first embodiment of the present invention.

FIGS. 7A and 7B are perspective views of the mobile phone according to the first embodiment of the present invention, in which the flexible substrate used for the electro-optical unit is viewed obliquely from the front side;
FIG. 4 is a perspective view of the flexible substrate viewed obliquely from the back side.

FIG. 8A is a solid line showing front side terminals and front side wiring patterns formed on the front side of the flexible substrate overlaid on the liquid crystal panel in the electro-optical unit of the mobile phone according to Embodiment 1 of the present invention; FIG. 3B is an explanatory diagram showing the back side terminals and the back side wiring pattern formed on the back side of the flexible substrate by dotted lines, and FIG. 2B is a solid line showing the back side terminals and the back side wiring pattern formed on the back side of the flexible substrate. FIG. 5 is an explanatory diagram showing front-side terminals and front-side wiring patterns formed on the front side of the flexible substrate by dotted lines.

9 is a perspective view of the electro-optical unit of the mobile phone according to Embodiment 1 of the present invention, in which the flexible substrate shown in FIGS. 8A and 8B is mounted on the terminal forming region of the liquid crystal panel shown in FIG. It is explanatory drawing which shows a situation.

FIG. 10 shows a state in which the flexible substrate shown in FIGS. 8A and 8B is mounted on the terminal forming region of the liquid crystal panel in the electro-optical unit of the mobile phone according to the modification of the first embodiment of the present invention. FIG.

FIG. 11 is an explanatory diagram showing an enlarged plan view of a panel-side terminal formed on a liquid crystal panel in the electro-optical unit of the mobile phone according to the second embodiment of the present invention.

FIG. 12A is a solid line showing front-side terminals and front-side wiring patterns formed on the front side of a flexible substrate overlaid on a liquid crystal panel in the electro-optical unit of the mobile phone according to Embodiment 2 of the present invention; FIG. 3B is an explanatory diagram showing the back side terminals and the back side wiring pattern formed on the back side of the flexible substrate by dotted lines, and FIG. 2B is a solid line showing the back side terminals and the back side wiring pattern formed on the back side of the flexible substrate. FIG. 5 is an explanatory diagram showing front-side terminals and front-side wiring patterns formed on the front side of the flexible substrate by dotted lines.

13 is a perspective view of the electro-optical unit of the mobile phone according to Embodiment 2 of the present invention, in which the flexible substrate shown in FIGS. 12A and 12B is mounted on the terminal forming region of the liquid crystal panel shown in FIG. It is explanatory drawing which shows a situation.

FIG. 14 shows a state in which the flexible substrate shown in FIGS. 12A and 12B is mounted on the terminal forming region of the liquid crystal panel in the electro-optical unit of the mobile phone according to the modification of the second embodiment of the present invention. FIG.

FIG. 15 shows a circuit board, a first reflector, a second reflector, and an electro-optical unit mounted on a conventional mobile phone.
It is a longitudinal cross-sectional view which expands and shows the state which laminated | stacked the light guide plate, the light-diffusion sheet, and the liquid crystal panel.

16 is a perspective view of the liquid crystal panel of the electro-optical unit of the mobile phone shown in FIG. 15, as viewed obliquely from below.

[Explanation of symbols]

 Reference Signs List 1 mobile phone (electronic device) 2 display unit 3 operation unit 4 speaker hole 5 microphone hole 6 lower case 7 circuit board 8 light diffusion sheet 9 upper case 10 lighting device 11 light source 12 light guide plate 15 first reflector 17 second Reflecting material 60 Rubber connector 70 Flexible board 71 Front side terminal 72 Back side terminal 91 Capacitor 100 Electro-optical unit 101 Key button 121 Display area 122 Keypad area 123 Light guide plate recess 124 Light guide plate bottom wall 125 Light guide plate through hole 151 , 152, 153 Side wall portion of first reflector 154 Bottom wall portion of first reflector 155, 159 Through hole of first reflector 400 Liquid crystal panel (electro-optical panel) 401 Image display area 410 First transparent Substrate 411 First terminal formation region 420 Second transparent substrate 421 Second terminal formation region 425 Portion where transparent substrate overhangs 440 First electrode pattern 450 Second electrode pattern 461, 462 Polarizing plate 480 Panel side terminal 481 Panel side input / output terminal (panel side terminal) 482 Panel side terminal (panel side terminal) 490 Driving IC 710 Front-side wiring pattern of flexible board 711 First front-side terminal of flexible board 712 Second front-side terminal of flexible board 713 Through-hole of flexible board 720 Back-side wiring pattern of flexible board 721 Flexible board First backside terminal 722 Second backside terminal of flexible substrate 781 Input / output terminal on circuit board side (circuit board side terminal)

Continued on the front page (51) Int.Cl. ⁷ Identification symbol FI Theme coat II (reference) G09F 9/00 350 G09F 9/00 350Z G02F 1/1345 G02F 1/1345

Claims (17)

[Claims] 1. An electro-optical panel, comprising: a circuit board which is overlapped with the electro-optical panel at a predetermined distance from the electro-optical panel; In the electro-optical unit in which the terminal and the circuit board side terminal are respectively formed, the electronic board includes a flexible board which is superimposed on the electro-optical panel with the back side facing, and the flexible board has a plurality of front side terminals formed on the front side And a plurality of back side terminals formed on the back side, and a plurality of through holes for electrically connecting the front side terminal and the back side terminal, wherein the back side terminal is connected to the panel side terminal. An electro-optical unit, wherein the electro-optical unit is electrically connected to a conductive material, and an electronic component is electrically connected to the front side terminal. 2. The electro-optical unit according to claim 1, wherein the flexible substrate is superimposed on the electro-optical panel including a region where the through hole is formed. 3. The electro-optical unit according to claim 1, wherein the entire flexible substrate is superimposed on the electro-optical panel. 4. The electro-optical unit according to claim 1, wherein in the flexible substrate, a region where the through hole is formed protrudes from an edge of the electro-optical panel. 5. The method according to claim 1, wherein
The electronic component includes a first terminal of the front side terminals sandwiched between the flexible board and the circuit board.
An electro-optical unit comprising: a connector provided with a connector electrode that elastically contacts the front surface side terminal and the circuit board side terminal. 6. The method according to claim 1, wherein
The electro-optical unit, wherein the electronic component includes an electric circuit element surface-mounted on a second surface-side terminal of the surface-side terminals. 7. The method according to claim 1, wherein
The electronic component includes a first terminal of the front side terminals sandwiched between the flexible board and the circuit board.
And a connector provided with a connector electrode that elastically contacts the circuit board side terminal, and an electric circuit element surface-mounted on the second front side terminal of the front side terminal. An electro-optical unit, comprising: 8. The method according to claim 1, wherein
A driving IC is mounted on the electro-optical panel by COG, and the driving IC is mounted on the panel side terminal.
An electro-optical unit, comprising: an input / output terminal. 9. The electro-optical panel according to claim 6, wherein a drive IC is mounted on the electro-optical panel by COG, and the panel-side terminal includes an input / output terminal for the drive IC. The electro-optical unit, wherein the electric circuit element is an external element for operating the driving IC. 10. The electro-optical unit according to claim 9, wherein the external element is a surface mount capacitor. 11. The electro-optical unit according to claim 8, wherein a plurality of electrode patterns extend from a mounting area of the driving IC toward an image display area of the electro-optical panel. . 12. The method according to claim 5, wherein
Wherein a plurality of first terminals are formed at a wider pitch than the panel terminals to which the first front terminals are electrically connected via the through holes and the rear terminals. Electro-optical unit. 13. The electro-optical unit according to claim 12, wherein each of the first surface-side terminals is formed in a region overlapping at least one of the panel-side terminals in a plane. 14. The electro-optical unit according to claim 1, wherein the panel side terminal is formed of an ITO film. 15. The electro-optical unit according to claim 1, wherein the electro-optical panel is a liquid crystal panel. 16. The electro-optical unit according to claim 1, wherein the conductive material is an anisotropic conductive agent. 17. An electronic apparatus comprising the electro-optical unit defined in claim 1.